WO2004036232A1 - Connecteur electrique - Google Patents

Connecteur electrique Download PDF

Info

Publication number
WO2004036232A1
WO2004036232A1 PCT/JP2002/010836 JP0210836W WO2004036232A1 WO 2004036232 A1 WO2004036232 A1 WO 2004036232A1 JP 0210836 W JP0210836 W JP 0210836W WO 2004036232 A1 WO2004036232 A1 WO 2004036232A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
probe
lower plate
electrical connection
connection device
Prior art date
Application number
PCT/JP2002/010836
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyuki Aso
Atsushi Tanabe
Koji Noro
Yutaka Funamizu
Original Assignee
Kabushiki Kaisha Nihon Micronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Nihon Micronics filed Critical Kabushiki Kaisha Nihon Micronics
Priority to AU2002343999A priority Critical patent/AU2002343999A1/en
Priority to PCT/JP2002/010836 priority patent/WO2004036232A1/fr
Publication of WO2004036232A1 publication Critical patent/WO2004036232A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe

Definitions

  • the present invention relates to an electrical connection device such as a probe card used for an electrical test of a test object such as a semiconductor device such as an integrated circuit.
  • the extension direction of each probe that is, the thickness direction of the plate member to which the probe is attached is referred to as the vertical direction.
  • the device under test such as a semiconductor device
  • a conduction test to determine whether or not the internal circuit operates according to specifications.
  • Such an energization test is performed using an electrical connection device such as a probe card in which a plurality of contacts, such as probes, whose needle tips are pressed against electrodes of a device under test, are arranged on the lower surface of an insulating substrate.
  • this type of electrical connection device there is a vertical device in which a plurality of probes made of thin metal wires are vertically assembled on a substrate, and a needle tip (lower end) is pressed against an electrode of a device under test.
  • a vertical device in which a plurality of probes made of thin metal wires are vertically assembled on a substrate, and a needle tip (lower end) is pressed against an electrode of a device under test.
  • the vertical type device is easier to assemble the probe than a conventional general device in which an L-shaped bent probe is mounted on a substrate in a cantilever shape, so it is inexpensive and has a needle tip. Since the arrangement density of the electrodes can be increased, it is suitable for a current test of a high-density test object having a large number of electrodes.
  • the lower plate and the upper plate are arranged at an interval in the vertical direction, and the middle plate is arranged between the upper and lower plates to serve as a probe support.
  • Board There is a device in which a probe is assembled to a probe support while penetrating the probe, and the probe is bent in the same direction in advance by displacing the middle plate horizontally with respect to the upper and lower plates (for example, see Japanese Patent Application Laid-Open No. H11-12848). Japanese Patent Application Laid-Open No. 7-45, JP-A-Heisei 2022-202337).
  • each probe penetrates the lower plate, the middle plate, and the upper plate so as to be displaceable with respect to the lower plate, the middle plate and the upper plate. Is transmitted to the other, and it is difficult to align the height positions of the needle tips. As a result, in the conventional device, the contact pressure acting between the electrode of the test object and the needle tip does not become constant. Disclosure of the invention
  • An electrical connection device includes a probe support, and a plurality of probes arranged on the probe support.
  • the probe support is a lower plate having a first recess that opens upward, and an upper plate having a second recess that opens downward, and is disposed at a distance above the lower plate.
  • Each probe is inserted into the lower plate, the upper plate, and the middle plate so as to be elastically deformable independently at a portion above and below the middle plate.
  • the lower plate, the middle plate, the upper plate, and the probe can be used as a probe assembly in which the lower end (needle tip) of each probe is pressed against the electrode of the device under test in the state configured as described above.
  • Each probe is elastically deformed in a region above the middle plate when its upper end is pushed downward, and is elastically deformed in a region below the middle plate when its lower end is pushed upward.
