WO2002067034A2 - Machine de transfert de circuit optique - Google Patents

Machine de transfert de circuit optique Download PDF

Info

Publication number
WO2002067034A2
WO2002067034A2 PCT/US2002/005498 US0205498W WO02067034A2 WO 2002067034 A2 WO2002067034 A2 WO 2002067034A2 US 0205498 W US0205498 W US 0205498W WO 02067034 A2 WO02067034 A2 WO 02067034A2
Authority
WO
WIPO (PCT)
Prior art keywords
optical module
optical
prealigned
gripper
module
Prior art date
Application number
PCT/US2002/005498
Other languages
English (en)
Other versions
WO2002067034A3 (fr
Inventor
Steven K. Case
Gregory S. Mowry
Timothy A. Skunes
Patrick J. Garfield
John T. Mcelreath
Craig D. Knighton
Gary A. Lenz
Mark L. Wilson
Original Assignee
Cyberoptics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/789,185 external-priority patent/US6443631B1/en
Priority claimed from US09/789,125 external-priority patent/US6546173B2/en
Priority claimed from US09/789,124 external-priority patent/US6546172B2/en
Priority claimed from US09/789,317 external-priority patent/US6590658B2/en
Priority claimed from US09/920,366 external-priority patent/US6956999B2/en
Application filed by Cyberoptics Corporation filed Critical Cyberoptics Corporation
Priority to AU2002306580A priority Critical patent/AU2002306580A1/en
Priority to US10/098,743 priority patent/US20020168147A1/en
Priority to US10/099,907 priority patent/US20020154870A1/en
Publication of WO2002067034A2 publication Critical patent/WO2002067034A2/fr
Publication of WO2002067034A3 publication Critical patent/WO2002067034A3/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2553—Splicing machines, e.g. optical fibre fusion splicer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2555—Alignment or adjustment devices for aligning prior to splicing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4227—Active alignment methods, e.g. procedures and algorithms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3616—Holders, macro size fixtures for mechanically holding or positioning fibres, e.g. on an optical bench
    • G02B6/362—Vacuum holders for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3834—Means for centering or aligning the light guide within the ferrule
    • G02B6/3838—Means for centering or aligning the light guide within the ferrule using grooves for light guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material

