WO2004044726A1 - 音響波型接触検出装置 - Google Patents
音響波型接触検出装置 Download PDFInfo
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- WO2004044726A1 WO2004044726A1 PCT/JP2003/014323 JP0314323W WO2004044726A1 WO 2004044726 A1 WO2004044726 A1 WO 2004044726A1 JP 0314323 W JP0314323 W JP 0314323W WO 2004044726 A1 WO2004044726 A1 WO 2004044726A1
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- Prior art keywords
- acoustic wave
- substrate
- lines
- wave
- reflection
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/043—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using propagating acoustic waves
- G06F3/0436—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using propagating acoustic waves in which generating transducers and detecting transducers are attached to a single acoustic waves transmission substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
Definitions
- the present invention relates to an acoustic wave type touch detection device for acoustically detecting a touch position such as a touch panel by an ultrasonic method.
- the acoustic wave type contact detection device using ultrasonic waves is used, for example, in operation screens of personal computers, vending machines for station tickets, copying machines installed at convenience stores, or unmanned terminals of financial institutions etc.
- a transducer including a piezoelectric vibrator (piezo element) disposed on a substrate such as glass is used.
- This transducer is used not only as a means for generating a bulk wave, but also as a sensor for detecting an acoustic wave scattered by a finger or the like touched by a touch panel.
- a wire insulated by an insulation coating was used to connect these transducers and the controller of the control circuit.
- this type of wire has a circular cross section, and when placed on the substrate along the edge of the substrate, it has the problem of being bulky and requiring extra space.
- the peripheral edge of the substrate is covered by a bezel or the like and there is not enough space, it may be difficult to arrange.
- a flat cable such as an FPC (flexible printed circuit) or the like in which a circuit is printed on a flexible substrate may be used (for example, Japanese Patent Application Laid-Open No. 6-324723 (page 2, FIG. 1)).
- the external electromagnetic wave can easily enter the signal circuit (signal line) formed on the FPC, and the electromagnetic wave can be emitted from the signal line to the outside. is there. The reason is that the signal line of the FPC is generally exposed to the outside.
- FPC disclosed in the aforementioned patent document In this case, a shield is formed by covering the FPC with a shield electrode larger than the FPC substrate. This arrangement is expensive because it requires separate parts.
- the present invention has been made in view of the above points, and it is an object of the present invention to provide an inexpensive acoustic wave contact detection device which is not bulky when wired on a substrate and is excellent in EMI resistance (electromagnetic interference). To aim. Disclosure of the invention
- the acoustic wave type contact detection device comprises a substrate having a surface on which the acoustic wave propagates, an acoustic wave generation means, a reflection array for propagating the generated acoustic wave along the substrate surface, and
- An acoustic wave type contact detection device comprising: detection means for detecting a change in acoustic wave due to contact of an object; and a controller as a control means, wherein at least one of the acoustic wave generation means and the detection means and the controller are flexible flat wiring It is characterized in that it is connected by (Flexible Flat Wiring), and the flexible flat wiring has a wiring pattern in which a ground line is disposed on at least one side of the signal line.
- planar wiring as used herein includes F PC and F FC.
- the flexible planar wiring can be configured to have a signal line group in which a plurality of signal lines are arranged in parallel and to have a wiring pattern in which ground lines are arranged on both sides of the signal line group.
- the acoustic wave referred to herein includes, in addition to the surface acoustic wave propagating on the surface of the substrate, an ultrasonic wave propagating along the surface of the substrate in the thin substrate.
- the acoustic wave generation means can include a mode conversion element and an ultrasonic transducer.
- the mode conversion element can be composed of a plurality of parallel ridges integrally formed on the substrate.
- the detection means can be a converter.
- the transducer may be of the type adhered to the back of the substrate, or it may be a wedge-shaped transducer attached to one side of the prism of the triangular prism adhered to the substrate surface.
- the acoustic wave type contact detection device of the present invention at least one of the acoustic wave generation means and the detection means is connected to the controller by flexible flat wiring. And this flexible flat wiring has a ground line on at least one side of the signal line. Since the wiring pattern is disposed, the signal line is electromagnetically shielded (shielded) by the ground line, and an acoustic wave type touch detection device excellent in EMI resistance can be obtained. In addition, it can be made inexpensive because no additional structure for shielding is required.
- the flexible flat wiring has a signal line group in which a plurality of signal lines are arranged in parallel, and a wiring pattern in which the ground lines are arranged on both sides of the signal line group, Shielding to improve EMI resistance. Also. This makes it possible to miniaturize flexible flat wiring. Since the price of F PC is approximately proportional to the area, it can be made inexpensive by downsizing.
