WO2004112266A1 - 基地局装置 - Google Patents
基地局装置 Download PDFInfo
- Publication number
- WO2004112266A1 WO2004112266A1 PCT/JP2004/007545 JP2004007545W WO2004112266A1 WO 2004112266 A1 WO2004112266 A1 WO 2004112266A1 JP 2004007545 W JP2004007545 W JP 2004007545W WO 2004112266 A1 WO2004112266 A1 WO 2004112266A1
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- WO
- WIPO (PCT)
- Prior art keywords
- base station
- outer container
- unit
- printed circuit
- board
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
Definitions
- the present invention relates to a base station apparatus of a communication system, and more particularly to a base station apparatus suitable for use as a radio base station apparatus of a third generation mobile communication system.
- each printed substrate provided on a plurality of printed circuit boards is provided.
- the present invention relates to a motherboard in which a plurality of connector connectors are connected, and more particularly to a motherboard and base station device suitable for use in a radio base station device of a communication system.
- this mobile communication system's communication area is expanded by installing BTs (Bas e s e r a s e i s e i s e i s e t i a t i o n) in a dead zone to which communication signals can not reach.
- a wireless base station device (hereinafter simply referred to as “base station device”) of this mobile communication system stores various devices in an external container (or rack) having a height of less than 2 meters.
- a large number of channels having a large number of channels with several hundreds to several thousand channels and a large weight having a large number of channels are used (see, for example, Japanese Patent Application Laid-Open No. 2001-111436).
- FIG. 1 is a perspective view showing the appearance of an example of a conventional large-capacity base station apparatus.
- the base station apparatus 10 shown in FIG. 1 is 1 800 mm in height, 800 mm in width, and 600 mm in depth.
- Am 1 amplifier Transmission amplifier 1) 2, T 1 PA fan 1 3, MD E (Modulation and D emo ration Equipment: base station modem 14), MDE fan 15 etc. Have.
- the conventional large-capacity base station apparatus is installed in a dead zone such as a mountainous area where the number of subscribers is smaller than that in an urban area where the number of subscribers is large, the urban area will be expanded. Because there is a high possibility that such a high utilization rate can not be expected, reduction of the introduction cost and operation cost has emerged as a major issue.
- large capacity base station equipment is installed as in the past in urban areas where there are a large number of subscribers, and insensitivity to relatively small numbers of subscribers such as mountain areas It is possible to expand the communication area by installing relatively inexpensive, small-sized, small-capacity base station equipment in the zone to suppress increases in the introduction and operation costs of the entire communication system.
- this type of conventional base station apparatus is extremely small and small, using, for example, only one BB (Bass Signal and Rocessor: Base spanned signal processing functional unit) substrate with several tens of channels. Even when a capacity base station device is configured, the weight and size of the base station device body become considerable.
- BB Base Signal and Rocessor: Base spanned signal processing functional unit
- the installation work requires appropriate equipment for installation and at least several workers. Do.
- construction vehicles can not enter the destination When placing base station equipment in such a mountainous area, it is necessary to bring the installation equipment and base station equipment body to the installation site by hand, so more labor and time are required.
- the base station device that caused the failure is not usually repaired, and replacement work with a new base station device is performed to restore the communication line promptly. I have to.
- this type of conventional base station device requires a great deal of cost and labor for its introduction.
- a plurality of printed circuit boards disposed in an external container such as the main unit or the detachable unit are each provided with respective printed circuit board connectors disposed on these printed circuit boards. It has a configuration disposed by connecting to a plurality of mother-board connectors of a mother-board attached to the external container.
- the mother board is formed by connecting the printed circuit board connectors of the plurality of printed circuit boards connected to the plurality of mother board connectors of the mother port and the plurality of printed board connectors.
- the mounting direction of the printed circuit board to the outer container and the force S were perpendicular to each other.
- this conventional maza-one board when the printed board is attached to the outer container in a state where the respective mach-board connectors of the plurality of printed boards are connected to the maza-one board connector, the maza Due to an error in the arrangement position of the one board connector and the printed circuit board connector, the printed circuit board may be stressed to a large extent, and the stress may cause the printed circuit board to be prone to failure. Disclosure of the invention
- a first object of the present invention is to provide a base station apparatus that can be installed easily and quickly at a desired installation site, and the installation cost can be significantly reduced.
- a second object of the present invention is to provide a method of attaching a printed circuit board to an external container without putting stress on the printed circuit board while the printed circuit board connector is connected to the printed circuit board connector. It is to provide a pod.
- the base station device of the present invention comprises an outer container, a flat first outer container fixed to the installation location, and a circuit board housed in the first outer container.
- a flat type second outer container removably attached to the first outer container is divided, and a heat dissipation space is separated from the outside of the first outer container, and the second outer container is stacked.
- a base station apparatus according to the present invention includes a first outer container fixed to an installation location, and a plurality of circuit boards arranged in a stack, which are detachably attached to the first outer container.
- An external container is provided, and a gap for heat release communicating with the outside air is provided between the first external container and the second external container, and the first external container and the second external container are formed of the circuit board. It was arranged to face in the stacking direction.
- the mother board according to the present invention comprises a plurality of mother board connectors to which respective printed board connectors disposed on a plurality of printed boards attached to an external container are connected. Is provided, the The mounting / removing direction of the printed circuit board connector with respect to the one board connector and the mounting direction of the printed circuit board with respect to the external container are configured to be the same.
