WO2003021647A1

WO2003021647A1 - Heat treatment device, and heat treatment method

Info

Publication number: WO2003021647A1
Application number: PCT/JP2002/008988
Authority: WO
Inventors: Akira Takahashi; Kazuhiro Kawamura
Original assignee: Tokyo Electron Limited
Priority date: 2001-09-04
Filing date: 2002-09-04
Publication date: 2003-03-13
Also published as: TW559957B; CN1230871C; CN1488162A; KR100781417B1; JP4923361B2; JP2003077786A; KR20040028678A

Abstract

A heat treatment device comprising a treatment vessel (28), and a work boat (30) disposed in the treatment vessel (28) to support works (W) in multiple stages. When an operator inputs desired job identification symbols (J1-Jh) from an input operation unit (18), etc., a layout program and a process program are read from a layout storage unit (16) and a process storage unit (14), respectively, via a job recipe specified by these job identification symbols, and these programs are successively executed in the order of the time series indicated in the job recipe. Various kinds of combination of the layout programs and the process programs can be selected only by selecting the job identification symbols thereby.

Description

Description Heat treatment equipment and heat treatment method Technical field

The present invention relates to a heat treatment apparatus and a heat treatment method for performing predetermined heat treatment and chemical / physical treatment on an object to be processed such as a semiconductor wafer.

Height

Generally, in order to manufacture a semiconductor integrated circuit, various heat treatments such as a film forming process, an etching process, an oxidation process, a diffusion process, and a reforming process are performed on a semiconductor wafer formed of a silicon substrate or the like. When performing these heat treatments using a vertical, so-called batch-type heat treatment apparatus, first, a semiconductor wafer is transferred from a cassette that can accommodate a plurality of, for example, about 25, semiconductor wafers to a vertical wafer boat. Transfer it and let it be supported in multiple stages. The wafer boat is large, and can accommodate, for example, about 150 wafers at the maximum. In addition, a dummy wafer different from the product wafer is supported at a predetermined position as necessary in order to equalize the gas flow or adjust the temperature profile in the height direction.

In this manner, the wafer boat is loaded (loaded) from below into a vacuum-evacuable processing vessel with various types of wafers supported in multiple stages, thereby keeping the processing vessel airtight. Then, a predetermined heat treatment is performed while executing a process program created in advance and controlling various process conditions such as a flow rate of a processing gas, a process pressure, and a process temperature in accordance with the process program.

In this case, depending on the type of processing, the number of product wafers at the time of processing, etc., the wafers should be supported on the wafer boat in any arrangement, or where the dummy wafers should be placed, or in the cassette. If there is a defect in the wafer supported by the wafer, whether or not a dummy wafer is inserted into the missing position when the wafer boat is transferred, or whether or not the missing position is left as it is, etc. A layout program for the layout (arrangement state) of the wafer must be specified prior to the heat treatment. Also, of course, the process corresponding to the heat treatment to be performed The process program must be specified in advance.

In the conventional heat treatment apparatus described above, the operator must input two types of symbols, a symbol specifying a layout program and a symbol specifying a process program. When there are many types, there is a problem that the input symbol may be mistaken.

Disclosure of the invention

The present invention has been made in consideration of the above points, and provides a heat treatment apparatus and a heat treatment method capable of selecting a combination of a layout program and a process program by a simple operation. Aim.

The present invention relates to a processing container, a processing object boat arranged in the processing container, and a plurality of processing objects placed in a predetermined position in multiple stages, and the plurality of processing objects being the processing object. In order to carry out different heat treatments on the layout storage unit, which includes a plurality of layout programs, each of which has a specific layout identification code, and to perform different heat treatments on the boat, each of which is placed in a different layout state on the boat. And a process storage unit including a plurality of process programs each having a specific process identification code, and a layout identification symbol corresponding to that of the plurality of layout programs and corresponding to each of the plurality of process programs. Select the desired layout identification code and process identification code from the process identification codes to be executed, and execute them. And a job recipe storage unit including a plurality of job recipes each having a specific job identification code. And a control unit for controlling the specified late program and the process program to be executed.