- FIG. 1 is a front view of a touch panel used in the acoustic wave type touch detection device of the present invention.
- FIG. 2 is a front view showing an F P C bonded to a substrate.
- Fig. 3 is a schematic plan view showing the whole of FPC.
- FIG. 4 is a partial enlarged view of F P C in which a portion indicated by B in FIG. 3 is enlarged.
- FIG. 5 is a front view of a reflective array corresponding to the reflective array shown in FIG.
- FIG. 6 is a front view showing a diffusion grating corresponding to FIG. 1 together with a mode conversion element.
- FIG. 7 is a partially enlarged view showing the diffusion grating together with a reflection array.
- Fig. 8 is a partially enlarged view showing the diffusion grating with the reflection array.
- Fig. 9 is an enlarged view showing a modification of the diffusion grating.
- FIG. 10 is a front view showing the relative positional relationship between the diffusion grating and the reflection array.
- FIG. 11 is a partial schematic enlarged view of the substrate of FIG. 1 as viewed from the direction of arrow A.
- BEST MODE FOR CARRYING OUT THE INVENTION A preferred embodiment of an acoustic wave type touch detection device (hereinafter simply referred to as device) of the present invention will be described with reference to the accompanying drawings.
- FIG. 1 is a front view of a touch panel 3 used in the device 1.
- the touch panel 3 includes a substrate 2 formed of a rectangular glass plate, an FPC (flexible printed circuit) 4 attached to the substrate 2, and the FPC 4 and the electricity. It is composed of a control unit (controller) 6 which is linked in a pneumatic manner.
- the FPC 4 is branched into a branch line 4 a along the X axis direction indicated by the arrow X in the horizontal direction of the substrate 2, ie, in the figure, and a branch line 4 b along the Y axis direction indicated by the arrow Y, which is orthogonal to the X axis.
- Transducers (bulk wave generating means) 8 and 10 for generating ultrasonic waves and transducers (detection means) 12 and 14 serving as sensors are attached to F P C 4. Further, on the front surface of the substrate 2, that is, on the front side in FIG.
- a reflective array 18 comprising a large number of oblique inclined lines 16 along the Y axis and a large number of inclined Reflective arrays 22 consisting of lines 20 are each formed near the side edge 44 of the substrate 2. Further, along the X axis, a reflective array 2 8 comprising a large number of inclined lines 2 6 near the upper edge 24 of the substrate 2 and a reflective array 3 comprising a large number of inclined lines 3 0 opposite to this reflective array 2 8 2 are formed near the lower edge 45 of the substrate 2.
- the patterns of these reflection arrays 18, 22, 28 and 32 are described in Japanese Patent Application Laid-Open Nos. 6 1 2 3 9 3 2 2 and 2 0 1 1 0 14 4 respectively. It is disclosed.
- the reflection arrays 18, 22, 28 and 32 are collectively referred to as a reflection array 33.
- the acoustic wave is reflected by the reflection array 33 to propagate on the surface of the substrate 2.
- FIG. 11 is a partially schematic enlarged view of the substrate 2 of FIG. 1 as viewed in the direction of arrow A.
- the mode conversion element 80 in FIG. 11 is formed on the substrate 2 by sintering a glass paste, and is composed of a plurality of parallel ridges 80 a separated from each other.
- the ridges 80 a shown in FIG. 11 actually extend in the direction orthogonal to the paper surface.
- the width of the ridges 80 a is set to about 400 micrometers, and the height is set to about 35 micrometers or more.
- the gap is formed such that a surface acoustic wave is generated just beside the protrusion 80 a.
- a converter 10 is bonded to the substrate 2 and electrically connected to a branch 4b of the FPC 4 by a solder 5.
- Other mode conversion elements 7 8, 8 2 and 8 4 have the same configuration.
- the mode conversion elements (sound wave generation means) shown by 7 8 8 0 are bulks generated from the transmitters 8 1, 10 at the transmission side. It converts waves into surface elastic waves. However, the mode conversion elements 82 and 84 convert surface acoustic waves (acoustic waves) propagated on the surface of the substrate 2 back into bulk waves. The ultrasonic vibration (Vanolek wave) of about 5.5 MH z. Emitted from the converter 10 travels from the back side of the substrate 2 to the mode conversion element 80 located on the surface of the substrate 2 as a mode conversion.
- the surface acoustic wave is converted by the element 80 and propagates (reflects) in the direction of the reflection array 32 at right angles to the ridges 80 a of the mode conversion element 80.
- the reflection array 32 is then reflected by the inward inclined many inclined lines 30 and propagates to the surface of the substrate 2 toward the reflection array 28, and the reflection array 28 is inclined inward lines 26 Reaching
- the mode conversion element 7 8, 80 the bulk wave left unconverted to the surface acoustic wave is not radiated in a specific direction, and propagates in all directions around the mode conversion element 7 8, 8 0. .
- the mode conversion element 78, 80 is composed of the above-mentioned plurality of ridges and basically generates surface waves in the direction orthogonal to these ridges, but a small surface wave in an unintended direction Is known to occur. This surface wave also becomes an unnecessary wave that can interfere with signal detection. When these unwanted waves reach the transducers 1 2 and 1 4, noise signals will be generated in the transducers 1 2 and 1 4.
- the surface acoustic wave reaching the reflection array 28 is further reflected and propagated toward the mode conversion element 84.
- the surface inertia wave that has reached the mode conversion element 84 is converted to a bulk wave by the mode conversion element 84 and its vibration is transmitted to the transducer 14 on the receiving side on the back side of the substrate 2 serving as a sensor. Are converted by the converter 14 into electrical signals.
- the ultrasonic vibration (bulk wave) emitted from the transducer 8 is also converted into a surface acoustic wave by the mode conversion element 78 and passes through the reflection array 18 and the reflection array 22 and enters the mode conversion element 82. Be done.
- the surface acoustic wave is converted into a balta wave by this mode conversion element 82 and is propagated to the converter 12 serving as a sensor and converted into an electrical signal. Be done.
- the surface acoustic wave is reflected by each one of the inclined lines 16, 20, 26, 30 in the reflection array 33, but in one inclined line, 0.5% to 1 ° / ° of the surface acoustic wave reached. 0 is reflected, the others are transmitted toward the adjacent subsequent inclined lines, and are sequentially reflected by the subsequent inclined lines.
- an unnecessary wave scattering means that is, a diffusion grating for scattering and eliminating unnecessary waves to reduce the noise described above is formed on the surface of the substrate 2.
- This diffusion grating consists of a rectangular portion indicated by 34, 36, 38 in FIG. 1 and a diffusion grating 43 consisting of inclined lines 40, 42 along the upper edge 24 and inclined lines 46, 48 along the side edge 44. Includes a diffusion grating 49.
- These inclined lines 40, 42, 46, 48 constitute a second reflection array having a function different from that of the reflection arrays 18, 22, 28, 32 described above.
- a second reflective array is also configured in the diffusion gratings 34, 36, 38 (Fig. 7). The details of these diffusion gratings 34, 36, 38, 43, 49 will be described later.
- the diffusion grid is shown as 50 in general.
- FIG. 2 is a front view showing the F PC 4 bonded to the substrate 2.
- the F PC 4 is bonded to the back surface of the substrate 2 but is shown as a solid line in FIG. 2 for convenience.
- the reflection array 33 and the diffusion grating 50 are omitted.
- FIG. 3 is a schematic plan view showing the entire F PC 4.
- FIG. 4 is a partially enlarged view of F P C 4 in which a portion indicated by B in FIG. 3 is enlarged.
- F PC 4 shown in FIGS. 3 and 4 corresponds to the state in which F PC 4 is viewed from the back surface of the substrate 2 in FIG.
- the FPC 4 is a converter 1 serving as a sensor at one end. 2 and 14 have corresponding electrodes 52 and 54 respectively. These electrodes 52 and 54 are soldered from above onto the transducers 12 and 14 bonded to the substrate 2 as described above, conductive adhesive such as silver paste, anisotropic conductive adhesive, etc. Connected by That is, the transducers 1 2 and 1 4 are located between the F PC 4 and the back surface of the substrate 2.
- the FPC 4 is composed of the aforementioned branch lines 4 a and 4 b and a connecting line 4 c connected to the controller 6.
- the connecting line 4c and the branch line 4a have the same length and are integrally formed in a band (Fig. 3).
- the connecting line 4c and the branch line 4a can be separated by a mesh eye 56 formed longitudinally therebetween.
- An electrode 58 to which the converter 8 is connected is formed at the other end of the branch line 4 a, and an electrode 6 connected to the controller 6 is formed at the other end of the connecting line 4 c.
- an electrode 62 connected to the converter 10 is formed at the other end of the branch line 4b (FIG. 3).
- the printed wiring 64 of the connecting line 4c connected to the controller 6 is the printed wiring 64a, 64b, 64c, 64d, 64e, 64f, 64g, 64h, 10 i of 64 i, 64 j are formed. What is important here is that four signal lines 64 d to 64 g as receiving lines connected to the transducers 12 and 14 as sensors constitute a signal line group. Printed wiring 64 c and 64 h for ground (ground) are arranged on both sides.
- the printed wiring 64 b, 64 i to be signal lines connected to the transmitters 8, 10 respectively are disposed, and further outside the printed wiring 64 c, 64 h.
- the printed wiring 64 a and 64 j for ground are arranged respectively. This means that the printed wiring 64 4 d to 64 g to be the receiving line (signal line) is surrounded by the ground lines 64 c and 64 h, and the printed wiring 64 b and 64 i to be the transmitting line (signal line)
- Ground lines 64 a, 64 c and 64 h, 64 j indicate that a shield is formed. This relationship is also maintained at branch lines 4 a and 4 b.
- the signal line group composed of the printed wiring 64 b, 64 d, 64 e, 64 f, 64 g, 64 i becomes less susceptible to the influence of the electromagnetic wave from the outside, and conversely, the electromagnetic wave is reversed. It has the effect of making it difficult to generate With the above configuration, the EMI resistance is particularly effective when the FPC 4 is disposed along the substrate 2 to extend the reception line for a long time. It will be effective.
- reference numerals 6 6 and 6 8 denote bending lines of the branch line 4 b.
- the electrode 6 2 FIG. 3
- F P C 4 is bonded and fixed to the substrate 2 with an adhesive (not shown) or the like.
- FIG. 5 shows the arrangement of only the reflection array 33 described above.
- FIG. 5 is a front view of a reflective array 33 corresponding to the reflective array 33 shown in FIG.
- Other unnecessary wave scattering means diffusion gratings 34, 36, 38, etc. are omitted.
- Each of the reflection arrays 18, 22 2, 28 3, and 32 inclined lines 16, 20, 26, and 30 have an inclination of 45 °, and the reflection arrays facing the surface acoustic waves are provided. It is designed to reflect towards.
- These reflective arrays 33 are formed by printing a paste of fine powder of lead glass in paste form on the surface of the substrate 2 by screen printing or the like, and sintering it at about 500 ° C. . Note that the corner of the substrate 2 is partially shown at 25 in the figure.
- a UV curable organic ink or an organic ink to which a filler made of metal powder for improving the reflectance is added may be used as a material of the reflective array.
- the sloped lines 1 6, 20, 2 6, 3 0 are narrower and denser as the distance from the transmitting side transducer 8, 1 0 is higher.
- the sloped lines 1, 6, 2 0, 2 6, As the intensity of the surface acoustic wave is attenuated as it passes through 30, the amount of this attenuation is compensated to propagate the surface acoustic wave to the surface of the substrate 2 on average.
- the reflection arrays 2 2 and 2 8 are disposed slightly inward from the upper edge 24 and the side edge 4 4 (FIG. 1) of the substrate 2. The reason for this is to make it possible to arrange the slant lines 40, 42, 46, 48 of the diffusion grating 50, which will be described later, outside the inclined lines.
- FIG. 6 is a front view showing a diffusion grating 50 corresponding to FIG. 1 together with mode conversion elements 7 8, 8 0, 8 2 and 8 4.
- Inclined lines 40 and 42 constituting the second reflection array described above are formed at mutually opposite angles near the upper edge 24 of the substrate 2. And, the angle is formed near the center of the substrate 2 vertically, and It gradually changes to a smaller angle as it goes to the end of 2.
- the other inclined lines 46 and 48 constituting the second reflective array are similarly formed to have opposite inclinations to each other, and their angles gradually change. The reason is that the unwanted waves are diffused in various directions, ie, irregularly reflected, without being reflected in the same direction.
- These inclined lines 40, 42, 46, 48 are located at the portions to which conventional tapes and the like were attached. That is, the inclined lines 40, 42, 46, 48 are portions formed to replace the tape.
- the unwanted wave that has reached this area is irregularly reflected by these inclined lines 40, 42, 46 and 48 so as not to reach the transducers 12 and 14 on the receiving side.
- the attenuation of ultrasonic vibrational energy depends on the frequency of the ultrasonic wave, the vibration mode and the type of glass. For a surface acoustic wave of about 5.5 MHz in a typical soda lime glass, when the substrate 2 propagates 40 cm, its intensity is attenuated to about 1/10. Therefore, the diffusely reflected unwanted wave is rapidly attenuated and disappears while repeating reflection on the substrate 2.
- the rectangular diffusion gratings 34, 36, 38 are formed by gathering a plurality of mutually separated ridges or inclined lines having angles different from 45 ° or 145 °. The shape will be described with reference to FIGS. 7 and 8.
- Figures 7 and 8 are partial enlargements showing the diffusion gratings 36, 38, respectively, together with the reflective array.
- a diffusion grating 36 is shown in FIG. 7 and the slanted lines 36a are different in angle as compared to the respective slanted lines 16 and 30 of the reflection arrays 18 and 32. Is clearly shown.
- FIG. 8 also shows a diffusion grating 38 having a steep inclined line 38a.
- diffusion gratings 36 and 38 are also for irregularly reflecting the unwanted waves propagating on the surface of the substrate 2 outward at angles other than 45 ° or ⁇ 45 ° and eliminating them.
- the diffusion grating 34 has the same shape and function but is not shown enlarged.
- the slanting lines of the diffusion grating 34 and the slanting lines 36a, 38a of the diffusion gratings 36, 38 may be parallel within the same diffusion grating, or the angles may be gradually different.
- the diffusion gratings 3 4 and 3 8 also have a function to cut off a path through which surface acoustic waves propagating from a predetermined direction reach the transducers 1 2 and 1 4 on the receiving side.
- diffusion grids 50 are printed on the substrate 2 as an ink in the form of a paste of fine powder of lead glass in the same manner as the reflection array 33. Therefore, When forming the reflective array 33, it can be printed at the same time, improving productivity and reducing manufacturing costs.
- the inclined lines 3 6 a and 3 8 a of the illustrated diffusion gratings 3 6 and 3 8 consist of a plurality of protrusions, but the invention is not necessarily limited to the protrusions and various modifications can be considered. .
- This modification is shown in FIG. FIG. 9 is an enlarged view showing a modification of the diffusion grating.
- the diffusion grating 51 is constituted by a set of a large number of projections 51 a having a diamond shape in plan view.
- the unnecessary wave that has reached the diffusion grating 51 is designed to be attenuated while repeating reflections between the protrusions 5 1 a in the region formed by the protrusions 5 1 a.
- the shape of the projection is not limited to the rhombus, and may be any shape such as a rectangle, a polygon such as a triangle, or an ellipse in a plan view.
- FIG. 10 shows the relative positional relationship between the diffusion grating 50 formed on the surface of the substrate 2 and the reflection array 3 3 in a front view. It is clearly shown that the inclined lines 40, 42 are located outside the reflective array 28 and the inclined lines 46, 48 are located outside the reflective array 22. Diffuse gratings 34, 36, 38 are acoustic waves (surface acoustic waves) transmitted through the reflection array 33 without being reflected, immediately after transmission, in a direction different from that reflected by the reflection array 33. It is arranged to be reflected.
- surface acoustic waves generated by the transducer 8 and the mode conversion element 78 are reflected toward the reflective array 22 while passing through the reflective array 18.
- the surface acoustic waves transmitted through the reflection array 18 without reaching the reflection array 18 reach the diffusion grating 36.
- the diffusion grating 36 functions to reflect the surface elastic wave toward the outside of the substrate 2 as shown in FIG. That is, the ultrasonic vibration causing noise is prevented from reaching the transducer 12 on the receiving side by reflecting the light in the reverse direction to the original reflection direction.
- inclined lines 40, 42, 46 and 48 of the diffusion grating 50 formed along the edge of the substrate 2 diffusely reflect and attenuate the balta wave propagating on the surface of the substrate 2. Is configured. Usually, bulk waves are converted to surface acoustic waves by the mode conversion elements 78 and 80, but bulk waves remaining after 100% conversion are propagated out of a predetermined direction. Used to dampen bulk waves. In addition, when converted to surface acoustic waves by the mode conversion elements 7 8 and 80, surface acoustic waves propagating from a predetermined direction are also inclined lines 40 0, 4 2 4 6 4 8 Is diffusely reflected so as to be discrete in various directions. Due to this discrete reflection, the possibility that unnecessary ultrasonic vibrations reach the transducers 12 and 14 on the receiving side and become noise is reduced.
- Ilka's picture 82 is a slant line 40, 40, 46, 48. And the same printing force as this picture 82 is also effective for noise reduction.
