WO2002039154A1 - Module laser a semi-conducteur et amplificateur raman utilisant ledit module - Google Patents

Module laser a semi-conducteur et amplificateur raman utilisant ledit module Download PDF

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Publication number
WO2002039154A1
WO2002039154A1 PCT/JP2001/009741 JP0109741W WO0239154A1 WO 2002039154 A1 WO2002039154 A1 WO 2002039154A1 JP 0109741 W JP0109741 W JP 0109741W WO 0239154 A1 WO0239154 A1 WO 0239154A1
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WO
WIPO (PCT)
Prior art keywords
laser diode
optical fiber
base
laser
fixing
Prior art date
Application number
PCT/JP2001/009741
Other languages
English (en)
Japanese (ja)
Inventor
Yuichiro Irie
Jun Miyokawa
Takeshi Aikiyo
Original Assignee
The Furukawa Electric Co.,Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Furukawa Electric Co.,Ltd. filed Critical The Furukawa Electric Co.,Ltd.
Publication of WO2002039154A1 publication Critical patent/WO2002039154A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G02B6/4203—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/094003—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light the pumped medium being a fibre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/30—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range using scattering effects, e.g. stimulated Brillouin or Raman effects
    • H01S3/302—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range using scattering effects, e.g. stimulated Brillouin or Raman effects in an optical fibre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens

Definitions

  • the present invention relates to a semiconductor laser module used in the optical communication field and a Raman amplifier using the semiconductor laser module.
  • wavelength multiplex transmission (WDM transmission) has been widely accepted in the communication field, and the era of wavelength multiplex transmission is now approaching.
  • WDM transmission wavelength multiplex transmission
  • Wavelength-multiplexed optical transmission can transmit light of multiple wavelengths over a single optical fiber. Therefore, it is an optical transmission method suitable for large-capacity high-speed communication.
  • studies on this transmission technology are being actively conducted.
  • Raman amplification uses the phenomenon that when strong light (cocoon-induced light) is incident on an optical fiber, gain appears about 100 nm longer than the excitation light wavelength due to induced Raman scattering.
  • Raman amplification is an optical signal amplification method that utilizes the phenomenon that when signal light in the wavelength region having the above gain is incident on an optical fiber that has been pumped with pump light, the signal light is amplified. is there. Therefore, existing optical fibers can be used as an amplification medium in Raman amplification without using EDF as an amplification medium.
  • an amplification gain can be obtained at an arbitrary wavelength. Therefore, the number of signal light channels in wavelength division multiplexing transmission can be increased by using Raman amplification.
  • the Raman gain is as small as about 3 dB with a 100 mW pump light input when using a (normally existing) communication optical fiber. For this reason, it is necessary to provide a plurality of excitation light sources (pump lasers) and obtain a strong excitation light by multiplexing these. In general, it has been studied to achieve a total excitation light intensity of about 500 mW to 1 W by multiplexing.
  • the pump light source of the Raman amplifier in order to apply Raman amplification to wavelength division multiplexing transmission, the pump light source of the Raman amplifier must have low noise, high output of, for example, 300 mW or more, and It is necessary to provide a light source with good stability.
  • the development of a semiconductor laser module having such characteristics for a pumping light source is very important.
  • a semiconductor laser module is a device in which laser light from a semiconductor laser (laser diode) is optically coupled to an optical fiber on the optical transmission side. It is applied not only as an excitation light source as described above but also as a signal light source, and various configurations have been proposed. Disclosure of the invention The present invention provides a semiconductor laser module applicable to a signal light source or an excitation light source, and a Raman amplifier using the semiconductor laser module.
  • a semiconductor laser module according to one aspect of the present invention is configured as follows:
  • a laser diode mounted on the base; a first optical fiber mounted on the base and optically coupled to the laser diode;
  • a plurality of fixing members mounted on the base and arranged at intervals in the longitudinal direction of the first optical fiber;
  • a second optical fiber disposed opposite to the other end of the laser diode to receive and transmit light emitted from the other end of the laser diode, wherein the first optical fiber has It is located toward one end of the laser diode,
  • the first optical fiber has a diffraction grating that reflects light having a set wavelength, and is configured to return the light having the set wavelength among the lights emitted from one end of the laser diode to the laser diode.
  • the first optical fiber is fixed to the base by a fixing member at a plurality of positions at intervals in the longitudinal direction of the optical fiber.
  • a semiconductor laser module according to another aspect of the present invention is configured as follows;
  • a fixing member mounted on the base, for fixing the first optical fiber to the base;
  • a second optical fiber disposed opposite to the other end of the laser diode, for receiving and transmitting light emitted from the other end of the laser diode;
  • thermocouple mounted on the bottom plate of the package and mounting the base;
  • the first optical fiber has a diffraction grating that reflects light of a set wavelength, and returns the light of the set wavelength among the lights emitted from one end side of the laser diode to the laser diode.
  • the thermo module comprises: a base side plate on which the base is mounted; a bottom plate side plate placed on the bottom plate of the package; and a Peltier element sandwiched and fixed between these plate members.
  • a laser diode mounting member that is mounted and fixed in contact with an upper surface of the thermo module and mounts the laser diode; a fixing member that is coupled to the laser diode mounting member and mounts the fixing member; And a mounting member.
  • the laser diode mounting member is formed of a material having a linear expansion coefficient in a range between a linear expansion coefficient of the fixed member mounting member and a linear expansion coefficient of a base side plate of the thermomodule.
  • a first optical fiber mounted on the base, arranged with the fiber tip side toward one end of the laser diode, and optically coupled to the laser diode;
  • a fixing member mounted on the base, for fixing the first optical fiber to the base;
  • a second optical fiber disposed opposite to the other end of the laser diode, for receiving and transmitting light emitted from the other end of the laser diode;
  • thermocouple mounted on the bottom plate of the package and mounting the base;
  • the first optical fiber has a diffraction grating that reflects light of a set wavelength, and returns the light of the set wavelength among the lights emitted from one end side of the laser diode to the laser diode.
  • a laser diode mounting member for mounting and fixing the laser diode in contact with an upper surface of the thermo module; and a base coupled to the laser diode mounting member for fixing the base. And a fixed member mounting member for mounting the member.
  • the bottom plate of the package is formed of a material having substantially the same linear expansion coefficient as the laser diode tower mounting member of the base.
  • a fixing member mounted on the base and fixing the first optical fiber to the base while holding the first optical fiber from both sides;
  • a second optical fiber disposed opposite to the other end of the laser diode, for receiving and transmitting light emitted from the other end of the laser diode;
  • thermoelectric unit mounted on the base plate of the package and mounting the base;
  • the first optical fiber has a diffraction grating that reflects light of a set wavelength, and the light of the set wavelength among the lights emitted from one end of the laser diode is transmitted to the laser diode.
  • the base is provided with a fixed member tower mounting portion for mounting the fixed member on the base.
  • the fixing member mounting portion and the fixing member are laser-welded at a first laser welding portion.
  • the first optical fiber side and the fixing member are laser-welded at a second laser-welded portion
  • the first laser welded portion and the second laser welded portion are substantially the same height in a direction perpendicular to the package bottom plate.
  • the semiconductor laser module according to still another embodiment of the present invention Is composed as follows:
  • a laser diode mounted on the base; a laser die mounted on the base; A first optical fiber disposed toward one end of the diode and optically coupled to the laser diode;
  • a fixing member mounted on the base, for fixing the first optical fiber to the base;
  • a second optical fiber disposed opposite to the other end of the laser diode, for receiving and transmitting light emitted from the other end of the laser diode;
  • thermo module on which the base is mounted; wherein the first optical fiber has a diffraction grating that reflects light having a set wavelength, and the first optical fiber is set out of light emitted from one end of the laser diode. A wavelength of light is fed back to the laser diode, and at least a part of the base is located at one or both sides of the side of the first optical fiber, and the length of the first optical fiber is Along the direction
  • a bending preventing means for preventing bending of the base is provided.
  • a laser diode mounted on the base; a first optical fiber mounted on the base, arranged with a fiber tip end side toward one end of the laser diode, and optically coupled to the laser diode;
  • a fixing member mounted on the base and fixing the first optical fiber to the base at a position near the laser diode and at a position farther from the laser diode than the laser diode;
  • a second optical fiber disposed opposite to the other end of the laser diode, for receiving and transmitting light emitted from the other end of the laser diode; Iva;
  • thermo module on which the base is mounted; wherein the first optical fiber has a diffraction grating that reflects light having a set wavelength, and the first optical fiber is set out of light emitted from one end of the laser diode. Wavelength of light is fed back to the laser diode, wherein the first optical fiber and the laser diode are aligned, and the first optical fiber is on a side closer to the laser diode. Are fixed from both sides by fixing members at each point on the far side
  • the fixing member for fixing the position far from the laser diode comprises a pair of fixing parts.
  • the fixed parts of this pair are fixed to the base with the first optical fiber sandwiched from both sides,
  • the fixed parts and the first optical fiber side are fixed by laser welding.
  • FIG. 1 is a configuration explanatory view showing a first embodiment of a semiconductor laser module according to the present invention
  • FIG. 2 is a plan view showing a configuration of a peripheral portion of a base of the semiconductor laser module of the first embodiment
  • FIG. 3 is an exploded view showing the structure of the base in the first embodiment in an exploded view
  • FIG. 4 is a sectional view taken along line AA of FIG. 3, and FIGS.
  • FIG. B is an explanatory diagram showing a perspective configuration of each fixing member provided in the first embodiment.
  • FIG. 6 is an explanatory view showing a fiber lens of the first optical fiber provided in the first embodiment and its peripheral configuration
  • FIG. 7 is a laser diode in the first embodiment.
  • Perspective view showing the arrangement area of FIG. 8 is an explanatory diagram showing a simplified cross-sectional configuration on the side where the second optical fiber is disposed in the first embodiment
  • FIG. 9 is a diagram showing a semiconductor laser module according to the present invention.
  • FIG. 10 is a perspective view showing the configuration of the second embodiment with a package partially omitted.
  • FIG. 10 shows a laser diode and a first optical fiber in a third embodiment of the semiconductor laser module according to the present invention.
  • FIG. 11 is a perspective view showing the fixing configuration of FIG. 11, and FIG. 11 is a plan view of FIG.
  • FIG. 12 is an exploded view showing the structure of the base in the third embodiment in an exploded view.
  • FIG. 13 is a diagram showing the structure around the base in another embodiment of the semiconductor laser module according to the present invention.
  • FIG. 14 is an explanatory view of a fiber lens structure of a first optical fiber in another embodiment of the semiconductor laser module according to the present invention.
  • FIG. 15 is a perspective view of the semiconductor laser module according to the present invention.
  • FIG. 16 is an explanatory view of a second optical fiber in another embodiment of the semiconductor laser module.
  • FIG. 16 is an explanatory view showing an example of a conventional semiconductor laser module in a cross section.
  • FIG. A is a diagram showing a configuration of the Peltier device, and
  • FIG. 17B is an explanatory diagram showing a problem of the semiconductor laser module.
  • FIG. 16 shows an example of a conventional semiconductor laser module.
  • This semiconductor laser module is for a signal light source, and employs fiber grating technology to improve the wavelength stability.
  • thermomodule 25 is provided in a knockout 27.
  • the base 2 is mounted on the thermo module 25.
  • the laser diode 1 is mounted and fixed on the LD bonding portion 2 1 of the base 2 via the heat sink 22.
  • a first optical fiber 4 optically coupled to the laser diode 1 is mounted on the base 2, a first optical fiber 4 optically coupled to the laser diode 1 is mounted.
  • the first optical fiber 4 is disposed with the distal end of the fiber lens 14 formed on the distal end thereof facing the one end 31 of the laser diode 1.
  • the first optical fiber 4 is housed in a metal sleep 3.
  • the first optical fiber 4 is fixed by laser welding to a fixed arm 63 projecting above the base 2 at a fixed portion 62.
  • the base 2 is preferably formed of a metal having low thermal conductivity and high laser weldability.
  • the material of the base 2 is preferably a material having a linear expansion coefficient close to that of the glass-based material forming the first optical fiber 4. . Therefore, in a conventional semiconductor laser module, the base 2 is generally formed of a Fe—Ni—Co alloy known as Copal (trademark).
  • the first optical fiber 4 has a grating 12 as a diffraction grating that reflects light of a set wavelength.
  • the first optical fiber 4 receives light emitted from one end 31 of the laser diode 1 via a fiber lens 14. Then, of the received light, the light of the set wavelength is reflected and returned to the laser diode 1.
  • a monitoring diode 9 is disposed to face.
  • the monitor photodiode 9 is fixed to the monitor photodiode fixed part 39.
  • the monitor photodiode fixing section 39 is fixedly arranged in the package 27.
  • Monitor Photodiode 9 Monitors the output of the laser diode 1 by receiving the laser light transmitted through the first optical fiber 4.
  • a second optical fiber 13 is arranged to face the other via a space.
  • the second optical fiber 13 receives the light emitted from the other end 30 of the laser diode 1 and transmits it.
  • the connection end face of the second optical fiber 13 is fixedly inserted into a ferrule 59, and the ferrule 59 is fixed to the rear end of the package 27.
  • a collimating lens 51, a light transmitting plate 55, and a condensing lens 57 are spaced from each other in this order from the laser diode 1 side. It is arranged.
  • the collimator lens 51 is fixed to the base 2.
  • the condenser lens 57 is fixed to the lens holder 56 and is fixed to the package 27.
  • thermomodule 25 is usually mounted on the bottom plate 26 of the package 27.
  • the bottom plate 26 of the package 27 is made of Cu—W alloy Cu W 20 (weight ratio of Cu is 20% and W is 80%).
  • the thermo module 25 usually includes a base plate 17, a bottom plate 18, and a Peltier element 1 sandwiched and fixed between the plates 17, 18. 9 Is formed by both the base side ⁇ 1 7 and the bottom plate side plate member 1 8 of the thermo-module 2 5 A 1 2 O 3.
  • the first optical fiber 4 and the second optical fiber 13 are both centered on the laser diode 1. Then, the laser light emitted from one end 31 of the laser diode 1 is received by the first optical fiber 4. The light having the set wavelength is reflected from the grating 12 and returns to the laser diode 1, and is emitted from the other end 30 of the laser diode 1. This output light is transmitted to the second optical fiber 13. Thus, the light is received, transmitted through the second optical fiber 13, and provided for a desired use.
  • the first optical fiber The distance between the tip of 4 and the laser diode 1 can be reduced. For this reason, it is possible to widen the frequency range in which the semiconductor laser module has a good RIN (Relative Inte nite n Si ty N o i s e) characteristic.
  • thermo module when a current is applied to drive the laser diode 1, the temperature of the laser diode 1 rises due to heat generation. This temperature rise causes a change in the oscillation wavelength and light output of the laser diode 1. For this reason, when using the semiconductor laser module, the temperature of the laser diode 1 is measured by a thermistor (not shown) fixed near the laser diode 1. Based on the measured value, the current flowing through the thermo module 25 is controlled to control the temperature of the laser diode 1 to be constant.
  • the semiconductor laser module having the above configuration receives the light emitted from the laser diode 1 by the first optical fiber 4, and reflects the light having a set wavelength out of the light by the grating 12. It is a configuration to return to the code 1. Therefore, when the first optical fiber 4 is displaced with respect to the laser diode 1, the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 is greatly reduced.
  • the above-described conventional semiconductor laser module has a configuration in which the first optical fiber 4 is sandwiched and fixed by the fixing portion 62 at one position in the longitudinal direction. Therefore, it is difficult to properly center and fix the first optical fiber 4. Therefore, when fixing the first optical fiber 4, There has been a problem that displacement is likely to occur.
  • the base 2 is formed by copal
  • the base side plate member 1 7 of thermo-module is formed by A 1 2 O 3.
  • the base 2 and the base side plate 17 have significantly different linear expansion coefficients.
  • the base 2 bends as shown in FIG. 17B with the operation of the thermo module 25 when the semiconductor laser module is used. This bending causes a problem that the laser diode 1 and the first optical fiber 4 are displaced from the centering position, and the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 is reduced.
  • the linear expansion coefficient between the base 2 and the base side plate 17 of the thermomodule 25 also increases.
  • the difference also causes base 2 to bow.
  • the optical coupling between the laser diode 1 and the first optical fiber 4 is deviated, and when the semiconductor laser module is used, the optical coupling does not completely return to the original state, and the optical coupling shift remains. turn into.
  • the fixing portion 62 of the sleeve 3 is on the tip side of the fixing arm 63 formed to protrude above the base 2. That is, since the fixed portion 62 is formed at a position higher than the bottom of the base 2, the sleeve 3 is largely displaced when the base 2 is bent. As a result, the rate of decrease in the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 was large.
  • the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 decreases in accordance with a change in the use environment temperature when the semiconductor laser module is used and when it is left unattended, the first optical fiber 4
  • the intensity of the light received and returned to the laser diode 1 decreases.
  • the intensity of the return light decreases, the light with high output and stable wavelength from the semiconductor laser module Output and transmission.
  • One aspect of the present invention is to optically couple a laser diode and an optical fiber that receives laser light from the laser diode and returns light of a set wavelength to the laser diode with high accuracy regardless of a temperature change.
  • a highly reliable semiconductor laser module is provided.
  • the present invention provides a pumping light source having low noise, high power, and good wavelength stability, which is suitable for wavelength multiplex transmission by using the semiconductor laser module as described above. Provide an amplifier.
  • FIG. 1 is a perspective view showing the configuration of a first embodiment of the semiconductor laser module according to the present invention.
  • the semiconductor laser module of this embodiment also has a package 27 for accommodating the laser diode 1 and the like as in the conventional example.
  • the package 27 is shown in a partially omitted state.
  • the semiconductor laser module of the first embodiment includes a thermo module 25, a base 2, a laser diode 1, a first optical fiber 4, and the like provided in a package 27. It is configured.
  • a plurality of lead terminals 60 are arranged on the side wall of the package 27 with a space therebetween, and the lead terminals 60 are formed so as to protrude toward the outside of the package 27.
  • the first embodiment is different from the conventional example in the configuration of the base 2 and the first optical fiber.
  • the semiconductor laser module of the first embodiment has a reliable optical coupling between the laser diode 1 and the first optical fiber 4 with high accuracy irrespective of changes in the use environment temperature. It is a semiconductor laser module with high performance.
  • the base 2 on which the laser diode 1 is directly or indirectly mounted is a laser diode mounting member 8 on which the laser diode 1 is mounted, and a fixing member mounting member provided on the laser diode mounting member 8. 5 and.
  • the fixing member mounting member 5 mounts the fixing members 6 and 7, and the fixing members 6 and 7 are arranged at an interval in the longitudinal direction of the optical fiber.
  • the first optical fiber 4 is fixed through a metal sleeve 3 as an optical fiber holding member.
  • the fixing members 6 and 7 fix the first optical fiber 4 to the base 2 by supporting and fixing the sleep 3.
  • the same grating as that shown in FIG. 16 is formed in the core of the first optical fiber 4.
  • the first optical fiber 4 is fixed to the base 2 by the fixing members 6 and 7 at a plurality of points (here, two points) spaced apart in the longitudinal direction of the optical fiber. ing.
  • the first optical fiber 4 is clamped and fixed from both sides by fixing members 6 and 7 in a state where the first optical fiber 4 is aligned with the laser diode 1.
  • Base 2 is mounted on thermo module 25.
  • the laser diode mounting member 8 of the base 2 is arranged in contact with the thermo module 25.
  • an LD bonding portion 21 which is formed integrally with the laser diode mounting member 8 is provided above the laser diode mounting member 8.
  • the LD bonding part 21 is a laser diode mounting area.
  • Fixing member mounting member 5 The laser diode mounting member 8 is arranged at a position avoiding the laser diode mounting area of the laser diode mounting member 8.
  • FIG. 3 is a perspective view showing the base 2 in an exploded state, and the fixing member mounting member 5 is mounted on the laser diode mounting member 8 at the position of the silver mouth ⁇ joint 46 shown by hatching in FIG. Is connected and fixed.
  • the base 2 is configured to include the fixing member mounting member 5 and the laser diode mounting member 8.
  • the laser diode mounting member 8 is made of a material having a linear expansion coefficient in a range between the linear expansion coefficient of the fixed member mounting member 5 and the linear expansion coefficient of the base side plate 17 of the thermomodule 25. It is formed by.
  • the fixing member mounting member 5 is formed of copearl
  • the laser diode mounting member 8 is a Cu—W alloy CuWIO (weight ratio of Cu is 10%, W 90%).
  • CuW10 has a thermal conductivity of 180 to 200 (W / mK), which is about 17 to 18 (W / m-K), which is the thermal conductivity of Copal. It has 10 times the thermal conductivity.
  • the bottom plate 26 of the package 27 is formed of the same material as the laser diode mounting member 8 of the base 2. Thereby, the linear expansion coefficient of the bottom plate 26 and the linear expansion coefficient of the laser diode mounting member 8 are made the same.
  • the fixing member mounting member 5 as the fixing member mounting portion and the fixing members 6 and 7 are laser-welded at a first laser welded portion 10.
  • the fixing members 6, 7 and the sleeve 3 are laser-welded at a second laser-welded portion 11 (11a, lib).
  • the height of the first laser welded portion 10 and the height of the second laser welded portion 11 in a direction perpendicular to the package bottom plate 26 are substantially the same.
  • the laser welding is performed by a YAG laser or the like.
  • the difference between the height of the first laser welded portion 10 and the height of the second laser welded portion 11 in the direction perpendicular to the package bottom plate 26 is within ⁇ 500 mm, preferably within ⁇ 50 ⁇ . I have to.
  • the height of the laser welded portions 10 and 11 in FIG. 12 on the fixing member 6 side is the same as the position of the laser light receiving end 32 of the first optical fiber 4 and the center position of the optical axis. Has become.
  • the fiber lens 14 of the first optical fiber 4 has a spherical shape shown in FIG. 6, and the tip is a laser beam receiving end 32.
  • the laser light receiving end 32 is arranged at the same height position as the plane of the active layer (not shown) of the laser diode 1.
  • the upper surface of the fixing member mounting member 5 and the upper surfaces of the fixing members 6 and 7 are flush (within 100 ⁇ m of soil). So that This is preferable because the height of the laser welded portion 10 can be easily made uniform for each product.
  • a bending preventing means 15 is formed on the fixing member mounting member 5 of the base 2.
  • the radius prevention means 15 is formed on both sides of the first optical fiber 4 along the longitudinal direction of the first optical fiber 4.
  • the radius preventing means 15 prevents the base 2 from bending.
  • the bending preventing means 15 is formed by forming a wall portion which is provided at least upward from the bottom 16 of the fixing member mounting member 5 in the longitudinal direction of the first optical fiber 4. It is.
  • the deflection preventing means 15 is provided in the entire area in the longitudinal direction of the fixing member mounting member 5 (the area within the broken line frame B in FIG. 2).
  • the bending prevention means 15 is provided on both sides of the axis part 33 connecting the laser light emitting end face of one end 31 of the laser diode 1 and the laser light receiving end 32 of the first optical fiber 4, and the laser.
  • On both sides of the fixing member 6 located on the side close to the diode 1. Is also provided.
  • the tip of the deflection preventing means 15 extends to the area where the LD bonding part 21 of the laser diode mounting member 8 is provided.
  • the deflection preventing means 15 is formed of a fixed member mounting member 5 and an integral member. 2 and 3, as shown in FIGS. 2 and 3, the walls constituting the deflection preventing means 15 and the fixing member fixing wall 35 form the fitting recesses 37a, 37 of the fixing members 6, 7 respectively. b is formed.
  • the fixing members 6, 7 are welded and fixed to the fixing member mounting member 5 by the first laser welded portion 10 in a state of being fitted to the corresponding fitting concave portions 37a, 37b.
  • the deflection preventing means is formed.
  • the fixing member mounting member 5 in which the wall portion 15 and the fixing member fixing wall portion 35 are integrally formed is obtained.
  • the fixing member 6 located on the side closer to the laser diode 1 is, as shown in FIGS. 5A and 5B, a holding portion for holding the first optical fiber 4 from both sides. It is formed by an integral part with 28. As an example, as shown in FIG. 5B, the holding portion 28 of the fixing member 6 may be formed in an arm shape. Then, when the laser diode 1 and the first optical fiber 4 are aligned, when the first optical fiber 4 integrated with the sleep 3 is rotated with the laser welded portion 11a as a fulcrum, the laser welding is performed. The stress applied to the portion 11a is dispersed into the deformation stress of the arm of the holding portion 28, and the concentration of stress can be prevented.
  • the fixing member 7 for fixing the first optical fiber 4 farther from the laser diode 1 includes a pair of fixing parts 7a and 7b.
  • the fixed parts 7 a and 7 b of this pair are fixed to the fixing member mounting member 5 of the base 2 with the sleep 3 sandwiched from both sides.
  • the fixed parts 7a and 7b are the first laser weld lib, The welding is fixed.
  • the fixing member fixing wall 35 of the fixing member mounting member 5 functions as a guide for guiding the movement of the fixing components 7a and 7b.
  • a minute gap is interposed between the fixing member fixing wall portion 35 and the sleeve 3.
  • the fixed parts 7 a and 7 b are fixed to the fixed member fixing wall 35 at the position of the first laser welded part 10.
  • the laser diode mounting member 8 of the base 2 is fixed to the upper surface of the thermo module 25.
  • the fixing member mounting member 5 connected to the laser diode tower mounting member 8 is a thermo module.
  • the first optical fiber 4 is provided so as to protrude from the upper surface of the first optical fiber 4 in the longitudinal direction.
  • the first optical fiber 4 is fixed on a fixing member mounting member 5 protruding from the thermomodule 25 side.
  • the end face (rear end face) of the first optical fiber 4 far from the laser diode 1 is formed obliquely with respect to the optical axis of the first optical fiber 4.
  • a monitor photodiode 9 is provided so as to face the rear end face of the first optical fiber 4, and the monitor photodiode 9 is fixed to a monitor photodiode fixing portion 39.