Definitions

  • the present invention relates to optical devices. More specifically, the present invention relates to the assembly of optical devices.
  • optical devices are being increasingly used in various industries and technologies in order to provide high speed data transfer, such as through fiber optic communication equipment .
  • a optical device typically consists of a number- of' components that must be precisely assembled and aligned for the device to operate and function efficiently.
  • Example components include fibers, waveguides, lasers, modulators, detectors, gratings, optical amplifiers, lenses, mirrors, prisms, windows, etc.
  • optical devices such as those used in fiber optic telecommunications, data storage and retrieval, optical inspection, etc. have had little commonality in packaging and assembly methods. This limits the applicability of automation equipment ⁇ for automating the manufacture of these devices since there is such a disparity in the device designs.
  • parts of each ndividual manufacturing line have to be custom-designed.
  • industries such as printed circuit board manufacturing and semiconductor manufacturing have both evolved to have common design rules and packaging methods. This allows the same piece of automation equipment to be applied to a multitude of designs.
  • printed circuits as an example, diverse applications ranging from computer motherboards to cellular telephones may be designed from relatively the same set of fundamental building blocks.
  • Typical single mode optical fibers used in fiber optic communications for the 1.3 ⁇ m to 1.6 ⁇ wavelength band have an effective core diameter of about 9 microns and an outside cladding dimension of 125 microns.
  • the typical tolerance for the concentricity of the core to the outside diameter of the cladding is 1 micron. If the outside claddings of the two fibers were perfectly aligned and there is no angular misalignment or longitudinal spacing, the cores may still be transversely misaligned by as much as 2 microns. This misalignment would give a theoretical coupling loss of about 14 percent or 0.65 dB. This loss is unacceptable in many applications. Further, optical devices are frequently manually assembled. Manual assembly is a slow and expensive process which has relatively low yields.
  • a method and apparatus for automatically assembling an optical device is provided. Prealigned optical modules are mounted by a pick and place machine onto a fixed reference.
  • Figure 1 is a diagram of a pick and place machine for placing prealigned optical modules to form an optical device.
  • Figure 2 is a block diagram showing various example components of a pick and place machine.
  • Figure 3 is a perspective view of one specific embodiment of a pick and place machine in accordance with the present invention.
  • Figure 4 is a perspective view of a optical device formed from two prealigned optical modules placed together using a pick and place machine of the invention.
  • Figure 5 is a front plan view of an optical module of Figure 4.
  • Figure ' 6 is a top plan view of a fixed reference of the optical device of Figure 4.
  • Figure 7 is a front plan view of another example optical module.
  • Figure 8 is a plan view of an example pick and place machine head.
  • Figure 9 is a front cross-sectional view showing a registration feature that registers an optical module in a fixed reference.
  • Figures 10A, 10B and IOC are cross- sectional views showing the operation of registration features.
  • Figure 11 is a cutaway plan view of a quill for use in a pick and place machine of the invention.
  • Figure 12 is a plan view of a laser transmitter optical device.
  • Figure 13 is a top plan view showing two fiber cassettes in a carrier.
  • Figure 15 is a cutaway top plan view and Figure 16 is a cutaway exploded perspective view showing optical modules carried in cradles adjacent a fixed reference.
  • Figure 17 is a perspective view of a cassette held by a vacuum gripper assembly.
  • Figure 18 is a block diagram showing example steps during operation of the pick and place machine -of Figure 3.
  • Figure 19 is a simplified block .diagram of a cradle and tray assembly.
  • Figure 20 is a perspective view of an alternative fiber component holder.
  • Figure 21 is a cross-sectional view showing electrical trace features used to verify proper registration of an optical module and a fixed reference.
  • a prealigned optical module is initially positioned with relatively low accuracy on a fixed reference substrate. Subsequently, registration features are used to passively position the module with relatively high accuracy. (The optical module is prealigned with respect to the registration features.) This technique lends itself to large scale, automated assembly of optical devices, including opto-electronic devices, such as fiber optic communication devices.
  • prealigned opto-electronic devices include devices that carry components such as a fiber, lens, laser, filter, grating, prism, etc.
  • the prealignment is with sub-micron accuracy and removes component variations.
  • the optical modules are then mounted onto a fixed reference substrate (also referred to herein as an optical circuit board) with the present invention. Both the optical modules and ' optical circuit boards have mating ' registration features that cooperate to easily facilitate sub- micron mechanical and optical alignment.
  • optical circuits such as laser transmitters, add/drop multiplexers, optical amplifiers, and optical switches may be assembled by mounting the appropriate optical modules onto an appropriately configured optical circuit • board.
  • One great advantage of building optical circuits in this fashion is that the automated optical circuit pick and place equipment for populating the optical circuit board does not need sub-micron positional accuracy.
  • the mating registration features between the optical modules and the optical circuit board passively guide the placement of the modules onto the circuit board to obtain the sub-micron mechanical and optical alignment.
  • the positional accuracy of pick and place machine need only be sufficient to deliver the optical module close enough to the optical circuit board to initiate the guiding process provided by the registration features.
  • Any appropriate method to perform the final guiding can be used and the invention is not limited to those specifically set forth herein in order to achieve the final sub-micron accuracy placement of the opto-electronic element.
  • the optical modules are then secured to the optical circuit board.
  • sub-micron accuracy positioning systems are characterized, in general, as having low speed and short travel lengths. Therefore, the present invention allows much faster assembly times than prior art methods of assembling optical devices and at the same time removes the negative effects of component variations .
  • Example components include, but are not limited to, integrated circuits, electrical resistors, and optical detectors.
  • FIG 1 is a simplified diagram showing a pick and place machine 110 in accordance with the present invention.
  • Pick and place machine 110 is configured to place a prealigned optical module 112A, which includes an optical component, onto a fixed reference 114 which could be, for example, a substrate or other configuration.
  • the optical module 112A can include a fiber optic "pigtail" 116A and, in such embodiments, the pick and place machine 110 is configured to grasp the pigtail 116A.
  • a second optical module 112B_ having a pigtail 116B is shown as mounted on fixed reference 114.
  • Pick and place machine 110 includes an actuator 120 that is controlled by a controller 122.
  • the actuator 120 moves a gripper linearly and/or rotationally about one or more axes.
  • Various types of sensors can be used to provide feedback to controller 122 to control actuator 120.
  • the gripper 124 grips the optical .modules.
  • An optional fiber gripper 126 can be provided to grip the pigtails ' from optical modules.
  • Pick and place machine 110 is also configured to receive a. source 130 of optical modules and other components 112C, 112D, 112E . . . which each may have fiber pigtails 116C, 116D, 11.6E . . ..
  • Source 130 can- be some type of a tray or other component delivery mechanism that can be loaded into machine 110 such that gripper 124 can grip the optical modules.
  • the present invention includes obtaining a plurality of prealigned modules and a fixed reference.
  • the modules and the substrate both have registration features configured to mate with one another. Registration features of at least one of the modules is initially aligned with a registration feature of the substrate. This initial aligning is performed with a first level of accuracy.
  • the module and the substrate are urged together such that the registration features cooperate with one another and passively align the optical module and the substrate due to this cooperation.
  • This passive alignment is at a second level of accuracy that is greater than the first level of accuracy.
  • a distal end gripper 132 is provided for gripping a distal end of the fiber pigtail 116 from an optical module 112.
  • the invention broadly includes a pick and place machine- • configured to carry a prealigned optical module (which may include electrical components) and support a fiber optic pigtail which extends from the module.
  • a prealigned optical module which may include electrical components
  • These pigtails can be quite long, for example several meters, and holding and controlling them during the placing process significantly increases the ability of a pick and place machine to be used in automated assembly of optical devices. More specific examples of various components or configurations of a pick and place machine are set forth herein, however, the invention is not limited to any of these specific examples or aspects.
  • FIG. 2 is a block diagram of a- pick and place machine 136 that shows additional optional components of the machine.
  • a controller 138 couples to a moving placement head 140, a transport conveyor 142, component feeders 144, upward looking camera 146, electrical probe 148, automatic tool changer 150, ' inspection until 152 and laminar air flow source 154.
  • controller 138 operates component .feeders such that placement head- 140 can grip a component such as an optical module.
  • the optical module can be oriented using upward looking camera 146 and/or a placement head camera carried on head 140.
  • Controller 138 can select from multiple tools in automatic tool changer 150 for use on placement head 140.
  • a laminar air flow 154 is provided for clean room conditions.
  • the controller can also activate electrical probes 148 for use in soldering an optical module and/or providing electrical connections.
  • the probes 148 may, in some embodiments, be carried on placement head 140 or extend from a work surface on which an optical module is placed.
  • Placement head 140 includes one or more component grippers for gripping an optical module, an adhesive dispenser and a curing source, such as an ultraviolet source.
  • a bar code reader can be carried on placement head 140 to read encoded bar code information. The bar code can be used for tracking optical modules.
  • Figure 3 shows a more specific example of a pick and place machine 2 adapted to assemble optical circuits consisting of parts such as optical elements, pre-aligned optical modules, optical circuit boards, opto-electronic. components, and • electrical components. These parts are presented to placement head 8 by reel feeders 52 as well as part trays 40, 42, 44, and 46. Tray stackers 38A, 38B, 38C, and 38 ' D contain multiple part trays 40, 42, 44, and 46, respectively. Placement head 8, shown in more detail in figure 8, is attached to gantry 6 and is capable of movement in the X direction. Gantry 6 is capable of being driven in " the Y direction by linear motors . -
  • Assembly tray 36 is delivered into pick and place machine 2 on conveyor rails 34. Assembly tray 36 is used as a temporary carrier for assembling multiple optical circuits 100. Assembly tray 36, once populated with- assembled optical circuits 100, would be used in a subsequent final packaging and sealing operation. Optical circuit 100 is shown in more detail in Figure 11.
  • Optical circuit 10 is shown as a simple optical fiber to optical fiber coupler.
  • the invention is applicable to more complex or other optical circuits containing other types of optical, opto-electronic, and electronic components.
  • Other example optical components include, but are not limited to, lenses, filters, waveguides, diffraction gratings, polarizers, and prisms.
  • Example optoelectronic components include, .but are not limited to, lasers, detectors, modulators, optical switches, and semiconductor optical amplifiers.
  • Optical circuit 10 is fabricated from two fiber modules 12A and 12B which include respective optical components 14A and 14B illustrated in this specific example as optical fibers.
  • the fibers are mounted to - respective optical component mounts 16A and 16B which are positioned and oriented to achieve a desired position and . orientation . of optical components 14A and 14B relative to base mounting plates 18A and 18B, respectively.
  • a refractive index optical matching material may be used to fill any gap between adjacent interface faces of optical components 14A and 14B to provide improved coupling and reduce reflections.
  • the optical matching material may be an optical adhesive that is curable by heat, radiation, or both.
  • base mounting plates 18A and 18B comprise substantially planar mating plates.
  • Base mounting plates 18A, 18B are one example of a relative reference mount.
  • Base mounting plates 18A and 18B mount to optical circuit board (substrate or fixed reference) 20 such that the optical components 14A and 14B are in substantial alignment.
  • Substrate 20 is one example of a fixed reference mount.
  • alignment registration marks 27A and 27B used by placement head camera 94, shown in Figure 8, in order that pick and place head 8 may accurately pick up parts such as fiber modules 12A and 12B from the part trays and tape and reel feeders.
  • optical modules are pre-assembled and pre-aligned to an appropriate reference with respect to the registration features on the module such that during assembly of optical circuit 10 by pick and place machine 2, a final optical circuit is fabricated by simply mounting prealigned optical modules on the reference substrate.
  • Optical modules can include, but are not limited to, fiber modules, lens modules, laser modules, filter modules, waveguide modules, detector modules, etc.
  • fixed reference 20 is illustrated as a planar substrate which can be ⁇ thought of (and is referred to herein in some instances) as an optical circuit board which receives parts such as optical modules, optical components, opto-electronic components, and electronic components to form an optical circuit.
  • Figure 5 is a front plan view of fiber module 12 showing optical component mount 16 adjacent base mounting plate 18.
  • either component mount 16 and base mounting plate 18 may be manipulated through up to six degrees of freedom as illustrated by the axes labeled X, Y, ⁇ x , ⁇ y , and ⁇ z in Figure 5 along with another Z axis which is not shown and is perpendicular to a plane of the Figure. This manipulation can be achieved because there is a gap 32 between mount 16 and plate 18. For some optical components, all six degrees of freedom may ' not be required for proper alignment and fewer degrees of freedom can be provided.
  • Figure 5 also illustrates example registration features 50.
  • each registration feature 50 is a protrusion that is configured to mate with fixed reference 20 as discussed below.
  • Figure 5 also ' shows a component registration feature 60 formed in lower component mount 26 and a component registration feature 62 in upper component mount 24.
  • component registration features 60 and 62 comprise V-grooves that are configured to receive an optical component such as optical component 14.
  • the optical component 14 can be coupled to the optical component mount using, for example, an adhesive or solder.
  • Optical component 14 is preferably fixed to component mount 16 to maintain alignment relative to registration features 50 of relative reference mount 18.
  • Figure 6 is a top plan view of fixed reference 20 configured to receive optical modules 12A and 12B shown in Figure 4.
  • Registration features 70A and 70B are provided to receive registration features 50 on respective optical modules 12A and 12B.
  • features 70 are precisely defined V-grooves configured to register the mesa registration features 50 shown in Figure 5.
  • the dashed outlines indicate the placement of fiber modules 12A and 12B.
  • This configuration provides an example of a kinematic-type registration or alignment technique.
  • One example kinematic technique is described in U.S. Patent No. 5,748,827, entitled “TWO-STAGE KINEMATIC MOUNT". Any appropriate registration or alignment technique can be used, however, preferably the registration technique should be accurate and provide high repeatability.
