WO2004069698A2 - Systeme de transport a ensemble frontal a sas de charge partage - Google Patents

Systeme de transport a ensemble frontal a sas de charge partage Download PDF

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Publication number
WO2004069698A2
WO2004069698A2 PCT/US2004/002859 US2004002859W WO2004069698A2 WO 2004069698 A2 WO2004069698 A2 WO 2004069698A2 US 2004002859 W US2004002859 W US 2004002859W WO 2004069698 A2 WO2004069698 A2 WO 2004069698A2
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
transfer chamber
transport system
elevator
mobile
Prior art date
Application number
PCT/US2004/002859
Other languages
English (en)
Other versions
WO2004069698A3 (fr
Inventor
Gregory Kielczewski
Thomas Q. Wolff
Jacob Cherepakho
Original Assignee
Aviza Technology Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aviza Technology Inc. filed Critical Aviza Technology Inc.
Publication of WO2004069698A2 publication Critical patent/WO2004069698A2/fr
Publication of WO2004069698A3 publication Critical patent/WO2004069698A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

Definitions

  • the present invention relates generally to transport systems which provide for transfer of media. More specifically, the present invention relates to a transport system having a shared load-lock front-end assembly suitable for transferring media in controlled environment such as a vacuum or low oxygen environment with such transport systems.
  • Transport of media is a large industry. There are many systems for the transport of all types of media. In the semiconductor or wafer processing industry, the movement of wafers throughout the fabrication facility ("fab") is of significant importance. The wafers are of significant value and are very susceptible to damage. Productivity and throughput are of utmost concern, and the industry devotes significant effort to the design of efficient transport systems. Further the fab must meet strict clean room environment standards which requires the use of specialized equipment and materials.
  • a significant disadvantage of hub-type prior art systems is their size.
  • the diameter of a transfer for hub-based systems is typically very large. This is due to the necessity of rotating a wafer inside the transfer chamber. Further, only a large transfer chamber diameter allows connection of an acceptable number of process chambers. As a result of this requirement robot designers face very serious challenges.
  • the robot arms must have a long reach, which results in excessive deflection of the arm at the extended position. As a result, wafer transfer becomes unreliable.
  • Another undesirable effect of a very long robotic arm is increased probability of excessive particle generation caused by wafer contact with the surface of a wafer carrier.
  • the present invention provides an improved transport system for transfer of media. More specifically, the present invention provides a transport system having shared load-lock front-end assembly or subsystem suitable for transferring media, such as semiconductor wafers, preferably but not necessarily in a controlled environment such as a vacuum or low oxygen environment.
  • the present invention addresses many of the limitations of the prior art, for example the present invention allows for transfer of media, in particular wafers, from one process chamber to another in a controlled environment, such as a vacuum environment. Further the present invention reduces the amount of hardware associated with each chamber ( separate load locks and load lock robots for each process chamber are not needed). This promotes cost reduction and decreases the tool footprint. Moreover, the tool footprint may be further reduced by allowing replacement of a traditional single layer arrangement with vertically stacked process chambers.
  • the present invention substantially minimizes the possibility of damaging media during transport (in particular semiconductor wafers) caused by a robot during system failure (such as a power failure or malfunction), as the transport system includes a transfer module firmly attached to a docking port of a process chamber or elevator.
  • wafers can be transferred in vacuum, the floor space occupied by the tool can be significantly reduced, and the number of chambers can be increased.
  • the floor space advantage of the present invention is even more prevalent if one takes into account that tools built around a hub or dual hub design require additional space for assembly of the tool and its maintenance. Side to wall arrangement of tools in a clean room is not possible.
