WO2004090560A2 - Automatic test machine for testing printed circuit boards - Google Patents

Automatic test machine for testing printed circuit boards Download PDF

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Publication number
WO2004090560A2
WO2004090560A2 PCT/GB2004/001523 GB2004001523W WO2004090560A2 WO 2004090560 A2 WO2004090560 A2 WO 2004090560A2 GB 2004001523 W GB2004001523 W GB 2004001523W WO 2004090560 A2 WO2004090560 A2 WO 2004090560A2
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WO
WIPO (PCT)
Prior art keywords
test
head
pins
module
track
Prior art date
Application number
PCT/GB2004/001523
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French (fr)
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WO2004090560A3 (en
Inventor
Colin Barker
Original Assignee
Colin Barker
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Colin Barker filed Critical Colin Barker
Publication of WO2004090560A2 publication Critical patent/WO2004090560A2/en
Publication of WO2004090560A3 publication Critical patent/WO2004090560A3/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805Bare printed circuit boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68Testing of releasable connections, e.g. of terminals mounted on a printed circuit board

Definitions

  • This patent describes a number of techniques for improving the test of printed circuit boards.
  • backplane This is a special type of printed circuit board (pcb's) which serves to provide interconnections between the other printed circuit boards that comprise the electronic system.
  • pcb's printed circuit board
  • a backplane has rows of connectors on it and the other printed circuit boards plug into it.
  • test equipment designed for "normal" boards is of limited use for testing backplanes.
  • Figure 1 shows some of the key features.
  • the backplane (1) is attached by a fixture to the frame (2) of the machine.
  • a test head (3) can be moved under computer control relative to the backplane in order to conduct specific tests at particular locations.
  • (4) shows the test head viewed from the other side. Movement in the X and Y directions can be achieved by linear motors (5,6). The test head can also be moved in the Z direction. This complete mechanism may be duplicated on the reverse side of the backplane. ⁇
  • the test head can incorporate a number of separate test units designed to perform optical, electrical or mechanical tests. This test head can be moved to a magazine (7) located at the side of the machine where it can pick up any one of a number of adapter modules, designed to tailor the test units to suit a particular application on the backplane being tested.
  • test time is reduced as much as possible. Factors which can increase the test time are (a) the need to keep changing adapter modules (b) the need to perform lots of mechanical tests as these are much slower than optical tests and (c) the need to make contact with a pin (or group of pins) more than once in order to perform say a mechanical test, followed by an electrical test.
  • the invention Rotating head
  • a test head containing test electronics and to which the adapter module is attached can be rotated under computer control to any angle in the plane of the board under test (see Fig 2).
  • the rack (11) containing the test electronics is attached to a circular plate (12).
  • On the front of this is an adapter module (13) which has spring-loaded pins (14) which make contact with the component being tested.
  • the circular plate (12) is mounted in a rotary bearing (15).
  • the drive unit (16) can rotate the whole of the test assembly to any position.
  • a backplane may have similar connectors mounted in different orientations. Since connectors are usually mounted parallel to the main axes of the board there are two possible orientations for a symmetrical connector (Fig 3 a) and four for an asymmetric one (Fig 3b). With a fixed head each of these orientations will require a separate test module. With a rotating head only one test module is needed. A rotating head can also deal easily with connectors orientated at intermediate angles whereas the design of a module to suit an intermediate angle would be cumbersome. b) It is possible that the connector may be at a slight angle to the expected orientation because either (Refer Figs 3c, 3d):—
  • the connector (21) is not parallel to the board axes (22) due to inaccuracies in the basic printed circuit board.
  • the invention Track capacitance measurement a) There are a variety of methods in use for testing the integrity of the tracks on a PCB by measuring the capacitance between the track and a nearby power plane. [The capacitance of a track is directly related to its surface area. If the capacitance of a track differs significantly from the capacitance of the same track on a "known good" board, then the track is suspect.]
  • Fig 4a The outline of a conventional circuit is shown in Fig 4a.
  • An AC signal (51) is applied between earth (52) and a large track or power plane on the PCB (53).
  • the detector circuit consists of a pair of diodes (55,56) together with a pair of resistors (57) and a capacitor (58).
  • the AC source instead of being connected to the large plane (53 in Fig 4a) is connected to the junction between the two capacitors (62,63 in Fig 4b).
  • the large plane is connected directly to earth by a wire (61), so that only a single probe (70 in Fig 4b) is needed.
  • the signal generated across the two diodes in Fig 4b is fed via low-pass filters (64, 67 and 65, 66) to a low-noise instrumentation amplifier (69).
  • the exciting electronics is charging up a small capacitance (the track being tested) rather than a large capacitance (the ground plane) which is being charged up by the conventional circuit as in Fig 4a. This reduces waveform distortion and noise by at least an order of magnitude thereby improving the accuracy of the measurement that can be achieved by this new circuit.
  • the invention Dual-purpose test pins
  • a further feature of this circuit is that by switching it to "ground” mode when the test pin is NOT in contact with another pin or track, the effects of any stray capacitance in each measuring circuit may be determined and any further measurement adjusted to allow for this stray capacitance.
  • a key requirement for using the capacitance measurement technique described above is to minimise the stray capacitance due to the equipment itself. This can be achieved by locating the two diodes (55, 56 in Fig.4a, 4b) as close as possible to the feature being measured. In practice this means locating them within the adapter modules immediately behind the pin used for contacting the pcb. A method of achieving this result is described. a) This method of module construction (as shown in Fig 6) allows easy interfacing from the array of contact probes on a fixed pattern (81), situated on the test-head (3) to a pattern (82) which will suit the connector (or other component) under test and could therefore be different for each connector / component type.
  • a key component of the module is the adapter card (83 in Fig 6). There could be more than one in a module. These are illustrated in Fig 7. c) Fig 7a shows the adapter card (83) in side view. d) At one end of the adapter card are pins (84, 89) at the standard spacing to interface with the test head pin layout, shown at (81). e) At the other end are pins (85) at the custom spacing to interface with the connector or other component being tested (86). Such pins can be replaced by the mating half of the connector under test. f) The conductive tracks (87) on the adapter card allow connection between the two sets of pins on these different spacings and the insertion of the diodes (88) close to the custom pins.
  • Fig 7b shows the adapter cards viewed from above. At one side are pins (84, 89) at the correct spacing to interface with the pins on the test head (81). Note that in the configuration shown two test head pins are required to support each test pin because there are two diodes in the capacitance measuring circuit described earlier. h) At the other end are pins (85) at the correct spacing to interface with the connector
  • the adapter cards in the module may incorporate additional test electronics for any purpose.
  • additional test electronics for any purpose.
  • One example would be RF circuitry which sends test data to the system so RF signals are confined to the testhead.
  • Modules can incorporate a compliant base with inbuilt sensing. Any significant force on the module can be detected and reported to the control system. This feature can be used for measurement purposes or for the prevention of damage.
  • the invention is a series of inventions which taken either together or separately improve the scope, speed and accuracy with which backplanes (or other printed circuit boards) can be tested using an automatic machine.

