WO2003037547A1 - Dispositif de refroidissement de moule - Google Patents

Dispositif de refroidissement de moule Download PDF

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Publication number
WO2003037547A1
WO2003037547A1 PCT/JP2002/011269 JP0211269W WO03037547A1 WO 2003037547 A1 WO2003037547 A1 WO 2003037547A1 JP 0211269 W JP0211269 W JP 0211269W WO 03037547 A1 WO03037547 A1 WO 03037547A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling water
air
cooling
mold
pressure
Prior art date
Application number
PCT/JP2002/011269
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Shigeyoshi Komaki
Original Assignee
Ahresty Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ahresty Corporation filed Critical Ahresty Corporation
Publication of WO2003037547A1 publication Critical patent/WO2003037547A1/ja

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20Accessories: Details
    • B22D17/22Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
    • B22D17/2218Cooling or heating equipment for dies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22CFOUNDRY MOULDING
    • B22C9/00Moulds or cores; Moulding processes
    • B22C9/06Permanent moulds for shaped castings
    • B22C9/065Cooling or heating equipment for moulds

Definitions

  • the present invention relates to a mold cooling device used for die casting, resin molding, and the like, and more specifically, to circulating cooling water in a cooling hole formed in a mold.
  • the present invention relates to a mold cooling device that cools a mold.
  • This mold cooling device is provided with a cooling water supply path for supplying cooling water into a cooling hole formed in the mold and an air purge for cooling water in the cooling hole in a pumping section for pumping cooling water and air.
  • An air purge path for feeding a high-pressure air is connected to the cooling water supply path and a fluid merging section for joining the air purge path.
  • the cooling water flows from the cooling water supply path to the mold through the fluid junction. It may flow into the cooling holes, and the effect of the air purge is diminished and the mold becomes too cold. This phenomenon occurs because the cooling water in the cooling water supply path is held at a higher pressure than the original holding pressure. That is, the cooling water is supplied from the cooling water Immediately after the recirculation water has been supplied into the cooling holes of the mold, a high-pressure (higher than the cracking pressure of the check valve) air flows from the air purge path through the above-mentioned fluid junction.
  • the cooling water that has been trapped is sealed at a high pressure, and when the air purge is completed, the differential pressure retained at a pressure exceeding the cracking pressure flows out into the cooling hole of the mold.
  • This tendency is remarkable when a rubber hose is used in the cooling water supply path, and it is considered that the rubber hose expands and functions as a kind of accumulator.
  • the present invention has been made in view of such conventional problems, and there is no possibility that cooling water will flow out into the cooling holes of the mold after the completion of the air purge, and the temperature of the mold is more strictly controlled.
  • the purpose of the present invention is to provide a mold cooling device capable of performing the following.
  • a mold cooling device configured to supply cooling water into a cooling hole formed in a mold to a pumping section for pumping cooling water and air.
  • the cooling water supply path is connected to an air purge path for supplying high-pressure air for air purging the cooling water in the cooling hole.
  • a mold cooling apparatus configured to cool a mold by alternately supplying cooling water and air into a hole, wherein cooling water and air having a pressure lower than a cracking pressure are respectively supplied to the fluid converging portion.
  • a check valve to maintain the supply path and the air purge path is incorporated, and after the cooling water is discharged from the cooling water supply path through the fluid merging section, there is a time lag and the High-pressure air is discharged through the fluid junction.
  • FIG. 1 is a schematic circuit diagram showing an embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
  • the mold cooling device basically includes: a pumping section 1 for pumping water and air; and a cooling hole A 1 connected to the pumping section 1 and drilled in the mold A.
  • a pumping section 1 for pumping water and air
  • a cooling hole A 1 connected to the pumping section 1 and drilled in the mold A.
  • the pumping section 1 is for alternately pumping the cooling water and the air.
  • the high-pressure water discharge pump 1b connected to the water supply pipe 1a connected to the water supply source to discharge the cooling water, and the high-pressure water Solenoid valve for cooling water 1c incorporated in the discharge side piping of discharge pump 1b, Solenoid valve for air 1e incorporated in air piping 1d connected to the air supply source, and cooling start signal from the machine
  • An operation control circuit that starts the operation and controls the high-pressure water discharge pump 1b and the solenoid valves 1c and le to control the cooling water and air pressure discharge (discharge amount, discharge timing, etc.). It consists of 1 f and so on.
  • 1 g is a filter for cooling water
  • 1 h is a solenoid valve for driving the pump
  • 1 j is an air pressure adjustment for adjusting the discharge pressure of the cylinder type pump (high-pressure water discharge pump 1 b).
  • the regulator is shown.
  • a plurality of cooling water supply paths 2 are branched in parallel on the discharge side of the high-pressure water discharge pump 1b, and a cooling water solenoid valve 1c is installed for each cooling water supply path 2.
  • a plurality of air purge paths 3 are branched in parallel from the air pipe 1 d connected to the air supply source, and an air solenoid valve 1 e is installed for each air purge path 3 to cool these one.
  • One set of cooling systems is composed of a water supply path and one air purge path, and a fluid junction 4 is provided for each cooling system.Each cooling system is controlled by one operation control circuit 1f. It is configured to be able to do.
  • the high-pressure water discharge pump 1b for discharging and pressure-feeding the cooling water a commonly used well-known pump can be used, but in this embodiment, a cylinder-type pump operated by high-pressure air is used. .
  • the operation control circuit If which controls the cooling water and air pumping (discharge amount, discharge timing, etc.) is controlled by a sequence control method using relays and timers, or a computer program control method using microcomputers. It starts with the cooling start signal from the machine and controls the high pressure water discharge pump 1b, the cooling water solenoid valve 1c and the air solenoid valve 1e. In addition, control the pressure feed (discharge amount, discharge timing, etc.) of cooling water and air in each cooling system.
  • the fluid junction 4 is for joining the cooling water supply path 2 and the air purge path 3 connected to the pumping section 1 so that cooling water and air can be alternately pumped.
  • the cooling water manifold 5 installed at the upper part or the like is arranged close to the cooling water manifold 5, and the check valves 4a and 4b are inserted.
  • the check valves 4a and 4b used are spring-type check valves, and a fluid (cooling water or air) having a pressure lower than the cracking pressure is maintained in the cooling water supply path 2 and air purge path 3, respectively. To do.
  • the air purge passage 3 and the cooling water manifold 5 in the reject water supply passage 2 are particularly close to each other.
  • the cooling water is held in the cooling water supply path 2 without having to incorporate the air solenoid valve and the cooling water solenoid valve, and the cooling water and the air can be quickly switched and alternately pumped.
  • the cooling water manifold 5 is a well-known cooling water manifold having one water supply port and a drain port (not shown) and a plurality of outgoing side ports 5a,. Connect the water supply port close to the outlet of the fluid junction 4 and connect it to the outlet, connect the drainage hose 5c to the drainage port, and set the outlet port 5a, ... and the return side port 5b, ...
  • the reciprocating cooling pipe 6 c is connected through the bases 6 a and 6 b to form the mold cooling section 6, and the reciprocating cooling pipe 6 c can be removed in the cooling hole A 1 of the mold A. Insert Installed.
  • the cooling water pipe 1a of the pumping section 1 connects to the water supply source and connect the air pipe 1d to the air supply source, respectively, and the cooling conditions (cooling temperature, cooling timing, etc.) for cooling the mold A are the same or close.
  • the cooling system is divided for each part, the fluid junction 4 and the cooling water manifold 5 are connected in sequence to the pumping section 1, and the reciprocating cooling pipe 6c of the mold cooling section 6 is connected to the cooling hole A of the mold. Insert and mount in 1 to electrically connect the operation control circuit 1 f of the pumping section 1 to the control circuit of the machine.
  • the high-pressure water discharge pump 1 b When the operation control circuit 1 f of the pumping unit 1 receives the cooling start signal from the machine, the high-pressure water discharge pump 1 b operates to start the discharge of the cooling water, The valve 1c operates to start pumping the cooling water.
  • the cooling water discharged from the high-pressure water discharge pump 1b is sent from the cooling water supply path 2 to the cooling water manifold 5 through the fluid merging section 4 to the cooling water manifold 5, where each outgoing port 5a of the cooling water manifold 5 is connected.
  • the heat From the hose 6a to the reciprocating cooling pipe 6c, the heat enters the cooling hole A1 of the mold A through the outward path, where heat is exchanged. After that, the cooling water goes back and forth From the return path of the cooling pipe 6c, the hose 6b passes through the return port 5b, ... of the cooling water manifold 5, and is discharged from the drain hose 5c of the cooling water manifold 5.
  • the cooling water solenoid valve 1c is stopped after a preset time has elapsed, and thereafter, the air solenoid valve 1e operates to start the high-pressure air pumping.
  • This time lag may be set, for example, by delaying the switching of the sequence circuit by a timer or by delaying the switching by detecting the pressure of a pressure sensor or a pressure switch, but the present invention is not limited to such means. Absent.
  • the high-pressure air pumped from the pumping section 1 passes through the air purge path 3 through the fluid merging section 4 and, similarly to the cooling water, each outgoing port of the cooling water manifold 5 From 5 a,..., the hose 6 a passes through the reciprocating cooling pipe 6 c, enters the cooling hole A 1 of the mold A, and purges the cooling water remaining in the cooling hole A 1 of the mold A with air. From the return path of the reciprocating cooling pipe 6 c, the hose 6 13 ⁇ the defrosted water manifold 5 is returned to the return side port 5 b, to ⁇ the cooling water manifold 5 and discharged out of the mold A. .
  • the start and stop of the cooling water and air pumping described above are controlled by the operation control circuit 1f of the pumping unit 1 for each cooling system. Also, The operation of pumping and stopping the cooling water and air is performed for each manufacturing cycle of the machine. Industrial applicability
  • the mold cooling device of the present invention when the cooling water and the air are alternately pumped into the cooling holes of the mold and the cooling water is intermittently supplied, the cooling water is cooled after the air purge is completed. There is no danger of flowing into the cooling holes of the mold. Therefore, it is possible to prevent the mold from being excessively cooled by the remaining cooling water, and to control the mold temperature more severely.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
PCT/JP2002/011269 2001-10-31 2002-10-30 Dispositif de refroidissement de moule WO2003037547A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001334650A JP4028711B2 (ja) 2001-10-31 2001-10-31 金型冷却装置
JP2001-334650 2001-10-31

