Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/842—Containers
  • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
  • H10K59/80—Constructional details
  • H10K59/87—Passivation; Containers; Encapsulations
  • H10K59/871—Self-supporting sealing arrangements
  • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
  • H10K59/80—Constructional details
  • H10K59/87—Passivation; Containers; Encapsulations
  • H10K59/873—Encapsulations

Definitions

• This invention relates to a method of forming a semiconductor device comprising assembling at least two layers.
• the invention is particularly, but not exclusively, applicable to forming an optoelectronic device from a semiconducting substrate incorporating active circuitry (e.g. a CMOS - complementary metal-oxide-semiconductor - wafer) and monochrome OLED (organic light emitting diode pixels) and a further translucent layer, for example of glass, comprising color filters providing a color device.
• active circuitry e.g. a CMOS - complementary metal-oxide-semiconductor - wafer
• monochrome OLED organic light emitting diode pixels
• a further translucent layer for example of glass, comprising color filters providing a color device.
• a plurality of OLED arrays is formed on a single substrate.
• the substrate comprises metal bond pads around the edges of each array for establishing electrical connections to the circuitry of the array.
• a convenient method of attaching the translucent filter layer to the substrate would be to use an adhesive such as an ultraviolet-curable epoxy adhesive. After attaching the filter layer to the substrate, the resulting assembly is singulated by cutting to obtain individual OLED devices.
• the present invention provides a method of forming a semiconductor device comprising providing a semiconductor substrate comprising circuitry and terminal means for establishing electrical connection to the circuitry; providing a sheet for forming a further layer of the device, the sheet comprising at least one groove; applying adhesive to at least one of said substrate and said sheet; and aligning said substrate and said sheet in a position such that said at least one groove faces said terminal means and attaching said substrate and said sheet together by means of said adhesive in said position.
• the adhesive may be applied solely to said sheet.
• the terminal means may comprise a plurality of bond pads.
• the semiconductor substrate comprises at least one array of OLEDs.
• the further layer may comprise a translucent layer, e.g. of glass, bearing filters, such as color filters.
• the circuitry comprises a plurality of discrete circuit means each having terminal means at at least one edge thereof, and after attachment of the substrate to the surface said substrate and sheet are singulated by severing said sheet at the at least one groove to form a plurality of devices each comprising one of said circuit means.
• each circuit means may have terminal means on all four edges, of said rectangular portion.
• the adhesive may be applied to the entire surface of the sheet, which surface is to be attached to the substrate, for example by spraying.
• each circuit means has terminal means on only one edge thereof.
• the sheet may be severed along lines offset from lines along which the substrate is severed, said lines in said substrate and said lines in said sheet being aligned with said grooves but spaced from each other across the width of said grooves. This avoids the need to remove sections of the sheet.
• the adhesive may be applied to parts only of the sheet, for example in continuous lines or lines of dots parallel to the grooves.
• the present invention provides a semiconductor device assembly comprising a semiconductor substrate comprising circuitry and terminal means for establishing electrical connection to the circuitry; and a sheet attached to the substrate by means of adhesive and forming a further layer of the device, the sheet comprising at least one groove facing and aligned with said terminal means.
• the terminal means may comprise a plurality of bond pads.
• the semiconductor substrate comprises at least one array of OLEDs.
• the further layer may comprise a translucent layer, e.g. of glass, bearing filters, such as color filters.
• the circuitry comprises a plurality of discrete circuit means each having terminal means at least one edge thereof.
• each circuit means may have terminal means on all four edges of said rectangular portion.
• each circuit means has terminal means on only one edge thereof.
• the sheet may comprise sheet channels for severing the sheet, offset from substrate channels along which the substrate is to be severed, said channels in said substrate and said channels in said sheet being aligned with said grooves but spaced from each other across the width of said grooves.
• the invention provides an optoelectronic device made according to the alternative embodiment of the inventive method defined above and comprising a semiconductor substrate comprising circuitry, light emitting elements and terminal means for establishing electrical connection to the circuitry; and a sheet attached to the substrate by means of adhesive and forming a further layer of the device, the sheet having a portion extending beyond the substrate, said portion having been formed during the step of severing the sheet along lines offset from lines along which the substrate is severed.
• the terminal means may comprise a plurality of bond pads.
• the semiconductor substrate comprises at least one array of OLEDs.
• the further layer may comprise a translucent layer, e.g. of glass, bearing filters, such as color filters.
• Figure 1 is a schematic fragmentary view of a substrate for use in the invention
• Figure 2 is a schematic fragmentary view of a sheet of glass for attaching to the substrate of Figure 1;
• Figure 3 is a schematic transverse section through an assembly formed from the substrate of Figure 1 and the sheet of Figure 2;
• Figure 4 is a schematic transverse section through an alternative assembly
• Figure 5 shows the assembly of Figure 4 after singulation.
• Figure 1 shows part of a substrate 1 comprising a CMOS wafer bearing a number of monochrome OLED arrays 2 which have been fabricated on the active circuitry. Each array is rectangular and has bond pads 3 along all four sides. In Figure 3 each trapezium denotes a line of bond pads, connections between the bond pads 3 and the OLED arrays 2 being omitted for clarity.
• the substrate comprises further layers such as encapsulating and electrode layers.
• Figure 2 shows part of a glass plate 4 for attaching to the substrate of Figure 1.
• a crisscross network of grooves 5, having a depth of e.g. 0.2 mm and corresponding to the locations of the bond pads 3 of the substrate 1 has been etched in the plate 4.
• the plate bears color filters (not shown) for defining colored pixels of an optoelectronic device.
• a transparent UY-curable epoxy adhesive 6 is sprayed over the entire surface of the plate 4 including the grooves 5, in a layer of uniform thickness (e.g. 5 um).
• the plate 4 and the substrate 1 are then assembled as shown in Figure 3. Since the grooves 5 are aligned with the bond pads 3, no adhesive contacts the latter.
• the assembly of Figure 3 is singulated preferably by sawing through the substrate 1 at the location of the scribe channels between the bond pads 3 of adjacent devices, and by sawing through the plate 4 at both edges of each groove 5, removing the glass above the groove. To prevent damage the saw cuts may be terminated e.g. 50 ⁇ m from the interface between the substrate 1 and the plate 4, the assembly then being broken at the saw cuts.
• Figure 4 shows an alternative assembly in which OLED arrays 2' of substrate V have rows of bond pads 3' along one side only.
• Saw cuts 6 are made in glass plate 4 at only one edge of each of the grooves 5. These saw cuts are offset, e.g. by 1.4 mm, from cuts 7 in substrate 1'. The substrate V and the plate 4 are broken at the saw cuts 7, 6 respectively to give the singulated devices shown in Figure 5. In this embodiment it is not necessary to remove sections of glass from the plate.
• adhesive could be applied to the plate in continuous lines or lines of dots, parallel to the grooves 5, for example using a robot. This is particularly appropriate in the embodiment shown in Figures 4 and 5.
• the adhesive spreads when the plate 4 is pressed against the substrate V, but flows along the inner surface of the grooves 5 rather than on to the bond pads 3', due to the nature of the surface of the glass.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Electroluminescent Light Sources (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

Family

ID=9955406

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (6)

Citations (6)

Family Cites Families (9)

• 2003
  • 2003-03-24 GB GBGB0306721.2A patent/GB0306721D0/en not_active Ceased
• 2004
  • 2004-03-23 JP JP2006506013A patent/JP2006523920A/ja active Pending
  • 2004-03-23 US US10/550,244 patent/US20070026553A1/en not_active Abandoned
  • 2004-03-23 WO PCT/GB2004/001270 patent/WO2004086529A1/en not_active Ceased
  • 2004-03-23 EP EP04722587A patent/EP1606847A1/en not_active Withdrawn

Patent Citations (6)

Non-Patent Citations (2)

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