  • the footprint of tools utilizing the present invention is the only space the tools require.
  • the present invention provides a transport system for transporting media comprising a front-end subsystem coupled between one or more process chambers and one or more input ports, where the front-end subsystem is configured to transport media between the one or more process chambers and input ports in a controlled environment.
  • the front-end subsystem comprises a front-end chamber housing a gantry robot and a mobile transfer chamber carried on the gantry robot, and a wafer delivery system coupled to the front-end chamber.
  • FIG. 1 is a top plan view of a universal platform system in accordance with one embodiment of the present invention
  • FIGs. 2 A- 2C are front views taken along section A-A of FIG. 1 showing one of the cooling station cassette vacuum stations in different configurations; specifically with the cover on, without the cover and an exploded view, respectively, according to embodiments of the present invention;
  • FIG. 3 is a top plan view illustrating a mobile transfer chamber in a docked position with an elevator according to one embodiment of the present invention
  • FIG. 4 is a front view taken along section B-B of FIG. 1 showing a multi- chamber tool according to one embodiment of the present invention.
  • FIG. 5 is a top plan view illustrating a mobile transfer chamber in a docked position with a process chamber in accordance with one embodiment of the present invention.
  • the present invention provides a transport system generally comprised of a front-end subsystem or assembly 100 coupled to a media processing tool 102, as shown in FIG. 1.
  • the front-end subsystem 100 transfers media from one or more input ports 13, 20 (such as cassettes) to one or more process chambers 1, 32 housed in the media processing tool 102.
  • input ports 13, 20 such as cassettes
  • process chambers 1, 32 housed in the media processing tool 102.
  • the front-end subsystem 100 is generally comprised of a front-end chamber 4 with optional low O 2 capabilities, robot 3, preferably a gantry robot, a mobile transfer chamber/ shared load-lock module 29 (hereinafter referred to as "mobile transfer chamber"), and wafer delivery system 110.
  • the mobile transfer chamber 29 is “shared,” that is the mobile transfer chamber services both the process chambers and the input ports and conveys wafers between the same.
  • the mobile transfer chamber 29 includes a slot valve 30 formed therein, and houses a transfer mechanism such as a three link arm or robot 28 as shown in more detail in Fig. 3.
  • the robot 28 is vacuum compatible.
  • Alternative transfer mechanisms may be used, and the invention is not limited by the particular embodiments shown and described herein.
  • the mobile transfer chamber 29 is adapted to move along the gantry robot 2.
  • Wafers are transferred between the process chambers and a wafer delivery system 110.
  • the wafer delivery system 110 is comprised of a dual cassette wafer delivery system as known in the art.
  • the cassette wafer delivery system 110 is generally comprised of two load ports 13, 20; two sets of "cooling station/cassette vacuum combination units (hereinafter called
  • the front-end subsystem 100 can be optionally equipped with one or more auxiliary off-line storage stations 11, 15, 19 for temporary storage of empty FOUPs.
  • auxiliary off-line storage stations 11, 15, 19 for temporary storage of empty FOUPs may be used, such as a single cassette wafer delivery system, dual cassette/Foup delivery systems, and the like
  • the elevator generally includes a housing having a docking port 33 formed within a cover 40 to permit access to wafers housed within the elevator as shown in FIG. 2A.
  • Fig. 2B illustrates the elevator with the cover removed.
  • Wafers are stacked and supported within a cassette which is coupled to a shaft and associated know mechanisms configured to move the wafer stack up and down.
  • a source slot 34 is defined as the slot in which the wafer to be processed is located.
  • a destination location 35 is defined, and during operation, the destination 35 will be aligned with the opening of the docketing port 33 to permit access to the wafer.
  • One or more FOUPs 12 and 21 containing wafers are delivered to load port 13 and 20, respectively (FIG. 1).
  • load port 13 and 20 For simplicity the discussion will focus on the operation of load port 13 and associated units, however the same operation can be carried out with load port 20 and its associated unites 19, 18, 24, 23 and 26.
