JPS62234688A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPS62234688A
JPS62234688A JP61076914A JP7691486A JPS62234688A JP S62234688 A JPS62234688 A JP S62234688A JP 61076914 A JP61076914 A JP 61076914A JP 7691486 A JP7691486 A JP 7691486A JP S62234688 A JPS62234688 A JP S62234688A
Authority
JP
Japan
Prior art keywords
workpiece
electromagnet
work
laser processing
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61076914A
Other languages
Japanese (ja)
Inventor
Masayoshi Mizukado
水門 正良
Minoru Tashiro
稔 田代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamazaki Mazak Corp
Original Assignee
Yamazaki Mazak Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamazaki Mazak Corp filed Critical Yamazaki Mazak Corp
Priority to JP61076914A priority Critical patent/JPS62234688A/en
Publication of JPS62234688A publication Critical patent/JPS62234688A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the working rate of a laser beam machine by providing a handling device for a work subjected to processing in combination to a laser beam processing head. CONSTITUTION:The handling device 6 is provided to the laser beam processing head 7 and the device 6 is constituted of an arm 10 which is freely turnable within a horizontal plane, an electromagnet 11b for attraction of the work, a piston rod 11a, a cylinder 11, etc. A work transport conveyor 12 is disposed near a machine body 2. A laser light torch 9 is retreated upward and the electromagnet 11b of the rod 11a contacts and attracts the work when the work on a table 3 is blanked by the torch 9. The electromagnet 11b ascends further to move the processing head 7 in a direction D. The arm 10 swivels to carry the work together with the electromagnet 11b onto the conveyor 12 so as to drop the work onto a transport member 12a. The working rate of the machine 1 is improved by the improved working efficiency.

Description

【発明の詳細な説明】 (a)、産業上の利用分野 本発明は、ワーク搬出手段が設けられたレーザ加工機に
関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a laser processing machine equipped with a workpiece delivery means.

(b)、従来の技術 従来、レーザ加工機で定尺材等のワークから所定形状の
小物ワークを多数切り抜く加工を行う場合、これ等切り
抜かれた小物ワークのレーザ加工機外への搬出は作業員
の手作業によっていた。
(b), Conventional technology Conventionally, when cutting out a large number of small workpieces of a predetermined shape from a workpiece such as a fixed-length material using a laser processing machine, it is necessary to transport the cutout small workpieces out of the laser processing machine. It was done manually by staff.

即ち、作業員がこれらの小物ワークを一個一個摘んで機
外ノ\搬出していた。
In other words, workers picked up these small workpieces one by one and carried them out of the machine.

(C)3発明が解決しようとする問題点しかし、これで
は、加工された小物ワークの搬出に多くの時間と労力を
必要とし、作業能率が低下してしまうという不都合が生
ずる。
(C) 3 Problems to be Solved by the Invention However, this method requires a lot of time and effort to carry out the processed small workpieces, resulting in a disadvantage that work efficiency is reduced.

本発明は、前述の欠点を解消すべく、加工された小物ワ
ークの搬出を手作業によらないで効率的に行うことの出
来るレーザ加工機を提供することを目的とする。
SUMMARY OF THE INVENTION In order to eliminate the above-mentioned drawbacks, it is an object of the present invention to provide a laser processing machine that can efficiently carry out processed small workpieces without manual work.

(d)1問題点を解決するための手段 即ち1本発明は、レーザ加工ヘッド(7)に、加工済み
ワークのハンドリング装置(6)を設けて構成される。
(d) Means for Solving Problem 1, ie, 1 of the present invention, is configured by providing a laser processing head (7) with a processing device (6) for handling a processed workpiece.

なお、括弧内の番号等は、図面における対応する要素を
示す、便宜的なものであり、従って、本記述は図面上の
記載に限定拘束さ九るものではない。以下のr (e)
、作用」の欄についても同様である。
Note that the numbers in parentheses are for convenience and indicate corresponding elements in the drawings, and therefore, this description is not limited to the descriptions in the drawings. r (e) below
The same applies to the column ``, action''.

(e)0作用 上記した構成により、本発明は、レーザ加工して任意個
数(1個以上)の小物ワーク(13a)を切り抜いた後
、該小物ワーク(13a)を、ハンドリング装置(6)
により、レーザ加工機(1)の機体(2)外に搬出する
ように作用する。
(e) 0 effect With the above-described configuration, the present invention cuts out an arbitrary number (one or more) of small workpieces (13a) by laser processing, and then transfers the small workpieces (13a) to the handling device (6).
This acts to transport the laser beam out of the body (2) of the laser processing machine (1).

