WO2002097453A1

WO2002097453A1 - Probe card, probe, probe manufacturing method, and probe card manufacturing method

Info

Publication number: WO2002097453A1
Application number: PCT/JP2002/005103
Authority: WO
Inventors: Takehisa Takoshima; Wataru Narazaki; Seiichi Hata; Akira Shimokoube
Original assignee: Advantest Corporation
Priority date: 2001-05-28
Filing date: 2002-05-27
Publication date: 2002-12-05
Also published as: JP2005233612A; JP4812967B2

Abstract

A probe card (10), comprising a probe pin (14) having a holding base plate (12), a holding end (16) held by the holding base plate (12), a free end (18) on the opposite side of the holding end (16), and a projected weighted part (20) extending longitudinally from the holding end (16) to the free end (18).

Description

Description Probe card, contact, method for manufacturing contact, and method for manufacturing probe card

The present invention relates to a contact, a probe card, a contact manufacturing method, and a probe card manufacturing method. In particular, the present invention relates to a contact, a probe card, a method for manufacturing a contact, and a method for manufacturing a probe, in which the weight of the probe pin is increased without changing the size of the probe pin to increase the rigidity. This application is related to the following Japanese patent application. For those designated countries that are allowed to be incorporated by reference to the literature, the contents described in the following application are incorporated into this application by reference and are incorporated as a part of the description of this application.

Japanese Patent Application No. 2 0 0 1— 1 5 9 6 1 6 Filing date 2 0

The rigidity of a contact such as a probe pin is determined by the Young's modulus of the material forming the probe pin and the shape of the probe pin. By increasing the rigidity of the probe pin, the contact resistance between the probe and the terminal of the electronic component can be reduced. As a method of increasing the rigidity of the probe pin, it is conceivable to change dimensions such as length, width and thickness of the probe pin.

In a method of manufacturing a probe pin by forming a thin layer on the substrate surface by sputtering, vapor deposition, plating, etc., the thickness of the probe pin is increased as the rigidity of the probe pin is increased. It is difficult to do. In addition, it is not preferable to change the dimensions of the probe pins in order to correspond to the shape and size of the electronic component whose characteristics are to be tested with the probe card.

Therefore, an object of the present invention is to provide a contact, a probe card, a contact manufacturing method, and a probe card manufacturing method that can solve the above-described problems. This object is achieved by a combination of features described in the independent claims. You. The dependent claims define further advantageous embodiments of the present invention. Disclosure of the invention

According to a first embodiment of the present invention, there is provided a probe card used to test the characteristics of an electronic component by contacting a terminal of the electronic component. A probe pin having a holding end to be held, a free end opposite to the holding end, and a protruding weight portion extending in a longitudinal direction from the holding end to the free end; And a transmission line which is connected to the probe card.

The protruding weight portion is formed so as to be depressed from one surface of the probe pin and protrude to the surface opposite to the one surface. The protruding weight portion may have a V-shaped cross section in the width direction. The protruding weight portion may have a U-shaped cross section in the width direction. Further, the protruding weight portion may be formed so as to protrude from one surface of the probe pin in a direction substantially perpendicular to the one surface, and may have a rectangular cross section in the width direction.

The protruding weight may be formed over the free end. The protruding weight may be formed at a position separated from the free end by a predetermined distance. The probe pin may have at its free end at least one protrusion that contacts the terminal of the electronic component. The probe pin may have a contact protruding portion formed at a free end thereof so as to be depressed from one surface of the probe pin and protrude to a surface opposite to the one surface, and to contact a terminal of the electronic component.

Preferably, the probe pin has a plurality of protruding weight portions. At least one of the plurality of protruding weights may be formed so as to partially overlap at least one of the other protruding weights in the width direction of the probe pin. The plurality of protruding weights are provided in at least three rows in the width direction, and the protruding weights provided in the center row partially overlap the protruding weights provided in the rows at both ends in the width direction. It may be formed as follows. It is preferable that the plurality of protruding weight portions are evenly arranged on the probe pin.

The probe pin is made of an amorphous alloy having a supercooled liquid temperature range. preferable.

The probe pin includes a holding end including a holding end, an inclined portion having one end extended from the holding end so as to have a predetermined angle with respect to the holding end, and the other end of the inclined portion. And a free end portion including a free end portion, and the inclined portion may have a protruding weight portion. The free end may extend parallel to or away from the holding end. In addition, the probe pin has a holding end including a holding end, a curved portion provided with one end extending from the holding end, and curved in a direction away from the holding substrate, and extended to the other end of the curved portion. The curved portion may include a protruding weight portion.

According to a second aspect of the present invention, there is provided a contact which is used for contacting a terminal of an electronic component to electrically connect the electronic component to another electronic component, comprising: a holding end held by a holding substrate; A contact having a free end opposite to the holding end, and a protruding weight portion extending in the longitudinal direction from the holding end to the free end.

The protruding weight portion may have a V-shaped cross section in the width direction. Further, the protruding weight portion may have a U-shaped cross section in the width direction. Further, the protruding weight portion may have a rectangular cross section in the width direction. The contact is preferably made of an amorphous alloy having a supercooled liquid temperature range.

According to the third aspect of the present invention, the electronic device has a holding end held by the holding substrate and a free end that contacts a terminal of the electronic component, and is used for electrically connecting the electronic component to another electronic component. Forming a groove extending in a longitudinal direction from a holding end of the contact to a free end in a region of the substrate where the contact is formed; and Provided is a contact manufacturing method characterized by comprising: a step of forming an amorphous alloy layer having a supercooled liquid temperature range; a step of heating the amorphous alloy layer; and a step of cooling the amorphous alloy layer. I do.

The step of heating may heat the amorphous alloy layer to a supercooled liquid temperature range of the amorphous alloy layer.

The step of forming a groove in the substrate is to form a U-shaped groove by isotropic etching. May be formed. In the step of forming a groove in the substrate, a groove having a V-shaped cross section may be formed by anisotropic etching. In the step of forming a groove in the substrate, a groove having a square cross section may be formed.

The contact manufacturing method may further include forming a hole in a region of the substrate where the free end of the probe pin is formed. The step of forming a hole may form the hole by anisotropic etching or isotropic etching. The step of forming a hole may form a plurality of holes.

The method for manufacturing a contact may further include a step of forming a plurality of protrusions at a free end of the contact that are in contact with terminals of the electronic component. The step of forming a plurality of protrusions may form the plurality of protrusions by ultrafine particle jet printing. In the step of forming the plurality of protrusions, the plurality of protrusions may be formed by plating. The step of forming a plurality of protrusions may form the plurality of protrusions by thermal spraying.

The method for manufacturing a contact comprises: a step for forming a first flat portion forming a holding end of the contact on the substrate; and an end having a predetermined angle with the substrate so as to have a predetermined angle with respect to the first flat portion. (1) forming an inclined surface portion extending from the flat surface portion; and forming a second planar portion provided on the substrate to extend from the other end of the inclined surface portion and to form a free end of the probe pin. Forming a groove on the inclined surface portion, and forming an amorphous alloy layer on the first plane portion, the inclined surface portion, and the second plane portion. May be formed.

According to a fourth aspect of the present invention, there is provided a probe card manufacturing method for manufacturing a probe card used to test a characteristic of an electronic component by contacting a terminal of the electronic component, wherein the transmission line including a conductive material is provided. A step of preparing the formed holding substrate, a holding end held by the holding substrate, a free end opposite to the holding end, and a protruding weight portion extending in a longitudinal direction from the holding end to the free end. A method of manufacturing a probe card, comprising: forming a probe pin having the same; and joining a holding end of the probe pin to a holding substrate.

The steps for forming the probe pins are as follows: Forming a groove extending in the longitudinal direction from the holding end of the probe pin to the free end, forming an amorphous alloy layer on the substrate by sputtering, heating the amorphous alloy layer, and forming an amorphous alloy layer. Cooling the layer.

The step of joining the holding end to the holding substrate may include the step of attaching the holding end to the holding substrate and the step of thermocompression bonding the holding end to the holding substrate.

The probe card manufacturing method may further include a step of separating the amorphous alloy layer from the substrate.

The above summary of the present invention does not list all of the necessary features of the present invention, and a sub-combination of these features may also be an invention. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a perspective view showing a probe card according to one embodiment of the present invention.

FIG. 2 is a top view of a probe pin having a plurality of protruding weight portions.

FIG. 3 is a cross-sectional view taken along the line AA ′ of the probe card shown in FIG. ,

FIG. 4 is a process chart showing an example of the method of manufacturing the probe card shown in FIG. FIG. 6 is a BB ′ cross-sectional view of the substrate and the amorphous alloy layer shown in FIG.

FIG. 7 is a process chart showing another example of the method for manufacturing the probe card shown in FIG. FIG. 8 is a perspective view showing another example of the probe card.

FIG. 9 is a process chart showing a method of manufacturing the probe card shown in FIG.

FIG. 10 is a process chart showing another example of manufacturing the probe card shown in FIG. FIG. 11 is a perspective view showing another example of the probe card manufactured by the process shown in FIG. 9 or FIG. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described through embodiments of the present invention. Not all combinations are essential to the solution of the invention.

FIG. 1 is a perspective view showing a probe card 10 according to one embodiment of the present invention. As shown in FIG. 1A, the probe card 10 includes a holding board (not shown), probe pins 14, and a transmission line (provided on the holding board and electrically connected to the probe pins 14). (Not shown). The probe pins 14 are joined to the holding substrate via the gold bumps 62. The probe pin 14 has a holding end 16 held by the holding substrate, a free end 18 opposite to the holding end 16, and a protrusion extending in the longitudinal direction from the holding end 16 to the free end 18. Weighting part 20. The protruding weight portion 20 is preferably formed over the free end 18. The protruding weight portion 20 may have, for example, a V-shaped groove shape as shown in FIG. For example, when the thickness of the probe pin 14 is about 5 μπι, the depth of the groove of the protruding weight portion 20 is preferably 2 to 20 / m, more preferably 5 to 15 μm. m.

The probe pin 14 is preferably formed using an amorphous alloy as a material. Amorphous alloys include any metals such as metallic glass, for example, as long as they are amorphous alloys that undergo a reversible phase transition from an amorphous phase to a fluidized bed that is a supercooled liquid region in a predetermined temperature range. Good. The amorphous alloy preferably contains, for example, a noble metal such as gold, palladium, or platinum as a main component. When the amorphous alloy contains a metal such as palladium or platinum as a main component, the amorphous alloy may further contain copper and / or silicon. In another example, the probe pin 14 may be formed of a metal or alloy such as aluminum or tungsten.

