TW200505776A - Transport system having shared load-lock front-end assembly - Google Patents

Transport system having shared load-lock front-end assembly

Info

Publication number
TW200505776A
TW200505776A TW093102021A TW93102021A TW200505776A TW 200505776 A TW200505776 A TW 200505776A TW 093102021 A TW093102021 A TW 093102021A TW 93102021 A TW93102021 A TW 93102021A TW 200505776 A TW200505776 A TW 200505776A
Authority
TW
Taiwan
Prior art keywords
transport system
end assembly
shared load
lock front
provides
Prior art date
Application number
TW093102021A
Other languages
English (en)
Chinese (zh)
Inventor
Gregory Kielczewski
Original Assignee
Aviza Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aviza Tech Inc filed Critical Aviza Tech Inc
Publication of TW200505776A publication Critical patent/TW200505776A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093102021A 2003-01-31 2004-01-29 Transport system having shared load-lock front-end assembly TW200505776A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US44396903P 2003-01-31 2003-01-31

Publications (1)

Publication Number Publication Date
TW200505776A true TW200505776A (en) 2005-02-16

Family

ID=32850814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102021A TW200505776A (en) 2003-01-31 2004-01-29 Transport system having shared load-lock front-end assembly

Country Status (2)

Country Link
TW (1) TW200505776A (fr)
WO (1) WO2004069698A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004058557A1 (de) * 2004-12-03 2006-06-08 Asys Automatic Systems Gmbh & Co. Kg Transfervorrichtung für die Handhabung von flächigen Substraten
DE102005039453B4 (de) 2005-08-18 2007-06-28 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage modularen Aufbaus für flächige Substrate
JP4959457B2 (ja) 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
JPH0756879B2 (ja) * 1988-03-31 1995-06-14 日鉄セミコンダクター株式会社 半導体の無塵化製造装置
US4923584A (en) * 1988-10-31 1990-05-08 Eaton Corporation Sealing apparatus for a vacuum processing system
JPH081923B2 (ja) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 クリーン搬送方法及び装置
JPH0697258A (ja) * 1992-09-17 1994-04-08 Hitachi Ltd 連続真空処理装置
JP3202929B2 (ja) * 1996-09-13 2001-08-27 東京エレクトロン株式会社 処理システム
US6752585B2 (en) * 2001-06-13 2004-06-22 Applied Materials Inc Method and apparatus for transferring a semiconductor substrate

Also Published As

Publication number Publication date
WO2004069698A2 (fr) 2004-08-19
WO2004069698A3 (fr) 2005-03-24

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