WO2003027654A3 - Sensorbaustein mit einem sensorelement, das von einem heizelement umgeben ist - Google Patents

Sensorbaustein mit einem sensorelement, das von einem heizelement umgeben ist Download PDF

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Publication number
WO2003027654A3
WO2003027654A3 PCT/DE2002/003129 DE0203129W WO03027654A3 WO 2003027654 A3 WO2003027654 A3 WO 2003027654A3 DE 0203129 W DE0203129 W DE 0203129W WO 03027654 A3 WO03027654 A3 WO 03027654A3
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WO
WIPO (PCT)
Prior art keywords
sensor
sensor module
surrounded
sensor element
heating element
Prior art date
Application number
PCT/DE2002/003129
Other languages
English (en)
French (fr)
Other versions
WO2003027654A2 (de
Inventor
Michael Bauer
Isolde Simon
Michael Arndt
Original Assignee
Bosch Gmbh Robert
Michael Bauer
Isolde Simon
Michael Arndt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Michael Bauer, Isolde Simon, Michael Arndt filed Critical Bosch Gmbh Robert
Priority to EP02758160A priority Critical patent/EP1430293A2/de
Priority to US10/489,904 priority patent/US7165441B2/en
Priority to JP2003531157A priority patent/JP4243540B2/ja
Publication of WO2003027654A2 publication Critical patent/WO2003027654A2/de
Publication of WO2003027654A3 publication Critical patent/WO2003027654A3/de

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/14—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
    • G01N27/18—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by changes in the thermal conductivity of a surrounding material to be tested

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

Es wird ein Sensorbaustein (1) beschrieben, der eine Heizstruktur (4) und ein Sensorelement (10) aufweist. Die Heizstruktur (4) umgibt das Sensorelement (10), so dass das Sensorelement weitgehend von einem Wärmeabfluss über einen Rahmen (2) entkoppelt ist. Damit wird eine grössere Messgenauigkeit des Sensorbausteins erreicht. Insbesondere werden störende Einflüsse durch einen Temperaturabfluss über den Halterahmen vermieden.
PCT/DE2002/003129 2001-09-20 2002-08-27 Sensorbaustein mit einem sensorelement, das von einem heizelement umgeben ist WO2003027654A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP02758160A EP1430293A2 (de) 2001-09-20 2002-08-27 Sensorbaustein mit einem sensorelement, das von einem heizelement umgeben ist
US10/489,904 US7165441B2 (en) 2001-09-20 2002-08-27 Sensor module having a sensor element surrounded by a heating element
JP2003531157A JP4243540B2 (ja) 2001-09-20 2002-08-27 加熱エレメントにより取り囲まれたセンサエレメントを備えたセンサ構成素子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10146321A DE10146321B4 (de) 2001-09-20 2001-09-20 Sensorbaustein mit einem Sensorelement, das von einem Heizelement umgeben ist
DE10146321.9 2001-09-20

Publications (2)

Publication Number Publication Date
WO2003027654A2 WO2003027654A2 (de) 2003-04-03
WO2003027654A3 true WO2003027654A3 (de) 2003-10-16

Family

ID=7699645

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003129 WO2003027654A2 (de) 2001-09-20 2002-08-27 Sensorbaustein mit einem sensorelement, das von einem heizelement umgeben ist

Country Status (5)

Country Link
US (1) US7165441B2 (de)
EP (1) EP1430293A2 (de)
JP (1) JP4243540B2 (de)
DE (1) DE10146321B4 (de)
WO (1) WO2003027654A2 (de)

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US8858071B2 (en) * 2004-12-16 2014-10-14 C-Therm Technologies Ltd. Method and apparatus for monitoring materials
GB0605683D0 (en) * 2006-03-21 2006-05-03 Servomex Group Ltd Thermal conductivity sensor
EP2015046A1 (de) * 2007-06-06 2009-01-14 Infineon Technologies SensoNor AS Vakuumsensor
US20110079074A1 (en) * 2009-05-28 2011-04-07 Saroj Kumar Sahu Hydrogen chlorine level detector
US8877365B2 (en) 2009-05-28 2014-11-04 Deeya Energy, Inc. Redox flow cell rebalancing
JP5055349B2 (ja) * 2009-12-28 2012-10-24 日立オートモティブシステムズ株式会社 熱式ガスセンサ
DE102012108350B3 (de) * 2012-09-07 2013-07-18 Pierburg Gmbh Vorrichtung und Verfahren zur Rekalibrierung eines Abgasmassenstromsensors
US9121773B2 (en) * 2013-03-13 2015-09-01 Bascom-Turner Instruments Gas sensors and methods of calibrating same
JP6012515B2 (ja) 2013-03-15 2016-10-25 日立オートモティブシステムズ株式会社 ガスセンサ
JP6499566B2 (ja) * 2015-11-27 2019-04-10 日立オートモティブシステムズ株式会社 気体センサ装置及び気体センサ装置の加熱電流制御方法
CN106017713B (zh) * 2016-06-28 2020-04-24 中航电测仪器股份有限公司 一种测温电阻
DE102017100433A1 (de) * 2017-01-04 2018-07-05 Bundesrepublik Deutschland, Vertreten Durch Das Bundesministerium Für Wirtschaft Und Energie, Dieses Vertreten Durch Den Präsidenten Der Physikalisch-Technischen Bundesanstalt Thermosensor zur Messung einer thermischen Transportgröße und Verfahren zum Messen einer thermischen Transportgröße
US11181545B2 (en) 2017-08-17 2021-11-23 Rosemount Aerospace Inc. Angle of attack sensor with thermal enhancement
DE102018108723A1 (de) * 2018-04-12 2019-10-17 Tdk Corporation Sensorvorrichtung, Verfahren zum Betreiben einer Sensorvorrichtung und elektronische Baugruppe, die eine Sensorvorrichtung aufweist
EP3835774A4 (de) * 2018-08-10 2022-04-20 TDK Corporation Gassensor
US11486785B2 (en) * 2019-03-28 2022-11-01 Rosemount Aerospace Inc. Thermal management system for air data sensor module
US11073415B2 (en) 2019-10-21 2021-07-27 Flusso Limited Thermal fluid flow sensor having a dielectric membrane comprising discontinuities between the heating element and an edge
US11649057B2 (en) 2019-12-13 2023-05-16 Rosemount Aerospace Inc. Static plate heating arrangement
EP4359778A1 (de) * 2021-06-22 2024-05-01 Flusso Limited Thermischer fluidsensor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3711511C1 (de) * 1987-04-04 1988-06-30 Hartmann & Braun Ag Verfahren zur Bestimmung der Gaskonzentrationen in einem Gasgemisch und Sensor zur Messung der Waermeleitfaehigkeit
US5044764A (en) * 1989-03-08 1991-09-03 Snow Brand Milk Products Co., Ltd. Method and apparatus for fluid state determination
US5303167A (en) * 1991-03-08 1994-04-12 Honeywell Inc. Absolute pressure sensor and method
US5515714A (en) * 1994-11-17 1996-05-14 General Motors Corporation Vapor composition and flow sensor
EP0724151A1 (de) * 1995-01-24 1996-07-31 Yamatake-Honeywell Co. Ltd. Gerät zur Messung der Wärmeleitfähigkeit
DE19624683C1 (de) * 1996-06-20 1997-10-16 Siemens Ag Wärmeleitfähigkeitsdetektor
DE19634690A1 (de) * 1996-08-10 1998-02-12 Entec Umweltmestechnik Gmbh Mikro-Wärmeleitfähigkeitsdetektor für Gasanalysen
WO2000070333A1 (en) * 1999-05-14 2000-11-23 Hot Disk Ab Method of measuring thermal properties of materials with direction dependant properties

Also Published As

Publication number Publication date
EP1430293A2 (de) 2004-06-23
US20050028580A1 (en) 2005-02-10
US7165441B2 (en) 2007-01-23
JP4243540B2 (ja) 2009-03-25
JP2005504291A (ja) 2005-02-10
DE10146321B4 (de) 2008-08-14
DE10146321A1 (de) 2003-04-24
WO2003027654A2 (de) 2003-04-03

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