  • the technique passively aligns the module ( hich contains a prealigned mount component) to the circuit board. Because an active alignment has been previously performed on the optical component, the pick and place machine can use passive alignment to place the module which simplifies the assembly process and allows for increased assembly speed.
  • a heat activated material 72 such as solder is provided which can be heated to rapidly and fixedly adhere the modules ' to the reference substrate.
  • contact pads 74 electrically couple to heaters 79 that are used to heat solder 72.
  • material 72 is preferably aligned with pads on the bottom of base mounting plates 18. These pads comprise a metal ' to which solder will strongly adhere. The solder can also ' ' provide electrical connections .
  • the bonding pads on the bottom of base mounting plate 18 may also include integral heating elements and electrical contact pads may be provided to energize these heating elements. A reduction in the bonding time may be obtained by heating both bonding pads and bonding material " 72.
  • bonding material 72 comprises solder
  • pads on the bottom of base mounting plate 18 may also be pre-tinned with a thin layer of solder.
  • Component 14 can be any type of optical, opto-electrical or ⁇ pto-mechanical element including active or passive elements.
  • optical element 14 is shown as an optical fiber.
  • Figure 7 is a front plan view showing lens 90 held in component mount 16 which coupled to base mounting plate 18. Lens 90 is registered with a registration groove 60. Additional support bonding material 92 is provided to secure lens 90 to component mount 16. This can be an adhesive, solder or other bonding material.
  • Lens module 12 may be prealigned so that parameters such as the back focal position and optical axis of lens 90 are located precisely with respect to registration features 50.
  • the optical modules set forth herein are provided as examples and the invention is not limited to any specific type of module or configuration.
  • Figure 8 shows a front elevational view of an example placement, head 8 from Figure 3.
  • Placement head 8 includes mounting plate 9 that can translate along rails 95A and 95B.
  • Mechanical gripper 81 . used to pick and place parts, may be actuated in the Z and ⁇ z directions by articulator 80.
  • Vacuum nozzle 83 also used to pick and place parts, may be actuated in the Z and ⁇ z directions by articulator 82.
  • Adhesive dispensing nozzle 85 may be actuated in the Z and ⁇ z directions by articulator- and pump. 84.
  • Adhesive dispensing nozzle 85 may be used for a variety of operations.
  • These operations include, but are not limited to, securing optical modules to the optical circuit board, dispensing optical index matching adhesive between optical modules to increase light coupling and reduce reflections, dispensing conductive epoxy or solder paste to secure parts and route electrical signals, encapsulating all or portions of an optical circuit, dispensing flux, or bonding electrical components such as packaged integrated circuits, integrated circuit die, resistors, and capacitors to the optical circuit board or optical module.
  • Additional adhesive dispensers 85 and articulator/pumps 84 may be included on placement head 8 as required.
  • Electrical contact probe 87 which may be actuated in the Z and ⁇ 2 directions by articulator 86, is used . to supply electrical current to electrical heater contact pads on the optical circuit board, the optical module, or both in order to rapidly secure optical modules to the optical circuit board.
  • Contact probe 87 may also be used to supply, electrical signals to the optical circuit board to perform functional tests and may also be used to verify proper seating of optical modules onto fixed references.
  • Figure 8 also shows placement head camera 94, lens 96, and illumination system 98. As stated above, images from placement head camera 94 are used to accurately calculate the position of critical features on parts such as optical components, prealigned optical modules, optical circuit boards, opto-electronic components, electrical components, assembly trays, and fiber cassettes.
  • This positional information is also used to accurately find adhesive dispensing locations as well as locating electrical heater contact pads.
  • images from placement head camera 94 can be used to accurately locate registration features on an optical circuit board so that proper, mating with the registration features of optical modules is obtained.
  • Placement head camera 94 may be of the area array or linescan array type, or other imaging technique that provides positional feedback.
  • Illumination system 98 may provide many types of illumination such as specular, diffuse, or darkfield.
  • the illuminator may also be divided into independent sections such that the angle of illumination may be controlled in both the azimuthal and altitudinal directions.
  • Various wavelengths and/or polarization control of light may also be employed by illuminator 98 in order to obtain proper feature contrast.
  • Illumination system 98 may also be strobed in order quickly acquire images or to "freeze" the effects of any motion.
  • delivery fiber 88 to deliver radiation, such as UV light, which is used to cure- light sensitive adhesives.
  • the radiation source is not shown and delivery fiber 88 can emit in any range of wavelength depending on the adhesive curing requirements.
  • An additional radiation source such as a laser or other infrared source, may also be supplied to heat bonding pads of the optical circuit board and optical module.
  • a laser source could also be supplied to melt solder.
  • a vacuum gripper assembly 280 is also shown in figure 8 coupled to articulator 91. Assembly 280 is used to grip cassettes as explained below in connection with Figures 13-17.
  • placement head 8 may be configured with a plurality of vacuum nozzles 83 and corresponding articulators 82 with no gripper 81 and corresponding articulator 80.
  • placement head 8 may advantageously employ a bar code reader in order to read bar codes from optical modules, optical circuit boards, and other components.
  • the bar code data could be captured into a database in order to track statistical process data such as yield information versus component lot numbers.
  • Another variation includes the use of multiple cameras on placement head 8 with different fields of view and resolutions. High resolution cameras can accurately locate small, critical features, whereas large field of view cameras can measure larger features.
  • images from camera and illumination system 54 are used to accurately locate critical features such as registration features 50 of optical module 12 on parts such as optical components, prealigned optical modules, optical circuit boards, opto-electronic components, and electrical components after they have been picked up by gripper 81 or vacuum nozzle 83 and prior to placement on the optical circuit board.
  • Camera and illumination system 54 may provide many types of illumination such as specular, diffuse, or darkfield.
  • the illuminator may also be divided into independent sections such that -the angle of illumination may be controlled in both the azimuthal and al.titudinal directions.
  • Camera and illumination system 54 may also be employed by camera and illumination system 54 in order to obtain proper feature contrast.
  • Camera and illumination system 54 may also be strobed in order quickly acquire images or to "freeze" the effects of any motion.
  • the electronic imager in camera and illumination system 54 may be of the area array or linear array types.
  • automatic tool changer 66 that is adapted to automatically supply a plurality of grippers, vacuum nozzles, or electrical contact probes to placement head 8. These additional grippers, nozzles, and electrical contact probes may be required depending on the physical geometry of the parts or optical circuit board. .
  • Figure 3 also shows inspection units 58 and 63. These may be used to perform final functional tests such as insertion loss, return loss, and wavelength accuracy. Inspection units 58 and 63 are aligned to optical circuits on assembly tray 36 using linear motors 56 and 64, -respectively.
  • This laminar air flow source provides a constant flow of clean air flowing in the assembly area of pick and place machine 2 so that contaminants do not settle into the registration features of either the optical circuit boards or optical modules.
  • the clean laminar air flow also prevents sensitive optical surfaces from becoming contaminated.
  • pick and place machine 2 assembles optical circuits in the following manner.
  • Placement head 8 is positioned over an optical circuit board. Either a part tray or a reel feeder may present the optical circuit board.