- FIG. 1 is a schematic perspective view showing the appearance of a conventional base station apparatus
- FIG. 2 is a block diagram showing a configuration of a base station apparatus according to an embodiment of the present invention
- FIG. 3 is a perspective view showing an appearance of a base station apparatus according to an embodiment of the present invention
- FIG. FIG. 6 is a perspective view showing an appearance of the base station apparatus according to an embodiment of the present invention in an exploded state of each of the stacks;
- FIG. 5 is a perspective view showing the external appearance of the base station apparatus according to an embodiment of the present invention in the state where the MD Eunit is disassembled.
- FIG. 6 is a perspective view showing the appearance of the state in which the electronic circuit board of the MD station of the base station apparatus according to the embodiment of the present invention is disassembled;
- FIG. 7 is a perspective view showing an appearance from the back side of FIG. 6 in a state in which the electronic circuit board of the MD E unit of the base station apparatus according to one embodiment of the present invention is disassembled.
- FIG. 8 is a front view of a base station apparatus according to an embodiment of the present invention.
- FIG. 9 is a cross-sectional view taken along line a—a of FIG.
- Figure 10 is a cross-sectional view along line b-b in Figure 8,
- Figure 1 1 is a cross-sectional view along line c-c in Figure 8;
- Figure 12 is a cross-sectional view along the line d- d in Figure 8,
- Figure 13 is a cross-sectional view along the line e- e in Figure 8,
- FIG. 14 is an exploded perspective view showing the state of attachment of T 1 p A unit to the I F unit of the base station apparatus according to one embodiment of the present invention
- FIG. 15 is an exploded perspective view showing an attachment state of an MD unit to an IF unit of a base station apparatus according to an embodiment of the present invention
- FIG. 16 shows an IF unit of a base station apparatus according to an embodiment of the present invention. A perspective view showing the MDE unit attached.
- FIG. 17 is an enlarged perspective view of a connector portion of an I terminal of a base station apparatus according to an embodiment of the present invention.
- FIG. 18 is a perspective view showing a state in which a fan unit is attached by releasing a fan cover of a base station apparatus according to an embodiment of the present invention
- FIG. 19 is an enlarged perspective view of an essential part showing a state in which the FAN cover of the base station apparatus according to the embodiment of the present invention is released and the FAN unit is attached to the FAN unit accommodation portion.
- FIG. 20 is an enlarged perspective view of an essential part, showing a state in which the FAN cover is attached to the FAN unit accommodating part by releasing the FAN cover of the base station apparatus according to one embodiment of the present invention
- FIG. 21 is an enlarged perspective view of an essential part showing a state in which the FAN cover attached to the FAN unit accommodation part is released by releasing the FAN cover of the base station apparatus according to one embodiment of the present invention and connected to the terminal board;
- FIG. 22 is a perspective view showing a state before locking the MDE case and the MDE cover of the MDE unit of the base station apparatus according to one embodiment of the present invention
- FIG. 23 is a perspective view showing a state in which the MDE case and the MDE cover of the MDE unit of the base station apparatus according to one embodiment of the present invention are locked.
- FIG. 24 shows a state before locking the MDE unit and the IF lock after locking the MDE case and the MD E cover of the MDE unit of the base station apparatus according to one embodiment of the present invention.
- FIG. 25 shows a state in which the MDE unit and the IF seat are locked after the MDE case and the MD E cover of the MDE unit of the base station apparatus according to one embodiment of the present invention are locked.
- FIG. 26 shows the case where after locking the MDE case and the MDE cover of the MDE buffer of the base station apparatus according to one embodiment of the present invention, and after locking the MDE suite and the IF suite, A perspective view showing the state of the P2004 / 007545
- FIG. 27 is a perspective view showing the back of the base station apparatus according to one embodiment of the present invention
- FIG. 28 is the main body fixing member attached to the back of the base station apparatus according to one embodiment of the present invention.
- FIG. 29 is a perspective view showing a state after the main body fixing member is attached to the back surface of the base station apparatus according to one embodiment of the present invention, Best mode for carrying out the invention
- the base station apparatus comprises an outer container, a flat first outer container fixed to an installation location, and a flat second container accommodating a circuit board and detachably attached to the first outer container.
- the apparatus is divided into an external container, and the heat dissipation space is separated outside the first external container, and the second external container is stacked and arranged.
- each of the outer containers is miniaturized and the workability is improved.
- the second outer container is stacked and disposed outside the first outer container with the heat release space separated, the heat dissipation is significantly improved.
- the base station apparatus can be further miniaturized and reduced in weight because the heat dissipation of each of the outer containers is improved.
- the base station apparatus of the present invention adopts a configuration in which a heat sink is provided on the facing surface of both the first outer container and the second outer container.
- the heat dissipating property is further improved because the heat dissipating member is provided on the facing surface of both the first outer container and the second outer container.
- the first outer container accommodates a power supply.
- the first external container fixed to the installation location accommodates the power source that is unlikely to cause a failure and connected to the external cable. (2) It is only necessary to replace the outer container, which can be quickly recovered. Further, in the base station device of the present invention, the first outer container and the second outer container are airtight, and the inner spaces of the first outer container and the second outer container are in communication with each other.
- the first outer container and the second outer container have airtightness, and both inner spaces communicate with each other.
- the internal temperature can be kept uniform, and the occurrence of failure due to local overheating can be suppressed.
- the base station apparatus is configured such that a fan put for sucking and discharging air between the first outer container and the second outer container is provided on the upper surface of the first outer container.
- the base station device air between the first outer container and the second outer container is sucked and discharged by the fan, so that the first outer container and the second outer container are discharged. And can be forced to cool.
- the air (hot air) has a tendency to rise, and since the fan is provided on the upper surface of the first outer container, the air (hot air) is supplied to the first outer container and the air. The air can be efficiently exhausted from between the second outer container.
- a plurality of connector connectors are provided to which the respective printed circuit board connectors disposed on the plurality of printed circuit boards are connected.
- a mother board is provided in which the mounting and demounting directions and the mounting direction of the printed circuit board with respect to the external container are arranged in the same direction.
- the base station apparatus further comprises a cooling fan for managing the temperature in the external container to which the mother board is attached, and the area of the plurality of printed circuit boards mounted on the mother board is smaller.
- a small, small size printed circuit board is disposed at a central portion of the outer container, and a vent channel of the cooling fan is formed between the small size printed circuit board and the outer container.
- a small size print substrate having a small area is disposed at a central portion of the outer container, and the cooling is performed between the small size print substrate and the outer container. Since the air flow path of the fan is formed, the printed circuit boards disposed inside the outer container can be efficiently cooled by the cooling fan, and the occurrence of defects due to the heat of the printed circuit boards can be suppressed. Can.
- the base station apparatus further comprises a heat dissipation member for cooling at least one of the plurality of printed circuit boards in a state where the plurality of printed circuit board connectors are connected to the plurality of mother-board connectors. Take the configuration.
- a heat dissipation member for cooling at least one of the plurality of printed circuit boards in a state where the plurality of printed circuit board connectors are connected to the plurality of mother-board connectors.
- the heat dissipation member includes a heat pipe.
- the heat dissipation member includes the heat pipe, so that the heat dissipation of the printed circuit board can be further improved.
- the base station apparatus comprises: a first outer container fixed to the installation location; and a second outer container that accommodates a plurality of circuit boards stacked and disposed and is removably attached to the first outer container.
- a gap for heat radiation communicating with the outside air is provided between the first outer container and the second outer container, and the first outer container and the second outer container are disposed to face each other in the stacking direction of the circuit board. Let's take the composition.
- the first outer container and the second outer container are disposed to face each other in the stacking direction of the circuit board, so that the first outer container and the second outer container are disposed.
- the heat radiation area communicating with the outside air can be enlarged, and the second outer container can be formed into a flat and small shape.
- the mother port of the present invention is a mother port provided with a plurality of motherboard connectors to which respective printed board connectors disposed on a plurality of printed circuit boards attached to an external container are connected, A configuration is adopted in which the mounting and demounting direction of the printed circuit board connector with respect to the mother board connector and the mounting direction of the printed circuit board with respect to the external container are the same.
- the mounting / removing direction of the printed board connector with respect to the mother board connector and the mounting direction of the printed board with respect to the external container become the same direction, so that the mother board is With the printed circuit board connector connected to the connector, the printed circuit board can be attached to the outer container without stressing the printed circuit board.
- the plurality of printed circuit boards may be a CNT board constituting a control device in a base station modulator / demodulator for modulating / demodulating transmission / reception signals, a TRX board constituting a transmission / reception card, baseband signal processing A BB 0 substrate for standard equipment that constitutes a functional unit and a BB 1 substrate for installation that constitutes a baseband signal processing functional unit are adopted.
- the C N T substrate, the T R X substrate, the B B O substrate, and the B B 1 substrate often cause initial failure during installation. If such a printed circuit board causes a problem due to the stress at the time of attachment to the external container, it is difficult to immediately find the cause of the problem, and it is necessary to replace a new printed circuit board. When installed, the printed circuit board that has just been replaced is extremely likely to cause the same problem again. In this mother board, such various printed circuit boards are attached to the outer container using the mother board, so that problems due to stress when the printed circuit boards are attached to the outer container are generated. It can be prevented. Therefore, in this master port, when a new printed circuit board is replaced and attached, the replaced printed circuit board will not cause the same failure again by the stress.
- the outer container is composed of an outer container case and an outer container cover attached to the outer container case so as to be openable and closable, and the BB 1 substrate for expansion The structure is disposed at a site exposed when the outer container cover is released.
- the expansion BB 1 substrate is disposed at a portion exposed in a state where the outer container cover is released. Therefore, the work of attaching and detaching the expansion BB 1 substrate Can be done easily.
- FIG. 2 is a block diagram showing a configuration of a base station apparatus according to an embodiment of the present invention.
- FIG. 3 is a perspective view showing an appearance of a base station apparatus according to an embodiment of the present invention.
- FIG. 4 is a perspective view showing an appearance of the state in which each unit of the base station apparatus according to the embodiment of the present invention is separated.
- the base station apparatus 100 is an MDE unit 110 as the second external container, and an IF unit 1 as the first external container. It has a configuration that is roughly divided into four units: 20, FAN unit 130, and T-PA 140.
- the MDE unit 110 has a base station modulator / demodulator (MDE) that modulates and demodulates transmission and reception signals.
- the IF unit 120 also has an interface for equipment connected to an external cable 150 (see Fig. 17) such as a communication cable.
- FAN-UT 1 30 is equipped with a cooling fan as a heat exchanger for cooling the internal equipment of base station apparatus 100.
- the T1 PA unit 140 is provided with a transmission / reception amplification device T1 PA for amplifying the transmission / reception signal.
