WO2002075415A2 - Dispositif optique - Google Patents

Dispositif optique Download PDF

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Publication number
WO2002075415A2
WO2002075415A2 PCT/US2002/005412 US0205412W WO02075415A2 WO 2002075415 A2 WO2002075415 A2 WO 2002075415A2 US 0205412 W US0205412 W US 0205412W WO 02075415 A2 WO02075415 A2 WO 02075415A2
Authority
WO
WIPO (PCT)
Prior art keywords
optical
optical device
substrate
mount
relative
Prior art date
Application number
PCT/US2002/005412
Other languages
English (en)
Other versions
WO2002075415A3 (fr
Inventor
Steven K. Case
Gregory S. Mowry
Timothy A. Skunes
Patrick J. Garfield
John T. Mcelreath
Craig D. Knighton
Gary A. Lenz
Mark L. Wilson
Original Assignee
Cyberoptics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/789,125 external-priority patent/US6546173B2/en
Priority claimed from US09/789,124 external-priority patent/US6546172B2/en
Priority claimed from US09/789,185 external-priority patent/US6443631B1/en
Priority claimed from US09/789,317 external-priority patent/US6590658B2/en
Priority claimed from US09/920,366 external-priority patent/US6956999B2/en
Application filed by Cyberoptics Corporation filed Critical Cyberoptics Corporation
Priority to AU2002240468A priority Critical patent/AU2002240468A1/en
Priority to GB0319380A priority patent/GB2387923B/en
Priority to US10/099,907 priority patent/US20020154870A1/en
Priority to US10/098,743 priority patent/US20020168147A1/en
Publication of WO2002075415A2 publication Critical patent/WO2002075415A2/fr
Publication of WO2002075415A3 publication Critical patent/WO2002075415A3/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2553—Splicing machines, e.g. optical fibre fusion splicer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2555—Alignment or adjustment devices for aligning prior to splicing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4227—Active alignment methods, e.g. procedures and algorithms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3616—Holders, macro size fixtures for mechanically holding or positioning fibres, e.g. on an optical bench
    • G02B6/362—Vacuum holders for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3834—Means for centering or aligning the light guide within the ferrule
    • G02B6/3838—Means for centering or aligning the light guide within the ferrule using grooves for light guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material

