WO2004096482A1 - Machine and process for cutting openings in a substrate - Google Patents

Machine and process for cutting openings in a substrate Download PDF

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Publication number
WO2004096482A1
WO2004096482A1 PCT/IB2004/001273 IB2004001273W WO2004096482A1 WO 2004096482 A1 WO2004096482 A1 WO 2004096482A1 IB 2004001273 W IB2004001273 W IB 2004001273W WO 2004096482 A1 WO2004096482 A1 WO 2004096482A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
machine
opening
cutting
laser beam
Prior art date
Application number
PCT/IB2004/001273
Other languages
French (fr)
Inventor
Johannes Georg Schaede
Original Assignee
Kba-Giori S.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kba-Giori S.A. filed Critical Kba-Giori S.A.
Priority to US10/554,486 priority Critical patent/US20060231537A1/en
Priority to JP2006500345A priority patent/JP4220544B2/en
Priority to EP04728605A priority patent/EP1622739B1/en
Priority to DE602004001779T priority patent/DE602004001779T2/en
Publication of WO2004096482A1 publication Critical patent/WO2004096482A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/29—Securities; Bank notes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/02—Delivering or advancing articles from machines; Advancing articles to or into piles by mechanical grippers engaging the leading edge only of the articles
    • B65H29/04—Delivering or advancing articles from machines; Advancing articles to or into piles by mechanical grippers engaging the leading edge only of the articles the grippers being carried by endless chains or bands
    • B65H29/042—Intermediate conveyors, e.g. transferring devices
    • B65H29/044—Intermediate conveyors, e.g. transferring devices conveying through a machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/515—Cutting handled material
    • B65H2301/5152—Cutting partially, e.g. perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/515—Cutting handled material
    • B65H2301/5153—Details of cutting means
    • B65H2301/51536—Laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/54—Auxiliary process performed during handling process for managing processing of handled material
    • B65H2301/543—Auxiliary process performed during handling process for managing processing of handled material processing waste material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2406/00—Means using fluid
    • B65H2406/30—Suction means
    • B65H2406/35—Other elements with suction surface, e.g. plate or wall
    • B65H2406/351—Other elements with suction surface, e.g. plate or wall facing the surface of the handled material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web
    • B65H2701/1912—Banknotes, bills and cheques or the like

Definitions

  • the present invention concerns a machine for cutting an opening, for example a window, in a planar substrate.
  • the present invention also concerns a process for cutting an opening, for example a window, in a planar substrate.
  • Such security features include special inks with iridescent properties, so called optically variable inks, used to print specific patterns on the substrate of the note, optically variable devices (such as holograms, kinegrams) in the shape of metallized patches, or also specific patterns, such as moire patterns and other similar patterns, all of which are very difficult if not impossible to copy by actual machines, but, on the other hand, are easy to control visually.
  • optically variable devices such as holograms, kinegrams
  • specific patterns such as moire patterns and other similar patterns, all of which are very difficult if not impossible to copy by actual machines, but, on the other hand, are easy to control visually.
  • Other security features include combinations of superimposed lines and/or patterns with colors, which are only visible under specific conditions, for example UV light or by transparency. Again, the interest of such security means is that they may easily be printed or placed on the document to be protected and also be controlled by simple devices, even visually, but they are impossible to reproduce with actual printers, scanners or copy machines.
  • Another specific technique involves watermarks in which the paper substrate is marked with lines or patterns only visible in transparency.
  • a further development of this technique concerns pseudo-watermarks consisting in the creation of a window in the substrate, especially in paper- based substrates, which are normally not transparent, said window being transparent .
  • Transparent windows are widely used in polymer-based substrates for banknotes and securities, in order to provide a security element. These polymer-based substrates are usually completely transparent; therefore, to form a transparent window, it is only necessary to leave the chosen zone free of printing.
  • a substrate which is not transparent a first process has been developed according to which, it is possible to reduce locally the thickness of the paper in order to create a transparent window in the substrate .
  • PCT application WO 99/14433 discloses this process and the content of this application is incorporated by reference in the present application.
  • a soaking solution is applied on at least one surface of the paper in one or several predetermined zones, then one applies pressure and heat on the soaked zone so as to evaporate and densify the coated paper in said zone relative to the rest of the paper.
  • said zones have a reduced thickness with respect to the rest of the paper and are transparent .
  • This first technique however has the drawback of weakening locally the paper in the zone comprising said window.
  • the smaller the thickness of the window the weaker the zone.
  • Banknotes using such a technique thus have a reduced lifetime and must be exchanged, i.e. new bank notes must be printed to replace the older damaged ones .
  • the aim of the invention is to improve the known machines and processes.
  • the aim of the invention is to provide an improved machine for cutting an opening in a planar substrate.
  • a further aim of the invention is to provide an improved process for cutting an opening into a planar substrate .
  • the invention complies with the definition given in the claims .
  • Figure 1 shows the principle of a machine according to the invention.
  • Figure 2 shows a cross-sectional top view of an aspiration box according to the invention.
  • Figure 3 shows a first embodiment of a laser guiding system.
  • Figure 4 shows a variant of the laser guiding system.
  • successive substrates 1 such as sheets of paper or other material, are brought to the machine by a feed system, for example a swing gripper transfer 2, and transferred on a first transfer cylinder 3.
  • the successive substrates 1 are transferred by a transfer cylinder 4 known in the art of printing machines with gripper systems 5.
  • the substrates 1 are then transferred to a transporting device, such as a chain gripper system 7 comprising a chain on which gripper bars 8 are mounted to carry the successive substrates 1.
  • a transporting device such as a chain gripper system 7 comprising a chain on which gripper bars 8 are mounted to carry the successive substrates 1.
  • the gripper bars cooperate with the first transfer cylinder 3 to take over the successive substrates 1 and transport them in the cutting part of the machine.
  • the substrates 1 are taken by the chain gripper system 7 until they arrive under the cutting part of the machine.
  • This cutting part comprises an aspiration box 9 which has aspiration openings 10 in the bottom wall that are linked to an aspiration source 11, said source 11 providing air under depression in order to press the substrate 1 against the exterior surface of the bottom wall of the box 9 during the cutting operation.
  • the cutting operation is carried out by a laser, the laser beam 13 being directed into a cutting opening 14 of the bottom wall of the box 9.
  • the laser beam 13 is either aimed directly on the substrate being cut, or indirectly by means of mirrors or other equivalent devices . Accordingly, during the cutting operation, the substrate is halted and maintained pressed against the exterior surface of the bottom wall so that the laser beam may cut the wanted opening in the substrate through the cutting opening 14 of the bottom wall.
  • This cutting opening 14 may have the same shape as the window being cut into the substrate or a larger size.
  • the laser beam 13 is aimed either directly by displacing the laser 12 itself along two orthogonal axis X-Y with appropriate mechanical means or the beam 13 can be aimed indirectly by mirrors (see figure 4) which are themselves moveable to displace the beam 13 along two orthogonal axis X-Y.
  • the system is therefore able to cut widows of several different sizes with no change of machine, but only by a proper aiming of the beam 13 along the axis X-Y.
  • the cut part is either aspirated in the box 9 through the air under depression and evacuated, or it can be aspirated in an evacuation outlet 15 also through air under depression.
  • the cutting opening 14 is closed by a transparent material, such as glass, in order to avoid balance problems with the vacuum created in box 9 and in outlet 15. If the cut part is small enough with respect to the size of the substrate, the substrate will be properly held against the exterior surface of the bottom wall during the cutting operation, even if the cutting opening is closed by a transparent material .
  • Box 9 and evacuation outlet 15 are also useful to evacuate the fumes created by the cutting operation.
  • the substrate can be taken away by the chain gripper system 7 for further treatment, i.e. the chain gripper system 7 advances thus taking the cut substrate 1 to a second transfer cylinder 16 and the cut substrate 1 may undergo a further treatment, such as laminating a foil over the window, in a further machine
  • the bottom wall 17 has, as a non-limiting example, a rectangular shape and comprises several holes 10 for allowing the air under depression in the box 9 to act on the substrate and apply the substrate against the outer surface of the bottom wall 17 during the cutting operation.
  • the bottom wall 9 further comprises the opening 14 through which the cutting is effected by the laser beam 13.
  • the shape of the opening 14 is given by way of an example as rectangular but other shapes are possible (square, round, triangular etc.) .
  • the opening 14 may be closed by transparent material to avoid vacuum balance problems between the box 9 and the outlet 15.
  • FIG 3 a first system for moving the laser beam 13 along two cutting directions is shown.
  • the laser itself 12 is displaced, for example by rotation or linearly, along two axis X and Y by appropriate actuators 18, 19 (rotating or linear) to carry out the cutting operation of the substrate 1 by displacing the laser beam 13 through bottom wall 17 and opening 14.
  • the laser 12 itself is fixed and only the laser beam 13 is guided along the shape to be cut in the substrate through opening 14 of bottom wall 17, for example by a mirror 20 which can rotate around two orthogonal axis with appropriate actuation means 21, 22 for example motors driven actuators, the principle of which is well known in the art .

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Business, Economics & Management (AREA)
  • Accounting & Taxation (AREA)
  • Finance (AREA)
  • Laser Beam Processing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The machine has at least a cutting tool (12), a transfer system (7,8) holding said substrate (1) and driving said substrate (1) along a determined direction. The cutting tool (12) comprises a laser beam (13) that can be moved in two perpendicular directions and evacuation means (11,15) to evacuate a cut part of said substrate (1).

Description

Machine and process for cutting openings in a substrate
The present invention concerns a machine for cutting an opening, for example a window, in a planar substrate.
The present invention also concerns a process for cutting an opening, for example a window, in a planar substrate.
In the field of banknotes and securities, there has been increasing needs for security features protecting against counterfeiting. Indeed, in the past years, computers, scanners and copy machines have been extensively developed and today, it is possible to buy very performing devices at a reasonable price. Since these devices are more performing, it has been at the same time necessary to develop new and improved security features for securities, such as banknotes, checks, cards (i.e. credit cards), ID cards, passports etc. which would not allow them to be copied by standard computers or scanners, or even modern color copy machines .
Such security features include special inks with iridescent properties, so called optically variable inks, used to print specific patterns on the substrate of the note, optically variable devices (such as holograms, kinegrams) in the shape of metallized patches, or also specific patterns, such as moire patterns and other similar patterns, all of which are very difficult if not impossible to copy by actual machines, but, on the other hand, are easy to control visually. Other security features include combinations of superimposed lines and/or patterns with colors, which are only visible under specific conditions, for example UV light or by transparency. Again, the interest of such security means is that they may easily be printed or placed on the document to be protected and also be controlled by simple devices, even visually, but they are impossible to reproduce with actual printers, scanners or copy machines.
Another specific technique involves watermarks in which the paper substrate is marked with lines or patterns only visible in transparency. A further development of this technique concerns pseudo-watermarks consisting in the creation of a window in the substrate, especially in paper- based substrates, which are normally not transparent, said window being transparent .
It is however very difficult to create or simulate a transparent window in a paper-based substrate . Transparent windows, as such, are widely used in polymer-based substrates for banknotes and securities, in order to provide a security element. These polymer-based substrates are usually completely transparent; therefore, to form a transparent window, it is only necessary to leave the chosen zone free of printing. However, in the case of paper, a substrate which is not transparent, a first process has been developed according to which, it is possible to reduce locally the thickness of the paper in order to create a transparent window in the substrate . PCT application WO 99/14433 for example, discloses this process and the content of this application is incorporated by reference in the present application. According to this known process, a soaking solution is applied on at least one surface of the paper in one or several predetermined zones, then one applies pressure and heat on the soaked zone so as to evaporate and densify the coated paper in said zone relative to the rest of the paper. Thus, said zones have a reduced thickness with respect to the rest of the paper and are transparent .
This first technique however has the drawback of weakening locally the paper in the zone comprising said window. In particular, the smaller the thickness of the window, the weaker the zone. Banknotes using such a technique thus have a reduced lifetime and must be exchanged, i.e. new bank notes must be printed to replace the older damaged ones .
Another technique implies to cut a hole directly in the substrate in order to create the transparent window. For example, PCT application WO 95/10420, the content of which is incorporated by reference in the present application, discloses a paper banknote with a cut window. It is of course necessary to cover the opening cut in the substrate, which is done in this case by a covering with a strip of transparent material, e.g. a foil or a laminate.
The aim of the invention is to improve the known machines and processes.
The aim of the invention is to provide an improved machine for cutting an opening in a planar substrate.
A further aim of the invention is to provide an improved process for cutting an opening into a planar substrate . To fulfil these aims, the invention complies with the definition given in the claims .
The invention will best understood by the description of an embodiment and of the accompanying drawings in which:
Figure 1 shows the principle of a machine according to the invention.
Figure 2 shows a cross-sectional top view of an aspiration box according to the invention.
Figure 3 shows a first embodiment of a laser guiding system.
Figure 4 shows a variant of the laser guiding system.
An embodiment of the machine for cutting an opening in a planar substrate is firstly described with reference to figure 1.
In this machine successive substrates 1, such as sheets of paper or other material, are brought to the machine by a feed system, for example a swing gripper transfer 2, and transferred on a first transfer cylinder 3. The successive substrates 1 are transferred by a transfer cylinder 4 known in the art of printing machines with gripper systems 5.
The substrates 1 are then transferred to a transporting device, such as a chain gripper system 7 comprising a chain on which gripper bars 8 are mounted to carry the successive substrates 1. The gripper bars cooperate with the first transfer cylinder 3 to take over the successive substrates 1 and transport them in the cutting part of the machine.
As explained, the substrates 1 are taken by the chain gripper system 7 until they arrive under the cutting part of the machine. This cutting part comprises an aspiration box 9 which has aspiration openings 10 in the bottom wall that are linked to an aspiration source 11, said source 11 providing air under depression in order to press the substrate 1 against the exterior surface of the bottom wall of the box 9 during the cutting operation.
The cutting operation is carried out by a laser, the laser beam 13 being directed into a cutting opening 14 of the bottom wall of the box 9. The laser beam 13 is either aimed directly on the substrate being cut, or indirectly by means of mirrors or other equivalent devices . Accordingly, during the cutting operation, the substrate is halted and maintained pressed against the exterior surface of the bottom wall so that the laser beam may cut the wanted opening in the substrate through the cutting opening 14 of the bottom wall. This cutting opening 14 may have the same shape as the window being cut into the substrate or a larger size. To carry out the cutting operation, the laser beam 13 is aimed either directly by displacing the laser 12 itself along two orthogonal axis X-Y with appropriate mechanical means or the beam 13 can be aimed indirectly by mirrors (see figure 4) which are themselves moveable to displace the beam 13 along two orthogonal axis X-Y. The system is therefore able to cut widows of several different sizes with no change of machine, but only by a proper aiming of the beam 13 along the axis X-Y.
Once the cutting operation has taken place, the cut part is either aspirated in the box 9 through the air under depression and evacuated, or it can be aspirated in an evacuation outlet 15 also through air under depression.
Accordingly, if the cut part is being evacuated in the box via the evacuation outlet' 15, it is preferred that the cutting opening 14 is closed by a transparent material, such as glass, in order to avoid balance problems with the vacuum created in box 9 and in outlet 15. If the cut part is small enough with respect to the size of the substrate, the substrate will be properly held against the exterior surface of the bottom wall during the cutting operation, even if the cutting opening is closed by a transparent material .
In a variant, it is also possible to remove the evacuation outlet 15 and evacuate the cut part through box 9.
Box 9 and evacuation outlet 15 (when present) are also useful to evacuate the fumes created by the cutting operation.
When the cutting operation is finished and the cut part has been evacuated, the substrate can be taken away by the chain gripper system 7 for further treatment, i.e. the chain gripper system 7 advances thus taking the cut substrate 1 to a second transfer cylinder 16 and the cut substrate 1 may undergo a further treatment, such as laminating a foil over the window, in a further machine
(not shown) . An example of such a laminate foil application machine is given in European patent application filed on
April 30, 2003 with the title "Machine for applying and cutting strips of laminate", in the name of KBA-GIORI S.A., the content of which is incorporated by reference in the present application. Another example of application of such a strip of laminate foil is disclosed in European patent application N°02405782.0 filed on September 10, 2002 in the name of KBA-GIORI S.A., the content of which is incorporated by reference in the present application.
The application of a strip of foil as known in the art and disclosed hereabove would then allow the use of the technology disclosed in patent application EP 1 291 195 and in EP patent application 02405782.0 filed on September 19, 2002 in the name of KBA-GIORI S.A., both being incorporated by reference in the present application, to apply a recto- verso security and control element to the cut substrate.
In figure 2, a top view in cross-section of the aspiration box 9 is represented. The bottom wall 17 has, as a non-limiting example, a rectangular shape and comprises several holes 10 for allowing the air under depression in the box 9 to act on the substrate and apply the substrate against the outer surface of the bottom wall 17 during the cutting operation. The bottom wall 9 further comprises the opening 14 through which the cutting is effected by the laser beam 13. The shape of the opening 14 is given by way of an example as rectangular but other shapes are possible (square, round, triangular etc.) . As mentioned above, the opening 14 may be closed by transparent material to avoid vacuum balance problems between the box 9 and the outlet 15.
In figure 3, a first system for moving the laser beam 13 along two cutting directions is shown. In this system, the principle of which is known in the art, the laser itself 12 is displaced, for example by rotation or linearly, along two axis X and Y by appropriate actuators 18, 19 (rotating or linear) to carry out the cutting operation of the substrate 1 by displacing the laser beam 13 through bottom wall 17 and opening 14.
In a variant represented in figure 4, the laser 12 itself is fixed and only the laser beam 13 is guided along the shape to be cut in the substrate through opening 14 of bottom wall 17, for example by a mirror 20 which can rotate around two orthogonal axis with appropriate actuation means 21, 22 for example motors driven actuators, the principle of which is well known in the art .
The embodiments of the invention described in the present specification are given as illustrative examples and must not be interpreted in a limiting manner. Other variants and equivalent solutions are possible within the scope of the appended claims .

Claims

Claims
1. Machine for cutting an opening, such as a window in a planar substrate (1) , said machine having at least a cutting tool (12) characterised in that it comprises a transfer system (7,8) holding said substrate (1) and driving said substrate along a determined direction, and in that the cutting tool (12) comprises a laser beam (13) that can be moved in two perpendicular directions and evacuation means (11,15) to evacuate a cut part of said substrate (1) .
2. Machine as claimed in claim 1, wherein it further comprises an aspiration box (9) to maintain the substrate (1) during the cutting operation.
3. Machine as claimed in claim 2, wherein said aspiration box (9) comprises a bottom wall (17) with aspiration openings (10) and a cutting opening (14) .
4. Machine as claimed in one of the preceding claims, wherein said transfer system is a chain gripper system (17) .
5. Machine as claimed in one of the preceding claims, wherein said laser (12) is displaced linearly or rotationally.
6. Machine as claimed in one of claims 1 to 4, wherein said laser beam (13) is displaced linearly or rotationally.
7. Machine as claimed in one of the preceding claims, wherein it further comprises a laminate application unit for applying a strip of laminate over the cut opening of the substrate.
8. Process for cutting an opening, such as a window, in a planar substrate, said process being characterised by the following steps:
-) holding said substrate with a gripper, -) moving said substrate along a given direction, -) applying said substrate against a surface, -) illuminating said substrate with a laser beam to cut an opening in said substrate, -) evacuating the cut part of said substrate.
9. Process according to claim 8, wherein said application step of substrate against a surface is made by using air under depression.
10. Process according to claim 8 or 9, wherein said evacuation step is made by aspiration means with air under depression.
11. Process according to one of claims 8 to 10, wherein said laser beam is displaced along two orthogonal axes.
12. Process according to one of claims 8 to 11, wherein said laser beam is rotated around two orthogonal axes.
13. Process according to one of claims 8 to 12, wherein a mirror displaces said laser beam.
14. Process according to one of claims 8 to 13, wherein it further comprises the step of applying laminate over the cut opening of the substrate .
PCT/IB2004/001273 2003-05-02 2004-04-21 Machine and process for cutting openings in a substrate WO2004096482A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US10/554,486 US20060231537A1 (en) 2003-05-02 2004-04-21 Machine and process for cutting openings in a substrate
JP2006500345A JP4220544B2 (en) 2003-05-02 2004-04-21 Mechanical apparatus and method for cutting an opening in a substrate
EP04728605A EP1622739B1 (en) 2003-05-02 2004-04-21 Machine and process for cutting openings in a substrate
DE602004001779T DE602004001779T2 (en) 2003-05-02 2004-04-21 MACHINE AND METHOD FOR CUTTING OPENINGS IN A SUBSTRATE

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US7922858B2 (en) 2007-02-26 2011-04-12 Kba-Giori S.A. Method and installation for applying foil material onto successive sheets
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US8967221B2 (en) 2008-07-03 2015-03-03 Kba-Notasys Sa Method and installation for applying foil material onto successive sheets
WO2010073225A2 (en) 2008-12-23 2010-07-01 Arjowiggins Security Security document comprising at least one combined image and a revelation means, and associated method
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WO2011141858A1 (en) 2010-05-12 2011-11-17 Arjowiggins Security Security document comprising a watermark or pseudo-watermark, a combined image and a visualization screen, and associated processes
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DE602004001779D1 (en) 2006-09-14
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US20060231537A1 (en) 2006-10-19
CN1784286A (en) 2006-06-07
DE602004001779T2 (en) 2007-11-22
EP1622739B1 (en) 2006-08-02
EP1473107A1 (en) 2004-11-03
CN100469509C (en) 2009-03-18
ATE334772T1 (en) 2006-08-15
EP1622739A1 (en) 2006-02-08

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