Thus, for example, the operator simply inputs a desired job identification code from the input operation unit, and reads out the layout program and the process program specified by the job identification code from the layout storage unit and the process storage unit. However, these are sequentially executed in the chronological order represented by the job recipe, so that a combination of various layout programs and process programs can be selected simply by selecting the job identification symbol. Moreover, it is possible to suppress the occurrence of input errors. it can.

The present invention is the heat treatment apparatus, wherein the job recipe storage unit includes a job recipe having one or a plurality of process identification symbols.

The present invention is the heat treatment apparatus, wherein the job recipe storage unit includes a job recipe having one or a plurality of layout identification symbols.

The present invention is the heat treatment apparatus, wherein the processing container is a vertical processing container having a lower end opened.

The present invention is the heat treatment apparatus, wherein a job identification code is input to the control unit by an input operation unit.

The present invention provides a heat treatment method for introducing a treatment object supported by a treatment object boat into a treatment vessel and performing a predetermined heat treatment, wherein the treatment objects are placed in different layouts from each other. Storing in advance a plurality of layout programs having a specific layout identification code in a layout storage unit; and a plurality of processes each having a specific process identification code, each having different process conditions for heat treatment. Storing a program in a process storage unit in advance; and a rate identification code corresponding to that of the plurality of late programs and an arbitrary rate identification code among the process identification symbols corresponding to that of the plurality of process programs. If you select the process identifiers and arrange them in chronological order In both cases, a plurality of job recipes each having a specific job identification code are stored in advance in the job recipe storage unit, and the job identification code is input from the outside, whereby the job identification code specified through the corresponding job recipe is input. An object to be processed is placed on a boat to be processed in a layout state based on a layout program, introduced into a processing vessel, and heat-treated under a process condition based on a process program specified through the job recipe. A heat treatment method characterized by the following. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a configuration diagram showing an example of the thermal oxidation apparatus according to the present invention.

FIG. 2 is a block diagram showing a control system of the heat treatment apparatus of the present invention.

FIG. 3 is a diagram showing the contents stored in the process storage unit.

FIG. 4 is a diagram showing the contents stored in the layout storage unit. FIG. 5 is a diagram showing the contents stored in the job receiver storage unit.

FIG. 6 is a diagram showing a layout of wafers placed on a wafer boat. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of a heat treatment apparatus and a heat treatment method according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram showing an example of a thermal oxidation apparatus according to the present invention, FIG. 2 is a block diagram showing a control system of a heat treatment apparatus of the present invention, and FIG. 3 is a view showing contents stored in a process storage unit. 4 is a diagram showing the contents stored in the layout storage unit, FIG. 5 is a diagram showing the contents stored in the job recipe storage unit, and FIG. 6 is a diagram showing the layout of wafers placed on the wafer boat.

The heat treatment apparatus 22 has a vertical processing vessel 28 having a vertical double-tube structure made of quartz and having an inner cylinder 24 and an outer cylinder 26. The processing space S in the inner cylinder 24 contains a wafer boat 30 made of quartz as a processing object boat for holding the processing object. Semiconductor wafers W as processing bodies are held in multiple stages at a predetermined pitch. Incidentally, the wafer boat 30 also holds a dummy wafer and the like as described later. -A cap 32 is provided to open and close the lower part of the processing container 28, and a rotary shaft 36 penetrating through a magnetic fluid seal 34 is provided. A rotating table 38 is provided at the upper end of the rotating shaft 36, a heat retaining cylinder 40 is provided on the table 38, and the wafer boat 30 is placed on the heat retaining cylinder 40. . The rotating shaft 36 is attached to the arm 44 of the boat elevator 42 that can be moved up and down, and can be moved up and down integrally with the gap 32 and the wafer boat 30. Numeral 0 is inserted into and removed from the processing container 28 from below. Note that the wafer boat 30 may be fixed without being rotated.

