JP3518079B2 - Laser processing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a work material into various shapes using laser light.

[0002]

2. Description of the Related Art Conventionally, when a material to be processed such as an organic material is cut and processed into an arbitrary shape, for example, JP-A-61-2 is used.
Laser processing machines such as those disclosed in JP-A-35090 and JP-A-2-30391 are used.

As a processing method, an XY table method,
Plotter method and mirror swing method are known. X
The -Y table method is a method in which the laser light emission port is fixed and the table on which the workpiece is placed is moved in the XY directions for processing, and the plotter method is a laser beam in which the workpiece is fixed. Is moved in the X-Y direction, or a mirror for reflecting the laser light from the exit port is moved in the X direction,
In this method, the gantry to which the mirror is attached is moved in the Y direction for processing. The mirror swing method is a processing method in which one mirror is rotated by a rotating mechanism, and a rotating mechanism for rotating the rotating mechanism and the mirror in another direction is provided to move the laser beam.

When cutting a work piece, usually, (1) the periphery of the cut portion is cooled to prevent the work piece from burning, and (2) the material is removed while it is in a molten state. Processing is performed while spraying an assist gas for the purpose of suppressing the heat effect on the periphery of the cutting part due to excessive heat.

[0005]

However, in the above-mentioned conventional processing method, the table (XY) on which the material to be processed is placed.
When processing corners or curved parts to move heavy parts such as a table system), a laser beam emitting port or a pedestal with a mirror (plotter system), or a rotation mechanism with a mirror (mirror swing system). Movement speed becomes slow. For this reason, the irradiation energy of the laser per unit length becomes large as compared with the time of processing the straight portion, which causes excessive heat input. Therefore, if the material to be processed is an organic material that is easily deformed by heat, the processing accuracy may decrease.

Further, in the cutting process by laser,
It is important to improve the cutting position accuracy. In particular, for a CO ₂ laser used for processing an organic material, it is difficult to directly detect the irradiation position with high accuracy, and the correction is performed by actually processing and measuring the shift off-line. It is the actual situation. Therefore, there is a demand for development of a method for easily and accurately detecting a laser irradiation position and correcting the position to improve the processing accuracy of a workpiece.

Therefore, an object of the present invention is to provide a laser processing method which is excellent in processing accuracy of a work material such as an organic material.

[0008]

In order to solve the above problems SUMMARY OF THE INVENTION In the method of claim 1, as shown in FIG. 1, when laser processing a workpiece 6 containing organic material, the organic material
As a work material 6 containing
Has a layer containing a flame retardant material formed on at least one surface
A material is used and an auxiliary gas is blown to the processed part of the work 6 above.
Processing without tight fit. A plurality of mirrors 4 are provided between the lens 2 for condensing the laser light and the workpiece 6.
1 and 51 are rotatably provided, and the mirrors 41 and 51 are independently driven to rotate in different directions, whereby the laser light is moved relative to the workpiece 6 to perform the cutting process.

At this time, as shown in FIG. 5, means for moving the processing stage 7 on which the material 6 to be processed is mounted and means 81 for detecting the position of the processing stage 7 are provided so that the processing stage 7 can be operated at appropriate times. It is also possible to perform processing while correcting the laser irradiation position based on the position of the processing stage 7 that is moved and detected by the position detecting means 81 and the coordinate data of the processing position stored in advance (claim). 2). Here, as the material 6 to be processed, a film containing an organic material or a multilayer film formed by laminating a plurality of film-like materials, or a woven fabric containing an organic material is used (claim 3).

In the method of claim 4, as shown in FIG.
A detector 9 for detecting the presence / absence of reception of laser light is provided in the vicinity of the workpiece 6, and a reference material 92 whose installation position is known is arranged in contact with the detector 9. The detector 9 and the reference material 92
The laser beam is relatively moved so as to cross the boundary between the reference signal 9 and the signal indicating the presence or absence of laser irradiation emitted from the detector 9.
The actual laser irradiation position is known from the position data of 2, and the laser irradiation position is corrected based on this.

Specifically, a plurality of the reference materials 92 are provided, and the reference materials 92 are arranged so as to face each other with the detector 9 interposed therebetween, and laser light is passed so as to cross the boundaries between the plurality of reference materials 92 and the detector 9. Move relative to. An intermediate position between the position where the electric signal emitted from the detector 9 first indicates laser irradiation and the position where the electric signal finally indicates laser irradiation is set as an intermediate position of the plurality of reference materials 92, and the position data and the data are stored in advance. The laser irradiation position may be corrected based on the coordinate data of the intermediate position (claim 5). Further, this method is effective when a carbon dioxide laser is used as the laser light irradiation means (claim 6).

[0012] In the method of claim 7, as shown in FIG. 16, after printing form figure A to be cut on the workpiece 6, when cutting the print figure A at the laser beam, the
A layer made of an organic material as the workpiece 6 containing an organic material
And a layer containing a flame retardant material formed on at least one surface thereof
Using a material that has
Processing is performed without blowing gas. Then, in the same step as the formation of the printed figure A, the reference mark B for detecting the laser irradiation position is formed on the workpiece 6. Then, the vicinity of the reference mark B is irradiated with laser light,
The laser irradiation position is corrected based on the amount of deviation between the position of the irradiation mark and the position of the reference mark B.

According to the method of claim 8, in the method of laser processing the workpiece 6 containing an organic material, the workpiece 6 is processed.
As the material, a material having a layer made of an organic material and a layer containing a flame-retardant material formed on at least one surface thereof is used, and processing is performed without blowing an auxiliary gas to the processed portion of the workpiece 6.

The method according to claims 1 to 3, wherein the organic material is
To be processed 6 having a layer 61 consisting of
When laser processing is applied to the
At the same time that the layer 61 containing the flame-retardant material is cut,
The flame-retardant material is vaporized and spreads around the processed part. This is a fire extinguishing material
Since it plays the role of
It is possible to prevent the workpiece 6 from burning. Further, in the method of claims 1 to 3, a plurality of mirrors are provided, and these are rotationally driven in mutually different directions to scan the laser light.
In the conventional plotter system and mirror swing system in which one mirror is used, movement or rotation of the mirror is performed in one direction, but since the mirror drive system itself is moved in the other direction, the drive unit is moved in two directions. Although the inertia was different and the desired quality was not obtained, in the present method, the mechanical moving part has a lightweight mirror 4.
Since only 1 and 51 are used, even when processing a corner portion, a curved portion, or the like, processing can be performed without reducing the moving speed of the laser light. Therefore, constant-speed processing is possible, and partial heat input does not occur, so it is optimal for processing organic materials, and the processing quality and accuracy are greatly improved compared to conventional methods.

When the processing stage 7 is moved as appropriate and the position of the processing stage 7 is detected to correct the laser irradiation position for processing, when the workpiece 6 is larger than the processing range of the mirrors 41 and 51. However, continuous processing is possible, and it is possible to obtain a machined shape without breaks. Also, mirror 4
Since the distance between 1, 51 and the workpiece 6 can be set arbitrarily,
The distance can be set so that the error of the laser irradiation position due to the rotation of the mirrors 41 and 51 becomes extremely small, and the processing accuracy is further improved.

In the method of claims 4 to 6, when the detector 9 and the reference material 92 are scanned with laser light, the laser irradiation signal is turned on on the detector 9 and the laser irradiation signal is turned off on the reference material 92. Become. Therefore, the actual laser irradiation position can be known from the ON-OFF signal and the known position of the reference material 92. Specifically, the pair of reference materials 92
It is assumed that the detector 9 is located therebetween (see FIG. 8) and the positions of the opposite edges of the reference member 92 are clear. The laser beam is scanned in the light movement direction indicated by the arrow, and the intermediate position between the position where the laser irradiation signal is first turned on and the position where the laser irradiation signal is turned on last is the intermediate position of the opposing edges of the reference material 92. Become.
By comparing this position data with the position data that should originally irradiate the intermediate position of the facing edge of the reference material 92, the deviation of the irradiation position is known, and the laser irradiation position is corrected to correct the processing position accuracy. Can be greatly improved.
This method is particularly effective when used for processing with a carbon dioxide gas laser, which has no conventional laser irradiation position detection method.

The method of claim 7, wherein the organic material is
The work material 6 having the layer 61 and the layer 62 containing the flame retardant material is
Laser processing, a layer made of organic material by laser irradiation
At the same time when the layer 61 is cut,
The fuel material evaporates and spreads around the processing area. This is the role of fire extinguishing material
It does not interfere with the use of assist gas
It is possible to prevent combustion of the work material 6. Further, since the reference mark B is formed at the same time as the print figure A, the deviation of the reference mark B can be regarded as the printing deviation. When the relation between the laser irradiation mark and the actual position of the reference mark B is represented by a vector c, and the relation between the position where the reference mark B is originally formed and the position where the laser beam is to be irradiated is represented by a vector d, The difference between the vector c and the vector d is the shift when the reference mark B is formed (that is, the print shift).
Is the sum of the deviation of the laser irradiation position. In this way, if the deviation at the time of forming the reference mark B and the deviation of the laser irradiation position are associated and quantified, and the irradiation position of the laser is corrected based on this deviation amount, the correction includes only one measurement error. Therefore, the error becomes smaller than that in the case of correcting the deviation when the reference mark B is formed and the deviation of the laser irradiation position,
The accuracy of cutting the printed figure is improved.

In the method of claim 8, when the workpiece 6 having the layer 61 made of an organic material and the layer 62 containing a flame retardant is laser-processed, the layer 61 made of an organic material is cut at the same time by laser irradiation. The flame-retardant material in the layer 62 containing the flame-retardant material is vaporized and spreads around the processed portion. Since this serves as a fire extinguishing material, it is possible to prevent combustion of the workpiece 6 without using an assist gas.

[0019]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings. FIG. 1 shows a laser processing apparatus used in this embodiment. In the figure, reference numeral 1 denotes a laser oscillator that oscillates a laser beam. As the laser oscillator, a CO ₂ laser was used here. A focal position adjusting device 2 and a condenser lens 3 are arranged in the optical path of the laser oscillator 1, and the laser light passing through these is incident on galvano scanners 4 and 5 which are optical scanning means. The galvano scanners 4 and 5 are for moving the irradiation position of the laser light within the processing area, and have a pair of rotatably provided mirrors 41 and 51. Then, the incident laser light is reflected by the mirror 41 (X-axis mirror),
The light is reflected by the mirror 51 (Y-axis mirror), and is irradiated onto an arbitrary position on the workpiece 6 made of a film of an organic material, which is arranged on the processing stage 7 below.

The processing stage 7 may have a hollow structure, and a suction device 71 may be installed in the lower portion as shown in the drawing so that gas and chips generated during processing can be sucked downward. When cutting with a galvano scanner, instead of removing in the molten state by blowing an assist gas,
In order to increase the cutting efficiency, the laser light needs to be efficiently absorbed by the work material. By installing the suction device 71 and sucking the generated gas downward, it is possible to prevent the generated gas from obstructing the path of the laser light. Further, the processing stage 7 has a structure capable of moving in the XY directions so that the workpiece 6 can be positioned as necessary.

In the figure, reference numeral 8 is a control device which operates the laser oscillator 1 and the focus position adjusting device 2 to rotate the galvano scanners 4 and 5. In the above device, the distance to the surface of the workpiece 6 after passing through the condenser lens 3 differs depending on the position in the processing area, so that the focal position of the laser light deviates. The focus position adjusting device 2 corrects this,
It is provided to adjust the focal position of the laser beam so that it is always optimum.

When processing the workpiece 6 using the laser processing machine, first, the workpiece 6 is fixed on the processing stage 7. Subsequently, the workpiece 6 is positioned by moving the processing stage 7 in the X-Y directions, if necessary. Further, the suction device 71 is operated so that the gas generated during processing and the chips can be sucked downward. Next, the processing data created in advance is input to the control device 8. The processing data includes information about ON / OFF of laser oscillation in addition to the processing shape. In the control device 8, arithmetic processing is performed based on the input processing data, and an ON-OFF signal of the laser oscillator 1,
Drive signals for the focus position adjusting device 2 and the galvano scanners 4, 5 are output. Then, the mirrors 41 and 51 rotate, and the laser beam is applied to an arbitrary position on the workpiece 6 according to the rotation angle. That is, by irradiating the workpiece 6 with laser light and moving the laser light irradiation position along the machining shape while also adjusting the focal position, the workpiece 6 in the irradiated portion is gasified, 6 Shape cutting is performed.

In the present invention, by using the galvano scanners 4 and 5 as the laser beam scanning means, it becomes possible to make the relative moving speed of the laser light at the time of machining the corner portion or the curved portion close to the moving speed at the time of cutting the straight portion. . Hereinafter, the reason will be described in comparison with the cutting by the XY table method.

When the acute-angled shape shown in FIG. 2 (a) is cut in the order of P → Q → R, the speed in the X direction becomes 0 at the position of Q because the moving direction is changed. Therefore, normal XY
In the cutting by the table method, control is performed such that the moving speed (X direction) of the table is decelerated from before the Q position and the speed is accelerated in the opposite direction from the Q position to the set speed. This control is to ensure cutting shape accuracy,
It is necessary to protect the mechanical moving part (table) and its drive motor. The change in velocity in the X direction in P → Q → R in this case is shown in FIG. Figure 3 (a)
During the middle time t, the moving speed of the table, that is, the relative speed of the workpiece and the laser light is slower than the relative moving speed in the straight line portion before the point P (after the point Q). If the laser output remains constant at this time, the irradiation energy per unit cutting length becomes large at that portion, so that the workpiece is melted too much and a sharp cutting shape cannot be obtained (FIG. 2 (b)). )). Therefore, conventionally, the laser output is controlled according to the relative speed to deal with it, but a dedicated control circuit is required, which causes a cost increase.

On the other hand, in the machining method according to the present invention, the relative velocity at the time of cutting a corner portion or a curved portion is made closer to the relative velocity at the time of machining a straight portion, and the machining speed is made constant, so that the irradiation energy is made uniform. It makes it possible to obtain sharp cutting shapes. This is to make the time required for acceleration / deceleration when changing the moving direction (t in FIG. 3A) as short as possible (ideally 0), that is, the slope a of the time t portion in FIG. 3A. It is necessary to make it larger, for example, as shown in FIG.
The change in the relative speed at the time of cutting the acute-angled shape as in (a) can be made negligible. Here, the inclination a is the actuation acceleration of the mechanically movable part, and is expressed by the following equation. a = F / m Formula (1) In this formula, F is the effect on the inertia of the mechanical movable part (determined by the torque generated by the table drive motor in the XY table system), and m is It is the mass of the mechanically movable part (mass of the table). In order to make a larger than in equation (1), it is necessary to make F larger, m smaller, or both.

In the XY table system, increasing F leads to an increase in size of the drive motor, and it is necessary to reduce the processing area or change the table material in order to reduce m, both of which are directly linked to cost increase. And not practical. On the other hand, in the present invention, it is extremely m as compared with the table.
Since a small mirror of is driven to rotate, it has a simple structure.
a can be made sufficiently large. Therefore, the time t required for acceleration / deceleration can be shortened to 1/100 or less as compared with the XY table method, and the relative moving speed at the time of cutting a corner portion, an acute angle portion, etc. can be made closer to that at the time of cutting a straight portion. You can

Thus, a desired cutting shape can be obtained by making the irradiation energy amount per unit cutting length substantially constant regardless of the shape of the processed portion and reducing the variation in the melting amount of the work material. Further, since the acceleration a is large, the set speed can be reached almost at the same time as the start of machining, and the run-up section (FIG. 4) to the machining start point, which is provided for machining by the XY table method, is unnecessary. That is, since the cutting can be started directly from the desired processing portion, it is possible to reduce the time required for processing. Further, since the special control for adjusting the laser output is not required, the structure of the control system of the device can be simplified.

Next, a second embodiment of the present invention will be described with reference to FIG. In laser processing using a galvano scanner, the irradiation area varies depending on the distance between the galvano scanner and the workpiece. The shorter the distance, the smaller the irradiation area, and the longer the distance, the larger the irradiation area. on the other hand,
In consideration of accuracy, if the distance is short for the same mirror rotation angle, the amount of movement of light is small, and if the distance is long, the amount of movement of light is large. Can be irradiated. Therefore, if the distance is set from the required accuracy, the irradiation area, that is, the processing area may be smaller than the area of the workpiece. In this case, it is conceivable that the graphic data is divided into the size of the processing area, and the work material is moved each time the divided data is processed using the XY table or the like. There is a problem that it is difficult to process the seam portion and the processing accuracy is reduced.

Therefore, in this embodiment, the distance between the galvano scanners 4 and 5 and the workpiece 6 is set so as to obtain a desired positional accuracy, and the portion to be processed is always placed in the processing area. The stage 7 is moved in a timely manner. Therefore, the irradiation area, that is, the processing area I (hatched in the figure) is smaller than the area of the workpiece 6. The processing stage 7 is movable in the X-Y directions, and a sensor 81 for detecting the position of the processing stage 7 is arranged close to the processing stage 7. As the sensor 81, for example, a sensor which illuminates slits arranged on the side surface of the processing stage 7 at regular intervals and detects the position of the processing stage 7 from the reflected light can be used. The control device 8 has a function of storing the graphic data for moving the laser beam, a function of converting the graphic data into the rotation angle of the galvano scanners 4, 5, and the galvano scanner 4, from the position of the processing stage 7 detected by the sensor 81.
5 has the function of adjusting the amount of rotation.

A case of cutting the figure shown in FIG. 5 using the apparatus having the above structure will be described with reference to the flowchart shown in FIG. The timing at which the processing stage 7 starts to move can be set arbitrarily, but here, after processing from the points s to a on the figure in the stationary state of the processing stage 7, the movement of the stage 7 is started and from the point b. The stage 7 is stopped when c enters the processing area I. Further, it is assumed that the figure data is given in XY coordinates with 0 in the figure as the origin. In this embodiment, it is assumed that the Y coordinate of this graphic data is inside the processing area I and the X coordinate is outside the processing area I.

First, the processing stage 7 is stationary and the sa portion is processed (FIG. 5A). The position of the processing stage 7 at this time is used as a reference of the stage 7 position. Since the portion of the point s-a is in the processing area I, the control device 8 converts the figure data into the rotation angles of the mirrors 41 and 51 without correcting the figure data.

