KR20040028678A - Heat treatment device, and heat treatment method - Google Patents

Abstract

The heat treatment apparatus includes a treatment vessel 28 and a workpiece boat 30 disposed in the treatment vessel 28 to support the workpiece W in multiple stages. When the operator inputs the desired job identification symbols J1 to Jh, for example, from the input operation unit 18, the layout program and the process program are respectively stored in the layout storage unit 16 and the process storage unit through the job recipe specified by the job identification symbol. It reads from (14) and executes them in order in the time series shown by the work recipe. Accordingly, a combination of various layout programs and process programs can be selected only by selecting a work identifier.

Description

Heat treatment equipment and heat treatment method {HEAT TREATMENT DEVICE, AND HEAT TREATMENT METHOD}

Generally, in order to manufacture a semiconductor integrated circuit, various heat treatments, such as a film forming process, an etching process, an oxidation process, a diffusion process, and a reforming process, are performed with respect to the semiconductor wafer which consists of a silicon substrate. In the case where these heat treatments are performed by a vertical so-called batch-type heat treatment apparatus, first, a semiconductor wafer is placed in a vertical wafer boat in a cassette capable of accommodating a plurality of semiconductor wafers, for example, about 25 sheets. wafer boat) to support it in multiple stages. This wafer boat is large and can hold, for example, up to about 150 wafers. In addition, in order to make the gas flow uniform or to adjust the temperature profile in the height direction, a dummy wafer different from the product wafer is supported at a predetermined position as necessary.

In such a state in which various wafers are supported in multiple stages, the wafer boat is loaded (loaded) from the lower side into the processing vessel configured to vacuum suction, thereby keeping the inside of the processing vessel airtight. Then, a process program prepared in advance is executed, and predetermined heat treatment is performed while controlling various process conditions such as the flow rate of the process gas, the process pressure, and the process temperature according to the process program.

In this case, depending on the type of processing, the number of product wafers in the process, etc., the arrangement of the wafers to be supported on the wafer boat or the position of the dummy wafers to be placed or the wafers supported in the cassette are scratched. If present, the layout program for the wafer layout (positioning state), such as whether or not to insert a dummy wafer or leave the scratch position empty as to the scratch position when the wafer boat is moved and loaded. Should be indicated prior to heat treatment. In addition, of course, the process program corresponding to the heat treatment must be instructed in advance.

By the way, in the above-mentioned conventional heat processing apparatus, the operator must input two types of symbols, symbol which specifies a layout program and symbol which specifies a process program, In particular, the kind of each symbol In many cases, there is a problem that a symbol to be input may be wrong.

The present invention relates to a heat treatment apparatus and a heat treatment method for performing predetermined heat treatment and chemical / physical treatment on a target object such as a semiconductor wafer.

1 is a configuration diagram showing an example of a thermal oxidation apparatus according to the present invention.

2 is a block diagram showing a control system of the heat treatment apparatus of the present invention.

3 is a diagram showing the contents of storage in the process storage unit.

4 is a diagram showing the contents of storage in the layout storage unit.

5 is a diagram showing the contents of storage in the work recipe storage unit.

Fig. 6 is a diagram showing the layout of a wafer placed on a wafer boat.

SUMMARY OF THE INVENTION The present invention has been made in view of this point, and an object thereof is to provide a heat treatment apparatus and a heat treatment method capable of selecting a combination of a layout program and a process program by a simple operation.

The present invention provides a processing vessel, an object boat arranged in a processing container and placing a plurality of objects in multiple stages at a predetermined position, and placing the plurality of objects on the object boat in a different layout state. And a layout storage section including a plurality of layout programs each having a specific layout identifier, and for performing different heat treatments on the object to be processed, the process conditions are different and each specific process Any of a process storage unit including a plurality of process programs having an identifier, a layout identifier corresponding to each of the plurality of layout programs, and a process identifier corresponding to each of the plurality of process programs; Select the identifier and the process identifier and run them A job recipe storage section including a plurality of job recipes, each of which is arranged in a time series in the order to be performed, each of which has a specific job identification code; And a control unit for controlling to execute the layout program and the process program specified by a corresponding work recipe by inputting from the outside.