(f)、実施例 以下、図面に基き、本発明の詳細な説明する。(f), Example Hereinafter, the present invention will be described in detail based on the drawings.

第1図は本発明によるレーザ加工機の一実施例を示す斜
視図、 第2図はトーチにより加工すべきワークをレーザ加工し
て小物ワークを切り抜く工程を示す図、第3図乃至第9
図は切り抜いた小物ワークをレーザ加工機の機外へ搬出
する工程を示す図である。
FIG. 1 is a perspective view showing an embodiment of a laser processing machine according to the present invention, FIG. 2 is a diagram showing a process of laser processing a workpiece to be processed using a torch and cutting out a small workpiece, and FIGS. 3 to 9
The figure shows the process of transporting the cut out small workpiece out of the laser processing machine.

レーザ加工機1は、第1図に示すように、機−3= 体2を有しており、機体2上には上部にワーク搭載面3
aの形成されたテーブル3が矢印A、B方向に移動自在
に設けられている。機体2にはコラム5がテーブル3上
を跨ぐ形で設けられており、コラム5には、レーザ加工
I\ツド7が矢印A、 B方向とは直角の矢印C,D方
向に移動駆動自在に支持されている。
As shown in Fig. 1, the laser processing machine 1 has a body 2 (machine 3), and a workpiece mounting surface 3 is mounted on the top of the body 2.
A table 3 formed with a is provided so as to be movable in the directions of arrows A and B. A column 5 is installed in the machine body 2 so as to straddle the top of the table 3, and the column 5 has a laser processing I/D 7 that can be freely moved and driven in the directions of arrows C and D, which are perpendicular to the directions of arrows A and B. Supported.

ところで、レーザ加工ヘッド7には、ハンドリング装置
6が設けられており、ハンドリング装置6は関節7aを
中心にして水平面内で矢印G、H方向に回動自在に支持
されたアーム1oを有している。アーム10の先端には
シリンダ11が設けられており、シリンダ11の図中下
方には、吸着部材としての電磁石11bがピストンロッ
ド11aを介して矢印E−F方向に突出後退自在に装着
されている。また、レーザ加工ヘッド7の図中下端部に
はレーザ光線が射出されるトーチ9が矢印E、F方向に
移動自在に装着されている。なお、電磁石1.1 bは
、シリンダ11が駆動されずピストンロッドllaが図
中矢印E方向に後退した状態では、その図中下面11c
が前記トーチ9の先端9aよりも所定距離上方に位置す
るように設けられている。
By the way, the laser processing head 7 is provided with a handling device 6, and the handling device 6 has an arm 1o supported rotatably in the directions of arrows G and H in a horizontal plane around a joint 7a. There is. A cylinder 11 is provided at the tip of the arm 10, and an electromagnet 11b as an adsorption member is attached to the lower part of the cylinder 11 in the figure so that it can protrude and retreat in the direction of arrow E-F via a piston rod 11a. . Further, a torch 9 from which a laser beam is emitted is attached to the lower end of the laser processing head 7 in the figure so as to be movable in the directions of arrows E and F. Note that when the cylinder 11 is not driven and the piston rod lla is retracted in the direction of arrow E in the figure, the electromagnet 1.1b has a lower surface 11c in the figure.
is provided so as to be located a predetermined distance above the tip 9a of the torch 9.

一方、機体2の第1図右方にはワーク搬送コンベア12
が設置されており、ワーク搬送コンベア12には、無端
状に巻き掛は設置されたベルト等の搬送部材12aが矢
印工方向、即ち機体2から遠ざかる方向に移動駆動自在
に支持されている。
On the other hand, on the right side of the machine 2 in Figure 1 is a workpiece conveyor 12.
A conveyor member 12a, such as a belt, is supported on the workpiece conveyor 12 so as to be movable in the direction of the arrow, that is, in the direction away from the machine body 2.

