WO2003073373A1 - Support intermediaire destine a etre insere dans un support et support comportant un tel support intermediaire - Google Patents

Support intermediaire destine a etre insere dans un support et support comportant un tel support intermediaire Download PDF

Info

Publication number
WO2003073373A1
WO2003073373A1 PCT/DE2003/000414 DE0300414W WO03073373A1 WO 2003073373 A1 WO2003073373 A1 WO 2003073373A1 DE 0300414 W DE0300414 W DE 0300414W WO 03073373 A1 WO03073373 A1 WO 03073373A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
compensating element
cavity
support
intermediate carrier
Prior art date
Application number
PCT/DE2003/000414
Other languages
German (de)
English (en)
Inventor
Harald Gundlach
Peter Stampka
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2003073373A1 publication Critical patent/WO2003073373A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Definitions

  • the invention relates to a carrier with a cavity, into which a further carrier can be inserted such that it has no gaps between a wall of the cavity and the further carrier in the stress-free state.
  • the invention further relates to an intermediate carrier for insertion into the carrier.
  • Such carriers are often designed in the form of a chip card body.
  • the further carrier is, for example, a chip module which is inserted into the cavity of the carrier and is approximately flush with the top of the carrier. If the chip module is designed as a contact-based chip module, external contact elements for external contacting are approximately flush with the top of the carrier. If, on the other hand, the chip module is designed as a contactless chip module, it itself is approximately flush with the top of the carrier or the chip card body.
  • the carrier can only represent a chip card body.
  • the further carrier can not only be designed as a chip module, which consists of an intermediate carrier and a chip attached to it.
  • the intermediate carrier consists of a flexible material, e.g. B. a plastic made of epoxy.
  • the further carrier with a plurality of electrical functional components, for. B. a memory chip, a display, an input device, a contact element device, etc. is provided.
  • the individual functional components can be electrically connected to one another in the further carrier via conductor tracks his. After the functionality of all functional components in the further carrier has been checked, the latter can be inserted into the cavity of the carrier.
  • the further carrier must be inserted into the carrier in such a way that, on the one hand, a flush surface is formed on the top of the carrier and, on the other hand, there are no gaps between the further carrier and a wall of the cavity of the carrier.
  • the arrangement of the carrier and the further carrier is often printed on the top after completion. A clean and sharp print image is only obtained if the other carrier in the cavity is flush with the top of the carrier. The aesthetic aspect therefore plays a role in fulfilling the first requirement.
  • the second requirement should not only be met when the beam is in a load-free state, but also when the beam is bent. Such bending stresses occur, for example, when the carrier is kept in a purse or is transported via a letter sorting system via deflection rollers with a diameter of usually 40 mm.
  • the carrier usually consists of a flexible material, while the further carrier consists of a rigid or rigid material, so that the electrical functional components incorporated in it in the case of a Bending no forces are exerted. Avoiding gaps is particularly difficult to achieve.
  • the object of the present invention is to provide an arrangement in which even with a bending load it is ensured that no gaps occur between the further carrier used in a cavity and the wall of the cavity of the carrier.
  • This object is achieved by a carrier and a further carrier used therein with the features of claim 1.
  • This object is also achieved by a further carrier, referred to as an intermediate carrier, having the features of claim 10.
  • the invention is based on the idea that due to the different materials of the carrier and the further carrier, a load is exerted on the intermediate carrier during a bend. Due to the rigid material of the further carrier, gaps can arise between the latter and the wall of the cavity of the carrier. This applies both when the further carrier is not firmly connected to the carrier in the region of the wall of the cavity, and also in the case where the further carrier is connected to the wall, for example by means of an adhesive. In order to avoid the gaps then occurring, the further carrier could also be made from a flexible and flexible material. However, this would have the disadvantage that components integrated in the further carrier would now be exposed to the bending stress. The invention therefore goes a different way.
  • the further carrier can also consist of a rigid, inflexible material.
  • a compensating element now ensures that no forces can occur when bending loads occur in the area of the cavities.
  • the compensating element alone absorbs the forces that occur, so that the requirements mentioned at the outset for a flat top side and a gap-free arrangement can be met in a simple manner.
  • the further carrier is preferably firmly connected to the carrier.
  • the connection can be made using an adhesive or any other connecting material.
  • the firm connection is preferably made both in the area of the bottom of the cavity and in the area of the walls. In this way it is ensured in any case that no gaps can occur between the carrier and the further carrier. In the area of the compensating element of the further carrier, it is not absolutely necessary to establish a firm connection with the carrier.
  • the further carrier is preferably designed as an intermediate carrier on or in which at least two functional components can be integrated, which can be electrically connected to one another via conductor tracks.
  • the functional components can be, for example, an integrated circuit, a display device, an input device such as a keyboard and other elements.
  • the functional elements can be arranged in the further carrier such that at least some are accessible from the top of the carrier. This should not be the case with a memory chip, so that it could be located entirely in the further carrier.
  • the conductor tracks are preferably applied to the intermediate carrier on which the functional elements are also mounted.
  • the further carrier can be constructed in one piece or from several layers. It is thus possible to fill in the gaps that arise between individual functional components with the material of the further carrier. In this way, the flat surface on the top of the carrier is possible.
  • the compensating element is arranged centrally in the further carrier or intermediate carrier.
  • the central arrangement of the compensating element enables a uniform distribution of the forces that occur under a bending load.
  • a compensating element is preferably arranged between two functional components.
  • the arrangement between the functional components ensures that they themselves are not subjected to any forces in the event of a bend.
  • the arrangement of a compensating element directly below one of the functional components would have the consequence that the bending forces that occur would also be transmitted directly to functional components located above the compensating element. This could cause a malfunction or a failure of the functional component.
  • the compensating element can be represented by a weakening of the intermediate carrier.
  • the intermediate carrier could, for example, have an accordion-shaped configuration. Basically, the provision of bores in the intermediate carrier would already result in a predetermined bending point which would be suitable for absorbing the bending forces.
  • the compensating element is designed in such a way that a spring effect is achieved in the lateral extent of the intermediate carrier.
  • the compensating element can also be formed by the material and / or the course of the conductor tracks. The material of the conductor tracks would then have to be such that an expansion of the same is reversible. The easiest way to achieve this, however, is that the conductor tracks are also designed in the form of a spring element.
  • FIG. 1 shows the arrangement of a further carrier in a cavity of a carrier in a sectional view
  • FIG. 2 shows a plan view of the further carrier
  • FIG. 3 shows a sectional illustration of the further carrier, from which a further example of a compensating element emerges
  • Figure 4 is a sectional view of the further carrier, in which the compensating element is formed by conductor tracks and
  • Figure 5 shows the arrangement of a further carrier in a cavity of a carrier in a sectional view.
  • Figure 1 shows a sectional view of a one-piece carrier 10 with a cavity 11, in which a further carrier is inserted.
  • the further carrier consists of an intermediate carrier 20,
  • the intermediate carrier 20 laterally has approximately the dimensions of the cavity 11 and is connected to its base 14 via an adhesive 41.
  • the functional elements 30a, 30b which could represent, for example, a display element and a chip provided with external contact elements, are applied to the side of the intermediate carrier 20 facing away from the bottom 14 of the cavity 11.
  • the functional components 30a, 30b are electrically connected to one another via one or more conductor tracks 31 applied to the intermediate carrier 20. Since the functional components 30a, 30b do not cover the entire surface of the intermediate carrier 20, a filling element 22b is arranged between them, which has the same height as the functional components 30a, 30b.
  • a filling element 22a, 22c is also provided between the respective functional components 30a, 30b and the walls 12 of the cavity.
  • the filling elements 22a, 22c are also firmly connected to the walls of the cavity by means of an adhesive 41.
  • the intermediate carrier 20 has a compensating element 23 in a central area, the more detailed configuration of which can be seen in more detail in FIGS. 2 to 4.
  • the central arrangement of the compensating element 23 is not absolutely necessary, but ensures that, in the event of a bend, the forces not absorbed by a compensating element 23 are evenly distributed over the areas of the intermediate carrier located to the left and right of the compensating element. As shown in FIG. 1, it makes sense if the compensating element 23 is not located directly below one of the functional elements 30a, 30b applied to the intermediate carrier 20. Since the compensating element 23 in particular permits a change in length, this would mean a force acting on an overlying functional element. This could be damaged.
  • FIG. 1 also shows the preferred arrangement of the compensating element 23, namely between two functional elements 30a, 30b.
  • FIG. 5 shows an alternative arrangement in which a cover element 15 is applied to the top 13 of the carrier 10. The overall arrangement is thus made up of several layers.
  • the cover element 15 has recesses 17 through which the functional components 30a, 30b extend so that they are accessible from the outside.
  • the compensating element ensures that, in the event of a bend exerted on the arrangement, no forces act on the further carrier 20 and the functional components 30a, 30b located thereon.
  • FIG. 2 shows a first exemplary embodiment of the manner in which the compensating element 23 can be designed.
  • the top view of the intermediate carrier 20 is shown.
  • the intermediate carrier 20 is now divided into two regions 20a, 20b, which are connected via the compensating element 23.
  • the compensating element 23 is part of the intermediate carrier. It has the shape of an upside down V or U, which was obtained by weakening the intermediate carrier 20.
  • the shape of the compensating element shown enables a change in length in the lateral direction, i. H. the distance between the areas 20a, 20b can be larger or smaller.
  • the compensating element 23 also enables bending along an axis running parallel from the bottom up to the plane of the drawing.
  • FIG. 3 shows an alternative embodiment of the compensating element 23 in cross section.
  • the intermediate carrier 20 is in turn divided into the two regions 20a, 20b and connected to one another via an accordion-shaped compensation element 23.
  • This configuration of the compensating element 23 also permits changes in length and also bends around an axis running into the plane of the drawing.
  • FIGS. 2 and 3 have in common that the compensating element 23 is formed by the intermediate carrier 20 itself.
  • FIG. 4 shows an exemplary embodiment in which the compensating element 23 is formed by conductor tracks 31 applied to the intermediate carrier 20.
  • the intermediate carrier 20 or its regions 20a, 20b are now held exclusively via the conductor track 31. It would also be conceivable to additionally support the regions 20a, 20b via the accordion-shaped element shown in FIG.
  • the stretchability can be achieved on the one hand by the design of the conductor track 31, which could also be in the form of a meander, for example.
  • the extensibility could also be achieved by using the material of the conductor tracks.
  • the use of polymer conductor tracks would be conceivable.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Electrotherapy Devices (AREA)

Abstract

L'invention concerne un premier support (10) comportant une cavité (11) pouvant recevoir un deuxième support (20) de manière que ce dernier soit jointif avec un côté supérieur (13) du premier support (10), et qu'il n'y ait pas d'espace entre une paroi (12) de la cavité (11) et le deuxième support (20) à l'état non contraint. Selon l'invention, le deuxième support (20) est pourvu d'au moins un élément de compensation (23) permettant d'éviter toute contrainte sur le deuxième support (20) en cas de flexion du premier support (10).
PCT/DE2003/000414 2002-02-26 2003-02-12 Support intermediaire destine a etre insere dans un support et support comportant un tel support intermediaire WO2003073373A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002108172 DE10208172B4 (de) 2002-02-26 2002-02-26 Zwischenträger zum Einsetzen in einen Träger und Träger mit einem Zwischenträger
DE10208172.7 2002-02-26

Publications (1)

Publication Number Publication Date
WO2003073373A1 true WO2003073373A1 (fr) 2003-09-04

Family

ID=27762444

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000414 WO2003073373A1 (fr) 2002-02-26 2003-02-12 Support intermediaire destine a etre insere dans un support et support comportant un tel support intermediaire

Country Status (3)

Country Link
DE (1) DE10208172B4 (fr)
TW (1) TW200303489A (fr)
WO (1) WO2003073373A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786988A (en) * 1996-07-02 1998-07-28 Sandisk Corporation Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
FR2799857A1 (fr) * 1999-10-14 2001-04-20 Gemplus Card Int Procede pour le renforcement d'un module de circuit integre de carte a puce
EP1152368A1 (fr) * 2000-05-05 2001-11-07 Infineon Technologies AG Carte à puce

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4441931C1 (de) * 1994-04-27 1995-07-27 Siemens Ag Chipkarte
DE19631166C2 (de) * 1996-08-01 2000-12-07 Siemens Ag Chipkarte
DE50015305D1 (de) * 2000-02-02 2008-09-25 Infineon Technologies Ag Chipkarte mit Sollbiegestellen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786988A (en) * 1996-07-02 1998-07-28 Sandisk Corporation Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
FR2799857A1 (fr) * 1999-10-14 2001-04-20 Gemplus Card Int Procede pour le renforcement d'un module de circuit integre de carte a puce
EP1152368A1 (fr) * 2000-05-05 2001-11-07 Infineon Technologies AG Carte à puce

Also Published As

Publication number Publication date
TW200303489A (en) 2003-09-01
DE10208172A1 (de) 2003-09-18
DE10208172B4 (de) 2005-07-07

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