WO2004042837A2 - Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu - Google Patents
Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu Download PDFInfo
- Publication number
- WO2004042837A2 WO2004042837A2 PCT/DE2003/003667 DE0303667W WO2004042837A2 WO 2004042837 A2 WO2004042837 A2 WO 2004042837A2 DE 0303667 W DE0303667 W DE 0303667W WO 2004042837 A2 WO2004042837 A2 WO 2004042837A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- electrode
- depression
- organic electronic
- conductor track
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
Definitions
- the invention relates to an organic electronic component with high-resolution structuring, in particular an organic field-effect transistor (OFET) with a small source-drain spacing, and a production method therefor.
- OFET organic field-effect transistor
- Organic electronic components are known, in particular OFETs with high-resolution structuring and a small source-drain distance “1 *, but these are produced in complex process steps which are associated with high costs. These process steps are uneconomical and regularly include photolithography, with depressions being produced photolithographically in a lower layer or in the substrate so that a conductor track with the required capacitance can be formed. These depressions are trough-shaped and have no sharp contours. The bottom of these depressions remains unchanged.
- a conductor track and / or an electrode needs a certain mass to have a low resistance, which in one
- the known mass-production-capable and fast processes for producing organic electronic components use the technique of applying the conductor track on the lower layer, generally on the substrate, whereby the problem arises that these “overlying” conductor tracks are either so thick that they cause defects in the subsequent insulator layer (s) or as wide, that much of the total area of the integrated circuit is used for this.
- DE 10061297.0 discloses a high-resolution printing method which can be used on an industrial scale and in which the conductor tracks are sunk, but this has the disadvantage that the depressions which are produced by pressing on an embossing stamp do not have steep wall surfaces and sharply drawn edges, but are more trough-shaped and are designed without sharp contours. As a result of these soft transitions, the material introduced into the depression does not only fill the depression accurately, but blurs around the depression and thus leads to leakage currents. As a result, the smeared material cannot be wiped off without wiping most of the material out of the recess.
- the object of the invention is to provide an organic electronic component that is inexpensive to produce on an industrial scale, in particular an OFET with a high-resolution structure and a small source-drain distance.
- the object and object of the invention is to achieve an organic electronic component with a distance 1 between two conductor tracks, electrodes and / or between a conductor track and an electrode of less than 10 ⁇ m, which has a substantially flat surface, i.e. the conductor track (s) and / or electrode (s) are raised less than 300 nm above the surface of a lower layer or the substrate.
- the invention also relates to an organic electronic component with a distance 1 between two conductor tracks, electrodes and / or between a conductor track and an electrode of less than 10 ⁇ m, in which at least one conductor track and / or one electrode is arranged in a depression in a lower layer , wherein the recess by means of a
- the invention relates to a method for producing an organic electronic component in which at least one depression is burned into a lower layer or the substrate by means of a laser and mask in order to produce a conductor track and / or an electrode, this depression comprising steep walls, sharp contours and has a rough surface on the floor and is filled with conductive, predominantly organic material in a subsequent process step.
- excess conductive organic material is wiped off in a process step following the filling of the depressions with this material, without any appreciable amount of conductive material being removed from the recess.
- the recesses can be filled using various techniques: it can be sprayed, knife-coated, injected, coated, printed or filled in in another manner according to the invention.
- the depressions are burned into the lower layer and / or the substrate with a pulsed laser, for example with pulse lengths of a few 10 ns. A few pulses can be sufficient to produce depressions in the range of 0.5 to 3 ⁇ m.
- the depressions created by laser structuring are characterized by the fact that the walls are very steep, in extreme cases directly vertical.
- the evaporation causes a very rough surface at the bottom of the depressions, which has the consequence that the filled organic conductor adheres very well there and, by removing the superfluous conductive material, is not drawn out to any appreciable extent between the depressions and / or is removed.
- FIG. 1 shows an example of a schematic representation of a process sequence for producing a conductor track and / or an electrode.
- the substrate 1 is drawn between several rollers, for example in a roll-to-roll process.
- the pressure and / or guide rollers 2, which support the smooth running of the belt, can be seen from left to right.
- a laser 3 for example an excimer laser, is used to produce 4 depressions 5 in the substrate through a mask.
- the excimer laser 3 is optionally equipped with optical lens systems 3a, 3b, so that the depressions 5 are not necessarily imaged in the same size as the mask 4 specifies. Since the laser pulse e.g. lasts only a few 10ns, the tape 1 has moved only insignificantly in time.
- the depressions 5 formed in this way, as described above, have sharp edges, steep walls and a rough bottom surface on which the organic conductors adhere particularly well.
- organic material or “functional material” or ⁇ X (functional) polymer "includes all types of organic African, organometallic and / or organic-inorganic plastics (hybrids), especially those that are referred to in English as "plastics". These are all types of substances with the exception of the semiconductors that form the classic diodes (germanium, silicon) and the typical metallic conductors. A limitation in the dogmatic sense to organic material as carbon-containing material is therefore not provided, rather the broad use of, for example, silicones is also contemplated. Furthermore, the term should not be subject to any restriction with regard to the molecular size, in particular to polymeric and / or oligomeric materials, but it is also entirely possible to use "small molecules”. The word component "polymer” in the functional polymer is historically determined and therefore contains no information about the presence of an actually polymeric compound.
