WO2004034447A1 - 極短紫外線光学系用反射ミラー、極短紫外線光学系、極短紫外線光学系の使用方法、極短紫外線光学系の製造方法、極短紫外線露光装置、及び極短紫外線露光装置の使用方法 - Google Patents
極短紫外線光学系用反射ミラー、極短紫外線光学系、極短紫外線光学系の使用方法、極短紫外線光学系の製造方法、極短紫外線露光装置、及び極短紫外線露光装置の使用方法 Download PDFInfo
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- WO2004034447A1 WO2004034447A1 PCT/JP2003/012887 JP0312887W WO2004034447A1 WO 2004034447 A1 WO2004034447 A1 WO 2004034447A1 JP 0312887 W JP0312887 W JP 0312887W WO 2004034447 A1 WO2004034447 A1 WO 2004034447A1
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- ultra
- optical system
- short ultraviolet
- reflection mirror
- mirror
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/283—Interference filters designed for the ultraviolet
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
Definitions
- the present invention relates to an ultra-short ultraviolet light (EUV) used in an ultra-short ultraviolet light exposure device (EUVL) and the like.
- EUV ultra-short ultraviolet light
- the present invention relates to a method of using a system, a method of manufacturing an ultrashort ultraviolet optical system, an ultrashort ultraviolet exposure apparatus, and a method of using an ultrashort ultraviolet exposure apparatus.
- a circuit pattern formed on a mask surface as an object surface is projected and transferred onto a substrate such as a wafer via an imaging optical system.
- a resist is applied to the substrate, and the resist is exposed by exposing the resist to obtain a resist pattern.
- the resolution w of the exposure apparatus is mainly determined by the exposure wavelength and the numerical aperture NA of the imaging optical system, and is expressed by the following equation.
- the exposure equipment used for semiconductor manufacturing mainly uses i-rays with a wavelength of 365 nm, and has a numerical aperture of about 0.5 and a resolution of 0.5 ⁇ m. Increasing the numerical aperture is difficult in optical design, so in order to further improve the resolution in the future, It is necessary to shorten the wavelength of the exposure light.
- An example of the exposure light having a wavelength shorter than the i-line is an excimer laser, which has a wavelength of 248 nm for a KrF excimer laser and 193 nm for an ArF excimer laser. In this case, a resolution of 0.25 m is obtained with the KrF excimer laser and 0.18 m with the ArF excimer laser.
- EUV light ultra-short ultraviolet light having a shorter wavelength
- a resolution of 0.1 m or less can be obtained at a wavelength of 13 nm.
- a conventional exposure apparatus mainly includes a light source, an illumination optical system, and a projection imaging optical system.
- the projection imaging optical system is composed of a plurality of lenses or reflecting mirrors, and forms an image of a pattern on a mask on a wafer.
- FIG. 8 shows a schematic view of a part of the ultrashort ultraviolet projection exposure apparatus.
- the apparatus mainly includes an EUV light source 21, an illumination optical system 22, a stage 24 of a mask 24, a projection optical system 23, and a stage 27 of a wafer 26.
- the mask 24 is formed with a pattern of the same size or an enlarged size as the pattern to be drawn.
- the projection optical system 23 includes a plurality of reflecting mirrors 23 a to 23 d and the like, and forms a pattern on the mask 24 on the wafer 26.
- a multilayer optical thin film is formed on the surface of the reflectors 23a to 23d to increase the reflectance. I have.
- the projection optical system 23 has a ring-shaped field of view, and transfers the pattern of the ring-shaped region forming a part of the mask 24 onto the wafer 26.
- the mask 24 is also of a reflective type.
- EUV light 28 b from EUV light source 21 is used as illumination EUV light 28 b by illumination optical system 22, and EUV light 28 b for illumination is irradiated onto mask 24 and reflected.
- EUV light 28 c is incident on the wafer 26 through the projection optical system 23.
- a desired region for example, a region for one semiconductor chip
- the optical system is mainly configured with a mirror.
- the projection optical system of the ultra-short ultraviolet projection exposure apparatus six mirrors are being used, unlike the one shown in FIG.
- optical characteristics for example, Strehl intensity, wavefront aberration, distortion, field curvature
- design calculation that determines the shape and arrangement of optical elements such as mirrors so that these values fall within a predetermined range.
- Fig. 7 shows the optical design process of a conventional ultrashort ultraviolet optical system.
- the design parameters are a collection of numerical values that represent the optical design of the projection system. Specifically, for a reflecting mirror, the radius of curvature that represents the shape of each surface, the aspheric coefficient, and the relative position of each surface This is the distance between surfaces to be expressed, and also includes the position and size of the stop that determines the number of apertures of the optical system.
- optical characteristics of the optical system expressed by these design parameters (Step S22) to evaluate the optical design.