  • the mounting portion 39 is mainly made of alumina. Motor diode fixed part
  • Numeral 39 is fixed on the laser diode mounting member 8 of the base 2 by a solder material or the like.
  • the laser diode 1 is fixed on the heat sink 22 by a solder material 40 mainly composed of AuSn solder.
  • the heat sink 22 is fixed on the laser diode mounting member 8 mainly by a solder material 41 having AuSn or AuSi.
  • the heat sink 22 is made of a high thermal conductive material such as A 1 N or diamond.
  • a second optical fiber 13 is arranged to face the other end 30 of the laser diode 1 with an interval therebetween.
  • the second optical fiber 13 is fixed to a ferrule holder 58 while being supported and fixed to a ferrule 59.
  • FIG. 1 As shown in FIG. 1, FIG. 2, and FIG. 8, between the other end 30 of the laser diode 1 and the second optical fiber 13, the other end 30 of the laser diode 1 is provided.
  • a collimating lens 51 that converts laser light into parallel light is provided on the surface at intervals.
  • the collimating lens 51 is mounted and fixed on the laser diode mounting member 8 of the base 2 while being supported and fixed by the lens holder 52.
  • the lens holder mounting portion 47 is shown by hatching.
  • the laser diode mounting member 8 is provided with an isolator 53 via a gap with the collimating lens 51.
  • the isolator 53 is fixed on the laser diode mounting member 8 via the isolator holder 54.
  • a condensing lens 57 is provided on the emission side of the isolator 53 via an interval.
  • a light transmitting plate 55 is provided between the isolator 53 and the condenser lens 57.
  • the condenser lens 57 condenses the light emitted from the laser diode 1 on the tip side of the second optical fiber 13.
  • the condenser lens 57 is fixed to the lens holder 56.
  • the light transmitting plate 55 provided on the incident side of the condenser lens 57 is made of sapphire glass or the like.
  • Light transmission plate 5 5 The package 27 has a sealing function.
  • the light transmitting plate 55 is disposed obliquely with respect to the optical axis of the condenser lens 57.
  • the operation of fixing the first optical fiber 4 to the fixing member mounting member 5 of the base 2 is performed, for example, as follows. First, the first optical fiber 4 and the laser diode 1 are aligned. With this alignment, the laser diode The distal end side of the first optical fiber 4 near the optical fiber 1 is clamped and fixed by the fixing member 6 from both sides.
  • This alignment is performed, for example, as follows. That is, the fixed component 6 is arranged in the fitting recess 37 a on the fixed component mounting member 5 of the base 2. Then, the first optical fiber 4 is arranged between the holding portions 28 (see FIG. 5) of the fixed component 6. Note that the interval between the holding portion 28 and the sleep 3 is about 0 to 2 ⁇ . In this state, the rear end side of the first optical fiber 4 far from the laser diode 1 is gripped by, for example, an alignment jig. Using this alignment jig, the laser diode 1 and the first optical fiber 4 are aligned. At this time, the fixed component 6 can move in the X direction along the surface of the fixed member mounting member 5 of the base 2 together with the sleep 3.
  • the fixed component 6 is fixed to the fixed member mounting member 5 of the base 2 at the first laser welded portion 10.
  • the first optical fiber 4 side (specifically, the sleep 3 of the first optical fiber 4) is fixed to the fixed component 6 by welding at the second laser welding portion 11a.
  • the side of the first optical fiber 4 close to the laser diode 1 is fixed to the fixing member mounting member 5. Note that the force for fixing the fixed component 6 to the fixed component mounting member 5 first and then welding and fixing the first optical fiber 4 side to the fixed component 6 or vice versa depends on the alignment. It should be selected in consideration of ease of alignment, alignment accuracy, etc.o
  • the end of the first optical fiber 4 farther from the laser diode 1 is fixed to the first part by the centering jig with the holding part (the laser welded part 11 a) held by the fixed part 6 as a fulcrum. Perform centering movement in the Y direction in the figure. Then, the first optical fiber 4 and the laser diode 1 are realigned.
  • the fixing parts 7 a and 7 b are inserted into the fitting recesses 37 b in a manner guided by the fixing member fixing wall 35 of the fixing member mounting member 5 of the base 2, Place both sides of Sleep 3 gently.
  • the fixing parts 7 a and 7 b are guided by a fixing member fixing wall 35, and are fixed to the fixing member of the base 2 in the X direction substantially perpendicular to the optical axis of the first optical fiber 4. Slide along the surface of the mounting member 5. By this slide movement, the distance between the fixed parts 7a and 7b of the sleep 3 on both sides and the side surface of the sleep 3 is adjusted to 0 to about 5 ⁇ m.
  • the fixed parts 7a and 7b are fixed to the fixed member fixing wall 35 by welding using a plurality of first laser welds 10. After that, the fixed parts 7a and 7b and the first optical fiber 4 side are fixed by laser welding (for example, YAG welding fixed) by the second laser welded part 11.
  • laser welding for example, YAG welding fixed
  • the centering operation is performed, for example, while oscillating laser light from the laser diode 1 and making the laser light incident and propagate on the first optical fiber 4.
  • the rear end of the first optical fiber 4 far from the laser diode 1 is centered and moved using the centering jig and the like.
  • the position where the intensity of the laser light propagating through the first optical fiber 4 becomes the highest is defined as the centering position.
  • the centering movement of the first optical fiber 4 is performed, for example, by attaching a stepping motor or the like to the centering jig, and measuring the intensity of the light propagating through the first optical fiber 4 and emitted by the light intensity detecting device. While monitoring, the amount of sleep 3 movement by the stepping motor may be adjusted by a person. Alternatively, both the light intensity detecting device and the driving device of the stepping motor may be connected to a computer, and the first optical fiber 4 may be automatically moved to the centering position by computer control.
  • the laser light emitted from one end 31 of the laser diode 1 is received by the first optical fiber 4 as in the conventional example. Then, while returning the light of the set wavelength to the laser diode 1, the light emitted from the other end 30 of the laser diode 1 is transmitted to the second optical fiber. The light is received by 13 and transmitted through the second optical fiber 13. At this time, also in this embodiment, the temperature of the laser diode 1 is controlled by the thermo module 25 as in the conventional example.
  • the first optical fiber 4 is fixed to the base 2 by the fixing members 6 and 7 at two points at an interval in the longitudinal direction of the fiber. Therefore, the first optical fiber 4 can be appropriately centered and fixed on the base 2 with respect to the laser diode 1, and the displacement of the first optical fiber 4 can be suppressed.
  • the laser diode mounting member 8 of the base 2 that contacts the base side plate member 17 of the thermomodule 25 is the linear expansion coefficient of the fixed member mounting member 5 provided on the upper side.
  • C u having a linear expansion coefficient between the copal and a 1 2 O 3 that material (in other words having a linear expansion coefficient in the range between the linear expansion coefficient of the base side plate member 1 7 of thermo-module 2 5 W 10). Therefore, compared with the set Keru conventional direct contact with the base 2 formed by copal on the base side plate member 1 7 consisting of A 1 2 O 3, can be alleviated deflection of the base 2 caused by environmental temperature changes .
  • the first embodiment it is possible to suppress a decrease in the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 due to a change in the use environment temperature.
  • CuW 10 forming the laser diode mounting member 8 has a good thermal conductivity, and has a thermal conductivity that is about 10 times that of Copal. Therefore, in the first embodiment, the heat generated by the laser diode 1 is efficiently transmitted to the thermomodule 25 via the heat sink 22 and the laser diode mounting member 8. Therefore, the laser module 1 can be efficiently cooled by the thermo module 25. Therefore, according to the first embodiment, the power consumption of the laser diode 1 and the thermomodule 25 can be reduced, and a semiconductor laser module with low power consumption can be obtained. Further, the radius of the thermo module 25 can be reduced.
  • the linear expansion coefficient of the laser diode mounting member 8 and the bottom plate 26 of the package 27 are the same, when the operating temperature of the semiconductor laser module changes, The same stress is applied to both the upper and lower sides of the thermo module 25, and the bending of the thermo module 25 is canceled. Therefore, according to the first embodiment, it is possible to more effectively suppress a decrease in the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 due to a change in the use environment temperature.
  • the second laser-welded portion 11 formed by laser welding with the package 3 is formed to have substantially the same height in the direction perpendicular to the package bottom plate 26. Therefore, even if a slight radius of the base 2 occurs, the radius does not cause the sleeve 3 to be largely displaced around the first laser welded portion 10 as a fulcrum. Therefore, it is possible to suppress the decrease in the optical coupling efficiency between the laser diode 1 and the optical fiber 2 even more efficiently.
  • the optical fiber is attached to the fixing member mounting member 5 of the base 2. Along the lengthwise direction of 4, a radius preventing means 15 for preventing the base 2 from bending is provided. Therefore, the radius of the base 2 along the longitudinal direction of the optical fiber can be suppressed by the deflection preventing means 15.
  • the light that is not emitted from the laser diode 1 emits the first light from the tip side of the first optical fiber 4.
  • Light enters fiber 4.
  • the displacement of the fixing position of the first optical fiber 4 by the fixing member 6 on the side closer to the laser diode 1 is the same as the displacement of the fixing position of the first optical fiber 4 by the fixing member 7 on the side farther from the laser diode 1.
  • the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 is greatly reduced as compared with the deviation. Therefore, it is extremely important to suppress the radius of the base 2 in the area where the fixing member 6 is provided.
  • the means for preventing deflection 15 is provided with both sides of an axis portion 33 connecting the one end 31 of the laser diode 1 and the light receiving end 32 of the laser beam in the first optical fiber 4, It is provided in a region including both sides of the fixing member 6 located on the side closer to the laser diode 1.
  • the bending of the base 2 in the area where the axis portion 33 and the fixing member 6 are provided can be suppressed. Therefore, it is possible to effectively suppress the deflection of the base 2 in accordance with a change in the use environment temperature of the semiconductor laser module. Further, it is possible to extremely efficiently suppress a reduction in the optical coupling rate between the laser diode 1 and the first optical fiber 4.
  • the bending preventing means 15 is provided with a fixing member mounting member 5 At least an upper wall from the bottom 16 of the first optical fiber 4 is formed in the longitudinal direction of the first optical fiber 4.
  • the deflection preventing means 15 is formed as an integral member with the fixed member mounting member 5.
  • the bending prevention means 15 is composed of a separate component from the fixing member mounting member 5, and the strength is reduced by the connection between the bending prevention means 15 and the fixing member mounting member 5 as in the case of bonding them. 1/09741
  • the radius prevention means 15 has a simple configuration, facilitating manufacture, and can effectively suppress the deflection of the base 2. Further, according to the first embodiment, it is close to the laser diode 1
  • the fixing member 6 for supporting and fixing the first optical fiber 4 on the side was formed as an integrated component having a holding portion 28 for holding the first optical fiber 4 from both sides. Therefore, since the connecting portion 49 connecting both sides of the holding portion 28 works as a deflection suppressing member, the bending of the base 2 in the X direction in FIGS. 2 and 5 can be further suppressed. . Therefore, according to the first embodiment, it is possible to suppress the decrease in the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 even more efficiently.
  • the fixing member 7 for fixing the first optical fiber 4 farther from the laser diode 1 is a pair of the fixing members 7 fixed to the base 2 with the sleep 3 sandwiched from both sides.
  • the fixed parts are 7a and 7b. Therefore, by aligning and fixing the first optical fiber 4 to the laser diode 1 using the above-described fixing method, the YAG welding of the fixed parts 7a and 7b and the first optical fiber 4 side is performed. The amount of movement of the first optical fiber 4 can be reduced. Therefore, when the first optical fiber 4 side is fixed by the fixing parts 7a and 7b, there is almost no displacement of the first optical fiber 4 (sleep 3).
  • the alignment work involved in manufacturing the semiconductor laser module can be performed accurately, the work time can be extremely shortened, and the cost can be reduced accordingly.
  • the fixing member mounting member 5 of the base 2 is farther from the thermomodule 25 than the optical fiber mounting end to be mounted and fixed on the thermomodule 25 (in the optical fiber longitudinal direction). ) I have. Therefore, the portion (projecting portion) not in contact with the thermo module 25 is not affected by the bending of the thermo module 25.
  • the first optical fiber 4 is fixed to a fixing member mounting member 5 protruding from the thermomodule 25.
  • the first optical fiber 4 becomes extremely insensitive to the bending of the thermo module 25, and the optical coupling efficiency between the laser diode 1 and the first optical fiber 4 is reduced even more efficiently. Can be suppressed.
  • the fixing member mounting member 5 is formed of Kovar.
  • Kovar has almost the same linear expansion coefficient as that of the first optical fiber 4 and has excellent laser weldability. For this reason, it is possible to prevent the first optical fiber 4 from being adversely affected by a difference in linear expansion coefficient from the first optical fiber 4. Further, the laser welding workability with the sleep 3 is good, and the semiconductor laser module can be manufactured with a low manufacturing cost.