A lower end opening of the processing container 28 is joined to a manifold 46 made of, for example, stainless steel. The manifold 46 is used to introduce various necessary gases into the processing container 28. In the illustrated example, three gas nozzles 48 A, 48 B, and 48 C are provided so as to penetrate therethrough. Each of the gas nozzles 48 A to 48 C is connected to a gas supply system 50 A, 50 B, 50 C, respectively. Flow controllers 52A, 52B, 52C such as a mass flow controller for controlling the gas flow are provided at A to 50C. Although three gas nozzles 48 A to 48 C are provided here, the number of gas nozzles can be increased or decreased as needed.

Then, each gas supplied from each of the gas nozzles 48 A to 48 C rises in the wafer accommodating area, which is the processing space S in the inner cylinder 24, and turns back downward at the ceiling, and The gas flows down in the gap between the cylinder 24 and the outer cylinder 26 and is discharged. An exhaust port 54 is provided on the bottom side wall of the outer cylinder 26, and a pressure control valve 58 and a vacuum pump 60 are provided in the exhaust path 56 in the exhaust port 54. A vacuum evacuation system 62 is connected, and the inside of the processing vessel 28 is evacuated.

Further, a heat insulating layer 64 is provided on the outer periphery of the processing vessel 28, and a heating heater 66 is provided as a heating means inside the heat insulating layer 64 so that the wafer W positioned inside is heated to a predetermined temperature. It is designed to be heated.

Here, the overall size of the processing container 28 is, for example, the size of the wafer W to be heat-treated is 8 inches, and the number of wafers held in the wafer boat 30 is about 150 (product wafers are 130 Approximately 20 wafers, etc.), the inner cylinder 24 has a diameter of approximately 260-270 mm, and the outer cylinder 26 has a diameter of approximately 275-285 mm. The height of the processing container 28 is approximately 1,280 mm.

In FIG. 1, reference numeral 68 denotes a sealing member such as an O-ring for sealing between the cap 32 and the manifold 46, and reference numeral 70 denotes a lower end of the manifold 46 and the outer cylinder 26. This is a sealing member such as an O-ring that seals between the parts.

A wafer transfer mechanism 82 is provided below the processing container 28 for transferring wafers W. and the like to and from the wafer boat 30. The wafer transfer mechanism 82 includes a transfer arm 84 that is moved in the vertical direction by, for example, a ball screw. The transfer arm 84 is slid along the arm 84. And a fork header 86 is provided so as to be able to turn. A plurality of, for example, five forks 88 are extended from the fork header 86, and the forks 88 allow a maximum of five wafers W or the like to be transferred to the wafer boat 30 at a time. Can be transferred. Next, a control system of the heat treatment apparatus will be described with reference to FIG. In FIG. 2, the control system of the heat treatment apparatus has a control unit 2 such as a central processing unit of a computer. A bus 4 extending from the control unit 2 includes a heat control unit 6 for controlling the heaters 6 and the like of the heat treatment equipment, and a boat elevator for loading and unloading the wafer boat 30 for lifting and lowering. 4 Wafer transfer mechanism 8 for transferring and unloading wafers to and from wafer boat 30 Mechanical control unit 8 for controlling 2 etc. A gas control unit 10 that controls the devices 52 A to 52 C, and a pressure control unit 12 that controls the pressure control valve 58 that controls the pressure in the processing container 28 are variously different. A process storage unit 14 storing a plurality of process programs for performing a process, and a layer storing a plurality of layout programs executed to realize various layout states of a wafer arrangement with respect to the wafer boat 30 Job storage for storing a plurality of job recipes in which the port storage unit 16 and the layout identification symbols of the above-mentioned layout programs and the process identification symbols of the process programs are combined and arranged in chronological order in the order to be executed. Each part is connected to 72. The process storage section 14, the layout storage section 16 and the job recipe storage section 72 are formed in the same secondary storage section, for example, a hard disk 74.

Further, the bus 4 is connected to an input operation unit 18 composed of a touch panel panel board and the like, and a control unit 2 for controlling the operation of the entire apparatus. Also, various control commands may be input from the host computer 20 side. It should be noted that the above-mentioned respective control units are typical ones, and various control units are actually connected to the bus 2.

Here, the respective storage contents of the storage sections 14, 16 and 72 will be described.

First, as shown in FIG. 3, the process storage section 14 stores various process programs for actually executing the heat treatment (process) and process identification symbols for identifying the process programs. In FIG. 3, a total of m (m: a positive integer) process programs are stored, and the program identification symbols Pl to Pm are attached to them. For example, process program 1 is a program that performs film forming process 1, process program 2 is a program that performs film forming process 2, and process program 3 is a film forming process. The program for performing the process 3, the process program 4 is a program for performing the check process, the process program 5 is a program for performing the seasoning process, and the process program 6 is a program for performing the cleaning process.

Various process conditions such as the type of gas used, gas flow rate, process temperature, process pressure, and process time are also added to each of the above process programs. The film forming processes 1 to 3 are, for example, processes for depositing different types of films on a wafer. In the above picking process, in particular, before performing the film forming process, etc., whether the heating heater 66, the flow rate controllers 52A to 52C, the pressure control valve 58, etc., operate properly. This is the process of checking.

The above-mentioned seasoning process is, for example, a process performed immediately after the cleaning process or the like. Before actually depositing a film on a wafer, a film-forming gas is flowed into the processing container 28 to perform the same process. This is a process for stabilizing the environment in the processing container 28 by attaching a film type to the inner surface of the processing container 28 or the like.

The cleaning process is a process of removing an unnecessary film attached to the inner surface of the processing container 28 or the surface of the wafer boat 30.

The types of heat treatments shown here are merely examples, and other various heat treatments such as an oxidation diffusion treatment, an etching treatment, a modification treatment, and an annealing treatment can be performed.

Next, as shown in FIGS. 4 and 6, the layout storage unit 16 stores various layout programs for realizing a predetermined layout state when the wafer is transferred to the wafer boat 30. A late identification code for identifying it is stored. In FIG. 4, a total of n (n: positive integer) layout programs are stored, and the layout identification symbols Ll to Ln are added to them. In each of the layout programs described above, a wafer is placed on the wafer boat 30 so as to realize different layout states.

For example, the layout program 1 realizes the placement state of the layout 1 as shown in FIG. Layout 1 shown in FIG. 6 (A) has a plurality of, in the example shown, five dummy wafers DW placed on the upper and lower ends of the wafer boat 30, and a product wafer W placed in the center. This is referred to as filling. Also, The layout program 2 realizes the placement state of the layout 2 as shown in FIG. 6 (B), and a plurality of dummy wafers DW, 10 in the illustrated example, are placed on the lower end side of the wafer boat 30. Above this, the mounting mode is such that the product wafers W are all mounted in the top-up state, and this is referred to as top-up.

The layout program 3 realizes the placement state of the layout 3 as shown in FIG. 6 (C). A plurality of dummy wafers DW, 10 in the illustrated example, are mounted on the upper end side of the wafer boat 30. This is a mounting mode in which the product wafers W are all mounted below in a state in which the product wafers W are mounted in a lower state, and this is referred to as lower state.

The layout program 4 realizes the placement state of the layout 4 as shown in FIG. 6 (D), which shows a modification of the centering state shown in FIG. 6 (A). In other words, a wafer carrying wafer, for example, within a 25-sheet capacity set, is not always full of wafers, and may be partially pulled out, so to speak, in a toothless state. In such a case, the missing portion is left as it is (without filling the wafer), and all the wafers are transferred to the wafer boat 30 in this state. Accordingly, as shown in FIG. 6 (D), a toothless portion 80 where a wafer is not placed partially occurs in the wafer boat 30. Such a mounting mode is referred to as middle deformation 1.

