WO2002013282A1 - Pompe a chaleur thermoelectrique - Google Patents

Pompe a chaleur thermoelectrique Download PDF

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Publication number
WO2002013282A1
WO2002013282A1 PCT/IT2001/000438 IT0100438W WO0213282A1 WO 2002013282 A1 WO2002013282 A1 WO 2002013282A1 IT 0100438 W IT0100438 W IT 0100438W WO 0213282 A1 WO0213282 A1 WO 0213282A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermoelectric
thermoelectric device
heat exchange
heat pump
couples
Prior art date
Application number
PCT/IT2001/000438
Other languages
English (en)
Inventor
Vincenzo Picone
Original Assignee
Peltech S.R.L.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peltech S.R.L. filed Critical Peltech S.R.L.
Publication of WO2002013282A1 publication Critical patent/WO2002013282A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Definitions

  • the present invention generally relates to the field of thermoelectric devices used for cooling and heating purposes in the civil, industrial, automotive, nautical, aeronautical, aerospace and military sectors.
  • Thermoelectric cooling and heating is generally based on the Peltier effect. This is a phenomenon whereby heat is liberated or absorbed at a junction of two dissimilar metals or a junction of a metal and a semiconductor when an electric current is passed through the junction. The junction becomes hot or cold depending on the direction in which the current is passed through the junction.
  • the Peltier effect is reversible, i.e. if the direction of the electric current is reversed, the cold junction becomes hot and the hot junction becomes cold. It has been found that the Peltier effect is magnified by using metal-semiconductor junctions rather than metal-metal junctions.
  • thermoelectric device generally designates a solid state device that makes use of the Peltier effect , f° r heating or cooling a material substance.
  • thermoelectric element generally designates a metallic conductor or a semiconductor forming the element of a junction.
  • thermoelectric couple designates a combination of two dissimilar thermoelectric elements forming a junction.
  • thermoelectric cell designates an array of thermoelectric couples electrically connected in series.
  • thermoelectric devices As known, solid state thermoelectric devices based on the Peltier effect are commercially available since 1960 and thenceforward great investments have been made into the development of suitable materials for the purpose of increasing the efficiency and performance of such devices.
  • thermoelectric elements were made of a metallic conductor, whereas at present the modern semiconductor technology permits thermoelectric elements to be made of Bi 2 Te 3 , PbTe, SiGe and SiSb with N-type and P-type doping.
  • thermoelectric devices for the conventional refrigeration systems and therefore at present special high performing thermoelectric elements are being developed.
  • thermoelectric devices known in the art and available on the market comprise thermoelectric cells built in a planar configuration, but there are also known thermoelectric devices comprising thermoelectric cells built in a cylindrical configuration.
  • thermoelectric devices having thermoelectric cells built in a planar configuration the thermoelectric couples are assembled between a pair of plane substrates made of alumina or the like via a solder layer.
  • thermoelectric couples having thermoelectric cells built in a cylindrical configuration the thermoelectric couples are assembled on a flexible plastic material substrate which is subsequently deformed in a cylindrical shape.
  • thermoelectric devices has the disadvantage of limiting the maximum size of each thermoelectric cell because of the chemical and physical properties of materials used for the substrates which cannot withstand high thermal gradients. Therefore, the construction of thermoelectric devices having a capacity greater then 0.5 kW always requires a great number of small modules of thermoelectric cells which may occupy a great surface, in particular when built in a plane configuration.
  • thermoelectric cells having a cylindrical configuration or similar are preferred.
  • International Application Document WO 00/49664 annexed hereto describes a thermoelectric device having a circularly or spirally wound configuration.
  • the present invention relates to a solid state thermoelectric device for a thermoelectric heat pump including an array of thermoelectric couples electrically connected in series and thermally connected in parallel so that all the hot and cold sides of the thermoelectric couples are separately arranged on opposite surfaces of the thermoelectric device and is characterised in that the thermoelectric couples are supported on a flexible polymeric substrate made of polyimide, polyethylene naphtalate, polyaryl heteroketone, polysulphon, polypheniloxide or polyphenilsulphur, said flexible polymeric substrate being wound in a cylindrical or spiral configuration so as to form a hollow core of the thermoelectric device.