  • the first optical fiber 4 Thus, the laser light of the laser diode 1 is fed back to the laser diode 1. Therefore, the distance between the end of the first optical fiber 4 (laser light receiving end 32) and one end 31 of the laser diode 1 can be made very short, and a semiconductor laser with small noise and good wavelength stability can be obtained. It can be a module.
  • the first light The light reflected on the rear end face of the fiber 4 can be prevented from returning to the laser diode 1 side, and the output from the laser diode 1 can be stabilized.
  • the collimating lens 51 and the focusing lens 57 are An isolator 53 is provided between them. Therefore, it is possible to reliably suppress the laser light from returning to the laser diode 1 from the second optical fiber 13 side, and to stabilize the output of the semiconductor laser module.
  • the light transmission plate 55 provided on the incident end side of the second optical fiber 2 is disposed obliquely with respect to the optical axis of the light collection lens 57. Therefore, the laser beam reflected by the light transmitting plate 55 can be prevented from returning to the laser diode 1, and the output of the semiconductor laser module can be further stabilized.
  • the laser diode 1 and the first optical fiber 4 can be optically coupled with high accuracy regardless of a change in the use environment temperature. A highly reliable semiconductor laser module with low noise, high output and good wavelength stability is obtained. Therefore, when a Raman amplifier is configured using the semiconductor laser module of the first embodiment as an excitation light source, this Raman amplifier can be an excellent Raman amplifier suitable for wavelength division multiplexing transmission.
  • thermo-module 25 has a higher laser beam intensity than the first embodiment. It is formed so as to be long in the axial direction so that the end of the base 2 on the rear end side of the first optical fiber 4 does not protrude from the thermomodule 25.
  • the entire lower surface of the laser diode mounting member 8 of the base 2 is brought into contact with the base side plate 17 of the thermomodule 25.
  • the semiconductor laser module of the second embodiment has the entire lower surface of the laser diode mounting member 8 of the base 2 in contact with the thermomodule 25.
  • the second embodiment can also provide substantially the same effects as those of the first embodiment.
  • FIG. 10 is a perspective view showing a fixing structure of the first optical fiber 4 in the third embodiment of the semiconductor laser module according to the present invention. Also, a plan view of the fixed configuration is shown in FIG. FIG. 12 shows an exploded view of the configuration of the base 2 in the third embodiment.
  • the third embodiment is substantially the same as the first embodiment. The difference between the third embodiment and the first embodiment is that the fixing member mounting member 5 and the laser diode mounting member constituting the base 2 are different. That is, the shape of FIG. 8 is configured as shown in FIG. 10 to FIG.
  • the deflection preventing means 15 is formed by both the fixing member mounting member 5 and the laser diode mounting member 8. Both sides of the axis part 33 connecting the one end 31 of the laser diode 1 to the light receiving end 32 of the laser light in the first optical fiber 4 and the side part of the fixing member 6 located on the side close to the laser diode 1
  • the radius prevention means 15 provided on both sides are constituted by a laser diode mounting member 8 and an integral member.
  • three first laser welded portions 10 are provided at each of the fixing portions of the fixing member mounting member 5 and the fixing members 6 and 7.
  • two fixing portions are provided at each of the above fixing portions.
  • the number of laser welds 10 at each of the fixing portions is not particularly limited, and is appropriately set.
  • the third embodiment can also provide substantially the same effects as the first embodiment.
  • the present invention is not limited to each of the above embodiments, but can adopt various embodiments.
  • the deflection preventing means 15 One side of the axis 1 33 connecting one end 3 1 of the diode 1 to the light receiving end 32 of the laser beam in the first optical fiber 4 and the side of the fixing member 6 located on the side close to the laser diode 1 It is formed in a region including both sides.
  • the radius preventing means 15 is provided along at least one side of at least one side of the first optical fiber 4, at least along a part of the longitudinal direction of the optical fiber, and the radius of the base 2 is provided. The configuration may be such that only the configuration of the embodiment is prevented.
  • the deflection preventing means 15 is provided at least on one side of the axis portion 33, the deflection of the base 2 in the axis portion 33 can be suppressed, and the laser diode 1 and the first A decrease in optical coupling efficiency with the optical fiber 4 can be efficiently suppressed. Therefore, it is preferable to provide the bending prevention means 15 at least on one side of the axis portion 33 (more preferably, on both sides of the axis portion 33).
  • At least one of the fixing members which support the first optical fiber 4 at positions spaced from each other in the longitudinal direction of the first optical fiber 4. If the bending preventing means 15 is provided on one side of the fixing member located closest to the laser diode 1, the displacement of the support position of the first optical fiber 4 on the side near the laser diode 1 can be suppressed. . Therefore, it is possible to efficiently suppress a decrease in optical coupling efficiency between the laser diode 1 and the first optical fiber 4 due to the bending of the base 2. Therefore, it is preferable to provide the bending prevention means 15 on one side of the fixing member located closest to the laser diode 1.
  • the bending preventing means 15 is configured by forming a wall standing upright from the bottom 16 of the fixing member mounting member 8 in the longitudinal direction of the optical fiber.
  • the configuration of the deflection preventing means 15 is not particularly limited, and may be a configuration other than the embodiment.
  • rod-shaped or square-shaped deflection prevention The means 15 may be provided by being fixedly adhered to the fixing member mounting member 5.
  • the base 2 is configured to have the fixing member mounting member 5 and the laser diode mounting member 8.
  • the configuration of the base 2 is not particularly limited to the embodiment.
  • the base 2 may be formed of one member having a fixing member mounting portion for mounting the fixing members 6 and 7.
  • the first optical fiber 4 is fixed by the fixing members 6 and 7 at two points with an interval in the longitudinal direction.
  • the first optical fiber 4 can be properly aligned and fixed with respect to the laser diode 1 as compared with the conventional example.
  • the first laser welded portion 10 and the second laser welded portion 11 are The height in the direction perpendicular to the package bottom plate 26 should be substantially the same. By doing so, it is possible to reduce the displacement of sleep 3 that occurs when base 2 curves, as compared with the conventional semiconductor laser module, and the light between laser diode 1 and first optical fiber 4 can be reduced. A reduction in coupling efficiency can be suppressed.
  • the first optical fiber 4 has a configuration in which the fiber lens 14 has a spherical shape.
  • the shape of the fiber lens 14 of the first optical fiber 4 is not particularly limited and may be another shape.
  • the fiber lens 14 may be a wedge-shaped anamorphic (rotationally asymmetric) lens or may be a non-wedge-shaped anamorphic lens.
  • 14a indicates a ridge line.
  • a fiber lens 14 is formed on the distal end side of the first optical fiber 4 so that the first optical fiber 4 and the laser diode 1 are optically coupled to each other.