Accordingly, the operator simply inputs a desired job identifier from the input operator, for example, reads the layout program and the process program specified by the job identifier from the layout memory and the process memory, and reads them into the job recipe. Since the execution is performed in order of the time series shown, a combination of various layout programs and process programs can be selected only by selecting a job identifier, and furthermore, occurrence of input errors can be suppressed.

The present invention is a heat treatment apparatus characterized in that the work recipe storage section includes a work recipe having one or a plurality of process identifiers.

The present invention is a heat treatment apparatus characterized in that the work recipe storage section includes a work recipe having one or a plurality of layout identifiers.

The present invention is the heat treatment apparatus, characterized in that the treatment vessel is a vertical type treatment vessel with an open bottom.

The present invention is a heat treatment apparatus characterized in that a job identification symbol is input to a control unit by an input operation unit.

The present invention provides a heat treatment method in which a workpiece to be supported by a workpiece boat is introduced into a processing vessel and subjected to a predetermined heat treatment, wherein the workpieces are placed in different layout states, and each of them has a specific layout identifier. Storing the plurality of layout programs in advance in the layout storage unit; and storing the plurality of process programs each having a specific process identification symbol in advance in the process storage unit while the process conditions for heat treatment are different; Selecting an arbitrary layout identifier and a process identifier from among layout identifiers corresponding to each of the plurality of layout programs and process identifiers corresponding to each of the plurality of process programs, and time-sequentially in order to execute them. At the same time, each A process of storing a plurality of work recipes having this specific work identifier in advance into a work recipe storage unit and inputting a work identifier from the outside, so that the feature is in a layout state based on the layout program specified through the corresponding work recipe; The liquor is placed on a workpiece boat to be introduced into a treatment vessel, and the heat treatment target object is subjected to heat treatment under a process condition based on a process program specified through the above work recipe.

EMBODIMENT OF THE INVENTION Hereinafter, one Example of the heat processing apparatus and heat processing method which concern on this invention is described in detail based on an accompanying drawing.

1 is a block diagram showing an example of a thermal oxidation apparatus according to the present invention, FIG. 2 is a block diagram showing a control system of the heat treatment apparatus according to the present invention, FIG. 3 is a diagram showing the contents of storage in the process storage unit, and FIG. 4 is a layout memory. 5 is a diagram showing the contents of the storage in the book, FIG. 5 is a diagram showing the contents of the working recipe storage, and FIG. 6 is a diagram showing the layout of the wafer placed on the wafer boat.

This heat treatment apparatus 22 has a processing vessel 28 having a longitudinal length of a quartz double tube structure composed of an inner tube 24 and an outer tube 26. In the processing space S in the inner cylinder 24, a quartz wafer boat 30, which is a workpiece boat for holding a workpiece, is accommodated. The wafer boat 30 includes a semiconductor wafer W as a workpiece. ) Is held in multiple stages at a predetermined pitch. On the other hand, the wafer boat 30 also holds dummy wafers and the like as described later.

A cap 32 is provided to open and close the bottom of the processing container 28, and a rotation shaft 36 penetrates through a magnetofluid seal 34. Then, the rotary table 38 is provided on the upper end of the rotary shaft 36, and the thermo cylinder 40 is installed on the table 38, and the wafer boat 30 is placed on the thermo cylinder 40. have. And, the rotating shaft 36 is attached to the arm (44) of the elevating boat elevator 42, and is capable of raising and lowering integrally with the cap 32, the wafer boat 30, etc., The wafer boat 30 can be inserted into and removed from the bottom of the processing container 28. In addition, you may make this the fixed state, without rotating the wafer boat 30. FIG.

The lower end opening of the processing container 28 is joined to, for example, a stainless steel manifold 46. The manifold 46 introduces various necessary gases into the processing container 28. In the plurality of illustrated examples, three gas nozzles 48A, 48B, and 48C are provided through. And gas supply systems 50A, 50B, 50C are connected to each gas nozzle 48A-48C, and gas flow volume is controlled to each gas supply system 50A-50C, for example, Flow controllers 52A, 52B, and 52C, such as mass flow controllers, are fitted. Although three gas nozzles 48A to 48C are provided here, of course, the number of gas nozzles can be increased or decreased as needed.

And each gas supplied from each said gas nozzle 48A-48C raises the accommodating area | region of the wafer which is the process space S in the inner cylinder 24, returns to the lower part from the ceiling, and the inner cylinder 24 ) And the inside of the gap between the outer cylinder 26 is discharged. In addition, an exhaust port 54 is provided in the bottom side wall of the outer cylinder 26, and the pressure control valve 58 and the vacuum pump 60 are provided in the exhaust path 56 by fitting the exhaust port 54. A vacuum evacuating system 52 is connected so as to vacuum the inside of the processing vessel 28.

In addition, a heat insulation layer 64 is formed on the outer circumference of the processing container 28, and inside the heating container 66 is provided as a heating means so as to heat the wafer W located therein to a predetermined temperature. It is.

Here, the overall size of the processing container 28 is, for example, about 8 inches for the size of the wafer W to be heat treated, and about 150 sheets of wafers held in the wafer boat 30 (about 130 sheets of product wafers). When the dummy wafer is about 20 sheets), the inner cylinder 24 has a diameter of about 260 to 270 mm, the outer cylinder 26 has a diameter of about 275 to 285 mm, and the height of the processing container 28 is about 1280 mm.

1, reference numeral 68 denotes a sealing member such as an O-ring for sealing between the cap 32 and the manifold 46, and reference numeral 70 denotes a seal member of the manifold 46 and the outer cylinder 26. As shown in FIG. Seal members, such as a zero ring, which seal between the lower end portions.

In addition, a wafer transfer mechanism 82 is provided below the processing container 28 to move the wafer W or the like to the wafer boat 30 or to take it out of the wafer vessel 30. The wafer transfer mechanism 82 has, for example, a transfer arm 84 moved up and down by a ball screw, and slides along the arm 84 to the transfer arm 84. A fork head 86 is provided to move and pivot. In the illustrated example, a plurality of forks 88 are arranged continuously from the fork head 86, and the forks 88 allow the wafer boat 30 to hold up to five wafers W and the like at one time. It is to be able to carry about.

Next, with reference to FIG. 2, the control system of this heat processing apparatus is demonstrated.

In Fig. 2, the control system of the heat treatment apparatus has a control unit 2 such as a central computing unit of a computer. The bus 4, which is connected to the control unit 2, includes a heater control unit 6 for controlling a heating heater 66 and the like of the heat treatment apparatus, and a load / unload that is a lifting operation of the wafer boat 30. Mechanism controller 8 for controlling the wafer transfer mechanism 82 and the like for carrying and unloading the wafer to the boat elevator 42 and the wafer boat 30 to be carried out, and the processing gas. A gas control unit 10 for controlling the flow rate controllers 52A to 52C for controlling the supply and flow rate, a pressure control unit 12 for controlling the pressure control valve 58 for controlling the pressure in the processing container 28, and the like; And a process storage unit 14 storing a plurality of process programs for performing various other processes, and a plurality of layout programs executed to realize various layout states of the wafer arrangement with respect to the wafer boat 30. layout The storage unit 16, and a work recipe storage unit 72 for storing a plurality of work recipes arranged in time series in order of combining the layout identifier of the layout program and the process identifier of the process program, respectively, Each is connected. On the other hand, the process storage unit 14, the layout storage unit 16 and the work recipe storage unit 72 are formed in the same secondary storage unit, for example, the hard disk 74.