  • the solid state thermoelectric device for a thermoelectric heat pump including an array of thermoelectric couples electrically connected in series and thermally connected in parallel so that all the hot and cold sides of the thermoelectric couples are separately arranged on opposite surfaces of the thermoelectric device is characterised in that the thermoelectric couples are supported on a flexible polymeric substrate made of polyimide, polyethylene naphtalate, polyaryl heteroketone, polysulphon, polypheniloxide or polyphenilsulphur, said flexible polymeric substrate being arranged in a configuration having a polygonal cross section so as to form a hollow core of the thermoelectric device.
  • the thermoelectric device comprises a first heat exchange tube arranged inside the hollow core of the thermoelectric device and a second heat exchange tube arranged outside the hollow core of the thermoelectric device, said first heat exchange tube being provided with turbulence generating means on its inner surface or inside its hollow space for producing a turbulent flow of a heat exchange fluid therethrough and said second heat exchange tube being provided with heat exchange fins on its outer surface.
  • thermoelectric device comprises coupling means at its end portions for permitting its first exchange tube to be connected to a pipe line through which a heat exchange fluid is passed.
  • thermoelectric heat pump comprising a plurality of thermoelectric devices the two end portions of which are connected to a first and second manifold, respectively, through which a heat exchange fluid is distributed to the thermoelectric device, said thermoelectric heat pump being provided with fan means for producing a flow of cooling air through the heat exchange fins of each thermoelectric device.
  • FIG. 1 is a partial cross sectional view of a first embodiment of the thermoelectric cell according to the present invention
  • FIG. 2 is a partial cross sectional view of a second embodiment of the thermoelectric cell according to the present invention.
  • FIG. 3 is a partial cross sectional view of a third embodiment of the thermoelectric cell according to the present invention.
  • Figures 4A and 4B are a front and rear view, respectively, of the thermoelectric cell of Figures 1 and 2
  • Figure 5 is a cross sectional view of a first embodiment of a thermoelectric device built using the thermoelectric cells of Figures 1 and 2
  • FIG. 6 is a cross sectional view of a second embodiment of a thermoelectric device built using the thermoelectric cells of Figures 1 and 2,
  • FIG. 7 is a cross sectional view of a third embodiment of a thermoelectric device using the thermoelectric cell of Figures 2 or 3,
  • FIG 8 is a perspective view of the third embodiment of the thermoelectric cell according to the present invention
  • Figure 9 is a side elevation view of a thermoelectric device using the thermoelectric cells according the first, second and third embodiment of the present invention
  • FIG 10 is a longitudinal cross sectional view of the thermoelectric device of Figure 9
  • Figure 11 is an assembly view of turbulent flow generating means of a heat exchanger used in the thermoelectric device of Figure 9,
  • Figure 12 is a front elevation view of a heat exchanger built with a plurality of thermoelectric devices of Figure 9,
  • Figure 13 is a rear elevation view of the heat exchanger of Figure 12.
  • thermoelectric cell comprises a pair of flexible laminates each consisting of a layer of polymeric material, for example polyimide PI available on the market under the trademark Kapton MT®, polyethylene naphtalate PEN available on the market under the trademark Kaladex®, polyaryl heteroketone PEEK available on the market under the trademarks Ultrapek® or Kadel®, polysulphon PSU, polyphenyloxide PPO, polyphenylsulphur PPS, and a layer of metallic material, for example copper.
  • polyimide PI available on the market under the trademark Kapton MT®
  • polyethylene naphtalate PEN available on the market under the trademark Kaladex®
  • polyaryl heteroketone PEEK available on the market under the trademarks Ultrapek® or Kadel®
  • polysulphon PSU polyphenyloxide PPO
  • polyphenylsulphur PPS polyphenylsulphur PPS
  • metallic material for example copper.
  • the two laminates are mutually and directly joined together by means of an adhesive resin with a high coefficient of heat transmission, for example an epoxy resin or an acrylic resin containing a silver or metal oxide filler.