  • An image of the optical circuit board is then captured by placement head camera 94 so that the proper pick up location of the optical circuit board may be calculated by a controller.
  • Placement head 8 picks up the optical ' circuit board and presents it to camera and illumination system 54. The image from system 54 is used to calculate the location of critical features such as registration features.
  • Placement head 8 is then positioned . over assembly tray 36.
  • An image of assembly tray 36 is captured by placement head camera 94 so that the proper placement location of the optical circuit board onto assembly tray 36 may be calculated by a controller.
  • the optical circuit board is then placed onto assembly tray 36.
  • Placement head 8 is then positioned over an optical module, optical component, opto-electronic component, or an electronic component. A part tray, reel feeder, or other feeder mechanism may present these components. An image of the component is then captured by placement head camera 94 so that the proper pick up location of component may be calculated by a controller. Placement head 8 then picks up the component and presents it to camera and illumination system 54. The image from camera and illumination system 54 is used to calculate locations of critical component features such as optical module registration features. Placement head 8 is then positioned over the optical circuit board. An image of the optical circuit board is captured by placement head camera 94 so that the proper placement location of the component onto the optical circuit may be calculated by a controller. . The component is then placed on the optical circuit board.
  • contact probes 87 are engaged with optical module contact pads in order to heat the solder and rapidly secure the optical module to the optical circuit board.
  • a local atmosphere of gas such as nitrogen or forming gas • (nitrogen with a small percentage of hydrogen)
  • nitrogen or forming gas • nitrogen with a small percentage of hydrogen
  • adhesive may be dispensed onto the optical circuit board in order to attach the optical module. Other securing methods are also possible.
  • optical circuit board The process of placing components onto the optical circuit board continues until the optical circuit board is fully populated and all components are secured. Additional adhesive such as a refractive index matching material can be dispensed as appropriate. " All or portions of the optical circuit can be encapsulated by epoxy. Radiation from fiber delivery system 88 can be used to cure the adhesives.
  • Figure 9 is cross-sectional view 9-9 from Figure 6 of optical circuit 10.
  • the dashed area indicates the region of one set of mating features between fiber module 12 and optical circuit board 20.
  • Figures 10A, 10B, and 10C, which are enlarged areas of the dashed area in Figure 9 show how the mating process works during different time phases of the placement of optical module 12 onto optical circuit board 20.
  • Vacuum nozzle 83 is adapted to have retractable push rod 89.
  • Push rod 89 is retracted up into vacuum nozzle 83 during the pick up of an optical module and during the initial placement of the optical module.
  • mesa feature 50 reaches the point of contact shown in Figure 10B
  • motion of articulator 82 is stopped and vacuum to nozzle 83 is shut off.
  • Push rod 89 is then lowered and pushes the optical module down. Due to the rounded tip of push rod 89, the- optical module may slip laterally and/or at an angle in order to fully seat as shown in Figure IOC.
  • This gripper design also works with other types of kinematic-style mounting structures.
  • the compliance wrist or vacuum ' gripper provide a gripper in which the compliance can be controlled.
  • the gripper should provide compliance to allow the passive alignment of the element.
  • a brake or other securing element can be used to fix a compliance wrist to provide controllable compliance.
  • controllable compliance can be obtained by releasing or reducing the vacuum.
  • FIG. 12 is a top plan view of laser transmitter 200.
  • Constituent components include optical circuit board 202, laser module 204, lens module 206, fiber module 208, modulator IC 212, and discrete electrical components 216 and 218.
  • Fiber cartridge or cassette 210, in which a spool of optical fiber is wound, is shown in Figure 12 and is a convenient device for pick and place machine 2 to manipulate long lengths of optical fiber.
  • Figure 13 is a top plan view showing one specific embodiment of the present invention for use in manipulating optical modules which are coupled to long fiber optic "pigtails.”
  • Figure .13 is a top plan view showing a carrier or assembly tray 240 that contains ' fiber cassettes 242A and 242B.
  • Fiber cassettes 242A and 242B carry spools of fiber 244A and 244B.
  • Each fiber 244A and 244B is coupled to a respective optical module 246A and 246B such as those discussed above.
  • optical module configurations can also be used. These modules are prealigned and, in combination with the cassette, are well suited for automated assembly processes.
  • the optical modules 246A and 246B are supported in respective cradles 248A and 248B. During automated assembly, the optical modules 246A,B can be gripped by gripping cradles 248A,B which are themselves loosely coupled to the fiber cassettes 242A,B, respectively. In Figure 13, the two optical modules 246A and 246B are shown in an assembled positioned in which they form an optical device. The opposed ends of the optical fibers 244A and 244B can carry additional optical modules 250A and 250B in cradles 252A and 252B, respectively.
  • Figure 14 is a cutaway perspective view showing cradle 248 in greater ' detail carrying prealigned optical module 246.
  • the cradle 248 "floats" in the fiber cassette 242 to provide sufficient freedom of movement of. module 246 when mounted onto the fixed reference.
  • the cradle 248 is loosely coupled to cassette 242 such that the cradle is allowed limited relative movement. Further, this configuration allows the cassette 242 to be picked up without requiring separate support to cradle 248 and optical module 246.
  • Figure 15 is a top plan cutaway view and Figure 16 is a side perspective floated cutaway view of optical modules 246A, B * positioned over fixed reference 260 and held in cradles 248A, 248B, respectively.
  • Fixed reference 260 is aligned by registration features 262 in carrier 240.
  • An opening 264 can be used to apply a vacuum to the fixed reference 260 during the assembly process to thereby secure the fixed reference 260.
  • the pick and place machine can include electrical contacts for coupling to contacts on fixed reference to thereby melt solder to bond the prealigned optical modules to the fixed reference 260.
  • FIG 17 is a perspective view of cassette 242 secured in a specific example vacuum gripper assembly 280 which is one example of interchangeable gripper such as those illustrated in Figure 8.
  • Vacuum gripper assembly 280 includes a main axis 282 having a vacuum conduit 284 formed therethrough.
  • a lateral projection 286 to the side of main axis 282 provides a vacuum connection to primary cradle nozzle 288, cassette vacuum cup 290 and the remote nozzle 292.
  • Cradle nozzle 288 is configured to couple to cradle 248 through application of a vacuum through vacuum conduit 284. Nozzle 288 may itself provide some compliance.
  • Cassette vacuum cup 290 is configured to support cassette 242 through a vacuum connection at a center . of cassette 242.
  • secondary cradle vacuum nozzle 292 is configured to grasp cradle 252.
  • Accurate alignment and placement of module 250 is not typically required.
  • Module 250 can be used to align or test module 246 by providing an optical input to one module and observing an output .
  • Assembly 280 is one example of a three point, connection to a fiber/optical module assembly in accordance with one aspect of the invention. In so e embodiments a single nozzle or two nozzles are employed. Assembly 280 allows the pick and place machine to position a module 246 and the associated optical fiber 244 during fabrication of an optical device. Assembly 280 can be one of the tools illustrated in Figure 8 and selectively used by the pick and place machine.
  • Figures 13-16 illustrate one specific embodiment of the present invention and the invention is intended to include broader aspects and should not be limited to this specific embodiment.
  • the present invention includes a pick and place machine that holds a prealigned optical module.
  • the invention includes a pick and place machine that holds an optical module, either prealigned or not prealigned, along with a fiber pigtail that couples to the module.