The layout program 5 realizes the mounting state of the layout 5 as shown in FIG. 6 (E), and the dummy program DW is mounted on the toothless portion 80 shown in FIG. 6 (D). To be placed. Such a mounting mode is referred to as centering deformation 2.

Each of the mounting modes is merely an example, and a number of layout programs for realizing various mounting modes are stored in the layout storage unit 16.

Next, as shown in FIG. 5, in the job receiver storage unit 72 which is a feature of the present invention, an arbitrary layout identification code and a process identification code are selected from the above-mentioned layout identification code and the above-mentioned process identification code. Are stored in chronological order in the order in which the job recipes should be executed.

In FIG. 5, a total of h (h: positive integer) job receivers are stored. Job identification symbols Jl to Jh. For example, the job recipe of the job identification code J1 is “L1 → P1”, which means that the wafer mounting and the process are performed in this order. For these job recipes, one or more of the process program shown in FIG. 3 and the layout program shown in FIG. 4 are selected and combined in a desired chronological order. What is necessary is just to memorize it with an identification symbol.

Next, the method of the present invention performed using the heat treatment apparatus of the present invention configured as described above will be described.

First, the operator already knows the layout state of the wafer to be executed and the process to be executed, and inputs a job identification code corresponding to the combination from the input operation unit 18 shown in FIG. In this case, the operator may input the job identification code from the host computer 20 side.

Then, the control unit 2 reads the corresponding job recipe from the input job identification code from the job recipe storage unit 72 and analyzes the contents. As a result of this analysis, the control unit 2 sequentially executes the layout program or the process program in the order specified in the job recipe. For example, if the operator inputs “J 1” as the job identification symbol, the job has “LI P 1” as the content, so the wafer transfer mechanism 82 is driven and as shown in FIG. 6 (A). The product wafer W and the dummy wafer DW are transferred to the wafer boat 30 as shown in the layout 1 shown in FIG. Will do. In the same manner, the wafer transfer mechanism 82 operates for transferring a wafer.

Similarly, when "J2" is entered as the job identification code, the job recipe contains ": L2P3", so the product wafer W and the product wafer W as shown in the layout 2 shown in Fig. 6 (B). The dummy wafer DW is transferred to the wafer boat 30, and the process program 3 is executed.

Similarly, when "J3" is entered as the job identification code, the job receiver has the content of "L3Plp2P3", so as shown in the rate 3 in FIG. 6 (C). Transfer product wafer W and dummy wafer DW to wafer boat 30, Process program 1, process program 2, and process program 3 are executed sequentially. As described above, the processing mode in which the process program is executed a plurality of times, for example, three times in a row, is used when, for example, a multilayer structure such as a stacked structure of an oxide film, a nitride film, and an oxide film is sequentially formed. Can be

Similarly, if "J4" is entered as the job identification code, the job recipe will contain "P4L2P2P1", so the process program 4 will execute with the processing container 28 empty. A check process is performed to check whether or not each component of the heat treatment apparatus operates normally.If normal operation is confirmed, the product wafer W is connected to the product wafer W as shown in the layout 2 in FIG. 6 (B). The dummy wafer DW is transferred to the wafer port 30, and the process program 2 and the process program 1 are sequentially executed.

Similarly, if "J5" is entered as the job identification code, the job recipe will contain "L4P3"> P6, so the product will be displayed as shown in layout 4 in Fig. 6 (D). The wafer W and the dummy wafer DW are transferred to the wafer boat 30, and the cleaning process, which is the process program 3 and the process program 6, is sequentially executed.In this case, the process program 6, which is the cleaning process, is executed. Before the transfer, the wafer boat 30 is lowered and unloaded, and the wafer W is taken out of the processing container 28.

Similarly, when "J6" is entered as the job identification code, the job recipe contains "L1 → P1 L2 P3". The product wafer W and the dummy wafer DW are transferred to the wafer boat 30 as shown in FIG. Next, when the execution of the process program 1 is completed, the wafer boat 30 is unloaded and the wafer is taken out from the processing container 28, and the same product wafer W is then shown in FIG. 6 (B). Change the layout by transferring it as in Layout 2, and then run process program 2.