- These pictures 82 have outer peripheries formed by curved lines, and the above-mentioned bulk waves or surface elastic waves reaching the outer peripheries are reflected and attenuated in various directions.
- This figure may be any picture, as long as the outer circumference is constituted by a curved surface, or the outer circumference has an angle for irregularly reflecting unwanted waves in various directions, or It may be a pattern.
- the diffusion grating 50 may be formed by etching using hydrofluoric acid or the like, or may be formed by chemical or physical removal processing by laser, sand blast, cutting or the like. In other words, instead of forming the protrusion, a groove may be formed.
- the present embodiment has described the case of using the so-called grating type surface acoustic wave generating means having the mode conversion elements 78, 80, 82, 84, the present invention is not limited to this embodiment.
- the invention can also be applied to an acoustic wave type contact detection system of a type that generates surface acoustic waves using a wedge-shaped transducer (not shown) using an acrylic prism (not shown).
- the present invention can be applied to an acoustic wave contact detection system of a type using a pair of comb-shaped electrodes formed on an ultrasonic transducer without a grating or a wedge.
- F P C 4 used in the present invention may be adhered to the substrate 2 with an arbitrary adhesive.
- the adhesion of the piezoelectric vibrator is preferably a UV-curable adhesive. The reason is that the transducers 8, 8 0, 8 2, 8 4 for the mode conversion elements 7, 8 10, 1 2, and 1 4 have provisional temporary positioning to confirm generation of the optimum surface acoustic wave. After that, it can be adhered by irradiation with ultraviolet light.
- the unnecessary wave scattering means may be a system for producing and attenuating irregular reflection as described above.
- the two receiving side transducers 1 2 and 1 4 are disposed close to each other.
- the transmitting side transducers 8 and 10 are replaced with each other and the receiving side transducer 1 2 and 14 may be spaced apart from each other.
- the noise picked up by the other can be suppressed.
- the electric path from the controller 6 to the transmission side transducers 8 and 10 can be shortened, it is possible to suppress the unnecessary radiation from this electric path, that is, the radiation of the electromagnetic wave.
- an FFC that is, a flexible flat cable may be used instead of the FPC.
- the transducers 8, 10, 12, 14 are electrically connected to the conductors of the FFC.
- the FFC is attached to the substrate 2 and attached to the substrate 2 as in the case of the FPC 4.
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Acoustics & Sound (AREA)
- Position Input By Displaying (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03811119A EP1562104A4 (en) | 2002-11-13 | 2003-11-11 | ACOUSTIC WAVE TYPE CONTACT DETECTOR |
AU2003301927A AU2003301927A1 (en) | 2002-11-13 | 2003-11-11 | Acoustic wave type contsct detector |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002329478A JP2004163262A (ja) | 2002-11-13 | 2002-11-13 | 音響波型接触検出装置 |
JP2002-329478 | 2002-11-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004044726A1 true WO2004044726A1 (ja) | 2004-05-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/014323 WO2004044726A1 (ja) | 2002-11-13 | 2003-11-11 | 音響波型接触検出装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6948371B2 (ja) |
EP (1) | EP1562104A4 (ja) |
JP (1) | JP2004163262A (ja) |
KR (1) | KR20050086550A (ja) |
CN (1) | CN1327320C (ja) |
AU (1) | AU2003301927A1 (ja) |
TW (1) | TWI291014B (ja) |
WO (1) | WO2004044726A1 (ja) |
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- 2003-11-11 WO PCT/JP2003/014323 patent/WO2004044726A1/ja active Application Filing
- 2003-11-11 CN CNB2003801029736A patent/CN1327320C/zh not_active Expired - Fee Related
- 2003-11-11 KR KR1020057008460A patent/KR20050086550A/ko not_active Application Discontinuation
- 2003-11-11 AU AU2003301927A patent/AU2003301927A1/en not_active Abandoned
- 2003-11-12 US US10/712,753 patent/US6948371B2/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
AU2003301927A1 (en) | 2004-06-03 |
US20050035685A1 (en) | 2005-02-17 |
TWI291014B (en) | 2007-12-11 |
KR20050086550A (ko) | 2005-08-30 |
JP2004163262A (ja) | 2004-06-10 |
CN1327320C (zh) | 2007-07-18 |
US6948371B2 (en) | 2005-09-27 |
EP1562104A4 (en) | 2005-11-09 |
CN1711518A (zh) | 2005-12-21 |
EP1562104A1 (en) | 2005-08-10 |
TW200427966A (en) | 2004-12-16 |
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