レーザ加工機1は、以上のような構成を有するので、第
2図に示すように、磁石に吸着する性質を有する磁性体
からなるワーク13から、所定形状の小物ワーク13a
を切り抜く場合には、まず、加工すべきワーク13をテ
ーブル3のワーク搭載面3a上に搭載し、その状態で該
テーブル3を矢印A= B方向に、レーザ加工ヘッド7
を矢印C,D方向に、更に1−−チ9を矢印E、F方向
に適宜移動駆動する。こうして、トーチ9をワーク13
上の所定の加工開始位置に位置決めしたところで、レー
ザ加工ヘッド7に、図示しないレーザ発振器からレーザ
光線を供給し、該光線をトーチ9からテーブル3上のワ
ーク13に向けて射出し、同時に供給されるアシス1−
ガスと共に、小物ワーク13aの切り抜き加工を行う。
Since the laser processing machine 1 has the above-described configuration, as shown in FIG.
When cutting out the workpiece 13, the workpiece 13 to be machined is first mounted on the workpiece mounting surface 3a of the table 3, and in this state, the table 3 is moved in the direction of arrow A=B by the laser processing head 7.
is suitably moved in the directions of arrows C and D, and further, 1--chi 9 is suitably moved in the directions of arrows E and F. In this way, the torch 9 is connected to the workpiece 13.
When the laser processing head 7 is positioned at the predetermined processing start position above, a laser beam is supplied from a laser oscillator (not shown) to the laser processing head 7, and the beam is emitted from the torch 9 toward the workpiece 13 on the table 3. Assis 1-
The small workpiece 13a is cut out together with the gas.

なお、レーザ加工中は、アーム10及びシリンダ11は
駆動されず、ピストンロッドllaの先端に装着された
電磁石11bは突出も励磁もしない。また、電磁石11
bの第1図下面11cは、トーチ9の先端より所定距離
上方に位置しているので、トーチ9によるレーザ加工中
には、電磁石11bはワーク13から離れた待避位置に
ある。従って、レーザ加工中に電磁石11bとワーク1
3が干渉することは無く、トーチ9によるレーザ加工は
円滑に行われる。
Note that during laser processing, the arm 10 and cylinder 11 are not driven, and the electromagnet 11b attached to the tip of the piston rod lla is neither protruded nor excited. In addition, the electromagnet 11
Since the lower surface 11c in FIG. 1b of FIG. Therefore, during laser processing, the electromagnet 11b and the workpiece 1
3 does not interfere with each other, and laser processing by the torch 9 is performed smoothly.

こうして、1個以上の数の小物ワーク13を切り抜いた
後、該切り抜いた小物ワーク13aを、レー、ザ加工機
1の機体2外へ搬出するには、第3図に示すように、ワ
ーク13及び切り抜き加工された小物ワーク13aがワ
ーク搭載面3a上に搭載されたままの状態で、トーチ9
を図中矢印E方向に、トーチ9の先端がワーク13の図
中表面より所定距離上方に位置するように移動させる。
After cutting out one or more small workpieces 13 in this way, in order to carry out the cutout small workpieces 13a out of the machine body 2 of the laser processing machine 1, as shown in FIG. And while the cut-out small workpiece 13a remains mounted on the workpiece mounting surface 3a, the torch 9
is moved in the direction of arrow E in the figure so that the tip of the torch 9 is positioned a predetermined distance above the surface of the workpiece 13 in the figure.

ワーク13の表面よりトーチ9の先端が所定距離上方に
位置したところで、再びテーブル3を矢印A、B方向に
、レーザ加工ヘッド7を矢印C,D方向に適宜移動駆動
して、シリンダ11のピストンロッドllaに装着され
た電磁石11bが、切り抜き加工された小物ワーク13
aの図中表面の略中央部上に位置するように位置決めす
る(第3図参照)。
When the tip of the torch 9 is located a predetermined distance above the surface of the workpiece 13, the table 3 is moved again in the directions of arrows A and B, and the laser processing head 7 is moved in the directions of arrows C and D as appropriate, and the piston of the cylinder 11 is moved. The electromagnet 11b attached to the rod lla is a small workpiece 13 cut out.
It is positioned so that it is located approximately at the center of the surface in the figure a (see FIG. 3).

該小物ワーク13aの図中表面の略中央部上に電磁石1
1bが位置したところで、第4図に示すように、シリン
ダ11を空圧等によって駆動させてピストンロッドll
aを矢印F方向に突出させ、該ピストンロッドllaに
装着された電磁石11bの図中下面を、小物ワーク13
aの表面に当接させる。該小物ワーク13aに電磁石1
1bが当接したところで、電磁石11bを励磁させ、該
小物ワーク13aを磁力によって電磁石11bの下面1
1Cに吸着させる。その状態で、第5図に示すように、
再びシリンダ11を空圧等によって駆動させて電磁石1
1bをピストンロッド11aと共に図中矢印E方向に上
昇後退させる。すると、電磁石11bに吸着された状態
のiJs物ワーク13aは、電磁石11bのE方向への
移動と共にE方向へ移動し、ワーク13から離脱する。
An electromagnet 1 is placed approximately at the center of the surface of the small workpiece 13a in the figure.
1b is located, as shown in FIG. 4, the cylinder 11 is driven by air pressure or the like to move the piston rod
a protrudes in the direction of arrow F, and the lower surface of the electromagnet 11b attached to the piston rod lla is attached to the small workpiece 13.
Bring it into contact with the surface of a. Electromagnet 1 is attached to the small workpiece 13a.
1b is brought into contact with the electromagnet 11b, the electromagnet 11b is excited, and the small workpiece 13a is brought into contact with the lower surface 1 of the electromagnet 11b by magnetic force.
Adsorb to 1C. In that state, as shown in Figure 5,
The cylinder 11 is driven again by air pressure, etc., and the electromagnet 1
1b is raised and retreated together with the piston rod 11a in the direction of arrow E in the figure. Then, the iJs object work 13a that is attracted to the electromagnet 11b moves in the E direction with the movement of the electromagnet 11b in the E direction, and separates from the work 13.

小物ワーク13aがワーク13から抜取られたところで
、更にロッドllaをE方向に移動させて小物ワーク1
3aを第1図におけるワーク搬送コンベア12の搬送部
材12a表面よりも高い位置にまで上昇させる。なお、
この際、小物ワーク13aの表面の略中央部が電磁石1
1bの下面に吸着されているので、該小物ワーク13a
は重量バランスを崩して該下面11cから離れて落下す
ることは無い。
When the small workpiece 13a is removed from the workpiece 13, the rod lla is further moved in the E direction to remove the small workpiece 1.
3a is raised to a position higher than the surface of the conveying member 12a of the work conveyor 12 in FIG. In addition,
At this time, approximately the center of the surface of the small workpiece 13a is the electromagnet 1.
Since the small workpiece 13a is attracted to the lower surface of 1b,
will not lose its weight balance and fall away from the lower surface 11c.

ワーク13及びワーク搬送コンベア12等の何れよりも
高い位置に小物ワーク13aが上昇したところで、第6
図に示すように、レーザ加工ヘッド7を矢印り方向に所
定距離移動駆動させる。
When the small workpiece 13a has risen to a position higher than either the workpiece 13 or the workpiece conveyor 12, etc., the sixth
As shown in the figure, the laser processing head 7 is driven to move a predetermined distance in the direction of the arrow.

なお、この際1〜−チ9の先端9a及び該小物ワ−り1
3aは、ワーク13の表面よりそれぞれ所定距離上方に
位置しているので、これ等とワーク13及びレーザ加工
機1の他の部分が干渉することは無く、レーザ加工ヘッ
ド7の矢印り方向への移動は円滑に行われる。
In addition, at this time, the tips 9a of 1 to 9 and the small workpiece 1
3a are each located a predetermined distance above the surface of the workpiece 13, so that they do not interfere with the workpiece 13 or other parts of the laser processing machine 1, and the laser processing head 7 moves in the direction of the arrow. The movement is smooth.

レーザ加工ヘッド7が矢印り方向に所定距離移動したと
ころで、第7図に示すように、適宜なアクチェータを用
いてアーム10を、関節7aを中心として矢印■(方向
に所定角度旋回させて、シリンダ11の先端の電磁石1
1bに吸着された小物ワーク13aが、機体2の第1図
右方に設置されているワーク搬送コンベア12のワーク
搬送部材12a上の所定位置に来るように位置決めする
When the laser processing head 7 has moved a predetermined distance in the direction indicated by the arrow, as shown in FIG. Electromagnet 1 at the tip of 11
The small workpiece 13a attracted to the machine body 2 is positioned at a predetermined position on the workpiece conveying member 12a of the workpiece conveyor 12 installed on the right side of the machine body 2 in FIG.