  • the pressing force acting on one end or the other end of each probe affects the other. Absent. Further, after the probe is assembled to the probe support, a process of aligning the height positions of the upper end and the lower end of the probe can be performed, so that the height positions of the needle tips can be easily adjusted. As a result, the height position of the needle tip is kept constant, and the contact pressure between the electrode of the test object and the needle tip becomes the same between the probes that are in contact.
  • Each probe penetrates through the middle plate so as not to be displaced vertically when it is elastically deformed, and penetrates the lower plate so as to be vertically displaceable, and is further displaceable vertically. It may be inserted into the upper plate. This ensures that each probe independently and elastically deforms in each of the region above and below the midplate.
  • the lower plate, the upper plate, and the middle plate may be separably connected by a plurality of screw members. By doing so, it becomes easy to assemble the probe to the probe support and to stand the loop support alone.
  • the lower plate may include a lower plate member, and a frame member disposed on the lower plate member and forming the first recess together with the lower plate member.
  • the electrical connection device further includes: a connection plate disposed on the upper plate; and a plurality of wirings inserted into the connection plate downward from above and individually electrically connected to an upper end surface of the probe. And may be included. In this case, by connecting the connection plate and the upper plate in a state where the end of the wiring is assembled to the connection plate, the wiring and the probe are pressed against each other by the end surface of the wiring and the upper end surface of the probe. And are electrically connected.
  • the electrical connection device further includes a substrate having a plurality of tester lands on an upper surface and an opening at a center, wherein the connection plate is assembled on a lower surface, and each wiring passes through the opening and passes through the connection land.
  • each wiring includes a core wire, one end of which is inserted into the connection plate and is in contact with the probe, and the other end of which is electrically connected to the tester land, and an electric insulating layer arranged around the core. Can be included.
  • Each of the wirings may further include an electric shield layer disposed around the electric insulating layer.
  • the electrical connection device of the present invention has, for example, through holes for probes, respectively.
  • Using the lower plate, the middle plate, and the upper plate maintain the lower plate, the middle plate, and the upper plate in a state in which the axes of their through holes are aligned, and then move the probe to the lower plate, the middle plate, and the upper plate. Inserting, then moving the middle plate and the upper plate in the predetermined direction with respect to the lower plate by a predetermined amount, and assembling the lower plate, the middle plate, and the upper plate firmly in that state, assembling the probe It can be easily assembled into an assembly.
  • connection plate and the upper plate may be firmly connected after assembling the probe assembly as described above.
  • connection plate and a substrate are used, the connection plate and the probe assembly may be connected to each other, and then the connection plate may be assembled to the substrate. You can combine it with a solid.
  • FIG. 1 is a plan view showing one embodiment of an electrical connection device according to the present invention, and is a diagram showing most of wirings removed.
  • FIG. 2 is a front view of the electrical connection device shown in FIG.
  • FIG. 3 is a cross-sectional view taken along line 3-3 in FIG.
  • FIG. 4 is an enlarged sectional view of a part of the probe assembly of the electrical connection device shown in FIG.
  • FIG. 5 is a cross-sectional view showing a state where a probe of the electrical connection device shown in FIG. 1 is pressed against an electrode of a device under test.
  • FIG. 6 is a cross-sectional view for explaining a method of assembling the probe assembly of the electrical connection device shown in FIG.
  • FIG. 7 is a cross-sectional view for explaining a method of assembling the probe assembly of the electrical connection device shown in FIG.
  • FIG. 8 is an enlarged sectional view showing another embodiment of the probe assembly. BEST MODE FOR CARRYING OUT THE INVENTION
  • the electrical connection device 10 is configured to test a plurality of (eight in the example shown in FIG. 1) integrated circuits on the semiconductor wafer 12. 1 4 and Then, it is used as a probe card for simultaneously detecting the test objects 14.
  • Each test object 14 has a rectangular shape, and has a plurality of electrodes 16 on each side that are spaced in the direction of the side of the rectangle.
  • the electrical connection device 10 includes a disc-shaped wiring board 20, a connection board 22 assembled on the lower surface of the wiring board 20, and a plurality of wirings 2 extending from the connection board 22 to the wiring board 20. 4 and a probe assembly 26 attached to the lower side of the connection plate 22.
  • the wiring board 20 is manufactured using an electrically insulating material such as glass-containing epoxy or ceramic.
  • the wiring board 20 has an opening 28 at the center that penetrates the central area of the wiring board 20 in the thickness direction, and has a plurality of tester lands 30 that are electrically connected to the tester at the periphery thereof. It has a plurality of connection lands 32 outside two opposing sides of the opening 28.
  • connection lines can be a wiring formed in the wiring board 20 by an appropriate method such as a printed wiring technology.
  • connection plate 22 is made of an electrically insulating material and has a rectangular shape larger than the opening 28 of the wiring board 20.
  • the connection plate 22 has a rectangular shallow upward recess 34 having substantially the same size as the opening 28, and penetrates the connection plate 22 in the thickness direction to form the recess 34. It has a plurality of through holes 36 to reach.
  • each wiring 24 protects a conductive core wire 38 by an electrical insulation layer 40 surrounding the core wire 38.
  • a core wire 38 exposed by peeling off the electric insulating layer 40 is inserted into the through hole 36, and an adhesive 4 is formed at the exposed end of the core wire 38. It is connected to the connection plate 22 by 2.
  • each core wire 38 is maintained substantially at the level of the lower surface of the connection plate 22.
  • the electric insulating layer 40 is peeled off, and the exposed end of the core wire 38 is connected to the connection land 32 by a conductive adhesive such as solder.
  • the probe assembly 26 is formed in a rectangular parallelepiped having a rectangular planar shape substantially the same size as the connection plate 22.
  • the probe assembly 26 has a rectangular lower plate 4 4
  • the plate 46 is placed, and the rectangular upper plate 48 is placed on the middle plate 46.
  • the lower plate 44 has a rectangular frame member 52 disposed on a rectangular lower plate member 50.
  • the middle plate 46 is placed on the frame member 52.
  • the upper plate 48 may also be formed by an upper plate member and a frame member.
  • the lower plate member 50, the frame member 52, the middle plate 46, and the upper plate 48 are connected to each other by a plurality of screw members 54 in a state of being stacked as described above, and a plurality of probes 5 are provided.
  • a probe support 58 supporting the 6 is constituted.
  • the lower plate member 50 and the frame member 52 form a lower plate 44.
  • the screw member 54 passes through the upper plate 48, the middle plate 46, and the frame member 52, and is screwed to the lower plate member 50.
  • the lower plate member 50 has a recess 60 that opens upward in cooperation with the frame member 52, and the upper plate 48 has a recess 62 that opens downward.
  • the middle plate 46 is disposed between the frame member 52 and the upper plate 48 so as to close the recesses 60 and 62.
  • the inner spaces of the recesses 60 and 62 and the frame member 52 have substantially the same size and shape as the opening 28 of the wiring board 20 when viewed in plan.
  • the lower plate member 50 has a plurality of through holes 64 that penetrate the lower plate member 50 in the thickness direction and open to the recesses 60.
  • the upper plate 48 has a plurality of through holes 68 penetrating in the thickness direction and opening to the recesses 62.
  • the through holes 64, 66, 68 correspond to each other and to the through hole 36 of the connection plate 22.
  • Each probe 56 is formed into an elastically deformable needle shape by a conductive thin metal wire such as tungsten, and is passed through through holes 68, 66, and 64.
  • Each probe 56 has a circular cross-sectional shape whose diameter, particularly at the location of the through hole 66, is substantially the same as that of the through hole 66.
  • each probe 56 is inserted into the through hole 68 so that the upper end of the probe 56 can be moved in the up-down direction, and is substantially at the level of the upper surface of the upper plate 48.
  • the lower end of each of the props 56 penetrates through the through hole 64 so as to be movable in the vertical direction, and protrudes downward from the lower plate member 50.
  • the through-holes 68 coincide with the through-holes 36, but the through-holes 64 and 66 are horizontal to each other and to the through-holes 36 and 68. Being displaced . Therefore, the probe 56 is curved in the same direction by the middle plate 46 in the region between the through holes 64 and 68.
  • the amount of displacement of the through holes 64, 66 can be made substantially the same as the arrangement pitch of the through holes 64, 66.
  • the displacement of the through holes 64, 68 can be small.
  • the displacement of the through holes 66, 68 can be larger than the displacement of the through holes 64, 66.
  • Each probe 56 is curved in the same direction by the middle plate 46 in the area between the through holes 64 and 68, and the diameter dimension is almost the same as that of the through hole 66.
  • each of the portions above and below the middle plate 46 is independently and elastically deformable and held by the middle plate 46.
  • each probe 56 is elastically deformed in a region below the middle plate 46 when the lower end is pushed upward, and elastically deformed in a region above the middle plate 46 when the upper end is pushed downward. .
  • the probe assembly 26 and the electrical connection device 10 can be assembled, for example, as follows.
  • the through holes 64, 66, 68 for each probe 56 are aligned vertically (through holes 64, 66).
  • the lower plate 44, the middle plate 46, and the upper plate 48 are maintained while the axes 6 and 68 are aligned.
  • each probe 56 is passed through the through holes 64, 66, 68 with its upper end slightly protruding from the upper plate 48.
  • the middle plate 46 and the upper plate 48 are respectively moved by a predetermined amount in the horizontal direction with respect to the lower plate 44, and in this state, the lower plate 4 is moved. 4.
  • the middle plate 46 and the upper plate 48 are firmly connected by the screw members 54. .
  • the upper plate 48 is firmly connected to the connection plate 22 by a plurality of screw members (not shown).
  • the wiring board 20 and the connection board 22 may be assembled after connecting the connection board 22 and the probe assembly 26, or may be connected after the connection board 22 is assembled to the wiring board 20.
  • the plate 22 and the probe assembly 26 may be connected.
  • each probe 56 Is pushed downward by the core wire 38 of the corresponding wiring 24.
  • each probe 56 is pushed downward at its upper end, and is elastically deformed in the probe region above the middle plate 46. The elastic deformation at this time does not affect the probe area below the middle plate 46.
  • Probe assembly 26 Lower plate member 50, frame member 52, middle plate 46, upper plate 48, and frame member 22 • A multi-positioned pair that is connected to each other and joined by screw members 54 And a plurality of positioning pins 70 (see FIG. 1) inserted through the wiring board 20 and inserted into the probe assembly 26 to maintain a constant relationship.
  • each probe 56 is pressed by the electrode 16 of the device under test 14 as shown in FIG. You.
  • each probe 56 is elastically deformed in the probe region below the middle plate 46, so that the lower end moves slightly in the horizontal direction with respect to the electrode 16 and gives a rubbing action to the electrode 16. The elastic deformation at this time does not affect the probe area above the middle plate 46.
  • each probe 56 is placed above the middle plate 46 so that the pressing force acting on one of the lower end and the upper end of each probe 56 does not affect the other. In each of the area and the lower probe area, it is elastically deformed independently.
  • the probe 56 After assembling the probe 56 to the probe support 58, it is possible to perform processing for aligning the height positions of the upper end and the lower end of the probe 56, and it is possible to easily align the height positions of the needle tips. . As a result, the height position of the needle tip is made uniform, and the contact pressure between the electrode 16 of the test object 14 and the needle tip becomes constant.
  • the probe 56 penetrates through the middle plate 46 and is curved by the middle plate 46 at the center so that the pressing force acting on one end of the probe 56 does not affect the other.
  • a suitable adhesive such as an electrically insulating adhesive
  • the axes of the through holes 64 and 68 are slightly displaced in a plan view so that the upper end and the lower end of the probe 56 are displaced.
  • the probe 56 is stepped by positioning the through holes 64 and 68 on the opposite side of the through hole 66, as shown in Fig. 8.
  • the upper end and the lower end of the probe 56 may be shifted, or the upper end and the lower end of the probe 56 may be aligned without shifting.
  • the present invention is not limited to the above embodiments, and can be variously modified without departing from the gist thereof.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

