WO2003019617A3 - Verfahren zur herstellung von elektronischen bauelementen - Google Patents

Verfahren zur herstellung von elektronischen bauelementen Download PDF

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Publication number
WO2003019617A3
WO2003019617A3 PCT/EP2002/009497 EP0209497W WO03019617A3 WO 2003019617 A3 WO2003019617 A3 WO 2003019617A3 EP 0209497 W EP0209497 W EP 0209497W WO 03019617 A3 WO03019617 A3 WO 03019617A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
transmitting device
chip
support
active detecting
Prior art date
Application number
PCT/EP2002/009497
Other languages
English (en)
French (fr)
Other versions
WO2003019617A2 (de
Inventor
Juergen Leib
Florian Bieck
Original Assignee
Schott Glas
Zeiss Stiftung
Juergen Leib
Florian Bieck
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2001141571 external-priority patent/DE10141571B8/de
Priority claimed from DE10222960A external-priority patent/DE10222960A1/de
Application filed by Schott Glas, Zeiss Stiftung, Juergen Leib, Florian Bieck filed Critical Schott Glas
Priority to EP02779276A priority Critical patent/EP1419530B1/de
Priority to AU2002342623A priority patent/AU2002342623A1/en
Priority to DE50210653T priority patent/DE50210653D1/de
Priority to US10/487,604 priority patent/US7160478B2/en
Priority to JP2003522978A priority patent/JP4571405B2/ja
Priority to KR1020047002746A priority patent/KR100940943B1/ko
Publication of WO2003019617A2 publication Critical patent/WO2003019617A2/de
Publication of WO2003019617A3 publication Critical patent/WO2003019617A3/de
Priority to US11/603,388 priority patent/US8114304B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Led Device Packages (AREA)
  • Ceramic Capacitors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Pressure Sensors (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Dicing (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Um eine Integration funktioneller Strukturen in die Gehäusung von elektronischen Bauelementen zu erreichen, ist ein Verfahren zur Herstellung eines elektronischen Bauelements vorgesehen, welches wenigstens ein Halbleiterelement umfasst, das auf zumindest einer Seite zumindest eine sensorisch aktive und/oder emittierende Einrichtung aufweist, wobei das Verfahren die Schritte umfasst: Bereitstellen zumindest eines Dies auf einem Wafer, Herstellen zumindest einer strukturierten Auflage, welche zumindest eine für die sensorisch aktive und/oder emittierende Einrichtung funktionelle Strukture aufweist, Zusammenfügen des Wafers mit der zumindest einen Auflage, so dass die Seite des Dies, welche die sensorisch aktive und/oder emittierende Einrichtung aufweist, der Auflage zugewandt ist, Abtrennen des Dies.
PCT/EP2002/009497 2001-08-24 2002-08-26 Verfahren zur herstellung von elektronischen bauelementen WO2003019617A2 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP02779276A EP1419530B1 (de) 2001-08-24 2002-08-26 Verfahren zur herstellung von elektronischen bauelementen
AU2002342623A AU2002342623A1 (en) 2001-08-24 2002-08-26 Method for producing electronic components
DE50210653T DE50210653D1 (de) 2001-08-24 2002-08-26 Verfahren zur herstellung von elektronischen bauelementen
US10/487,604 US7160478B2 (en) 2001-08-24 2002-08-26 Method for producing electronic componets
JP2003522978A JP4571405B2 (ja) 2001-08-24 2002-08-26 電子部品の作製方法
KR1020047002746A KR100940943B1 (ko) 2001-08-24 2002-08-26 전자 부품 제조 방법
US11/603,388 US8114304B2 (en) 2001-08-24 2006-11-22 Method for producing electronic components

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE10141558.3 2001-08-24
DE10141558 2001-08-24
DE10141571.0 2001-08-24
DE2001141571 DE10141571B8 (de) 2001-08-24 2001-08-24 Verfahren zum Zusammenbau eines Halbleiterbauelements und damit hergestellte integrierte Schaltungsanordnung, die für dreidimensionale, mehrschichtige Schaltungen geeignet ist
DE10222960.0 2002-05-23
DE10222960A DE10222960A1 (de) 2002-05-23 2002-05-23 Verfahren zur Herstellung von elektronischen Bauelementen

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10487604 A-371-Of-International 2002-08-26
US11/603,388 Division US8114304B2 (en) 2001-08-24 2006-11-22 Method for producing electronic components

Publications (2)

Publication Number Publication Date
WO2003019617A2 WO2003019617A2 (de) 2003-03-06
WO2003019617A3 true WO2003019617A3 (de) 2004-01-22

Family

ID=27214576

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/009497 WO2003019617A2 (de) 2001-08-24 2002-08-26 Verfahren zur herstellung von elektronischen bauelementen

Country Status (9)

Country Link
US (2) US7160478B2 (de)
EP (1) EP1419530B1 (de)
JP (1) JP4571405B2 (de)
KR (2) KR100940943B1 (de)
AT (1) ATE369626T1 (de)
AU (1) AU2002342623A1 (de)
DE (1) DE50210653D1 (de)
SG (1) SG161099A1 (de)
WO (1) WO2003019617A2 (de)

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Also Published As

Publication number Publication date
AU2002342623A8 (en) 2003-03-10
KR100986816B1 (ko) 2010-10-12
US7160478B2 (en) 2007-01-09
WO2003019617A2 (de) 2003-03-06
SG161099A1 (en) 2010-05-27
US20040256349A1 (en) 2004-12-23
KR20040036920A (ko) 2004-05-03
US20070063202A1 (en) 2007-03-22
AU2002342623A1 (en) 2003-03-10
EP1419530B1 (de) 2007-08-08
KR100940943B1 (ko) 2010-02-08
JP4571405B2 (ja) 2010-10-27
JP2005501405A (ja) 2005-01-13
DE50210653D1 (de) 2007-09-20
KR20090115818A (ko) 2009-11-06
EP1419530A2 (de) 2004-05-19
ATE369626T1 (de) 2007-08-15
US8114304B2 (en) 2012-02-14

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