WO2002016854A1 - Procédé et dispositif de circulation d'air en salle informatique - Google Patents

Procédé et dispositif de circulation d'air en salle informatique Download PDF

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Publication number
WO2002016854A1
WO2002016854A1 PCT/US2001/022620 US0122620W WO0216854A1 WO 2002016854 A1 WO2002016854 A1 WO 2002016854A1 US 0122620 W US0122620 W US 0122620W WO 0216854 A1 WO0216854 A1 WO 0216854A1
Authority
WO
WIPO (PCT)
Prior art keywords
air
equipment
assembly
cooling
equipment assembly
Prior art date
Application number
PCT/US2001/022620
Other languages
English (en)
Inventor
R. Stephen Spinazzola
Dennis L. Peltz
Original Assignee
Toc Technology, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/784,238 external-priority patent/US6494050B2/en
Priority claimed from US09/842,167 external-priority patent/US6412292B2/en
Application filed by Toc Technology, Llc filed Critical Toc Technology, Llc
Priority to EP01961666A priority Critical patent/EP1334326A4/fr
Priority to JP2002521908A priority patent/JP2004508526A/ja
Priority to AU2001282912A priority patent/AU2001282912A1/en
Publication of WO2002016854A1 publication Critical patent/WO2002016854A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present invention relates to a computer room reduced air flow method and apparatus but is not limited to use in computer rooms and instead can be utilized with respect to any equipment assembly requiring cooling which is positioned in a room.
  • the method and apparatus described below permits achieving energy savings while reducing the amount of air required to cool electronic/heat generating equipment, wherein a computer rack heat extraction device (CRHED) or similar device is utilized.
  • the method and apparatus permits the collection of heat generating, for example, by the rack electronic equipment.
  • Figure 3 A conventional computer room method and assembly is illustrated in Figure 3 which exemplifies the approach for cooling electronic equipment commonly used currently wherein an array of racks of equipment are positioned on a raised floor.
  • Figure 3 illustrates an air- conditioning system used in the method and apparatus of a conventional system wherein a room space 1 defined by a room floor 2, side walls 3 and a ceiling 4 having a plurality of ceiling panels 4a is provided.
  • the room floor 2 is positioned a predetermined distance above a base floor 5 such that the room floor 2 and the base floor 5 in combination form a double floor structure having a free space 6 (i.e., an air passageway) formed therein.
  • a free space 6 i.e., an air passageway
  • a rack 7 for one or more computer processing units (CPUs) is disposed on the floor 2 wherein electronic cables for the rack are capable of being housed in the free space 6 of the double floor structure but can be specifically communicated to the rack separate from the free air space, if desired.
  • CPUs computer processing units
  • a plurality of support members 2b can be provided which are stationary by being fixed by bolts or similar fastening elements to predetermined positions on the floor 2.
  • the rack 7 is positioned in a casing 8 having air inlets 8a and air outlets 8b formed respectively in a bottom plate of a casing 8 and in the ceiling portion of the casing 8.
  • a computer case fan 9 is operable during operation of the equipment 7 so as to assist the air flow upwardly from the casing through the air outlets 8b.
  • the CPU members are arranged in an air passageway formed within the casing 8.
  • the floor 2 includes a plurality of floor panels located on support members or pedestals 2b, one panel 2a of which includes a plurality of perforations to allow air flow as indicated by the arrows to flow through the front of the outside housing to casing 8, through the CPU rack 7 and out the back of casing 8.
  • a cooling unit 14 is positionable either inside or outside the room 1 and is communicated with a heat exchanger or other air conditioning equipment so as to permit a cooling coil 15 located within unit 14 to cool air blowing there through.
  • the cooling unit 14 also includes a fan 16 which is positionable below cooling coil 15.
  • An inlet 20 is provided to allow air from the room to flow thereinto from the room, the air in the casing 8 mixing with room air prior to being introduced into the cooling unit 14, as illustrated in Figure 3.
  • the fan 16 is therefore arranged between the air inlet 20 and an air outlet 22 located at the lower portion of unit 14 and feeds air into the free space 6 located above the base floor.
  • the fan 16 thus permits air in the interior of the room to be sucked into the air inlet 20 of the casing 8 and also permits the air in the room to pass through cooling coil 15.
  • the air in the room is typically at a temperature of 75°F ⁇ .
  • the above-noted approach for cooling electronic equipment thus permits the area in the free space 6 below the raised floor 2 to be used for cable management and also serves as a supply air plenum.
  • the computer room air conditioning units utilize cooling coil 15 to cool the air.
  • the CRACUs supply conditioned air at approximately 55°F to the underfloor supply air plenum or free space 6.
  • the floor tiles with perforations or slots to allow air to flow from under the raised floor to above the floor are positionable below or are located adjacent to the rack 7.
  • Other perforated tiles are positionable throughout the room to provide air supply to other heat generating equipment and to maintain the room at an ambient environment.
  • the conditioned air is then drawn into the rack 7 by either convection by air flow from perforated panels 2a and/or opening 8a to the casing 8 or by fans 9 located in the top of the racks.
  • the air enters the racks at a temperature of approximately 55°F, is heated by the CPUs or other electronic equipment, and flows upwardly out of the rack at approximately a temperature of 95°F.
  • the warm air leaves the rack and mixes with the conditioned ambient environment of the room 1 which is at a temperature of approximately 75 °F, and thus returns to the CRACUs at a temperature of approximately 75°F as illustrated in Figure 3.
  • a conventional CRACUs have a 20° delta T ( ⁇ 4°F) across the cooling coil 15. This is also coincident with the space delta T which is defined as being the difference in temperature between the air supplied to the space and the air returned from such space.
  • the temperature of the air returned from the space is usually coincident with the ambient space temperature such that the return air at 75 °F enters the return on top of the CRACUs, passes along the cooling coil 15 and is discharged at a temperature of substantially 55 °F at the bottom of unit 14 so as to pass into the free space 6.
  • the required air quantity to cool such space is a direct function of the space delta T.
  • the equation set forth below is used to calculate the required air flow or cubic feet per minute (CFM) of air to cool a space:
  • Figure 4 of the present application shows an air conditioning system used in a method and apparatus as described in such application.
  • the room space is defined by room floor 2, sidewalls 3 and an upper ceiling 4 wherein a lower ceiling 4a is formed, for example, of ceiling tiles defining, a ceiling plenum 4b, and a base floor 5.
  • the room floor 2 is formed a predetermined distance from the base floor such that the room floor 2 and the base floor 5 collectively form a double floor structure having a free space 6 or air passageway formed therein within which electric cables may also be housed.
  • air flow from space 6 can enter one side portion of each of the CPU racks and flow across the same towards a plenum 8c which can run the full length of the equipment assembly so as to permit air to flow across each CPU in the rack and then flow upwardly towards a plurality of ducts 24.
  • the ducts 24 are sealed with respect to the equipment assembly by, for example, rubber gaskets wherein similar rubber gaskets 26 are provided between the duct 24 and the lower ceiling 4a.
  • Figure 1 shows an air conditioning system use in the method and apparatus according to an additional earlier concept also developed by the inventors.
  • the structure corresponding to that described above with regard to Figure 3 utilizes the same reference numbers.
  • the embodiment shown in Figure 2 utilizes an attachment either on the back or top of the computer rack (or cabinet) to collect the warm air from the equipment in the rack.
  • the apparatus as shown in Figure 1 uses space available within the back and top of the rack for the same purpose wherein the use of the existing space allows for both space and cost efficiencies.
  • the apparatus shown therein utilizes a cavity type front door 8 consisting of a solid outer panel 8f and a perforated plate inner panel 8b.
  • Cooling air from below the raised floor 2 is directed first into an air plenum in the bottom of the rack. From the plenum, the cooling air is directed into the air space or cavity 8d and the door that extends the entire front of the rack 7.
  • the air cavity channels the cool air and distributes the cool air more evenly across the front of the equipment in the rack 7. Therefore, this improvement in the distribution of air allows for more even cooling of the equipment.
  • the design shown in Figure 1 also incorporates an air space or cavity 8e between the perforated plate 8b and the front 7a of the equipment 7.
  • This air space 8e allows for some re-circulated air to pass from the back 7b of the rack (i.e., the warm side) to the front 7a of the rack 7 (the cold side).
  • Some recirculation may be required since the internal fans (not shown) in the equipment in the rack 7 may be moving more air than is supplied to the rack from the under-floor system described above.
  • the above-noted design allows for either a single fan or a plurality of fans 25 at the top of the rack to exhaust the heat.
  • the fan or fans 25 may be a single speed, variable speed or adjustable speed type of fan, depending upon the specific need for the device.
  • Figure 2 illustrates the manner in which perforated panel and the solid panels 8a and 8c at the front and back of the cabinet are pivotable so as to be opened for repair and/or replacement of the equipment in the rack 7.
  • the flow arrow shown in Figure 5 serves to illustrate the manner in which air flow occurs, including exiting of air into the ceiling plenum 4b.
  • An object of the present invention is to provide a method and apparatus which utilizes an increased delta T to reduce the required air quantity, thus resulting in a reduced airflow method and apparatus.
  • the present invention utilizes an approximately 40°F delta T to reduce the CFM by substantially 50%.
  • the substantially 50% reduction in the airflow will serve to effectively correspondingly reduce the required power by substantially 50%, resulting in substantial energy savings.
  • a key element of the method and apparatus is an increase in delta T above what is conventionally used.
  • the present invention is capable of operating in a range of delta T from 25°F to 45°F.
  • the use of a 40°F in the description set forth below is solely exemplary in illustrating the device and greater or lesser temperature variations are possible.
  • An object of at least one embodiment of the present invention is to provide an air conditioning method and apparatus which utilizes the steps of supplying cooling air generated from a cooling apparatus into an air passageway formed below a floor; guiding the cooling air within the air passageway into an equipment assembly disposed on the floor through an opening located in the floor; communicating the cooling air introduced into the equipment assembly into a plenum and introducing the air released from within the equipment into the plenum for communicating such released air to the cooling apparatus.
  • the method may also include the step of guiding the air from the equipment assembly through at least one duct into the plenum and may include the step of cooling the cooling air generated from the cooling apparatus to a temperature of substantially 55°F while also heating the air released from the equipment assembly to a temperature of substantially 95 °F prior to introducing such air to the cooling apparatus so as to form a closed loop in terms of cycling of the air through the cooling assembly and the equipment assembly.
  • a further object of the present invention is to obtain a temperature differential between the air supplied to the air passageway or plenum from the cooling apparatus and the air introduced into the plenum from the equipment assembly so as to be substantially 40°F, thus permitting lower power requirements of the fan utilized to assist flow of the air in the closed loop.
  • a further object of the present invention is to position the fan between the cooling apparatus and the air passageway so as to permit blowing of the air into the passageway towards the equipment assembly, although it is understood that the fan can be located anywhere within the closed loop so as to assist flow of air between the blowing apparatus and the equipment assembly.
  • a further object of the present invention is to provide a method and apparatus wherein the cooling assembly is located either within or outside the computer room, the equipment assembly comprising either at least one computer processing unit or other type of processing unit in combination with an additional heat generating equipment or without such equipment.
  • a further object, of the present invention is to cool equipment assembly generating heat which does or does not include computer equipment.
  • An additional object of the present invention is to provide an air conditioning assembly for performing the method described above.
  • An additional object of the present invention is to provide a CPU rack housing with a cavity type front door having a substantially solid outer panel and a perforated plate inner panel so that cooling air from below the raised floor is directed first into an air plenum in the bottom of the rack. From the plenum, the cooling air can be directed into an air space or cavity in the door that extends the entire front of the rack such that the air cavity channels cool air and distributes the cool air more evenly across the front of the equipment in the rack and thus allows for more even cooling of the equipment.
  • a further object of the present invention is to provide an improved design which incorporates an air space or cavity between the perforated plate and the front of the equipment so that the air space allows for some re-circulated air to pass from the back of the rack (the warm side) to the front of the rack (the cold side).
  • An additional object of the present invention is to permit either a single fan or a plurality of fans to be positioned at the top of the rack so as to exhaust the heat wherein the fan or fans have a single speed, variable speed or adjustable speed capability, depending upon the specific need for the device.
  • Another feature of the device is the ability to cool more heat generating electronic equipment in a cabinet than can be cooled with the conventional system.
  • the conventional system as shown in Figure 3 has been shown to experience overheating of equipment at conditions above 4KW of name plated heat rejection of electronic equipment per cabinet.
  • a cabinet equipped with the CRHED and associated improvements will effectively cool up to 8KW of name plated heat rejection of electronic equipment.
  • the ability to cool more equipment in a single cabinet result in more revenue per unit area of a building.
  • an additional feature of the present invention is to provide a heating and cooling method in accordance with the above-noted objects wherein cooling air is fed to the heat generating electronic equipment in the cabinet by means of a cooling duct in the ceiling which permits air to be fed to the equipment at a temperature of substantially 55°F which is thermally isolated from the remaining volume of the ceiling plenum itself which permits return of air via a duct from the heating equipment at a temperature of substantially 95° and which is returned to the heating and air conditioning system described above.