- the optical characteristics are based on the basic numerical values of the optical system such as Strehl intensity, wavefront aberration, distortion, field curvature, etc., and the specific mask pattern (line & space, isolated line, contact hole, etc.) under specific illumination conditions. )
- the accuracy of the pattern formed when the image is transferred is wide-ranging to concrete data for determining whether or not the intended purpose is met.
- step S23 it is determined whether or not desired optical characteristics have been obtained. If the desired optical characteristics have been obtained, the processing is terminated assuming that the design conditions have been determined. If not, proceed to step S24 to correct the design parameters. Then, using the corrected design parameters, the process returns to step S22 to calculate the optical characteristics. In this way, design conditions having desired optical characteristics are determined by iterative calculation.
- the ultra-short ultraviolet optical system when used, a certain rise in the temperature of the mirror is inevitable, and the mirror is actually used due to the thermal deformation of the mirror caused by this temperature rise.
- the optical characteristics in the state differ from the optical characteristics designed by the method described above.
- a mirror for an ultra-short ultraviolet optical system capable of obtaining desired characteristics, an ultra-short ultraviolet optical system using such a mirror, a method of manufacturing and using such an ultra-short ultraviolet optical system, It is a first object to provide an ultra-short ultraviolet exposure apparatus using such an ultra-short ultraviolet optical system and a method of using the ultra-short ultraviolet exposure apparatus.
- the optical characteristics for example, Strehl strength
- Wavefront aberration, distortion, and field curvature must be within a predetermined range.
- the characteristics of such an optical system are measured after assembly, and if they do not fall within a predetermined value, the shape of each optical element (mirror, etc.) is changed. It is necessary to correct or change the mounting method of each optical element. Therefore, it is required to measure the characteristics of the ultrashort ultraviolet optical system by some method.
- the reference pattern is formed on the image plane, and for field curvature, the reference pattern is formed on the image plane by changing the position of the image plane, and these are compared. This is also required.
- EUV light that is weaker than the EUV light actually used is used as the measurement light.
- mirrors are used in which a multilayer optical thin film is formed on the surface of glass-quartz that has been processed to form a concave or convex surface and has reflective characteristics. I have.
- a commonly used multilayer optical thin film is obtained by alternately laminating Mo and Si. As an example, Mo and Si having a thickness of 6.7 nm are alternately laminated. A layer with a thickness of 335 nm is used as a whole by laminating 0 layers.
- a mirror using such a multilayer optical thin film has a reflectivity of at most about 70%. Therefore, 30% of the energy of the incident EUV light is converted to heat on the surface of the mirror. For this reason, although a cooling device is attached to the mirror, a certain rise in the temperature of the mirror is inevitable when the ultra-short ultraviolet optical system is used. Therefore, the shape of the mirror is determined in consideration of this temperature rise, and it is preferable to design the mirror so that predetermined optical characteristics can be obtained at the temperature in the state of use.
- the present invention has been made in view of such circumstances, and even when the optical characteristics are measured using light weaker than EUV light in an actual use state, the measurement is the same as the actual use state.
- Reflection mirror for an ultra-short ultraviolet optical system capable of obtaining optical characteristics close to the use condition of the ultra-short ultraviolet optical system, an ultra-short ultraviolet optical system using such a reflection mirror, a method of manufacturing such an ultra-short ultraviolet optical system, and Usage method, ultra-short ultraviolet exposure apparatus using such ultra-short ultraviolet optical system, and
- Another object of the present invention is to provide a method of using a UV exposure apparatus. Disclosure of the invention
- a first invention for achieving the above object is a step of determining the shape and arrangement of each optical element such that when an optical element as a component is thermally deformed during exposure, optical characteristics are optimized.
- This is a method for producing an ultra-short ultraviolet optical system, characterized by having:
- the shape and arrangement of each optical element are determined in consideration of thermal deformation during use of the constituent optical elements, so the shape and arrangement of each optical element are determined based on the design result. If manufacturing is based on it, the required optical characteristics can be obtained during use, and even if it is not possible, the required optical characteristics can be obtained with fine adjustment. Can be.
- a second invention for achieving the above object is the first invention, wherein the shape and arrangement of each optical element are determined in consideration of a mechanical constraint condition of each optical element. It is a feature.
- the thermal deformation is determined in consideration of the mechanical constraint of the optical element.
- the deformation of optical elements is not only hindered by restraint conditions, but also varies by heat transfer to the restrained object. In the present means, since these are taken into account, more accurate design and manufacturing based on this can be performed.
- a third invention for achieving the above object is the first invention or the second invention, wherein a shape and an arrangement of each optical element are determined in consideration of a mechanical constraint condition of each optical element. It is characterized in that it is determined.
- the thermal constraints are the upper and lower limits of the temperature allowed for the optical element.
- the shape and arrangement of the optical elements are determined. Therefore, in an actual use condition, the possibility that the optical element exceeds the allowable temperature constraint can be reduced.
- a fourth invention for achieving the object is any one of the first to third inventions, wherein the optical element is a method for manufacturing an ultra-short ultraviolet optical system including a reflection mirror,
- the heating unit measures the optical characteristics of the reflection mirror or the ultra-short ultraviolet optical system including the reflection mirror while heating the reflection mirror, and based on the measurement result, determines the set of the ultra-short ultraviolet optical system.
- the method is characterized by including a step of performing a dressing adjustment.
- the measurement when measuring the optical characteristics, the measurement can be performed in a deformed state of the reflection mirror close to a use state. Therefore, assembly adjustment at the time of manufacturing can be easily and accurately performed.
- a fifth invention for achieving the above object is the fourth invention, wherein the temperature distribution of the reflecting mirror due to heat generated by the heating means is substantially the same as when the reflecting mirror is in use. It is characterized by being heated so that
- the measurement when the optical characteristics are measured, the measurement can be performed in a deformed state of the reflecting mirror which is almost the same as a used state. Therefore, assembly adjustment at the time of manufacturing can be performed easily and accurately.
- a sixth invention for achieving the above object is a reflection mirror used in an ultrashort ultraviolet optical system, wherein a heating device is provided on a surface portion thereof. Reflection mirror.
- the heat generating device since the heat generating device is provided on the surface of the reflecting mirror, heat can be generated by the heat generating device, and the temperature of the reflecting mirror can be raised to a temperature close to the temperature in use. Therefore, by measuring the optical characteristics in this state, it is possible to obtain The optical characteristics can be measured close to the time of use.
- the “surface portion” refers to the surface and the portion immediately below the surface. Specifically, the distance from the portion of the multilayer optical thin film formed on the surface of the reflection mirror to the surface of the mirror substrate. Since a heat generating device is provided in this portion, heat can be generated in a state close to when EUV light is irradiated.
- a sixth invention for achieving the above object is the sixth invention, wherein the heat generating device is provided only in an effective area of the reflection mirror.
- the “effective area” is a portion to which EUV light is actually irradiated during use. Heat during use is generated in this area.
- the heat generating device is provided only in the effective area of the reflection mirror, it is possible to generate heat closer to the time of use.
- An eighth invention for achieving the above object is the sixth invention or the seventh invention, wherein the heating device comprises a thin-film resistor, and a reflector is formed in an effective area of the reflection mirror. It is characterized by being provided on the back side of the multilayer optical thin film.
- the heat generating device is formed of a thin-film resistor, it is possible to form the heat generating device on the surface of the reflection mirror by the same process as forming a multilayer optical thin film.
- the surface of the reflection mirror can be heated without hindering the function of the multilayer optical thin film.
- a ninth invention for achieving the above object is the eighth invention, wherein a cut is provided in the thin-film resistor, and the cut divides the thin-film resistor or the multilayer optical thin film into a continuous structure. It is characterized in that it is a strip-shaped heating element.
- a cut is provided in the thin film resistor, and the cut allows the thin film resistor to be formed.
- the antibody is divided into continuous strip-shaped heating elements. Therefore, by applying a voltage to both ends of the continuous strip-shaped thin film resistor, the thin film resistor can generate heat.
- the width of the belt-like portion depending on the location and further controlling the current flowing as necessary, the amount of heat generated can be changed depending on the location, and a desired temperature distribution is given to the reflecting mirror. be able to.
- a tenth invention for achieving the above object is the sixth invention or the seventh invention, wherein the heating means is a multilayer optical thin film constituting a reflector. It is.
- the present invention uses a multilayer optical thin film constituting a reflector as a heating means. Therefore, the same function and effect as the eighth aspect can be obtained. Further, since the multilayer optical thin film itself constituting the reflector is used as a heating device, there is no need to provide a special heating device.
- the eleventh invention for achieving the above object is the tenth invention, wherein the multilayer optical thin film is provided with cuts, and the cuts divide the multilayer optical thin film to form a continuous strip. It is characterized by being a heating element.
- the present invention has the same function and effect as the ninth invention.
- a twenty-second invention for achieving the above object is any one of the sixth to eleventh inventions, wherein the temperature distribution of the reflection mirror due to the heat generated by the heating means is as follows:
- the heat generating means is characterized in that the heat generating means has a temperature distribution substantially the same as when the reflection mirror is in use.
- the amount of heat generated in each portion of the reflection mirror can be adjusted.
- the temperature distribution of the reflecting mirror due to the heat generated by the heating device is If the reflection mirror has substantially the same temperature distribution as that in the used state, the optical characteristics can be measured under the amount of deformation of the mirror close to the used state. “Almost” refers to a range in which the difference between the amount of deformation of the mirror and the state of use does not cause a problem in the measurement accuracy of the optical characteristics.
- a thirteenth invention for achieving the above object has a light source for emitting ultra-short ultraviolet light, an illumination optical system having a reflection mirror for guiding ultra-short ultraviolet light from the light source onto a mask, and a reflection mirror.
- An ultrashort ultraviolet exposure apparatus comprising: a projection optical system for projecting and forming an image of the mask on a sensitive substrate; and a heating means for heating at least one reflection surface of the reflection mirror.
- at least one of the reflection mirrors is any one of the sixth to 12th inventions.
- the reflection mirror for an ultrashort ultraviolet optical system according to any one of the sixth invention to the twelve invention is provided, when measuring the optical characteristics, the reflection mirror is in a deformed state close to a use state. A measurement can be made. Therefore, assembly adjustment can be performed easily and accurately.
- a fourteenth invention for achieving the object is a method for using the ultrashort ultraviolet exposure apparatus according to the thirteenth invention, wherein a heating means heats the reflecting mirror at the start of operation. It is characterized by having.
- the reflection mirror is heated by the heat generating device.
- the reflection mirror quickly reaches a temperature close to the actual use state and its shape is stabilized, so that the use of the reflection mirror can be started earlier rather than being heated by EUV light and waiting for a stable state. it can.
- the heating means other heating means such as a laser or an infrared lamp can be used in addition to the above-described heating means.
- a fifteenth invention for achieving the above object is an ultra-short purple light including a reflecting mirror.
- a method for manufacturing an external optical system comprising: measuring a reflection mirror or an ultra-short ultraviolet optical system including a reflection mirror while heating the reflection mirror by a heating means;
- the present invention is characterized in that it has a step of assembling and adjusting an ultraviolet optical system.
- the measurement when the optical characteristics are measured, the measurement can be performed in a deformed state of the reflecting mirror close to a use state. Therefore, assembly adjustment at the time of manufacturing can be easily and accurately performed.
- a sixteenth invention for achieving the above object is the fifteenth invention, wherein the temperature distribution of the reflection mirror due to heat generated by the heating means is substantially the same as when the reflection mirror is in use. It is characterized by being heated to a temperature distribution.
- the measurement when the optical characteristics are measured, the measurement can be performed in a deformed state of the reflecting mirror which is almost the same as a used state. Therefore, assembly adjustment at the time of manufacturing can be performed easily and accurately.
- the shape and arrangement of each optical element are determined so that the optical characteristics are optimized when the optical element as a component is thermally deformed during exposure. It is an ultra-short ultraviolet optical system characterized by
- the shape and arrangement of each optical element are determined so that the optical characteristics are optimized when the constituent optical element is thermally deformed during exposure.
- the optical characteristics required for actual use can be obtained.
- An eighteenth invention for achieving the above object is a method for using an ultra-short ultraviolet optical system according to the seventeenth invention, wherein the optical element includes a reflection mirror, and a heating means at the start of operation. And a step of heating the reflection mirror.
- the reflection mirror is heated by the heat generating device.
- the reflection mirror quickly reaches a temperature close to the actual use state and its shape is stabilized, so that the use of the reflection mirror can be started earlier rather than being heated by EUV light and waiting for a stable state. it can.
- a nineteenth invention for achieving the above object is an ultrashort ultraviolet exposure apparatus comprising the ultrashort ultraviolet optical system according to the seventeenth invention.
- the ultra-short ultraviolet optical system according to the seventeenth aspect of the present invention is provided, when the optical element as a component is thermally deformed at the time of exposure, the optical characteristics are optimized. The shape and arrangement of each optical element are determined. Therefore, the optical characteristics required in actual use can be obtained.
- FIG. 1 is a flowchart showing an outline of a method for designing an ultrashort ultraviolet optical system according to a first embodiment of the present invention.
- FIG. 2 is a schematic diagram showing a reflection mirror for an ultra-short ultraviolet optical system according to a second embodiment of the present invention.
- FIG. 3 is a diagram showing the principle of forming a temperature distribution by changing the width of a resistor.
- FIG. 4 is a schematic diagram showing a reflection mirror for an ultrashort ultraviolet optical system according to a third embodiment of the present invention.
- FIG. 5 is a schematic diagram showing an ultrashort ultraviolet optical system according to a fourth embodiment of the present invention.
- FIG. 6 is a schematic diagram showing an ultrashort ultraviolet optical system according to a fifth embodiment of the present invention.
- FIG. 7 is a flowchart showing an outline of a conventional method for designing an ultrashort ultraviolet optical system.
- FIG. 8 is a diagram showing an outline of a part of a conventional ultrashort ultraviolet projection exposure apparatus.
- FIG. 1 is a flowchart showing an outline of a design method which is one step in a method of manufacturing an ultra-short ultraviolet optical system according to a first embodiment of the present invention.
- step S11 initial values of design parameters are given as in the conventional method.
- step S12 the thermal deformation of each mirror constituting the ultrashort ultraviolet optical system at the time of exposure is calculated.