  • the connections for the thermoelectric elements are made on the metallic material layer of the laminates via an etching process.
  • Numeral 10 designates the connections onto which the N-type and P-type thermoelectric elements 11 and 12 respectively are soldered by using an eutectic tin alloy.
  • the thickness of the connections 10 will vary depending on the electric power to be supplied to the thermoelectric device and preferably it should range from 100 to 400 microns.
  • Numeral 13 designates the layer of polymeric material of the laminates and numeral 14 designates the adhesive material joining together the laminates.
  • the thickness of the layer of polymeric material of the laminates should range from 25 to 150 microns.
  • the purpose of the adhesive material 14 is to pack the hollow core of the thermoelectric device and even the contacting surfaces of the two laminates, in order to prevent formation of air bubbles and to level of possible surface imperfections.
  • Another purpose of the adhesive material 14 is to assure a good transmission of heat.
  • a thermosetting resin for example an epoxy resin containing a finely ground metallic element filler should be used.
  • the resin is spread with a scraper in order to limit the quantity of material deposed and to form a thin layer, preferably having a thickness not greater than 10 to 15 microns.
  • the resin should be formulated so as to simultaneously and completely set during the final soldering operation of the thermoelectric couples.
  • FIGS 4A and 4B show the thermoelectric cell of Figure 1 in a plane condition.
  • Numerals 16 and 17 designate the terminals allowing connection of thermoelectric cell to a power source not shown in the drawings.
  • the thermoelectric couples are arranged on a portion only of the laminate, the remaining portions L1 , L2, L3 and L4 being provided for permitting the laminates once attached to be deformed into a cylindrically wound configuration or a spirally wound configuration so as to form a hollow core of the thermoelectric device as taught by the pending International Application WO 00/49664 and shown in Figures 5 and 6 of the drawings.
  • thermoelectric cell of the present invention there is shown a second embodiment of the thermoelectric cell of the present invention.
  • the thermoelectric cell comprises a flexible laminate consisting of a layer of polymeric material, for example the same polymeric used in the first embodiment, and two layers of metallic material, for example copper, each arranged on the two opposite faces of the layer of polymeric material.
  • the laminate is deformed into a cylindrical configuration or a spiral configuration so as to form a hollow core of the thermoelectric device as taught by the pending International Application WO 00/49664.
  • thermoelectric elements are made on the metallic material layer of the laminates via an etching process.
  • Numeral 10 designates the connections onto which the N-type and P-type thermoelectric elements 11 and 12 respectively are soldered by using an eutectic tin alloy.
  • the thickness of the connections 10 will vary depending on the electric power to be supplied to the thermoelectric device and preferably it should range from 100 to 400 microns.
  • Numeral 13 designates the layer of polymeric material of the laminate.
  • the thickness of the layer of polymeric material 13 of the laminate should be chosen so as to assure on the one hand a good mechanical strength and on the other hand an effective transmission of heat.
  • the thickness of the layer of polymeric material should range from 25 to 150 microns.
  • thermoelectric cell of Figure 2 shows the thermoelectric cell of Figure 2 in a plane condition.
  • the thermoelectric cell is subsequently deformed into a cylindrically wound configuration or a spirally wound configuration so as to form a hollow core of the thermoelectric device as shown in Figures 5 and 6 of the drawings.
  • Figure 3 of the drawings there is shown a third embodiment of the thermoelectric cell of the present invention.
  • the thermoelectric cell comprises a rigid laminate consisting of a layer of ceramic material, for example alumina or similar, and two layers of metallic material, for example copper, each arranged on the two opposite faces of the layer of ceramic material.
  • Numeral 10 designates connections onto which the N-type and P- type thermoelectric elements 11 and 12 respectively are soldered by using an eutectic tin alloy and numeral 15 designates the rigid layer of ceramic material.
  • the thickness of the connections 10 should range from 100 to 400 microns and the thickness of the layer of ceramic material 15 should range from 25 to 150 microns.
  • thermoelectric cells according to the second or third embodiment are cascaded in series thermally and arranged so as to form a hollow core of the thermoelectric device having a polygonal cross section.
  • numeral 18 designates the heat exchange fins provided on the external heat exchange tube designated by numerals 19, 22 and 24, respectively.
  • Numerals 20, 23 and 26 designate the internal heat exchange tube around which the thermoelectric cells are arranged.
  • Numeral 21 designates the passage for the heat exchange fluid to be cooled or heated by means of the thermoelectric device.
  • thermoelectric device of Figures 5, 6 or 7 used as a module for example in the construction of a heat pump.
  • the capacity of the thermoelectric device may range from 0.3 to 2.5 kW depending on the design specifications required for obtaining a high efficiency of thermal exchange and on the intended use of the heat pump.
  • thermoelectric device is provided with couplings for connecting it to a pipe line.
  • Numeral 27 designates a screw-type coupling. Of course, other kinds of couplings may be also used.
  • Numeral 28 designates two closure elements made of polymeric material which thermally insulate the hollow core of the thermoelectric device and also form the body thereof.
  • the polymeric material from which the covers 28 are made may be polytetrafluorethylene, polyvinylidene fluoride, polyamide 6.6 with glass fibre or high density polyethylene filler according to the kind of fluid to be cooled or heated and to the design specifications.
  • Turbulent flow generating means designated by 33 are provided inside the hollow core of the thermoelectric device for increasing the heat exchange efficiency of the thermoelectric device.
  • Means 33 consist of a first series of disks designated by 29 for distributing the heat exchange fluid along the walls of the hollow core and, intercalated therewith, a second series of disks designated by 31 for uniformly distributing the temperature inside the heat exchange fluid.
  • Disks 29 are provided with a series of radial grooves 30 formed on their surface. Because the disks 29 are in thermal contact with the surface of the interior heat exchange tube 20,23,26 the grooves 30 increase the surface contacted by the heat exchange fluid and cause a turbulent flow to be generated.
  • disks 31 have a smooth surface and are provided with a central bore designated by 32 through which the heat exchange fluid is passed. Disks 31 are also in thermal contact with the surface of the interior heat exchange tube 20,23,26 and their purpose is to uniformly distribute the temperature inside the fluid. Generally, disks 31 will have a thickness smaller than that of the disks 29 since they serve as intervening elements.
  • the diameter of the passage 32 for the heat exchange fluid may vary according to the properties of the heat exchange fluid and the design specifications of the thermoelectric device. Both the disks 29 and 31 may be made of the same metallic material, for example aluminium.
  • a modular heat pump formed of a plurality of thermoelectric devices having a predetermined capacity.
  • the thermoelectric devices are in fluid communication with two manifolds designated by 34 and 40, respectively.
  • the manifolds distribute the heat exchange fluid through the thermoelectric devices.
  • Numerals 35 and 36 designate the heat exchange fluid outlet and inlet, respectively, of the modular heat pump.
  • Numeral 38 designates a pair of thermocouples which are provided for controlling the temperature of the heat exchange fluid at the inlet and outlet of the modular heat pump.
  • thermocouples are generally connected to a control unit, not shown in the Figure, which is provided for controlling the power supplied to the heat pump through cables 37 according to the heat load.
  • the modular heat pump may be attached to a support by means of fittings which are designated by 41 in Figure 12.
  • a flow of air is produced through the heat pump by means of fans designated by 44.
  • the rating of the fans 44 and the dimension of the paddles designated by 42 depend on the required design specifications.
  • the number of fans shown in Figure 13 is not binding to the purposes of the present invention.
  • Numeral 43 designated the power supply terminals provided for the fan motors.
  • the supply voltage may be equal of different to that used for supplying the heat pump depending on the required design specifications.
  • Numeral 45 designates the air duct wherein the fans 44 are mounted.
  • the air duct may be made of a metallic or polymeric material.
  • thermoelectric devices which form the modular heat pump may range from 0.3 to 2.5 kW depending on the design specifications required for obtaining a high efficiency of thermal exchange and on the intended use of the heat pump. In this way the heat pump may have a high capacity and at the same time be very compact in size.

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  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif thermoélectrique à l'état solide pour pompe à chaleur thermoélectrique, comprenant un réseau de couples thermoélectriques électriquement connectés en série et thermiquement connectés en parallèle de façon que tous les côtés chauds et froids des couples thermoélectriques soient disposés séparément sur les surfaces opposées du dispositif thermoélectrique. Ledit dispositif se caractérise en ce que les couples thermoélectriques ont pour support un substrat polymérique flexible fait de polyimide, de polyéthylène naphtalate, de polyaryl hétérocétone, de polysulphone, de polyphényloxyde ou de polyphényle de soufre. Le substrat polymérique flexible est enroulé selon une configuration cylindrique ou hélicoïdale de façon à former un noyau creux dans le dispositif thermoélectrique. En variante, le substrat polymérique flexible possède une configuration présentant une section transversale polygonale de façon à former un noyau creux dans le dispositif thermoélectrique.
PCT/IT2001/000438 2000-08-09 2001-08-07 Pompe a chaleur thermoelectrique WO2002013282A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT2000MI001863A IT1318752B1 (it) 2000-08-09 2000-08-09 Pompa di calore a stato solido di potenza espandibile con modulitermoelettrici multistadio.
ITMI2000A001863 2000-08-09

Publications (1)

Publication Number Publication Date
WO2002013282A1 true WO2002013282A1 (fr) 2002-02-14

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Family Applications (1)

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PCT/IT2001/000438 WO2002013282A1 (fr) 2000-08-09 2001-08-07 Pompe a chaleur thermoelectrique

Country Status (2)

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IT (1) IT1318752B1 (fr)
WO (1) WO2002013282A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700052B2 (en) * 2001-11-05 2004-03-02 Amerigon Incorporated Flexible thermoelectric circuit
WO2004051158A2 (fr) * 2002-12-02 2004-06-17 Peltech S.R.L. Module thermoelectrique integre
EP2462635A1 (fr) * 2009-08-06 2012-06-13 Laird Technologies, Inc. Modules thermoélectriques, ensembles thermoélectriques et procédés liés

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056848A (en) * 1961-07-24 1962-10-02 North American Aviation Inc Portable generator utilizing direct conversion of heat to electricity
FR1353485A (fr) * 1962-10-18 1964-02-28 Dehavilland Aircraft Perfectionnements aux convertisseurs d'énergie thermo-électriques
US3554815A (en) * 1963-04-30 1971-01-12 Du Pont Thin,flexible thermoelectric device
US3740273A (en) * 1969-01-31 1973-06-19 Biviator Sa Miniaturized electric source having a radioactive heat source
FR2620573A1 (fr) * 1987-09-16 1989-03-17 Orquera Henri Panneau transducteur chaleur/electricite a nombreux thermocouples en forme de film mince plie en accordeon
US5228923A (en) * 1991-12-13 1993-07-20 Implemed, Inc. Cylindrical thermoelectric cells
WO1994018516A1 (fr) * 1993-02-02 1994-08-18 Hydrocool Pty. Ltd. Echangeur de chaleur a collecteur

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056848A (en) * 1961-07-24 1962-10-02 North American Aviation Inc Portable generator utilizing direct conversion of heat to electricity
FR1353485A (fr) * 1962-10-18 1964-02-28 Dehavilland Aircraft Perfectionnements aux convertisseurs d'énergie thermo-électriques
US3554815A (en) * 1963-04-30 1971-01-12 Du Pont Thin,flexible thermoelectric device
US3740273A (en) * 1969-01-31 1973-06-19 Biviator Sa Miniaturized electric source having a radioactive heat source
FR2620573A1 (fr) * 1987-09-16 1989-03-17 Orquera Henri Panneau transducteur chaleur/electricite a nombreux thermocouples en forme de film mince plie en accordeon
US5228923A (en) * 1991-12-13 1993-07-20 Implemed, Inc. Cylindrical thermoelectric cells
WO1994018516A1 (fr) * 1993-02-02 1994-08-18 Hydrocool Pty. Ltd. Echangeur de chaleur a collecteur

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700052B2 (en) * 2001-11-05 2004-03-02 Amerigon Incorporated Flexible thermoelectric circuit
WO2004051158A2 (fr) * 2002-12-02 2004-06-17 Peltech S.R.L. Module thermoelectrique integre
WO2004051158A3 (fr) * 2002-12-02 2004-07-22 Peltech Srl Module thermoelectrique integre
CN1329701C (zh) * 2002-12-02 2007-08-01 派尔技术有限公司 集成热电组件
EP2462635A1 (fr) * 2009-08-06 2012-06-13 Laird Technologies, Inc. Modules thermoélectriques, ensembles thermoélectriques et procédés liés
EP2462635A4 (fr) * 2009-08-06 2014-07-02 Laird Technologies Inc Modules thermoélectriques, ensembles thermoélectriques et procédés liés

Also Published As

Publication number Publication date
IT1318752B1 (it) 2003-09-10
ITMI20001863A0 (it) 2000-08-09
ITMI20001863A1 (it) 2002-02-11

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