- T1 PA transmission / reception amplification device
- the MDE unit 1 10 comprises a CNT substrate P 1 consisting of a printed circuit board constituting the control device and a printed circuit board constituting the transmission / reception card.
- TRX board P 2, BB 0 board P 3 consisting of a printed circuit board for standard equipment that constitutes the base-paned signal processing function part
- BB 1 board P 4 consisting of an additional printed board that constitutes the baseband signal processing function part
- IF unit 1 20, as shown in FIG. 2, is a power supply unit 1 2 2 for supplying power to terminal board 1 2 1 to which external cable 1 50 is connected, terminal board 1 21 and MD E 1 unit 1 10, and antenna It has a duplexer 1 2 3 connected.
- the FAN unit 1 300 and the T-PA unit 140 are 4007545
- Each consists of a single unit.
- the CNT substrate P1 of the MDE unit 110 is connected via its connector C1 and the connector C5 of the mother substrate 1 1 1 to the mother substrate 1 1 Connected to one.
- the TRX substrate P2 is connected to the mother substrate 1 1 1 via the substrate C 2 and the connector C 6 of the mother 1 substrate 1 1 1.
- the B B 0 substrate P 3 is connected to the mother 1 substrate 1 1 1 via the connector C 3 of the connector C 3 and the Maza 1 substrate 1 1 1.
- the BB 1 board P 4 is connected to the mother 1 board 1 1 1 via the connector C 4 and the connector C 8 of the mother 1 board 1 1.
- the mother substrate 1 1 1 is connected to the terminal substrate 1 1 2 via the connector C 9 and the connector C 1 0 of the terminal substrate 1 1 2.
- the motherboard 1 1 1 is connected to the power supply 1 22 of the IF unit 1 20 through the connector C 1 2 of the MDE buffer 1 10 and the connector C 1 5 of the IF unit 1 20
- the terminal boards 1 12 are connected to the terminal boards 1 2 1 of the I F unit 1 20 through the connectors C 1 1 of the MDE unit 1 1 10 and the connectors C 1 4 of the 1 I 2 1.
- the terminal board 112 is connected to the power supply unit 212 of the IF unit 120 via the connector C12 of the MDE unit 110 and the connector C15 of the IF unit 120. It is done.
- the MDE fan 1 1 3 is connected to the terminal board 1 1 2 of the MDE unit 1 1 0.
- FAN unit 1 30 is connected to terminal board 1 2 1 of I unit 1 20.
- the T-port 140 is connected to the power supply device 22 and the terminal board 121 of the IF unit 120 through the connector C 20 and the connector C 17 of the IF 120, respectively.
- the T-PA unit 140 has its connector C 21 and the connector C 18 of the IF unit 1 20, and the connector C 16 of the IF unit 1 20 and the connector C 1 of the MDE unit 1 10 Connected to the TRX substrate P 2 of the MDE Unit 1 10 through 3.
- the T1 PA unit 140 is connected to the duplexer 123 of the IF unit 120 through the connector C22 of the IF unit 120 and the connector C19 of the IF unit 120.
- MDE suite 1 10 is a waterproof outer container consisting of MDE case 1 14 and MDE cover 1 1 5
- CNT substrate P1, TRX substrate P2, 880 substrate? 3 B B 1 board P 4, mother single board 1 1 1, terminal board 12 2 and MD E fan 1 13 are housed.
- the mother substrate 11 1 is attached to the substrate plate 1 16 via the mounting bracket 1 1 7.
- the substrate plate 116 is made of a highly heat dissipating metal plate such as aluminum and screwed to the MD E case 114.
- CNT substrate P l, TRX substrate P 2 and BB 1 substrate P 4 connectors C l, C 2 and C 4 and 'maza one substrate 1 1 1 connectors C 5, C 6 and C 8 and are arranged so as to be attached and detached from a direction perpendicular to the plate surface of the substrate plate 16.
- FIG. 15 A more specific attachment structure of these CNT substrates P 1, TRX substrates P 2, BB 0 substrates P 3 and BB 1 substrates P 4 to the MDE unit 110 is shown in FIG. -Shown in the cross-sectional views of Fig. 9, Fig. 10, Fig. 11, Fig. 12 and Fig. 13 along the line b, c c, d spring and e e.
- CNT substrates P 1, TRX substrates P 2, BB 0 substrates P 3 and BB 1 substrates P 4 are attached to and removed from the MDE unit 1 1 0 with cover hinges 1 1 5 1 1 1 5 2 and case hinge 1 It is carried out with the MDE cover 115, which is attached to the MD E case 1 14 by 14 1 and 1 142 so as to be able to open and close freely.
- the expansion BB 1 substrate P 4 be disposed at a portion exposed in a state where the MDE cover 115 attached openably and closably to the MDE case 114 is opened. That is, by arranging the B B 1 substrate P 4 in such an exposed position, the mounting and demounting operation of the B B 1 substrate P 4 to the MDE unit 110 can be easily performed.
- this MD Eutut 1 10 is the above-mentioned CNT substrate P 1 and a rectangular substrate? 2.
- the largest C NT substrate P 1 is disposed at the deepest part of MDE case 1 14, and the other relatively small area of small size
- a TRX substrate P 2, a BB 0 substrate P 3 and a BB 1 substrate P 4 consisting of printed circuit boards are disposed at the center of the MDE case 114.
- the TRX substrate P 2 and BB 0 substrate P 3 and BB 1 substrate P 4 and MDE unit 1 10 M consisting of small size printed circuit boards Since the air flow passage of the MDE fan 1 13. 3 is formed between the DE case 1 1 4 and the inner wall of the DE case 1 1. 4, each printed circuit board disposed in the MDE unit 1 1 0 by the MDE fan 1 13. Cooling can be performed efficiently, and the occurrence of defects due to the heat of each printed circuit board can be suppressed.
- the MDE unit 110 has, for example, a heat dissipation member such as a heat dissipation sheet, and the CNT substrate P 1, TR X substrate P 2, BB 0 substrate in a state of being disposed in the MD E unit 110. It is desirable to arrange to cool at least one of P 3 and BB 1 substrate P 4.
- a heat dissipation member such as a heat dissipation sheet
- the above-mentioned IF unit 120 is configured as a main unit which is first positioned and fixed. Also, the other MDE unit 1 10, the FAN unit 1 30 and the T-PA unit 140 are configured as detachable jets that can be attached to and detached from the main unit I-F unit 120.
- a chain 1402 is attached to the T-PA unit 140 to prevent it from falling off when it is attached or detached.
- the chain 1402 is provided with a hook 1403 at its free end.
- suspension pins 1 220 Prevents the T-PA union 140 from falling when attached or removed.
- the MDE unit 1 1 0 has the MD E unit hinge pins 1 14 3 and 1 1 44 formed on one side of the MDE unit 1
- the IF unit 120 is attached to the IF unit 120 so as to be openable / closable and detachable by being disengaged from the IF unit hinges 1201 and 1202 formed on the side of the housing.
- the MD E unit 1 1 0 10 is engaged with its M DE 1 ⁇ ⁇ ⁇ hinge hinge pin 1 1 44 force IF 1 120 1 IF hinge 1 202
- the drop prevention cap 1404 attached to the IF unit 120 is attached to the end of the MD E unit hinge pin 1 144. This prevents inadvertent removal of the MDE unit 110 from the I unit 120 and ensures safety in opening and closing the MDE unit 110.
- each connector C ll, C 1 2 and C 1 3 force of this MDE unit 1 10 Connected to each connector C14, C15, C16 of IF unit 120 respectively.
- an external cable can be connected to the device disposed in the IF unit 120.
- a small window 1 204 is formed to facilitate the process of connecting the 150s.
- this small window 1204 is provided with a protective cover 1 205 as shown in FIG. 14, FIG. 15 and FIG. It is closed. This prevents the operator from accidentally touching the lead of the external cable 150 and causing an electric shock when installing the I-F unit 120 on the installation site or opening / closing the MD E-unit 110.
- the FAN unit 1 30 is shown in Figure 18 and the IF unit 1 20 M
- the DE unit 110 is detachably accommodated in a FAN unit accommodating portion 1 206 as a heat exchanger accommodating portion provided so as to protrude above the portion to which the DE unit 110 is attached.
- the FAN unit accommodating portion 1 206 is closed by the FAN cover 1 203 in a state in which the FAN unit 130 is accommodated.
- the screws for fixing the fan cover 1203 to the fan housing 120 are special screws similar to the screws for closing the small cover 1153 described above.
- the fan cover 1203 is provided with a stop provided at the free end of the protective chain to prevent the inadvertent closing movement of the fan unit housing 206 in the released state. There are 1 20 8 screws
- the attachment / detachment operation of the FAN unit 1 30 with respect to the FAN unit accommodating portion 1 206 is performed by holding the handle 1 30 1 of the FAN unit 1 30.
- channel-shaped guide rails 1 210 are provided on both sides of the fan unit housing 1 206.
- FAN guide guide 302 for engaging with the guide rails 1201.
- the guide rails 1 2 10 of the fan unit accommodating portion 1 206 are disposed to be raised on the front side of the fan unit accommodating portion 1 206.
- the FAN unit 1 30 of the FAN unit 1 30 is engaged with the guide rail 1 2 1 0, as shown in FIG. 20, the FAN unit 1 30 is accommodated in the FAN unit accommodating portion 1 206 by its own weight.
- the FAN terminal 1 30 housed in the FAN fitting housing 1 206 is connected to the connection terminal 1 30 3 with the connection terminal 1 2 1 1 extended from the terminal board 1 2 1 (see FIG. 2). 1).
- this MDE cover plate 1 1 45 is provided as a locking means for locking the 1 1 5 to the MDE case 1 1 4.
- This MDE cover lock plate 1 1 45 as shown in FIG. 23, with the MD E cover -1 5 closed, the MD E cover lock key 1 146 and the MD E cover lock plate 1 145 keyhole 1 Lock the MD E cover 1 1 5 to the MDE case 1 14 by inserting and rotating it into 14 7. This will ensure the security of MD Eunit 1 1 0.
- the keyhole 1 147 of the MDE cover lock plate 1 1 4 5 is locked by the keyhole cover 1 1 48 after locking as shown in FIG. 24 in order to prevent rainwater and dust from entering the keyhole 1 147. It is supposed to be closed.
- an MDE unit lock plate 1 2 1 2 is provided.
- the MDE mute 1 2 1 2 is a MDE union 1 1 Lock the MD Eunit 1 1 0 to the I-fut 1 2 0 by inserting and rotating it into the keyhole 1 2 14 of the key. This ensures the security of the MDE unit 1 10, the I unit 1 20 and the T unit 1 140.
- the keyhole 1 2 14 of the MDE unique slot plate 1 212 is locked after the keyhole cover 1 2 1 5 It is supposed to be closed by
- IF unit 1 20 which is the main unit of base station apparatus 100 configured in this way On the back of the unit, as shown in Figure 27, Figure 28 and Figure 29, a main body fixing member 1 6 0 used when fixing this IF unit 120 to a predetermined installation site (here, a pole such as a utility pole) , 1 6 1, 1 6 2 mounting portions 1 2 1 6 1 1 2 1 7 are formed on the main body unit.
- a predetermined installation site here, a pole such as a utility pole
- the IF unit 120 is attached to the mounting portions 121 6 and 1 2 1 7 on its back, and the body fixing members 1 60, 1 6 1 and 1 6 2 are bolted.
- the body fixing members 1 60, 1 6 1 and 1 6 2 are bolted.
- 1 64 pass fixing bands 16 5, 1 6 6 to these main body fixing members 1 6, 1 2 6 and fix the fixing bands 1 6, 5 6 to the above-mentioned pole
- the IF bench 120 is fixed to this pole.
- base station apparatus 100 is divided into MDE unit 110 and IF unit 120, whereby the heat dissipation area of the entire base station apparatus is increased, and base station apparatus 100 is thus configured.
- the size and weight of the MDE fan 1 1 3 and the fan unit 1 30 can be reduced.
- the base station apparatus 100 has the IF unit 120 as a main unit and the MDE unit 1 10 as a removable unit, of a weight and size that can be carried by the base station unit alone. Divided into
- the base station apparatus 100 can be used for manual or special installation of the base station apparatus even in a dead zone where installation of each floor of the building, underground mall, and mountain area is considered difficult. It can be installed alone without the need for equipment, and the base station 100 can be installed without a large introduction cost, and the communication area can be easily and quickly expanded.
- this base station apparatus 100 accommodates equipment connected to an external cable 150 with very few failures, such as a power supply unit 122 and a duplexer 132, in the IF unit 120 as a main unit.
- the electronic circuit board which is prone to initial failure and setting errors, is housed in the MDE unit 110 as a detachable unit. Therefore, according to this base station apparatus 100, for example, the aforementioned C] ⁇ Ding board? 1, Ding 1 board? 2, 880 base 3, 881 board 4 and masa 1 board 11 Even if a failure occurs in the electronic circuit board, etc., the communication system can be recovered promptly by replacing the MDE station 110 only. The communication system can be launched and maintained very easily and quickly.
- this base station apparatus 100 is the connector CI 1, C 12, C 13 of the MD E unit 1 10 shown in FIG. 16 and the connector C 14, C 1 5 of the IF unit 120. Only the junction around C 16 is sealed by the seal member 180 as shown in FIG. That is, the MDE unit 1 1 ° and the IF unit 1 20 are sealed so as to communicate with each other only at the junction. Therefore, this base station apparatus 100 can form a large heat radiation area of the opposing part of the MDE-UT 1 10 and IF unit 1 2 0, and can improve their heat radiation effect. . Further, according to this configuration, as shown in FIG. 13, it is possible to form a space communicating with the outside air at the opposing part excluding the connector part between the MDE unit 110 and the IF unit 120.
- this base station apparatus 100 dissipates heat on the opposing surfaces of the MDE unit 1 10 and the IF unit 1 20, respectively.
- the heat sinks 1 1 0 a and 1 20 a are arranged in the longitudinal direction as 22 bodies. As described above, this base station apparatus 100 forms a gap communicating with the outside air at the opposing part of the MD EUT 100 and the IF UNIT 120 to provide a heat radiation space. Since the heat dissipating fins 1 10 a and 1 20 a are arranged in the longitudinal direction as heat dissipating members on the surface facing the IF unit 120, the heat dissipating performance is remarkably improved.
- the MDE unit lock plate is used as a locking means as the opening / closing portion of the IF unit 120 and the MDE unit 110 is closed.
- the seal member 1 80 is configured to be pressed by the MD E unit 1 10 and the IF unit 1 20.
- each of the MD E case 1 14 and the MD E cover 1 1 5 5 and the IF seat 1 2 0 2 and the T-PA unit 140 is sealed by the seal member 1 70 and the seal member 1 90. It is done.
- connectors C14, C15, and C16 of IF unit 120 of this base station apparatus 100 are disconnected to connectors Cll, C12, and C13 of MD E1.
- the fan unit accommodating part 1 206 is an MD EUT 1 10 C I?
- the MDE unit hinge pins 1 143 and 1 144 are disengaged from the IF unit hinges 1 20 1 and 1 202 while pivoting in the closing direction from the initial position of mounting on the unit 1 20, the movement of the MDE unit 1 1 0 in a direction It has a configuration that is prominent at the part that blocks
- the MDE unit hinge pins 1 143 and 1 144 are disengaged from the IF unit hinges 1 20 1 and 1 20 2 with the MDE unit 1 10 force SIF unit 1 20 rotated from the initial position to the closing position. Movement of the M DE unit 1 1 0 in the direction is blocked.
- the base station apparatus 100 when the MDE station 1 1 0 is opened or closed, the MDE unit 1 1 0 does not inadvertently leave the IF unit 1 20. For example, It is possible to secure the safety when installing the base station device 100.
- this base station apparatus 100 drops the detachment of the MD E unit hinge pin 1 144 engaged with the IF unit hinge 120 2 from the IF unit hinge 1 202. Since it is blocked by the prevention cap 1 404, the safety in attaching and detaching the MDE unit 1 10 to the IF unit 1 20 can be further improved.
- This base station apparatus 100 also comprises a CNT substrate P 1, a TRX substrate P 2, a BB 0 substrate P 3 and a BB which constitute a base station modulation / demodulation device for modulating / demodulating transmission / reception signals in the MDE unit 1 10.
- a base station modulator / demodulators that are easily affected by these heats and prone to communication failures due to initial failures or setting errors can be replaced easily, system startup and maintenance Management can be done more easily.
- the connector C 8 for at least one of the plurality of connectors of the motherboard 1 1 1 1 as a connector is a connector for mounting the BB 1 board P 4 (print board) for extension of the base station modulator / demodulator Therefore, the number of channels of the base station modulator / demodulator can be easily increased without operating the IF unit 120.
- the base station apparatus 100 is provided with mounting portions 121 of main body fixing members 160, 61 used for fixing the IF unit 120 to a predetermined installation site. Since 6 and 1 2 1 7 are formed on the back of IF unit 1 20, if using body fixing members 1 60 and 1 1 1 attached to this mounting portion 1 2 1 6 and 1 2 1 7 The unit 120 can be fixed in advance to a predetermined installation site. Therefore, according to the base station apparatus 100, when attaching and detaching the MDE unit 1 1 0 to the IF unit 1 20, the IF unit 1 20 does not shake or fall over, and the installation work of the base station apparatus 1 00 Can be done safely and quickly.
- the MDE unit 1 By attaching and detaching the 10, it is possible to prevent the fall of the IF jet 120 during this operation in advance.
- the main body fixing members 160, 161 are retrofitted to the mounting portions 121, 120 of the IF seat 120. Therefore, before the installation The size and weight of the IF unit 120 can be reduced, and portability and packaging of the IF unit 120 can be facilitated.
- a vent hole 1 2 18 (see FIG. 3) of a size that can prevent the infiltration of liquid by a Gora-Tex filter is formed. Therefore, according to this base station apparatus 100, air flows in and out through the vent holes 1 2 1 3 so that the internal pressure and external pressure of the MDE unit 1 10, IF unit 1 20 and T 1 PA unit 1 40 becomes equal, negative pressure does not occur in base station 100, and the internal 04007545
- the mother board 1 1 1 of the base station apparatus 100 is a connector of each of the CNT substrate P 1, the TRX substrate P 2 and the BB 1 substrate P 4. And mounting directions for each connector of Md 1 board 1 1 1 and mounting directions of C NT board P 1, TRX board P 2 and BB 1 board P 4 for MD E case 1 1 0 MD E case 1 1 4 , Are configured to be in the same direction. Therefore, according to the base station apparatus 10, with the connectors of the CNT substrate P1, the T RX substrate P 2 and the BB 1 substrate P 4 connected to the respective connectors of the motherboard 1 1 1 1 CNT substrate P 1, D 1 substrate? Without stressing each of the 2 and B B 1 substrates P 4, the same: ⁇ D board 1, Ding! ⁇ Substrate 2 and BB 1 substrate P 4 can be attached to MDE case 1 14 of MDE unit 1 10
- the MDE board of the printed board of the CNT board P 1, TRX board P 2 and BB 1 board P 4 attached to this is used.
- the problem of stress does not occur the first time the test unit is installed in the MDE case 114. Therefore, when a new printed circuit board is replaced and mounted, the base station apparatus 100's masa-board 1 11 does not cause the stress again to cause the same problem again with the printed circuit board that has just been replaced. .
- this base station apparatus 100 is provided with the mother board 1 1 1 configured as described above, problems with the CNT substrate P 1, TRX substrate P 2 and BB 1 substrate P 4 It is possible to configure a communication system that is less likely to occur.
- this base station apparatus 100 is comprised of a TRX substrate P 2, BB 0 substrate P 3 and BB 1 substrate P 4 and MD E 1 N 10 1 consisting of small-sized printed circuit boards. Since the air flow passage of the MDE fan 1 13 is formed between the MDE case 1 14 and the inner wall of the MDE case 1 14, each print disposed in the MDE run 1 1 0 by the MDE fan 1 1 3 The substrate can be cooled efficiently, and the occurrence of defects due to the heat of each printed circuit can be suppressed.
- this base station apparatus 100 is a C NT substrate P 1 in a state in which a heat dissipation member such as the above-mentioned substrate plate 116 is disposed in the MDE unit 110, a single substrate? 2, B B 0 substrate P 3 and B B 1 substrate P 4 can be disposed so as to be in contact with each other, and the occurrence of defects due to heat of each printed circuit can be further suppressed.
- this base station apparatus 100 uses a heat pipe as the heat dissipation member, thereby making it possible to use a CNT substrate P1, a TRX substrate P2, an 880 substrate? 3 and 8: 61
- the heat dissipation of the substrate P 4 can be further improved.
- each of the outer containers can be miniaturized and the workability is improved, and a heat radiation space is provided between each outer container, and the opposing surfaces of each outer container are provided. Since the heat dissipating members are respectively provided on the upper side, it has an effect of remarkably improving the heat dissipating property, and is useful as a base station device of the communication system, particularly as a wireless base station device of the third generation mobile communication system.
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/527,028 US20050207121A1 (en) | 2003-06-12 | 2004-05-26 | Base station device |
EP04734903A EP1538760A1 (en) | 2003-06-12 | 2004-05-26 | Base station device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-168503 | 2003-06-12 | ||
JP2003168503A JP3556944B1 (ja) | 2003-06-12 | 2003-06-12 | 基地局装置 |
JP2003-168502 | 2003-06-12 | ||
JP2003168502A JP2005005542A (ja) | 2003-06-12 | 2003-06-12 | マザーボード及び基地局装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004112266A1 true WO2004112266A1 (ja) | 2004-12-23 |
Family
ID=33554404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/007545 WO2004112266A1 (ja) | 2003-06-12 | 2004-05-26 | 基地局装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050207121A1 (ja) |
EP (1) | EP1538760A1 (ja) |
WO (1) | WO2004112266A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104244676A (zh) * | 2014-08-19 | 2014-12-24 | 深圳三星通信技术研究有限公司 | 一种远端射频拉远单元结构 |
CN108260227A (zh) * | 2016-12-28 | 2018-07-06 | 中兴通讯股份有限公司 | 一种基站结构 |
WO2021221332A1 (en) * | 2020-04-29 | 2021-11-04 | Samsung Electronics Co., Ltd. | Wireless base station assembly structure and wireless base station |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2005078947A1 (ja) * | 2004-02-13 | 2007-10-18 | 日本電気株式会社 | デジタル無線装置 |
US8582298B2 (en) | 2009-06-22 | 2013-11-12 | Xyber Technologies | Passive cooling enclosure system and method for electronics devices |
US9036351B2 (en) * | 2009-06-22 | 2015-05-19 | Xyber Technologies, Llc | Passive cooling system and method for electronics devices |
DE102014108396A1 (de) * | 2014-06-13 | 2015-12-17 | Ebm-Papst St. Georgen Gmbh & Co. Kg | Antennenanordnung mit einer Lüftereinheit |
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JP2003092482A (ja) * | 2001-09-19 | 2003-03-28 | Nippon Antenna Co Ltd | 通信機器の放熱構造 |
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US70043A (en) * | 1867-10-22 | Improvement in yapoe-buetsee | ||
FR2701178A1 (fr) * | 1993-02-03 | 1994-08-05 | Philips Electronique Lab | Système de communication par étalement de spectre à multiutilisateurs. |
CA2128554C (en) * | 1994-07-21 | 2002-04-30 | Kevin L. Dalgleish | Wireless base station |
US5771468A (en) * | 1996-01-17 | 1998-06-23 | Telefonaktiebolaget L M Ericsson | Multi-purpose base station |
FI973881A (fi) * | 1997-10-03 | 1999-04-04 | Nokia Telecommunications Oy | Elektroniikkakaappi ja elektroniikkakaapin ilmakanavisto |
JP3024610B2 (ja) * | 1997-10-13 | 2000-03-21 | 日本電気株式会社 | 密閉型通信機器 |
JP3033735B2 (ja) * | 1998-06-17 | 2000-04-17 | 日本電気株式会社 | 密閉型筐体 |
JP4037606B2 (ja) * | 2000-12-08 | 2008-01-23 | 日本電気株式会社 | ワイヤー取付型情報通信機器用屋外筐体構造 |
JP2003060371A (ja) * | 2001-08-16 | 2003-02-28 | Nec Corp | 通信機器筐体の放熱構造 |
US7139531B2 (en) * | 2002-09-27 | 2006-11-21 | Fujitsu Limited | Outdoor radio equipment |
JP3907580B2 (ja) * | 2002-12-11 | 2007-04-18 | 富士通株式会社 | 通信装置 |
JP4325219B2 (ja) * | 2003-02-26 | 2009-09-02 | 日本電気株式会社 | 電子装置の筐体構造とその密閉筐体の内部の気圧調整方法 |
JP4408224B2 (ja) * | 2004-01-29 | 2010-02-03 | 富士通株式会社 | 放熱機能を有する筐体 |
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2004
- 2004-05-26 US US10/527,028 patent/US20050207121A1/en not_active Abandoned
- 2004-05-26 EP EP04734903A patent/EP1538760A1/en not_active Withdrawn
- 2004-05-26 WO PCT/JP2004/007545 patent/WO2004112266A1/ja not_active Application Discontinuation
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JPH01107189U (ja) * | 1988-01-11 | 1989-07-19 | ||
JPH0736495U (ja) * | 1993-12-17 | 1995-07-04 | 株式会社東芝 | 回路基板収容ラック |
JP2000031676A (ja) * | 1998-04-28 | 2000-01-28 | Lucent Technol Inc | 冷却式電子装置 |
JP2003092482A (ja) * | 2001-09-19 | 2003-03-28 | Nippon Antenna Co Ltd | 通信機器の放熱構造 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104244676A (zh) * | 2014-08-19 | 2014-12-24 | 深圳三星通信技术研究有限公司 | 一种远端射频拉远单元结构 |
CN104244676B (zh) * | 2014-08-19 | 2017-03-08 | 深圳三星通信技术研究有限公司 | 一种远端射频拉远单元结构 |
CN108260227A (zh) * | 2016-12-28 | 2018-07-06 | 中兴通讯股份有限公司 | 一种基站结构 |
WO2021221332A1 (en) * | 2020-04-29 | 2021-11-04 | Samsung Electronics Co., Ltd. | Wireless base station assembly structure and wireless base station |
Also Published As
Publication number | Publication date |
---|---|
EP1538760A1 (en) | 2005-06-08 |
US20050207121A1 (en) | 2005-09-22 |
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