Definitions

  • the present invention relates to optical components and optical devices fabricated from such components. More specifically, the present invention relates to an optical device formed by a plurality of optical modules which carry optical, optical-electrical or optical-mechanic components.
  • Optical devices are being increasingly used in various industries and technologies in order to provide high speed data transfer such as a fiber optic communication equipment. In many applications there is a transition or an incorporation of optical devices where previously only electrical devices were employed.
  • An optical device typically consists of a number . of components which must be precisely assembled and aligned for the device to operate and function efficiently.
  • Example components include fibers, waveguides, lasers, modulators, detectors, gratings, optical amplifiers, lenses, mirrors, prisms, windows, etc.
  • optical devices such as those used in fiber optic telecommunications, data storage and retrieval, optical inspection, etc. have had little commonality in packaging and assembly methods. This limits the applicability of automation equipment for automating the manufacture of these devices since there is such a disparity in the device designs. To affect high volume automated manufacturing of such devices, parts of each individual manufacturing line have to be custom-designed.
  • Typical single mode optical fibers used in telecommunications for the 1.3 ⁇ m to 1.6 ⁇ m wavelength range have an effective core diameter of about 9 microns and an outside cladding dimension of 125 microns.
  • the typical tolerance for . the concentricity of the core to the outside diameter of the cladding is 1 micron.
  • an optical device which comprises a plurality of optical modules.
  • Each optical module includes an optical component to operably couple to a relative reference mount.
  • the relative reference is configured to couple to a fixed reference mount.
  • a plurality of optical modules mounted on the fixed reference mount form the optical device.
  • Figure 1 is a perspective view of an optical device in accordance with one example embodiment of the present invention.
  • Figure 2A is a exploded perspective view of an optical module shown in Figure 1.
  • Figure 2B is a bottom plan view of a component mount.
  • Figure 3 is a front plan view of an optical module of Figure 1.
  • Figure 4 is a bottom plan view of the optical module of Figure 1.
  • Figure 5 is a top plan view of a fixed reference mount shown in Figure 1.
  • Figure 6 is a cross-sectional view of the optical module of Figure 4 taken along the line labeled 6—6.
  • Figure 7A is a cross-sectional view of registration features used to register the relative reference mount with a fixed reference mount shown in Figure 1.
  • Figure 7B is an exploded cross-sectional view of the registration features.
  • Figure 8A is a perspective view showing bonding material used with the present invention.
  • Figure 8B is a side cross-sectional view showing the bonding material of Figure 8A.
  • Figure 8C is an enlarged view of the bonding material.
  • Figure 8D is an enlarged view of the bonding material which illustrates deformation of the material after heating.
  • Figure 9 is a perspective view showing an optical module of the present invention which includes a Gradient Index (GRIN) lens.
  • GRIN Gradient Index
  • Figure 10 is a front plan view of the optical module of Figure 9.
  • FIG. 11 is a block diagram showing general aspects of the invention.
  • the present invention includes various aspects that reduce or eliminate many of the problems associated with the prior art.
  • the present invention offers an optical device fabricated from optical modules which are prealigned in standardized optical modules.
  • Each optical module can be aligned with sub- micron precision with respect to registration features. Registration features on a module can be aligned with matching features on a substrate. This is similar to mounting an electrical component in or on a printed circuit board.
  • Optical devices can be easily fabricated by mounting prealigned optical modules in the optical "circuit board". The prealignment of the optical module can compensate for variations between components to thereby essentially eliminate the effects of component variability.
  • the prealigned optical modules are well suited for automated fabrication of devices.
  • the modules can be fabricated in silicon using techniques which are well known in the art of silicon processing.
  • any appropriate material can be used. Preferable materials are those which are used with existing electrical or optical components. Further, the invention can be used with active devices such as lasers, modulators, detectors, etc. Electrical conductors can be fabricated on the various layers for coupling to active optical components. Electrical circuitry including analog and digital circuitry can also be fabricated directly on the modules or on the fixed reference mount.
  • the present invention provides an optical device formed from at least two optical modules in which optical components are mounted to optical component mounts.
  • the optical component mount is fixed to a relative reference mount such as a base mounting plate at a desired position and orientation.
  • the relative reference mount is coupled to a fixed reference mount such as a substrate such that the optical component is maintained at a desired position and orientation relative to the fixed reference mount.
  • the optical component can be pre-aligned to a desired spacial reference and orientation by adjusting the optical component mount relative to the reference mount prior to fixing their relative positions. This can be used to provide general component pre-alignment as well as compensate for the variations which can arise between optical components.
  • the following description sets forth a number of specific examples, however, in various aspects, the present invention is not limited to the specific configurations, components or techniques set forth herein.
  • Figure 1 is a perspective view of an optical device 10.
  • Optical device 10 is shown as a simple optical fiber to optical fiber coupler for purposes of illustrating the present invention. However, the invention is applicable to more complex or other optical devices and other types of optical components .
  • the optical device 10 is fabricated from two optical modules 12A and 12B which include respective optical components 14A and 14B illustrated in this specific example as optical fibers. The fibers are mounted to respective optical component mounts 16A and 16B which are positioned and oriented to achieve a desired position and orientation of optical components 14A and 14B relative to base mounting plates 18A and 18B, respectively.
  • a number of specific examples of this coupling are set forth below in more detail, however, other aspects of the invention are not limited to such examples.
  • base mounting plates 18A and 18B comprise substantially planar mating plates.
  • Base mounting plates 18A, 18B are one example of a relative reference mount.
  • the relative reference mount can have any shape or configuration.
  • Base mounting plates 18A and 18B mount to reference substrate 20 such that the optical components 14A and 14B are in substantial alignment.
  • Substrate 20 is one example of a fixed reference mount and any appropriate fixed reference mount with an appropriate shape and configuration can be used.
  • the optical component modules of the present invention can be pre-assembled and prealigned to an appropriate reference such that a final optical device is fabricated by simply mounting the assembled optical modules on the reference substrate.
  • reference substrate 20 is illustrated as a planar substrate which can be thought of as an optical "circuit board" which receives optical modules to form an optical, opto- electrical or opto-mechanical device.
  • Figure 2A is an exploded perspective view of optical module 12.
  • optical component mount or holder 16 comprises upper component mount or holder 24 and lower component mount or holder 26.
  • Figure 2A illustrates one example mounting technique coupling optical component mount 16 to base mounting plate 18.
  • a bonding material 30 is carried on a top surface of base mount plate 18.
  • Material 30 preferably has at least two states. In one state, material 30 does not interfere or- contact mount 16. Then, the optical component mount 16 can be positioned with up to six degrees of freedom relative to the base mounting plate 18. In another state, the material couples mounts 16 and 18 and thereby fixes the relative position therebetween.
  • material 30 comprises a heat or chemically responsive (or activated) material such as solder or other bonding material.
  • the solder can comprise any type of solder including plated solder, solder preforms/ solder balls, solder paste, solder bumps, etc. including those types of solders used in flip chip electronic packages.
  • other materials such as adhesives which dry, chemically react, or are activated by other means or other attachment techniques can be used.
  • the attachment technique allows some relative movement between the optical component mount 16 and the base mounting plate 18 prior to fixedly attaching the two.
  • heating elements see Figure 8B for more detail
  • heating elements are provided which are activated through the application of electrical energy through contact pads 34. This can be by electrically contacting pads 34 and applying a current therethrough.
  • other heating techniques can be used.
  • other techniques to change the state of bonding material can be used such as application of a curing component such as radiation or a chemical.
  • Any appropriate adhesives including brazing, welding, bonding or other technique can be used.
  • the bond can be activated using a technique including exposure to air, heat, chemicals, heat radiation (including light and UV) , etc.
  • Figure 2B is a bottom plan view of optical component mount 16 and lower mount 26 and shows bonding pads 40 which are arranged to mate with material 30 shown in Figure 2A.
  • Pads 40 can comprise, for example, a metal deposited on lower mount 26.
  • bonding pads 40 also include integral heating elements and electrical contact pads are provided to energize the heating elements. A reduction in the bonding time may be obtained by heating both bonding pads 40 and bonding material 30.
  • Figure 3 is a front plan view of optical module 12 showing optical component mount 16 adjacent base mounting plate 18. In the arrangement shown in Figure 3, material 30 is not initially in contact with optical component mount 16. As discussed below, material 30 can be activated to fill or fix the gap 32 between mount 16 and mount 18.
  • mounts 16 and 18 can be used in which there is actual contact between mounts 16 and 18 or material 30 fills gap 32 prior to bonding.
  • either component prior to fixedly adhering mount 16 to mount 18 either component can be manipulated through up to six degrees of freedom as illustrated by the axes labeled X and Y in Figure 3 along with another Z axis which is not shown and is perpendicular to a plane of the Figure, and rotation about the three axes. For some optical components, all six degrees of freedom may not be required for proper alignment and fewer degrees of freedom can be provided.
  • Figure 3
  • each registration feature 50 is a protrusion which is configured to mate with reference substrate 20 as discussed below.
  • Figure 3 also shows a component registration feature 60 formed in lower component mount 26 and a component registration feature 62 in upper component mount 24.
  • component registration features 60 and 62 comprise V-grooves which are configured to receive an optical component such as optical component 14.
  • the optical element 14 can be coupled to the optical component mount using, for example, an adhesive or solder.
  • Optical component 14 is preferably fixed to component mount 16 to maintain alignment relative to registration features 50 of relative reference mount 18.
  • Figure 4 is a bottom plan view of optical module 12 which shows base mounting plate 18 and a portion of lower optical component mount 26 of optical component mount 16. Pads 54 on base mounting plate 18 can bond with bonding material 72.
  • the bottom plan view of Figure 4 illustrates an interface surface 64 of optical component mount 16. Interface surface 64 is an input, output or input/output face for the optical component 14 shown in Figure 3.
  • the interface surfaces of adjacent optical modules are in abutting contact.
  • a refractive index optical matching material fills any gap between adjacent interface faces to provide improved coupling and reduce reflections.
  • the optical matching material may be in a solid, gel or liquid form.
  • interface surface 64 is a plane which forms an angle relative to a plane perpendicular to the direction of propagation of optical fiber 14. For example, this can be eight degrees.