In this embodiment, the protruding weight portion 20 is formed so as to protrude from the surface of the probe pin 14 bonded to the gold bump 62 in the direction of the opposite surface. Therefore, the protruding weight portion 20 formed over the free end 18 can function as a contact that contacts the terminal of the electronic component.

In another example, the protruding weight portion 20 may be formed so as to be depressed in the direction from the surface of the probe pin 14 to be bonded to the gold bump 62 to the surface on the opposite side.

As shown in FIG. 1 (b), the protruding weight portion 20 is separated from the free end 18 by a predetermined distance. It may be formed at the position where it is located. In this case, the probe pin 14 preferably has a projection 22 at the free end 18 that contacts the terminal of the electronic component. In this embodiment, the probe pin 14 has a plurality of protrusions 22.

Since the probe pin 14 has a plurality of protrusions 22, any one of the plurality of protrusions 22 contacts the terminal of the electronic component when the probe pin 14 is pressed in the direction of the terminal of the electronic component. Thus, the probe pins 14 can be more reliably connected to the electronic components. Furthermore, since the probe pins 14 have the protruding portions 22, even if the terminals of the electronic component have an oxide film, the oxide film of the terminal of the electronic component can be more reliably removed. As a result, the contact resistance between the terminal and the probe pin 14 can be reduced, so that signals can be more efficiently supplied to the electronic components. As shown in FIG. 1 (c), the probe pin 14 preferably has a plurality of projecting weight portions 20. In this case, it is preferable that each protruding weight portion 20 has a length in the longitudinal direction of the probe pin 14 that is less than half the length of the probe pin 14 in the longitudinal direction. In the present embodiment, since the probe pin 14 has a plurality of protruding weight portions 20, even if the load of the probe pin 14 increases, the probe pin 14 is applied to the root portion joined to the gold bump 62 of the probe pin 14. Stress can be distributed.

Further, in another example, the plurality of protruding weight portions 20 may be formed over the free ends 18 of the probe pins 14. In this case, it is preferable that the protruding weight portion 20 is formed so as to protrude from the surface of the probe pin 14 to be bonded to the gold bump 62 in the direction of the opposite surface. When the protruding weight portion 20 is formed in this manner, the protruding weight portion 20 formed over the free end 18 can function as a contact that contacts the terminal of the electronic component. FIG. 2 is a top view showing another example of the probe pin 14 having a plurality of protruding weight portions 20. FIG.

As shown in FIGS. 2 (a) and 2 (b), the protruding weight portions 20 may be provided symmetrically in the width direction of the probe pin 14. In FIG. 2 (a), as shown by the broken lines, the plurality of protruding weight portions 20 are preferably formed so as to partially overlap in the width direction. A plurality of protruding weight parts 2 provided in three rows in the width direction When it has 0, it is preferable that the protruding weight portions 20 provided in the center row are formed so as to partially overlap the protruding weight portions 20 provided in both end rows in the width direction. The rigidity of the probe pin 14 can be increased by forming the plurality of protruding weight portions 20 so as to partially overlap in the width direction of the probe pin 14.

Further, it is preferable that the plurality of protruding weight portions 20 are formed so as to be shifted in the width direction in the row to be contacted. In the width direction of the probe pin 14, when the N protruding weight portions 20 are formed in the first row, N-l, N or N + 1 in the next row, and N in the next row. It is preferable that the same number is formed for each odd-numbered column and each even-numbered column, such as. Further, it is preferable that the protruding weight portions 20 are formed so as to be evenly arranged on the probe pins 14.

Further, as shown in FIGS. 2 (c) and 2 (d), the protruding weight portion 20 may be provided asymmetrically in the width direction of the probe pin 14.

As shown in FIG. 2 (e), when the probe pin 14 has a plurality of protrusion weights 20 provided in three rows in the width direction, the plurality of protrusion weights 20 overlap each other in the width direction. It may be formed not to be. By forming the plurality of protruding weight portions 20 so as not to overlap each other in the width direction of the probe pin 14, it is possible to disperse stress generated at the root portion of the probe pin 14 held on the holding substrate. Can be.

The protruding weight portion 20 formed on the probe pin 14 has a depth and a longitudinal direction in accordance with the required rigidity or in consideration of the stress generated at the base portion held by the holding substrate 12. It is preferable to form them by designing the length, number, arrangement, and overlap in the width direction.

FIG. 3 is a sectional view taken along line AA ′ of FIG. 2 (a).

As shown in FIG. 3A, the protruding weight portion 20 preferably has a V-shaped cross section in the width direction. Further, as shown in FIG. 3B, the protruding weight portion 20 may have a U-shaped cross section in the width direction.

Further, as shown in FIG. 3C, in another example, the protruding weight portion 20 may be a protruding portion extending in the longitudinal direction from the holding end 16 to the free end 18. The protrusion is The cross section in the width direction of the probe pin has a square shape. Here, the cross section is a square shape, as shown in Fig. 3 (c), and the cross section may be a square surface, or as shown in Fig. 3 (d), a part of a square frame. There may be. In this case, the protruding weight portion 20 is preferably formed of the same material as the material from which the probe pins 14 are formed. The protruding weight portions 20 are preferably formed in the arrangement shown in FIGS. 1 and 2 by lift-off or etching using sputtering.

FIG. 4 is a process chart showing an example of a method of manufacturing the probe card 10 shown in FIG. 1 (c).

First, as shown in FIG. 4 (a), the substrate 30 of silicon or the like goes from the holding end 16 to the free end 18 of the probe pin 14 in the area 14a where the probe pin 14 is formed. A groove 32 extending in the longitudinal direction is formed. The groove 32 is preferably formed by etching such as dry etching or wet etching. Preferably, a plurality of grooves 32 are formed. The groove 32 is preferably formed so as to correspond to the arrangement of the protruding weight portion 20 in the probe pin 14 shown in FIGS.

Next, as shown in FIG. 4 (b), an amorphous alloy is sputtered on the region 14a of the substrate 30 to form an amorphous alloy layer to be the probe pins 14. The amorphous alloy layer may be formed in the shape of the probe pin 14 by a lift-off method in which a resist layer is formed in a region other than the region 14a and then sputtering is performed. The amorphous alloy layer 14 is formed into the shape of the probe pin 14 by sputtering the amorphous alloy over the entire surface of the substrate 30 and then removing the amorphous alloy layer in a region other than the region 14a by etching. It may be formed.

Subsequently, the amorphous alloy layer is heated. The amorphous alloy layer is preferably heated to a temperature higher than the glass transition temperature of the amorphous alloy. In the present embodiment, the amorphous alloy layer is heated to a supercooled liquid region that is equal to or higher than the glass transition temperature of the amorphous alloy and equal to or lower than the crystallization start temperature. After that, the amorphous alloy layer is cooled. Preferably, the amorphous alloy layer is cooled to a temperature below the glass transition temperature. The amorphous alloy layer may be cooled by natural cooling. Thereafter, as shown in FIG. 4C, a gold bump 62 is formed on the holding end 16 of the probe pin 14. Next, as shown in FIG. 4 (d), the probe pins 14 are separated from the substrate 30. The probe pins 14 may be separated from the substrate 30 by etching a portion of the substrate 30 connected to the probe pins 14 which is an amorphous alloy layer. E Tsuchingu, for example preferably carried out by dry etching using the © Etsu preparative etching or X e F ₂ with hydroxide force Riumu solution.

Then, as shown in FIG. 4 (e), at least one protruding portion 22 that contacts the terminal of the electronic component is formed on the free end 18 of the probe pin 14. In this example, a plurality of protrusions 22 are formed on the free end 18 of the probe pin 14. The plurality of protrusions 22 may be formed by ultrafine particle jet printing. The plurality of protrusions 22 may be formed by plating. Further, the plurality of protrusions 22 may be formed by thermal spraying. In the present embodiment, since the probe pin 14 has a plurality of protrusions 22, when the probe pin 14 is pressed in the direction of the terminal of the electronic component, any one of the plurality of protrusions 22 becomes electronic. Since it is in contact with the terminal of the component, the probe pin 14 and the electronic component can be more reliably connected.

Although not shown, the probe pins 14 may be bonded to the holding substrate via the gold bumps 62 before the probe pins 14 are separated from the substrate 30. In this case, first, the holding end 16 of the probe pin 14 is aligned with the holding substrate. After that, the holding end 16 is attached to the holding substrate. The holding end 16 is preferably bonded to the holding substrate via the transmission line of the holding substrate. Thereafter, the holding end 16 is bonded to the holding substrate by thermocompression bonding via the gold bump 62. Thermocompression bonding may be performed directly without using the gold bumps 62. The joining of the holding end 16 of the probe pin 14 to the holding substrate is preferably performed by a series of operations using a flip chip bonder, a substrate bonding (including substrate bonding) device, or the like. The thermocompression bonding is preferably performed at a temperature at which the amorphous alloy layer is not heated to the supercooled liquid region. Further, the probe pins 14 may be bonded to the holding substrate via the gold bumps 62 after being separated from the substrate 30.

In another example, before bonding probe pins 14 to holding substrate 12, Only the region of the substrate 14 held by the holding substrate 12 may be separated from the substrate 30. Then, the holding substrate may be joined to the probe pins 14 from the same side as the substrate 30. FIG. 5 is a process chart showing another example of the method of manufacturing the probe card 10. In this example, the steps described with reference to FIG. 4 (a) are used to move the probe pins 14 from the holding end 16 to the free ends 18 in the region where the probe pins 14 are formed on a substrate such as silicon. A groove 32 is formed extending in the longitudinal direction. Further, it is preferable that after the groove 32 is formed before the through-hole forming step described below, heating is performed at a temperature not lower than the supercooled liquid temperature and not higher than the crystallization start temperature, and then cooled. By this heating and cooling step, the internal stress of the probe pin 14 can be removed.

Next, as shown in FIG. 5A, a through hole 8 is formed in the substrate 30 in a through hole forming step. In the through hole forming step, the through hole 8 is formed in a region including the region where the free end 18 is formed in the substrate 30.

Next, as shown in FIG. 5B, the probe pin 14 is bent in a bending step. In the bending step, the probe pin 14 is bent by various methods such as gravity, centrifugal force, static electricity, and magnetic force. In the bending step, for example, the probe pin 14 may be bent by applying an external force to the free end 18 of the probe pin 14 by the external member 6. In the bending step, as shown in FIG. 5B, the probe pins 14 formed on the surface of the substrate 30 are bent toward the back surface of the substrate 30.

In the bending step, the amorphous alloy layer forming the probe pins 14 is heated to a temperature that is equal to or higher than the supercooled liquid temperature range of the amorphous alloy layers and equal to or lower than the crystallization start temperature. Preferably, the free end 18 is curved in a direction away from the surface of the substrate 30. According to this example, the internal stress of the probe pin 14 can be removed, and the probe pin 14 can be easily bent. Further, the bending step may be performed after the probe pins 14 described in FIG. 4 are bonded to the holding substrate. In this case, the bending step bends the free end 18 of the probe pin 14 in a direction away from the holding substrate.

Next, as described in FIG. 4 (c), gold is attached to the holding end 16 of the probe pin 14. The bump 62 is formed. Next, as described in FIG. 4D, the probe pins 14 are separated from the substrate 30. The probe pins 14 detached from the substrate 30 are shown in FIG. According to the probe pin 14 manufactured by the manufacturing method in this example, since the probe pin 14 is curved in the direction of the terminal of the electronic component to be contacted, it can be easily connected to the terminal and the connected state can be maintained.

Also, in the manufacturing method according to the present embodiment, at least one protrusion that contacts the terminal of the electronic component may be formed at the free end 18 of the probe pin 14 in the same manner as the manufacturing method described with reference to FIG. .

Fig. 6 is a cross-sectional view of the substrate 30 and the amorphous alloy layer taken along line B-B shown in Fig. 4 (b).

As shown in FIG. 6A, the groove 32 preferably has a V-shaped cross section in the Φ rich direction. In this case, the groove 32 is preferably formed by anisotropic etching. As shown in FIG. 6 (b), the groove 32 may have a U-shaped cross section in the width direction or a square shape. When the groove 32 is U-shaped, the groove 32 is preferably formed by isotropic etching.

FIG. 7 is a process chart showing another example of a method of manufacturing the probe card 10 shown in FIG. 1 (c).

In the present embodiment, description of the same steps as those of the method for manufacturing the probe card 10 described with reference to FIG.

First, as shown in FIG. 7A, a groove 32 is formed in a region 14a of the substrate 30 where the probe pins 14 are formed. Also, a hole 34 is formed in a region of the substrate 30 where the free end 18 of the probe pin 14 is formed. Here, a plurality of holes 34 may be formed. The groove 32 and the hole 34 are preferably formed by etching such as dry etching or wet etching. The groove 32 and the hole 34 may be formed by anisotropic etching or may be formed by isotropic etching.

Next, as shown in FIG. 7 (b), an amorphous alloy is sputtered on the region 14 a of the substrate 30 to form an amorphous alloy layer to be the probe pins 14. continue, Heat the amorphous alloy layer. Then, the amorphous alloy layer is cooled. Thereafter, as shown in FIG. 7C, a gold bump 62 is formed on the holding end 16 of the probe pin 14.

Next, as shown in FIG. 7 (d), the probe pins 14 are detached from the substrate 30. The probe pins 14 of the probe card 10 manufactured by the steps in the present embodiment have contact protruding portions 22 protruding in the free end 18 in the direction of contact with the terminals of the electronic component. In this case, the contact protrusion 22 can function as a contact that contacts the terminal of the electronic component. FIG. 8 is a perspective view showing another example of the probe card 10.

As shown in FIG. 8 (a), the probe pins 14 of the probe card 10 in this embodiment have a holding end 24 including a holding end 16 and a predetermined angle with respect to the holding end 24. One end is provided at the other end of the inclined portion 26 so as to extend parallel to the holding end 24, and the other end of the inclined portion 26 is provided so as to be parallel to the holding end 24. It has a free end 28 including a free end 18. The inclined portion 26 functions as an elastic portion. The probe pin 14 has a protruding weight portion 20 extending in the longitudinal direction from the holding end 16 to the free end 18 on the inclined portion 26. The probe pin 14 preferably has at its free end 18 at least one protrusion 22 that contacts the terminal of the electronic component.

As shown in FIG. 8 (b), the probe pin 14 may have a contact protrusion 22 protruding in a direction in which it contacts the terminal of the electronic component at the free end 28.

In this embodiment, since the probe pin 14 is bent in a direction in which the probe pin 14 contacts the terminal of the electronic component, the probe pin 14 and the electronic component can be easily connected.

FIG. 9 is a process chart showing a method for manufacturing the probe card 10 shown in FIG. First, as shown in FIG. 9 (a), a first flat portion 42 forming the holding end 16 of the probe pin 14 and a predetermined angle 0 with respect to the first flat portion 42 are formed. A first substrate 40 having an inclined surface portion 44 having one end extended from the first flat portion 42 is prepared. The angle Θ may be, for example, 30 degrees to 60 degrees, preferably 54.7 degrees.

Then, as shown in FIG. 9 (b), the first substrate 40 is connected to the free end of the probe pin 14. The shell is occupied by the second substrate 50 having the second flat portion 52 on which 18 is formed. The first substrate 40 and the second substrate 50 are preferably bonded so that the second plane portion 52 is provided to extend to the other end of the inclined surface portion 44. Further, the second plane portion 52 is preferably parallel to the first plane portion 42. In the present embodiment, the probe pins 14 are formed using the first substrate 40 and the second substrate 50. However, in other examples, the first flat portions 42 and the inclined surface portions 4 are formed by, for example, etching. A single substrate on which the fourth and second plane portions 52 are formed may be used.

Next, a groove 32 is formed on the inclined surface portion 44 so as to extend from the first flat portion 42 to the direction of the second flat portion 52. The groove 32 is preferably formed by patterning the inclined surface portion 44 with a resist and performing etching such as dry etching or wet etching. The groove 32 is preferably formed in a V shape by anisotropic etching. The groove 32 may be formed in a U shape by isotropic etching. Preferably, a plurality of grooves 32 are formed in the inclined surface portion 44.

Subsequently, as shown in FIG. 9 (c), an amorphous alloy layer is formed on the first flat portion 42 and the inclined surface portion 44 of the first substrate 40 and the 笫 2 flat portion 52 of the second substrate 50 by a sputtering method. Form 60. Then, the amorphous alloy layer 60 is heated. The amorphous alloy layer 60 preferably heats up to a temperature higher than the glass transition temperature of the amorphous alloy used as the material. In the present embodiment, the amorphous alloy layer 60 is heated to a supercooled liquid region that is equal to or higher than the glass transition temperature of the amorphous alloy and equal to or lower than the crystallization start temperature. Thereafter, the amorphous alloy layer 60 is cooled. It is preferable to cool the amorphous alloy layer 60 to a temperature lower than the glass transition temperature of the amorphous alloy. The amorphous alloy layer 60 may be cooled by natural cooling.

Then, as shown in FIG. 9 (d), unnecessary portions of the amorphous alloy layer 60 are removed by etching or the like, so that the amorphous alloy layer 60 has a holding end 24, an inclined portion 26, and a free end 28. Form probe pins 14. Then, as shown in FIG. 9E, gold bumps 62 are formed on the holding ends 24 of the probe pins. In another example, the gold bump 62 may be formed on the side of the holding substrate 12 to be bonded to the probe pin. As shown in FIG. 9 (f), a holding substrate 12 on which a transmission line 64 including a conductive material is formed is prepared. Then, the holding end 24 of the probe pin 14 is joined to the holding substrate 12. The joining of the holding end 24 to the holding substrate 12 is performed by first aligning the holding end 24 with the holding substrate 12. Then, the holding end portion 24 is bonded to the holding substrate 12. Thereafter, the holding end 24 is thermocompression-bonded to the holding substrate 12. The joining of the holding end portion 24 to the holding substrate 12 is preferably performed by a series of operations using a flip chip bonder or the like. The thermocompression bonding is preferably performed at a temperature at which the amorphous alloy layer is not heated to the supercooled liquid region.

Next, as shown in FIG. 9 (g), the amorphous alloy layer 60 is separated from the first substrate 40 and the second substrate 50. The amorphous alloy layer 60 is separated from the first substrate 40 and the second substrate 50 by etching the connecting portion of the first substrate 40 and the second substrate 50 with the amorphous alloy layer 60. Is also good. The etching is preferably performed by, for example, wet etching using an aqueous solution of potassium hydroxide or dry etching using XeF ₂ .

As shown in FIG. 9 (h), a conductive layer 66 may be formed on the amorphous alloy layer 60. The conductive layer 66 is preferably made of gold. Then, as shown in FIG. 9 (i), a projection 22 is formed on the free end 26 of the probe pin 14. Preferably, a plurality of protrusions 22 are formed.

Further, as another example, in FIG. 9B, a hole is formed by etching in a region of the first substrate 40 where the free end 26 of the probe pin 14 is formed on the first plane portion 42. Is also good. In this case, the projections 22 may be formed when the amorphous alloy layer 60 is formed in FIG.

In the probe card 10 manufactured in this embodiment, the probe pins 14 are bent in a direction in which the probe pins 14 are in contact with the terminals of the electronic components, so that the probe pins 14 can be easily connected to the electronic components. can do. In addition, the protruding portion 22 formed on the free end 26 of the probe pin 14 comes into contact with the terminal of the electronic component in parallel, so that the contact area can be further increased. FIG. 10 is a process chart showing another example of the method of manufacturing the probe card 10 shown in FIG.

In the present embodiment, the step of forming the amorphous alloy layer 60 shown in FIG. 9C may include the following steps.

As shown in FIG. 10 (a), the first substrate 40 has a first flat portion 42 and an inclined surface portion 44 and a second flat portion 52 of the second substrate 50 and an amorphous alloy layer and a second flat portion 52. An adhesion layer 70 for making the first substrate 40 and the second substrate 50 adhere to each other is formed. When the amorphous alloy contains palladium as a main component, the adhesion layer 70 preferably contains a titanium-nickel alloy having a composition ratio of about 1: 1. In the case where the amorphous alloy contains palladium as a main component and contains a bond, the adhesion layer 70 may have a first adhesion layer containing chromium or titanium and a second adhesion layer containing copper. Preferably, the first adhesion layer is formed on the first substrate 40 and the second substrate 50, and the second adhesion layer is formed on the first adhesion layer.

Subsequently, as shown in FIG. 10 (b), the first substrate 40 and the second substrate 50 are easily removed from the probe pins 14 in a later step on the adhesion layer 70. For the separation sacrificial layer 72 is formed. The peel sacrificial layer 72 is preferably formed of a material that can withstand chemical treatment such as heating and etching of the amorphous alloy layer in a later step. The peeling sacrificial layer 72 is preferably, for example, a metal thin film. In this embodiment, the peeling sacrificial layer 72 contains chromium and is formed to a thickness of about 100 nm.