Next, when the processing reaches the point a, the stage 7
(Fig. 5 (b)). When irradiating the laser after starting the movement, the position of the stage 7 is detected (step (1) in FIG. 6), and the irradiation position is corrected by the amount of movement (step (2) in FIG. 6). The X coordinate of the galvano irradiation position at this time is given as galvano irradiation coordinates (correction) = figure data coordinates−stage 7 movement amount. The actual rotation angle is calculated based on the galvano irradiation coordinates (correction) (step (3) in FIG. 6). The moving speed of the stage 7 is the galvano irradiation coordinates (correction).
Is larger than the processing area I. Next, the mirrors 41 and 51 are rotated by the calculated rotation angle amount (step (4) in FIG. 6) and laser light is emitted (step (5) in FIG. 6). Hereinafter, this is repeated. Processing part is point b
When the points b to c reach the processing area I, the stage 7 is stopped and only the mirrors 41 and 51 are operated to continue the processing (FIG. 5C). When the processing portion approaches the point c, the stage 7 is moved in the opposite direction, processing is performed while similarly correcting, and laser irradiation is stopped when the processing is completed (FIG. 6).
Step (6)).

Next, a concrete description will be given using a simple processing example shown in FIG. It is assumed that the black portion in FIG. 7 (1) is cut, and ◯ indicates a laser irradiation mark (processed hole) formed by pulse irradiation. In the present embodiment, a method of cutting while partially overlapping the processed holes by laser pulse irradiation will be described. The processing area I of the galvano scanners 4 and 5 is a hatched portion in FIG. It should be noted that the numbers in the circles in the figure are numbers provided for convenience in the following description to facilitate understanding.

First, with the machining stage 7 stationary, 1-
Laser irradiation is performed up to position 4 (FIG. 7C). Next, when the movement of the stage 7 is started and the stage position at the time of emitting the next pulse is the position of FIG. 7 (4) (the position where the movement amount of the stage 7 from the stationary state is d), the figure data is obtained. Correction is performed to shift the stored irradiation position by d, and the laser is irradiated to the position of 5. Further, when the stage is moved by d until the next irradiation, and when the stage is moved for a total of 2d, the irradiation position stored as the graphic data is corrected by shifting by 2d, and the laser beam is irradiated to the position 6 (FIG. 7).
(5)). After this, when the processing is repeated up to the position of 10, the maximum value of the X coordinate falls within the processing area I (FIG. 7 (7)). In this state, the stage 7 is stopped and the mirrors 41 and 51 are operated to continue machining up to 14 (see FIG. 7).
(8)). Next, the stage 7 is moved in the opposite direction, and processing is performed while similarly correcting (FIGS. 7 (9)-(11)). X
When the minimum coordinate value reaches the processing area I, the stage 7
And the unprocessed part is processed without correcting the graphic data (FIG. 7 (12)).

By doing so, even when a figure larger than the machining range of the galvano scanners 4 and 5 is machined, it can be machined seamlessly, and the accuracy of machining by the galvano scanner can be improved.

In this embodiment, pulse oscillation is taken as an example of the laser oscillation mode, but continuous oscillation may be used.
Further, as a method of detecting the position of the stage 7, for example, the stage moving speed may be detected and the position may be calculated from time integration of the speed, or the like, or the position may be indirectly obtained. The figure data may be corrected in advance on the assumption of the stage moving speed, and the corrected data may be further corrected from the actual stage position.

Next, a third embodiment of the present invention will be described with reference to FIG. In the laser processing as shown in each of the above embodiments, it is important to adjust the origin position for aligning the workpiece and the laser beam irradiation position. Further, when laser processing is repeatedly performed, it is conceivable that the actual irradiation position of the galvano scanner may shift over time even if processing is performed on the same graphic data. In machining with a galvano scanner, a slight rotation angle deviation is D x tan θ.
(D = distance between the mirror and the work material, θ = small deviation in rotation angle, directly under the mirror), and the larger the processing area, that is, the larger D, the greater the influence on the cutting accuracy and the defective product occurs. Easier to do. In this case, it is necessary to correct the graphic data at appropriate time intervals. The present embodiment relates to a method of detecting a laser light irradiation position for this position correction.

In FIG. 8, 9 is a laser light detector, and its light receiving surface 91 is made of a substance which emits a signal in response to the laser light. For example, in the case of a CO ₂ laser (λ = 10.6μ
m) Using p-type Ge, it is possible to confirm the presence or absence of light reception by generating an electromotive force at the time of light reception by utilizing the photon drag effect.
On the light receiving surface 91, a pair of light shielding members 92 provided with a slit 93 having a constant width in the central portion are arranged, and only a part of the light receiving surface 91 is exposed through the slit 93. is there. Here, the light blocking member 92 is made of a material that does not transmit laser light. In addition, the light blocking member 92
Boundary lines 1 and 2 at the ends of are supposed to have their positions (X coordinates) made clear.