  • An angled surface 64 of the optical component 14 can be preferable because it reduces the amount of reflected light which is coupled back into an optical fiber. If two modules are in close proximity or in abutting contact, the adjacent optical component mount would have a complimentary angle.
  • interface surface 64 can be shaped or formed using an appropriate process such as a lapping process, chemically machining, machining, etc., or an additive process, to achieve the desired configuration.
  • FIG. 5 is a top plan view of reference substrate 20 configured to receive .
  • Registration features 70A and 70B are provided to receive registration features 50 on respective optical modules 12A and 12B.
  • features 70 are precisely defined depressions configured to register the protrusions of registration features 50 shown in Figures 3 or 4. This example embodiment is shown in Figure 7A in more detail.
  • the dashed outlines indicate the placement of base mounting plates 18A and 18B.
  • This configuration provides an example of a kinematic-type registration or alignment technique.
  • One example kinematic technique is described in U.S. Patent No. 5,748,827, entitled “TWO-STAGE KINEMATIC MOUNT". Any appropriate registration or alignment technique can be used, however, preferably the registration technique should be accurate and provide high repeatability.
  • a heat activated material 72 such as solder is provided which can be heated to fixedly adhere the optical modules to the reference substrate.
  • contact pads 74 electrically couple to heaters which are used to heat material 72.
  • Material 72 is preferably aligned with pads 54 shown in Figure 4.
  • pads 54 can be of a material to which material 72 will strongly adhere.
  • pads 54 can comprise a metal to which solder will adhere. Pads used to promote adhesion can have multiple layers. For example, one layer to bond with the bonding material and another layer to bond with the mount, such as mounts 16, 18 or substrate 20. In another aspect, bonding pads 54 on the bottom of base mounting plate 18 may also include integral heating elements and electrical contact pads may be provided to energize these heating elements. A reduction in the bonding time may be obtained by heating both bonding pads and bonding material 72.
  • Figure 6 is a cross-sectional view showing optical module 12 mounted taken along the line labeled 6—6 in Figure 4 and including substrate 20. This view shows the assembled configuration in which the optical module 12 is coupled to the reference substrate 20 and component holder 16 is coupled to base mounting plate 18.
  • Figure 7A is an enlarged cross-sectional and Figure 7B is an enlarged exploded view showing v- groove registration feature 70 and protruding. ⁇ registration feature 50.
  • the relative spacing between plate 18 and substrate 20 can be controlled by adjusting the angle or widths of the walls of v- groove 70 or of protrusion 50. If fabricated in properly oriented, single crystal silicon, the angle is typically fixed by the crystal structure of the- material and the width can be adjusted to control the spacing.
  • the coupling between plate 1'8 and substrate 20 actually occurs at line contact points 76.
  • Figure 8A is a perspective view showing bonding material 30 in greater detail and Figure 8B is a cross-sectional view showing bonding material 30 between lower component mount 26 and mounting plate 18.
  • Bonding material 30 is carried on -heating elements 80 which are electrically coupled to conductors 82.
  • Heating elements 80 can comprise a resistive elements such as a refractory metal or alloy such as tantalum, chromium or nichrome and be configured to melt material 30 when sufficient electrical current is supplied through conductors 82.
  • the cross-sectional view shown in Figure 8B illustrates the configuration near heating element 80.
  • Figure 8B is a diagram of thin film layers and is not to scale and shows features, such as contacts 34 which are remote from the heater element 80 and near the edge of mounting plate 18.
  • Element 80 is shown electrically coupled to contacts 34 through electrical conductors 82.
  • An electrical insulating layer 87 can optionally be positioned between element 80 and material 30 to increase the amount of electrical current flowing through element 80.
  • Additional layer or layers 85 can be deposited on insulator 87 to promote adhesion or provide other characteristics or qualities as desired. This is known in the art of metal deposition as "under-bump metallurgy" (UBM) .
  • UBM under-bump metallurgy
  • Thermal (and/or electrical) isolation layers 89 can also be applied to reduce the transfer of thermal energy to the surrounding components.
  • heating element 80 is designed to operate in a thermally adiabatic regime. As current flows through the heating element 80 and it begins to warm, the thermal energy flows into the bonding material 30.
  • the structure preferably is configured to reduce heat flow into the surrounding areas. This reduces the energy required to activate the bonding material, reduces the heating and setting times and reduces the thermal stress applied to the surrounding material.
  • Element 80 can have any appropriate shape including straight, bifilar, serpentine, etc.
  • Solder provides a bonding material which can be quickly attached (in less than 100 mSec) and allows "reworking" the bond by reheating the solder.
  • the various materials can be selected as desired for the appropriate physical properties.
  • Si0 2 provides good thermal and electrical isolation and is easily processed. Of course, other materials including other oxides or organic films can be used.
  • the electrical isolation layer 87 is preferably relatively thin and provides high thermal conductivity. Silicon nitride is one example material.
  • the conductors 82 can be any conductive material however, preferable materials include those which are easily deposited such as thick refractory metals, gold or aluminum.
  • the material or materials for pads 54 can be any appropriate material that adheres to the bonding material 30. Examples include, gold, nickel, platinum, etc. The thickness of the various layers should also be selected to reduce the thermal load on the heating element.
  • Pad 40 is shown with layers 40A and 40B. Layers 40A can be of a material suitable for bonding to thermal isolation layer 89. For example, Ti if layer 89 is Si0 2 . Layer 40B is configured to bond with bonding material 30 and may be, for example, gold, nickel, platinum, or other materials. Pads 40 can be constructed of a multilayer thin film structure of titanium, nickel, and gold.