  • a lens system similar to the collimator lens 51 or the condenser lens 56 is provided between the first optical fiber 4 and the laser diode 1 so that the first optical fiber 4 and the laser diode 1 are connected to each other. It is also possible to have a configuration in which the light is optically coupled.
  • the collimator lens 51, the isolator 53, and the condenser lens 57 are provided between the second optical fiber 13 and the other end 30 of the laser diode 1. .
  • the collimating lens 51 and the isolator 53 may not be used.
  • a fiber lens 23 may be formed on the distal end side of the second optical fiber 13 as shown in FIG. 15, for example.
  • the fiber lens 23 may be an anamorphic lens as shown in FIG. 15 or a conical shape like the fiber lens 14 of the first optical fiber 4 in each of the above embodiments. It can be a fiber lens.
  • the fixing member mounting member 5 is provided so as to protrude from the rear end side of the first optical fiber 4 with respect to the laser diode mounting member 8, and the monitor photodiode 9 and the monitor photodiode are fixed to the protruding region.
  • Section 39 is provided.
  • the fixing member mounting member 5 is formed so as to protrude from the laser diode 'mounting member 8, and the monitor photo diode fixing portion 39 is separate from the base 2. May be provided.
  • the fixing member mounting member 5 When the fixing member mounting member 5 is formed so as to protrude from the laser diode mounting member 8, the fixing members 6, 7 and the sleeve 3, the first optical fiber 4, which are mounted on the protruding portion, are attached to the laser diode mounting member. 8 can be suppressed from being affected. Therefore, it is possible to more efficiently suppress a decrease in the optical coupling efficiency between the laser diode 1 and the first optical fiber 4. If the protrusion length L of the fixing member mounting member 5 is too long, the bonding strength to the laser diode mounting member 8 will be insufficient. For this reason, there is a possibility that the adhesive may be peeled off when the protrusion is subjected to vibration. Therefore, it is preferable to set L ⁇ 5 mm.
  • the fixing member mounting member 5 When the fixing member mounting member 5 is formed so as to protrude from the laser diode mounting member 8, as shown in FIG. 13, the fixing member mounting member 5 is located below the fixing member 6 located closest to the laser diode 1. By forming the reinforcing portion 20, vibration of the fixed member mounting member 5 in the Y direction in the figure can be suppressed.
  • the contact area between the laser diode mounting member 8 and the fixing member mounting member 5 is increased. be able to . Therefore, both can be firmly fixed mechanically. Since the lower surface of the reinforcing portion 20 is not in contact with the thermo module 25, the reinforcing portion 20 is not affected by the bending of the thermo module 25.
  • the shape of the reinforcing portion 20 is not particularly limited, and may be another shape. For example, it may have a rectangular parallelepiped shape as shown in FIG. 13 or may have a configuration having a tapered surface as shown by oblique line A in FIG.
  • the fixing member mounting member 5 is formed so as to protrude from the laser diode mounting member 8
  • the capturing portion 20 may not be provided.
  • the fixing member 6 located closest to the laser diode 1 is formed as an integrated component having the holding portion 28 as shown in FIG. 5, but the structure of the fixing member 6 Is not particularly limited, and may have another configuration.
  • the radius of the base 2 in the X direction can be suppressed.
  • the laser diode mounting member 8 and the bottom plate 26 of the package 27 are made of the same material to have the same linear expansion coefficient, but the laser diode mounting member 8 and the bottom plate 2 of the package 27 are the same. As long as the coefficient of linear expansion of 6 is substantially the same, different materials may be used. It is preferable that the linear expansion coefficients of the laser diode mounting member 8 and the bottom plate 26 of the package 27 be substantially the same, but they may be different from each other.
  • the lead terminal 60 is formed to protrude outward from the side wall of the package 27, but the lead terminal 60 may be formed to extend downward from the side wall of the package 27.
  • the arrangement form and shape of the lead terminals 60 and the shape of the package 27 are arbitrarily designed.
  • the semiconductor laser module of each embodiment is applied to a Raman amplifier.
  • the semiconductor laser module of the present invention is not only used as an excitation light source for a Raman amplifier, but also used for other than a Raman amplifier. It is applied to various light sources for optical communication, such as an excitation light source for an amplifier and a signal light source.
  • the semiconductor laser module and the Raman amplifier using the semiconductor laser module according to the present invention are suitable for use in optical communication and the like, which obtain a stable laser output while suppressing the influence of temperature change. I have.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Lasers (AREA)
  • Semiconductor Lasers (AREA)

Abstract

L'invention concerne un module laser à semi-conducteur présentant une puissance de sortie élevée, un bruit réduit, une excellente stabilité de longueur d'onde et une haute fiabilité, indépendamment d'une variation de température de son environnement de fonctionnement. Un module thermique (25) comprenant un matériau plat côté base (17), un matériau plat côté plaque inférieure (18) ainsi que des éléments de Peltier (19) est disposé sur la plaque inférieure (26) d'un boîtier (27), une base (2) étant disposée sur ce module thermique (25). De plus, une diode laser (1), une première fibre optique (4) permettant de rediriger le faisceau laser émis depuis la diode laser (1) vers cette diode laser (1), ainsi que des éléments de fixation (6, 7) destinés à supporter la première fibre optique (4) dans au moins deux positions longitudinales sont disposés sur la base (2), laquelle est constituée par un élément de montage de diode laser (8) situé sur le module thermique (25) et par un élément de montage d'élément de fixation (5) intégré. Ledit élément de montage de diode laser (8) est constitué d'un matériau doté d'un coefficient d'expansion linéaire intermédiaire entre le coefficient d'expansion linéaire de l'élément de montage d'élément de fixation (5) et celui du matériau plat côté base (17) du module thermique (25).
PCT/JP2001/009741 2000-11-07 2001-11-07 Module laser a semi-conducteur et amplificateur raman utilisant ledit module WO2002039154A1 (fr)

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JP2000339342A JP2002148489A (ja) 2000-11-07 2000-11-07 半導体レーザモジュールおよびその半導体レーザモジュールを用いたラマンアンプ
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JP2005159104A (ja) * 2003-11-27 2005-06-16 Sony Corp レーザ・システム
WO2010109701A1 (fr) * 2009-03-26 2010-09-30 古河電気工業株式会社 Module laser à semi-conducteur et élément de suppression
JP2009267386A (ja) * 2008-03-31 2009-11-12 Furukawa Electric Co Ltd:The 半導体レーザモジュールおよび抑制部材
JP5385674B2 (ja) * 2009-04-28 2014-01-08 ファイベスト株式会社 レーザモジュール

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JPS6471193A (en) * 1987-09-11 1989-03-16 Japan Aviation Electron Laser diode module
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