Abstract

An automatic test machine for testing printed circuits boards (1) comprising a rotation test-head (3, 4); means for track capacitance measurement (51-70); dual-purpose test pins (70-75); and a module construction (13, 14, 83-85,87-90) based on adapter cards (83, 90).

Description

DESCRIPTION
Improvements to an automatic test machine.
Field This patent describes a number of techniques for improving the test of printed circuit boards.
Background A key component in many electronic systems, especially in the
Telecomms industry, is the backplane. This is a special type of printed circuit board (pcb's) which serves to provide interconnections between the other printed circuit boards that comprise the electronic system. Typically a backplane has rows of connectors on it and the other printed circuit boards plug into it.
Because it is at the heart of the system it is difficult to replace if a fault is found when the system is fully assembled, and this means that quality is paramount. Since it is has far more connections than typical printed circuit boards but has relatively few components on it (apart from connectors), test equipment designed for "normal" boards is of limited use for testing backplanes.
Typically all machines designed for testing pcb's fall into one of two types, they either require hard tooling of some sort to interface with a particular pcb or are "robotic" in nature and the test capability, usually called a "test head" is moved under computer control, in X, Y and Z to suit the particular pcb being tested. This robotic type of tester is usually known in the pcb industry as a "flying probe" machine. This patent application principally deals with improvements to the latter category.
A machine specifically designed for testing backplanes is described. Figure 1 shows some of the key features. The backplane (1) is attached by a fixture to the frame (2) of the machine. A test head (3) can be moved under computer control relative to the backplane in order to conduct specific tests at particular locations. (4) shows the test head viewed from the other side. Movement in the X and Y directions can be achieved by linear motors (5,6). The test head can also be moved in the Z direction. This complete mechanism may be duplicated on the reverse side of the backplane.
The test head can incorporate a number of separate test units designed to perform optical, electrical or mechanical tests. This test head can be moved to a magazine (7) located at the side of the machine where it can pick up any one of a number of adapter modules, designed to tailor the test units to suit a particular application on the backplane being tested.
It is clearly desirable that the test time is reduced as much as possible. Factors which can increase the test time are (a) the need to keep changing adapter modules (b) the need to perform lots of mechanical tests as these are much slower than optical tests and (c) the need to make contact with a pin (or group of pins) more than once in order to perform say a mechanical test, followed by an electrical test.
This patent describe a number of features which could be incorporated into the test head and the adapter modules of such a machine, (but are not limited to this application) and which are designed to improve the capability with which the test head can perform various types of test. The Invention
There are four separate aspects of the invention.
The invention - Rotating head
A test head containing test electronics and to which the adapter module is attached can be rotated under computer control to any angle in the plane of the board under test (see Fig 2). The rack (11) containing the test electronics is attached to a circular plate (12). On the front of this is an adapter module (13) which has spring-loaded pins (14) which make contact with the component being tested. The circular plate (12) is mounted in a rotary bearing (15). The drive unit (16) can rotate the whole of the test assembly to any position.
This has two advantages :— a) A backplane may have similar connectors mounted in different orientations. Since connectors are usually mounted parallel to the main axes of the board there are two possible orientations for a symmetrical connector (Fig 3 a) and four for an asymmetric one (Fig 3b). With a fixed head each of these orientations will require a separate test module. With a rotating head only one test module is needed. A rotating head can also deal easily with connectors orientated at intermediate angles whereas the design of a module to suit an intermediate angle would be cumbersome. b) It is possible that the connector may be at a slight angle to the expected orientation because either (Refer Figs 3c, 3d):—
Although the board axes (22) are parallel to the machine axes (23) the connector (21) is not parallel to the board axes (22) due to inaccuracies in the basic printed circuit board.
OR
Although the connector (24) is parallel to the board axes (25) the board itself
(25) is slightly misaligned with respect to the machine axes (26). c) Any such misalignment be measured and the head rotated so that the test module is exactly aligned with the connector being tested. d) These advantages apply to any component requiring to be probed or tested and which can be oriented in different directions. By using a module with two probes whose separation can be varied any two leaded component in any orientation can be tested with a single module.
The invention Track capacitance measurement a) There are a variety of methods in use for testing the integrity of the tracks on a PCB by measuring the capacitance between the track and a nearby power plane. [The capacitance of a track is directly related to its surface area. If the capacitance of a track differs significantly from the capacitance of the same track on a "known good" board, then the track is suspect.]
All of these methods require the use of two probes. One of these probes applies an AC voltage to a large plane or track (usually a ground plane or power plane). The second probe, which makes contact with the track being tested, is connected to a sensitive detection circuit to detect the signal passed to this track by capacitive coupling from the large plane or track. b) The outline of a conventional circuit is shown in Fig 4a. An AC signal (51) is applied between earth (52) and a large track or power plane on the PCB (53). The detector circuit consists of a pair of diodes (55,56) together with a pair of resistors (57) and a capacitor (58). The voltage appearing across the pair of diodes is fed to a simple detector (59), giving an output voltage (60) which is a measure of the capacitance between the track (54) and the power plane (53). c) The method proposed is unique in that it requires only a single probe. d) It achieves this by having the functions of the "exciting electronics" and the "sensing electronics" combined into a single circuit. It then requires only that a ground plane or power plane (or several) be connected to ground with a simple piece of wire. e) The design of the new circuit is shown in Fig 4b. The capacitor (58 in Fig 4a) becomes two capacitors (62,63 in Fig 4b). The AC source instead of being connected to the large plane (53 in Fig 4a) is connected to the junction between the two capacitors (62,63 in Fig 4b). The large plane is connected directly to earth by a wire (61), so that only a single probe (70 in Fig 4b) is needed. f) The signal generated across the two diodes in Fig 4b is fed via low-pass filters (64, 67 and 65, 66) to a low-noise instrumentation amplifier (69). g) In this method the exciting electronics is charging up a small capacitance (the track being tested) rather than a large capacitance (the ground plane) which is being charged up by the conventional circuit as in Fig 4a. This reduces waveform distortion and noise by at least an order of magnitude thereby improving the accuracy of the measurement that can be achieved by this new circuit.
The invention Dual-purpose test pins
As described above, capacitance characterisation is a convenient way of testing track integrity. However, in a small number of circumstances within a particular pcb, this technique may not be possible or adequate and conventional measurements may be necessary (for example but not exclusively resistive or high voltage measurements). In order not to need duplicate adapters and test moves, a group of test channels with both measurement capabilities is desirable. a) One method of implementing this is shown in the circuit of Fig 5. The points A, B in Fig 5 correspond to points A, B in either Fig 4a, or Fig 4b. The two diodes (55, 56) in Fig 5 correspond to the two diodes shown in Fig 4a or 4b. b) The circuit incorporates two switches (71, 72) activated by two signals (73, 74). Although semiconductor switching devices are shown in the diagram any kind of semiconductor or electro-mechanical switch can be used. c) When the movement of the adapter card towards the connector being tested starts the test circuitry is switched to capacitive mode. This is achieved by switching both switches (71, 72) "off, so the circuit of Fig 5 is having no effect. d) The circuit of Fig 4b will detect as soon as the test pin comes into contact with the track or the connector being tested. In the case of a connector pin this gives another method of measuring (as a by-product) the pin height since the position of the test head is known accurately. e) When contact has been made with the circuit still in capacitive mode the pin can measure the track capacitance to confirm (or fail) track continuity. f) The circuit can then switch to either
"Ground mode" by switching (71) "on" in which case the circuit will ground the pin allowing a connectivity measurement to be made from a probe elsewhere on the PCB OR
"Current mode" by switching (72) "on" in which case the circuit will supply a current determined by the DC supply voltage and the resistor (75), to allow a connectivity measurement to be made to a pin which has been grounded by another probe. g) A further feature of this circuit is that by switching it to "ground" mode when the test pin is NOT in contact with another pin or track, the effects of any stray capacitance in each measuring circuit may be determined and any further measurement adjusted to allow for this stray capacitance.
The invention Module construction
A key requirement for using the capacitance measurement technique described above is to minimise the stray capacitance due to the equipment itself. This can be achieved by locating the two diodes (55, 56 in Fig.4a, 4b) as close as possible to the feature being measured. In practice this means locating them within the adapter modules immediately behind the pin used for contacting the pcb. A method of achieving this result is described. a) This method of module construction (as shown in Fig 6) allows easy interfacing from the array of contact probes on a fixed pattern (81), situated on the test-head (3) to a pattern (82) which will suit the connector (or other component) under test and could therefore be different for each connector / component type. b) A key component of the module is the adapter card (83 in Fig 6). There could be more than one in a module. These are illustrated in Fig 7. c) Fig 7a shows the adapter card (83) in side view. d) At one end of the adapter card are pins (84, 89) at the standard spacing to interface with the test head pin layout, shown at (81). e) At the other end are pins (85) at the custom spacing to interface with the connector or other component being tested (86). Such pins can be replaced by the mating half of the connector under test. f) The conductive tracks (87) on the adapter card allow connection between the two sets of pins on these different spacings and the insertion of the diodes (88) close to the custom pins. g) Fig 7b shows the adapter cards viewed from above. At one side are pins (84, 89) at the correct spacing to interface with the pins on the test head (81). Note that in the configuration shown two test head pins are required to support each test pin because there are two diodes in the capacitance measuring circuit described earlier. h) At the other end are pins (85) at the correct spacing to interface with the connector
(or other item) under test (86). i) Any variation in spacing between the pins at either end is accommodated by assembling the boards into the module at an angle as shown (90). j) The effects of any residual stray capacitance may be further reduced by varying under software control the pattern of test pins which are excited simultaneously, k) Where the test points on the component under test are very close together the effective spacing between test pins may be increased by arranging them in a
"chequerboard" pattern. 1) The adapter cards in the module may incorporate additional test electronics for any purpose. One example would be RF circuitry which sends test data to the system so RF signals are confined to the testhead. m) Modules can incorporate a compliant base with inbuilt sensing. Any significant force on the module can be detected and reported to the control system. This feature can be used for measurement purposes or for the prevention of damage.
Summary
In summary the invention is a series of inventions which taken either together or separately improve the scope, speed and accuracy with which backplanes (or other printed circuit boards) can be tested using an automatic machine.

Claims

CLAIMS A series of improvements to an automatic test machine which may be used together or separately to improve the scope, speed and accuracy of the tests, and comprise a rotating test-head, an improved method of track capacitance measurement, dual- purpose test pins and a method of module construction based on adapter cards. A rotating test-head whereby components mounted at any angle may be tested using a single adapter module. An improved method of track capacitance measurement which allows the testing of PCB tracks using a single probe. Dual-purpose test pins whereby a single pin may be switched between different test modes. A method of module construction which allows interfacing between a fixed array of contacts, such as but not limited to, the array on the test-head to a variable contact array, such as but not limited to, the contacts on the component being tested. A method of module construction which can increase the effective spacing between test pins. A method of module construction which allows additional electronic circuitry to be located very close to the component under test.
PCT/GB2004/001523 2003-04-10 2004-04-08 Automatic test machine for testing printed circuit boards WO2004090560A2 (en)

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Application Number Priority Date Filing Date Title
GBGB0308550.3A GB0308550D0 (en) 2003-04-10 2003-04-10 Improvements to an automatic test machine
GB0308550.3 2003-04-10

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WO2004090560A2 true WO2004090560A2 (en) 2004-10-21
WO2004090560A3 WO2004090560A3 (en) 2005-01-20

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* Cited by examiner, † Cited by third party
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JP2021012117A (en) * 2019-07-08 2021-02-04 ヤマハファインテック株式会社 Electrical inspection device and holding unit
CN116699300A (en) * 2023-07-31 2023-09-05 深圳市力容电子有限公司 Ox horn type capacitor testing device and testing method
CN116754987A (en) * 2023-08-17 2023-09-15 深圳市迈龙迪科技有限公司 LED lamp bead sampling inspection device

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565966A (en) * 1983-03-07 1986-01-21 Kollmorgen Technologies Corporation Method and apparatus for testing of electrical interconnection networks
US4714875A (en) * 1984-04-16 1987-12-22 Mars, Inc. Printed circuit board fault location system
EP0354124A1 (en) * 1988-08-03 1990-02-07 AEROSPATIALE Société Nationale Industrielle Apparatus for checking the correct snapping of the pins of a multiple pin connector
US5006808A (en) * 1989-03-21 1991-04-09 Bath Scientific Limited Testing electrical circuits
EP0572060A1 (en) * 1992-05-29 1993-12-01 International Business Machines Corporation Apparatus and method for resistive detection and waveform analysis of interconnection networks
US5357191A (en) * 1992-11-09 1994-10-18 Probot, Inc. Method and apparatus for testing circuit boards
GB2307754A (en) * 1995-11-30 1997-06-04 Fujitsu Automation Test/reference capacitance ratio used to assess a conductive pattern on a pcb
WO1999023500A1 (en) * 1997-10-30 1999-05-14 Siemens Aktiengesellschaft Method for testing electrical modules
EP0919820A2 (en) * 1997-10-30 1999-06-02 Nidec-Read Corporation Circuit board testing apparatus and method
US5994909A (en) * 1997-08-25 1999-11-30 Lucas; Brian K. Robotic twin probe for measurement on printed circuit boards and electrical and electronic assemblies
EP0962777A2 (en) * 1998-06-02 1999-12-08 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
US6064195A (en) * 1998-05-11 2000-05-16 R-Tec Corporation Test probe positioning device
WO2000039595A1 (en) * 1998-12-30 2000-07-06 Proteus Corporation Dual-pin probe for testing circuit boards
EP1059538A2 (en) * 1999-05-31 2000-12-13 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
US6268719B1 (en) * 1998-09-23 2001-07-31 Delaware Capital Formation, Inc. Printed circuit board test apparatus
US6291978B1 (en) * 1993-08-31 2001-09-18 Agilent Technologies, Inc. System and method for detecting shorts, opens and connected pins on a printed circuit board using automatic test equipment
WO2001077697A2 (en) * 2000-04-12 2001-10-18 Barker, Colin, Graham Electrical and electro-mechanical test method and apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09230005A (en) * 1996-02-22 1997-09-05 Hioki Ee Corp Circuit board testing device

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565966A (en) * 1983-03-07 1986-01-21 Kollmorgen Technologies Corporation Method and apparatus for testing of electrical interconnection networks
US4714875A (en) * 1984-04-16 1987-12-22 Mars, Inc. Printed circuit board fault location system
EP0354124A1 (en) * 1988-08-03 1990-02-07 AEROSPATIALE Société Nationale Industrielle Apparatus for checking the correct snapping of the pins of a multiple pin connector
US5006808A (en) * 1989-03-21 1991-04-09 Bath Scientific Limited Testing electrical circuits
EP0572060A1 (en) * 1992-05-29 1993-12-01 International Business Machines Corporation Apparatus and method for resistive detection and waveform analysis of interconnection networks
US5357191A (en) * 1992-11-09 1994-10-18 Probot, Inc. Method and apparatus for testing circuit boards
US6291978B1 (en) * 1993-08-31 2001-09-18 Agilent Technologies, Inc. System and method for detecting shorts, opens and connected pins on a printed circuit board using automatic test equipment
GB2307754A (en) * 1995-11-30 1997-06-04 Fujitsu Automation Test/reference capacitance ratio used to assess a conductive pattern on a pcb
US5994909A (en) * 1997-08-25 1999-11-30 Lucas; Brian K. Robotic twin probe for measurement on printed circuit boards and electrical and electronic assemblies
EP0919820A2 (en) * 1997-10-30 1999-06-02 Nidec-Read Corporation Circuit board testing apparatus and method
WO1999023500A1 (en) * 1997-10-30 1999-05-14 Siemens Aktiengesellschaft Method for testing electrical modules
US6064195A (en) * 1998-05-11 2000-05-16 R-Tec Corporation Test probe positioning device
EP0962777A2 (en) * 1998-06-02 1999-12-08 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
US6268719B1 (en) * 1998-09-23 2001-07-31 Delaware Capital Formation, Inc. Printed circuit board test apparatus
WO2000039595A1 (en) * 1998-12-30 2000-07-06 Proteus Corporation Dual-pin probe for testing circuit boards
EP1059538A2 (en) * 1999-05-31 2000-12-13 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
WO2001077697A2 (en) * 2000-04-12 2001-10-18 Barker, Colin, Graham Electrical and electro-mechanical test method and apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 01, 30 January 1998 (1998-01-30) -& JP 09 230005 A (HIOKI EE CORP), 5 September 1997 (1997-09-05) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021012117A (en) * 2019-07-08 2021-02-04 ヤマハファインテック株式会社 Electrical inspection device and holding unit
CN116699300A (en) * 2023-07-31 2023-09-05 深圳市力容电子有限公司 Ox horn type capacitor testing device and testing method
CN116699300B (en) * 2023-07-31 2023-09-26 深圳市力容电子有限公司 Ox horn type capacitor testing device and testing method
CN116754987A (en) * 2023-08-17 2023-09-15 深圳市迈龙迪科技有限公司 LED lamp bead sampling inspection device
CN116754987B (en) * 2023-08-17 2023-11-10 深圳市迈龙迪科技有限公司 LED lamp bead sampling inspection device

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