WO2004083742A3 - Modele a temperature d'ebullition dans les boucles de refroidissement des microcanaux pompes - Google Patents

Modele a temperature d'ebullition dans les boucles de refroidissement des microcanaux pompes Download PDF

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Publication number
WO2004083742A3
WO2004083742A3 PCT/US2004/006746 US2004006746W WO2004083742A3 WO 2004083742 A3 WO2004083742 A3 WO 2004083742A3 US 2004006746 W US2004006746 W US 2004006746W WO 2004083742 A3 WO2004083742 A3 WO 2004083742A3
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WO
WIPO (PCT)
Prior art keywords
fluid
adjusting
pressure
heat
pumped
Prior art date
Application number
PCT/US2004/006746
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English (en)
Other versions
WO2004083742A2 (fr
Inventor
Peng Zhou
Shulin Zeng
Thomas W Kenny Jr
Mark Munch
Girish Upadhya
Kenneth Goodson
Juan G Santiago
Original Assignee
Cooligy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc filed Critical Cooligy Inc
Publication of WO2004083742A2 publication Critical patent/WO2004083742A2/fr
Publication of WO2004083742A3 publication Critical patent/WO2004083742A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un procédé de refroidissement d'au moins un dispositif produisant de la chaleur au moyen d'un système de refroidissement. Le procédé comporte des opérations consistant à utiliser au moins une pompe pour faire circuler un fluide dans au moins un échangeur de chaleur et régler une pression du fluide de façon à régler de façon correspondante une température de point d'ébullition du fluide dans l'échangeur de chaleur considéré. Le procédé peut également comporter une opération consistant à fournir au moins un dispositif de rejet de chaleur permettant de rejeter la chaleur du système, ce dispositif de rejet de chaleur étant situé en aval de l'échangeur de chaleur considéré. L'opération de réglage d'une pression du fluide peut comporter un réglage d'une pression du fluide pendant le chargement et la fermeture étanche du système. En outre, l'opération de réglage d'une pression du fluide peut comporter le réglage d'une composition et d'un volume de gaz et de liquide introduit pendant le chargement du système.
PCT/US2004/006746 2003-03-17 2004-03-05 Modele a temperature d'ebullition dans les boucles de refroidissement des microcanaux pompes WO2004083742A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US45572903P 2003-03-17 2003-03-17
US60/455,729 2003-03-17
US10/643,638 US20040182551A1 (en) 2003-03-17 2003-08-18 Boiling temperature design in pumped microchannel cooling loops
US10/643,638 2003-08-18

Publications (2)

Publication Number Publication Date
WO2004083742A2 WO2004083742A2 (fr) 2004-09-30
WO2004083742A3 true WO2004083742A3 (fr) 2005-11-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/006746 WO2004083742A2 (fr) 2003-03-17 2004-03-05 Modele a temperature d'ebullition dans les boucles de refroidissement des microcanaux pompes

Country Status (3)

Country Link
US (1) US20040182551A1 (fr)
TW (1) TW200506305A (fr)
WO (1) WO2004083742A2 (fr)

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US7327570B2 (en) * 2004-12-22 2008-02-05 Hewlett-Packard Development Company, L.P. Fluid cooled integrated circuit module
US20100044005A1 (en) * 2008-08-20 2010-02-25 International Business Machines Corporation Coolant pumping system for mobile electronic systems
US7872867B2 (en) * 2008-09-02 2011-01-18 International Business Machines Corporation Cooling system for an electronic component system cabinet
CN101881568A (zh) * 2010-07-05 2010-11-10 云南汇博科技有限公司 热管启动温度值的设定方法
WO2012145733A1 (fr) 2011-04-22 2012-10-26 Vanderbilt University Polariseur para-hydrogène
CN103424018A (zh) * 2012-05-14 2013-12-04 施耐德电器工业公司 具有增压泵的液体相变传热式泵送冷却系统
JP6439326B2 (ja) 2014-08-29 2018-12-19 株式会社Ihi リアクタ
CN106642809A (zh) * 2016-12-28 2017-05-10 江苏康泰热交换设备工程有限公司 微通道热管采暖方法及装置
US11948861B2 (en) * 2018-09-17 2024-04-02 Agency For Science, Technology And Research Liquid cooling module and method of forming the same
CN112736046B (zh) * 2020-12-11 2024-03-22 杭州电子科技大学 一种集成芯片散热装置及其散热方法

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Also Published As

Publication number Publication date
TW200506305A (en) 2005-02-16
US20040182551A1 (en) 2004-09-23
WO2004083742A2 (fr) 2004-09-30

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