Cette invention concerne un connecteur électrique comprenant un support de sondes ainsi qu'une pluralité de sondes disposées sur le support de sondes. Ce support de sondes comprend une plaque inférieure comportant un premier évidement ouvert vers le haut, une plaque supérieure comportant un deuxième évidement ouvert vers le bas, laquelle plaque supérieure est disposée au-dessus de la plaque inférieure à une certaine distance de celle-ci, ainsi qu'une plaque intermédiaire disposée entre la plaque inférieure et la plaque supérieure de façon à boucher les premier et deuxième évidements. Chaque sonde est introduite indépendamment dans la plaque inférieure, la plaque supérieure et la plaque intermédiaire d'une manière élastiquement déformable à des endroits situés au-dessus et en dessous du centre.
PCT/JP2002/010836 2002-10-18 2002-10-18 Connecteur electrique WO2004036232A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002343999A AU2002343999A1 (en) 2002-10-18 2002-10-18 Electric connector
PCT/JP2002/010836 WO2004036232A1 (fr) 2002-10-18 2002-10-18 Connecteur electrique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/010836 WO2004036232A1 (fr) 2002-10-18 2002-10-18 Connecteur electrique

Publications (1)

Publication Number Publication Date
WO2004036232A1 true WO2004036232A1 (fr) 2004-04-29

Family

ID=32104837

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/010836 WO2004036232A1 (fr) 2002-10-18 2002-10-18 Connecteur electrique

Country Status (2)

Country Link
AU (1) AU2002343999A1 (fr)
WO (1) WO2004036232A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2060922A1 (fr) * 2007-11-16 2009-05-20 Technoprobe S.p.A Tête d'essai de microstructure
CN102854343A (zh) * 2011-06-29 2013-01-02 台湾积体电路制造股份有限公司 用于半导体器件的测试结构和测试方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1130631A (ja) * 1997-07-10 1999-02-02 Tokyo Kasoode Kenkyusho:Kk プローブカード
JP2000162239A (ja) * 1998-11-27 2000-06-16 Japan Electronic Materials Corp 垂直型プローブカード
JP2001021584A (ja) * 1999-07-06 2001-01-26 Tokyo Cathode Laboratory Co Ltd 垂直型プローブカード
JP2001027650A (ja) * 1999-07-12 2001-01-30 Takashi Nansai ファインピッチプリント基板検査機用治具
JP2002231399A (ja) * 2001-02-02 2002-08-16 Fujitsu Ltd 半導体装置試験用コンタクタ及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1130631A (ja) * 1997-07-10 1999-02-02 Tokyo Kasoode Kenkyusho:Kk プローブカード
JP2000162239A (ja) * 1998-11-27 2000-06-16 Japan Electronic Materials Corp 垂直型プローブカード
JP2001021584A (ja) * 1999-07-06 2001-01-26 Tokyo Cathode Laboratory Co Ltd 垂直型プローブカード
JP2001027650A (ja) * 1999-07-12 2001-01-30 Takashi Nansai ファインピッチプリント基板検査機用治具
JP2002231399A (ja) * 2001-02-02 2002-08-16 Fujitsu Ltd 半導体装置試験用コンタクタ及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2060922A1 (fr) * 2007-11-16 2009-05-20 Technoprobe S.p.A Tête d'essai de microstructure
CN102854343A (zh) * 2011-06-29 2013-01-02 台湾积体电路制造股份有限公司 用于半导体器件的测试结构和测试方法

Also Published As

Publication number Publication date
AU2002343999A1 (en) 2004-05-04

Similar Documents

Publication Publication Date Title
US7616016B2 (en) Probe card assembly and kit
US6731123B2 (en) Probe device
EP2422205B1 (fr) Contacts de kelvin électriquement conducteurs pour testeur de microcircuit
US8102184B2 (en) Test contact system for testing integrated circuits with packages having an array of signal and power contacts
TWI397690B (zh) 用於針對電子元件之測試裝置的構件及電子元件之測試方法
JPWO2004072661A1 (ja) 電気的接続装置
KR101826663B1 (ko) 반도체 디바이스 테스트용 양방향 도전성 소켓, 반도체 디바이스 테스트용 양방향 도전성 모듈 및 이의 제조방법
US7049838B2 (en) Semiconductor device tester with slanted contact ends
JP4209696B2 (ja) 電気的接続装置
JP4615057B1 (ja) プローブカード
KR20070076539A (ko) 신호 및 전력 콘택트의 어레이를 갖는 패키지를 구비하는집적회로를 시험하는 테스트 콘택트 시스템
JP2008216060A (ja) 電気的接続装置
US7121860B2 (en) Pinch-style support contact, method of enabling electrical communication with and supporting an IC package, and socket including same
JP4455940B2 (ja) 電気的接続装置
JP2004138576A (ja) 電気的接続装置
JP4102571B2 (ja) 接触子及び電気的接続装置
WO2004036232A1 (fr) Connecteur electrique
KR101066551B1 (ko) 프로브 카드 제조에 사용되는 핀 어레이 틀
JP7374037B2 (ja) ポゴブロック
JP3019355U (ja) 半導体ウェハ等の試験用プローブカード
JP2005127961A (ja) テスト用基板及びそれを使用したテスト装置
US20150168456A1 (en) Probe card and method for producing a probe card
KR200304113Y1 (ko) 반도체 검사용 프로브 카드
JP2993093B2 (ja) 集積回路装置の試験装置
JP2609860B2 (ja) プリント基板検査治具用ピン

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP