WO2004092716B1 - Procede et appareil pour inspecter un substrat au moyen d'une pluralite de regimes de longueur d'onde d'inspection - Google Patents
Procede et appareil pour inspecter un substrat au moyen d'une pluralite de regimes de longueur d'onde d'inspectionInfo
- Publication number
- WO2004092716B1 WO2004092716B1 PCT/US2004/010324 US2004010324W WO2004092716B1 WO 2004092716 B1 WO2004092716 B1 WO 2004092716B1 US 2004010324 W US2004010324 W US 2004010324W WO 2004092716 B1 WO2004092716 B1 WO 2004092716B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- tho
- wavelength
- wavelengths
- illuminating
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
- G01N33/53—Immunoassay; Biospecific binding assay; Materials therefor
- G01N33/543—Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals
- G01N33/54366—Apparatus specially adapted for solid-phase testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/410,126 | 2003-04-08 | ||
US10/410,126 US7352456B2 (en) | 2003-04-08 | 2003-04-08 | Method and apparatus for inspecting a substrate using a plurality of inspection wavelength regimes |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004092716A1 WO2004092716A1 (fr) | 2004-10-28 |
WO2004092716B1 true WO2004092716B1 (fr) | 2005-01-20 |
Family
ID=33130740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/010324 WO2004092716A1 (fr) | 2003-04-08 | 2004-04-05 | Procede et appareil pour inspecter un substrat au moyen d'une pluralite de regimes de longueur d'onde d'inspection |
Country Status (2)
Country | Link |
---|---|
US (1) | US7352456B2 (fr) |
WO (1) | WO2004092716A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2256487B1 (fr) * | 2003-09-04 | 2019-11-06 | KLA-Tencor Corporation | Procédés d'inspection d'un spécimen utilisant différents paramètres d'inspection |
US7684032B1 (en) * | 2005-01-06 | 2010-03-23 | Kla-Tencor Corporation | Multi-wavelength system and method for detecting epitaxial layer defects |
US8148900B1 (en) | 2006-01-17 | 2012-04-03 | Kla-Tencor Technologies Corp. | Methods and systems for providing illumination of a specimen for inspection |
US7705331B1 (en) | 2006-06-29 | 2010-04-27 | Kla-Tencor Technologies Corp. | Methods and systems for providing illumination of a specimen for a process performed on the specimen |
US9354177B2 (en) * | 2013-06-26 | 2016-05-31 | Kla-Tencor Corporation | System and method for defect detection and photoluminescence measurement of a sample |
US9638644B2 (en) * | 2013-08-08 | 2017-05-02 | Camtek Ltd. | Multiple mode inspection system and method for evaluating a substrate by a multiple mode inspection system |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4498772A (en) | 1982-11-05 | 1985-02-12 | Rca Corporation | Method to determine the crystalline properties of an interface of two materials by an optical technique |
US4877326A (en) * | 1988-02-19 | 1989-10-31 | Kla Instruments Corporation | Method and apparatus for optical inspection of substrates |
US5293538A (en) | 1990-05-25 | 1994-03-08 | Hitachi, Ltd. | Method and apparatus for the inspection of defects |
US5179422A (en) * | 1991-05-15 | 1993-01-12 | Environmental Research Institute Of Michigan | Contamination detection system |
KR100245805B1 (ko) * | 1995-03-10 | 2000-04-01 | 가나이 쓰도무 | 검사방법 및 장치 또 이것을 사용한 반도체장치의 제조방법 |
US5825498A (en) | 1996-02-05 | 1998-10-20 | Micron Technology, Inc. | Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials |
US6064517A (en) | 1996-07-22 | 2000-05-16 | Kla-Tencor Corporation | High NA system for multiple mode imaging |
US6157444A (en) * | 1997-11-28 | 2000-12-05 | Hitachi, Ltd. | Defect inspection apparatus for silicon wafer |
JP3166841B2 (ja) | 1998-04-10 | 2001-05-14 | 日本電気株式会社 | パーティクル検査装置 |
US6822978B2 (en) | 1999-05-27 | 2004-11-23 | Spectra Physics, Inc. | Remote UV laser system and methods of use |
US6999614B1 (en) | 1999-11-29 | 2006-02-14 | Kla-Tencor Corporation | Power assisted automatic supervised classifier creation tool for semiconductor defects |
US6891610B2 (en) | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining an implant characteristic and a presence of defects on a specimen |
EP2256487B1 (fr) * | 2003-09-04 | 2019-11-06 | KLA-Tencor Corporation | Procédés d'inspection d'un spécimen utilisant différents paramètres d'inspection |
-
2003
- 2003-04-08 US US10/410,126 patent/US7352456B2/en not_active Expired - Lifetime
-
2004
- 2004-04-05 WO PCT/US2004/010324 patent/WO2004092716A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20040201837A1 (en) | 2004-10-14 |
WO2004092716A1 (fr) | 2004-10-28 |
US7352456B2 (en) | 2008-04-01 |
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