  • the titanium is used as an adhesion layer to silicon.
  • nickel is deposited on top of the titanium so that solder will make strong intermetallic bonds with the nickel.
  • gold is deposited on top of the nickel to prevent the nickel from corroding.
  • UBM configurations may also be used depending on the solder alloy and many other considerations.
  • the pads may also be pre-tinned with a thin layer of solder to form intermetallics with the under bump metallurgy prior to securing the components.
  • material 30 comprises a solder formed with a large surface area region 84 and a tapered region 86.
  • surface tension causes the liquid material from tapered region 86 to flow toward large surface area region 84 and cause large surface area region 84 to expand in an upward direction as illustrated in Figure 8D.
  • This configuration is advantageous because it allows the orientation of component mount 16 to be adjusted as desired (through the six degrees of freedom as discussed with respect to Figure 3) without any interference from the bonding material 30. Bonding material only contacts the two surfaces when heat is applied and the material fills the gap between the two components.
  • plate 18 can be securely registered within feature 70 prior to application of the bonding material 72 or actuation of heating elements 80.
  • solder flow technique is described in U.S. Patent No. 5,892,179, entitled “SOLDER BUMPS AND STRUCTURES FOR INTEGRATED REDISTRIBUTION ROUTING CONDUCTORS", issued April 6, 1999.
  • the bonding technique can advantageously use the surface tension developed in the bonding material.
  • the solder or adhesive can be electrically conductive to provide electrical contacts to the optical device between the various layers, or to adjacent electronic circuitry.
  • Thermally conductive materials can be used to help dissipate heat.
  • two bonding materials are used, which can be the same or different and can be applied simultaneously or sequentially. For example, after the solder discussed herein is applied, a second bonding material can fill the gap to provide additional stability. However, shrinkage or other shape changes of the bonding material should be addressed to maintain alignment.
  • roughness or texturing the surfaces using any appropriate technique can be used to promote adhesion of the bonding material.
  • Component 14 can be any type of optical opto-electrical or opto-mechanical element including active or passive elements.
  • optical element 14 is shown as an optical fiber.
  • an optical element 90 is shown which comprises a GRIN lens.
  • Figure 9 is a perspective view showing lens 90 held in component mount 16 which coupled to base mounting plate 18.
  • Figure 10 is a front plan view.
  • Lens 90 is registered with a registration groove 60.
  • Additional support bonding material 92 is provided to secure lens 90 to component mount 16. This can be an adhesive, solder or other bonding material.
  • Figure 11 is a block diagram of an optical device 110 in accordance with the present invention.
  • Optical device 110 includes optical modules 112A and 112B coupled to a fixed reference 114.
  • Figure 11 illustrates the invention in terms of a block diagram and the present invention is not limited to any particular physical implementation.
  • Optical modules 112A and 112B each include optical components 116A and 116B which may be optical, optical-electrical, or optical-mechanical which are fixed to prealignment mounts 118A and 118B, respectively. Each optical component 116A and 116B is prealigned with a reference standard 120 prior to mounting onto fixed reference 114.
  • Reference standard 120 is shown as a block and is intended to illustrate the concept of a standardized reference frame and is not limited to a single physical implementation.
  • the standard 120 may comprise different physical implementations for different types of optical components.
  • an optical component is prealigned in accordance with the reference standard 120, that optical component is aligned such that it will properly optically interact, in a desired manner, with another optical component which has also been prealigned to the same standardized reference frame when those two optical components are placed at predetermined locations in fixed reference 114.
  • the reference standard provides a reference frame through which optical components can be prealigned such that they can optically interact in a desired manner once mounted in the fixed reference.
  • the prealignment can be any type of alignment using any alignment technique.
  • the prealignment of the optical components 116A and 116B to reference standard 120 can occur at a remote location and/or at a different time from the assembly of optical modules 112A and 112B to fixed reference 114.
  • the prealignment of the optical component 116A and 116B to reference standard 120 is through adjustment of the optical components 116A and 116B in prealignment mounts 118A and 118B.
  • the optical component 116A,B prior to mounting the -optical component 116A, 116B to the prealignment mount 118A,B, the optical component 116A,B is allowed six degrees of freedom during the prealignment process. However, the number of degrees of freedom can be any number 1-6.
  • the optical component 116 is fixedly coupled to the respective prealignment mount 118A or 118B using any appropriate mounting technique. If desired, in one embodiment an optical component can be subsequently realigned.
  • the optical modules 112A and 112B are mounted to the fixed reference.
  • the mounting is at predetermined locations 130A and 130B.
  • Predetermined locations 130A and 130B are positioned such that the optical components 116A and 116B, having been prealigned to the reference standard 120, will be aligned in a manner such that one optical component can optically interact with the other optical component.
  • Predetermined locations 130A and 130B can comprise registration features on fixed reference 114.
  • the registration features 130A and 130B are also prealigned such that when an optical module 116A,B is placed at predetermined locations 130A,B it will be aligned in manner such that it will properly interact with the other optical component.
  • prealignment mount couplings 140A, 140B couple respective optical components to prealignment mounts 118A,B to fix the alignment of optical components 116A,B relative to reference standard 120.
  • fixed reference couplings 142A,B couple prealignment mounts 118A,B to the fixed reference 114.
  • fixed reference couplings comprise registration features on mounts 118A,B that mate with registration features on fixed reference 114.
  • the various components can be fabricated using any appropriate technique or material.
  • the depressions or grooves for various registration features are formed by anisotropically etching oriented single-crystal silicon.
  • Protrusions can be formed in an analogous, complimentary manner.
  • the configuration should preferably eliminate or substantially reduce movement in any of the six degrees of freedom. This is required to achieve sub- micron spacial reproducibility between components.
  • a [100] orientation of single crystal silicon allows the formation of such features which can be orientated at 90 degrees to one another.
  • Any appropriate etching or formation technique can be used.
  • One common anisotropic etch technique uses KOH and masking to define the desired features.
  • any appropriate sputtering, plating, evaporation or other fabrication technique can be used.
  • optical modules which can reduce or eliminate the effects of component variability.
  • this is achieved by adjusting the component mount (holder) relative to a registration feature on the base mounting plate.
  • the bonding material fixes the relationship between the component and the registration feature.
  • Precise registration features are provided on the base mounting plate 18 such that it can be inserted into an optical "circuit board" to fabricate devices which comprise multiple optical component modules.
  • the optical modules are well suited for automated assembly of optical devices because they are in standardized packages, prealigned and can be easily mounted on a reference substrate.
  • Optical modules can be manually placed into the optical "circuit board” or the process can be automated.
  • the particular optical modules are preferably standardized to facilitate such automation.
  • this configuration allows assembly of devices in a "top downward” fashion in which optical modules are moved downward into an optical "circuit board” which facilitates process automation. Further, because different modules are fabricated using similar materials, variations due to thermal expansion will affect all modules in a similar way such that the alignment between adjacent modules on the optical "circuit board” is maintained.
  • solder bond can be used advantageously to provide an electrical connection to electrical components on the module.
  • the solder can be heated in any order or combination including simultaneously.
  • the position and sequence of the heating of the solder can be configured to reduce or compensate for deformation in the components including thermal deformation.
  • Solder can also be used advantageously because the solder can be reheated allowing the component to be repositioned, removed, replaced, and/or repaired.
  • the present invention provides an optical device comprising a plurality of optical modules in which optical variations due to component variability are eliminated or significantly reduced. This provides uniformity across multiple optical modules which is particularly desirable for automated assembly.
  • the invention can be viewed as providing three stages of alignment between the optical component and the optical component mount. A first stage of alignment is provided between the component mount (holder) and the optical component, for example using a V-groove registration feature as shown or other technique. A second stage of alignment is between the optical component mount and registration features of the relative reference mount. This also eliminates or reduces alignment variations due to component variability. A final alignment occurs between the optical module and the reference substrate.
  • the optical element has an optical characteristic which varies in space relative to at least one dimension.
  • the optical component is aligned with reference features on the relative reference mount by fixing the position of the component mount relative to the registration features of the relative reference mount to thereby align the optical characteristic.
  • the first stage of alignment is eliminated and the optical element is directly aligned with the registration features of the relative reference mount and no mount/holder is used.
  • the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.
  • the number of solder, heater, and receiver sets may be altered depending on detailed requirement.
  • the sequence of reflowing the solder may be altered to enhance stability.
  • entire multimodule assemblies can be arranged on an optical "circuit board" to fabricate a complex optoelectronic assembly.
  • the optical component can be any type of active or passive optical, opto-electrical or opto-mechanical component and not limited to the specific examples set forth herein.
  • the optical component can be aligned and its orientation fixed using any suitable or desirable means.
  • the relative reference mount and other components are formed from a single crystal material such as silicon.
  • these components can be fabricated from any electrical material including semiconductors or ceramics.
  • Other materials include machinable materials such as steel, aluminum, metal alloys, etc. depending on requirements of a particular implementation.
  • An assembled optical module can be used to fabricate an optical device using a "pick and place” machine or any suitable or desirable means.
  • the chamfers or bevels on the edges of the component mount can facilitate mechanical gripping of the mount.
  • the various components of the invention can be fabricated using any desired technique. Solders are known in the art and any appropriate solder can be selected to obtain the desired characteristics. Soldering may take place in an atmosphere that prevents or removes solder oxidation.
  • the optical component can be coupled directly to the relative reference mount without a separate component mount. As used herein, "light” is not necessarily visible light. Further, the optical component can be any active or passive optical, opto-electrical or opto-mechanical element.
  • optical modules can be prealigned using any appropriate technique.
  • the alignment is performed insitu, after the optical module or relative reference mount has been mounted to the optical "circuit board".

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Axle Suspensions And Sidecars For Cycles (AREA)
  • Lenses (AREA)
  • Retarders (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Information Retrieval, Db Structures And Fs Structures Therefor (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)

Abstract

L'invention concerne un dispositif optique (10) comprenant une pluralité de modules optiques (12A, B). Chaque module optique (12A, B) comprend un composant optique (14A, B) couplé de façon fixe à un support de référence relatif (18A, B). Ce support de référence relatif (18A, B) est conçu pour être fixé sur un substrat (20). Une pluralité de modules optiques (12A, B) sont montés sur le substrat (20) pour former le dispositif optique (10).
PCT/US2002/005412 2001-02-20 2002-02-20 Dispositif optique WO2002075415A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2002240468A AU2002240468A1 (en) 2001-02-20 2002-02-20 Optical device
GB0319380A GB2387923B (en) 2001-02-20 2002-02-20 Optical device
US10/099,907 US20020154870A1 (en) 2001-02-20 2002-03-15 Optical module with heat dissipation
US10/098,743 US20020168147A1 (en) 2001-02-20 2002-03-15 Optical circuit pick and place machine

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
US09/789,125 US6546173B2 (en) 2001-02-20 2001-02-20 Optical module
US09/789,124 US6546172B2 (en) 2001-02-20 2001-02-20 Optical device
US09/789,185 2001-02-20
US09/789,185 US6443631B1 (en) 2001-02-20 2001-02-20 Optical module with solder bond
US09/789,124 2001-02-20
US09/789,317 2001-02-20
US09/789,125 2001-02-20
US09/789,317 US6590658B2 (en) 2001-02-20 2001-02-20 Optical alignment system
US27632301P 2001-03-16 2001-03-16
US27633601P 2001-03-16 2001-03-16
US27633501P 2001-03-16 2001-03-16
US60/276,336 2001-03-16
US60/276,323 2001-03-16
US60/276,335 2001-03-16
US28816901P 2001-05-02 2001-05-02
US60/288,169 2001-05-02
US09/920,366 2001-08-01
US09/920,366 US6956999B2 (en) 2001-02-20 2001-08-01 Optical device
US31839901P 2001-09-10 2001-09-10
US60/318,399 2001-09-10
US34011401P 2001-12-14 2001-12-14
US60/340,114 2001-12-14

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10/098,743 Continuation-In-Part US20020168147A1 (en) 2001-02-20 2002-03-15 Optical circuit pick and place machine
US10/099,907 Continuation-In-Part US20020154870A1 (en) 2001-02-20 2002-03-15 Optical module with heat dissipation

Publications (2)

Publication Number Publication Date
WO2002075415A2 true WO2002075415A2 (fr) 2002-09-26
WO2002075415A3 WO2002075415A3 (fr) 2003-08-07

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PCT/US2002/005268 WO2002067032A2 (fr) 2001-02-20 2002-02-20 Systeme d'alignement optique
PCT/US2002/005412 WO2002075415A2 (fr) 2001-02-20 2002-02-20 Dispositif optique
PCT/US2002/005498 WO2002067034A2 (fr) 2001-02-20 2002-02-20 Machine de transfert de circuit optique
PCT/US2002/005497 WO2002067033A2 (fr) 2001-02-20 2002-02-20 Module optique

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Application Number Title Priority Date Filing Date
PCT/US2002/005268 WO2002067032A2 (fr) 2001-02-20 2002-02-20 Systeme d'alignement optique

Family Applications After (2)

Application Number Title Priority Date Filing Date
PCT/US2002/005498 WO2002067034A2 (fr) 2001-02-20 2002-02-20 Machine de transfert de circuit optique
PCT/US2002/005497 WO2002067033A2 (fr) 2001-02-20 2002-02-20 Module optique

Country Status (4)

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CN (2) CN1259585C (fr)
AU (2) AU2002306580A1 (fr)
GB (2) GB2390174B (fr)
WO (4) WO2002067032A2 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007076888A1 (fr) * 2005-12-30 2007-07-12 Fci Dispositif de couplage optique
CN102969644A (zh) * 2011-08-29 2013-03-13 华新丽华股份有限公司 对位结构、激光光源模块及光学对位方法
US9983371B2 (en) * 2016-03-08 2018-05-29 Mellanox Technologies, Ltd. Optoelectronic transducer with integrally mounted thermoelectric cooler
EP4045245A1 (fr) * 2019-11-12 2022-08-24 Bright Machines, Inc. Système d'insertion de module pour assemblage robotique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0600645A1 (fr) * 1992-11-30 1994-06-08 AT&T Corp. Boîtier optique singulier en ligne
EP0903600A1 (fr) * 1997-09-19 1999-03-24 Nec Corporation Panneau de montage d'un dispositif optique

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0600645A1 (fr) * 1992-11-30 1994-06-08 AT&T Corp. Boîtier optique singulier en ligne
EP0903600A1 (fr) * 1997-09-19 1999-03-24 Nec Corporation Panneau de montage d'un dispositif optique

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KOSHOUBU N ET AL: "ADVANCED FLIP CHIP BONDING TECHNIQUES USING TRANSFERRED MICROSOLDERBUMPS" 1999 PROCEEDINGS 49TH. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. ECTC 1999. SAN DIEGO, CA, JUNE 1 - 4, 1999, PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, NEW YORK, NY: IEEE, US, 1 June 1999 (1999-06-01), pages 272-277, XP000903804 ISBN: 0-7803-5232-7 *
SASAKI J ET AL: "HYBRID INTEGRATED 4*4 OPTICAL MATRIX SWITCH USING SELF-ALIGNED SEMICONDUCTOR OPTICAL AMPLIFIER GATE ARRAYS AND SILICA PLANAR LIGHTWAVE CIRCUIT" ELECTRONICS LETTERS, IEE STEVENAGE, GB, vol. 34, no. 10, 14 May 1998 (1998-05-14), pages 986-987, XP000846136 ISSN: 0013-5194 *

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AU2002306579A1 (en) 2002-09-04
CN1502054A (zh) 2004-06-02
GB0319380D0 (en) 2003-09-17
CN1220086C (zh) 2005-09-21
WO2002067033A2 (fr) 2002-08-29
GB2390174B (en) 2004-06-09
WO2002075415A3 (fr) 2003-08-07
WO2002067032A2 (fr) 2002-08-29
CN1259585C (zh) 2006-06-14
GB2387923B (en) 2004-06-02
GB0319381D0 (en) 2003-09-17
WO2002067032A3 (fr) 2003-08-21
WO2002067033A3 (fr) 2003-10-30
CN1493013A (zh) 2004-04-28
GB2387923A (en) 2003-10-29
WO2002067034A2 (fr) 2002-08-29
GB2390174A (en) 2003-12-31
WO2002067034A3 (fr) 2003-10-30
AU2002306580A1 (en) 2002-09-04

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