The bus 4 is further connected with an input operation unit 18 made of a touch panel, a keyboard, or the like, and a control unit 2 for controlling the operation of the entire apparatus. In addition, various control commands may be input at the host computer 20 side. In addition, each said control part has illustrated the typical thing, In fact, more control parts are connected to the said bus 4 further.

Here, the stored contents of the storage units 14, 16 and 72 will be described.

First, as shown in Fig. 3, the process storage section 14 stores various process programs for actually performing heat treatment (process) and process identification symbols for identifying them. In FIG. 3, m (m: positive integer) process programs are stored in total, and each of the program identification symbols P1 to Pm is attached. For example, the process program 1 is a program for performing the film forming process 1, the process program 2 is a program for performing the film forming process 2, the process program 3 is a program for performing the film forming process 3, and the process program 4 is a program for performing a checking process. The process program 5 is a program for performing a seasoning process, and the process program 6 is a program for performing a cleaning process.

The above process programs also include various process conditions such as gas type, gas flow rate, process temperature, process pressure, and process time to be used. The film forming processes 1 to 3 perform a process of depositing different kinds of films on the wafer, for example. In particular, the check processing is a process for checking whether the heating heater 66, the flow controllers 52A to 52C, the pressure control valve 58 and the like operate normally before actually performing the film forming process or the like.

The seasoning process is performed immediately after the cleaning process, for example, and before the film is actually deposited on the wafer, the same film type is applied to the inner surface of the processing container 28 by flowing gas for film formation in the processing container 28. It is a process for stabilizing the environment in the container 28.

The cleaning process is a process for removing an unnecessary film adhering to the inner surface of the processing container 28 or the surface of the wafer boat 30.

The kind of heat treatment shown here is merely an example, and in addition, various heat treatments, such as an oxidation diffusion process, an etching process, a modification process, and an annealing process, can be performed.

Next, as shown in FIGS. 4 and 6, the layout storage unit 16 includes various layout programs for realizing a predetermined layout state when the wafer is transferred to the wafer boat 30 and layouts for identifying them. The identifier is memorized. In Fig. 4, n layout programs (n: positive integers) are all stored, and each of the layout identifiers L1 to Ln is attached. Each of the above layout programs is configured to place a wafer on the wafer boat 30 so as to realize different layout states.

For example, layout program 1 realizes the mounting state of layout 1 as shown in Fig. 6A. In the layout 1 shown in Fig. 6A, a plurality of dummy wafers DW are placed on the upper and lower ends of the wafer boat 30, respectively, in the illustrated example, and a product wafer W is placed on the center. Form and this is called middle loading. In addition, the layout program 2 realizes the layout state of layout 2 as shown in FIG. 6 (B), and a plurality of dummy wafers DW are provided on the lower end side of the wafer boat 30. In the example shown in FIG. On top of this, the upper part of the product wafer (W) is in the form of a state filled with the top, this is called the upper loading (upper loading).

In addition, layout program 3 realizes the layout state of layout 3 as shown in FIG. 6C, and a plurality of dummy wafers DW are provided on the upper end side of wafer boat 30, and in the example shown, 10 sheets are shown. On top of this, the lower part is placed on the product wafer W in a state filled with the lower part, which is called lower loading.

In addition, the layout program 4 realizes the mounting state of the layout 4 as shown in FIG. 6 (D), which shows a variation of the intermediate loading state shown in FIG. 6 (A). That is, in the cassette which carries 25 wafers, for example, 25 sheets are not always filled with a wafer, and it may be in a state which is partially missing and what is called a tooth missing. In such a case, all the wafers are transferred to the wafer boat 30 in this state, with the same portions as those with their teeth missing (without filling the wafer). Therefore, as shown in FIG. 6 (D), the empty portion 80 in which the wafer is not partially placed is generated in the wafer boat 30. This type of placement is referred to as first modified middle loading.

In addition, the layout program 5 realizes the mounting state of the layout 5 as shown in Fig. 6E, which is to place the dummy wafer DW on the empty portion 80 shown in Fig. 6D. have. This type of placement is referred to as second modified middle loading.

Each of the above mounting forms is merely an example, and a plurality of layout programs for realizing various other mounting forms are stored in the layout storage unit 16.

Next, in the work recipe storage unit 72 characterized by the present invention, arbitrary layout identifiers and process identifiers are selected from the layout identifiers and the process identifiers as shown in Fig. 5, and these are executed. There are a number of work recipes that are listed in time series in the order they should be stored.

In FIG. 5, all h (h: positive integer) work recipes are memorize | stored, and the job identification symbols of J1-Jh are respectively attached. For example, the job recipe of the job identifier J1 is " L1? P1 ", which means that wafer placement and processing are performed in this order. These work recipes select one or more of the process program shown in FIG. 3 and the layout program shown in FIG. 4 and combine them in a desired time series order, and the work recipe storage unit 72 has a work identifier. Remember it.

Next, the method of the present invention using the heat treatment apparatus of the present invention configured as described above will be described.

First, since the layout state of the wafer to be executed and the process to be executed are known to the operator in advance, a job identification symbol corresponding to the combination is input from the input operation unit 18 shown in FIG. In this case, the operator may input the job identifier on the host computer 20 side.

In doing so, the control unit 2 reads out the corresponding work recipe from the inputted job identifier from the work recipe storage unit 72 and interprets the contents. As a result of this analysis, the control unit 2 executes the layout program or the process program in order in the order specified in the work recipe.

For example, when an operator inputs "J1" as a job identifier, since this job recipe has "L1-> P1" as the content, the wafer transfer mechanism 82 is driven and shown in Fig. 6A. As in Layout 1, the product wafer W and the dummy wafer DW are transferred to the wafer boat 30, the wafer boat 30 is lifted up, and the wafer is loaded into the processing container 28 to process the program. Will run On the other hand, this wafer transfer mechanism 82 operates with respect to transfer of wafers as follows.

Similarly, when " J2 " is input as the job identifier, since the job recipe is " L2 → P3 ", the product wafer W and the dummy wafer (as shown in layout 2 shown in FIG. DW) is transferred to the wafer boat 30 and the process program 3 is executed.

Similarly, when " J3 " is input as the job identifier, since the job recipe is set to " L3 → P1 → P2 → P3, " the product wafer W as shown in layout 3 shown in Fig. 6C. ) And the dummy wafer DW are transferred to the wafer boat 30 to execute the process program 1, the process program 2, and the process program 3 in this order. In this manner, the processing mode such as executing the process program a plurality of times, for example, three times in succession is used, for example, when forming a multilayer film structure such as a stacked structure of an oxide film, a nitride film, and an oxide film in order.

Similarly, when " J4 " is input as the job identifier, the job recipe has " P4-> L2-> P2-> P1 " If it is possible to check whether each component of the heat treatment apparatus is operating normally and to confirm the normal operation, the product wafer W and the dummy wafer DW as shown in layout 2 shown in FIG. In step 30, the process program 2 and the process program 1 are executed in sequence.

Similarly, when " J5 " is input as the job identifier, since the job recipe is " L4? P3 → P6 ", the product wafer W and the product wafer W are shown in the layout 4 shown in Fig. 6D. The dummy wafer DW is transferred to the wafer boat 30, and the cleaning process of the process program 3 and the process program 6 is executed in sequence. In this case, of course, the wafer boat 30 is lowered and unloaded before the process program 6, which is a cleaning process, and the wafer W is taken out of the processing container 28, of course.

Similarly, when " J6 " is input as the job identification symbol, the job recipe has the contents " L1-> P1-> L2-> P3 ". Therefore, first, as shown in layout 1 shown in FIG. W) and the dummy wafer DW are transferred to the wafer boat 30 and the process program 1 is executed. Next, when execution of this process program 1 is completed, the wafer boat 30 is unloaded, the wafer is taken out of the processing container 28, and the same product wafer W is then shown in FIG. 6 (B). Change layout as you change layout 2, and then continue to run process program 2.

As described above, other processes can be performed on the same product wafer W in different layouts.

In this way, in the present invention, the operator can simply select one or more desired job recipes and simply perform input of one job identifier to perform a desired process in a desired wafer layout state.

Moreover, only by inputting one job identification code, generation of an input error can be suppressed as compared with the conventional method.

Meanwhile, in the present embodiment, the heat treatment apparatus having a double tube structure has been described as an example, but the structure of the heat treatment apparatus of the batch type is not particularly limited, and the gas is introduced from the bottom portion of the heat treatment apparatus and the treatment vessel of the single tube structure. The present invention can also be applied to a heat treatment apparatus configured to exhaust the gas, or vice versa, to a heat treatment apparatus configured to introduce gas from the ceiling of the processing vessel and to exhaust the gas from the bottom. In addition, the present invention can be applied not only to a vertical heat treatment apparatus but also to a horizontal heat treatment apparatus.

In addition, the object to be processed is not limited to a semiconductor wafer, but can also be applied to LCD substrates, glass substrates, and the like.

As described above, according to the heat treatment apparatus and the heat treatment method of the present invention, the following excellent effect can be obtained.

The operator reads the layout program and the process program specified by this task identifier from the layout storage unit and the process storage unit, respectively, by simply inputting a desired task identifier from the input control unit, for example. In this order, the combinations of various layout programs and process programs can be selected only by selecting the job identifiers, and the occurrence of input misses can also be suppressed.

Claims (6)

Treatment vessels, An object boat disposed in the processing container for placing the plurality of objects in multiple stages at a predetermined position; A layout storage section for placing the plurality of objects to be processed in a different layout state on the object boat and including a plurality of layout programs each having a specific layout identifier; A process storage section which includes a plurality of process programs each having different process conditions and each having a specific process identification symbol in order to perform different heat treatment on the target object; Arbitrary layout identifiers and process identifiers are selected from among layout identifiers corresponding to each of the plurality of layout programs and process identifiers corresponding to each of the plurality of process programs, and sequentially in order to execute them. A work recipe storage, each of which comprises a plurality of work recipes each having a specific work identifier; And a control unit for controlling the execution of the layout program and the process program specified by a corresponding work recipe by inputting the work identifier from the outside. The heat treatment apparatus according to claim 1, wherein the work recipe storage section includes a work recipe having one or more process identifiers. The heat treatment apparatus according to claim 1, wherein the work recipe storage section includes a work recipe having one or more layout identifiers. The heat treatment apparatus according to claim 1, wherein the treatment container is a vertical treatment container having an open lower end. The heat treatment apparatus according to claim 1, wherein a job identifier is input to the control unit by an input operation unit. A heat treatment method in which a workpiece to be supported by a workpiece boat is introduced into a treatment vessel and subjected to a predetermined heat treatment. Placing the target object in a different layout state and simultaneously storing a plurality of layout programs each having a specific layout identifier in a layout storage unit; A process of previously storing a plurality of process programs each having a specific process identification symbol in a process storage unit at the same time that the process conditions for heat treatment are different; Select a layout identifier and a process identifier from among layout identifiers corresponding to each of the plurality of layout programs and process identifiers corresponding to each of the plurality of process programs, and time-series in order for executing them. And simultaneously storing a plurality of work recipes each having a specific work identifier in a work recipe storage unit; By inputting a job identifier from the outside, the object is placed on the object boat in a layout state based on the layout program specified through the corresponding job recipe to be introduced into the processing container, and the process program specified through the job recipe. And heat-treating the object under process conditions based on the heat treatment method.