AU2002362394A1 - Imaging array - Google Patents

Imaging array

Info

Publication number
AU2002362394A1
AU2002362394A1 AU2002362394A AU2002362394A AU2002362394A1 AU 2002362394 A1 AU2002362394 A1 AU 2002362394A1 AU 2002362394 A AU2002362394 A AU 2002362394A AU 2002362394 A AU2002362394 A AU 2002362394A AU 2002362394 A1 AU2002362394 A1 AU 2002362394A1
Authority
AU
Australia
Prior art keywords
imaging array
imaging
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002362394A
Inventor
Peter D. Brewer
Mehran Matloubian
Carl W. Pobanz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HRL Laboratories LLC
Original Assignee
HRL Laboratories LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HRL Laboratories LLC filed Critical HRL Laboratories LLC
Publication of AU2002362394A1 publication Critical patent/AU2002362394A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/005—Prospecting or detecting by optical means operating with millimetre waves, e.g. measuring the black losey radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Geophysics (AREA)
  • Radiation Pyrometers (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
AU2002362394A 2001-09-28 2002-09-19 Imaging array Abandoned AU2002362394A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32605301P 2001-09-28 2001-09-28
US60/326,053 2001-09-28
PCT/US2002/029962 WO2003029772A2 (en) 2001-09-28 2002-09-19 Imaging array

Publications (1)

Publication Number Publication Date
AU2002362394A1 true AU2002362394A1 (en) 2003-04-14

Family

ID=23270620

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002362394A Abandoned AU2002362394A1 (en) 2001-09-28 2002-09-19 Imaging array

Country Status (3)

Country Link
AU (1) AU2002362394A1 (en)
TW (1) TW569006B (en)
WO (1) WO2003029772A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5556072B2 (en) 2009-01-07 2014-07-23 ソニー株式会社 Semiconductor device, method of manufacturing the same, and millimeter wave dielectric transmission device
CN102313907B (en) * 2010-06-30 2014-04-09 清华大学 Millimeter wave inspection equipment
US8653467B2 (en) 2012-06-19 2014-02-18 Raytheon Company Multichip packaging for imaging system
JP6176869B2 (en) * 2013-03-08 2017-08-09 ノースロップ グルマン システムズ コーポレーションＮｏｒｔｈｒｏｐ Ｇｒｕｍｍａｎ Ｓｙｓｔｅｍｓ Ｃｏｒｐｏｒａｔｉｏｎ Waveguide and semiconductor packaging
KR102028714B1 (en) * 2017-12-06 2019-10-07 삼성전자주식회사 Antenna module and manufacturing method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438336A (en) * 1993-11-12 1995-08-01 Trw Inc. Focal plane imaging array with internal calibration source

Also Published As

Publication number Publication date
TW569006B (en) 2004-01-01
WO2003029772A2 (en) 2003-04-10
WO2003029772A3 (en) 2003-06-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase