JPH04113700A - Parts feeder - Google Patents
Parts feederInfo
- Publication number
- JPH04113700A JPH04113700A JP2234299A JP23429990A JPH04113700A JP H04113700 A JPH04113700 A JP H04113700A JP 2234299 A JP2234299 A JP 2234299A JP 23429990 A JP23429990 A JP 23429990A JP H04113700 A JPH04113700 A JP H04113700A
- Authority
- JP
- Japan
- Prior art keywords
- component
- electronic component
- carrier
- positioning
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 description 15
- 210000000078 claw Anatomy 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 3
- 208000019300 CLIPPERS Diseases 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 2
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
(イ)産業上の利用分野
本発明は、搬送装置により間欠搬送きれて来たキャリア
の下面に貫通穴を有する凹部に搭載された電子部品を位
置決めした後下流ステーションへ供給する部品供給装置
に関する。DETAILED DESCRIPTION OF THE INVENTION (A) Industrial Application Field The present invention is directed to a downstream station after positioning an electronic component mounted in a recess having a through hole on the bottom surface of a carrier that has been intermittently transported by a transport device. The present invention relates to a parts supply device.
(ロ)従来の技術
従来技術として、特開昭58−105547号公報が挙
げられる。これは、ペレット供給部から移動アームのペ
レット吸着体にてペレットを取り出し、ペレットをペレ
ット吸着体で保持した状態で移動アームによりペレット
位置決め機構位置に移動させ、クリッパにて位置決めす
る。更に、位置決めされたペレットをリードフレームの
配設床上に移動させて、配設床にペレットを配設してい
た。(B) Prior Art As a prior art, Japanese Patent Application Laid-Open No. 105547/1984 can be mentioned. In this process, a pellet is taken out from a pellet supply section by a pellet adsorption member of a moving arm, and while the pellet is held by the pellet adsorption member, the moving arm moves the pellet to a pellet positioning mechanism position, and the clipper positions the pellet. Furthermore, the positioned pellets are moved onto the placement floor of the lead frame, and the pellets are placed on the placement floor.
そのため、移動アームはペレット供給部からリードフレ
ームへ移動する間にペレット位置決め機構位置で一旦停
止しなければならず、時間ロスが発生する。また、ペレ
ット吸着体でペレット上面を吸着した状態でペレットを
クリッパで位置決めするため、表面に傷ができてしまっ
ていた。Therefore, the moving arm must temporarily stop at the pellet positioning mechanism position while moving from the pellet supply section to the lead frame, resulting in a time loss. In addition, since the pellets are positioned using clippers while the top surface of the pellets is being adsorbed by the pellet adsorbent, the surface is scratched.
(ハ)発明が解決しようとする課題
従って、本発明はサイクルタイムの短縮及び表面の傷の
発生を防止せんとするものである。(c) Problems to be Solved by the Invention Accordingly, the present invention aims to shorten the cycle time and prevent the occurrence of scratches on the surface.
(ニ)課題を解決するための手段
そこで、本発明は搬送装置により間欠搬送されて来たキ
ャリアの下面に貫通穴を有する凹部に搭載された電子部
品を位置決めした後下流ステーションへ供給する部品供
給装置に於いて、前記電子部品を前記貫通穴を介して吸
着しながら突き上げる突き上げ装置と、該突き上げ装置
で突き上げられた状態にある電子部品を挟持して位置決
めする位置決め装置と、該位置決め装置で位置決めされ
た電子部品を吸着して下流ステーションへ供給する吸着
手段とを設けたものである。(d) Means for Solving the Problems Therefore, the present invention aims at positioning electronic components mounted in recesses having through holes on the lower surface of a carrier that is intermittently transported by a transport device, and then supplying the components to a downstream station. The apparatus includes a pushing-up device that pushes up the electronic component while adsorbing it through the through-hole, a positioning device that clamps and positions the electronic component that is pushed up by the pushing-up device, and a positioning device that positions the electronic component by the positioning device. The device is equipped with a suction means for sucking the electronic components and supplying them to a downstream station.
(*)作用
以上の構成から、搬送装置により間欠搬送されて来たキ
ャリア上の電子部品が所定位置に到達したら、突き上げ
装置はキャリアの凹部の貫通穴を介して該電子部品を吸
着しながら突き上げる。そして、突き上げられた状態に
ある電子部品は位置決め装置により位置決めされた後、
吸着手段により吸着詐れて下流ステーションへ供給され
る。(*) Effect From the above configuration, when the electronic component on the carrier that has been intermittently transported by the transport device reaches a predetermined position, the push-up device pushes up the electronic component while adsorbing it through the through hole in the recess of the carrier. . Then, after the electronic component in the pushed up state is positioned by the positioning device,
The adsorbent is incorrectly adsorbed by the adsorbing means and is supplied to the downstream station.
(へ)実施例 以下、本発明の実施例について図面に基づき詳述する。(f) Example Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
(1)は図示しない供給装置から供給された搬送シュー
ト〈2)上のキャリア(3〉を下流側へ搬送する搬送装
置である。該搬送装置(1)は、シリンダ(4)のロッ
ド(5)の下動により軸(6)を中心に回動される回動
しバー(7)の先端に、前記キャリアク3)の側端に設
けられた送り穴(8)に入り込む送り爪(9)を有し、
ロッドレスシリンダ等の直線往復動装置(10)により
該送り穴(8)に送り爪(9)が入り込んだ状態で間欠
的に水平移動される。(1) is a conveyance device that conveys the carrier (3) on the conveyance chute (2) supplied from a supply device (not shown) to the downstream side. At the tip of the rotating bar (7) which is rotated around the shaft (6) by the downward movement of ), there is a feed claw (9) that enters the feed hole (8) provided at the side end of the carrier 3). ),
A linear reciprocating device (10) such as a rodless cylinder moves the feed pawl (9) horizontally intermittently into the feed hole (8).
尚、前記キャリア(3)には、下部に穴(11)を有す
る凹部(12)にアームプレート等の電子部品(13)
が載置されている。The carrier (3) has an electronic component (13) such as an arm plate in a recess (12) having a hole (11) at the bottom.
is placed.
(14〉は所定位置に搬送されて来た電子部品(13)
の下方に配貧され、前記穴(11)を貫通して、電子部
品(13)を吸着しながら突き上げる突き上げ装置で、
図示しない真空源に連結された突き上げノズル(15)
が取り付けられた取付板(16)がシリンダ(17)の
ロッド(18)の上動によりリニアガイド(19)に案
内されて上動されることにより、前記電子部品(13)
を所定位置まで突き上げる。(14> is the electronic component (13) that has been transported to the specified position
A push-up device is disposed below the hole, penetrates the hole (11), and pushes up the electronic component (13) while adsorbing it;
Push-up nozzle (15) connected to a vacuum source (not shown)
The mounting plate (16) to which the electronic component (13) is attached is guided by the linear guide (19) and moved upward by the upward movement of the rod (18) of the cylinder (17).
Push up to the specified position.
(20)は所定位置まで突き上げられた電子部品(13
)を四方から挟持して位置決めする位置決め爪である。(20) is an electronic component (13) pushed up to a predetermined position.
) is a positioning claw that positions by holding it from all sides.
(21)は位置決めされた電子部品(13)を位置決め
解除後に吸着し、図示しない作業ステーションまで搬送
する吸着ノズルである。(21) is a suction nozzle that suctions the positioned electronic component (13) after the positioning is released and conveys it to a work station (not shown).
以下、動作について説明する。The operation will be explained below.
搬送シュート(2)上に供給装置から供給されたキャリ
ア(3)を搬送装置(1)により下流側へ間欠的に搬送
する。即ち、シリンダ(4)のロッド(5)が下動され
て回動レバー(7)が@(6)を中心に回動されて、送
り爪(9〉がキャリア(3)の送り穴(8)に入り込む
。そして、直線往復動装置(10)の駆動により、キャ
リア(3)を下流側へ搬送する。The carrier (3) supplied from the supply device onto the conveyance chute (2) is intermittently conveyed to the downstream side by the conveyance device (1). That is, the rod (5) of the cylinder (4) is moved down, the rotation lever (7) is rotated about @(6), and the feed claw (9>) is moved into the feed hole (8) of the carrier (3). ), and the carrier (3) is conveyed to the downstream side by driving the linear reciprocating device (10).
次に、所定位置まで搬送されて来た電子部品(13)を
突き上げ装!(14)で所定位置まで突き上げる。即ち
、シリンダ(17)のロッド(18)が上動きれて取付
板(16〉を介して突き上げノズル(15)がリニアガ
イド(19)に案内されながら上動されて、キャリア(
3)の凹部(12)の穴(11)を貫通して電子部品(
13)を吸着しながら突き上げる。Next, push up the electronic component (13) that has been transported to the specified position! (14) to push up to the specified position. That is, the rod (18) of the cylinder (17) is moved upward and the thrust nozzle (15) is moved upward through the mounting plate (16) while being guided by the linear guide (19).
The electronic component (
13) Push up while adsorbing.
そして、突き上げノズル(15)で所定位置まで突き上
げられた電子部品(13)を位置決め爪(2o)で位置
決めする。Then, the electronic component (13) pushed up to a predetermined position by the push-up nozzle (15) is positioned by the positioning claw (2o).
この位置決めされた電子部品(13)は、位置決め解除
後に吸着ノズル(21)に吸着され(突き上げノズル(
15)による吸着は解除される。)、該吸着ノズル(2
1)により作業ステーションに待機された図示しない基
板上の所定位置に装着される。This positioned electronic component (13) is sucked by the suction nozzle (21) after the positioning is released (the push-up nozzle (
The adsorption caused by 15) is canceled. ), the suction nozzle (2
1), it is mounted at a predetermined position on a board (not shown) that is waiting at a work station.
(ト)発明の効果
以上、本発明によれば吸着位置、位置決め位置が同一位
置であるため、タクトタイムが速くなる。また、電子部
品表面の傷の発生が防止できる。(G) Effects of the Invention According to the present invention, since the suction position and the positioning position are at the same position, the takt time becomes faster. Furthermore, it is possible to prevent scratches on the surface of electronic components.
図は部品供給装置の斜視図である。
(1)・・・搬送装置、 (2)・・・搬送シュート、
(3)・・・キャリア、 (13)・・・電子部品、
(14)・・・突き上げ装置、 (20〉・・・位置
決め爪、 (21)・・・吸着ノズル。The figure is a perspective view of the parts supply device. (1)... Conveyance device, (2)... Conveyance chute,
(3)...Carrier, (13)...Electronic component,
(14)... Push-up device, (20>... Positioning claw, (21)... Suction nozzle.
Claims (1)
面に貫通穴を有する凹部に搭載された電子部品を位置決
めした後下流ステーションへ供給する部品供給装置に於
いて、前記電子部品を前記貫通穴を介して吸着しながら
突き上げる突き上げ装置と、該突き上げ装置で突き上げ
られた状態にある電子部品を挟持して位置決めする位置
決め装置と、該位置決め装置で位置決めされた電子部品
を吸着して下流ステーションへ供給する吸着手段とを設
けたことを特徴とする部品供給装置。(1) After positioning an electronic component mounted in a recess having a through hole on the lower surface of a carrier that has been intermittently transported by a transport device, a component supply device supplies the electronic component to a downstream station by positioning the electronic component in a recess having a through hole in the bottom surface of the carrier. a push-up device that pushes up the electronic component while sucking it through the push-up device, a positioning device that clamps and positions the electronic component pushed up by the push-up device, and a positioning device that picks up the electronic component positioned by the positioning device and supplies it to a downstream station. What is claimed is: 1. A component supply device characterized by comprising a suction means for
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2234299A JPH04113700A (en) | 1990-09-03 | 1990-09-03 | Parts feeder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2234299A JPH04113700A (en) | 1990-09-03 | 1990-09-03 | Parts feeder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04113700A true JPH04113700A (en) | 1992-04-15 |
Family
ID=16968822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2234299A Pending JPH04113700A (en) | 1990-09-03 | 1990-09-03 | Parts feeder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04113700A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6836959B2 (en) * | 2000-02-25 | 2005-01-04 | Nec Corporation | Size reduction of chip mounting system |
CN107934421A (en) * | 2017-11-24 | 2018-04-20 | 南华大学 | Material accumulating tank transfer device is condensed using the zirconium chloride of hydraulic control |
-
1990
- 1990-09-03 JP JP2234299A patent/JPH04113700A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6836959B2 (en) * | 2000-02-25 | 2005-01-04 | Nec Corporation | Size reduction of chip mounting system |
US7122399B2 (en) | 2000-02-25 | 2006-10-17 | Nec Corporation | Size reduction of chip mounting system |
CN107934421A (en) * | 2017-11-24 | 2018-04-20 | 南华大学 | Material accumulating tank transfer device is condensed using the zirconium chloride of hydraulic control |
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