In the present embodiment, the step of separating the amorphous alloy layer 60 shown in FIG. 9 (g) from the first substrate 40 and the second substrate 50 is performed by removing the peeling sacrificial layer 62 by etching. The alloy layer 60 is separated from the first substrate 40 and the second substrate 50.

As shown in FIG. 10 (c), an amorphous alloy layer 60 is formed on the exfoliated sacrificial layer 72. Next, as shown in FIG. 10 (d), a metal layer 74 is formed on the amorphous alloy layer 60. Further, an adhesion layer 76 for making the amorphous alloy layer 60 and the metal layer 74 adhere to each other may be formed on the monomonorefass alloy layer 60. Similar to the adhesion layer 70, the adhesion layer 76 has a composition ratio of 1: 1 when the amorphous alloy is mainly composed of palladium. Preferably, it contains a titanium-nickel alloy. When the amorphous alloy contains copper with palladium as the main component, the adhesion layer 76 may have a first adhesion layer containing chromium or titanium and a second adhesion layer containing copper.

Further, a barrier layer 78 for preventing the metal contained in the metal layer 74 from diffusing into the amorphous alloy layer 60 may be formed between the amorphous alloy layer 60 and the metal layer 74. In this embodiment, the barrier layer 78 may be provided between the adhesion layer 76 and the metal layer 74. The barrier layer 78 is preferably platinum. The barrier layer 78 preferably has a thickness of about 100 nm. By forming the barrier layer 78 between the amorphous alloy layer 60 and the metal layer 74, even when the amorphous alloy layer 60 is heated, the metal contained in the metal layer 74 can be converted to the amorphous alloy layer 6 Does not spread to zero. When the barrier layer 78 made of white gold is formed on the adhesion layer 76, the adhesion layer 76 may use only the second adhesion layer containing copper.

Further, an adhesion layer for adhering the barrier layer 78 and the metal layer 74 may be formed between the barrier layer 78 and the metal layer 74. Further, the probe pin 14 may have both the conductive layer 66 shown in FIG. 9 (h) and the metal layer 74 shown in FIG. 10 (d), or have only one of them. You may.

Forming an adhesion layer 70, forming a peeling sacrificial layer 72, forming an amorphous alloy layer 60, forming an adhesion layer 76, and forming a barrier layer 78. The step of forming and the step of forming the metal layer 74 are preferably performed in the same apparatus by a sputtering method.

FIG. 11 is a perspective view showing a probe card 10 manufactured by the process shown in FIG. 9 or FIG.

The probe card 10 has a plurality of probe pins 14. The probe pins 14 are bent in a direction opposite to the holding substrate 12. Further, the plurality of probe pins 14 are provided side by side on the holding substrate 12. In the present embodiment, the length of the probe pin 14 is preferably about several hundred μm. Further, the plurality of probe pins 14 are preferably formed at a pitch of about 100 μm or less. In the probe card 10 according to the present embodiment, since the probe pins 14 have the plurality of protruding weight portions 20, the weight can be increased and the rigidity can be increased. Therefore, the contact resistance when contacting the terminal of the electronic component can be reduced.

In the probe card 10 according to the present embodiment, the probe pins 14 are bent in a direction in which the probe pins 14 are in contact with the terminals of the electronic component, so that the probe pins 14 and the electronic component can be easily connected.

In the above embodiments, the probe pins and the probe card have been described as examples. However, the members described as the probe pins in the above embodiments may be used as contacts for connecting electronic components such as semiconductor elements.

As described above, the present invention has been described using the embodiment, but the technical scope of the present invention is not limited to the scope described in the above embodiment. It is apparent to those skilled in the art that various changes or improvements can be added to the above embodiment. It is apparent from the description of the appended claims that embodiments with such modifications or improvements can be included in the technical scope of the present invention. Industrial applicability

As is clear from the above description, according to the present invention, the weight of the probe pin can be increased without changing the size of the probe pin, and the rigidity of the probe pin can be increased.

Claims

The scope of the claims

1. A probe card that contacts a terminal of an electronic component and is used for testing characteristics of the electronic component,

A holding substrate,

A probe pin having a holding end held by the holding substrate, a free end opposite to the holding end, and a protruding weight portion extending in a longitudinal direction from the holding end toward the free end;

A probe card, comprising: a transmission line provided on the holding substrate and electrically connected to the probe pins.

2. The probe card according to claim 1, wherein the protruding weight portion is formed so as to be depressed from one surface of the probe pin and protrude to a surface opposite to the one surface.

3. The probe card according to claim 2, wherein the protruding weight portion has a V-shaped cross section in the Φ 畐 direction.

4. The probe card according to claim 2, wherein the protruding weight portion has a U-shaped cross section in the width direction.

5. The probe according to claim 1, wherein the protruding weight portion is formed so as to protrude from one surface of the probe pin in a direction substantially perpendicular to the one surface, and has a rectangular cross section in the width direction. card.

6. The probe card according to claim 1, wherein the protruding weight portion is formed over the free end.

7. The probe card according to claim 1, wherein the protruding weight is formed at a position separated from the free end by a predetermined distance.

8. The probe card according to claim 7, wherein the probe pin has at least one protrusion at the free end that contacts a terminal of the electronic component.

9. The probe pin is recessed from one surface of the probe pin at the free end, 8. The probe card according to claim 7, wherein the probe card is formed so as to protrude on a surface opposite to the one surface, and has a contact protruding portion that contacts a terminal of the electronic component.

10. The probe card according to any one of claims 1 to 5, wherein the probe pin has a plurality of the protruding weight portions.

1 1. At least one of the plurality of protruding weights partially overlaps with at least one of the other protruding weights in the width direction of the probe pin. The probe card according to claim 10, wherein the probe card is formed as follows.

12. The plurality of protruding weights are provided in at least three rows in the width direction, and the protruding weights provided in the center row are the same as the protruding weights provided in both rows in the width direction. The probe card according to claim 10, wherein the probe card is formed so as to partially overlap.

. 1 3 wherein the probe pin, supercooling JP to the Amorufasu alloy a material having a liquid temperature ^zone: I laying a probe card according to claim 1 1 2.

14. The probe pin includes a holding end including the holding end, and an inclined portion having one end extended from the holding end so as to have a predetermined angle with respect to the holding end, 3. A specially-equipped structure according to claim 1, further comprising a free end portion extending from the other end of the inclined portion, the free end portion including the free end, and the inclined portion having the protruding weight portion. Probe card.

1 5. The probe pin is

A holding end including the holding end,

A curved portion provided with an end extending from the holding end, and curved in a direction away from the holding substrate;

A free end portion extending from the other end of the curved portion and including the free end,

The probe card according to claim 1, wherein the bending portion has the protruding weight portion.

16. A contact that is used to electrically connect the electronic component to another electronic component by contacting a terminal of the electronic component, the contact being held by a holding substrate, and being opposite to the holding end. A contact having a free end on the side and a protruding weight portion extending in a longitudinal direction from the holding end toward the free end.

17. Manufacturing a contact that has a holding end held by the holding substrate and a free end that contacts a terminal of the electronic component, and is used for electrically connecting the electronic component to another electronic component. Contact manufacturing method,

Forming a groove extending in a longitudinal direction from the holding end of the contact to the free end in a region of the substrate where the contact is formed;

Forming an amorphous alloy layer having a supercooled liquid temperature range on the substrate; heating the amorphous alloy layer;

Cooling the amorphous alloy layer;

A method for manufacturing a contact, comprising: ,

18. The contact manufacturing method according to claim 17, wherein the heating step heats the amorphous alloy layer to the supercooled liquid temperature range of the amorphous alloy layer.

19. The method of manufacturing a contact according to claim 17, wherein the step of forming a groove in the substrate includes forming a groove having a U-shaped cross section by isotropic etching.

20. The method according to claim 17, wherein the step of forming a groove in the substrate includes forming a groove having a V-shaped cross section by anisotropic etching.

21. The contact manufacturing method according to claim 17, wherein the step of forming a groove in the substrate includes forming a groove having a rectangular cross section.

22. The contact manufacturing method according to claim 17, further comprising: forming a hole in a region of the substrate where the free end of the probe pin is formed.

23. The method for manufacturing a contact according to claim 17, further comprising the step of forming a plurality of protrusions at the free end of the contact that are in contact with the terminals of the electronic component.

24. The method according to claim 23, wherein the step of forming the plurality of protrusions comprises forming the plurality of protrusions by ultrafine particle jet printing.

25. The method according to claim 23, wherein the step of forming the plurality of protrusions includes forming the plurality of protrusions by a method.

26. The method of claim 23, wherein the step of forming the plurality of protrusions comprises forming the plurality of protrusions by thermal spraying.

27. A step of forming a first flat portion forming the holding end of the contact on the substrate;

Forming, on the substrate, a peripheral slope portion having one end extending from the first plane portion so as to have a predetermined angle with respect to the first plane portion;

Forming a second plane portion provided on the substrate so as to extend from the other end of the inclined surface portion, wherein the free end of the probe pin is formed;

Further comprising

Forming the groove, forming the groove on the inclined surface portion;

The step of forming the amorphous alloy layer includes forming the amorphous alloy layer on the first plane portion, the inclined surface portion, and the second plane portion.

17. The method for manufacturing a contact according to item 17.

28. A probe card manufacturing method for manufacturing a probe card used to test a characteristic of the electronic component by contacting a terminal of the electronic component,

A step of preparing a holding substrate on which a transmission line containing a conductive material is formed; a holding end held by the holding substrate; a free end opposite to the holding end; and a longitudinal direction from the holding end to the free end. Forming a probe pin having a protruding weight extending in the direction;

Joining the holding end of the probe pin to the holding substrate;

A method for manufacturing a probe card, comprising:

2 9 · The step of forming the probe pin includes: Forming a groove extending in a longitudinal direction from the holding end of the probe pin toward the free end in a region of the substrate where the probe pin is formed;

A step of forming an amorphous alloy layer on the substrate by sputtering, and a step of heating the amorphous alloy layer.

Cooling the alloy layer.

29. The method for producing a probe card according to claim 28, comprising:

30. The step of joining the holding end to the holding substrate,

Bonding the holding end to the holding substrate;

Thermocompression bonding the holding end to the holding substrate;

30. The method for producing a probe card according to claim 28, wherein the method comprises: 31. In a state where the amorphous alloy layer is heated to a temperature that is equal to or higher than the supercooled liquid temperature range of the ammonorefass alloy layer and equal to or lower than the crystallization start temperature, the free end moves away from the holding substrate. 30. The method for manufacturing a probe card according to claim 29, further comprising a step of bending.

32. The probe card manufacturing method according to any one of claims 28 to 31, further comprising a step of separating the amorphous alloy layer from the substrate.