- Calculation of thermal deformation is performed as follows. First, the emission intensity of the light source, the wavelength distribution, and the configuration of the entire optical system (illumination system, filter, mask, projection system), and the intensity distribution of light (mostly EUV light) incident on each mirror of the projection system calculate. Next, the absorption energy of the light on the mirror surface (about 30% of the energy of the irradiation light) is determined, and this is used as the heat source arranged on the mirror surface.
- Model a mirror to perform calculations by the finite element method represented as a set of cells decomposed by meshing). The mirror is somehow held and has a cooling mechanism. These are the boundary conditions for mechanical and temperature constraints.
- the temperature distribution of this model is calculated by the finite element method, and the resulting thermal deformation is calculated. After calculating the thermal deformation of each mirror, the process proceeds to step S13, and the optical characteristics are calculated using the surface shape.
- step S14 it is determined whether or not desired optical characteristics have been obtained. If obtained, the process is terminated assuming that the design conditions have been determined. If not, proceed to step S15 to modify design parameters to improve the optical characteristics. Then, using the corrected design parameters, the process returns to step S12 to perform the thermal deformation calculation. in this way Then, iterative calculations determine design conditions having desired optical characteristics ⁇ ) ⁇
- the modification of the design parameters to improve the optical characteristics is specifically as shown below as an example. Since the area near the mirror surface expands due to a rise in temperature, the concave surface is deformed so as to have a large radius of curvature, and the convex surface is deformed so as to have a small radius of curvature. Since the change in the radius of curvature is known from the result of the above thermal deformation calculation, modify the design parameters so as to offset this (that is, to achieve the radius of curvature of the design value after thermal deformation). (Change the radius of curvature or spacing.) Thermal deformation depends not only on temperature distribution but also on mechanical constraints. Therefore, if necessary, modify the mirror hold conditions.
- optical design solution optimized in this way is not optimized at room temperature, but is optimized when the mirror temperature rises due to EUV light absorption and reaches a steady state in actual use conditions. It will be in the state that was done.
- the ultrashort ultraviolet exposure apparatus and the mirror for the optical system as shown in FIG. 8 are designed as described above, and are formed so as to obtain desired optical characteristics in a state of thermal deformation in use, It is possible to obtain an ultra-short ultraviolet exposure apparatus having a predetermined performance and an optical system thereof.
- FIG. 2 is a schematic view showing a reflection mirror for an ultra-short ultraviolet optical system according to a second embodiment of the present invention, where (b) is a plan view and (a) is a cross-sectional view taken along line AA in (b). It is.
- a heat generating mechanism is provided for generating Joule heat by energizing a thin film resistor layer provided below the multilayer optical thin film.
- a thin film resistor layer 2 made of TaN having a thickness of 100 nm is formed on a substrate 1 made of low thermal expansion glass.
- the thin-film resistor layer 2 is formed in a region substantially matching the effective region of the mirror.
- the material of the thin film resistor is not limited to TaN.
- NiCr alloy or T a - 81 0 2 mono- main Uz preparative thin or the like may be used.
- the thin-film resistor layer 2 and other heat generating means are formed in a region almost coincident with the effective area of the mirror as described above.
- the temperature of the mirror can be increased, so that a certain effect can be obtained. This is the same in the third embodiment described later.
- an electrode layer 3 made of Al having a thickness of 100 nm is provided so as to be in contact with both ends thereof.
- Insulating layer 4 made of Si 0 2 having a thickness of 300nm on the thin film resistor layer 2 is formed.
- a Mo / Si multilayer optical film 5 having a period length of 6.7 nm and a stack number of 50 layers serving as a reflector is formed thereon.
- the multilayer optical thin film 5 and the thin film resistor layer 2 are electrically insulated by the insulating layer 4.
- the multilayer optical thin film 5 is formed in the area including the effective area of the mirror (the area used as the reflecting surface), but for simplicity, it is assumed in FIG. 2 that it is provided on the entire surface of the mirror. Is drawn on. It is preferable that the thin film resistor layer 2 is also provided only in the portion where the multilayer optical thin film 5 is provided.
- the thin-film resistor layer 2 is provided with a notch (a portion where the heating resistor is partially removed) 21 of a width of about 10 m in order to obtain a desired heat generation distribution.
- the heat generation is small because the resistance is small at the wide portion of the heating resistor, and the heat generation is large at the narrow portion where the resistance is large.
- Figure 3 illustrates the principle of the method for controlling the heat distribution.
- a voltage is applied to both ends of the thin film resistor and a current flows from left to right.
- the electrical resistance on the left side without the notch is small, and the electrical resistance on the right side with the notch is large.
- the calorific value is proportional to I 2 R (I: current, R: electric resistance), so it is small on the left and large on the right. Since the calorific value is proportional to the electrical resistance, an arbitrary calorific value distribution can be realized by adjusting the thickness of the thin film resistor by changing the notch-cut.
- a method of condensing and irradiating a laser beam and locally removing the thin film resistor layer by laser ablation can be used.
- a pattern such as a resist is formed in advance at a position to be cut, and a thin film resistor layer is formed thereon, and a resist and a thin film resistor layer formed thereon are later formed.
- a so-called re-off method for removal may be used.
- the surface of 4 is flattened.
- planarization first, a 500-nm-thick insulator layer 4 of SiO 2 is formed on the entire surface of the heating resistor layer 2. In this state, a step is formed on the surface of the insulator layer 4 due to the step caused by the cut 21 provided in the heating resistor layer 2. Therefore, polishing is performed until the thickness of the insulator layer 4 becomes 300 nm, and the surface is flattened.
- the thickness of the insulator layer 4 is 400 nm in the portion of the cut 21 of the thin-film resistor layer 2 and 200 nm in the portion of the electrode layer 3.
- the multilayer optical thin film 5 is formed by laminating.
- a hole 41 is provided to expose the electrode layer 3. From here, the electric wiring 6 is connected to the electrode layer 3, and the electric wiring 6 is connected to the power supply 7.
- the thickness of each layer is enlarged relative to the thickness of the substrate 1, but in practice the thickness of the substrate 1 is about 50 Since the thickness including the layer 2 to the multilayer optical thin film 5 is 1 / m or less, the surface of the mirror is heated as in EUV light irradiation. Therefore, this mirror exhibits the same thermal deformation as that during exposure by flowing a predetermined current between both electrodes 3.
- the electric resistance of the thin-film resistor 2 changes depending on the temperature, it is possible to determine the heat generation temperature from the current and voltage at the time of energization by using the thermal coefficient of resistance (TCR) of the thin-film resistor.
- TCR thermal coefficient of resistance
- an exothermic temperature distribution with respect to the current value is measured in advance using an infrared radiation thermometer or the like and data is collected, it is possible to adjust the temperature by the amount of current so as to reach a desired temperature.
- FIG. 4 is a schematic view showing a reflection mirror for an ultrashort ultraviolet optical system according to a third embodiment of the present invention, where (b) is a plan view and (a) is a cross-sectional view taken along line AA in (b). It is.
- the multilayer optical thin film itself is used as a heating mechanism to generate Joule heat. That is, the multilayer optical thin film itself plays the role of the thin-film resistor 2 in the first embodiment.
- a Mo / Si multilayer optical thin film 5 having a period length of 6.7 nm and a stack number of 50 layers is provided.
- the multilayer optical thin film 5 is formed in a region substantially coincident with the effective region of the mirror.
- An electrode layer 3 made of Al of 19 lOOnm is provided.
- the electrode layer 3 and a part of the multilayer optical thin film 5 are formed so as to overlap. It does not matter which part is overlapped. (In Fig. 4, the multilayer optical thin film 5 is drawn above.)
- the multilayer optical thin film 5 is provided with a notch (a portion where the multilayer optical thin film is partially removed) 51 having a width of about 10 m in order to obtain a desired heat generation distribution.
- the heat generation is small because the resistance is small in the wide part, and the heat generation is large in the narrow part because the resistance is large.
- the cut 51 does not reflect the EUV light, but the area of the entire cut is negligibly small compared to the area of the effective area of the mirror, so that there is almost no adverse effect on the optical characteristics.
- a method of condensing and irradiating a laser beam and locally removing the thin film resistor layer by laser ablation can be used.
- a pattern such as a resist is formed in advance at a position to be cut, and a thin film resistor layer is formed thereon, and a resist and a thin film resistor layer formed thereon are later formed.
- a so-called lift-off method for removal may be used.
- the thickness of each layer is enlarged with respect to the thickness of the substrate for simplicity, but in reality, the thickness of the multilayer optical thin film is about 50
- the thickness of the mirror is as follows: As with EUV light irradiation, the mirror surface is heated. Therefore, the mirror exhibits the same thermal deformation as that at the time of exposure by flowing a predetermined current between both electrodes.
- the electrical resistance of the multilayer optical thin film changes with temperature
- TCR resistance temperature coefficient
- FIG. 5 is a schematic diagram showing an ultrashort ultraviolet optical system according to a fourth embodiment of the present invention.
- the portion surrounded by the broken line in FIG. 5 is the ultrashort ultraviolet optical system, and specifically, the projection optical system of the EUV exposure apparatus.
- the projection optical system of the EUV exposure apparatus uses the reflection mirror shown in the second embodiment or the third embodiment as a main component. That is, the heat generating mechanism as shown in the second embodiment or the third embodiment is provided on the reflection surface of each of the mirrors M1 to M6.
- a constant current power supply 7 for energizing is connected to the heat generating mechanism of each mirror by an electric wiring 6 (it goes without saying that the electric wiring 6 is arranged so as not to block the light beam). .
- the output of each constant current power supply is controlled by a control computer 8.
- each mirror When measuring the wavefront of the projection system, a predetermined current is supplied from each constant current power supply to cause each mirror to generate heat.
- the heat distribution due to the absorption of light from the mirrors M1 to ⁇ 6 on the surface of each mirror M1 to ⁇ 6 when performing exposure by mounting it on an EUV exposure apparatus depends on the intensity of the light source mounted on the EUV exposure apparatus and the optical system (illumination system, It can be calculated from the composition of the filter, mask, projection system).
- Each mirror is energized under the same heat distribution conditions.
- the wavefront of the projection system changes greatly. After adjusting the position and orientation of each mirror so that the wavefront aberration is minimized in the state of heat generation, fix them and complete the adjustment work of the projection system. After that, when the heat generation of the mirror is stopped, the wavefront changes greatly again and the wavefront aberration increases.
- Exposure simulation was performed with this projection system mounted on an EUV exposure system (the mirror is not energized). Does a wafer exposed immediately after the start of exposure show only exposure performance below the design values in both resolution and distortion? JP2003 / 012887
- an exposure simulation was performed immediately after the start of the exposure while energizing each mirror of the projection system.
- the mirror surface temperature was measured from the voltage and current, and the current value was controlled so that the temperature was almost the same as in the steady state.
- the exposure performance was as designed after 15 minutes.
- the heating of the mirror due to exposure progressed, the current value gradually decreased due to the temperature control of the mirror, and when the exposure characteristics became stable, the current value of each mirror was almost zero. Thereafter, energization of the mirror was stopped.
- the time required for stabilizing the exposure performance was significantly reduced by generating heat on the surfaces of the mirrors constituting the projection system immediately after the start of exposure.
- FIG. 6 is a schematic diagram showing an ultrashort ultraviolet optical system according to a fifth embodiment of the present invention.
- a portion surrounded by a broken line is an extremely short ultraviolet optical system, and specifically, a projection optical system of an EUV exposure apparatus.
- the basic configuration of the ultrashort ultraviolet optical system of the present embodiment is the same as that shown in FIG. 5, in the present embodiment, a heat generating mechanism is provided on the surface of each of the reflection mirrors M1 to M6.
- Infrared sources A to E are provided instead, and each reflecting mirror M The difference is that the effective area of 1 to M6 is irradiated with infrared rays. Therefore, the effective area of each of the reflection mirrors M1 to M6 is heated by infrared rays and the temperature rises.
- the temperatures of the reflection mirrors M1 to M6 may be measured, and the amount of infrared radiation from each of the infrared sources A to E may be controlled so that the temperatures of the reflection mirrors M1 to M6 become a predetermined temperature. . In this way, as in the embodiment shown in FIG.
- each of the reflection mirrors M1 to M6 is given a temperature distribution equivalent to that in use, and the thermal deformation of each of the reflection mirrors M1 to M6 is performed. Can be almost the same as when using.
- a laser or other heating means may be used as a heat radiation source.
- a heating mechanism is provided for all the reflecting mirrors, and all the reflecting mirrors are heated by infrared rays. Heating may be performed by means. In addition, various combinations can be employed, such as heating some of the reflection mirrors with a heating mechanism and heating some of the other reflection mirrors with heat rays (infrared rays). Further, in the above embodiment, a heating mechanism or an infrared ray is used as the heating mechanism, but any other heating means can be arbitrarily selected and used as long as it can heat the mirror.
- the basic configuration of the ultra-short ultraviolet exposure apparatus according to the embodiment of the present invention is the same as the conventional ultra-short ultraviolet exposure apparatus shown in FIG.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epidemiology (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Optical Elements Other Than Lenses (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004542844A JPWO2004034447A1 (ja) | 2002-10-10 | 2003-10-08 | 極短紫外線光学系用反射ミラー、極短紫外線光学系、極短紫外線光学系の使用方法、極短紫外線光学系の製造方法、極短紫外線露光装置、及び極短紫外線露光装置の使用方法 |
| AU2003271130A AU2003271130A1 (en) | 2002-10-10 | 2003-10-08 | Ultra-short ultraviolet optical system-use reflection mirror, ultra-short ultraviolet optical system, application method for ultra-short ultraviolet optical system, production method for ultra-short ultraviolet optical system, ultra-short ultraviolet exposure system, and application method for ultra-short ultraviolet exposu |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002297025 | 2002-10-10 | ||
| JP2002-297025 | 2002-10-10 | ||
| JP2002312146 | 2002-10-28 | ||
| JP2002-312146 | 2002-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2004034447A1 true WO2004034447A1 (ja) | 2004-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2003/012887 Ceased WO2004034447A1 (ja) | 2002-10-10 | 2003-10-08 | 極短紫外線光学系用反射ミラー、極短紫外線光学系、極短紫外線光学系の使用方法、極短紫外線光学系の製造方法、極短紫外線露光装置、及び極短紫外線露光装置の使用方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2004034447A1 (ja) |
| AU (1) | AU2003271130A1 (ja) |
| WO (1) | WO2004034447A1 (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245374A (ja) * | 2005-03-04 | 2006-09-14 | Nikon Corp | Euv露光装置の調整方法 |
| JP2007536754A (ja) * | 2004-05-06 | 2007-12-13 | カール ツァイス レーザー オプティクス ゲーエムベーハー | 熱挙動が改良された光学部品 |
| JP2013533633A (ja) * | 2010-07-30 | 2013-08-22 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Euv露光装置 |
| JP2013536988A (ja) * | 2010-08-30 | 2013-09-26 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 投影露光装置 |
| TWI464542B (zh) * | 2008-09-29 | 2014-12-11 | 卡爾蔡司Smt有限公司 | 微影投射曝光裝置的照射系統 |
| JP2015528134A (ja) * | 2012-07-24 | 2015-09-24 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Euv投影露光装置用ミラー機構、その操作方法、及びeuv投影露光装置 |
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|---|---|---|---|---|
| JPH05291117A (ja) * | 1992-04-14 | 1993-11-05 | Hitachi Ltd | 投影露光方法およびその装置 |
| US5420436A (en) * | 1992-11-27 | 1995-05-30 | Hitachi, Ltd. | Methods for measuring optical system, and method and apparatus for exposure using said measuring method |
| JP2000036449A (ja) * | 1998-07-17 | 2000-02-02 | Nikon Corp | 露光装置 |
| JP2001013297A (ja) * | 1999-06-30 | 2001-01-19 | Nikon Corp | 反射光学素子および露光装置 |
| JP2002100551A (ja) * | 2000-09-21 | 2002-04-05 | Nikon Corp | 熱変形の自己補償機構付き反射ミラー |
-
2003
- 2003-10-08 JP JP2004542844A patent/JPWO2004034447A1/ja active Pending
- 2003-10-08 WO PCT/JP2003/012887 patent/WO2004034447A1/ja not_active Ceased
- 2003-10-08 AU AU2003271130A patent/AU2003271130A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291117A (ja) * | 1992-04-14 | 1993-11-05 | Hitachi Ltd | 投影露光方法およびその装置 |
| US5420436A (en) * | 1992-11-27 | 1995-05-30 | Hitachi, Ltd. | Methods for measuring optical system, and method and apparatus for exposure using said measuring method |
| JP2000036449A (ja) * | 1998-07-17 | 2000-02-02 | Nikon Corp | 露光装置 |
| JP2001013297A (ja) * | 1999-06-30 | 2001-01-19 | Nikon Corp | 反射光学素子および露光装置 |
| JP2002100551A (ja) * | 2000-09-21 | 2002-04-05 | Nikon Corp | 熱変形の自己補償機構付き反射ミラー |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007536754A (ja) * | 2004-05-06 | 2007-12-13 | カール ツァイス レーザー オプティクス ゲーエムベーハー | 熱挙動が改良された光学部品 |
| JP2006245374A (ja) * | 2005-03-04 | 2006-09-14 | Nikon Corp | Euv露光装置の調整方法 |
| TWI464542B (zh) * | 2008-09-29 | 2014-12-11 | 卡爾蔡司Smt有限公司 | 微影投射曝光裝置的照射系統 |
| US10031423B2 (en) | 2010-07-30 | 2018-07-24 | Carl Zeiss Smt Gmbh | EUV exposure apparatus with reflective elements having reduced influence of temperature variation |
| KR20130096231A (ko) * | 2010-07-30 | 2013-08-29 | 칼 짜이스 에스엠티 게엠베하 | Euv 노광 장치 |
| US9316929B2 (en) | 2010-07-30 | 2016-04-19 | Carl Zeiss Smt Gmbh | EUV exposure apparatus with reflective elements having reduced influence of temperature variation |
| US9746778B2 (en) | 2010-07-30 | 2017-08-29 | Carl Zeiss Smt Gmbh | EUV exposure apparatus with reflective elements having reduced influence of temperature variation |
| JP2013533633A (ja) * | 2010-07-30 | 2013-08-22 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Euv露光装置 |
| KR101895083B1 (ko) * | 2010-07-30 | 2018-10-18 | 칼 짜이스 에스엠티 게엠베하 | Euv 노광 장치 |
| US10317802B2 (en) | 2010-07-30 | 2019-06-11 | Carl Zeiss Smt Gmbh | EUV exposure apparatus with reflective elements having reduced influence of temperature variation |
| US10684551B2 (en) | 2010-07-30 | 2020-06-16 | Carl Zeiss Smt Gmbh | EUV exposure apparatus with reflective elements having reduced influence of temperature variation |
| JP2013536988A (ja) * | 2010-08-30 | 2013-09-26 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 投影露光装置 |
| JP2015528134A (ja) * | 2012-07-24 | 2015-09-24 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Euv投影露光装置用ミラー機構、その操作方法、及びeuv投影露光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2004034447A1 (ja) | 2006-02-09 |
| AU2003271130A1 (en) | 2004-05-04 |
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