  • the coupling to the module and fiber can be at one point, two locations, or more locations.
  • a cassette carries the fiber and the pick and place machine grasps the cassette.
  • the pick and place machine can allow limited relative movement of the optical module, for example, through the configuration of the gripper or nozzle that grasps the module and/or the cradle which carries the module.
  • the kinematic registrations features of the optical module and the optical circuit board are designed to constrain the optical module in one or more of the 6 degrees of freedom, X, Y, Z, ⁇ x , ⁇ ⁇ and ⁇ z , once it is placed on the optical circuit board.
  • the kinematic registration features allow sub-micron precision alignment between the optical module and the optical circuit board.
  • the pick and place robot may not have the accuracy to directly place the optical module onto the optical circuit board and have the registration features align to sub-micron precision. Therefore, the gripper, or end effector, that places the pre-aligned optical modules should be compliant in order for ' the registration features of the optical module to mate properly with the registration features of the optical circuit board.
  • FIG. 18 is a block diagram showing one example sequence of steps in accordance with the present invention.
  • Block diagram 300 is an example of a sequence of steps in accordance with the present invention.
  • an assembly tray is loaded and its reference frame is established at block 304.
  • this can be using a camera imaging system or other appropriate technique.
  • an optical circuit board is grasped using an appropriate gripper. 'The gripper can be changed as necessary. The gripper is placed over the circuit board and its position and orientation can be identified using imaging techniques . An optional serial number can also be recorded. At block 308, the optical circuit board is placed onto the assembly tray and can be clamped using a suitable method such as a vacuum.
  • control is passed to block 312 if a securing adhesive is required. If not, control is passed directly to block 314 which determines whether solder paste is required for the component. The solder can be for securing or to provide an electrical connection. If so, solder paste is dispensed at block 316. If ' no solder paste is required, control is passed directly to block 318 and a component that may include an optical module is grasped. The appropriate gripper is selected for grasping the component. The gripper is positioned over the component and the component's orientation is determined using appropriate imaging techniques. Again, an optional serial number from the component can be recorded.
  • the component is placed at the proper location on the circuit board.
  • the orientation of the component is identified using visual reference features carried on the component.
  • An upward looking camera or other imaging technique can be used.
  • the optical module is secured at block 322, for example using solder or other adhering or securing technique.
  • the tools used by the pick and place machine can be changed as necessary, for example, to electrically contact and heat solder carried on the components or on an optical circuit board.
  • a determination is made whether all components have been placed. If there are additional components, control is passed to block 318. If not, control is passed to block 326 where a determination is made if additional adhesive is required.
  • additional adhesive dispense is required.
  • Additional adhesive can be used for matching the optical index between adjacent components, providing component encapsulation and securing a component.
  • a curing step can be used in which radiation or heat is applied to adhere the adhesive.
  • the device is then tested, as desired, at block 330 to determine its operating characteristics.
  • control is passed to block 306. ' Completed trays can be moved off the machine, for example, by a conveyor at block 334.
  • Figure 19 is a simplified block diagram showing a cassette and cradle assembly 360.
  • Figure 19 is intended to illustrate broad aspects of the invention and shows a prealigned optical module 362 held in a cradle 364 of assembly 360.
  • the cradle 364 is secured to cassette 366.
  • the securing is preferably through a ' technique that allows limited relative movement, with at least one degree of freedom, between cradle 364 and cassette 366. This allows cradle 364 to be manipulated to align and place optical module 362 without disturbing or moving cassette 366.
  • Figure 20 shows another example ' fiber component mount 16 to facilitate manipulation of optical modules without a separate cassette mechanism. Fiber 14 and distal fiber end 19 are captured between top holder 24 and bottom holder 26.
  • a distal end gripper 132 may be optionally used to support the fiber loop during manipulation of the optical module.
  • distal fiber end 19 may be cut or clipped from component mount 16. Fiber 14 may then be fusion spliced to another fiber, a connector may be added, or it may be connected to another optical device.
  • figure 21 is a cross-sectional view of mesa reference feature 50 being inserted into v-groove 70. Electrical traces 71 extend partially into v-grooves 70. Electrical traces 71 connect to contact pads not shown. Electrical trace 73 is deposited in the bottom of v- groove 70 and electrical trace 51 is deposited onto mesa registration feature 50. When registration feature 50 is seated properly into v-groove 70, a continuous , electrical connection is established between electrical traces 71 through electrical traces 51 and 73. If registration feature 50 does not seat properly into v-groove 70, there will be * an open circuit between electrical traces 71.
  • the contact pads connected to electrical traces 71 may be monitored, for example by contact probe 87, for . electrical continuity during the mounting of optical module 12 onto fixed reference 20 to verify proper mating.
  • Other configurations of registration features, electrical contact pads, and traces are possible to verify proper mating of optical module 12 and fixed reference 20 and the example shown in figure 21 is only illustrative of one configuration.
  • the present invention uses a surface mount approach of placing an optical module onto an optical circuit board from above.
  • the robot end effector should apply a small, stiff force in the downward or Z direction to mate the optical module with the optical circuit board.
  • the end effector should be compliant in the other five degrees of freedom X, Y, ⁇ x , ⁇ ⁇ and ⁇ z , in order to allow the registration features to guide the optical module into alignment with the optical circuit board.
  • the nozzle of- Figure 11 has compliance in all degrees of freedom except the Z direction. It is also desirable to have the downward Z force be small when the registration features are made of brittle or fragile materials such as silicon, glass, or ceramic.
  • compliant wrists allow compliance in the X, Y, and ⁇ z , directions while the lateral alignment devices allow ' compliance ' in the X and Y directions.
  • a pick and place machine which is adapted for high speed, automated assembly of opto-electronic circuits.
  • Mating registration features on optical modules and optical circuit boards easily facilitate sub-micron mechanical and optical alignment.
  • a wide variety of high performance optical circuits may be assembled by mounting optical modules and other components onto appropriately configured optical circuit boards. Using prealigned optical modules with registration features greatly relaxes the positional accuracy requirements of the optical circuit pick and place machine.
  • a Cartesian pick and place machine is illustrated, any configuration can be used including a SCARA configuration, or other configurations or their combinations. Multiple placement heads can also be used.
  • the pick and place machine of the invention can be used to place optical, electro-optical or electrical components. During or following the mounting of an optical module or a number of optical modules onto the fixed reference, the operation and/or alignment of the module (s) can be inspected.
  • the inspection can be using a camera or other viewing device or through an active inspection in which the optical module (s) is operated and its output observed. This can be used to aid in the alignment and for quality control. This can be through the use of a functional inspection module that may contain an optical sensor, electrical measurement devices, optical sources, electrical sources, or other circuitry or optics that are used to inspect and measure ' the functional operation of the optical module .

