WO2004092716B1 - Procede et appareil pour inspecter un substrat au moyen d'une pluralite de regimes de longueur d'onde d'inspection - Google Patents

Procede et appareil pour inspecter un substrat au moyen d'une pluralite de regimes de longueur d'onde d'inspection

Info

Publication number
WO2004092716B1
WO2004092716B1 PCT/US2004/010324 US2004010324W WO2004092716B1 WO 2004092716 B1 WO2004092716 B1 WO 2004092716B1 US 2004010324 W US2004010324 W US 2004010324W WO 2004092716 B1 WO2004092716 B1 WO 2004092716B1
Authority
WO
WIPO (PCT)
Prior art keywords
light
tho
wavelength
wavelengths
illuminating
Prior art date
Application number
PCT/US2004/010324
Other languages
English (en)
Other versions
WO2004092716A1 (fr
Inventor
Steven R Lange
Original Assignee
Kla Tencor Tech Corp
Steven R Lange
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Tech Corp, Steven R Lange filed Critical Kla Tencor Tech Corp
Publication of WO2004092716A1 publication Critical patent/WO2004092716A1/fr
Publication of WO2004092716B1 publication Critical patent/WO2004092716B1/fr

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/50Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
    • G01N33/53Immunoassay; Biospecific binding assay; Materials therefor
    • G01N33/543Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals
    • G01N33/54366Apparatus specially adapted for solid-phase testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers

Abstract

L'invention concerne un procédé et un appareil d'inspection de surface. Cet appareil et ce procédé permettent, en particulier, d'inspecter une surface dans plusieurs régimes optiques, de sorte que les propriétés de détection de défauts sont améliorées. Un procédé consiste à éclairer la surface avec une lumière dans une première gamme d'ondes et une seconde gamme d'ondes. La première gamme d'ondes est sélectionnée, de sorte que la surface est opaque à la lumière de la première gamme d'ondes, de sorte qu'un signal optique résultant, prédominé par des propriétés de diffraction et de diffusion de la surface, est produit. La seconde gamme d'ondes est sélectionnée, de sorte que la surface est au moins partiellement transmissive à la lumière dans la seconde gamme d'ondes, de sorte qu'un autre signal optique résultant, prédominé par des propriétés optiques en couche mince de la surface, est produit. Les signaux optiques résultants sont détectés et traités pour permettre la détection de défauts dans ladite surface. Cette invention concerne également des dispositifs permettant la mise en oeuvre desdits procédés.
PCT/US2004/010324 2003-04-08 2004-04-05 Procede et appareil pour inspecter un substrat au moyen d'une pluralite de regimes de longueur d'onde d'inspection WO2004092716A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/410,126 2003-04-08
US10/410,126 US7352456B2 (en) 2003-04-08 2003-04-08 Method and apparatus for inspecting a substrate using a plurality of inspection wavelength regimes

Publications (2)

Publication Number Publication Date
WO2004092716A1 WO2004092716A1 (fr) 2004-10-28
WO2004092716B1 true WO2004092716B1 (fr) 2005-01-20

Family

ID=33130740

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/010324 WO2004092716A1 (fr) 2003-04-08 2004-04-05 Procede et appareil pour inspecter un substrat au moyen d'une pluralite de regimes de longueur d'onde d'inspection

Country Status (2)

Country Link
US (1) US7352456B2 (fr)
WO (1) WO2004092716A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2256487B1 (fr) * 2003-09-04 2019-11-06 KLA-Tencor Corporation Procédés d'inspection d'un spécimen utilisant différents paramètres d'inspection
US7684032B1 (en) * 2005-01-06 2010-03-23 Kla-Tencor Corporation Multi-wavelength system and method for detecting epitaxial layer defects
US8148900B1 (en) 2006-01-17 2012-04-03 Kla-Tencor Technologies Corp. Methods and systems for providing illumination of a specimen for inspection
US7705331B1 (en) 2006-06-29 2010-04-27 Kla-Tencor Technologies Corp. Methods and systems for providing illumination of a specimen for a process performed on the specimen
US9354177B2 (en) * 2013-06-26 2016-05-31 Kla-Tencor Corporation System and method for defect detection and photoluminescence measurement of a sample
US9638644B2 (en) * 2013-08-08 2017-05-02 Camtek Ltd. Multiple mode inspection system and method for evaluating a substrate by a multiple mode inspection system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498772A (en) 1982-11-05 1985-02-12 Rca Corporation Method to determine the crystalline properties of an interface of two materials by an optical technique
US4877326A (en) * 1988-02-19 1989-10-31 Kla Instruments Corporation Method and apparatus for optical inspection of substrates
US5293538A (en) 1990-05-25 1994-03-08 Hitachi, Ltd. Method and apparatus for the inspection of defects
US5179422A (en) * 1991-05-15 1993-01-12 Environmental Research Institute Of Michigan Contamination detection system
KR100245805B1 (ko) * 1995-03-10 2000-04-01 가나이 쓰도무 검사방법 및 장치 또 이것을 사용한 반도체장치의 제조방법
US5825498A (en) 1996-02-05 1998-10-20 Micron Technology, Inc. Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials
US6064517A (en) 1996-07-22 2000-05-16 Kla-Tencor Corporation High NA system for multiple mode imaging
US6157444A (en) * 1997-11-28 2000-12-05 Hitachi, Ltd. Defect inspection apparatus for silicon wafer
JP3166841B2 (ja) 1998-04-10 2001-05-14 日本電気株式会社 パーティクル検査装置
US6822978B2 (en) 1999-05-27 2004-11-23 Spectra Physics, Inc. Remote UV laser system and methods of use
US6999614B1 (en) 1999-11-29 2006-02-14 Kla-Tencor Corporation Power assisted automatic supervised classifier creation tool for semiconductor defects
US6891610B2 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining an implant characteristic and a presence of defects on a specimen
EP2256487B1 (fr) * 2003-09-04 2019-11-06 KLA-Tencor Corporation Procédés d'inspection d'un spécimen utilisant différents paramètres d'inspection

Also Published As

Publication number Publication date
US20040201837A1 (en) 2004-10-14
WO2004092716A1 (fr) 2004-10-28
US7352456B2 (en) 2008-04-01

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