- the invention presents for the first time a method with which an organic electronic component such as an OFET can be produced economically with high switching speed and high reliability. It has been shown that depressions that are burned in with a laser hold the filling with conductive organic material differently than the conventional depressions and that organic conductors can therefore be produced faster and better with this method than with other methods.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/533,756 US20060118778A1 (en) | 2002-11-05 | 2003-11-05 | Organic electronic component with high-resolution structuring and method for the production thereof |
JP2004549084A JP2006505927A (ja) | 2002-11-05 | 2003-11-05 | 高分解能の構造を有する有機電子要素およびそれを製造する方法 |
EP03785493A EP1559148A2 (de) | 2002-11-05 | 2003-11-05 | ORGANISCHES ELEKTRONISCHES BAUTEIL MIT HOCHAUFGELöSTER STRUKTURIERUNG UND HERSTELLUNGSVERFAHREN DAZU |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10251475.5 | 2002-11-05 | ||
DE10251475 | 2002-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004042837A2 true WO2004042837A2 (de) | 2004-05-21 |
WO2004042837A3 WO2004042837A3 (de) | 2004-10-07 |
Family
ID=32308476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/003667 WO2004042837A2 (de) | 2002-11-05 | 2003-11-05 | Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060118778A1 (de) |
EP (1) | EP1559148A2 (de) |
JP (1) | JP2006505927A (de) |
CN (1) | CN1726604A (de) |
WO (1) | WO2004042837A2 (de) |
Cited By (13)
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WO2005022663A1 (de) * | 2003-08-25 | 2005-03-10 | Polyic Gmbh & Co. Kg | Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu |
US7678857B2 (en) | 2003-09-03 | 2010-03-16 | Polyic Gmbh & Co. Kg | Polymer mixtures for printed polymer electronic circuits |
US7724550B2 (en) | 2004-12-23 | 2010-05-25 | Polyic Gmbh & Co. Kg | Organic rectifier |
US7786818B2 (en) | 2004-12-10 | 2010-08-31 | Polyic Gmbh & Co. Kg | Electronic component comprising a modulator |
US7812343B2 (en) | 2005-04-15 | 2010-10-12 | Polyic Gmbh & Co. Kg | Multilayer composite body having an electronic function |
US7843342B2 (en) | 2005-03-01 | 2010-11-30 | Polyic Gmbh & Co. Kg | Organic clock generator |
US7847695B2 (en) | 2004-08-23 | 2010-12-07 | Polyic Gmbh & Co. Kg | External package capable of being radio-tagged |
US7846838B2 (en) | 2005-07-29 | 2010-12-07 | Polyic Gmbh & Co. Kg | Method for producing an electronic component |
US7875975B2 (en) | 2000-08-18 | 2011-01-25 | Polyic Gmbh & Co. Kg | Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag |
US7940340B2 (en) | 2005-07-04 | 2011-05-10 | Polyic Gmbh & Co. Kg | Multilayer body with electrically controllable optically active systems of layers |
US7940159B2 (en) | 2004-12-10 | 2011-05-10 | Polyic Gmbh & Co. Kg | Identification system |
US8044517B2 (en) | 2002-07-29 | 2011-10-25 | Polyic Gmbh & Co. Kg | Electronic component comprising predominantly organic functional materials and a method for the production thereof |
US8134233B2 (en) | 2007-07-30 | 2012-03-13 | Motorola Solutions, Inc. | Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board |
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- 2003-11-05 WO PCT/DE2003/003667 patent/WO2004042837A2/de active Application Filing
- 2003-11-05 US US10/533,756 patent/US20060118778A1/en not_active Abandoned
- 2003-11-05 EP EP03785493A patent/EP1559148A2/de not_active Withdrawn
- 2003-11-05 CN CNA2003801059676A patent/CN1726604A/zh active Pending
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7875975B2 (en) | 2000-08-18 | 2011-01-25 | Polyic Gmbh & Co. Kg | Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag |
US8044517B2 (en) | 2002-07-29 | 2011-10-25 | Polyic Gmbh & Co. Kg | Electronic component comprising predominantly organic functional materials and a method for the production thereof |
WO2005022663A1 (de) * | 2003-08-25 | 2005-03-10 | Polyic Gmbh & Co. Kg | Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu |
US7678857B2 (en) | 2003-09-03 | 2010-03-16 | Polyic Gmbh & Co. Kg | Polymer mixtures for printed polymer electronic circuits |
US7847695B2 (en) | 2004-08-23 | 2010-12-07 | Polyic Gmbh & Co. Kg | External package capable of being radio-tagged |
US7786818B2 (en) | 2004-12-10 | 2010-08-31 | Polyic Gmbh & Co. Kg | Electronic component comprising a modulator |
US7940159B2 (en) | 2004-12-10 | 2011-05-10 | Polyic Gmbh & Co. Kg | Identification system |
US7724550B2 (en) | 2004-12-23 | 2010-05-25 | Polyic Gmbh & Co. Kg | Organic rectifier |
US7843342B2 (en) | 2005-03-01 | 2010-11-30 | Polyic Gmbh & Co. Kg | Organic clock generator |
US7812343B2 (en) | 2005-04-15 | 2010-10-12 | Polyic Gmbh & Co. Kg | Multilayer composite body having an electronic function |
US7940340B2 (en) | 2005-07-04 | 2011-05-10 | Polyic Gmbh & Co. Kg | Multilayer body with electrically controllable optically active systems of layers |
US7846838B2 (en) | 2005-07-29 | 2010-12-07 | Polyic Gmbh & Co. Kg | Method for producing an electronic component |
US8134233B2 (en) | 2007-07-30 | 2012-03-13 | Motorola Solutions, Inc. | Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
EP1559148A2 (de) | 2005-08-03 |
JP2006505927A (ja) | 2006-02-16 |
US20060118778A1 (en) | 2006-06-08 |
WO2004042837A3 (de) | 2004-10-07 |
CN1726604A (zh) | 2006-01-25 |
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