Abstract

L'invention concerne un procédé et un appareil d'assemblage automatique d'un dispositif optique (118). Des modules optiques pré-alignés (112) sont montés par une machine (110) de transfert sur une référence fixe (114).
PCT/US2002/005498 2001-02-20 2002-02-20 Machine de transfert de circuit optique WO2002067034A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2002306580A AU2002306580A1 (en) 2001-02-20 2002-02-20 Optical circuit pick and place machine
US10/098,743 US20020168147A1 (en) 2001-02-20 2002-03-15 Optical circuit pick and place machine
US10/099,907 US20020154870A1 (en) 2001-02-20 2002-03-15 Optical module with heat dissipation

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
US09/789,124 2001-02-20
US09/789,125 2001-02-20
US09/789,185 US6443631B1 (en) 2001-02-20 2001-02-20 Optical module with solder bond
US09/789,125 US6546173B2 (en) 2001-02-20 2001-02-20 Optical module
US09/789,124 US6546172B2 (en) 2001-02-20 2001-02-20 Optical device
US09/789,185 2001-02-20
US09/789,317 2001-02-20
US09/789,317 US6590658B2 (en) 2001-02-20 2001-02-20 Optical alignment system
US27633501P 2001-03-16 2001-03-16
US27633601P 2001-03-16 2001-03-16
US27632301P 2001-03-16 2001-03-16
US60/276,335 2001-03-16
US60/276,323 2001-03-16
US60/276,336 2001-03-16
US28816901P 2001-05-02 2001-05-02
US60/288,169 2001-05-02
US09/920,366 US6956999B2 (en) 2001-02-20 2001-08-01 Optical device
US09/920,366 2001-08-01
US31839901P 2001-09-10 2001-09-10
US60/318,399 2001-09-10
US34011401P 2001-12-14 2001-12-14
US60/340,114 2001-12-14

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10/098,743 Continuation-In-Part US20020168147A1 (en) 2001-02-20 2002-03-15 Optical circuit pick and place machine
US10/099,907 Continuation-In-Part US20020154870A1 (en) 2001-02-20 2002-03-15 Optical module with heat dissipation

Publications (2)

Publication Number Publication Date
WO2002067034A2 true WO2002067034A2 (fr) 2002-08-29
WO2002067034A3 WO2002067034A3 (fr) 2003-10-30

Family

ID=27582758

Family Applications (4)

Application Number Title Priority Date Filing Date
PCT/US2002/005498 WO2002067034A2 (fr) 2001-02-20 2002-02-20 Machine de transfert de circuit optique
PCT/US2002/005268 WO2002067032A2 (fr) 2001-02-20 2002-02-20 Systeme d'alignement optique
PCT/US2002/005497 WO2002067033A2 (fr) 2001-02-20 2002-02-20 Module optique
PCT/US2002/005412 WO2002075415A2 (fr) 2001-02-20 2002-02-20 Dispositif optique

Family Applications After (3)

Application Number Title Priority Date Filing Date
PCT/US2002/005268 WO2002067032A2 (fr) 2001-02-20 2002-02-20 Systeme d'alignement optique
PCT/US2002/005497 WO2002067033A2 (fr) 2001-02-20 2002-02-20 Module optique
PCT/US2002/005412 WO2002075415A2 (fr) 2001-02-20 2002-02-20 Dispositif optique

Country Status (4)

Country Link
CN (2) CN1259585C (fr)
AU (2) AU2002306580A1 (fr)
GB (2) GB2390174B (fr)
WO (4) WO2002067034A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021097488A1 (fr) * 2019-11-12 2021-05-20 Bright Machines, Inc. Système d'insertion de module pour assemblage robotique

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007076888A1 (fr) * 2005-12-30 2007-07-12 Fci Dispositif de couplage optique
CN102969644A (zh) * 2011-08-29 2013-03-13 华新丽华股份有限公司 对位结构、激光光源模块及光学对位方法
US9983371B2 (en) * 2016-03-08 2018-05-29 Mellanox Technologies, Ltd. Optoelectronic transducer with integrally mounted thermoelectric cooler

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0600645A1 (fr) * 1992-11-30 1994-06-08 AT&T Corp. Boîtier optique singulier en ligne
EP0903600A1 (fr) * 1997-09-19 1999-03-24 Nec Corporation Panneau de montage d'un dispositif optique

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0600645A1 (fr) * 1992-11-30 1994-06-08 AT&T Corp. Boîtier optique singulier en ligne
EP0903600A1 (fr) * 1997-09-19 1999-03-24 Nec Corporation Panneau de montage d'un dispositif optique

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KOSHOUBU N ET AL: "ADVANCED FLIP CHIP BONDING TECHNIQUES USING TRANSFERRED MICROSOLDERBUMPS" 1999 PROCEEDINGS 49TH. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. ECTC 1999. SAN DIEGO, CA, JUNE 1 - 4, 1999, PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, NEW YORK, NY: IEEE, US, 1 June 1999 (1999-06-01), pages 272-277, XP000903804 ISBN: 0-7803-5232-7 *
SASAKI J ET AL: "HYBRID INTEGRATED 4*4 OPTICAL MATRIX SWITCH USING SELF-ALIGNED SEMICONDUCTOR OPTICAL AMPLIFIER GATE ARRAYS AND SILICA PLANAR LIGHTWAVE CIRCUIT" ELECTRONICS LETTERS, IEE STEVENAGE, GB, vol. 34, no. 10, 14 May 1998 (1998-05-14), pages 986-987, XP000846136 ISSN: 0013-5194 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021097488A1 (fr) * 2019-11-12 2021-05-20 Bright Machines, Inc. Système d'insertion de module pour assemblage robotique

Also Published As

Publication number Publication date
WO2002067033A2 (fr) 2002-08-29
GB0319380D0 (en) 2003-09-17
WO2002067034A3 (fr) 2003-10-30
AU2002306579A1 (en) 2002-09-04
CN1259585C (zh) 2006-06-14
WO2002075415A2 (fr) 2002-09-26
CN1493013A (zh) 2004-04-28
WO2002075415A3 (fr) 2003-08-07
GB2390174B (en) 2004-06-09
WO2002067032A3 (fr) 2003-08-21
GB2387923A (en) 2003-10-29
GB0319381D0 (en) 2003-09-17
WO2002067033A3 (fr) 2003-10-30
CN1220086C (zh) 2005-09-21
AU2002306580A1 (en) 2002-09-04
WO2002067032A2 (fr) 2002-08-29
CN1502054A (zh) 2004-06-02
GB2390174A (en) 2003-12-31
GB2387923B (en) 2004-06-02

Similar Documents

Publication Publication Date Title
US20020168147A1 (en) Optical circuit pick and place machine
US6590658B2 (en) Optical alignment system
RU2745381C2 (ru) Оптическая юстировка оптической подсистемы по отношению к оптоэлектронному прибору
US7369334B2 (en) Optical device with alignment compensation
US5745624A (en) Automatic alignment and locking method and apparatus for fiber optic module manufacturing
US6974168B2 (en) System and method for performing simultaneous precision die bond of photonic components onto a single substrate
US5857047A (en) Automated fiber pigtailing machine
JP2002534710A (ja) 統合されたマイクロ電子機械的アライメントおよびロッキング装置、ならびに光ファイバモジュールの製造方法
US9323009B2 (en) Computer program product for electro-optical assembly
US6471419B1 (en) Fiber optic assembly
US20020062170A1 (en) Automated opto-electronic assembly machine and method
US6896422B2 (en) Optoelectronic modules and methods of manufacturing the same
US6690864B1 (en) System and method for installation and alignment of optical fiber
WO2002067034A2 (fr) Machine de transfert de circuit optique
CA2187961A1 (fr) Methode et appareil d'alignement et de collage
US6907178B2 (en) Optoelectronic assembly with embedded optical and electrical components
JPH08201650A (ja) 光基板の端面の平行度の調整装置
CN116224504A (zh) 一种用于硅光子芯片的光封装平台和方法
van Gastel et al. A concept for accurate edge-coupled multi-fiber photonic interconnects
JPH01241504A (ja) 複合光デバイスの組立方法
US6550984B2 (en) Integrated optical component with photodetector for automated manufacturing platform
US20220105695A1 (en) Assembly of flexible optical waveguides and photonic chips for optical interconnection packaging
JP3196062B2 (ja) 光ファイバカセットおよび光ファイバブロック組立装置
JPH09131624A (ja) 自動薄片挿入装置及び方法
Hall et al. Assembly of laser-fiber arrays

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase in:

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP