WO2002085089A1 - Appareil de refroidissement et son procede de fabrication - Google Patents

Appareil de refroidissement et son procede de fabrication Download PDF

Info

Publication number
WO2002085089A1
WO2002085089A1 PCT/SE2002/000657 SE0200657W WO02085089A1 WO 2002085089 A1 WO2002085089 A1 WO 2002085089A1 SE 0200657 W SE0200657 W SE 0200657W WO 02085089 A1 WO02085089 A1 WO 02085089A1
Authority
WO
WIPO (PCT)
Prior art keywords
inner space
encapsulation
electronic devices
printed circuit
cooling
Prior art date
Application number
PCT/SE2002/000657
Other languages
English (en)
Inventor
Håkan Ragnar BRÄNNMARK
Per Mattias Nyqvist
Original Assignee
Emerson Energy Systems Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emerson Energy Systems Ab filed Critical Emerson Energy Systems Ab
Publication of WO2002085089A1 publication Critical patent/WO2002085089A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/068—Hermetically-sealed casings having a pressure compensation device, e.g. membrane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Definitions

  • the present invention relates to an apparatus according to the preamble of claim 1.
  • the present invention also relates to a method according to the preamble of claim 5.
  • Electronic components arranged on e.g. printed circuit boards dissipate heat during operation and thus need to be cooled so as to prevent rapidly increasing component temperatures, which may jeopardise their function.
  • Liquid cooling is one way of cooling the printed circuit boards which, in contrast to air cooling, provides a more efficient cooling due to better heat carrier capabilities.
  • One way of utilising liquid cooling is to enclose printed circuit boards in liquid tight units in which a ref igerant is contained.
  • the refrigerant may either be of an electronic friendly nature or the printed circuit board may be provided with a coating of lacquer, so as to prevent short-circuiting.
  • the refrigerant contained in the unit absorbs the heat emitted by the electronic components and dissipates it to the unit, which in turn has to be externally cooled so as to maintain an acceptable temperature.
  • This may be ac- complished in a number of ways, e.g. forced- or natural convection air liquid cooling, providing the unit with flanges or the like to increase the heat-emitting area, etc.
  • the units may be completely or partly filled with a refrigerant.
  • the refrigerant in the latter undergoes a phase transformation, i.e. it evapo- rates when absorbing heat from the components, which vapour condenses on the inner surfaces of the units, thereby emitting heat.
  • the air pressure within the partly filled units the evaporation temperature may be controlled.
  • different types of refrigerants suitable for various environments and heat loads may be employed, e.g. water would be conceivable as a refrigerant if the pressure is decreased sufficiently enough, which would be advantageous since water is nontoxic and inexpensive. Irrespective of choice of refrigerants great demands are made upon tight sealing to avoid leakage from the units. A leakage may be disadvantageous from several reasons, not only due to the incapability to further cool the printed circuit boards or the risk of short circuiting electronics outside the units, but also due to contamination of the environment and time-consuming repair and maintenance.
  • WO 00/60914 shows a printed circuit board arranged inside a liquid-tight unit.
  • a top cover and a bottom cover are mounted together around a printed circuit board.
  • a refrigerant is contained within the unit for cooling the printed circuit board.
  • the printed circuit board is clamped between flanges of the top- and bottom cover, re- spectively, so as to be firmly hold by the flanges.
  • An adhesive or the like is arranged between the flanges and the printed circuit board forming a peripherical seal.
  • An object of the present invention is to provide an apparatus and a method for encapsulation and cooling electronic devices, such as printed circuit boards in liquid- tight units, which overcomes the problems associated with previously known apparatuses and methods.
  • said electronic device may be firmly mounted and hold without the use of screw- and spring joints, whereby the mounting is simplified.
  • the electronic device is not part of the seal, i.e. it is not clamped between the contact surfaces of the first and second encapsulation parts.
  • the functionality of the seal is not jeopardised due to heat expansions, or other movements, of the electronic devices.
  • the electronic device is spring-loaded between the first and second encapsulation parts, i.e. the encapsulation parts are not static in directions perpendicular to the electronic device. Accordingly, the encapsulation parts can compensate for heat expansions of the electronic device, so the risk of damaging the electronic device is reduced.
  • said supporting means comprise protrusions projecting into the inner space.
  • specific portions of the electronic device may be clamped.
  • said protrusions are made from a heat conducting material.
  • heat generated by specific, heat-generating components may be carried off to the encapsulation parts.
  • said inner space is at least partly contained with a refrigerant for cooling the electronic devices.
  • evaporation temperatures of the refrigerant may be controlled.
  • Fig. la shows a schematic, sectioned side view of an apparatus according to a preferred embodiment of the invention.
  • Fig. lb shows a schematic, sectioned side view of the apparatus in fig. la accommodating a printed circuit board.
  • Fig. lc shows a schematic, sectioned side view of the apparatus in fig. lb when an under-pressure has been created within the apparatus.
  • Fig. la-c depicts an apparatus for encapsulation and cooling electronic devices, such as printed circuit boards.
  • the apparatus is formed by two encapsulation parts 1, 3 from now on referred to as top and bottom covers.
  • Each cover 1, 3 comprises a flat or planar panel 5, 7 with right-angled sides 9, 11 surrounding the panel 5, thus cre- ating a bowl-like shaped cover.
  • the sides 9, 11 have a peripherical surface 13, 15 substantially in parallel with the panels 5, 7, and which work as a contact surface when the top and bottom covers are put together.
  • an inner space 17 is formed between them. This inner space is defined by side inner faces 19, 21 and panel inner faces 23, 25.
  • Protrusions 27a-b, 29a-b ar- ranged on each panel inner face 23, 25, respectively project into the inner space 17.
  • the protrusions are in the form of ridges 27a-b, 29a-b and extend along the panel inner faces.
  • a gap is formed between two opposite ridges 27a-b, 29a-b, even though the contact surfaces 13, 15 abut against each other.
  • This gap is sufficient to accommodate a printed circuit board 31, see fig. lb, where an underside 33 of the printed circuit board is supported by the ridges 29a-b of the bottom cover 3.
  • the printed circuit board 31 freely rests on the bottom ridges 29a-b and is by no means attached or mounted to the covers.
  • the printed circuit board is, on its upper side, provided with electronic components 35, which during use dissipate heat.
  • Fig. lb also shows a peripherical seal 37 arranged in the transition zone between the top and bottom covers 1, 3, so as to join them but also to make the inner space liquid- and air-tight.
  • the seal 37 could be accomplished in many ways, depending on the material that is used for the covers. Thus, soldering or any suitable adhesive distributed between the contact surfaces is conceivable.
  • the inner space 17 is partly contained with a refrigerant.
  • the refrigerant absorbs the heat generated by the electronic components 35, evaporates and finally condenses on the inner faces 19, 21, 23, 25 of the covers, as explained earlier. During the condensation the heat dissipates to the covers, where it is taken care of by a not shown external cooling facility.
  • An under-pressure has also been created in the inner space 17, so as to adapt the evaporation temperature of the refrigerant to environmental conditions, such as heat loads. This is advantageous when refrigerants, which under normal atmospheric pressure exhibits evaporation temperatures which are not compatible with the actual application, are employed.
  • the under-pressure may be created in many ways, such as vacuum-pumping, i.e. evacuation of air contained in the inner space, but is well known in the art and thereby not explained any further.
  • the panels 5, 7 are no longer flat or planar. Due to the under-pressure they have been deformed, whereby the inner space 17 has somewhat collapsed.
  • the panels 5, 7 have a design and a thickness of material that makes them, and thus also the covers, deformable, i.e. they easily deflect when a force is applied to the panels. Accordingly, the covers 1, 3 will exhibit a concave shape when such a force is applied from the outside of the panels. This shape is also shown in Fig. lc, but instead of an external force the under-pressure in the inner space enables the deformation of the covers.
  • the panels 5, 7 will deflect into the inner space due. to the deformable structure of the panels and due to the pressure difference between the inner space and the ambient.
  • the deflection of the panels causes the ridges 27a-b, 29a-b of the panels to be forced into clamping engagement with the printed circuit board 31.
  • This clamping engagement thus hold the printed circuit board on place, whereby no other fastening means are required to join the printed circuit board to the covers.
  • the ridge 27b abut against one of the components 35 when the printed circuit board is clamped.
  • the ridge 27a is somewhat bigger than ridge 27b and abuts directly against the printed circuit board surface during the clamping engagement. Thus, crushed components are avoided, since the ridge 27a works as a stop and prevents further deformation of the panels.
  • the deformation may also be achieved by providing, at least specific portions, of the covers with a material having a flexible or compressible structure, e.g. rubber.
  • a material having a flexible or compressible structure e.g. rubber.
  • such portions are arranged in the panels on each side of the ridges.
  • protrusions do not necessarily have to be in the form of ridges, but can also be formed by, e.g. circular bulgings or any, other for the purpose of clamping, suitable protrusions. It is also conceivable to arrange a number of the described apparatuses in series for creating an apparatus for encapsulation and cooling a multiple of printed circuit boards. The inner spaces could be in fluid communication with each other for circulation of refrigerant between the different inner spaces.
  • top and bottom covers could be integrated with each other, and with one side open for entry of the printed circuit board.
  • a lid then forms the second encapsulation part.
  • the above mentioned apparatus however reqiiires that the inner space is only partly filled with a refrigerant.
  • a completely filled inner space would not provide for the coUapsibility of the inner space and thus the clamping engagement according to the present invention, even though the covers would have a deformable structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un appareil permettant d'encapsuler et de refroidir des dispositifs électroniques tels que des cartes (31) de circuit imprimé. Ledit appareil comprend au moins une première et une seconde parties d'encapsulation (1, 3) à assembler afin de créer un espace intérieur (17) destiné à recevoir les dispositifs électroniques. Au moins l'une des première et une seconde parties d'encapsulation (1, 3) est dotée de moyens de support (27a-b, 29a-b) desdits dispositifs électroniques dans l'espace intérieur (17) et de moyens de joint (37) d'étanchéité destinés à ladite partie d'encapsulation (1, 3). Au moins l'une des première et une seconde parties d'encapsulation (1, 3) peut être déformée lorsqu'on crée une dépression dans l'espace intérieur (17), les moyens de support (27a-b, 29a-b) étant ainsi contraints à coopérer par serrage avec les dispositifs électroniques (31). L'invention concerne également un procédé de fabrication de cet appareil.
PCT/SE2002/000657 2001-04-12 2002-04-03 Appareil de refroidissement et son procede de fabrication WO2002085089A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0101312-7 2001-04-12
SE0101312A SE520661C2 (sv) 2001-04-12 2001-04-12 Kylapparat samt förfarande för att bilda en sådan apparat

Publications (1)

Publication Number Publication Date
WO2002085089A1 true WO2002085089A1 (fr) 2002-10-24

Family

ID=20283775

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2002/000657 WO2002085089A1 (fr) 2001-04-12 2002-04-03 Appareil de refroidissement et son procede de fabrication

Country Status (2)

Country Link
SE (1) SE520661C2 (fr)
WO (1) WO2002085089A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010063158A1 (de) * 2010-12-15 2012-06-21 Robert Bosch Gmbh Steuergerät und Verfahren zum Herstellen eines Steuergeräts
DE102016107289A1 (de) * 2016-04-20 2017-10-26 Systematec Gmbh Ansteueranordnung, Befestigungsanordnung und Kompressorvorrichtung
JP2018101655A (ja) * 2016-12-19 2018-06-28 日本電気株式会社 冷却装置、冷却方法、及び熱伝導体
CN108770303A (zh) * 2018-06-25 2018-11-06 河南孚点电子科技有限公司 一种散热芯片及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707414A (en) * 1984-04-09 1987-11-17 General Dynamics, Pomona Division Electrostatic-free package
JPH0267791A (ja) * 1988-09-02 1990-03-07 Riyoosan:Kk プリント基板用冷却装置
US5247424A (en) * 1992-06-16 1993-09-21 International Business Machines Corporation Low temperature conduction module with gasket to provide a vacuum seal and electrical connections

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707414A (en) * 1984-04-09 1987-11-17 General Dynamics, Pomona Division Electrostatic-free package
JPH0267791A (ja) * 1988-09-02 1990-03-07 Riyoosan:Kk プリント基板用冷却装置
US5247424A (en) * 1992-06-16 1993-09-21 International Business Machines Corporation Low temperature conduction module with gasket to provide a vacuum seal and electrical connections

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010063158A1 (de) * 2010-12-15 2012-06-21 Robert Bosch Gmbh Steuergerät und Verfahren zum Herstellen eines Steuergeräts
DE102016107289A1 (de) * 2016-04-20 2017-10-26 Systematec Gmbh Ansteueranordnung, Befestigungsanordnung und Kompressorvorrichtung
JP2018101655A (ja) * 2016-12-19 2018-06-28 日本電気株式会社 冷却装置、冷却方法、及び熱伝導体
CN108770303A (zh) * 2018-06-25 2018-11-06 河南孚点电子科技有限公司 一种散热芯片及其制备方法

Also Published As

Publication number Publication date
SE520661C2 (sv) 2003-08-05
SE0101312D0 (sv) 2001-04-12
SE0101312L (sv) 2002-10-13

Similar Documents

Publication Publication Date Title
US10912233B2 (en) Controller with heat sink clamping plate for enhanced thermal properties
US7307841B2 (en) Electronic package and method of cooling electronics
US5808868A (en) Electronic module with power components
JP4892527B2 (ja) 電子制御装置
KR100193969B1 (ko) 전자 기기의 lcd 패널 보유 지지 구조
US5999407A (en) Electronic module with conductively heat-sunk components
RU2190898C2 (ru) Сборочный узел для крепления теплового радиатора относительно поверхности электронного устройства
CN111343833B (zh) 显示装置
US6603665B1 (en) Heat dissipating assembly with thermal plates
CA2657056C (fr) Joint etanche a l'air coulissant renforce a autocentrage pour dispositifs electroniques detachables
US8027164B2 (en) Mounting arrangement for fixing printed circuit boards disposed one above the other in a housing
JP2006278941A (ja) 放熱装置及びプラグインユニット
JP4702451B2 (ja) 圧縮機用電子回路装置
JPH0650357U (ja) 熱伝達装置
WO2002085089A1 (fr) Appareil de refroidissement et son procede de fabrication
KR19990068011A (ko) 전자장치
JP6156368B2 (ja) 冷却装置の接続構造、冷却装置、および冷却装置の接続方法
AU2004224907A1 (en) Heat sink assembly for a potted housing
US20040241357A1 (en) Constructional unit and method for producing a constructional unit of this kind
JP2010034202A (ja) 電子装置の基板固定構造
CN109425156B (zh) 储液器组件、压缩机组件及空调器
JP2002320313A (ja) 車両用制御ユニット構造
US20180124952A1 (en) Modular dewar system
US20030095392A1 (en) Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shims
KR100438294B1 (ko) 집적 회로 냉각 장치

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP