WO2004028958A3 - Elektrisches und/oder mikromechanisches bauelement und verfahren - Google Patents

Elektrisches und/oder mikromechanisches bauelement und verfahren Download PDF

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Publication number
WO2004028958A3
WO2004028958A3 PCT/DE2003/000705 DE0300705W WO2004028958A3 WO 2004028958 A3 WO2004028958 A3 WO 2004028958A3 DE 0300705 W DE0300705 W DE 0300705W WO 2004028958 A3 WO2004028958 A3 WO 2004028958A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical
micromechanical component
component
micromechanical
producing
Prior art date
Application number
PCT/DE2003/000705
Other languages
English (en)
French (fr)
Other versions
WO2004028958A2 (de
Inventor
Frieder Haag
Markus Lang
Frank Henning
Original Assignee
Bosch Gmbh Robert
Frieder Haag
Markus Lang
Frank Henning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Frieder Haag, Markus Lang, Frank Henning filed Critical Bosch Gmbh Robert
Publication of WO2004028958A2 publication Critical patent/WO2004028958A2/de
Publication of WO2004028958A3 publication Critical patent/WO2004028958A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Es wird ein elektronisches und/oder mikromechanisches Bauelement und ein Verfahren zur Herstellung eines solchen Bauelements vorgeschlagen, wobei auf eine Oberfläche (120) eine Schicht (31) aufgetragen wird, wobei die Schicht (31) eine gleichmässige Dicke aufweist.
PCT/DE2003/000705 2002-09-19 2003-03-06 Elektrisches und/oder mikromechanisches bauelement und verfahren WO2004028958A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10243513A DE10243513A1 (de) 2002-09-19 2002-09-19 Elektrisches und/oder mikromechanisches Bauelement und Verfahren
DE10243513.8 2002-09-19

Publications (2)

Publication Number Publication Date
WO2004028958A2 WO2004028958A2 (de) 2004-04-08
WO2004028958A3 true WO2004028958A3 (de) 2004-07-22

Family

ID=31969267

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000705 WO2004028958A2 (de) 2002-09-19 2003-03-06 Elektrisches und/oder mikromechanisches bauelement und verfahren

Country Status (2)

Country Link
DE (1) DE10243513A1 (de)
WO (1) WO2004028958A2 (de)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119757A (ja) * 1983-12-01 1985-06-27 New Japan Radio Co Ltd 半導体装置の製造方法
EP0384036A2 (de) * 1988-12-29 1990-08-29 Hitachi Chemical Co., Ltd. Wärmebeständige Kunststoffpaste sowie damit hergestellte integrierte Schaltungsanordnung
US5097317A (en) * 1989-09-08 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device
WO2002019423A1 (en) * 2000-08-30 2002-03-07 Abb Ab Composite
WO2002033749A1 (de) * 2000-10-14 2002-04-25 Robert Bosch Gmbh Verfahren zum schutz elektronischer oder mikromechanischer bauteile
DE10058593A1 (de) * 2000-11-25 2002-06-06 Bosch Gmbh Robert Verpacktes elektronisches Bauelement und Verfahren zur Verpackung eines elektronischen Bauelements

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119757A (ja) * 1983-12-01 1985-06-27 New Japan Radio Co Ltd 半導体装置の製造方法
EP0384036A2 (de) * 1988-12-29 1990-08-29 Hitachi Chemical Co., Ltd. Wärmebeständige Kunststoffpaste sowie damit hergestellte integrierte Schaltungsanordnung
US5097317A (en) * 1989-09-08 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device
WO2002019423A1 (en) * 2000-08-30 2002-03-07 Abb Ab Composite
WO2002033749A1 (de) * 2000-10-14 2002-04-25 Robert Bosch Gmbh Verfahren zum schutz elektronischer oder mikromechanischer bauteile
DE10058593A1 (de) * 2000-11-25 2002-06-06 Bosch Gmbh Robert Verpacktes elektronisches Bauelement und Verfahren zur Verpackung eines elektronischen Bauelements

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 277 (E - 355) 6 November 1985 (1985-11-06) *

Also Published As

Publication number Publication date
DE10243513A1 (de) 2004-04-01
WO2004028958A2 (de) 2004-04-08

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