WO2003023873A3 - Flacher aktor oder sensor mit interner vorspannung - Google Patents

Flacher aktor oder sensor mit interner vorspannung Download PDF

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Publication number
WO2003023873A3
WO2003023873A3 PCT/EP2002/010080 EP0210080W WO03023873A3 WO 2003023873 A3 WO2003023873 A3 WO 2003023873A3 EP 0210080 W EP0210080 W EP 0210080W WO 03023873 A3 WO03023873 A3 WO 03023873A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
flat actuator
material layer
actuator
middle layer
Prior art date
Application number
PCT/EP2002/010080
Other languages
English (en)
French (fr)
Other versions
WO2003023873A2 (de
Inventor
Bernhard Doellgast
Original Assignee
Drei S Werk Praez Swerkzeuge G
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Drei S Werk Praez Swerkzeuge G filed Critical Drei S Werk Praez Swerkzeuge G
Priority to AU2002339541A priority Critical patent/AU2002339541A1/en
Priority to DE10294168T priority patent/DE10294168D2/de
Publication of WO2003023873A2 publication Critical patent/WO2003023873A2/de
Publication of WO2003023873A3 publication Critical patent/WO2003023873A3/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders

Abstract

Ein flaches mehrschichtiges Bauelement (1) zum Einsatz als Aktor oder Sensor, welches unter interner Vorspannung steht und bezüglich seiner Form nur eine geringe thermische Drift zeigt, umfasst eine elektrisch aktivierbare Materialschicht (2), vorzugsweise eine Piezokeramik, und eine passive Mittellage (3) sowie eine weitere passive Materialschicht (4). Dabei weist die Mittellage (3) einen grösseren linearen thermischen Ausdehnungskoeffizienten als die Materialien der beiden benachbarten Schichten (2,4) auf.
PCT/EP2002/010080 2001-09-07 2002-09-07 Flacher aktor oder sensor mit interner vorspannung WO2003023873A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002339541A AU2002339541A1 (en) 2001-09-07 2002-09-07 Flat actuator or sensor having an internal pretensioning
DE10294168T DE10294168D2 (de) 2001-09-07 2002-09-07 Flacher Aktor oder Sensor mit Internen Vorspannung

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10144182 2001-09-07
DE10144182.7 2001-09-07
DE20202297U DE20202297U1 (de) 2001-09-07 2002-02-15 Flacher Aktor oder Sensor mit interner Vorspannung
DE20202297.8 2002-02-15

Publications (2)

Publication Number Publication Date
WO2003023873A2 WO2003023873A2 (de) 2003-03-20
WO2003023873A3 true WO2003023873A3 (de) 2003-11-27

Family

ID=26010095

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/010080 WO2003023873A2 (de) 2001-09-07 2002-09-07 Flacher aktor oder sensor mit interner vorspannung

Country Status (4)

Country Link
US (1) US7045933B2 (de)
AU (1) AU2002339541A1 (de)
DE (2) DE20202297U1 (de)
WO (1) WO2003023873A2 (de)

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US20050012434A1 (en) * 2003-03-26 2005-01-20 Continuum Photonics, Inc. Robust piezoelectric power generation module
DE102004031889B4 (de) * 2004-06-30 2012-07-12 Infineon Technologies Ag Halbleiterbauteil mit einem Gehäuse und einem teilweise in eine Kunststoffgehäusemasse eingebetteten Halbleiterchip und Verfahren zur Herstellung desselben
US20060132027A1 (en) * 2004-12-22 2006-06-22 Zhanjun Gao Method and display element with reduced thermal stress
DE102005028976A1 (de) * 2005-06-22 2006-12-28 Siemens Ag Piezoaktor mit gesteigertem Hubvermögen
WO2007138346A1 (en) * 2006-05-27 2007-12-06 Bae Systems Plc A bonding tool and method
DE102006036408B4 (de) * 2006-08-02 2020-04-23 Endress+Hauser SE+Co. KG Verfahren zur Fertigung eines Messgerätes und entsprechendes Messgerät
DE102006047411A1 (de) * 2006-09-29 2008-04-03 Technische Universität Dresden Verfahren zur Herstellung von Wandlerwerkstoff-Modulen und Wandlerwerkstoff-Module
US7834490B1 (en) * 2006-12-28 2010-11-16 The United States Of America As Represented By The Secretary Of The Navy Bimetallic strips for energy harvesting, actuation and sensing
DE102011078706B4 (de) * 2011-07-05 2017-10-19 Airbus Defence and Space GmbH Verfahren und herstellungsvorrichtung zur herstellung eines mehrschichtigen aktuators
EP3346131B1 (de) * 2011-10-11 2022-04-27 Murata Manufacturing Co., Ltd. Fluidsteuerungsvorrichtung und verfahren zur anpassung der fluidsteuerungsvorrichtung
US9448628B2 (en) 2013-05-15 2016-09-20 Microsoft Technology Licensing, Llc Localized key-click feedback
US9514902B2 (en) * 2013-11-07 2016-12-06 Microsoft Technology Licensing, Llc Controller-less quick tactile feedback keyboard

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DE19520796A1 (de) * 1995-06-07 1996-12-12 Siemens Ag Piezoelektrischer Biegewandler
DE19620826A1 (de) * 1996-05-23 1997-11-27 Siemens Ag Piezoelektrisches Element sowie Verfahren zu dessen Herstellung
EP1067609A1 (de) * 1999-01-22 2001-01-10 Kansai Research Institute Piezoelektrischer dünnschichtanordnung, verfahren zu deren herstellung und tintenstrahldruckkopf
WO2001048834A2 (de) * 1999-12-23 2001-07-05 Siemens Aktiengesellschaft Piezoelektrisches element
EP1324401A1 (de) * 2000-09-27 2003-07-02 Matsushita Electric Industrial Co., Ltd. Dielektrisches dünnfilmelement, stellelement damit, ink jet-kopf und ink jet-recorder

Also Published As

Publication number Publication date
AU2002339541A1 (en) 2003-03-24
US20030048040A1 (en) 2003-03-13
DE20202297U1 (de) 2002-08-29
DE10294168D2 (de) 2004-07-22
WO2003023873A2 (de) 2003-03-20
US7045933B2 (en) 2006-05-16

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