WO2003060987A1 - Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device - Google Patents

Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device Download PDF

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Publication number
WO2003060987A1
WO2003060987A1 PCT/JP2003/000148 JP0300148W WO03060987A1 WO 2003060987 A1 WO2003060987 A1 WO 2003060987A1 JP 0300148 W JP0300148 W JP 0300148W WO 03060987 A1 WO03060987 A1 WO 03060987A1
Authority
WO
WIPO (PCT)
Prior art keywords
arranging
micro
semiconductor device
micro spheres
liquid
Prior art date
Application number
PCT/JP2003/000148
Other languages
English (en)
French (fr)
Inventor
Ichiro Hazeyama
Masahiro Kubo
Sakae Kitajo
Kazuhiko Futakami
Shinichi Ishiduka
Susumu Nanko
Hitoshi Anma
Tosiji Yamada
Akeo Katahira
Original Assignee
Nec Corporation
Japan Em Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation, Japan Em Co., Ltd. filed Critical Nec Corporation
Priority to AU2003202505A priority Critical patent/AU2003202505A1/en
Priority to JP2003560981A priority patent/JP4266830B2/ja
Priority to US10/501,195 priority patent/US7119438B2/en
Publication of WO2003060987A1 publication Critical patent/WO2003060987A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02123—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body inside the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01023—Vanadium [V]
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    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01047—Silver [Ag]
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    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Micromachines (AREA)
  • Manipulator (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
PCT/JP2003/000148 2002-01-10 2003-01-10 Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device WO2003060987A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2003202505A AU2003202505A1 (en) 2002-01-10 2003-01-10 Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device
JP2003560981A JP4266830B2 (ja) 2002-01-10 2003-01-10 微小球体の液体による整列方法、および微小球体整列装置
US10/501,195 US7119438B2 (en) 2002-01-10 2003-01-10 Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002-3869 2002-01-10
JP2002003869 2002-01-10
JP2002040116 2002-02-18
JP2002-40116 2002-02-18
JP2002-206047 2002-07-15
JP2002206047 2002-07-15

Publications (1)

Publication Number Publication Date
WO2003060987A1 true WO2003060987A1 (en) 2003-07-24

Family

ID=27348070

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/000148 WO2003060987A1 (en) 2002-01-10 2003-01-10 Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device

Country Status (6)

Country Link
US (1) US7119438B2 (ja)
JP (1) JP4266830B2 (ja)
CN (1) CN100341126C (ja)
AU (1) AU2003202505A1 (ja)
TW (1) TWI226670B (ja)
WO (1) WO2003060987A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007529120A (ja) * 2004-03-12 2007-10-18 セミトゥール インコーポレイテッド ワークピース処理用シングルチャンバ
JP2008041803A (ja) * 2006-08-03 2008-02-21 Showa Denko Kk ハンダ回路基板の製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4427411B2 (ja) * 2004-07-28 2010-03-10 日立ソフトウエアエンジニアリング株式会社 ビーズ配列装置及びビーズ配列方法
CA2589483C (en) 2004-12-03 2013-10-29 Schering Corporation Substituted piperazines as cb1 antagonists
CA2637565A1 (en) 2006-01-18 2007-07-26 Schering Corporation Cannibinoid receptor modulators
RU2010102478A (ru) 2007-06-28 2011-08-10 Интэрвэт Интэрнэшнл Б.Ф. (NL) Замещенные пиперазины как антагонисты св1
JP5518500B2 (ja) 2010-01-20 2014-06-11 昭和電工株式会社 はんだ粉末付着装置および電子回路基板に対するはんだ粉末の付着方法
CN102122606B (zh) * 2010-11-16 2012-07-18 上海微松工业自动化有限公司 一种晶圆级封装微球自动收集及供球循环设备
CN102167838B (zh) * 2010-12-21 2012-11-28 苏州纳微生物科技有限公司 一种含树枝状结构聚合物复合微球及各向异性导电材料和各向异性导电膜
CN102922131B (zh) * 2012-11-16 2014-12-10 厦门大学 一种光纤微球制备装置
CN107246203A (zh) * 2017-08-01 2017-10-13 陕西隆翔停车设备集团有限公司 一种快速提升库门
TWI811027B (zh) * 2022-07-18 2023-08-01 創新服務股份有限公司 基板的電子元件安裝方法、元件排列裝置及自動化電子元件安裝設備

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5976965A (en) * 1997-06-18 1999-11-02 Nec Corporation Method for arranging minute metallic balls
JP2000294676A (ja) * 1999-04-02 2000-10-20 Hitachi Via Mechanics Ltd はんだボールの搭載方法およびその装置
US20010009261A1 (en) * 2000-01-25 2001-07-26 Japan E M Co., Ltd. Method and apparatus for lining up micro-balls
JP2001223232A (ja) * 2000-02-08 2001-08-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107181A (en) * 1997-09-08 2000-08-22 Fujitsu Limited Method of forming bumps and template used for forming bumps
JPH11240612A (ja) * 1998-02-26 1999-09-07 Nichiden Mach Ltd 微細ボールの整列方法及びその装置
JP2001168127A (ja) * 1999-12-08 2001-06-22 Japan Em Kk 微小球体移載装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5976965A (en) * 1997-06-18 1999-11-02 Nec Corporation Method for arranging minute metallic balls
JP2000294676A (ja) * 1999-04-02 2000-10-20 Hitachi Via Mechanics Ltd はんだボールの搭載方法およびその装置
US20010009261A1 (en) * 2000-01-25 2001-07-26 Japan E M Co., Ltd. Method and apparatus for lining up micro-balls
JP2001223232A (ja) * 2000-02-08 2001-08-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007529120A (ja) * 2004-03-12 2007-10-18 セミトゥール インコーポレイテッド ワークピース処理用シングルチャンバ
JP2008041803A (ja) * 2006-08-03 2008-02-21 Showa Denko Kk ハンダ回路基板の製造方法

Also Published As

Publication number Publication date
CN1615542A (zh) 2005-05-11
JPWO2003060987A1 (ja) 2005-05-19
AU2003202505A1 (en) 2003-07-30
JP4266830B2 (ja) 2009-05-20
US20050040528A1 (en) 2005-02-24
TWI226670B (en) 2005-01-11
CN100341126C (zh) 2007-10-03
US7119438B2 (en) 2006-10-10
TW200405490A (en) 2004-04-01

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