なお、この際、該小物ワーク13aはワーク13及びワ
ーク搬送コンベア12等の何れよりも高い位置にあるの
で、該小物ワーク13aとワーク13、レーザ加工機1
の他の部分及びワーク搬送コンヘア]2等が干渉するこ
とは無く、前記アーム10の矢印H方向への旋回は円滑
に行われる。
At this time, since the small workpiece 13a is located at a higher position than both the workpiece 13 and the workpiece conveyor 12, the small workpiece 13a, the workpiece 13, and the laser processing machine 1
There is no interference with other parts of the workpiece conveyor, the workpiece conveyor conveyor] 2, etc., and the arm 10 can be smoothly rotated in the direction of the arrow H.

ワーク搬送部材12a上の所定位置に該小物=8− ワーク13aが位置したところで、第8図に示すように
、シリンダ11を駆動させてピストンロッドllaと共
に電磁石11bを矢印F方向に突出させ、該電磁石11
bに吸着された小物ワーク13aをワーク搬送部材12
aの表面に近接させる。
When the small object=8-work 13a is located at a predetermined position on the workpiece conveying member 12a, the cylinder 11 is driven to project the electromagnet 11b together with the piston rod lla in the direction of arrow F, as shown in FIG. Electromagnet 11
The small workpiece 13a attracted to b is transferred to the workpiece conveying member 12.
close to the surface of a.

ワーク搬送部材12aの表面に該小物ワーク13aが近
接したところで、電磁石11bを消磁して磁力を消滅さ
せると、今迄電磁石11bの下面11cに吸着されてい
た小物ワーク13aは、吸着力を失い自重に因って該下
面lieを離れ、第9図に示すように、ワーク搬送部材
12a上の所定位置に落下する。ワーク搬送部材12a
上の所定位置に落下した小物ワーク13aは、矢印工方
向に移動駆動されるワーク搬送部材12aにより、次の
加工工程が行われる機械等へ搬出されて行く。
When the small workpiece 13a comes close to the surface of the workpiece conveying member 12a, when the electromagnet 11b is demagnetized to eliminate the magnetic force, the small workpiece 13a, which had been attracted to the lower surface 11c of the electromagnet 11b, loses its adsorption force and loses its own weight. As a result, the workpiece leaves the lower surface lie and falls to a predetermined position on the workpiece conveying member 12a, as shown in FIG. Workpiece conveyance member 12a
The small workpiece 13a that has fallen to a predetermined position above is carried out to a machine or the like where the next processing step will be performed by the workpiece conveyance member 12a, which is driven to move in the direction of the arrow.

小物ワーク1.3 aの搬出工程が終了すると、上記し
た搬出動作を逆に遡る形でアーム10、シリンダ11、
レーザ加工ヘッド7等は、該搬出工程前の状態に復帰す
る。なお、第3図乃至第9図に示す小物ワーク13aの
搬出工程においては、トーチ9の先端からはレーザ光線
は射出されずレーザ加工は行われない。
When the carrying out process of the small workpiece 1.3a is completed, the arm 10, cylinder 11,
The laser processing head 7 and the like return to the state before the carrying out process. In addition, in the process of carrying out the small workpiece 13a shown in FIGS. 3 to 9, no laser beam is emitted from the tip of the torch 9, and no laser processing is performed.

また、上記した一連の動作をNCプログラムで制御する
ことも勿論可能である。更に、本実施例においては、シ
リンダ11の先端に装着する吸着部材として電磁石工1
bを用いた場合について述べたが、吸着部材は電磁石1
1bに限らず、空圧による真空吸引等を利用したもので
もよいことは勿論である。空圧による真空吸引等を利用
した吸着部材を装着した場合には、ワーク13として磁
石に吸着される性質を有さない非磁性材料を用いること
が出来、便利である。なお、ハンドリング装置としては
、吸着機能に限定されることはなく、適宜なワーク把持
手段を設け、小物ワークの周囲に適当なスペースがあれ
ば、該小物ワークの上下又は左右から該ワークを把持す
る形で搬出工程を行なうように構成することもできる。
Furthermore, it is of course possible to control the series of operations described above using an NC program. Furthermore, in this embodiment, an electromagnet 1 is used as an adsorption member attached to the tip of the cylinder 11.
As mentioned above, the adsorption member is the electromagnet 1
It goes without saying that the method is not limited to 1b, but may also be one that utilizes vacuum suction using pneumatic pressure. When an attraction member that utilizes vacuum suction or the like using air pressure is attached, it is convenient because the workpiece 13 can be made of a non-magnetic material that does not have the property of being attracted to a magnet. Note that the handling device is not limited to the suction function, but is equipped with an appropriate workpiece gripping means, and if there is an appropriate space around the small workpiece, it can grip the small workpiece from above and below or from the left and right sides. It is also possible to carry out the unloading process in the form of

(g)0発明の効果 以上、説明したように本発明によれば、レーザ加エノ\
ツド7に、加工済みワークのハンドリング装置6を設け
て構成したので、トーチ9により1個以上の任意間数の
小物ワーク13aを切り抜いた後、該小物ワーク13a
を、ハンドリング装置によりレーザ加工機1の機外2へ
搬出することが出来るので、該小物ワーク13aの搬出
を作業員が手作業で行う場合に比して短時間で行なうこ
とが出来、作業能率が向上するばかりか、レーザ加工機
1の全体の稼働率を向上させることが出来る。
(g) 0 Effects of the Invention As explained above, according to the present invention, laser processing
Since the handle 7 is provided with a handling device 6 for processed workpieces, after one or more small workpieces 13a are cut out using the torch 9, the small workpieces 13a are
can be carried out to the outside 2 of the laser processing machine 1 by the handling device, so the small workpiece 13a can be carried out in a shorter time than when the worker manually carries it out, improving work efficiency. Not only is this improved, but also the overall operating rate of the laser processing machine 1 can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明によるレーザ加工機の一実施例を示す斜
視図、 第2図はトーチにより加工すべきワーイ7をレーザ加工
して小物ワークを切り抜く工程を示す図、第3図乃至第
9図は切り抜いた小物ワークをレーザ加工機の機外へ搬
出する工程を示す図である。 一11= 1・・・・レーザ加工機 6・・・・・・ハンドリング装置 7・・・・・・レーザ加工ヘッド 9・・・・・トーチ 出願人  ヤマザキマザック株式会社 代理人   弁理士   相1)伸二 (ほか1名) 第5図 C\D 1.−曹;其]○
FIG. 1 is a perspective view showing an embodiment of a laser processing machine according to the present invention, FIG. 2 is a diagram showing a process of cutting out a small workpiece by laser processing a wire 7 to be processed using a torch, and FIGS. The figure shows the process of transporting the cut out small workpiece out of the laser processing machine. 111 = 1...Laser processing machine 6...Handling device 7...Laser processing head 9...Torch Applicant Yamazaki Mazak Co., Ltd. Agent Patent attorney Phase 1) Shinji (and 1 other person) Figure 5 C\D 1. - Cao; ○

Claims (1)

【特許請求の範囲】[Claims] レーザ加工ヘッドを有し、該レーザ加工ヘッドにトーチ
を装着したレーザ加工機において、前記レーザ加工ヘッ
ドに、加工済みワークのハンドリング装置を設けて構成
したレーザ加工機。
A laser processing machine comprising a laser processing head and a torch attached to the laser processing head, wherein the laser processing head is provided with a handling device for a processed workpiece.
JP61076914A 1986-04-03 1986-04-03 Laser beam machine Pending JPS62234688A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61076914A JPS62234688A (en) 1986-04-03 1986-04-03 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61076914A JPS62234688A (en) 1986-04-03 1986-04-03 Laser beam machine

Publications (1)

Publication Number Publication Date
JPS62234688A true JPS62234688A (en) 1987-10-14

Family

ID=13618950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61076914A Pending JPS62234688A (en) 1986-04-03 1986-04-03 Laser beam machine

Country Status (1)

Country Link
JP (1) JPS62234688A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034392U (en) * 1989-06-05 1991-01-17
JPH0533981U (en) * 1991-10-02 1993-05-07 株式会社アマダ Product unloading device for laser processing machine
EP1473107A1 (en) * 2003-05-02 2004-11-03 Kba-Giori S.A. Machine and process for cutting openings in a substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843884B2 (en) * 1977-03-23 1983-09-29 エプソン株式会社 electromagnet

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843884B2 (en) * 1977-03-23 1983-09-29 エプソン株式会社 electromagnet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034392U (en) * 1989-06-05 1991-01-17
JPH0533981U (en) * 1991-10-02 1993-05-07 株式会社アマダ Product unloading device for laser processing machine
EP1473107A1 (en) * 2003-05-02 2004-11-03 Kba-Giori S.A. Machine and process for cutting openings in a substrate
WO2004096482A1 (en) * 2003-05-02 2004-11-11 Kba-Giori S.A. Machine and process for cutting openings in a substrate

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