WO2002086948A2 - Transport cassette for semiconductor substrate masks - Google Patents
Transport cassette for semiconductor substrate masks Download PDFInfo
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- WO2002086948A2 WO2002086948A2 PCT/EP2002/004304 EP0204304W WO02086948A2 WO 2002086948 A2 WO2002086948 A2 WO 2002086948A2 EP 0204304 W EP0204304 W EP 0204304W WO 02086948 A2 WO02086948 A2 WO 02086948A2
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- cassette according
- mask
- housing
- support
- cassette
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
Definitions
- the present invention relates to a cassette for transporting and / or storing optical masks used in the production of semiconductor substrates, according to the preamble of claim 1.
- Such cassettes are used to transport and / or store optical masks that are used in the production of semiconductor substrates.
- the optical masks are made of quartz glass, for example, and are approximately 6 to 8 mm thick.
- the masks, which are given a predetermined structure for the production of the semiconductor substrates in question on a surface, must be provided with 100% clean optical surfaces, which must also be retained.
- cassettes for transporting and / or storing optical masks have support elements in the form of rails which run essentially over the entire depth of the cassette and on which the masks rest with one of their optical surfaces on the edge.
- the disadvantage of this is that there is a risk of this strip support that the optical surface in this support area is contaminated with particles. This has a disadvantageous effect on the subsequent exposure process in the production of the semiconductor substrates.
- the object of the present invention is therefore to create a cassette for transporting and / or storing optical masks of the type mentioned at the outset, in which the optical surface of the mask comes into contact with the optical masks used in the production of semiconductor substrates Support element in the housing is avoided.
- the features specified in claim 1 are provided in a cassette for transporting and / or storing optical masks of the type mentioned used in the production of semiconductor substrates.
- the masks with their chamfered surfaces rest on the receiving element and thus particle contamination of the optical surface, which is adjacent to this contact surface, is avoided. In this way, the structure surface of the mask is protected.
- the features are provided according to claim 2, so that a corresponding, for example. Horizontal alignment of the mask in the cassette is ensured.
- a preferred embodiment of the receiving element can be given by the features of claim 3.
- the features according to claim 4 are provided.
- a so-called four-point contact of the mask is achieved, i. that is, the mask lies on four spaced-apart receiving strips.
- the features are advantageously provided according to claim 5.
- the features are provided according to claim 9, resulting in a simply designed and manufactured housing leads. This in turn means that, according to the features of claims 10 and / or 11, the receiving strips and / or the resilient stops can be provided in a quick and simple manner.
- FIG. 1 shows a perspective rear view of a cassette for optical masks according to a preferred exemplary embodiment of the present invention, in an empty state
- Figure 2 is a rear view corresponding to Figure 1
- the cassette 10 shown in the drawing according to a preferred exemplary embodiment is used for transporting and / or storing optical masks 11 used in the production of semiconductor substrates.
- the cassette has a housing 12 made of metal.
- the housing 12 has a bottom 13 and a ceiling 14, between which two side walls 16 and 17 are arranged, which face identical support elements 18 and 19, on which masks 11 can be held one above the other and at a uniform distance at a constant distance ,
- Each of the support elements 18, 19 is in two sections divided, which are formed by support strips 21 and 22 which are arranged one behind the other in the insertion direction A of the masks 11.
- the strips 21 and 22 are formed as elements which are punched out and angled out of the divided side walls 16 and 17.
- each side wall 16, 17 is provided in its longitudinal center, as seen in the direction of arrow A, with a recess 23 or 24, which extends over substantially the entire height between floor 13 and ceiling 14.
- the strips 21 and 22 are in one piece with the edges 25 and 26 delimiting the recess 23 and 24 and are bent vertically from these inwards to the opposite side wall 17, 16.
- the support strips 21, 22 have, at their free ends facing away from the side wall edges 25, 26, an approximately sawtooth-shaped profile 27 which has a support bevel 28, a rounded guide nose 29 adjoining it and an adjoining insertion bevel 30.
- the bevel 28 serves to hold a mask 11 in a horizontal arrangement within the cassette housing 12 and the guide lug 29 for lateral limitation and guidance of a mask 11 in the lateral direction according to double arrow B.