Publications (1)

Publication Number Publication Date
WO2003037547A1 true WO2003037547A1 (fr) 2003-05-08

Family

ID=19149749

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/011269 WO2003037547A1 (fr) 2001-10-31 2002-10-30 Dispositif de refroidissement de moule

Country Status (3)

Country Link
JP (1) JP4028711B2 (zh)
TW (1) TWI278363B (zh)
WO (1) WO2003037547A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009022311A3 (en) * 2007-08-15 2009-04-09 Actelion Pharmaceuticals Ltd 1,2-diamido-ethylene derivatives as orexin antagonists
FR3133774A1 (fr) 2022-03-28 2023-09-29 Lethiguel Dispositif pour le contrôle de la température locale d’une pièce en magnésium lors de sa fabrication par moulage, et procédé utilisant ce dispositif

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010099698A (ja) * 2008-10-23 2010-05-06 Die Engineering:Kk 金型冷却装置
JP6023526B2 (ja) * 2012-09-14 2016-11-09 東洋機械金属株式会社 ダイカストマシンの冷却通水制御方法
US10471499B2 (en) * 2015-09-02 2019-11-12 Alfi S.R.L. Systems for cooling molds for metals or for metal alloys, and molding set comprising said cooling system and at least one mold
CN109759560B (zh) * 2019-04-01 2019-12-31 江苏祥和电子科技有限公司 一种具有快速冷却降温功能的铝合金压铸模具
CN112045160A (zh) * 2020-08-27 2020-12-08 靖江市钜顺精密轻合金成型科技有限公司 一种压铸模的快速冷却方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1080758A (ja) * 1996-09-09 1998-03-31 Ahresty Corp 金型冷却装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1080758A (ja) * 1996-09-09 1998-03-31 Ahresty Corp 金型冷却装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009022311A3 (en) * 2007-08-15 2009-04-09 Actelion Pharmaceuticals Ltd 1,2-diamido-ethylene derivatives as orexin antagonists
FR3133774A1 (fr) 2022-03-28 2023-09-29 Lethiguel Dispositif pour le contrôle de la température locale d’une pièce en magnésium lors de sa fabrication par moulage, et procédé utilisant ce dispositif

Also Published As

Publication number Publication date
JP2003136188A (ja) 2003-05-14
TW200300005A (en) 2003-05-01
TWI278363B (en) 2007-04-11
JP4028711B2 (ja) 2007-12-26

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