  • the front door of the FOUP 12 and a bladder door 8 between elevator 6 and transfer chamber 10 open simultaneously.
  • the robot 9 transfers wafers from load port 13 to elevator 6.
  • the transfer can be performed in a single move by a multi-end-effector robot, or a sequence of pick and place operations performed by a single end-effector wafer transfer robot.
  • the front door 12 and the bladder door 8 close.
  • An operator, or an automated delivery system takes an empty FOUP from load port 13, places it temporarily on an auxiliary off-line storage station 11, and puts anew FOUP on load port 13.
  • a control system as known in the art initiates a change in the atmosphere inside of the elevator 6, replacing air with nitrogen in order to create a low O 2 environment, or alternatively evacuates elevator chamber 6 to the required vacuum level, depending on the particular process.
  • the associated plumbing and/or vacuum equipment is not shown but is well know by those of ordinary skill in the art. In some cases the process may not require a special environment inside the elevator chamber, and the last step of the chamber evacuation can be skipped. If a special environment in the elevator chamber is not necessary at all, the tool can be simplified by removing elevators 6, 14, 18, 26 and transfer chambers 10, 22.
  • the transfer chamber 29 is moved towards the docking port 33 of elevator 6 (FIG. 2) and attaches the transfer chamber 29 to docking port 33 of elevator 6, creating a vacuum-sealed connection.
  • elevator 6 moves to align a source slot of the first wafer to be processed with the opening of docking port 33.
  • a narrow chamber 36 between slot valve 30 of mobile transfer chamber 29 and slot valve 5 of elevator 6 (FIG. 3) is evacuated, or brought to the same atmosphere and pressure as the one established at both mobile transfer chamber 29 and elevator 6.
  • slot valves 30 and 5 open and vacuum robot 28 picks up a wafer from any slot of a cassette of elevator 6. Both slot valves 30 and 5 close.
  • Chamber 36 is brought to atmospheric pressure, and mobile transfer chamber 29 disengages from docking port 33 of elevator 6 (FIG. 2).
  • the control system starts the process of evacuation of mobile transfer chamber 29, and initiates a movement of robot 3 in order to bring transfer chamber 29 to a required process chamber, in this example to chamber 1.
  • Mobile transfer chamber 29 is coupled to docking port 37 of process chamber 1, as shown in FIG. 4 creating a vacuum-sealed connection.
  • the process of evacuation of mobile transfer chamber 29 continues.
  • a narrow chamber 49 between slot valve 30 of mobile transfer chamber 29 and slot valve 2 (FIG. 5) of process chamber 1 is evacuated.
  • slot valves 30 and 2 open, and vacuum robot 28 swaps wafers in the chamber 1. Both slot valves 30 and 2 close.
  • Chamber 49 is brought to atmospheric pressure, and mobile transfer chamber 29 disengages from docking port 37 of chamber 1.
  • the control system starts the process of bringing mobile transfer chamber 29 to the atmosphere characteristic for the elevator (CD A, N 2 or vacuum) or another chamber, and initiates a movement of robot 3 to bring mobile transfer chamber 29 to elevator 6 (FIG. 2), or alternatively, to another chamber. At the same time elevator 6 moves to align cooling station 36 with the opening of docking port 33.
  • Mobile transfer chamber 29 attaches itself to docking port 33 of elevator 6, creating a vacuum-sealed connection.
  • the process of bringing mobile transfer chamber 29 to the atmosphere characteristic for the elevator (CD A, N 2 or vacuum) continues.
  • a similar process starts for chamber 36 (FIG. 3).
  • slot valves 30 and 5 open and vacuum robot 28 swaps wafers, or places the first wafer on cooling station 36 (FIG. 2).
  • elevator 6 moves to align a destination 35 with the opening of docking port 33.
  • Vacuum robot 28 places the wafer from the cooling station into the destination slot 35.
  • Elevator 6 moves to align a source slot 34 (the slot in which the wafer to be processed is located) with the opening of docking port 33. The cycle starts again.
  • Table 1 illustrates steps of wafer transport, and estimates cycle time of the system for one embodiment of the present invention. Table 1.
  • the robot 28 within transfer chamber 29 does not need to rotate, and instead the entire chamber 29 is adapted to rotate.
  • the distance between the edge of a wafer placed on the end-effector of the robot 28 and the slot valve 30 of the mobile transfer chamber 29 can be smaller than 0.5".

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un système de transport amélioré permettant de transférer un support. L'invention concerne, plus spécifiquement, un système de transport comprenant un ensemble ou un sous-système frontal à sas de charge partagé approprié pour transférer un support, en particulier, de tranches semi-conductrices, dans un environnement commandé tel qu'un environnement sous vide ou à faible teneur en oxygène.
PCT/US2004/002859 2003-01-31 2004-02-02 Systeme de transport a ensemble frontal a sas de charge partage WO2004069698A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44396903P 2003-01-31 2003-01-31
US60/443,969 2003-01-31

Publications (2)

Publication Number Publication Date
WO2004069698A2 true WO2004069698A2 (fr) 2004-08-19
WO2004069698A3 WO2004069698A3 (fr) 2005-03-24

Family

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Family Applications (1)

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PCT/US2004/002859 WO2004069698A2 (fr) 2003-01-31 2004-02-02 Systeme de transport a ensemble frontal a sas de charge partage

Country Status (2)

Country Link
TW (1) TW200505776A (fr)
WO (1) WO2004069698A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004058557A1 (de) * 2004-12-03 2006-06-08 Asys Automatic Systems Gmbh & Co. Kg Transfervorrichtung für die Handhabung von flächigen Substraten
EP1755151A1 (fr) * 2005-08-18 2007-02-21 Asys Automatic Systems Gmbh & Co. Kg Installation de traitement modulaire pour des substrats plats
US8257498B2 (en) 2007-07-26 2012-09-04 Tokyo Electron Limited Substrate transfer module and substrate processing system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4923584A (en) * 1988-10-31 1990-05-08 Eaton Corporation Sealing apparatus for a vacuum processing system
US4923352A (en) * 1988-03-31 1990-05-08 Kabushiki Kaisha N.M.B. Semiconductor System for manufacturing semiconductor under clean condition
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5364219A (en) * 1991-06-24 1994-11-15 Tdk Corporation Apparatus for clean transfer of objects
US5942013A (en) * 1996-09-13 1999-08-24 Tokyo Electron Limited Substrate processing system
US20020192056A1 (en) * 2001-06-13 2002-12-19 Applied Materials, Inc. Method and apparatus for transferring a semiconductor substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697258A (ja) * 1992-09-17 1994-04-08 Hitachi Ltd 連続真空処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US4923352A (en) * 1988-03-31 1990-05-08 Kabushiki Kaisha N.M.B. Semiconductor System for manufacturing semiconductor under clean condition
US4923584A (en) * 1988-10-31 1990-05-08 Eaton Corporation Sealing apparatus for a vacuum processing system
US5364219A (en) * 1991-06-24 1994-11-15 Tdk Corporation Apparatus for clean transfer of objects
US5942013A (en) * 1996-09-13 1999-08-24 Tokyo Electron Limited Substrate processing system
US20020192056A1 (en) * 2001-06-13 2002-12-19 Applied Materials, Inc. Method and apparatus for transferring a semiconductor substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004058557A1 (de) * 2004-12-03 2006-06-08 Asys Automatic Systems Gmbh & Co. Kg Transfervorrichtung für die Handhabung von flächigen Substraten
EP1755151A1 (fr) * 2005-08-18 2007-02-21 Asys Automatic Systems Gmbh & Co. Kg Installation de traitement modulaire pour des substrats plats
US7845892B2 (en) 2005-08-18 2010-12-07 Jusung Engineering Co, Ltd. Movable transfer chamber and substrate-treating apparatus including the same
KR101292805B1 (ko) 2005-08-18 2013-08-02 에이시스 오토매틱 시스템즈 게엠베하 운트 콤파니 콤만디트게젤샤프트 이동식 이송챔버를 포함하는 기판처리장치
US8257498B2 (en) 2007-07-26 2012-09-04 Tokyo Electron Limited Substrate transfer module and substrate processing system

Also Published As

Publication number Publication date
TW200505776A (en) 2005-02-16
WO2004069698A3 (fr) 2005-03-24

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