WO2003107440A2 - Dispositifs optoelectroniques - Google Patents

Dispositifs optoelectroniques Download PDF

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Publication number
WO2003107440A2
WO2003107440A2 PCT/GB2003/002431 GB0302431W WO03107440A2 WO 2003107440 A2 WO2003107440 A2 WO 2003107440A2 GB 0302431 W GB0302431 W GB 0302431W WO 03107440 A2 WO03107440 A2 WO 03107440A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat pipe
heat
pipe according
optical fibres
active region
Prior art date
Application number
PCT/GB2003/002431
Other languages
English (en)
Other versions
WO2003107440A3 (fr
Inventor
Kenneth Board
Gareth Peter Evans
Gareth Jones
Original Assignee
Enfis, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enfis, Limited filed Critical Enfis, Limited
Priority to AU2003241030A priority Critical patent/AU2003241030A1/en
Priority to EP03730348A priority patent/EP1516371A2/fr
Priority to US10/517,907 priority patent/US20060196651A1/en
Publication of WO2003107440A2 publication Critical patent/WO2003107440A2/fr
Publication of WO2003107440A3 publication Critical patent/WO2003107440A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • This invention relates to optoelectronic devices, such as light emitting diodes and other semiconductor light sources.
  • ap-n junction diode when forward biassed, can be made to emit visible light by application of an energy source, and is known as a light emitting diode or LED.
  • the radiation has a broad spectrum and is spontaneous and non-coherent, and is due to the recombination of electrons and holes which occur when conduction band electrons are captured by valence band holes.
  • optical coupling system consisting of a bundle of optical fibres, one end of which is placed in close proximity to the active region or light emitting surface of the device to extract light therefrom.
  • the thermal resistance of the overall arrangement is relatively high because heat is required to flow from the active region of the device (which is generally provided at the upper surface of the device, through the substrate on which the active region is formed to the heat sink, the thermal conductivity of the substrate material generally being substantially lower than that of the heat sink material, which is usually copper.
  • the transient response is low (i.e. there is a considerable delay between the heat being generated and that heat being drawn away from the device). This low transient response is not only due to the above-mentioned relatively high thermal resistance, but also due to the high thermal capacities of the substrate and the heat sink in combination.
  • a cooling mechanism that has, in recent years, been introduced to the field of cooling semiconductor devices is the heat pipe.
  • heat may be applied at a localised area, or evaporator, where the working fluid in the chamber is vaporised absorbing the latent heat of vaporisation.
  • the vapour then flows due to a small pressure gradient, to the opposite side where it condenses and gives up the latent heat of vaporisation.
  • a wick structure along the wall of the heat pipe provides capillary pumping for the liquid to return to the evaporator region thus completing the cycle. This phase change process will cause the condenser side to be nearly isothermal while spreading the energy from the heat source uniformly over the base of the heat sink.
  • Heat pipes have superior heat transfer characteristics compared to more conventional heat removal arrangements, and have been found to be an excellent means to remove unwanted heat from semiconductor devices generally.
  • known heat pipes are obviously not suitable for use on the light output side of semiconductor light sources, because they are opaque and would block the light output.
  • a heat pipe for use in extracting heat from a semiconductor light source having an active region, the heat pipe comprising a transparent or translucent member of thermally conductive material and defining an optical transmission path therethrough, the heat pipe being adapted to be located proximate to the active region of the semiconductor device to extract heat, when in use.
  • the present invention extends to a semiconductor light source including an active region and having a heat pipe as defined above located proximate to said active region.
  • the heat pipe of the present invention is made of a transparent or translucent material, and has a refractive index or refractive index combination which facilitates the passage of light from the active region where it is generated.
  • the heat pipe of the present invention has a number of advantages. Firstly, the effective thermal conductivity of a heat pipe is very large and significantly greater than that of a copper (or similar) heat sink, such that temperature rises are substantially lower than in conventional semiconductor light sources. Secondly, the heat generated in the active region of the device can be removed directly from the surface that is emitting light, in addition (or as an alternative to) heat removal through the substrate. Thirdly, the transient response of the overall system including the heat pipe of the present invention is substantially improved because the heat transport function is dependent on the rate of vapour movement and not on the rate at which heat flows through the substrate and heat sink combination of the prior art. Finally, the heat pipe of the present invention has the significant advantage of permitting the passage of light therethrough such that it is suitable for use with a semiconductor light source.
  • the optical transmission path is preferably provided by means of a channel which runs through the heat pipe.
  • the channel is arranged to receive optical transmission means.
  • the transparent or translucent member preferably comprises a hollow pipe (which can be any closed shape, not necessarily cylindrical) with sealed ends and is made of any suitable thermally conductive transparent or translucent material having the required mechanical strength for the application.
  • a heat pipe is generally at least partially filled with a cooling fluid, such as water, deionised water, or any other suitable working fluid (which may be placed under a partial vacuum so as to lower the boiling point of the liquid).
  • the water in the end of the heat pipe which is closest to the active region is heated by the heat produced by the active region during operation of the device, until it is vaporised, at which point it rises to the cool side of the heat pipe (thus the heat is transported away from the active region as latent heat within the vapour), where it condenses and returns to the hot end of the heat pipe.
  • the condensed liquid may be carried back to the hot end of the heat pipe by gravity.
  • a wick or similar material which transports liquid by capillary action may be provided, in which case the condensed liquid is carried back to the hot end of the heat pipe by capillary forces in the wick.
  • the heat pipe defines a channel therethrough, in which is disposed a bundle of optical fibres or the like, said optical fibres being substantially circular in cross-section, the gaps between said optical fibres defining capillary channels by means of which heated coolant fluid (whether liquid or vaporised) can be transported towards the cool end of the heat pipe, and by means of which the condensed liquid can be transported from the cool end of the heat pipe back to the hot end (closest to the active region of the device).
  • heated coolant fluid whether liquid or vaporised
  • a bundle of optical fibres placed in close proximity to the light emitting surface of a semiconductor light source would not only act as a light guide but, if made part of the heat pipe system, would allow (or at least aid) swift and effective heat removal when the coolant fluid (which is beneficially transparent) contained in the heat pipe is vaporised, and also return of the condensed fluid back to the cool end of the heat pipe.
  • a conventional wick structure of transparent material could be used.
  • Figure 1 is a schematic diagram of a semiconductor light source including a heat pipe in accordance with the present invention.
  • Figure 2 is a schematic diagram illustrating the capillary channels created between the fibres of a bundle of optical fibres for use in an exemplary embodiment of the present invention
  • a semiconductor light source comprises a light emitting semiconductor device 10 having an upper surface 12 that emits light and a lower surface 14.
  • the device 10 is mounted (at its lower surface 14) on a heat sink 16, made of, for example, copper or aluminium.
  • a heat pipe 18 Located on the upper surface 12 of the device 10 is a heat pipe 18 comprising a sealed member of transparent or translucent material having a wick 20 disposed down the sides and along the bottom thereof.
  • the wick 20 may be of any suitable material capable of transporting liquid along it by means of a capillary action.
  • the heat pipe 18 is partially filled with a liquid (preferably transparent, such as water or de- ionised water or the like).
  • a liquid preferably transparent, such as water or de- ionised water or the like.
  • heat pipe 18 which is transparent (or at least translucent) in nature.
  • heat generated by the active region (because of the continuous or intermittent electrical energy applied thereto) is transmitted to the heat pipe 18 (via the upper surface 12 of the device 10), winch heats the liquid in the heat pipe 18.
  • the liquid is vaporised and rises toward the top of the heat pipe 18 (which is relatively cool), where it condenses and returns by means of gravity (and the wick 20) to the lower (hot) end of the heat pipe 18.
  • a condenser 22 is provided at the upper (cool) end of the heat pipe 18 to speed up the process of condensing the coolant fluid within the heat pipe 18.
  • heat may simply be removed by convection from the surface of the heat pipe.
  • the heat pipe of the present invention provides an optical coupling system which also removes heat directly from the surface of the device close to the active region using a transparent heat pipe.
  • a bundle of optical fibres 30 are provided within the heat pipe 18.
  • the optical fibres obviously provide a more efficient optical transmission means for extracting the light generated by the active region of the device 10.
  • the gaps 32 created between the optical fibres 30 in the bundle provide an efficient capillary action within the heat pipe 18 for transport of vapour to the cool end of the pipe 18 and (more importantly) for transport of condensed coolant to the hot end of the pipe 18.
  • a geometry which provides efficient capillary action consists of one or more holes with sharp corners (the more acute the angles, the greater the capillary action), which is achieved naturally in the interstices between the substantially circular optical fibres 30, as shown in Figure 2 of the drawings. It will be appreciated that the capillary forces acting in the gaps 32 will be relatively strong, provided that the dimensions are suitably small.
  • the optical fibres 30 may be provided so as to substantially fill the channel defined by the pipe 18, in which case cooling fluid may have to flow in both directions along the gaps 32 provided between the fibres.
  • the fibres 30 may only partially fill the channel (they may, for example, be provided around the inner periphery of the pipe 18, in which case a large gap is left through which vaporised cooling fluid can be rapidly and effectively transported away from the light emitting surface.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un dispositif semi-conducteur luminescent (10) monté sur un dissipateur thermique (16) et comprenant un caloduc (18) situé sur sa surface supérieure (12). Le caloduc (18) comprend un élément cylindrique étanche conçu dans un matériau transparent ou translucide, une mèche (20) étant disposée vers le bas du côté et le long du fond de celui-ci. La chaleur (18) est partiellement remplie d'un liquide placé sous un vide partiel, de manière à réduire son point d'ébullition. Un faisceau de fibres optiques (Figure 2-30) peut être placé dans le caloduc (18), des trous (Figure 2-32) étant créés entre les fibres optiques (Figure 2-30) et conférant une action capillaire efficace dans le caloduc (18) pour le transport de vapeur dans l'extrémité froide du caloduc (18) et pour le transport d'un agent réfrigérant condensé dans l'extrémité chaude du caloduc (18).
PCT/GB2003/002431 2002-06-13 2003-06-05 Dispositifs optoelectroniques WO2003107440A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2003241030A AU2003241030A1 (en) 2002-06-13 2003-06-05 Opteolectronic devices
EP03730348A EP1516371A2 (fr) 2002-06-13 2003-06-05 Dispositifs optoelectroniques
US10/517,907 US20060196651A1 (en) 2002-06-13 2003-06-05 Opteolectronic devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0213504.4 2002-06-13
GB0213504A GB2389706A (en) 2002-06-13 2002-06-13 Optoelectronic devices

Publications (2)

Publication Number Publication Date
WO2003107440A2 true WO2003107440A2 (fr) 2003-12-24
WO2003107440A3 WO2003107440A3 (fr) 2004-08-05

Family

ID=9938450

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2003/002431 WO2003107440A2 (fr) 2002-06-13 2003-06-05 Dispositifs optoelectroniques

Country Status (5)

Country Link
US (1) US20060196651A1 (fr)
EP (1) EP1516371A2 (fr)
AU (1) AU2003241030A1 (fr)
GB (1) GB2389706A (fr)
WO (1) WO2003107440A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006031023A1 (fr) * 2004-09-15 2006-03-23 Seoul Semiconductor Co., Ltd. Dispositif lumineux pourvu d'un caloduc et procede permettant de fabriquer un fil de sortie de caloduc pour un dispositif lumineux
WO2009007905A2 (fr) * 2007-07-11 2009-01-15 Koninklijke Philips Electronics N.V. Caloduc
DE102007041852A1 (de) * 2007-09-03 2009-03-05 Osram Opto Semiconductors Gmbh Hochleistungs- LED Modul
US9726435B2 (en) 2002-07-25 2017-08-08 Jonathan S. Dahm Method and apparatus for using light emitting diodes for curing

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Publication number Priority date Publication date Assignee Title
US8109981B2 (en) 2005-01-25 2012-02-07 Valam Corporation Optical therapies and devices
WO2007056541A2 (fr) 2005-11-08 2007-05-18 Young Garrett J Dispositif, procedes et systemes pour affichage ou projection multi-primaire
US8292463B2 (en) 2006-07-28 2012-10-23 Koninklijke Philips Electronics N.V. Illumination module with similar heat and light propagation directions
US8827498B2 (en) * 2008-09-30 2014-09-09 Osram Sylvania Inc. LED light source having glass heat pipe with fiberglass wick
CN101813429B (zh) * 2009-02-20 2013-01-23 富瑞精密组件（昆山）有限公司 热管的制造方法
CA2757050A1 (fr) * 2009-03-31 2010-10-07 John Andre Adams Module optique de collimation a del fournissant un raccord isolant
US8378559B2 (en) * 2009-08-20 2013-02-19 Progressive Cooling Solutions, Inc. LED bulb for high intensity discharge bulb replacement
EP2480828A2 (fr) * 2009-09-25 2012-08-01 Cree, Inc. Appareil d'éclairage ayant un élément de dissipation de la chaleur
KR20110106169A (ko) * 2010-03-22 2011-09-28 삼성전자주식회사 광원 모듈 및 이를 가지는 디스플레이장치
US8746975B2 (en) 2011-02-17 2014-06-10 Media Lario S.R.L. Thermal management systems, assemblies and methods for grazing incidence collectors for EUV lithography
US8731139B2 (en) 2011-05-04 2014-05-20 Media Lario S.R.L. Evaporative thermal management of grazing incidence collectors for EUV lithography
GB2514552A (en) 2013-05-28 2014-12-03 Ibm Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network
GB2514551A (en) * 2013-05-28 2014-12-03 Ibm Fluid-cooled electronic circuit device with cooling fluid conduits having optical transmission medium
FR3054292B1 (fr) * 2016-07-22 2019-04-05 Valeo Vision Module lumineux de vehicule terrestre
US10877217B2 (en) 2017-01-06 2020-12-29 Rockley Photonics Limited Copackaging of asic and silicon photonics
CN110799874A (zh) 2017-08-01 2020-02-14 洛克利光子有限公司 具有发射光学子组件和接收光学子组件的模块
DE102020112591A1 (de) 2020-05-08 2021-11-11 Airbus S.A.S. Kühlvorrichtung zur verwendung in magnetischen wechselfeldern, spulenanordnung, elektrische maschine und flugzeug

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US3825741A (en) * 1973-03-05 1974-07-23 Tinsley Labor Inc Light source with high efficiency light collection means
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JPS5546589A (en) * 1978-09-29 1980-04-01 Fujitsu Ltd Cooled photoelectric converter
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EP0435473A2 (fr) * 1989-12-29 1991-07-03 Digital Equipment Corporation Evaporateur comportant des sites de nucléation formés par décapage de fibres et sa méthode de fabrication
EP0658933A2 (fr) * 1993-12-16 1995-06-21 Sharp Kabushiki Kaisha Dispositifs à semi-conducteur et méthode de fabrication
EP0789405A2 (fr) * 1996-02-07 1997-08-13 Toyota Jidosha Kabushiki Kaisha Méthode pour refroidir des cellules solaires
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FR1428845A (fr) * 1965-03-22 1966-02-18 Thomson Houston Comp Francaise Perfectionnements aux systèmes pour engendrer un rayonnement cohérent
GB1216090A (en) * 1966-12-28 1970-12-16 Philips Electronic Associated Semiconductor devices
GB1295775A (fr) * 1969-04-01 1972-11-08
US3825741A (en) * 1973-03-05 1974-07-23 Tinsley Labor Inc Light source with high efficiency light collection means
US3860847A (en) * 1973-04-17 1975-01-14 Los Angeles Miniature Products Hermetically sealed solid state lamp
JPS5546589A (en) * 1978-09-29 1980-04-01 Fujitsu Ltd Cooled photoelectric converter
JPS60153188A (ja) * 1984-01-21 1985-08-12 Toshiaki Shinmura ヒ−トパイプを利用した半導体レ−ザ−出力装置
EP0435473A2 (fr) * 1989-12-29 1991-07-03 Digital Equipment Corporation Evaporateur comportant des sites de nucléation formés par décapage de fibres et sa méthode de fabrication
EP0658933A2 (fr) * 1993-12-16 1995-06-21 Sharp Kabushiki Kaisha Dispositifs à semi-conducteur et méthode de fabrication
EP0789405A2 (fr) * 1996-02-07 1997-08-13 Toyota Jidosha Kabushiki Kaisha Méthode pour refroidir des cellules solaires
WO1999016136A1 (fr) * 1997-09-25 1999-04-01 University Of Bristol Dispositif de rayonnement optique
JP2001036153A (ja) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd 光源装置
US20030052584A1 (en) * 2001-09-17 2003-03-20 Nobuyuki Matsui Lighting apparatus with enhanced capability of removing heat

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9726435B2 (en) 2002-07-25 2017-08-08 Jonathan S. Dahm Method and apparatus for using light emitting diodes for curing
WO2006031023A1 (fr) * 2004-09-15 2006-03-23 Seoul Semiconductor Co., Ltd. Dispositif lumineux pourvu d'un caloduc et procede permettant de fabriquer un fil de sortie de caloduc pour un dispositif lumineux
US8569939B2 (en) 2004-09-15 2013-10-29 Seoul Semiconductor Co., Ltd. Luminous device with heat pipe and method of manufacturing heat pipe lead for luminous device
WO2009007905A2 (fr) * 2007-07-11 2009-01-15 Koninklijke Philips Electronics N.V. Caloduc
WO2009007905A3 (fr) * 2007-07-11 2009-03-26 Koninkl Philips Electronics Nv Caloduc
DE102007041852A1 (de) * 2007-09-03 2009-03-05 Osram Opto Semiconductors Gmbh Hochleistungs- LED Modul

Also Published As

Publication number Publication date
EP1516371A2 (fr) 2005-03-23
AU2003241030A8 (en) 2003-12-31
AU2003241030A1 (en) 2003-12-31
US20060196651A1 (en) 2006-09-07
GB0213504D0 (en) 2002-07-24
GB2389706A (en) 2003-12-17
WO2003107440A3 (fr) 2004-08-05

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