WO2004059695A3 - Ultraschallevitation in einer schnellheizanlage für wafer - Google Patents

Ultraschallevitation in einer schnellheizanlage für wafer Download PDF

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Publication number
WO2004059695A3
WO2004059695A3 PCT/EP2003/013388 EP0313388W WO2004059695A3 WO 2004059695 A3 WO2004059695 A3 WO 2004059695A3 EP 0313388 W EP0313388 W EP 0313388W WO 2004059695 A3 WO2004059695 A3 WO 2004059695A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
processing plant
thermal processing
rapid thermal
heating
Prior art date
Application number
PCT/EP2003/013388
Other languages
English (en)
French (fr)
Other versions
WO2004059695A2 (de
Inventor
Klaus Funk
Original Assignee
Mattson Thermal Products Gmbh
Klaus Funk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Thermal Products Gmbh, Klaus Funk filed Critical Mattson Thermal Products Gmbh
Priority to US10/540,614 priority Critical patent/US7098157B2/en
Priority to AU2003293739A priority patent/AU2003293739A1/en
Publication of WO2004059695A2 publication Critical patent/WO2004059695A2/de
Publication of WO2004059695A3 publication Critical patent/WO2004059695A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Um eine rasche Abkühlung von Substraten in einer Schnellheizanlage zu ermöglichen, sieht die vorliegend Erfindung ein Verfahren zum thermischen Behandeln von scheibenförmigen Substraten, insbesondere Halbleiterwafern, in einer Schnellheizanlage mit wenigstens einer vom Substrat beabstandete ersten Strahlungsquelle zum Erwärmen wenigstens eines Substrats vor, bei dem das Substrat in einer Heizphase erwärmt und einer darauf folgenden Kühlphase abgekühlt wird, und das Substrat wenigstens während eines Abschnitts der Kühlphase mit einem Abstand zwischen 50 µm und 1 mm, insbesondere zwischen 150 und 500 µm von einer Heiz/Kühlplatte beabstandet gehalten wird. Um durch Auflageelemente entstehenden Probleme zu eliminieren ist ferner eine Vorrichtung ein Verfahren zum thermischen Behandeln von scheibenförmigen Substraten, insbesondere Halbleiterwafern, in einer Schnellheizanlage vorgesehen, bei der bzw. bei dem wenigstens ein Substrat über eine vom Substrat beabstandete Strahlungsquelle in einer Heizphase erwärmt und einer darauf folgenden Abkühlphase abgekühlt wird und das Substrat während der thermischen Behandlung mittels Ultraschallevitation in der Schnellheizanlage gehalten wird.
PCT/EP2003/013388 2002-12-23 2003-11-28 Ultraschallevitation in einer schnellheizanlage für wafer WO2004059695A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/540,614 US7098157B2 (en) 2002-12-23 2003-11-28 Method and apparatus for thermally treating disk-shaped substrates
AU2003293739A AU2003293739A1 (en) 2002-12-23 2003-11-28 Ultrasonic levitation in a rapid thermal processing plant for wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10260672.2 2002-12-23
DE10260672A DE10260672A1 (de) 2002-12-23 2002-12-23 Verfahren und Vorrichtung zum thermischen Behandeln von scheibenförmigen Substraten

Publications (2)

Publication Number Publication Date
WO2004059695A2 WO2004059695A2 (de) 2004-07-15
WO2004059695A3 true WO2004059695A3 (de) 2005-03-17

Family

ID=32519324

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/013388 WO2004059695A2 (de) 2002-12-23 2003-11-28 Ultraschallevitation in einer schnellheizanlage für wafer

Country Status (4)

Country Link
US (1) US7098157B2 (de)
AU (1) AU2003293739A1 (de)
DE (1) DE10260672A1 (de)
WO (1) WO2004059695A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7378618B1 (en) 2006-12-14 2008-05-27 Applied Materials, Inc. Rapid conductive cooling using a secondary process plane
DE202007019013U1 (de) * 2007-11-01 2010-04-29 Zimmermann & Schilp Handhabungstechnik Gmbh Vorrichtungen zur Inspektion und Bestrahlung von flächigen Materialien
TWI397113B (zh) * 2008-08-29 2013-05-21 Veeco Instr Inc 具有可變熱阻之晶圓載體
US9640412B2 (en) * 2009-11-20 2017-05-02 Applied Materials, Inc. Apparatus and method for enhancing the cool down of radiatively heated substrates
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
US10167571B2 (en) 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
CN107108304B (zh) 2014-11-17 2020-12-22 康宁公司 超音波近场热玻璃的传送和形成
KR101860631B1 (ko) * 2015-04-30 2018-05-23 시바우라 메카트로닉스 가부시끼가이샤 기판 처리 장치 및 기판 처리 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11301832A (ja) * 1998-04-22 1999-11-02 Toshiba Corp 浮揚装置
WO2000061474A1 (de) * 1999-04-14 2000-10-19 Technische Universität München Institut Für Werkzeugmaschinen Und Betriebswissenschaften Vorrichtung zum berührungslosen greifen und positionieren von bauteilen
US20020116836A1 (en) * 1997-07-10 2002-08-29 Ratson Morad Method and apparatus for heating and cooling substrates
WO2002090222A1 (de) * 2001-05-04 2002-11-14 Robert Bosch Gmbh Vorrichtung zum berührungslosen greifen und halten eines gegenstandes

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US102098A (en) * 1870-04-19 Improved french bedstead
US116836A (en) * 1871-07-11 Improvement in locomotive-boilers
JPS59215718A (ja) 1983-05-23 1984-12-05 Kokusai Electric Co Ltd 半導体基板の赤外線熱処理装置
JPS611017A (ja) 1984-06-13 1986-01-07 Kokusai Electric Co Ltd 半導体基板の熱処理装置
DE3608783A1 (de) * 1986-03-15 1987-09-17 Telefunken Electronic Gmbh Gasphasen-epitaxieverfahren und vorrichtung zu seiner durchfuehrung
KR0155545B1 (ko) * 1988-06-27 1998-12-01 고다까 토시오 기판의 열처리 장치
US4962330A (en) * 1989-03-21 1990-10-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Acoustic transducer apparatus with reduced thermal conduction
US5890580A (en) * 1993-07-12 1999-04-06 Kaijo Corporation Object levitating apparatus, object transporting apparatus, and object levitating bearing along with an object levitating process and object transporting process
KR100697468B1 (ko) * 1999-02-04 2007-03-20 스티그 알티피 시스템즈 게엠베하 급속 열 처리 시스템용 냉각 샤워헤드
DE19905524B4 (de) 1999-02-10 2005-03-03 Steag Rtp Systems Gmbh Vorrichtung zum Messen der Temperatur von Substraten
DE19916872C1 (de) * 1999-04-14 2000-04-13 Inst Werkzeugmaschinen Und Bet Vorrichtung zum berührungslosen Lagern von Bauteilen
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DE19936081A1 (de) * 1999-07-30 2001-02-08 Siemens Ag Vorrichtung und Verfahren zum Temperieren eines Mehrschichtkörpers, sowie ein unter Anwendung des Verfahrens hergestellter Mehrschichtkörper
US6259062B1 (en) * 1999-12-03 2001-07-10 Asm America, Inc. Process chamber cooling
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JP4494019B2 (ja) * 2002-03-11 2010-06-30 株式会社アイエイアイ 超音波浮上装置
US6800833B2 (en) * 2002-03-29 2004-10-05 Mariusch Gregor Electromagnetically levitated substrate support

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020116836A1 (en) * 1997-07-10 2002-08-29 Ratson Morad Method and apparatus for heating and cooling substrates
JPH11301832A (ja) * 1998-04-22 1999-11-02 Toshiba Corp 浮揚装置
WO2000061474A1 (de) * 1999-04-14 2000-10-19 Technische Universität München Institut Für Werkzeugmaschinen Und Betriebswissenschaften Vorrichtung zum berührungslosen greifen und positionieren von bauteilen
WO2002090222A1 (de) * 2001-05-04 2002-11-14 Robert Bosch Gmbh Vorrichtung zum berührungslosen greifen und halten eines gegenstandes

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section PQ Week 200003, Derwent World Patents Index; Class P43, AN 2000-033239, XP002277900 *

Also Published As

Publication number Publication date
DE10260672A1 (de) 2004-07-15
AU2003293739A1 (en) 2004-07-22
AU2003293739A8 (en) 2004-07-22
US20060115968A1 (en) 2006-06-01
US7098157B2 (en) 2006-08-29
WO2004059695A2 (de) 2004-07-15

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