- the respective rear edge 36 of the side wall 16 and 17 in the insertion direction A has a one-piece resilient stop 37 which projects from this side wall edge 36 and is bent toward the respective other side wall 16, 17.
- the stop 37 is formed by an approximately V-shaped tongue that is resilient.
- the mask 11 for example made of a quartz glass as a flat plate 6 to 8 mm thick, has a bevel 34 and 35, for example, approximately 1.5 mm wide, surrounding both its upper surface 32 and its lower surface 33.
- the bevel of these chamfers 34 and 35 to the surface 32 and 33 corresponds to the inclination of the support bevels 28 of the support strips 21, 22 to the horizontal plane.
- the mask 11 lies with its chamfer 34 or 35 on the bevel 28. In this way, the upper surface 32 or the lower surface 33 remains free of contact.
- the longitudinal face 39 of the mask 11 remaining between the two chamfers 34 and 35 bears against the guide lug 29, so that the mask 11 is held between two opposing support strips 21 and 22. Both the support and the guidance of the mask 11 on or between two opposite support elements 18 and 19 thus take place at four spaced points.
- a metallic housing 12 with punched and bent support elements 18, 19 and resilient tongues 37 is also described in the illustrated embodiment, it goes without saying that a plastic housing can also be provided on which the support elements 18, 19 or stops 37 correspond accordingly are molded.
Abstract
The invention relates to a cassette (10) for transporting and/or storing optical masks (11) which are used during the production of semiconductor substrates. Said cassette comprises a plurality of opposite lateral walls (16, 17) of a housing (12) and superposed bearing elements (18, 19) for receiving the masks (11) which are provided with chamfers (34, 35) along the edges thereof. In order to prevent the bearing element in the housing from touching the optical surface of the mask during handling, the receiving element (18, 19) is provided with an inclined bearing surface (28), the incline thereof in relation to the lateral wall (16, 17) of the housing (12) being the same as the incline of the chamfer (34, 35) in relation to the front (39) of the mask (11).
Description
Titel: Transportkassette für Halbleitersubstrat-MaskenTitle: Transport cassette for semiconductor substrate masks
Beschreibungdescription
Die vorliegende Erfindung bezieht sic auf eine Kassette zum Transportieren und/oder Lagern von bei der Herstellung von Halbleitersubstraten verwendeten optischen Masken, nach dem Oberbegriff des Anspruchs 1.The present invention relates to a cassette for transporting and / or storing optical masks used in the production of semiconductor substrates, according to the preamble of claim 1.
Derartige Kassetten dienen zum Transportieren und/oder Lagern von optischen Masken, die bei der Herstellung von Halbleitersubstraten verwendet werden. Die optischen Masken bestehen bspw. aus Quarzglas und sind ca. 6 bis 8 mm dick. Die Masken, die an einer Fläche eine vorgegebene Struktur zur Herstellung der betreffenden Halbleitersubstrate erhalten, müssen mit hunderprozentig sauberen optischen Flächen versehen sein, die auch erhalten bleiben müssen.Such cassettes are used to transport and / or store optical masks that are used in the production of semiconductor substrates. The optical masks are made of quartz glass, for example, and are approximately 6 to 8 mm thick. The masks, which are given a predetermined structure for the production of the semiconductor substrates in question on a surface, must be provided with 100% clean optical surfaces, which must also be retained.
Bekannte Kassetten zum Transportieren und/oder Lagern von optischen Masken besitzen Auflageelemente in Form von im Wesentlichen über die gesamte Kassettentiefe verlaufenden Schienen, auf denen die Masken mit einer ihrer optischen Flächen randseitig aufliegen. Nachteilig hieran ist, dass durch diese Streifenauflage die Gefahr besteht, dass die optische Fläche in diesem Auflagebereich mit Partikeln kontaminiert wird. Dies wirkt sich nachteilig auf den nachfolgenden Belichtungsvorgang bei der Herstellung der Halbleitersubstrate aus.Known cassettes for transporting and / or storing optical masks have support elements in the form of rails which run essentially over the entire depth of the cassette and on which the masks rest with one of their optical surfaces on the edge. The disadvantage of this is that there is a risk of this strip support that the optical surface in this support area is contaminated with particles. This has a disadvantageous effect on the subsequent exposure process in the production of the semiconductor substrates.
Aufgabe der vorliegenden Erfindung ist es deshalb, eine Kassette zum Transportieren und/oder Lagern von bei der Herstellung von Halbleitersubstraten verwendeten optischen Masken der eingangs genannten Art zu schaffen, bei der eine Berührung der optischen Fläche der Maske mit dem
Auflageelement im Gehäuse vermieden ist.The object of the present invention is therefore to create a cassette for transporting and / or storing optical masks of the type mentioned at the outset, in which the optical surface of the mask comes into contact with the optical masks used in the production of semiconductor substrates Support element in the housing is avoided.
Zur Lösung dieser Aufgabe sind bei einer Kassette zum Transportieren und/oder Lagern von bei der Herstellung von Halbleitersubstraten verwendeten optischen Masken der genannten Art die im Anspruch 1 vorgegebenen Merkmale vorgesehen.To achieve this object, the features specified in claim 1 are provided in a cassette for transporting and / or storing optical masks of the type mentioned used in the production of semiconductor substrates.
Durch die erfindungsgemäßen Maßnahmen ist erreicht, dass die Masken mit ihren gefasten Flächen auf dem Auf ahmeelement aufliegen und damit eine Partikelkontaminierung der optischen Fläche, die dieser Auflagefläche benachbart ist, vermieden ist. Auf diese Weise ist die Strukturfläche der Maske geschützt .It is achieved by the measures according to the invention that the masks with their chamfered surfaces rest on the receiving element and thus particle contamination of the optical surface, which is adjacent to this contact surface, is avoided. In this way, the structure surface of the mask is protected.
In bevorzugter Ausgestaltung sind die Merkmale nach Anspruch 2 vorgesehen, so dass eine entsprechende, bspw. horizontale Ausrichtung der Maske in- der Kassette gewährleistet ist. Eine bevorzugte Ausgestaltung des Aufnahmeelementes kann dabei durch die Merkmale nach Anspruch 3 gegeben sein.In a preferred embodiment, the features are provided according to claim 2, so that a corresponding, for example. Horizontal alignment of the mask in the cassette is ensured. A preferred embodiment of the receiving element can be given by the features of claim 3.
Um darüber hinaus eine Streifen- bzw. Linienauflage in dieser Ausdehnung zur vermeiden, sind die Merkmale nach Anspruch 4 vorgesehen. Dadurch ist eine sog. Vierpunktauflage der Maske erreicht, d. h., die Maske liegt an vier voneinander beabstandeten Aufnahmeleisten auf. Dabei sind zweckmäßigerweise die Merkmale nach Anspruch 5 vorgesehen.In order to avoid a strip or line support in this extent, the features according to claim 4 are provided. A so-called four-point contact of the mask is achieved, i. that is, the mask lies on four spaced-apart receiving strips. The features are advantageously provided according to claim 5.
Um eine Einschubbegrenzung der Masken beim Einführen in die Kassette zu erreichen, sind die Merkmale nach Anspruch 6 vorgesehen. Zweckmäßige Ausgestaltungen hierzu ergeben sich aus den Merkmalen des Anspruchs 7 und/oder 8.In order to limit the insertion of the masks when they are inserted into the cassette, the features according to claim 6 are provided. Appropriate configurations for this result from the features of claim 7 and / or 8.
Bei einem weiteren Ausführungsbeispiel vorliegender Erfindung sind die Merkmale nach Anspruch 9 vorgesehen, was zu einem
einfach ausgestalteten und herzustellenden Gehäuse führt. Dies wiederum bedeutet, dass gemäß den Merkmalen des Anspruchs 10 und/oder 11 die Aufnahmeleisten und/oder die federnden Anschläge in schneller und einfacher Weise vorgesehen werden können.In a further exemplary embodiment of the present invention, the features are provided according to claim 9, resulting in a simply designed and manufactured housing leads. This in turn means that, according to the features of claims 10 and / or 11, the receiving strips and / or the resilient stops can be provided in a quick and simple manner.
Weitere Einzelheiten der Erfindung sind der folgenden Beschreibung zu entnehmen, in der die Erfindung anhand des in der Zeichnung dargestellten Ausführungsbeispieles näher beschrieben und erläutert ist. Es zeigen:Further details of the invention can be found in the following description, in which the invention is described and explained in more detail with reference to the embodiment shown in the drawing. Show it:
Figur 1 in perspektivischer Rückansicht eine Kassette für optische Masken gemäß einem bevorzugten Ausführungsbeispiel vorliegender Erfindung, in leerem Zustand,1 shows a perspective rear view of a cassette for optical masks according to a preferred exemplary embodiment of the present invention, in an empty state,
Figur 2 eine der Figur 1 entsprechende Rückansicht derFigure 2 is a rear view corresponding to Figure 1
Kassette, jedoch in mit optischen Masken belegtem Zustand undCassette, but in condition with optical masks and
Figur 3 in vergrößerter Darstellung und in Ansicht eineFigure 3 in an enlarged view and in a view
Einzelheit gemäß Kreisausschnitt III der Figur 2.Detail according to section III of FIG. 2.
Die in der Zeichnung gemäß einem bevorzugten Ausführungsbeispiel dargestellte Kassette 10 dient zum Transportieren und/oder Lagern von bei der Herstellung von Halbleitersubstraten verwendeten optischen Masken 11.The cassette 10 shown in the drawing according to a preferred exemplary embodiment is used for transporting and / or storing optical masks 11 used in the production of semiconductor substrates.
Die Kassette besitzt ein Gehäuse 12 aus Metall. Das Gehäuse 12 besitzt einen Boden 13 und eine Decke 14, zwischen denen zwei Seitenwände 16 und 17 angeordnet sind, die einander zugewandt identische Auflageelemente 18 bzw. 19 tragen, auf denen in einem hier konstanten Abstand Masken 11 übereinander und in gleichmäßigem Abstand gehalten werden können.The cassette has a housing 12 made of metal. The housing 12 has a bottom 13 and a ceiling 14, between which two side walls 16 and 17 are arranged, which face identical support elements 18 and 19, on which masks 11 can be held one above the other and at a uniform distance at a constant distance ,
Jedes der Auflageelemente 18, 19 ist in zwei Abschnitte
unterteilt, die durch Auflageleisten 21 und 22 gebildet sind, die in Einschubrichtung A der Masken 11 in einem Abstand hintereinander angeordnet sind. Beim dargestellten Ausführungsbeispiel sind die Leisten 21 und 22 als aus den geteilten Seitenwänden 16 und 17 ausgestanzte und abgewinkelte Elemente gebildet. Hierzu ist jede Seitenwand 16, 17 in ihrer, in Richtung des Pfeiles A gesehen, Längsmitte mit einer Ausnehmung 23 bzw. 24 versehen, die über im Wesentlichen die gesamte Höhe zwischen Boden 13 und Decke 14 verläuft. Die Leisten 21 und 22 sind mit den die Ausnehmung 23 und 24 begrenzenden Rändern 25 und 26 einteilig und von diesen nach innen zur jeweils gegenüberliegenden Seitenwand 17, 16 senkrecht umgebogen.Each of the support elements 18, 19 is in two sections divided, which are formed by support strips 21 and 22 which are arranged one behind the other in the insertion direction A of the masks 11. In the exemplary embodiment shown, the strips 21 and 22 are formed as elements which are punched out and angled out of the divided side walls 16 and 17. For this purpose, each side wall 16, 17 is provided in its longitudinal center, as seen in the direction of arrow A, with a recess 23 or 24, which extends over substantially the entire height between floor 13 and ceiling 14. The strips 21 and 22 are in one piece with the edges 25 and 26 delimiting the recess 23 and 24 and are bent vertically from these inwards to the opposite side wall 17, 16.
Die Auflageleisten 21, 22 besitzen an ihren den Seitenwandrändern 25, 26 abgewandten freien Enden ein etwa sägezahnförmiges Profil 27, das eine Auflageschräge 28, eine daran anschließende abgerundete Führungsnase 29 und eine daran anschließende Einführungsschräge 30 aufweist. Wie noch anhand der Figur 3 im Einzelnen erläutert werden wird, dient die Auflageschräge 28 der Halterung einer Maske 11 in horizontaler Anordnung innerhalb des Kassettengehäuses 12 und die Führungsnase 29 zur seitlichen Begrenzung und Führung einer Maske 11 in seitlicher Richtung gemäß Doppelpfeil B.The support strips 21, 22 have, at their free ends facing away from the side wall edges 25, 26, an approximately sawtooth-shaped profile 27 which has a support bevel 28, a rounded guide nose 29 adjoining it and an adjoining insertion bevel 30. As will be explained in more detail with reference to FIG. 3, the bevel 28 serves to hold a mask 11 in a horizontal arrangement within the cassette housing 12 and the guide lug 29 for lateral limitation and guidance of a mask 11 in the lateral direction according to double arrow B.
Die in Einschubrichtung A jeweils hintere Kante 36 der Seitenwand 16 bzw. 17 besitzt einen einstückigen federnden Anschlag 37, der von dieser Seitenwandkante 36 absteht und zur jeweils anderen Seitenwand 16, 17 hin umgebogen ist. Der Anschlag 37 ist durch eine etwa V-förmige Zunge, die federnd ist, gebildet. In in das Gehäuse 12 eingeschobenem Zustand der Maske 11 stößt die Maske mit ihrer Rückstirn 38 an die federnden Zungen 37 an.The respective rear edge 36 of the side wall 16 and 17 in the insertion direction A has a one-piece resilient stop 37 which projects from this side wall edge 36 and is bent toward the respective other side wall 16, 17. The stop 37 is formed by an approximately V-shaped tongue that is resilient. When the mask 11 is pushed into the housing 12, the rear face 38 of the mask abuts the resilient tongues 37.
Die Maske 11, die bspw. aus einem Quarzglas als ebene Platte
von etwa 6 bis 8 mm Dicke gebildet ist, besitzt umlaufend sowohl seiner oberen Fläche 32 als auch seiner unteren Fläche 33 benachbart jeweils eine Fase 34 bzw. 35 von bspw. etwa 1,5 mm Breite. Die Abschrägung dieser Fasen 34 und 35 zur Oberfläche 32 bzw. 33 entspricht der Neigung der Auflageschräge 28 der Auflageleisten 21, 22 zur Horizontalebene. Gemäß Figur 3 liegt somit die Maske 11 mit ihrer Fase 34 oder 35 auf der Auflageschräge 28 auf. Auf diese Weise verbleibt die obere Fläche 32 oder die untere Fläche 33 auflagefrei. Die zwischen den beiden Fasen 34 und 35 verbleibende Längsstirn 39 der Maske 11 liegt an der Führungsnase 29 an, so dass die Maske 11 zwischen zwei gegenüberliegenden Auflageleisten 21 und 22 gehalten wird. Sowohl die Auflage als auch die Führung der Maske 11 auf bzw. zwischen zwei gegenüberliegenden Auflageelementen 18 und 19 erfolgt somit an vier beabstandeten Punkten.The mask 11, for example made of a quartz glass as a flat plate 6 to 8 mm thick, has a bevel 34 and 35, for example, approximately 1.5 mm wide, surrounding both its upper surface 32 and its lower surface 33. The bevel of these chamfers 34 and 35 to the surface 32 and 33 corresponds to the inclination of the support bevels 28 of the support strips 21, 22 to the horizontal plane. According to FIG. 3, the mask 11 lies with its chamfer 34 or 35 on the bevel 28. In this way, the upper surface 32 or the lower surface 33 remains free of contact. The longitudinal face 39 of the mask 11 remaining between the two chamfers 34 and 35 bears against the guide lug 29, so that the mask 11 is held between two opposing support strips 21 and 22. Both the support and the guidance of the mask 11 on or between two opposite support elements 18 and 19 thus take place at four spaced points.
Wenn auch beim dargestellten Ausführungsbeispiel ein metallisches Gehäuse 12 mit ausgestanzten und abgebogenen Auflageelementen 18, 19 und federnden Zungen 37 beschrieben ist, versteht es sich, dass auch ein Gehäuse aus Kunststoff vorgesehen sein kann, an dem die Auflageelemente 18, 19 bzw. Anschläge 37 entsprechend angeformt sind.
If a metallic housing 12 with punched and bent support elements 18, 19 and resilient tongues 37 is also described in the illustrated embodiment, it goes without saying that a plastic housing can also be provided on which the support elements 18, 19 or stops 37 correspond accordingly are molded.
Claims
Schutzansprücheprotection claims
Kassette (10) zum Transportieren und/oder Lagern von bei der Herstellung von Halbleitersubstraten verwendeten optischen Masken (11), mit mehreren an gegenüberliegenden Seitenwänden (16, 17) eines Gehäuses (12) und übereinander angeordneten Auflageelementen (18, 19) zur Aufnahme der längs ihrer Kanten mit Fasen (34, 35) versehenen Masken (11), dadurch gekennzeichnet' dass das Aufnahmeelement (18, 19) mit einer geneigten Auflagefläche (28) versehen ist, deren Neigung zur Seitenwand (16, 17) des Gehäuses (12) gleich der Neigung der Fase (34, 35) zur Stirn (39) der Maske (11) ist.Cassette (10) for transporting and / or storing optical masks (11) used in the production of semiconductor substrates, with several on opposite side walls (16, 17) of a housing (12) and stacked support elements (18, 19) for receiving the Masks (11) provided with chamfers (34, 35) along their edges, characterized in that the receiving element (18, 19) is provided with an inclined support surface (28), the inclination of which towards the side wall (16, 17) of the housing (12 ) is equal to the inclination of the chamfer (34, 35) to the forehead (39) of the mask (11).
Kassette nach Anspruch 1, dadurch gekennzeichnet, dass das Auflageelement (18, 19) mit einer Seitenbegrenzung (29) für die Stirn (39) der Maske (11) versehen ist.Cassette according to claim 1, characterized in that the support element (18, 19) is provided with a side boundary (29) for the forehead (39) of the mask (11).
Kassette nach den Ansprüchen 1 und 2, dadurch gekennzeichnet, dass das Aufnähmeelement (18, 19) eine im Querschnitt etwa sägezahnförmige Ausbildung (27) aufweist, wobei die Seitenbegrenzung durch die Sägezahnstirn (29) gebildet ist.Cassette according to claims 1 and 2, characterized in that the receiving element (18, 19) has a sawtooth-shaped configuration (27) in cross section, the side boundary being formed by the sawtooth face (29).
Kassette nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Auflageelement (18, 19) durch eine in Einschubrichtung (A) der Maske (11) vordere und hintere Auflageleiste (21, 22) gebildet ist.Cassette according to at least one of the preceding claims, characterized in that the support element (18, 19) is formed by a front and rear support strip (21, 22) in the insertion direction (A) of the mask (11).
Kassette nach Anspruch 4, dadurch gekennzeichnet, dass die Auflageleiste (21, 22) mit der betreffenden Seitenwand (16, 19) einstückig ist.Cassette according to claim 4, characterized in that the support strip (21, 22) is in one piece with the relevant side wall (16, 19).
Kassette nach mindestens einem der vorhergehenden
Ansprüche, dadurch gekennzeichnet, dass das in Einschubrichtung der Maske (11) hintere Ende des Gehäuses (12) mit federnden Anschlägen (37) versehen ist.Cassette according to at least one of the previous ones Claims, characterized in that the rear end of the housing (12) in the insertion direction of the mask (11) is provided with resilient stops (37).
7. Kassette nach Anspruch 6, dadurch gekennzeichnet, dass die federnden Anschläge (37) in Flucht mit den Auflageelementen (18, 19) liegen.7. Cassette according to claim 6, characterized in that the resilient stops (37) are in alignment with the support elements (18, 19).
8. Kassette nach Anspruch 6 oder 7, dadurch gekennzeichnet, dass die federnden Anschläge durch angeformte Zungen (37) gebildet sind.8. Cassette according to claim 6 or 7, characterized in that the resilient stops are formed by molded tongues (37).
9. Kassette nach mindestens einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Gehäuse (12) aus Metall ist und dass die beiden Seitenwände (16, 17) durch eine etwa längsmittige Öffnung (23, 24) unterbrochen sind.9. Cassette according to at least one of the preceding claims, characterized in that the housing (12) is made of metal and that the two side walls (16, 17) are interrupted by an approximately longitudinally central opening (23, 24).
10. Kassette nach den Ansprüchen 4 und/oder 5 und 9, dadurch gekennzeichnet, dass die Auflageleisten (21, 22) der Öffnung (23, 24) zugewandt als mit den Seitenwandabschnitten einstückigen und umgebogenen Lappen gebildet sind.10. Cassette according to claims 4 and / or 5 and 9, characterized in that the support strips (21, 22) facing the opening (23, 24) are formed as integral with the side wall portions and bent tabs.
11. Kassette nach einem der Ansprüche 6 bis 8 und nach Anspruch 9, dadurch gekennzeichnet, dass die federnden Anschläge als mit den hinteren Seitenwandabschnitten einstückigen und umgebogenen Zungen (37) gebildet sind.
11. Cassette according to one of claims 6 to 8 and according to claim 9, characterized in that the resilient stops are formed as tongues (37) which are integral with the rear side wall sections and bent over.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2002319138A AU2002319138A1 (en) | 2001-04-21 | 2002-04-18 | Transport cassette for semiconductor substrate masks |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20106908.3 | 2001-04-21 | ||
| DE20106908U DE20106908U1 (en) | 2001-04-21 | 2001-04-21 | Transport cassette for semiconductor substrate masks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2002086948A2 true WO2002086948A2 (en) | 2002-10-31 |
| WO2002086948A3 WO2002086948A3 (en) | 2003-09-25 |
Family
ID=7956038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2002/004304 WO2002086948A2 (en) | 2001-04-21 | 2002-04-18 | Transport cassette for semiconductor substrate masks |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2002319138A1 (en) |
| DE (1) | DE20106908U1 (en) |
| WO (1) | WO2002086948A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019052282A1 (en) * | 2017-09-18 | 2019-03-21 | 京东方科技集团股份有限公司 | Mask cassette and mask |
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| US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
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| US4687097A (en) * | 1984-12-11 | 1987-08-18 | Empak, Inc. | Wafer processing cassette |
| US4697704A (en) * | 1986-06-30 | 1987-10-06 | Royal Master Systems, Inc. | Storage container for floppy discs |
| US4696395A (en) * | 1986-11-14 | 1987-09-29 | Northrop Corporation | Substrate container |
| US4718548A (en) * | 1986-12-19 | 1988-01-12 | Advanced Micro Devices, Inc. | Protective housing for a leadless chip carrier or plastic leaded chip carrier package |
| US4798305A (en) * | 1987-11-16 | 1989-01-17 | National Semiconductor Corporation | Adjustable shipping tray |
| JPH10163310A (en) * | 1996-11-28 | 1998-06-19 | Komatsu Electron Metals Co Ltd | Wafer holding structure of semiconductor wafer packaging container |
| US5921397A (en) * | 1996-12-10 | 1999-07-13 | Empak, Inc. | Disk cassette |
| JPH10319577A (en) * | 1997-05-20 | 1998-12-04 | Oki Electric Ind Co Ltd | Tilt light testing substrate holder |
| JPH11135412A (en) * | 1997-10-28 | 1999-05-21 | Nikon Corp | Projection aligner and method for holding reticule |
| JP3556480B2 (en) * | 1998-08-17 | 2004-08-18 | 信越ポリマー株式会社 | Precision substrate storage container |
-
2001
- 2001-04-21 DE DE20106908U patent/DE20106908U1/en not_active Expired - Lifetime
-
2002
- 2002-04-18 WO PCT/EP2002/004304 patent/WO2002086948A2/en not_active Application Discontinuation
- 2002-04-18 AU AU2002319138A patent/AU2002319138A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
| WO2001001828A1 (en) * | 1999-07-02 | 2001-01-11 | Spi/Semicon | Wafer container |
Non-Patent Citations (2)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03, 31. März 1999 (1999-03-31) -& JP 10 319577 A (OKI ELECTRIC IND CO LTD), 4. Dezember 1998 (1998-12-04) * |
| PATENT ABSTRACTS OF JAPAN vol. 1999, no. 10, 31. August 1999 (1999-08-31) -& JP 11 135412 A (NIKON CORP), 21. Mai 1999 (1999-05-21) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019052282A1 (en) * | 2017-09-18 | 2019-03-21 | 京东方科技集团股份有限公司 | Mask cassette and mask |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2002319138A1 (en) | 2002-11-05 |
| DE20106908U1 (en) | 2002-08-29 |
| WO2002086948A3 (en) | 2003-09-25 |
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