559957 A7 B7 五、發明説明（j ) 【發明領域】 (請先閲讀背面之注意事項再填寫本頁) 本發明是關於對半導體晶圓等的被處理體實施預定的 熱處理以及化學/物理的處理的熱處理裝置及熱處理方法 【發明背景】 【習知技藝之說明】 一般爲了製造半導體積體電路’對由矽基板等構成的 半導體晶圓進行成膜處理、蝕刻處理、氧化處理、擴散處 理、改質處理等的各種熱處理。對於以縱型的所謂的整批 (Batch)式的熱處理裝置進行這些熱處理的情形，首先由 可收容半導體晶圓複數片例如25片左右的晶圓匣盒 (Cassette)將半導體晶圓移載到縱型的晶舟（Wafer boat)， 使其多段地支持於晶舟。此晶舟大者例如可載置最大1 50 片左右的晶圓。而且，爲了使氣體的流動均勻化或者調整 高度方向的溫度輪廓（Profile)，依照需要在預定的位置支 持與製品晶圓不同的虛擬晶圓（Dummy wafer)。 經濟部智慧財產局員工消費合作社印製 如此在多段地支持各種晶圓的狀態下，晶舟在可被抽 真空的處理容器內由其下方傳入（裝載，Load)，以氣密地 維持處理容器內。而且，實行預先作成的製程程式，依照 上述製程程式一邊控制處理氣體的流量、製程壓力、製程 溫度等的各種製程條件，一邊實施預定的熱處理。 此情形依照處理的種類、處理時的製品晶圓的片數等 ’對於具有怎樣的排列以支持晶圓於晶舟，或者虛擬晶圓 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -4 - 559957 A7 B7 五、發明説明（2) ---澤-- (請先閱讀背面之注意事項再填寫本頁) 配置於哪一位置，或者被支持於晶圓匣盒內的晶圓存在欠 缺的情形，在晶舟移載時對該欠缺的位置是否插入虛擬晶 圓，或是否就空出該欠缺位置等的關於晶圓的佈置 (Layout)(配置狀態）的佈置程式，必須在熱處理之前先指 示。而且，當然必須預先指示對應於應實行的熱處理的製 程程式。 因此，對於上述習知的熱處理裝置，操作者必須輸入 特定佈置程式的記號與特定製程程式的記號的兩種類的記 號，特別是在各個記號的種類多的情形下有發生弄錯輸入 的記號之情形的問題。 【發明槪要】 本發明是考慮此點所進行的創作，其目的爲提供可以 簡單的操作選擇佈置程式與製程程式的組合之熱處理裝置 及熱處理方法。 本發明是一種熱處理裝置，其特徵包含： 處理容器； 經濟部智慧財產47員工消費合作社印製 配置於處理容器內，多段載置複數片被處理體於預定 的位置之被處理體舟； 在不同於前述被處理體舟的佈置的狀態下載置前述複 數片被處理體，並且分別包含具有特定的佈置識別記號的 複數個佈置程式的佈置記憶部； 爲了對前述被處理體實施不同的熱處理，各個製程條 件不同，並且分別包含具有特定的製程識別記號的複數個 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29?公釐） -5- 559957 A7 B7 五、發明説明（3 ) 製程程式的製程記憶部； 由對應於前述複數個佈置程式的每一個的佈置識別記 號與對應於前述複數個製程程式的每一個的製程識別記號 之中，選擇任意的佈置識別記號與製程識別記號，時系列 地排列成應實行這些識別記號的順序，並且分別包含具有 特定的工作識別記號的複數個工作處理程式（〗ob recipe)的 工作處理程式記憶部；以及 藉由自外部輸入前述工作識別記號，以實行經由對應 的工作處理程式而特定的前述佈置程式以及前述製程程式 而控制的控制單元。 據此，操作者僅藉由例如輸入操作部輸入所希望的工 作識別記號，分別由佈置記憶部與製程記憶部讀出被此工 作識別記號特定的佈置程式與製程程式，藉由以工作處理 程式表示的時系列的順序依次實行這些程式。據此，僅藉 由選擇工作識別記號，可選擇種種的佈置程式與製程程式 的組合，而且也能抑制輸入誤失（Miss)的發生。 本發明是一種熱處理裝置，其特徵爲前述工作處理程 式記憶部包含具有一個或複數個製程識別記號的工作處理 程式。 本發明是一種熱處理裝置，其特徵爲前述工作處理程 式記憶部包含具有一個或複數個佈置識別記號的工作處理 程式。 本發明是一種熱處理裝置，其特徵爲前述處理容器爲 下端開放的縱型的處理容器。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ---------裝-- (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -6 - 559957 A7 _____B7___ 五、發明説明（4 ) 本發明是一種熱處理裝置，其特徵爲工作識別記號藉 由輸入操作部輸入到控制單元。 (請先閱讀背面之注意事項再填寫本頁) 本發明是一種熱處理方法，將由被處理體舟支持的被 處理體導入處理容器內，實施預定的熱處理，其特徵包含： 在互異的佈置狀態下載置前述被處理體，並且預先使 分別具有特定的佈置識別記號的複數個佈置程式記憶於佈 置記憶部之製程； 熱處理用的製程條件分別不同，並且預先使分別具有 特定的製程識別記號的複數個製程程式記憶於製程記憶部 之製程； 由對應於前述複數個佈置程式的每一個的佈置識別記 號與對應於前述複數個製程程式的每一個的製程識別記號 之中，選擇任意的佈置識別記號與製程識別記號，時系列 地排列成應實行這些識別記號的順序，並且預先使分別具 有特定的工作識別記號的複數個工作處理程式記憶於工作 處理程式記憶部之製程；以及 經濟部智慈財產局員工消費合作社印製 藉由自外部輸入工作識別記號，在根據經由對應的工 作處理程式而特定的前述佈置程式的佈置狀態下，將被處 理體載置於被處理體舟導入處理容器內，且在根據經由前 述工作處理程式而特定的製程程式的製程條件下，熱處理 被處理體。 【圖式之簡單說明】 圖1是顯示與本發明有關的熱氧化裝置的一例的構成 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 559957 A7 _____________ 五、發明説明（5 ) 圖。 (請先閲讀背面之注意事項再填寫本頁) 圖2是顯示本發明的熱處理裝置的控制系的方塊圖。 圖3是顯示製程記憶部內的記憶內容圖。 圖4是顯示佈置記憶部內的記憶內容圖。 圖5是顯示工作處理程式記憶部內的記憶內容圖。 圖6是顯不載置於晶舟內的晶圓的佈置的樣態圖。 【符號說明】 2:控制單元 4:匯流排 6:加熱器控制部 8:機構部控制部 10:氣體控制部 1 2 :壓力控制部 14:製程記憶部 1 6 :佈置記憶部 經濟部智慧財產局員工消費合作社印製 1 8 :輸入操作部 20:主電腦 22:熱處理裝置 24:內筒 2 6 :外筒 2 8 :處理容器 3 0:晶舟 32:蓋 本紙張尺度適用中國國家標準（CNS )八4規格（210X297公釐） -8- 559957 經濟部智慧財產局員工消費合作社印製 A7 B7五、發明説明（6 ) 34:磁性流體密封 3 6 :旋轉軸 3 8 :旋轉台 4 0:保溫筒 42:晶舟升降機 44 、 84:臂 46:歧管 50A、50B、50C:氣體供給系 48A〜48C:氣體噴嘴 52A〜52C:流量控制器 54:排氣口 5 6 :排氣路 5 8 :壓力控制閥 60:真空泵 62:真空排氣系 6 4:絕熱層 6 6:加熱器 68 ' 70:密封構件 72:工作處理程式記憶部 74:硬碟 80:掉牙部 82:晶圓移載機構 84:移載臂 8 6:晶圓岔頭 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -9- 559957 A7 B7 五、發明説明（7 ) 8 8:晶圓岔 S :處理空間 (請先閱讀背面之注意事項再填寫本頁) W:製品晶圓 D W:虛擬晶圓 【較佳實施例之詳細說明】 以下’根據添附圖面詳述與本發明有關的熱處理裝置 及熱處理方法的一實施例。 圖1是顯示與本發明有關的熱氧化裝置的一例的構成 圖；圖2是顯示本發明的熱處理裝置的控制系的方塊圖； 圖3是顯示製程記憶部內的記憶內容圖；圖4是顯示佈置 記憶部內的記憶內容圖；圖5是顯示工作處理程式記憶部 內的記憶內容圖；圖6是顯示載置於晶舟的晶圓的佈置的 樣態圖。 經濟部智慧財產局員工消費合作社印製 此熱處理裝置22具有由內筒24與外筒26構成的石 英製的雙重管構造的縱型的預定長度的處理容器28。在 上述內筒24內的處理空間S收容有當作用以保持被處理 體的被處理體舟的石英製的晶舟30，在此晶舟30當作被 處理體的半導體晶圓以預定的間距被保持多段。此外，在 此晶舟30如後述虛擬晶圓等也被保持。 爲了開關此處理容器28的下方配設有蓋（Cap) 32，在 此蓋32配設有經由磁性流體密封34而貫通的旋轉軸36 。而且，在此旋轉軸36的上端配設有旋轉台（Table)38， 在此旋轉台3 8上配設保溫筒40，在此保溫筒40上載置 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -10- 559957 A7 _ _ B7____ 五、發明説明（8 ) (請先閲讀背面之注意事項再填寫本頁) 上述晶舟30。而且，上述旋轉軸36安裝於可升降的晶舟 升降機（Boatelevator)42的臂44，使上述蓋32或晶舟30 等可一體地升降，晶舟3 0可由下方插入脫離到處理容器 28內。此外，不使晶舟30旋轉令晶舟30爲固定狀態也 可以。 上述處理容器28的下端開口部接合有例如不銹鋼製 的歧管（Manifold)46。在此歧管46使用以將種種必要的氣 體導入到處理容器28內的複數個在圖示例爲三個氣體噴 嘴48A、48B、48C貫通而配設。而且，在各氣體噴嘴 48八〜48〇分別連接有氣體供給系50八、5(^、50(：，並且在 各氣體供給系50A〜50C中介配設有控制氣體流量的例如 像質流控制器（Mass flow controller)的流量控制器52 A、 5 2B、5 2C。此處雖然配設三個氣體噴嘴48A〜48C，惟依照 需要當然可增減氣體噴嘴的數目。 經濟部智慧財產局員工消費合作社印製 而且，由上述各氣體噴嘴48 A〜48C供給的各氣體上 升到內筒24內的處理空間S的晶圓的收容區域而在最高 部朝下方折返，而且流下到內筒24與外筒26的間隙內而 排出。而且，在外筒26的底部側壁設有排氣口 54，在此 排氣口 54連接有在排氣路5 6中介配設壓力控制閥5 8與 真空泵60而成的真空排氣系62，用以將處理容器28內 抽真空。 而且，在處理容器2 8內的外周配設有絕熱層6 4，在 此內側配設有加熱器（H e a t e r) 6 6作爲加熱手段，以將位於 內側的晶圓W加熱到預定的溫度。 I紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -11 - 559957 A7 B7 五、發明説明（9) 此處，處理容器28的全體的大小爲例如令應熱處理 的晶圓W的尺寸爲8英吋，保持於晶舟30的晶圓片數爲 150片左右（製品晶圓130片左右；虛擬晶圓等20片左右） 的話，內筒24的直徑約260〜270mm左右；外筒26的直 徑約275〜285mm左右，處理容器28的高度約1 280mm左 右。 此外，圖1中符號68爲密封蓋32與歧管46之間的 〇環等的密封構件，符號70爲密封歧管46與外筒26的 下端部之間的〇環等的密封構件。 而且，在上述處理容器28的下方對上述晶舟30移載 晶圓W等，配設有用以由此處取出的晶圓移載機構82。 此晶圓移載機構82具有例如藉由滾珠螺桿（Ball screw)朝 上下方向移動的移載臂84，在此移載臂84配設沿著此臂 84可滑動移動以及旋轉移動的晶圓岔頭（Fork header) 86。 而且，由此晶圓岔頭86使複數支在圖示例爲5支的晶圓 岔（Fork) 88延伸，藉由此晶圓岔88可一次將最大5片的 晶圓等對晶舟30移載。 其次，參照圖2說明此熱處理裝置的控制系。 在圖2中熱處理裝置的控制系具有電腦的中央演算部 等的控制單元2。由此控制單元2延伸的匯流排4分別連 接有控制熱處理裝置的加熱器66等的加熱器控制部6， 與控制進行晶舟30的升降動作的裝載/卸載 (Loader/Unloader)等的晶舟升降機42或對晶舟30進行晶 圓的移載/取出的晶圓移載機構82等的機構部控制部8、 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） $-- (請先閲讀背面之注意事項再填寫本頁) 、1; 經濟部智慧財產局員工消費合作社印製 -12- 559957 A7 _ _B7_ 五、發明説明（1〇) (請先閲讀背面乏注意事項再填寫本頁) 與進行控制處理氣體的供給、流量的流量控制器52A〜52C 等的控制的氣體控制部1 0，與進行控制處理容器28內的 壓力的壓力控制閥5 8等的控制的壓力控制部1 2，與爲了 進行各種不同的製程而記憶有複數個製程程式的製程記憶 部1 4，與記憶爲了實現對晶舟30的晶圓配置的各種佈置 狀態而實行的複數個佈置程式的佈置記憶部1 6，與記憶 分別組合上述佈置程式的佈置識別記號與製程程式的製程 識別記號，而時系列地排列成應實行的順序的複數個工作 處理程式的工作處理程式記憶部72。此外，上述製程記 憶部14、佈置記憶部16以及工作處理程式記憶部72是 形成於同一二次記憶部例如硬碟74內。 而且，更於此匯流排4連接有由觸摸面板或鍵盤等構 成的輸入操作部1 8，與控制此裝置全體的動作的控制單 元2。而且，也有各種控制指令由主電腦（Host computei*)20側輸入的情形。此外，上述各控制部是舉例 說明代表者，實際上在上述匯流排2更連接有種種控制部 〇 經濟部智慧財產局員工消費合作社印製 此處說明上述各記憶部14、16、72的各記憶內容。 首先在製程記憶部14如圖3所示記憶有實際實行熱 處理（製程）用的各種製程程式與識別該製程程式用的製程 識別記號。在圖3記憶有全部m個（m:正的整數）的製程 程式，分別附加有P1〜Pm的製程識別記號。例如製程程 式1爲進行成膜處理1的程式；製程程式2爲進行成膜處 理2的程式；製程·程式3爲進行成膜處理3的程式；製程 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -13- 559957 A7 ___B7_ 五、發明説明（u) (請先閲讀背面之注意事項再填寫本頁) 程式4爲進行檢查（Check)處理的程式；製程程式5爲進 行陳化（Seasoning)處理的程式以及製程程式6爲進行淸洗 (C1 e a n i n g)處理的程式。 在上述各製程程式也附加有使用的氣體種、氣體流量 、製程溫度、製程壓力、製程時間等的各種製程條件。上 述成膜處理1〜3爲進行例如使各個異種的膜沉積於晶圓上 的處理。上述檢查處理爲特別是在實際進行成膜處理等之 前，檢查加熱器66、流量控制器52A〜52C、壓力控制閥 5 8等是否正常地動作的處理。 上述陳化處理爲例如在緊接著淸洗處理後等進行的處 理，實際上在對晶圓沉積膜前於處理容器28內流通成膜 用的氣體，使相同的膜種附著於處理容器28的內面等， 用以使處理容器28內的環境穩定化的處理。 上述淸洗處理是除去附著於處理容器28的內面或晶 舟30的表面的不要的膜的處理。 經濟部智慧財產局員工消費合作社印製 此處所示的熱處理的種類只不過是僅顯示一例，其他 也能進行例如氧化擴散處理、蝕刻處理、改質處理、回火 (A η n e a 1)處理等的各種熱處理。 其次在佈置記憶部1 6如圖4以及圖6所示，記憶有 在將晶圓移載到晶舟30時用以實現預定的佈置狀態的各 種佈置程式，與用以識別該佈置程式的佈置識別記號。在 圖4記憶有全部η個（η:正的整數）的佈置程式，分別附 加有L 1〜Ln的佈置識別記號。上述各佈置程式爲了實現 分別互異的佈置狀態而將晶圓載置於晶舟30。 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -14- 559957 經濟部智慧財產^7B(工消費合作社印製 A7 B7五、發明説明（12) 例如佈置程式1爲實現如圖6(A)所示的佈置1的載 置狀態。圖6(A)所示的佈置1爲在晶舟30的上下端載置 複數片在圖示例各5片虛擬晶圓DW，在中央部載置製品 晶圓W的載置樣態，稱此爲中塡塞。而且，佈置程式2 爲貫現如圖6 (B)所不的佈置2的載置狀態，在晶舟3 0的 下端側載置複數片在圖示例1 0片虛擬晶圓DW，在比此 處還上方在上塡塞所有製品晶圓W的狀態下載置的載置 樣態，稱此爲上塡塞。 而且，佈置程式3爲實現如圖6(C)所示的佈置3的載 置狀態，在晶舟3 0的上端側載置複數片在圖示例1 〇片虛 擬晶圓DW，在比此處還下方在下塡塞所有製品晶圓w的 狀態下載置的載置樣態，稱此爲下塡塞。 而且，佈置程式4爲實現如圖6(D)所示的佈置4的 載置狀態，此爲顯示圖6(A)所示的中塡塞狀態的變形。 即不限於在傳送晶圓來的例如25片收容晶圓匣盒內，經 常滿載有晶圓，也有部分被抽出變成所謂的掉牙狀態的情 形。在這種情形下使該掉牙部分在原封不動的狀態（不塡 塞晶圓），在此狀態下將所有的晶圓移載到晶舟30。因此 ，如圖6(D)所示在晶舟30發生部分地未載置晶圓的掉牙 部80。稱這種載置樣態爲中塡塞變形1。 而且’佈置程式5爲實現如圖6(E)所示的佈置5的載 置狀態，此爲用以對圖6(D)所示的掉牙部80載置虛擬晶 圓DW。稱追種載置樣態爲中塡塞變形2。 上述各載置狀態只不過是僅顯示一例，用以實現種種 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁) -15- 559957 A7 __B7 __ 五、發明説明（13) 不同的載置樣態的多數佈置程式更被記憶於此佈置記憶部 1 6 〇 (請先閱讀背面之注意事項再填寫本頁) 其次，在作爲本發明的特徵的工作處理程式記憶部 72如圖5所示，記憶有由上述佈置識別記號與上述製程 識別記號之中選擇任意的佈置識別記號與製程識別記號’ 時系列地排列成應實行這些識別記號的順序的複數個工作 處理程式。 在圖5記憶有全部h個（h:正的整數）工作處理程式 ，分別附加有Π〜〗h的工作識別記號。例如工作識別記號 J1的工作處理程式爲”Ll-> ΡΓ，故意味著依照此順序進行 晶圓載置與製程。這些工作處理程式分別各選擇一個或複 數個圖3所示的製程程式與圖4所示的佈置程式，以所希 望的時系列的順序組合，與上述工作識別記號一起記憶於 上述工作處理程式記憶部72的話佳。 其次，說明使用如以上構成的本發明的熱處理裝置進 行的本發明方法。 經濟部智慈財產笱員工消費合作社印製 首先操作者因預先判明想實行的晶圓的佈置狀態以及 應實行的製程，故由圖2所示的輸入操作部1 8輸入對應 於此組合的工作識別記號。此情形也有操作者由主電腦 20側輸入此工作識別記號的情形。 於是，控制單元2由工作處理程式記憶部72讀出由 其輸入的工作識別記號對應的工作處理程式，解析其內容 。此解析結果控制單元2以特定於工作處理程式的順序分 別依次實行佈置程式或製程程式而進行。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -16- 559957 A7 B7 五、發明説明（14) 例如當操作者以工作識別記號輸入”π”時，因此工作 處理程式爲以”L1—ΡΓ作爲內容，故晶圓移載機構82驅 動’如圖6 (A)所7K的佈置1將製品晶圓W與虛擬晶圓d W 移載到晶舟3 0，而且’使此晶舟3 0上升將晶圓裝載到處 理容器28內’以實行製程程式1。此外，以下同樣地關 於晶圓的移載，此晶圓移載機構82會動作。 而且同樣地，當以工作識別記號輸入” J2”時，因工作 處理程式爲以”L2—P3”作爲內容，故如圖6(B)所示的佈置 2將製品晶圓W與虛擬晶圓DW移載到晶舟30，以實行 製程程式3。 而且同樣地，當以工作識別記號輸入” J3”時，因工作 處理程式爲以” L 3 — P 1 — P 2 — P 3 ”作爲內容，故如圖6 (C)所 示的佈置3將製品晶圓W與虛擬晶圓D W移載到晶舟3 0 ，以依次實行製程程式1、製程程式2以及製程程式3。 如此，像連續實行複數次例如三次製程程式的處理形態使 用於例如像氧化膜、氮化膜、氧化膜的疊層構造的多層膜 構造的情形等。 而且同樣地，當以工作識別記號輸入” J4”時，因工作 處理程式爲以”P4— L2— P2—ΡΓ作爲內容，故在處理容器 28內爲空的狀態下實行製程程式4的檢查處理，確認熱 處理裝置的各構成零件是否正常地動作，若可確認正常動 作的話，像如圖6(B)所示的佈置2將製品晶圓W與虛擬 晶圓DW移載到晶舟30，以依次實行製程程式2以及製 程程式1。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） I---------裝-- (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產笱員工消費合作社印製 -17- 559957 A7 B7_ __ 五、發明説明（15) (請先閱讀背面之注意事項再填寫本頁) 而且同樣地，當以工作識別記號輸入”J5”時’因工作 處-理程式爲以”L4—P3—P6”作爲內容，故像如圖6(D)所示 的佈置4將製品晶圓W與虛擬晶圓DW移載到晶舟30 ’ 以依次實行製程程式3以及製程程式6的淸洗處理。此情 形在實行淸洗處理的製程程式6前，當然使晶舟30下降 卸載，由處理容器28內取出晶圓W。 而且同樣地，當以工作識別記號輸入” J6”時，因工作 處理程式爲以”LI—PI—L2—P3”作爲內容，故首先像如圖 6(A)所示的佈置1將製品晶圓W與虛擬晶圓DW移載到晶 舟30，以實行製程程式1。其次，若此製程程式1的實行 完了的話，卸載晶舟3 0，由處理容器2 8內取出晶圓W， 而且其次，如圖6(B)所示的佈置2藉由重新傳送相同的 製品晶圓W改變佈置，接著實行製程程式2。 如以上對同一製品晶圓W也能以不同的佈置實施不 同的製程。 經濟部智慧財產局g(工消費合作社印製 如以上在本發明操作者僅藉由輸入一個工作識別記號 ，就能選擇一個或複數個所希望的工作處理程式，可在所 希望的晶圓佈置狀態下實施所希望的製程。 而且，因僅輸入一個工作識別記號，故與習知方法比 較也能抑制輸入誤失的發生。 此外，在本實施例雖然以雙重管構造的熱處理裝置爲 例而說明，惟若爲整批式的熱處理裝置的話其構造就不特 別限定，單管構造的熱處理裝置；以像由處理容器的底部 導入氣體由最高部排氣的構造的熱處理裝置；或者相反地 ^氏張尺度適用中國國家標準（CNS ) A4規格(210X297公釐) ~ "" -18- 經濟部智慧財產局員工消費合作社印製 559957 A7 ___B7 五、發明説明（16) 以像由處理容器的最高部導入氣體由底部排氣的構造的熱 處理裝置等也都能適用本發明。而且，不僅縱型的熱處理 裝置，橫型的熱處理裝置也能適用。 而且，被處理體不限定於半導體晶圓，也能適用於 LCD基板、玻璃基板等。 如以上的說明，如果依照本發明的熱處理裝置及熱處 理方法，可發揮如以下的優良的作用功效。 操作者僅藉由例如輸入操作部輸入所希望的工作識別 記號，分別由佈置記憶部與製程記憶部讀出被此工作識別 記號特定的佈置程式與製程程式，藉由以工作處理程式表 示的時系列的順序依次實行這些程式，因此，僅藉由選擇 工作識別記號，可選擇種種的佈置程式與製程程式的組合 ，而且也能抑制輸入誤失的發生。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁)559957 A7 B7 V. Description of the invention (j) [Field of the invention] (Please read the precautions on the back before filling out this page) The present invention relates to performing predetermined heat treatment and chemical / physical treatment on the object to be processed, such as semiconductor wafers. Heat treatment device and heat treatment method [Background of the invention] [Explanation of the know-how] Generally, in order to manufacture a semiconductor integrated circuit, a semiconductor wafer composed of a silicon substrate or the like is subjected to film formation treatment, etching treatment, oxidation treatment, diffusion treatment, modification Various heat treatments such as quality treatment. In the case of performing these heat treatments in a vertical so-called batch-type heat treatment device, first, a semiconductor wafer can be transferred to a cassette box that can accommodate a plurality of semiconductor wafers, for example, about 25 wafers. The vertical Wafer boat supports it in multiple sections. This wafer boat can hold, for example, a maximum of about 150 wafers. Furthermore, in order to make the gas flow uniform or adjust the temperature profile in the height direction, a dummy wafer different from a product wafer is supported at a predetermined position as needed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in a state where various wafers are supported in multiple stages, the wafer boat is introduced (loaded) from below in a processing container that can be evacuated to maintain the processing airtightly Inside the container. In addition, a previously created process program is implemented, and a predetermined heat treatment is performed in accordance with the above process program while controlling various process conditions such as the flow rate of the process gas, the process pressure, and the process temperature. In this case, according to the type of processing, the number of wafers of the product wafer during processing, etc. For the arrangement of the wafer to support the wafer in the wafer boat, or the virtual wafer, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297) -4-559957 A7 B7 V. Description of the invention (2) --- Ze-(Please read the precautions on the back before filling out this page) Where is it located, or is it supported in the wafer cassette Wafers are missing, whether a virtual wafer is inserted into the missing position when the wafer is being transferred, or whether the missing position is vacated, such as a layout program for the layout of the wafer. Must be indicated before heat treatment. Moreover, it is of course necessary to indicate in advance a process program corresponding to the heat treatment to be performed. Therefore, for the above-mentioned conventional heat treatment device, the operator must input two types of symbols of the symbol of the specific layout program and the symbol of the specific process program, especially if there are many types of each symbol, the symbols that have been entered incorrectly may occur. Situation. [Summary of the invention] The present invention is made in consideration of this point, and its purpose is to provide a heat treatment device and a heat treatment method that can select a combination of a layout program and a process program with a simple operation. The present invention is a heat treatment device, which includes: a processing container; a 47-person consumer cooperative of the Ministry of Economic Affairs; a consumer cooperative; printed and arranged in the processing container; a plurality of stages of a plurality of processed objects at a predetermined position; Downloading the plurality of objects to be processed in the state of the arrangement of the object boat, and each including a layout memory unit having a plurality of layout programs with specific layout identification marks; in order to perform different heat treatments on the objects, each The process conditions are different, and each contains a plurality of paper sizes with specific process identification marks. The Chinese paper standard (CNS) A4 (210X29? Mm) is applicable. -5- 559957 A7 B7 V. Description of the invention (3) Process memory section; selecting an arbitrary layout identification mark and a process identification mark from the layout identification mark corresponding to each of the plurality of layout programs and the process identification mark corresponding to each of the plurality of layout programs, time series Are arranged in the order in which these identification marks should be implemented, and A job processing program memory unit having a plurality of job processing programs (〖ob recipe) having specific job identification marks; and inputting the aforementioned job identification marks from outside to implement the aforementioned layout program specified by the corresponding job processing programs and Control unit controlled by the aforementioned process program. According to this, the operator only inputs the desired job identification mark by, for example, the input operation part, and the layout memory part and the process memory part respectively read out the layout program and process program specified by the job identification mark, and the job processing program These sequences are executed sequentially in the order of the time series shown. According to this, only by selecting the job identification mark, various combinations of layout programs and process programs can be selected, and the occurrence of input errors can be suppressed. The present invention is a heat treatment device, characterized in that the work processing program memory section includes a work processing program having one or more process identification marks. The present invention is a heat treatment device, characterized in that the work processing program memory section includes a work processing program having one or a plurality of layout identification marks. The present invention is a heat treatment apparatus characterized in that the processing container is a vertical processing container having a lower end open. This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) --------- install-(Please read the precautions on the back before filling out this page) Order for the staff of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by a cooperative -6-559957 A7 _____B7___ V. Description of the invention (4) The present invention is a heat treatment device characterized in that a work identification mark is input to a control unit through an input operation unit. (Please read the precautions on the back before filling in this page) The present invention is a heat treatment method, which introduces the object to be processed supported by the object boat into the processing container, and implements the predetermined heat treatment. Its characteristics include: Downloading and processing the above-mentioned object, and preliminarily memorizing a plurality of layout programs each having a specific layout identification mark in a layout memory section; the process conditions for heat treatment are different, and a plurality of specific process identification marks are respectively made in advance Each process program is memorized in the process of the process memory section; an arbitrary layout identification mark is selected from the layout identification mark corresponding to each of the plurality of layout programs and the process identification mark corresponding to each of the plurality of layout programs. The process identification marks are arranged in series in order to implement the order of these identification marks, and a plurality of job processing programs each having a specific job identification mark are stored in advance in the process of the job processing program memory department; and the intellectual property of the Ministry of Economic Affairs Bureau employee consumer cooperatives print and borrow The job identification mark is input from the outside, and the processed body is placed in the processed body boat and introduced into the processing container under the layout state of the aforementioned layout program specified by the corresponding job processing program. Under the specific process conditions, the object is heat treated. [Brief description of the drawing] Figure 1 shows the structure of an example of a thermal oxidation device related to the present invention. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 559957 A7 _____________ 5. Description of the invention (5) Illustration. (Please read the precautions on the back before filling out this page.) Figure 2 is a block diagram showing the control system of the heat treatment apparatus of the present invention. FIG. 3 is a diagram showing memory contents in a process memory unit. FIG. 4 is a diagram showing memory contents in the layout memory section. FIG. 5 is a diagram showing memory contents in a work processing program memory unit. FIG. 6 is a view showing a layout of a wafer placed in a wafer boat. [Description of symbols] 2: Control unit 4: Busbar 6: Heater control unit 8: Mechanism control unit 10: Gas control unit 1 2: Pressure control unit 14: Process memory unit 16: Arrangement memory unit, Ministry of Economic Affairs, Intellectual Property Printed by the Bureau's Consumer Cooperatives 1 8: Input operation section 20: Host computer 22: Heat treatment device 24: Inner tube 2 6: Outer tube 2 8: Processing container 3 0: Crystal boat 32: Cover This paper applies Chinese national standards ( CNS) 8 specifications (210X297 mm) -8- 559957 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (6) 34: Magnetic fluid seal 3 6: Rotary shaft 3 8: Rotary table 4 0 : Insulation tube 42: Boat elevator 44, 84: Arm 46: Manifold 50A, 50B, 50C: Gas supply system 48A ~ 48C: Gas nozzles 52A ~ 52C: Flow controller 54: Exhaust port 5 6: Exhaust path 5 8: Pressure control valve 60: Vacuum pump 62: Vacuum exhaust system 6 4: Thermal insulation layer 6 6: Heater 68 '70: Sealing member 72: Work processing program memory 74: Hard disk 80: Tooth drop 82: Crystal Circular transfer mechanism 84: transfer arm 8 6: wafer fork (please read the precautions on the back before filling this page) This paper size applies National Standard (CNS) A4 Specification (210X297 mm) -9- 559957 A7 B7 V. Description of Invention (7) 8 8: Wafer Fork S: Processing Space (Please read the precautions on the back before filling this page) W : Product wafer DW: Virtual wafer [Detailed description of the preferred embodiment] Hereinafter, an embodiment of the heat treatment device and heat treatment method related to the present invention will be described in detail based on the attached drawings. 1 is a block diagram showing an example of a thermal oxidation device according to the present invention; FIG. 2 is a block diagram showing a control system of a heat treatment apparatus according to the present invention; FIG. 3 is a diagram showing memory contents in a process memory unit; and FIG. 4 is a diagram showing A memory content map in the layout memory unit; FIG. 5 is a memory content map in the job processing program memory unit; and FIG. 6 is a sample diagram showing the layout of the wafer placed in the wafer boat. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This heat treatment device 22 has a vertical-type processing container 28 of a double structure made of stone and made of an inner tube 24 and an outer tube 26. In the processing space S in the inner cylinder 24, a quartz wafer boat 30 serving as a boat to hold a processed object is housed. Here, the wafer 30 is used as a semiconductor wafer of the processing object at a predetermined pitch. Be kept in multiple segments. In addition, the wafer boat 30 is also held here, as will be described later. In order to open and close the processing container 28, a cap 32 is provided, and a rotation shaft 36 is provided through the cap 32 through a magnetic fluid seal 34. In addition, a rotary table (Table) 38 is arranged on the upper end of the rotary shaft 36, and a thermal insulation tube 40 is arranged on the rotary table 38, and the paper is placed on this thermal insulation tube 40. The Chinese national standard (CNS) A4 is applied. Specifications (210X297mm) -10- 559957 A7 _ _ B7____ 5. Description of the invention (8) (Please read the precautions on the back before filling this page) The above-mentioned crystal boat 30. The rotary shaft 36 is mounted on an arm 44 of a liftable boat elevator 42 so that the lid 32, the boat 30, and the like can be raised and lowered integrally, and the boat 30 can be inserted into and removed from the processing container 28 from below. In addition, the wafer boat 30 may be kept in a fixed state without rotating the wafer boat 30. A lower end opening of the processing container 28 is joined to a manifold 46 made of stainless steel, for example. Here, the manifold 46 is used to introduce various necessary gases into the processing container 28. In the example shown in the figure, three gas nozzles 48A, 48B, and 48C pass through and are arranged. In addition, gas supply systems 50, 50, and 50 (:) are connected to each of the gas nozzles 48 to 48, and, for example, mass flow control for controlling gas flow is provided in each of the gas supply systems 50A to 50C. Flow controllers 52 A, 5 2B, 5 2C. Although three gas nozzles 48A to 48C are provided here, the number of gas nozzles can of course be increased or decreased as needed. Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the consumer cooperative, and each gas supplied from each of the gas nozzles 48 A to 48C ascended to the wafer storage area of the processing space S in the inner cylinder 24 and turned back downward at the highest part, and then flowed down to the inner cylinder 24 and The outer cylinder 26 is discharged in the gap. Further, an exhaust port 54 is provided on the bottom side wall of the outer cylinder 26, and the exhaust port 54 is connected to a pressure control valve 58 and a vacuum pump 60 through an exhaust path 56. A vacuum exhaust system 62 is formed to evacuate the inside of the processing container 28. In addition, a heat insulation layer 6 4 is disposed on the outer periphery of the processing container 28, and a heater 6 6 is disposed on the inside. As a means of heating, W is heated to a predetermined temperature. I The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -11-559957 A7 B7 V. Description of the invention (9) Here, the overall size of the processing container 28 is, for example, If the size of the wafer W to be heat-treated is 8 inches, and the number of wafers held on the wafer boat 30 is about 150 (about 130 wafers of product wafers; about 20 wafers such as virtual wafers), the diameter of the inner cylinder 24 The diameter of the outer tube 26 is about 275 to 285 mm, and the height of the processing container 28 is about 1 280 mm. In addition, reference numeral 68 in FIG. 1 is a seal such as the O-ring between the sealing cover 32 and the manifold 46. The member 70 is a sealing member such as a 0-ring between the sealing manifold 46 and the lower end of the outer tube 26. The wafer W and the like are transferred to the wafer boat 30 below the processing container 28, and are provided for The wafer transfer mechanism 82 is taken out from here. This wafer transfer mechanism 82 has, for example, a transfer arm 84 that moves in a vertical direction by a ball screw, and the transfer arm 84 is disposed along the The arm 84 can slide and rotate the wafer fork head. r) 86. In addition, the wafer fork head 86 extends a plurality of forks 88 (fork) shown in the figure, so that the wafer fork 88 can load a maximum of 5 wafers at a time. The wafer boat 30 is transferred. Next, the control system of the heat treatment apparatus will be described with reference to Fig. 2. The control system of the heat treatment apparatus in Fig. 2 has a control unit 2 such as a central calculation unit of a computer. The busbar extended by the control unit 2 4 A heater control unit 6 such as a heater 66 that controls the heat treatment device, and a wafer elevator 42 that controls the loading / unloading (Loader / Unloader) of the wafer boat 30, or a wafer boat 30, respectively. Circular transfer / removal of wafer transfer mechanism 82 and other mechanism control units 8. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) $-(Please read the precautions on the back first (Fill this page), 1; Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -12- 559957 A7 _ _B7_ V. Description of the invention (1〇) (Please read the precautions on the back before filling this page) and control the processing gas Supply controllers 52A ~ 52C, etc. A gas control unit 10 controlled by a pressure control unit, a pressure control unit 12 controlled by a pressure control valve 5 8 which controls the pressure in the processing vessel 28, and a process in which a plurality of process programs are stored for performing various processes. The memory unit 14 and the layout memory unit 16 that memorize a plurality of layout programs implemented to realize various layout states of the wafer configuration of the wafer boat 30, and respectively combine the layout identification mark of the above-mentioned layout program and the process program. The process identification marks are arranged in series in a job processing program memory unit 72 of a plurality of job processing programs in a sequence to be executed. In addition, the above-mentioned process memory section 14, layout memory section 16, and work processing program memory section 72 are formed in the same secondary memory section such as the hard disk 74. Further, the bus 4 is connected to an input operation unit 18 including a touch panel, a keyboard, and the like, and a control unit 2 that controls the overall operation of the device. There are also cases where various control commands are input from the host computer (Host computei *) 20 side. In addition, the above-mentioned control sections are representative examples. In fact, various control sections are connected to the above-mentioned busbar. 2 Printed by the Consumer Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Memory content. First, as shown in FIG. 3, the process memory unit 14 stores various process programs for actually performing heat treatment (process) and process identification marks for identifying the process programs. In FIG. 3, all m (m: positive integer) process programs are memorized, and process identification marks of P1 to Pm are added respectively. For example, process program 1 is the program for film formation process 1; process program 2 is the program for film formation process 2; process · program 3 is the program for film formation process 3; the paper size of the process applies the Chinese National Standard (CNS) A4 Specifications (210X297mm) -13- 559957 A7 ___B7_ V. Description of the invention (u) (Please read the precautions on the back before filling this page) Program 4 is the program for checking (Check) processing; process program 5 is for aging The program for the seasoning process and the process program 6 are programs for the C1 eaning process. Various process conditions such as the type of gas used, the gas flow rate, the process temperature, the process pressure, and the process time are also added to each of the above process programs. The above-mentioned film forming processes 1 to 3 are processes for depositing various kinds of films on a wafer, for example. The above-mentioned inspection process is a process for inspecting whether the heater 66, the flow controllers 52A to 52C, the pressure control valve 58, and the like are operating normally before the film formation process or the like is actually performed. The above-mentioned aging treatment is, for example, a treatment performed immediately after the rinsing treatment, and the like. Actually, the gas for film formation is circulated in the processing container 28 before the film is deposited on the wafer. The inner surface is used for processing for stabilizing the environment in the processing container 28. The rinsing process is a process of removing an unnecessary film attached to the inner surface of the processing container 28 or the surface of the wafer boat 30. The type of heat treatment shown here is printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, which is only an example, and others can be subjected to, for example, oxidation diffusion treatment, etching treatment, modification treatment, and tempering (A η nea 1) treatment. And other various heat treatments. Next, as shown in FIG. 4 and FIG. 6, the layout memory section 16 stores various layout programs for realizing a predetermined layout state when the wafer is transferred to the wafer boat 30, and layouts for identifying the layout programs. Identification mark. In FIG. 4, all η (η: positive integer) layout programs are memorized, and layout identification marks of L 1 to Ln are added respectively. Each of the above-mentioned layout programs places wafers in the wafer boat 30 in order to achieve mutually different layout states. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -14- 559957 Intellectual property of the Ministry of Economic Affairs ^ 7B (printed by the Industrial and Consumer Cooperatives A7 B7 V. Description of the invention (12) For example, the layout program 1 is to achieve As shown in Fig. 6 (A), the placement state of arrangement 1 is shown in Fig. 6 (A). The arrangement 1 shown in Fig. 6 (A) is to place a plurality of dummy wafers DW on the upper and lower ends of the wafer boat 30. The placement state where the product wafer W is placed in the center is called the middle plug. In addition, the layout program 2 is the placement state in which the placement 2 is not shown in FIG. 6 (B). A plurality of pieces are placed on the lower end side of 0. In the example shown in the figure, 10 pieces of virtual wafers DW are placed on top of the wafers, and all the product wafers W are loaded on the upper side. This is called the upper case. Moreover, in order to realize the placement state of the arrangement 3 as shown in FIG. 6 (C), a plurality of wafers are placed on the upper side of the wafer boat 30. In the example of the figure, 10 virtual wafers DW are placed. Below this, the loading pattern of all the product wafers w loaded in the lower part is called the lower part. The layout program 4 is to realize the layout 4 as shown in FIG. 6 (D). This is a deformation that shows the state of intermediate congestion as shown in Fig. 6 (A). That is, it is not limited to 25 wafer storage cassettes from which wafers are transferred, and they are often fully loaded with wafers, and some are also partially loaded. It is pulled out into the so-called tooth-losing state. In this case, the tooth-losing portion is left intact (without jamming the wafer), and all wafers are transferred to the wafer boat 30 in this state. Therefore, as shown in FIG. 6 (D), the tooth-dropping portion 80 in which the wafer is partially unloaded occurs in the wafer boat 30. This mounting state is referred to as a middle plug deformation 1. Moreover, the “arrangement formula 5” is implemented as The placement state of the arrangement 5 shown in Fig. 6 (E) is used to place the virtual wafer DW on the tooth drop portion 80 shown in Fig. 6 (D). Variation 2. Each of the above mounting conditions is only an example, and it is used to realize the various paper sizes that apply the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling this page) -15- 559957 A7 __B7 __ V. Description of the invention (13) Most layout programs with different mounting patterns are memorized here. Section 16 (Please read the precautions on the back before filling out this page) Secondly, as shown in FIG. 5, the work processing program memory section 72, which is a feature of the present invention, stores the above-mentioned layout identification mark and the above-mentioned process identification mark. When selecting an arbitrary arrangement identification mark and a process identification mark among them, a plurality of work processing programs are arranged in series in the order in which these identification marks should be implemented. In FIG. 5, all h (h: positive integer) work processing programs are memorized. The job identification marks Π ~〗 h are attached respectively. For example, the job processing program of the job identification mark J1 is "Ll- > Pl", which means that wafer placement and manufacturing processes are performed in this order. These work processing programs each select one or a plurality of process programs shown in FIG. 3 and layout programs shown in FIG. 4, and are combined in the sequence of a desired time series and stored in the work processing program memory together with the above-mentioned job identification mark. The words of Department 72 are good. Next, the method of the present invention performed using the heat treatment apparatus of the present invention configured as described above will be described. Printed by the Intellectual Property Department of the Ministry of Economic Affairs and the Employee Consumer Cooperative. The operator first determines the layout status of the wafers to be implemented and the process to be implemented. Therefore, the input operation section 18 shown in FIG. 2 inputs the work corresponding to this combination. Identification mark. In this case, the operator may input the job identification mark from the host computer 20 side. Then, the control unit 2 reads out the job processing program corresponding to the job identification code inputted by the job processing program storage unit 72, and analyzes its content. The analysis result control unit 2 executes a layout program or a process program in the order specific to the work processing program. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -16- 559957 A7 B7 V. Description of the invention (14) For example, when the operator enters "π" with the job identification mark, the job processing program is "L1-PΓ as the content, so the wafer transfer mechanism 82 drives 'as shown in the arrangement of 7K in Fig. 6 (A) 1 to transfer the product wafer W and the virtual wafer dW to the wafer boat 30, and' make this The wafer boat 30 rises to load wafers into the processing container 28 to execute the process program 1. In addition, the wafer transfer mechanism 82 will operate similarly to the wafer transfer in the following. When the identification code is inputted as "J2", since the job processing program uses "L2-P3" as the content, the arrangement 2 shown in Fig. 6 (B) transfers the product wafer W and the virtual wafer DW to the wafer boat 30. In order to implement the process formula 3. Also, when "J3" is input with the job identification mark, the job processing program contains "L 3 — P 1 — P 2 — P 3” as the content, so as shown in Figure 6 (C The arrangement 3 shown in Figure) transfers the product wafer W and the virtual wafer DW to the wafer boat 3 0 to sequentially realize Process formula 1, process formula 2, and process formula 3. In this way, a processing form such as a three-step process program that is executed multiple times in succession is used, for example, in the case of a multilayer film structure such as a laminated structure of an oxide film, a nitride film, or an oxide film. In the same way, when "J4" is input with the job identification code, the job processing program is "P4-L2-P2-PΓ" as the content, so the inspection of the process program 4 is performed with the processing container 28 empty. Processing to confirm whether each component of the heat treatment device operates normally. If the normal operation can be confirmed, the product wafer W and the virtual wafer DW are transferred to the wafer boat 30 as shown in the arrangement 2 shown in FIG. 6 (B). In this way, process program 2 and process program 1 are executed in sequence. This paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) I --------- install-(Please read the precautions on the back before filling this page) Order the intellectual property of the Ministry of Economic Affairs 笱Printed by Employee Consumer Cooperatives -17- 559957 A7 B7_ __ V. Description of Invention (15) (Please read the notes on the back before filling out this page) Also, when entering "J5" with a job identification mark, 'cause of work place -The program is based on "L4—P3—P6", so the product wafer W and virtual wafer DW are transferred to the wafer boat 30 'as shown in Fig. 6 (D) to sequentially execute the process program 3 and cleaning process of process formula 6. In this case, of course, before the process 6 of the cleaning process is performed, the wafer boat 30 is lowered and unloaded, and the wafer W is taken out from the processing container 28. And similarly, when inputting "J6" with the job identification mark, the job processing program uses "LI-PI-L2-P3" as the content, so the product is first crystallized as shown in arrangement 1 shown in Fig. 6 (A). The circle W and the virtual wafer DW are transferred to the wafer boat 30 to execute the process program 1. Next, if the execution of this process program 1 is completed, the wafer boat 30 is unloaded, and the wafer W is taken out from the processing container 28, and secondly, the arrangement 2 shown in FIG. 6 (B) is used to retransmit the same product. The layout of the wafer W is changed, and then the process program 2 is executed. As described above, different processes can be implemented for the same product wafer W in different arrangements. The Intellectual Property Bureau of the Ministry of Economic Affairs (printed by the Industrial and Consumer Cooperative Society as described above) In the present invention, the operator can select one or more desired job processing programs by entering only one job identification mark, which can be arranged in the desired wafer state The desired process is implemented next. Moreover, since only one job identification mark is input, compared with the conventional method, the occurrence of input errors can be suppressed. In addition, in this embodiment, a heat treatment device with a double tube structure is used as an example. However, if it is a batch-type heat treatment device, the structure is not particularly limited. The heat treatment device of a single tube structure; a heat treatment device of a structure in which gas is introduced from the bottom of a processing vessel and exhausted from the highest part; or vice versa Zhang scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) ~ " " -18- Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 559957 A7 ___B7 V. Description of the invention (16) The present invention can also be applied to a heat treatment device having a structure in which the highest portion of the gas is introduced and the gas is exhausted from the bottom. Moreover, not only the vertical heat treatment Horizontal and horizontal heat treatment devices can also be applied. Moreover, the object to be processed is not limited to semiconductor wafers, but can also be applied to LCD substrates, glass substrates, etc. As described above, if the heat treatment device and heat treatment method of the present invention are used, The following excellent functions and effects can be exhibited: The operator only inputs the desired job identification mark by, for example, inputting the operation section, and the layout memory section and the process memory section respectively read out the layout program and process program specified by the job identification mark. These programs are executed sequentially in the order of the time series represented by the job processing program. Therefore, only by selecting job identification marks, various combinations of layout programs and process programs can be selected, and the occurrence of input errors can be suppressed. This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)
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