As described above, the same product wafer W can be subjected to different processes with different layouts.

Thus, in the present invention, the operator simply inputs one job identification code. Thus, one or more desired job recipes can be selected and a desired process can be performed in a desired wafer layout state.

Also, since only one job identification code is input, it is possible to suppress the occurrence of input errors as compared with the conventional method.

In this embodiment, the heat treatment apparatus having a double-pipe structure has been described as an example. However, the structure is not particularly limited as long as the heat treatment apparatus is a batch-type heat treatment apparatus. The present invention is also applicable to a heat treatment apparatus having a structure in which gas is introduced from the ceiling and exhausted from the ceiling, or conversely, a heat treatment apparatus having a structure in which gas is introduced from the ceiling of the processing vessel and exhausted from the bottom. Can be applied. Further, the present invention can be applied not only to a vertical heat treatment apparatus but also to a horizontal heat treatment apparatus.

The object to be processed is not limited to a semiconductor wafer, but may be applied to an LCD substrate, a glass substrate, or the like.

As described above, according to the heat treatment apparatus and the heat treatment method of the present invention, the following excellent effects can be obtained.

The operator simply inputs a desired job identification code from the input operation unit, for example, and reads out the layout program and the process program specified by the job identification code from the layout storage unit and the process storage unit. Jobs are executed sequentially in the chronological order represented by the job recipe. Therefore, a combination of various layout programs and process programs can be selected simply by selecting a job identification code. Can also be suppressed.

Claims

The scope of the claims

1. A processing container,

An object boat disposed in the processing container and configured to mount a plurality of objects to be processed at predetermined positions in multiple stages;

A layout storage unit including a plurality of layout programs each having a plurality of layout programs each having a specific layout identification symbol, wherein the plurality of workpieces are placed on the workpiece boat in different layout states;

A process storage unit including a plurality of process programs each having a specific process identification code, in addition to different process conditions for performing different heat treatments on the object to be processed;

An arbitrary layout identification symbol and a process identification symbol are selected from the layout identification symbols corresponding to each of the plurality of layout programs and the process identification symbols corresponding to each of the plurality of process programs. A job recipe storage unit including a plurality of job recipes, each of which has a specific jop identification symbol, arranged in chronological order;

A control unit for controlling the execution of the layout program and the process program specified via a corresponding job recipe by inputting the Jop identification symbol from outside;

A heat treatment apparatus comprising:

2. The heat treatment apparatus according to claim 1, wherein the job receiver storage unit includes a job recipe having one or a plurality of process identification codes.

3. The heat treatment apparatus according to claim 1, wherein the job recipe storage unit includes a job recipe having one or a plurality of layout identification symbols.

4. The heat treatment apparatus according to claim 1, wherein the processing container is a vertical processing container having a lower end opened.

5. The heat treatment apparatus according to claim 1, wherein a job identification code is input to the control unit by an input operation unit.

6. Introduce the object supported by the object boat into the processing In the heat treatment method of performing the treatment,

Placing the object to be processed in different layout states from each other, and storing a plurality of layout programs each having a specific layout identification symbol in a layout storage unit in advance;

A process of preliminarily storing a plurality of process programs, each having a specific process identification code, in a process storage unit, each of which has different process conditions for heat treatment;

An arbitrary layout identification symbol and a process identification symbol are selected from the layout identification symbols corresponding to those of the plurality of layout programs and the process identification symbols corresponding to that of the plurality of process programs. Arranging them in chronological order, and storing in advance a plurality of job recipes each having a specific job identification code in a job recipe storage unit;

By inputting a job identification code from the outside, the object to be processed is placed on the object to be processed in a layout state based on the layout program specified through the corresponding job recipe, and introduced into the processing container, and A heat treatment method, wherein the object to be processed is heat-treated under process conditions based on a process program specified via the job recipe.