WO2004043126A1 - Method for moving at least two elements of a placement machine as well as such a placement machine - Google Patents
Method for moving at least two elements of a placement machine as well as such a placement machine Download PDFInfo
- Publication number
- WO2004043126A1 WO2004043126A1 PCT/IB2003/004928 IB0304928W WO2004043126A1 WO 2004043126 A1 WO2004043126 A1 WO 2004043126A1 IB 0304928 W IB0304928 W IB 0304928W WO 2004043126 A1 WO2004043126 A1 WO 2004043126A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- moved
- placement machine
- component
- placement
- guide
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
Definitions
- the invention relates to a method for moving at least two elements of a placement machine in and opposite to a predetermined direction, in which the second element is moved by means of the first element.
- the invention also relates to a placement machine suitable for executing such a method.
- an arm forming a first element is movable in and opposite to a Y- direction.
- a slide forming a second element which slide is moved along with the arm when the latter is moved in Y-direction.
- the slide is also movable in a transverse direction extending transversely to the predetermined direction and denoted X.
- the slide comprises a component placement element by means of which a component can be picked up from a pick up plate and subsequently be placed on a desired position onto the substrate.
- the arm, the slide and the component placement element are moved in common in or opposite to the Y-direction and the X-direction.
- the component pick-up element should be temporarily stopped to enable it to pick up and place the component respectively.
- the relatively heavy ami and the component placement element are to be moved as fast as possible between the pick-up position and the desired position on the substrate, which leads to relatively large acceleration and deceleration forces. Since, in addition, the accuracy with which a relatively light component is picked up or moved, respectively, should be relatively high, stringent requirements are made on the driving and guiding of the arm.
- the first element together with the second element to a desired position in a relatively fast manner.
- the second element is moved in opposite direction to the first element.
- the second element undergoes a compound move that is determined by the move of the first element in the predetermined direction and the move relative to the second element relative to the first element in the direction opposite to predetermined direction, or vice versa.
- the compound move of the second element may be relatively small or even zero, so that the second element is brought to a standstill without the need for the first element to be brought to a standstill as well, so that there will not be any large deceleration forces on the first element.
- An embodiment of the method according to the invention is characterized in that the first element is moved in the predetermined direction over a distance that is substantially equal to the distance over which the second element is moved in opposite direction.
- the resulting or compound distance over which the second element is moved will then be substantially equal to zero. This makes it possible for the first element to be moved, whereas the second element remains stopped.
- a further embodiment of the method according to the invention is characterized in that the first element is moved in the predetermined direction with a speed that is substantially equal to the speed with which the second element is moved in opposite direction. In this way the resulting speed with which the second element is moved is substantially equal to zero, whereas the speed of the first element need not be adjusted.
- a further embodiment of the method according to the invention is characterized in that the second element is also moved in a transverse direction extending transversely to the predetermined direction. In this way the second element can be moved in a plane extending parallel to the predetermined direction and transverse direction.
- the second element comprises a component placement element which relative to the second element is moved in a placement direction extending transversely to the predetermined direction.
- a component placement element By means of a component placement element it is possible for a component to be moved accurately and fast to a desired position by means of the placement machine.
- the second element comprises an imaging device by which images are made.
- the imaging device it is possible to make images of a desired position to which the second element is to be moved, which action is preferably carried out while the second element is being moved. This enables the second element to be driven relative to the first element so that the second element is accurately moved close to the desired position.
- the invention is also based on a placement machine that avoids the disadvantages of the known machine.
- the placement machine according to the invention therefore comprises at least two elements that are movable in and opposite to a predetermined direction, the second element being movable with the aid of the first element, both the first element and the second element further being movable relative to each other in and opposite to a predetermined direction.
- Fig. 1 is a plan view of a component placement machine that has a placement machine according to the invention
- Fig. 2 gives a diagrammatic representation of a placement machine according to the invention, in which the second element is located close to the desired placement position
- Fig. 3 shows the placement machine shown in Fig. 2 in which the second element is located near a pick-up position.
- Fig. 1 shows a component placement machine 1 according to the invention, which comprises an elongated frame 2 over which substrate 3 can be moved in or opposite to a direction indicated by arrow Pi.
- the direction indicated by arrow Pj extends in parallel with the X-direction.
- the component placement machine 1 further comprises two guide rails 4,5 parallel with each other and extending in Y-direction, transversely to the X-direction.
- the guide rails 4,5 are located over the frame 2.
- the guides 7,8 each comprise a motor by which the guides 7,8 are movable over the guide rails 4 in and opposite to the directions indicated by the arrow P 2 or P 3 , respectively.
- a guide 9 is movable over the arm 6 by means of a motor in and opposite to the X-direction indicated by the a ⁇ ow P 4 .
- the guide 9 comprises at least one component placement machine which in Fig. 1 is hidden from view by the guide 9 and the arm 6.
- the component placement machine 1 further comprises a number of component feeding devices 10 arranged on both sides of the frame 2 between the guide rails 4,5.
- Substrates 3 are moved in steps in the direction indicated by the arrow P] over the frame 2, with components being positioned on the substrates 3 in the area between the guide rails 4,5 by means of the component placement element.
- the guide 9 is moved over the arm 6 while at the same time the guides 7,8 are moved over the guide rails 4,5, so that a desired component can be picked up from the component feeding devices 10 by means of the component placement element.
- the component placement element is taken to a desired position above the substrate 3 via the guides 7,8 after which the component is positioned in the Z direction at the desired position on the substrate by means of the component placement element.
- the mass of the component to be placed is often less than 1 gram.
- the total mass of the guides 7,8, the arm 6 and the guide 9 is for example 65 to 80 kg. During the move in for example Y-direction this whole mass is constantly to be moved to and fro between the component feeding devices 10 and the desired position on the substrate 3.
- the arm 6 is to be moved to and fro relatively fast. It should also be possible to quickly bring the arm 6 to a standstill and set in motion again.
- relatively large acceleration and deceleration forces show up during this action.
- vibrations occur during this action which are first to be dampened to achieve the desired positioning accuracy, which takes extra time.
- a guide 7 that is movable over a guide rail 4 in and opposite to the Y-direction indicated by the arrow P 2 .
- the guide rail 14 extends in parallel with the guide rail 4.
- the guide 13 can be moved in and opposite to a Y-direction indicated by arrow P 5 .
- the direction indicated by arrow P 5 extends in parallel with the direction indicated by arrow P 2 .
- a component 15 has already been fed from the component feeding device 10 by means of the component placement element 12.
- Component 15 is to be placed at a desired position on the substrate 3.
- the guide 7 together with the connected guide 13 is moved in the direction indicated by arrow P 2 at a relatively high speed.
- the guide 13 is moved by means of a regulator in the direction indicated by arrow P 5 , opposite to the direction indicated by arrow P 2 .
- the placement of the guide 13 in the direction indicated by the arrow P5 is regulated such that the component 15 is immobile relative to the substrates 3 above the desired position on the substrate 3 and can be placed on the substrate 3.
- Fig. 3 shows the placement machine 11 represented in Fig. 2 when a component 15 is being picked up from a component feeding device 10.
- the guide 7 is first moved in a direction opposite to the arrow P 2 from a position above the substrate 3 to a position located above the component feeding device 10. Subsequently, the guide 7 is to be moved again in the direction indicated by the arrow P 2 to the position located above the substrate 3. This reciprocating move of the guide 7 is indicated by the arrow P 6 .
- the guide 13 is moved in the direction indicated by the arrow P7 over the guide rail 14, the superposed move of the component placement element 12 being such that the component placement element 12 stands still for a moment at the desired position above the component feeding device 10 to be able to pick up a component 15 from the component feeding device 10.
- the guide 7 can be slowed down relatively slowly during the pick up and accelerated again to be able to change direction of move so that there are relatively small deceleration and acceleration forces.
