WO2003029772A3 - Reseau d'imagerie - Google Patents

Reseau d'imagerie Download PDF

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Publication number
WO2003029772A3
WO2003029772A3 PCT/US2002/029962 US0229962W WO03029772A3 WO 2003029772 A3 WO2003029772 A3 WO 2003029772A3 US 0229962 W US0229962 W US 0229962W WO 03029772 A3 WO03029772 A3 WO 03029772A3
Authority
WO
WIPO (PCT)
Prior art keywords
radiometer
pixel
integrated circuits
silicon substrate
fabricated
Prior art date
Application number
PCT/US2002/029962
Other languages
English (en)
Other versions
WO2003029772A2 (fr
Inventor
Carl W Pobanz
Mehran Matloubian
Peter D Brewer
Original Assignee
Hrl Lab Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hrl Lab Llc filed Critical Hrl Lab Llc
Priority to AU2002362394A priority Critical patent/AU2002362394A1/en
Publication of WO2003029772A2 publication Critical patent/WO2003029772A2/fr
Publication of WO2003029772A3 publication Critical patent/WO2003029772A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/005—Prospecting or detecting by optical means operating with millimetre waves, e.g. measuring the black losey radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Geophysics (AREA)
  • Radiation Pyrometers (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

Un réseau à plan focal pour l'imagerie à ondes millimétriques comprend une pile tridimensionnelle d'éléments d'antenne et des circuits intégrés monolithiques hyperfréquence (MMIC) de radiométrie, enfouis dans des couches diélectriques polymères créées au-dessus d'un substrat de silicium. Chaque MMIC de radiométrie et chaque élément d'antenne comprennent un pixel de radiométrie. Le substrat de silicium contient des circuits intégrés destinés à collecter et à traiter les signaux pour chaque pixel de radiométrie et générer un signal vidéo au format respecté. Le réseau peut être fabriqué sur une tranche de silicium unique ou construit à partir de structures fabriquées sur les tranches de silicium multiples.
PCT/US2002/029962 2001-09-28 2002-09-19 Reseau d'imagerie WO2003029772A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002362394A AU2002362394A1 (en) 2001-09-28 2002-09-19 Imaging array

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32605301P 2001-09-28 2001-09-28
US60/326,053 2001-09-28

Publications (2)

Publication Number Publication Date
WO2003029772A2 WO2003029772A2 (fr) 2003-04-10
WO2003029772A3 true WO2003029772A3 (fr) 2003-06-19

Family

ID=23270620

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/029962 WO2003029772A2 (fr) 2001-09-28 2002-09-19 Reseau d'imagerie

Country Status (3)

Country Link
AU (1) AU2002362394A1 (fr)
TW (1) TW569006B (fr)
WO (1) WO2003029772A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5556072B2 (ja) 2009-01-07 2014-07-23 ソニー株式会社 半導体装置、その製造方法、ミリ波誘電体内伝送装置
CN102313907B (zh) * 2010-06-30 2014-04-09 清华大学 毫米波检查设备
US8653467B2 (en) 2012-06-19 2014-02-18 Raytheon Company Multichip packaging for imaging system
EP2965356A1 (fr) * 2013-03-08 2016-01-13 Northrop Grumman Systems Corporation Conditionnement de guide d'ondes et de semi-conducteur
KR102028714B1 (ko) * 2017-12-06 2019-10-07 삼성전자주식회사 안테나 모듈 및 안테나 모듈 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438336A (en) * 1993-11-12 1995-08-01 Trw Inc. Focal plane imaging array with internal calibration source

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438336A (en) * 1993-11-12 1995-08-01 Trw Inc. Focal plane imaging array with internal calibration source

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
A. M. FERENDECI: "Monolithically processed vertically interconnected 3D phased array antenna module", NATIONAL AEROSPACE AND ELECTRONICS CONFERENCE, 2000. IEEE PROCEEDINGS, - 12 October 2000 (2000-10-12), pages 151 - 157, XP002236017 *
T. SEKI, H. YAMAMOTO ET AL.: "Active antenna using multi-layer ceramic-polyimide substrates for wireless communication systems", MICROWAVE SYMPOSIUM DIGEST, 2001 IEEE MTT-S INTERNATIONAL, - 25 May 2001 (2001-05-25), pages 385 - 388, XP002236018 *

Also Published As

Publication number Publication date
TW569006B (en) 2004-01-01
WO2003029772A2 (fr) 2003-04-10
AU2002362394A1 (en) 2003-04-14

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