EP1222434A1 - Echangeur thermique pour pompe a chaleur electronique - Google Patents

Echangeur thermique pour pompe a chaleur electronique

Info

Publication number
EP1222434A1
EP1222434A1 EP00969084A EP00969084A EP1222434A1 EP 1222434 A1 EP1222434 A1 EP 1222434A1 EP 00969084 A EP00969084 A EP 00969084A EP 00969084 A EP00969084 A EP 00969084A EP 1222434 A1 EP1222434 A1 EP 1222434A1
Authority
EP
European Patent Office
Prior art keywords
heat exchanger
fins
heat
heat pump
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00969084A
Other languages
German (de)
English (en)
Other versions
EP1222434A4 (fr
Inventor
Andrew W. Batchelor
Ben Banney
David Mcdonald
Tilak T. Chandratilleke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hydrocool Pty Ltd
Original Assignee
Hydrocool Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hydrocool Pty Ltd filed Critical Hydrocool Pty Ltd
Publication of EP1222434A1 publication Critical patent/EP1222434A1/fr
Publication of EP1222434A4 publication Critical patent/EP1222434A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/04—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
    • F28F1/045—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular with assemblies of stacked elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels

Definitions

  • This invention relates to electronic heat pumps and finned heat exchangers for transferring heat to and from such heat pumps.
  • An electronic heat pump is defined herein as any heat pump or refrigerating module that directly depends upon flow of electrons and / or energy changes of electrons for its operation. This definition includes, but is not limited to, thermo-electric heat pumps and thermionic heat pumps.
  • a heat exchanger for an electronic heat pump comprising: a thermally conductive base plate having first and second surfaces; the first surface being flat and adapted to make intimate surface contact with a surface of an electronic heat pump the second surface being obverse to the first surface and supporting an array of thermally conductive fins, adjacent fins defining there between a plurality of channels.
  • streams of coolant are forced to flow along a series of channels over the face of the electronic heat pump - see
  • an object of the present invention to extend the area of convective heat transfer between the electronic heat pump and coolant to a size significantly greater than the available area on the surface of the electronic heat pump.
  • a heat exchanger for one side of an electronic heat pump having a cold side and a hot side comprising:- (i) a heat exchanger having a thermally conductive base plate adapted to be thermally coupled by one face to one side of the electronic heat pump and having a plurality of spaced apart thermally conductive heat exchanger fins projecting outwardly from the other face, adjacent fins defining channels there between, and (ii) a manifold having a recess for receiving the finned base plate and the backing plate, a fluid inlet to the recess and a fluid outlet from the recess.
  • an electronic heat pump and heat exchanger system comprising:-
  • the thermally conductive base plate is integral with the fins.
  • the base plate of the heat exchanger may be joined to the face of the heat pump using soft solder with low melting point and good thermal conductivity such as Indium. Low melting point helps to carry out the process of fusing the base plate to the electronic heat pump with minimum thermal damage while, high thermal conductivity facilitates low thermal contact resistance at the joined interface.
  • a practical advantage of the invention is that, the geometrical arrangement of the heat exchanger enables the use of heat pump face area in its entirety in the heat dissipation process to the fluid.
  • participating heat transfer surfaces of the electronic heat pump were obstructed by mechanical components such as seals, which lead to unsatisfactory operation of the peripheral parts of the electronic heat pump.
  • One aspect of the present invention relates to the application of a finned heat exchanger in a device which utilises an electronic heat pump to generate a thermal gradient.
  • a microchannel between a pair of adjacent fins is defined as a channel whose width is approximately 0.1 to 5mm and preferably about .4mm.
  • the fins which define the height of the microchannel are about 3.6mm high and having a thickness of about .8mm.
  • Fig. 1 is an exploded view of a heat pump and manifold assembly incorporating a finned heat exchanger according to one embodiment of the invention.
  • Fig. 2 is a cross-sectional view taken along lines ii - ii of Fig. 1 (when assembled),
  • Fig. 3 is an exploded view of a modified form of the heat pump and manifold assembly shown in Fig. 1 ,
  • Fig. 4 is a graph of the coefficient of performance against temperature difference for a thermo-electric heat pump
  • Fig. 5 is a schematic diagram of a plurality of the heat pump and manifold assemblies shown in Fig. 1 connected in series
  • Fig. 6. is a schematic diagram of a plurality of the heat pump and manifold assemblies shown in Fig. 1 connected in parallel
  • Fig. 7 is a schematic diagram of a refrigeration system incorporating the heat pump and manifold assembly of Fig. 1 ,
  • Fig. 8 is a cross-sectional view of fins of a heat exchanger according to another embodiment of the invention
  • Fig. 9 is a cross-sectional view of fins of a heat exchanger according to another embodiment of the invention.
  • Fig. 10 is an exploded view of a heat pump and manifold assembly incorporating two heat pumps according to another embodiment of the invention.
  • Fig. 1 1 is a perspective view of the heat pump and manifold assembly shown in Fig. 10,
  • Fig. 12 is a perspective view of one of the heat exchanger fin arrays shown in Fig. 10,
  • Fig. 13 is an enlarged view of portion of the heat exchanger fin arrays in Fig. 12,
  • Fig. 14 is a perspective view of the other fin array shown in Fig. 10,
  • Fig. 1 5 is an enlarged view of part of the fin array shown in Fig. 14,
  • Fig. 16 is a graph of the Nusselt number against Reynolds Number for fully developed flow in a duct
  • Fig. 17 is a graphical representation of coolant temperature profiles inside a channel of the finned heat exchanger shown in Fig. 1 ,
  • Fig. 18 is a graphical representation of coolant temperature profiles inside the passageway of a prior art manifold
  • Fig. 19 is a graphical representation of coolant temperature profiles inside a micro channel having an aspect ratio of 1 : 10,
  • Fig. 20 is a graphical representation of coolant temperature profiles inside a micro channel having an aspect ratio of 1 :6
  • Fig. 21 is a graphical representation of coolant temperature profiles inside a micro channel having an aspect ratio of 1 :4,
  • Fig. 22 is a graphical representation of coolant temperature profiles inside a micro channel having an aspect ratio of 1 :3
  • Fig. 23 is a graphical representation of coolant temperature profiles inside a micro channel having an aspect ratio of 1 :2, and
  • Fig. 24 is a graphical representation of coolant temperature profiles inside a micro channel having an aspect ratio of 1 : 1 .
  • the heat transfer system 10 includes an electronic heat pump 1 1 having, in this instance, an upper cold side 12 and a lower hot side 13, a cold side finned heat exchanger 14 including a cold side backing plate 15 and a cold side manifold 16.
  • a hot side finned heat exchanger 17 including a hot side backing plate 18 and a hot side manifold 19.
  • the finned heat exchangers 14 and 17 each consist of a flat base plate 15 integral with or joined to a plurality of parallel equally spaced fins 21 .
  • thermoelectric module 1 1 In order for the system to function, a liquid coolant is passed through the channels between the fins of the heat exchanger 17. Heat is then transferred away from the "hot side" of the thermoelectric module by conduction through the coolant in the heat exchanger channels and from the surface of the heat exchanger, conduction through the heat exchanger 17 and through the solder or other jointing compound fixing the heat exchanger 17 to the adjacent surface of the thermoelectric module 1 1 . Heat is transferred through the thermoelectric module 1 1 in its normal manner.
  • the second heat exchanger 14 may or may not be attached to the "cold side" of the thermoelectric module and operates in a similar fashion to the heat exchanger on the "hot side” but with the direction of heat flow reversed.
  • the respective orientation of the cold side and hot side are controlled by the electrical polarity of the electronic heat pump.
  • the dimensions of the system are based on the dimensions of the electronic heat pump 1 1 , which is determined by its manufacturer.
  • the heat exchanger 14, 17 consists of a flat base plate 15, 18 joined to a plurality of axially aligned, equally spaced fins, enclosed by a flat plate (e.g. 20) across the top of the fins.
  • the flat plate across the top of the fins is integral with the fins, forming channels surrounded by homogenous parent metal.
  • the number of fins, the dimensions of the fins, the dimensions of the space between the fins are optimised by numerical analysis of flow and heat transfer to ensure the most efficient convection for a minimum of flow resistance.
  • the cross-sectional shape of the fins may be further optimised from the simple rectangular shape to a more complex shape such as a trapezium to further heat transfer or to facilitate manufacture.
  • the surface of the base plate of the heat exchanger in contact with the heat pump is manufactured to sufficient flatness to ensure good thermal contact with the electronic heat pump.
  • the heat exchanger is made of a material with high thermal conductivity, is mechanically robust and resistant to corrosive damage by the coolant.
  • Each manifold 16 and 19 has the following functions, (a) an enclosure to receive and discharge the coolant, via ports 100, from an attached pipe, (b) a flow distributor to evenly distribute flow of coolant between the adjacent fins of the heat exchanger 14 or 17, (c) a structure to allow clamping forces between the heat exchangers and the electronic heat pump 1 1 .
  • each manifold is fitted with an entry and exit port 100 for fluid, the entry and exit ports are located at opposite ends of a diagonal that is drawn across the rectangular cross section of the cover. The purpose of this orientation is to ensure even distribution of flow to the fins, according to an earlier established principle as discussed in U.S. Patent No. 5,653,1 1 1 .
  • each manifold Adjacent to the exit and entry ports, there is a cavity 101 running from the port to at least the furthest fin.
  • the purpose of the cavity 101 is to ensure an even distribution of flow from the port to the fins of the heat exchanger 14 and 17.
  • Each manifold may be fitted with an equally spaced series of bolt-holes 102 running around the periphery of the cover. This allows provision of bolts and nuts to impose the said clamping force.
  • the electronic heat pump 11 is sandwiched between the two heat exchangers.
  • the ceramic exterior faces 110, 111 are in close contact with the base plates 15, 18 of the heat exchangers.
  • the base plates 15, 18 are restrained by their side edges soldered to a metallized surface on the ceramic faces 110, 111 and may be sealed against the interior surface 112 of the manifolds 16, 19.
  • O-ring seals 113 may be used to prevent leakage of fluid from the channels 101 into the central area 114 containing the heat pump 1.
  • the ports 100 lead into channels 101 which extend at least the full length of the array of fins 21.
  • Fig. 2 illustrates two distinct styles of heat exchanger fabrication.
  • the upper or cold side heat exchanger comprises an array of fins 21 and the base plate 15.
  • the array of fins and channels 21 include a covering plate 20 which may be integral with the fins or soldered onto the array of fins. It is this covering plate 20 which is in contact with and sealed against the manifold 16 so that fluid flow between the channels 101 occurs only through the array of fins 21.
  • the array of fins 21 may be open ended, with the distal tips of the fins contacting and sealing against the floor of the manifold 19.
  • a third variation is depicted in Fig. 3.
  • Fig. 3 illustrates a resilient polymeric sheet 120 interposed between one or both heat exchangers and their respective manifolds 16, 19.
  • These polymeric or soft metal sheets 120 may be used to ensure a proper resilient seal between an array of fins and its manifold when the manifolds are joined together. If effect, the sheets 120 are capable of taking up manufacturing tolerances, or in the case where open ended fins are used (as shown in Fig. 3) actually serve to seal the channels between fins against the inner surface of the manifold.
  • Fig. 4 shows a graph of COP (coefficient of performance) vs del T for a typical thermoelectric module (Frost 76S from Kryotherm).
  • Figs. 5 and 6 show a series and a parallel arrangement of heat exchanger 'units' to obtain a larger refrigerating power than can be achieved with a single heat exchanger and enclosed electronic heat pump.
  • Fig. 5 illustrates a series arrangement of devices 10 of the type depicted in Fig. 1 . It would be appreciated that by fluidly connecting adjacent devices 10 in a counter-current arrangement can result in the ability to accommodate greater thermal loads for a given rate of fluid flow.
  • the hot side of the device 10 is connected to the hot side of an adjacent device, the flows of hot and cold liquids travelling in opposite directions as illustrated.
  • Fig. 6 illustrates the parallel connection of two pairs of devices 10, each pair operating in series. Again, the flows of hot and cold liquids are travelling in opposite directions to maximise thermal efficiency.
  • the hot side fluid flows 130 are depicted as a solid line while the cold side fluid flows are illustrated with a dash line 131 .
  • Fig. 7 illustrates a schematic system diagram illustrating an application of the device 10 of the present invention.
  • a cold side heat secondary exchanger 150 is located within a refrigerated space 1 51 .
  • a small fan 152 circulates the air within the refrigerated space in an attempt to achieve thermal equilibrium.
  • the cold side secondary heat exchanger 150 is supplied with cold fluid from the electronic heat pump 10 by a pump 153.
  • the output of the electronic heat pump's hot side manifold is delivered to a secondary hot side fan assisted heat exchanger 154, circulation between the secondary heat exchanger 154 and the heat pump 10 being accomplished by a second pump 155.
  • Fig. 8 illustrates an array of fins 161 which may be used in place of the rectangular fins depicted in, for example, Figs 1 and 3.
  • These fins 161 are tapered and include longitudinal grooves 162 which serve to increase the surface area interface between the fins 161 and the channels 160.
  • the side surfaces of each fin are provided with a pair of "V" shaped grooves which promote heat transfer between the fin 161 and the channel 160.
  • Fig. 9 illustrates an alternate embodiment of an array of fins wherein the individual fins are replaced by a corrugated metal sheet 170 which is interposed between a pair of parallel sheets or plates 171 , 172.
  • two or more electronic heat pumps 1 1 may be stacked into a single working module 180.
  • the cold sides In this example, the cold sides
  • Each hot side 13 of the pair of electronic heat exchangers is associated with its own manifold and heat exchanger 182. As shown in Fig. 1 1 , liquid enters the upper and lower manifold entry ports 190 and exits through the hot side ports of the upper and lower manifolds 191 .
  • the central manifold and heat exchanger 192 circulates fluid past the cold sides of both of the heat pumps within the module 180.
  • Fig. 12 illustrates an array of fins 200.
  • Each fin 201 is generally rectangular in cross section.
  • Each pair of adjacent fins defines a microchannel there between.
  • the ends 202 of each fin 201 may be provided with a step 203 for the purpose of facilitating attachment to the manifold.
  • Fig. 14 illustrates the type of fin array which is required for the central manifold 181 depicted in Figs. 10 and 1 1 .
  • the array comprises a central web 204 which has similarly configured fins 205 directed outwardly from both its upper and lower surfaces.
  • the efficiency of the heat pump will be enhanced significantly if the same amount of heat can be pumped from the hot or cold side at a lower temperature difference between the surface of the thermoelectric module and the liquid passing through the heat exchanger. Since heat flow is equal to h c x Area x del T (where h c is the heat transfer coefficient), a relatively simple way to reduce del T is to increase Area. The design of the heat exchanger with multiple fins achieves this aim and leads directly to greater heat pump efficiency.
  • microchannels design confers. It has been found through recent research into the cooling of high heat load computer chips that the usage of microchannels leads to unexpectedly high heat transfer coefficients. The reasons are not yet clear but are believed to include the increased impact of surface tension and electric potential effects which lead to earlier transitions from laminar to turbulent flow. The effects of natural surface roughness are also magnified in microchannel flow and can contribute to the high heat transfer coefficients.
  • thermoelectric heat pumps When applied to cooling computer chips, very high heat loads are encountered. Heat fluxes of 75 W/cm 2 are now being achieved. Relatively high del T's are required for these heat loads which is in contrast with thermoelectrics.
  • the heat exchanger design exploits the high heat transfer coefficients possible with microchannels and applies the benefit to achieve relatively low heat fluxes (less than 1 W/cm 2 ) at very low del T's. These conditions are ideal for thermoelectric heat pumps and lead to significantly enhanced efficiencies.
  • Heat transfer in laminar flow is by conduction rather than by convection as is the case in turbulent flow. Because most liquids, including water, have low thermal conductivities this means that heat transfer coefficients are relatively low.
  • the flow in the heat exchangers of this design is in the laminar region and particular attention must then be paid to heat transfer coefficients because of the deleterious effects of high temperature differentials on the thermoelectric module.
  • a benefit which is exploited in the design is the known feature that the h c in developing laminar flow is significantly higher than in fully developed laminar flow.
  • the length of channels is controlled to a significant degree by the physical size of the thermoelectric module, typically 40 mm square, and the dimensions of the channels have been optimised within these restrictions so that flow exists predominantly in the developing region.
  • Heat flux from the walls of the channel into the liquid coolant is optimised when all parts of the channel surface are at a uniform temperature.
  • the design of the heat exchanger is such that this is achieved through careful consideration of fin height as well as spacing.
  • the length of the fin is critical because thermal resistance is proportional to fin length.
  • the narrow width of the channel eliminates the situation where the bulk of the fluid passes straight through a heat exchanger with the heat transfer restricted to a relatively thin film of fluid at the surface.
  • Fig. 17 shows temperature contours within a micro channel of one embodiment of a finned conductive heat exchanger having an aspect (i.e. width to height) ratio of 1 :3.5 on the hot side of a heat pump, the heat flux being 40,000 W/m 2 , inlet fluid temperature 27°C, flow rate 1 l/min with pure water coolant. These temperature gradients show minor variation (2.4°C) across the fluid, indicating that all of the fluid is involved in the heat transfer process with little bypass.
  • Fig. 18 shows temperature contours within a channel of a finned insulating heat exchanger having an aspect ratio of 1 :3.4 on the hot side of a heat pump, the heat flux being 40,000 W/m 2 , inlet fluid temperature 27°C, flow rate 1 l/min with pure water coolant.
  • the critical feature of the temperature profile is the difference in temperature between the fluid close to the heated surface and the bulk of the fluid. It can be seen that this difference is significantly less for the heat exchanger shown in Fig. 17 than for the earlier design involving plastic fins or partitions shown in Fig. 18 which has a temperature gradient of 30.7°C. This indicates that the heat exchanger has largely solved the problem of the earlier design where the bulk of the coolant remained effectively unheated during its passage through the heat exchanger.
  • the heat dissipation capability of the narrow channel heat exchanger is primarily dependent on the conduction of heat along the walls of the 15
  • the heat transfer performance of the narrow channel heat exchanger is evaluated and optimised to obtain the most effective flow arrangement.
  • the variation of fluid temperature contours with channel aspect ratio is illustrated in Figs. 19 to 24.
  • the range of aspect ratios found to be useful range from 4: 1 to 15: 1 .
  • the number of channels may range from a minimum of 10 up to a maximum of 100.
  • a thermally conductive base plate is integrated with the fins to ensure minimal thermal resistance to heat flow. This base plate could act as the wall of an electronic heat pump, replacing the low conductivity ceramic presently used.
  • the overall size of the heat exchanger is not limited to the surface area of the electronic heat pump. It can be made larger and because it is of high conductivity metal there will be minimal thermal resistance to the flow of heat. This enables an even greater expansion of the surface area for heat exchange to a liquid coolant through channels.
  • Other high conductivity devices such as heat pipes, can be used in conjunction with the heat exchanger in order to enlarge the potential contact area or to transport the heat load to a more convenient location for mounting of the heat exchanger.
  • the prior art includes many heat transfer mechanisms that generally yield significantly high levels of heat fluxes. Some such flow arrangements with inherently high rates of heat transfer are jet impingement cooling, interrupted jet cooling and heat transfer in very narrow passages or microchannels.
  • These special characteristics of flows and heat transfer in microchannels are the results of micron-scale channel size and, the interfacial electrokinetic and surface roughness effects near the solid-liquid interface. High convective heat flux rates achievable in microchannel flow is attributed to these vastly different flow phenomena that occur in narrow passages.
  • thermo-electric cooling module attempts to harness possible heat transfer enhancement in flow through narrow passages.
  • the preferred heat exchange is made of metal of high thermal conductivity and has several narrow rectangular passages through which the cooling liquid flows.
  • High thermal conductivity helps to spread heat flux evenly around the channel walls that are in contact with the liquid, thereby increasing the effective area heat transfer to the fluid. Due to special flow characteristics in narrow passages as in microchannels, high heat transfer rates are present in the flow. The developing nature of the flow through the passage further contributes to the heat transfer augmentation. The combined effect of all these mechanisms gives rise to significantly low thermal resistance between the thermo-electric module attached to the heat exchanger and the cooling fluid than previous designs of heat exchangers for similar applications.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

L'invention concerne un échangeur thermique (17) pour pompe à chaleur électronique (11) qui comprend une plaque de base conductrice (18) à première et seconde surfaces. La première surface est plate et permet un contact de surface étroit avec une surface de la pompe, et la seconde surface, à l'envers de la première, soutient un alignement d'ailettes conduisant la chaleur (21). Les ailettes adjacentes (21) définissent entre elles une pluralité de microcanaux.
EP00969084A 1999-10-07 2000-10-06 Echangeur thermique pour pompe a chaleur electronique Withdrawn EP1222434A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AUPQ332199 1999-10-07
AUPQ3321A AUPQ332199A0 (en) 1999-10-07 1999-10-07 Heat exchanger for an electronic heat pump
PCT/AU2000/001220 WO2001025711A1 (fr) 1999-10-07 2000-10-06 Echangeur thermique pour pompe a chaleur electronique

Publications (2)

Publication Number Publication Date
EP1222434A1 true EP1222434A1 (fr) 2002-07-17
EP1222434A4 EP1222434A4 (fr) 2005-09-28

Family

ID=3817481

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00969084A Withdrawn EP1222434A4 (fr) 1999-10-07 2000-10-06 Echangeur thermique pour pompe a chaleur electronique

Country Status (4)

Country Link
EP (1) EP1222434A4 (fr)
JP (1) JP2003511648A (fr)
AU (1) AUPQ332199A0 (fr)
WO (1) WO2001025711A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2392610C (fr) 2002-07-05 2010-11-02 Long Manufacturing Ltd. Echangeur de chaleur refroidi par parois cloisonnees
AU2003286821A1 (en) 2002-11-01 2004-06-07 Cooligy, Inc. Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
CA2425233C (fr) * 2003-04-11 2011-11-15 Dana Canada Corporation Echangeur thermique a plaques a ailettes a refroidissement sur surface froide
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US20070101737A1 (en) 2005-11-09 2007-05-10 Masao Akei Refrigeration system including thermoelectric heat recovery and actuation
TWI410595B (zh) * 2010-09-29 2013-10-01 Ind Tech Res Inst 熱電式飲用裝置及熱電式熱泵
JP6523049B2 (ja) * 2015-06-01 2019-05-29 カルソニックカンセイ株式会社 熱交換器
CN114440662B (zh) * 2020-10-30 2024-07-05 江西省瑞科制冷科技有限公司 一种注塑成型换热器装置
CN116007237A (zh) * 2022-04-15 2023-04-25 无锡暖芯半导体科技有限公司 一种半导体晶体制冷水冷换热装置及其使用方法

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Publication number Priority date Publication date Assignee Title
DE3937017A1 (de) * 1989-11-07 1991-05-08 Neuhaus Gerhard Peltier - kuehlblock
DE69209042T2 (de) * 1991-12-16 1996-10-02 At & T Corp Wärmeabfuhr durch engkanälige Kühlrippen um elektronisches Hochleistungskomponenten zu kühlen
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
US5448449A (en) * 1993-12-20 1995-09-05 The Whitaker Corporation Retainer for securing a heat sink to a socket
US5584183A (en) * 1994-02-18 1996-12-17 Solid State Cooling Systems Thermoelectric heat exchanger

Non-Patent Citations (2)

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Title
No further relevant documents disclosed *
See also references of WO0125711A1 *

Also Published As

Publication number Publication date
WO2001025711A1 (fr) 2001-04-12
EP1222434A4 (fr) 2005-09-28
AUPQ332199A0 (en) 1999-11-04
JP2003511648A (ja) 2003-03-25

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