- the relatively light guide 13 can undergo relatively large decelerations and accelerations which results in relatively small deceleration and acceleration forces, as a result of the relatively light weight.
- the guide rail 14 can be connected with the guide 9 for example on a side of the arm 6 facing the frame 2.
- Fig. 1 gives a diagrammatic view of such a guide rail 14 having reference numeral 14'.
- the guide 7 can be moved with a speed of 2 meters per second, the time needed for picking up or placing a component being for example 100ms.
- the length of the guide rail 14 should then be about 200mm to make a sufficient move of the guide 13 possible.
- the guide 13 not only with a component placement element 12 but also with a camera (16) by means of which a pick-up position on the component feeding device 10 can be observed as well as a desired placement position on the substrate 3 prior to picking up and placing a component 15 respectively. Based on the images perceived by the camera (16), an accurate driving of the guide 13 relative to the guide rail 14 can be realized. It is also possible for the camera to be installed on a separate slide 13 that can be moved over a separate guide rail 14.
- the component placement element 12 for example comprises a pick-up tube that can be moved relative to the guide 13 in and opposite to the Z direction extending transversely to the X and Y-direction.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004549478A JP4326474B2 (en) | 2002-11-08 | 2003-11-04 | Method for moving at least two elements of a positioning device and such positioning device |
AU2003274570A AU2003274570A1 (en) | 2002-11-08 | 2003-11-04 | Method for moving at least two elements of a placement machine as well as such a placement machine |
EP03758545A EP1559302A1 (en) | 2002-11-08 | 2003-11-04 | Method for moving at least two elements of a placement machine as well as such a placement machine |
US10/534,109 US7716822B2 (en) | 2002-11-08 | 2003-11-04 | Method of moving at least two elements of a placement machine |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02079684 | 2002-11-08 | ||
EP02079684.3 | 2002-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004043126A1 true WO2004043126A1 (en) | 2004-05-21 |
Family
ID=32309423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2003/004928 WO2004043126A1 (en) | 2002-11-08 | 2003-11-04 | Method for moving at least two elements of a placement machine as well as such a placement machine |
Country Status (5)
Country | Link |
---|---|
US (1) | US7716822B2 (en) |
EP (1) | EP1559302A1 (en) |
JP (1) | JP4326474B2 (en) |
AU (1) | AU2003274570A1 (en) |
WO (1) | WO2004043126A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2009979A2 (en) * | 2007-06-26 | 2008-12-31 | Siemens Aktiengesellschaft | Device and method for populating substrates with components |
CN110089209A (en) * | 2016-09-29 | 2019-08-02 | 安必昂公司 | Component placement device and its driving method |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
EP2343165A1 (en) * | 2010-01-07 | 2011-07-13 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | System and method for picking and placement of chip dies |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6397456B1 (en) * | 1996-10-14 | 2002-06-04 | Mydata Automation Ab | Method and a machine for automatic mounting of components and a pick-up head for such a machine |
Family Cites Families (27)
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US1467504A (en) * | 1922-06-12 | 1923-09-11 | Sabarros Louis | Apparatus for the mechanical handling of goods |
US3822801A (en) * | 1972-11-17 | 1974-07-09 | W Morgan | Vehicle rack |
JPS60171799A (en) * | 1984-02-17 | 1985-09-05 | 松下電器産業株式会社 | Device for automatically mounting electronic part |
JPS62114289A (en) * | 1985-11-14 | 1987-05-26 | 松下電器産業株式会社 | Mounting of electronic parts and apparatus for the same |
JPS62292328A (en) * | 1986-06-12 | 1987-12-19 | Matsushita Electric Ind Co Ltd | Method for attaching parts |
JP2503082B2 (en) * | 1989-09-05 | 1996-06-05 | 富士機械製造株式会社 | Electronic component mounting device |
JPH0821790B2 (en) * | 1990-02-15 | 1996-03-04 | 松下電器産業株式会社 | Rotary head electronic component mounting equipment |
US5224636A (en) * | 1992-03-13 | 1993-07-06 | Bounds Dayne L | Utility rack |
US5645292A (en) * | 1995-08-29 | 1997-07-08 | Mcwilliams; James Scott | ATV trailer |
JP3196626B2 (en) * | 1995-12-26 | 2001-08-06 | ソニー株式会社 | Component mounting method |
SG52900A1 (en) * | 1996-01-08 | 1998-09-28 | Matsushita Electric Ind Co Ltd | Mounting apparatus of electronic components and mounting methods of the same |
US5662451A (en) * | 1996-03-25 | 1997-09-02 | Pa-Paw's, Llc | Game hoist |
JPH10229298A (en) | 1997-02-17 | 1998-08-25 | Matsushita Electric Ind Co Ltd | Electronic part mounting equipment |
US5911556A (en) * | 1997-07-31 | 1999-06-15 | Caldwell; Thomas Marion | All-terrain vehicle deer caddy |
US5964565A (en) * | 1998-04-23 | 1999-10-12 | Skotzky; Harvey Steven | Deer lifting device for all terrain vehicles |
JP4108840B2 (en) | 1998-09-22 | 2008-06-25 | 松下電器産業株式会社 | Operation control method of electronic component mounting apparatus |
JP3983394B2 (en) * | 1998-11-09 | 2007-09-26 | 株式会社ルネサステクノロジ | Geometry processor |
JP4480840B2 (en) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | Component mounting apparatus and component mounting method |
US6461095B1 (en) * | 2000-08-11 | 2002-10-08 | David P. Puska | ATV lift and carry apparatus |
US6869265B2 (en) * | 2000-11-06 | 2005-03-22 | Jack L. Smith | Lift device |
DE10064108A1 (en) * | 2000-12-21 | 2002-07-18 | Siemens Production & Logistics | Assembly head and assembly system for an assembly device for assembling components |
US6589004B2 (en) * | 2001-05-01 | 2003-07-08 | Dennis W. Reed | All terrain vehicle lift |
US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
US6638001B1 (en) * | 2002-02-11 | 2003-10-28 | Mckinley Perry A. | Game lifting apparatus |
US6769858B1 (en) * | 2002-05-09 | 2004-08-03 | Adron E. Butler | Method and apparatus for loading cargo on an ATV |
DE10228555B4 (en) * | 2002-06-26 | 2004-07-15 | Siemens Ag | Device for fetching IC's from a wafer |
TW200419640A (en) * | 2003-02-25 | 2004-10-01 | Matsushita Electric Ind Co Ltd | Electronic component placement machine and electronic component placement method |
-
2003
- 2003-11-04 US US10/534,109 patent/US7716822B2/en not_active Expired - Fee Related
- 2003-11-04 WO PCT/IB2003/004928 patent/WO2004043126A1/en active Application Filing
- 2003-11-04 JP JP2004549478A patent/JP4326474B2/en not_active Expired - Fee Related
- 2003-11-04 EP EP03758545A patent/EP1559302A1/en not_active Withdrawn
- 2003-11-04 AU AU2003274570A patent/AU2003274570A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6397456B1 (en) * | 1996-10-14 | 2002-06-04 | Mydata Automation Ab | Method and a machine for automatic mounting of components and a pick-up head for such a machine |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2009979A2 (en) * | 2007-06-26 | 2008-12-31 | Siemens Aktiengesellschaft | Device and method for populating substrates with components |
EP2009979A3 (en) * | 2007-06-26 | 2011-11-30 | ASM Assembly Systems GmbH & Co. KG | Device and method for populating substrates with components |
CN110089209A (en) * | 2016-09-29 | 2019-08-02 | 安必昂公司 | Component placement device and its driving method |
Also Published As
Publication number | Publication date |
---|---|
US20060123627A1 (en) | 2006-06-15 |
EP1559302A1 (en) | 2005-08-03 |
JP4326474B2 (en) | 2009-09-09 |
US7716822B2 (en) | 2010-05-18 |
AU2003274570A1 (en) | 2004-06-07 |
JP2006505936A (en) | 2006-02-16 |
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Legal Events
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