  • This permits the cooling air to be fed to the equipment via the ceiling rather than via than the plenum provided beneath the floor and above the base floor.
  • This embodiment permits the cooled air plenum provided in the ceiling duct to communicate cooled air at a temperature of substantially 55°F into the equipment via a duct which permits heated air from the heat generating electronic equipment to exit from the cabinet of the equipment into the ceiling for return to the heating and air conditioning system for being cooled to a temperature of substantially 55° by the cooling unit 14 so as to complete the cycle of flow of air to and from the heat generating electronic equipment in the cabinet.
  • FIG. 1 illustrates an air conditioning method and apparatus used in an embodiment of the present invention previously developed by the inventors.
  • Fig. 2 is a top view of the structure shown in Figure 1, which illustrates the capability of the panels to be pivotable on the cabinet.
  • FIG. 3 illustrates a conventional air conditioning method and apparatus
  • Fig. 4 illustrates a concept of the inventors designed for an air conditioning method and apparatus which was developed subsequent to the initial embodiment shown in Figure 1.
  • Fig. 5 illustrates an air conditioning method and apparatus according to the present invention
  • FIG. 6 is a top view of the structure shown in Figure 5, which illustrates the capability of the panels to be pivotable on the cabinet.
  • FIG. 7 illustrates a second embodiment of the air conditioning method and apparatus in accordance with the present invention.
  • Fig. 8 is a top view of the structure shown in Figure 7, which illustrates the capability of the panels to be pivotable on the cabinet.
  • FIG. 9 illustrates a third embodiment of the air conditioning method and apparatus used in the present invention.
  • Fig. 10 is a top view of the structure shown in Figure 9, which illustrates the capability of the panels to be pivotable on the cabinet.
  • Figures 5 and 6 illustrate the first embodiment in accordance with the present invention wherein structure similar to that shown in Figures 1-4 is illustrated using the same reference number but in a 100 series.
  • Figures 5 and 6 serve to illustrate the air-conditioning system used in the method and apparatus of the present invention wherein a room space 101 is defined by a floor 102, side walls 103 and a ceiling 104 having a plurality of ceiling panels 104a.
  • the room floor 102 is positioned a predetermined distance above the base floor 105 such that the room floor 102 and base floor 105 in combination form a double floor structure having a free space 106 (i.e. air passageway) formed therein.
  • a rack 107 for one or more computer processing units (CPUs) is disposed in a casing 108 located on the floor 102 wherein electronic cables for the rack are capable of being housed in the free space 106 of the double floor structure but can be specifically communicated through the rack 107 separate from the free air space, if desired.
  • CPUs computer processing units
  • a plurality of support members can be provided which are stationary by being fixed by bolts or similar fastening elements to the predetermined positions on the floor 102.
  • the rack 107 is positioned in the casing 108 has the casing is provided with air inlets 108a and air outlets 108h.
  • a computer case fan 125 is operable during operation of the rack 107 so as to assist the flow upwardly from the casing through the air outlets 108h.
  • a cooling unit similar to that of cooling unit 14 illustrated in Figure 4 is positionable either inside or outside the room 101 and is communicated with a heat exchange or other air conditioning equipment as previously described so as to permit the cooling coil 15 located within the unit 14 to cool air blowing therethrough.
  • the cooling unit 14 also includes a fan 16 which is positionable below cooling coil 15 as shown in Figure 4.
  • a fan 16 which is positionable below cooling coil 15 as shown in Figure 4.
  • the casing 108 inlet 108a in the form of an opening in the bottom part of the equipment for permitting air at substantially 55° to flow into the equipment, a perforated plate inner panel 108b, a rear wall 108c of the casing 108, and an air space or cavity 108d located between panel 108b and the outer wall of the casing 108 and room space 101.
  • a single fan or plurality of fans 125 is provided at opening 108h.
  • the embodiment shown in Figures 5 and 6 allows for heat rejected from the rack to be ventilated directly into the space of the computer room and allows the rack to be used in existing computer rooms.
  • FIG. 7 The second embodiment of the present invention is shown in Figures 7 and 8 wherein an additional duct 104c is provided for directly communicating cooled air at a temperature of substantially 55° to an additional duct 108g that directly leads into an opening 108a formed in the upper portion of the casing 108 as illustrated in Figure 7.
  • the third embodiment shown in Figures 9 and 10 of the present invention includes a duct 104c similar to that of Figures 7 and 8 but wherein duct 125 is removed and that, instead, a fan or plurality of fans 125 permit the heated air to be returned directly into the computer room 101 wherein the air exiting from the casing 108 exits with a CFM based upon a 40°F ⁇ T load in cabinet 108.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Duct Arrangements (AREA)
  • Ventilation (AREA)

Abstract

La présente invention concerne un procédé et un dispositif mettant en oeuvre un différentiel thermique accru de façon à réduire la quantité d'air requise du système de conditionnement d'air (14), et donc à réduire la puissance de la circulation d'air. En l'occurrence, l'invention utilise un différentiel thermique de 40°F permettant de réduire les besoins en volume d'air soufflé d'environ 50% de façon à réduire d'autant la puissance requise pour les turbines (125), ce qui se retrouve sous forme d'économies d'énergie notables. La présente invention sert à faire passer dans un conduit d'air (104c) de l'air de refroidissement provenant d'une usine à froid, à guider l'air de refroidissement à l'intérieur du conduit d'air pour qu'il pénètre dans l'ensemble d'équipement, et à introduire l'air dégagé par l'équipement, soit dans une gaine pour que cet air dégagé aboutisse à l'usine à froid, soit dans la pièce dans laquelle l'équipement et/ou l'usine à froid se trouve.
PCT/US2001/022620 2000-08-23 2001-08-23 Procédé et dispositif de circulation d'air en salle informatique WO2002016854A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP01961666A EP1334326A4 (fr) 2000-08-23 2001-08-23 Proc d et dispositif de circulation d'air en salle informatique
JP2002521908A JP2004508526A (ja) 2000-08-23 2001-08-23 コンピュータ室の空気流の方法および装置
AU2001282912A AU2001282912A1 (en) 2000-08-23 2001-08-23 Computer room air flow method and apparatus

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US22688700P 2000-08-23 2000-08-23
US60/226,887 2000-08-23
US09/784,238 2001-02-16
US09/784,238 US6494050B2 (en) 2000-02-18 2001-02-16 Computer rack heat extraction device
US09/842,167 2001-04-26
US09/842,167 US6412292B2 (en) 2000-05-09 2001-04-26 Computer rack heat extraction device

Publications (1)

Publication Number Publication Date
WO2002016854A1 true WO2002016854A1 (fr) 2002-02-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/022620 WO2002016854A1 (fr) 2000-08-23 2001-08-23 Procédé et dispositif de circulation d'air en salle informatique

Country Status (4)

Country Link
EP (1) EP1334326A4 (fr)
JP (1) JP2004508526A (fr)
AU (1) AU2001282912A1 (fr)
WO (1) WO2002016854A1 (fr)

Cited By (12)

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WO2004049773A2 (fr) * 2002-11-25 2004-06-10 American Power Conversion Corporation Systeme de retrait d'air de ventilation
JP2010079919A (ja) * 2002-11-25 2010-04-08 American Power Conversion Corp 排気除去システム
US7862410B2 (en) 2006-01-20 2011-01-04 American Power Conversion Corporation Air removal unit
NL2003272C2 (nl) * 2009-07-23 2011-01-25 Volkerwessels Intellectuele Eigendom B V Koelinrichting en werkwijze voor het koelen van in een kast aangebrachte apparatuur.
US7903407B2 (en) 2008-07-31 2011-03-08 Hitachi, Ltd. Cooling systems and electronic apparatus
FR2980777A1 (fr) * 2011-09-30 2013-04-05 Airbus Operations Sas Systeme de ventilation et circuits de soufflage et d'extraction d'air d'un tel systeme, ainsi que baie avionique d'aeronef
US9237672B2 (en) 2008-12-04 2016-01-12 Io Data Centers, Llc System and method of providing computer resources
US9772610B2 (en) 2008-12-04 2017-09-26 Baselayer Technology, Llc Modular data center
US9952103B2 (en) 2011-12-22 2018-04-24 Schneider Electric It Corporation Analysis of effect of transient events on temperature in a data center
US10117362B2 (en) 2009-04-21 2018-10-30 Excalibur Ip, Llc Cold row encapsulation for server farm cooling system
US10212858B2 (en) 2009-04-21 2019-02-19 Excalibur Ip, Llc Cold row encapsulation for server farm cooling system
US11076507B2 (en) 2007-05-15 2021-07-27 Schneider Electric It Corporation Methods and systems for managing facility power and cooling

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JP5478185B2 (ja) * 2009-10-06 2014-04-23 高砂熱学工業株式会社 空調システム
JP5507213B2 (ja) * 2009-11-13 2014-05-28 株式会社Ｎｔｔファシリティーズ 電算機室用空調システム
JP5407977B2 (ja) * 2010-03-25 2014-02-05 富士通株式会社 空調システム及び空調方法
JP7186507B2 (ja) * 2018-02-22 2022-12-09 高砂熱学工業株式会社 サーバ冷却システム及びサーバ冷却方法

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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004049773A3 (fr) * 2002-11-25 2004-09-30 American Power Conv Corp Systeme de retrait d'air de ventilation
JP2010079919A (ja) * 2002-11-25 2010-04-08 American Power Conversion Corp 排気除去システム
US7752858B2 (en) 2002-11-25 2010-07-13 American Power Conversion Corporation Exhaust air removal system
WO2004049773A2 (fr) * 2002-11-25 2004-06-10 American Power Conversion Corporation Systeme de retrait d'air de ventilation
US7862410B2 (en) 2006-01-20 2011-01-04 American Power Conversion Corporation Air removal unit
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JP2004508526A (ja) 2004-03-18
AU2001282912A1 (en) 2002-03-04
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EP1334326A1 (fr) 2003-08-13

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