Further, as the optical scanning means, only the scanner 4 for performing optical scanning in the X-axis direction by rotating the mirror 41 is shown here for the sake of simplicity. The detector 9 is, for example, in the laser processing apparatus of FIG.
The light shielding member 92 is fixed at an appropriate position on the stage 7 so that the light shielding member 92 is on the same plane as the workpiece 6.

Hereinafter, description will be made with reference to the flowchart of FIG. First, the angle of the mirror 41 is set to a position where the point S on the light shielding member 92 in FIG. Next, the mirror 41 is rotated and set at a position where the point + d from the point S (the middle point 1 in FIG. 10A) is irradiated, the laser oscillator oscillates one pulse, and the point 1 is irradiated (FIG. 9).
Step (1)). At this time, the signal of the detector 9 is confirmed (signal regarding presence / absence of light detection: hereinafter, ON is ON, NO is O
If it is FF), and if it is OFF, the mirror 41 is rotated to a position where the next point (point 2 in the figure) is irradiated, and laser is irradiated (step (2) in FIG. 9). Hereafter, this operation is
The position data (here, the angle of the rotating mirror) of the light moving device when it is turned on is stored repeatedly until it becomes N (step (3) in FIG. 9), and the mirror 41 is set at the position for irradiating the next point. Rotate. Thereafter, this operation is repeated, and the laser irradiation is stopped when the signal is turned off again (step (4) in FIG. 9). If the laser is turned on for the first time, the laser is moved in the minus direction to the position where it is turned off, and the movement is again started in the plus direction (step (5) in FIG. 9).

Next, the central position data is calculated from the stored first ON position data and last ON position data (step (6) in FIG. 9). The calculated center position data is the position data for actually irradiating the center of the slit 93, and from the difference between the position data that should originally irradiate the center of the slit 93 and the position data to be irradiated and the actually irradiated position. The shift can be calculated. The relationship between the position data (rotation angle) and the signal of the detector 9 at this time is shown in FIGS. The slit 93 whose position data (X coordinate here) is already known from the figure is the position data of (X ₁₁ −X ₆ ) / 2.
It can be seen that the data is for irradiating the central position of.

As described above, the present method is applied to the processing methods shown in the first and second embodiments to adjust the origin position,
Alternatively, if the processing is performed while the laser irradiation position is corrected, the processing accuracy can be further improved.

Further, as shown in FIG. 11A, the light blocking member 92
May be provided on only one side, and the actual irradiation position may be known based on the position data of the boundary line between the light shielding member 92 and the light receiving surface 91. In this case, the first position that is turned ON may be set as the boundary position, and the measurement error is slightly large, but memory and calculation are not required, and the position that is desired to be irradiated at a low cost in a short time and the position that is actually irradiated. The deviation can be calculated. Further, as shown in FIG. 11B, the last point of OFF and O
The center position of the first point of N may be the boundary line position of the edge of the light shielding member 92.

Instead of providing the detector 9 below the slit 93 as in FIG. 12, the detector 9 may be provided obliquely above and the reflected laser light may be condensed by the condenser 94. At this time, the material of the light blocking member 92 is a material that reflects laser light.
The same effect can be obtained by this method, and it is effective, for example, when the detector 9 cannot be provided below the slit 93 due to the device configuration. Alternatively, the slit may not be provided, and the light may directly move on the detector (FIG. 13). In this case, the boundary position of the outer peripheral case 95 of the detector 9 must be clear.

In this method, it is not necessary to keep the irradiation position interval constant, and as shown in FIG. 14, the irradiation position interval is set in two stages, and after roughly determining the position of the boundary line (FIG. 14).
(A)) Further, it is possible to improve the detection accuracy by reducing the irradiation position interval near the boundary line (FIG. 14 (b)).

In this embodiment, the case where the rotary mirror is used as the optical scanning means and the photodetector is fixed has been described. However, the fixed mirror 42 is used and the photodetector 9 and the slit 93 are formed by the XY table 72. It can also be applied to a processing method of moving (FIG. 15). In this case as well, the same effect is obtained, which is effective in improving the processing accuracy.

Next, a fourth embodiment of the present invention will be described with reference to FIG. The present embodiment relates to a method in which a mark for position detection is previously placed on the work 6 by printing or the like, and the printing error and the irradiation position are corrected based on the mark.
In the figure, a work 6 is simultaneously formed with a figure A to be cut by printing and a mark B for detecting a laser irradiation position. A detection device 82 for detecting the deviation between the laser irradiation mark and the figure B is arranged near the workpiece 6 and the detection result is input to the control device 8. The control device 8 stores the graphic data for moving the laser light, the function of converting the graphic data into the rotation angles of the galvano scanners 4 and 5, and the galvano scanner 4 based on the deviation detected by the detection device 82. 5 also has the function of adjusting the rotation amount.

FIG. 17A is an enlarged view of the periphery of the figure B. In the drawing, the position of the figure shown by the dotted line is the position where printing should be originally performed, and the solid line figure B is the actually printed figure. Further, the position of the circle indicated by the dotted line is the position where the position is designated in advance for the figure of the dotted line, and is the position where the laser should be originally irradiated. The position of the solid circle is the position where the laser is actually irradiated. That is,
As shown in FIG. 17B, the printing is displaced by the amount represented by the vector a, and the irradiation position is displaced by the amount represented by the vector b. Therefore, when the print deviation and the irradiation position deviation are individually corrected, the correction includes detection errors of both the printing and irradiation positions.

In the present invention, when the displacement of the irradiation position is quantified, the quantification is made in association with the printing portion to reduce the measurement error. The method will be described below. First, in order to measure the deviation between the actual irradiation position and the printing, one pulse of laser irradiation is performed around the figure B, and the deviation is measured by the detection device 82 to calculate the correction amount. The calculation method will be specifically described. As shown in FIG. 17C, the positional relationship between actual printing and actual irradiation position is recognized as a vector (vector c). The vector difference h ′ of the vector d indicating the relationship between this vector and the position where the original printing should be performed and the position where the laser should be originally irradiated is the sum of the deviation between the actual printing position and the actual irradiation position (that is, FIG. 17
(B) the difference between the vector a and the vector b). Highly accurate processing can be realized by correcting the stored data based on this deviation amount, calculating the corrected data as the rotation angle of the mirror, and cutting the print figure a.

In this embodiment, the mark formed by printing is used as a reference, but the present invention is not limited to printing. For example, it is also applicable to a case where a hole is drilled in the previous process and laser processing is performed on the hole with high precision. can do. Further, the present method is not limited to processing using a galvano scanner, and any processing that moves the laser light and the processing material relative to each other, such as moving the processing material with respect to the laser light using an XY table. Can also be applied to.

Although a film of an organic material is used as the material 6 to be processed in each of the above embodiments, a woven fabric containing an organic material may be used. Further, in particular, in laser processing that does not use an assist gas like the processing method using a galvano scanner, in order to prevent the workpiece 6 made of a combustible organic material from burning due to excessive heat input, the process shown in FIG. It is desirable to use the work material 6 having a structure in which the second layer 62 made of a material containing a flame retardant is laminated on the lower surface of the first layer 61 made of a combustible organic material as shown in FIG. Specifically, for example, it is considered that the first layer 61 is made of a combustible organic material such as polyethylene terephthalate, and the second layer 62 is made of a material containing a flame retardant material such as polyhalogenated organic phosphoric acid ester. To be

Single layer work material 6 made of combustible organic material
In the case of processing, even if the laser light is cut so that the workpiece 6 is cut and not burned, there is still a possibility that the material will burn due to excessive heat input due to variations in energy. In such a case, when the workpiece 6 configured as shown in FIG. 18 is irradiated with laser light from the first layer 61 side, the flame retardant material in the second layer 62 is also vaporized and spreads around the processed portion. .
This plays the role of a digestive material, and the combustion of the material 6 to be processed can be prevented. If the second layer 62 is removed after processing, the workpiece 6 can be obtained in any shape. Alternatively,
If the second layer 62 may be left, it is not necessary to remove it.

When a layer containing a flame retardant material is provided, it does not necessarily have a two-layer structure, and at least one layer in the multilayer may be a layer containing a flame retardant material. Alternatively, a flame retardant material can be added to the adhesive layer used to bond the layers. Note that the laser light irradiation may be performed from the second layer 62 side.

[0054]

As described above, according to the present invention, a material to be processed can be processed with high quality and high accuracy, and has a high industrial utility value.

[Brief description of drawings]

FIG. 1 is an overall schematic view of a laser processing apparatus used in a first embodiment of the present invention.

FIG. 2 (a) is a cut shape obtained by the method of the first embodiment, and FIG. 2 (b) is a cut shape obtained by a conventional method.

FIG. 3 (a) is a diagram showing a change in the moving speed of laser light by a conventional method, and FIG. 3 (b) is a diagram showing a change in the moving speed of laser light by the method of the present invention.

FIG. 4 is a diagram for explaining a laser processing method according to a conventional method.

FIG. 5 is an overall schematic view of a laser processing apparatus used in a second embodiment of the present invention.

FIG. 6 is a flowchart showing a processing method of the second embodiment.

FIG. 7 is a diagram showing a processing step of the second embodiment.

FIG. 8 is an overall schematic view of a laser irradiation position detection device used in a third embodiment of the present invention.

FIG. 9 is a flowchart showing a laser irradiation position detecting method of the third embodiment.

10 (a) is a partially enlarged view of FIG. 9, FIG.
(B), (c) is a figure which shows the laser irradiation position and a mirror rotation angle, respectively, and the relationship between a laser irradiation position and a photodetector signal.

FIG. 11 is a diagram showing another example of the laser irradiation position detecting method.

FIG. 12 is a partially enlarged view of a laser irradiation position detection device showing another example of the laser irradiation position detection method.

FIG. 13 is a diagram showing another example of the laser irradiation position detecting method.

FIG. 14 is a diagram for explaining another example of the laser irradiation position detecting method.

FIG. 15 is an overall schematic view of a laser irradiation position detection device showing another example of the laser irradiation position detection method.

FIG. 16 is an overall schematic view of a laser processing apparatus used in a fourth embodiment of the present invention.

FIG. 17 is a diagram for explaining the laser processing method according to the fourth embodiment.

FIG. 18 is a diagram showing a structure of a work material used in the present invention.

[Explanation of symbols]

1 Laser oscillator 2 Focus position adjustment device 3 condenser lens 4, 5 galvano scanner 41, 51 Mirror 6 Work material 7 Processing stage 8 control device 81 Position detection sensor (position detection means) 9 Photodetector 92 Light-shielding member (reference material)

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasutaka Kamiya 1-1, Showa-cho, Kariya city, Aichi Japan Denso Co., Ltd. (72) Inventor Shigeya Kato 1-1-cho, Showa-cho, Kariya city, Aichi In-company (56) Reference JP-A-6-170570 (JP, A) JP-A-4-197591 (JP, A) JP-A-49-109694 (JP, A) JP-A-5-131607 (JP, A) ) JP-A-61-206584 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B23K 26/40

Claims (8)

(57) [Claims] 1. A method of laser processing a work material containing an organic material, comprising a layer made of an organic material and at least the same.
Also a material having a layer containing a flame retardant material formed on one surface
It is used as the above-mentioned work material and is added
Processing is performed without blowing auxiliary gas, and a plurality of mirrors are rotatably provided between the lens for focusing the laser light and the work material, and these mirrors are independently driven to rotate in different directions. By doing so, the laser beam is moved relative to the workpiece to perform the cutting process. 2. A means for moving a processing stage on which the material to be processed is mounted and a means for detecting a position of the processing stage, the processing stage being moved at a proper time, and the position detecting means detecting the position. The position of the processing stage,
The laser processing method according to claim 1, wherein the laser irradiation position is corrected based on the coordinate data of the processing position stored in advance. 3. The laser processing method according to claim 1, wherein the material to be processed is a film containing an organic material or a multilayer film formed by laminating a plurality of film-like materials, or a woven fabric containing an organic material. 4. A laser processing method for performing processing by moving laser light relative to a material to be processed, wherein a detector for detecting the presence or absence of reception of laser light is provided in the vicinity of the material to be processed.
A reference material whose installation position is known is arranged in contact with the detector, the laser light is relatively moved so as to cross the boundary between the detector and the reference material, and electricity indicating whether or not the laser irradiation emitted by the detector is present. A laser processing method comprising detecting a laser irradiation position from a signal and position data of the reference material, and correcting the laser irradiation position based on the detected laser irradiation position. 5. A plurality of the reference materials are provided, and the reference materials are arranged so as to face each other with the detector interposed therebetween. The laser light is relatively moved so as to cross the boundaries between the plurality of the reference materials and the detector, respectively. An intermediate position between the position where the electric signal emitted from the detector first indicates laser irradiation and the position where the electric signal finally indicates laser irradiation is set as an intermediate position of the plurality of reference materials, and this position data is stored in advance. The laser processing method according to claim 4, wherein the laser irradiation position is detected from the coordinate data of the intermediate position, and the laser irradiation position is corrected based on this. 6. The laser processing method according to claim 4, wherein a carbon dioxide gas laser is used as the laser light irradiation means. 7. A laser processing method in which a figure to be cut is printed on a work material and then the printed figure is cut by laser light, or after punching the work material, the hole is used as a reference for cutting. In a laser processing method that cuts a desired position with laser light, a layer made of an organic material and
Material having a layer containing a flame retardant material formed on one surface
Is used as the material to be processed, and
While performing processing without blowing auxiliary gas, in the same step as the formation of the printed figure or the punching process, a reference mark for laser irradiation position detection is formed on the workpiece, and the reference mark of the reference mark is formed. A laser processing method, comprising: irradiating a laser beam in the vicinity, and correcting the laser irradiation position based on the amount of deviation between the position of the irradiation mark and the reference mark position. 8. A method of laser processing a work material containing an organic material, wherein a material having a layer made of an organic material and a layer containing a flame retardant material formed on at least one surface thereof is used as the work material. A laser processing method, wherein the laser processing method is used, and processing is performed without blowing an auxiliary gas to the processed portion of the material to be processed.