JP4101174B2 - 熱交換器 - Google Patents
熱交換器 Download PDFInfo
- Publication number
- JP4101174B2 JP4101174B2 JP2003534833A JP2003534833A JP4101174B2 JP 4101174 B2 JP4101174 B2 JP 4101174B2 JP 2003534833 A JP2003534833 A JP 2003534833A JP 2003534833 A JP2003534833 A JP 2003534833A JP 4101174 B2 JP4101174 B2 JP 4101174B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat exchanger
- inlet
- outlet
- manifold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
Claims (10)
- 装置への又は装置からの熱を伝導する熱交換器において、
a)熱を伝導するよう構成され且つ配置された熱伝導面(128)(heat transfersurface)と、
b)少なくとも1つの入口マニホルド(140、240)、少なくとも1つの出口マニホルド(142、242)及び少なくとも1つの相互に接続する通路(144、244)とを含む熱交換部材(130、132)であって、前記少なくとも1つの相互に接続する通路(144、244)は、前記熱伝導面(128)と熱的に連通される(in theramal conductive communication)熱伝導構造体(154)を有し、且つ前記少なくとも1つの相互に接続する通路(144、244)は、前記少なくとも1つの入口マニホルド(140、240)を前記少なくとも1つの出口マニホルド(142、242)へ流体的に接続すると共に、1対のウエブ(170、180)の間に配されて前記入口マニホルド(140、240)と前記熱伝導面(128)との間を伸びる第一の部分(145)であって、作動流体流れを前記熱伝導面(128)の方向へ該表面と略直交する方向へ向ける前記第一の部分(145)と、1対のウエブ(170、180)の間に配されて前記熱伝導面(128)と前記出口マニホルド(142、242)との間を伸びる第二の部分(147)であって、作動流体流れを前記熱伝導面(128)から離れる方へ該表面と略直交する方向へ向ける前記第二の部分(147)とを含む前記熱交換部材(130、132)とを備え、
前記熱伝導構造体(154)は、前記1対のウエブ(170、180)の間で前記少なくとも1つの相互に接続する通路(144、244)内に配されて前記第一の部分(145)及び第二の部分(147)の両方内を少なくとも部分的に伸びることにより、熱を前記作動流体と前記熱伝導面(128)との間で、前記作動流体が前記熱伝導面(128)の方である該熱伝導面(128)と直交する方向へ流れるときに第一の方向へ伝導し、且つ前記作動流体が前記熱伝導面(128)から離れる方である該熱伝導面(128)と直交する方向へ流れるときに第二の方向へ伝導することを特徴とする熱交換器。 - 請求項1に記載の熱交換器において、
前記熱伝導構造体(154)は、前記少なくとも1つの入口マニホルド(140、240)及び前記少なくとも1つの出口マニホルド(142、242)内に配置された熱伝導フィン(154)を含み、
該フィン(154)は、前記入口マニホルド(140、240)内の第1の所定領域と前記出口マニホルド(142、242)内の第2の所定領域とを有し、
前記入口マニホルド(140、240)及び出口マニホルド(142、242)内のフィン(154)の前記領域は、前記入口及び出口マニホルド(142、242)の各々内の所望の熱伝導容量に従って決定される、熱交換器。 - 請求項2に記載の熱交換器において、
前記第1の所定領域及び第2の所定領域は、前記熱伝導容量が前記入口マニホルド(140、240)及び出口マニホルド(142、242)間で変化するように、略等しい、熱交換器。 - 請求項2に記載の熱交換器において、
前記第1の所定領域及び第2の所定領域は、前記熱伝導容量が前記入口マニホルド(140、240)及び出口マニホルド(142、242)間で略等しいように、略等しくない、熱交換器。 - 請求項2に記載の熱交換器において、
前記フィン(154)は更に前記相互接続通路内へ伸びており、前記入口マニホルド(140、240)、相互接続通路及び出口マニホルド(142、242)の間を伸びる単一の一体(single, unitary)構造として形成されている、熱交換器。 - 請求項1に記載の熱交換器において、
前記熱交換器内への作動流体を受け取るようにされた入口プレナム(124)と、前記熱交換器からの前記作動流体を取り除くようにされた出口プレナム(126)とを更に具備する、熱交換器。 - 請求項1に記載の熱交換器において、
前記少なくとも一つの相互に接続する通路(144、244)の前記第1及び第2の部分(145、147)が、略等しい断面面積を有する、熱交換器。 - 請求項1に記載の熱交換器において、
前記入口マニホルド(140、240)の数と前記出口マニホルド(142、242)の数とは異なる、熱交換器。 - 請求項1に記載の熱交換器において、
前記熱伝導構造体(154)は、前記第1の部分(145)内を第1の距離だけ伸び、且つ前記第2の部分(147)内を第2の距離だけ伸び、該第1及び第2の距離は異なる、熱交換器。 - 請求項1に記載の熱交換器において、
前記熱伝導構造体(154)は、前記第1の部分(145)内を第1の距離だけ伸び、且つ前記第2の部分(147)内を第2の距離だけ伸び、該第1及び第2の距離は等しい、熱交換器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32801301P | 2001-10-09 | 2001-10-09 | |
US10/266,300 US7278474B2 (en) | 2001-10-09 | 2002-10-08 | Heat exchanger |
PCT/US2002/032102 WO2003031898A1 (en) | 2001-10-09 | 2002-10-09 | High heat flux single-phase heat exchanger |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005505739A JP2005505739A (ja) | 2005-02-24 |
JP2005505739A5 JP2005505739A5 (ja) | 2006-03-02 |
JP4101174B2 true JP4101174B2 (ja) | 2008-06-18 |
Family
ID=26951749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003534833A Expired - Lifetime JP4101174B2 (ja) | 2001-10-09 | 2002-10-09 | 熱交換器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7278474B2 (ja) |
EP (1) | EP1442266A4 (ja) |
JP (1) | JP4101174B2 (ja) |
KR (1) | KR20040050910A (ja) |
CN (1) | CN1599858A (ja) |
WO (1) | WO2003031898A1 (ja) |
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US20060096738A1 (en) * | 2004-11-05 | 2006-05-11 | Aavid Thermalloy, Llc | Liquid cold plate heat exchanger |
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US7427566B2 (en) | 2005-12-09 | 2008-09-23 | General Electric Company | Method of making an electronic device cooling system |
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US8302671B2 (en) * | 2008-04-29 | 2012-11-06 | Raytheon Company | Scaleable parallel flow micro-channel heat exchanger and method for manufacturing same |
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US9275760B2 (en) | 2009-09-25 | 2016-03-01 | Terrapower, Llc | Heat exchanger, methods therefor and a nuclear fission reactor system |
CN102667953A (zh) * | 2009-09-25 | 2012-09-12 | 希尔莱特有限责任公司 | 热交换器、为此的方法以及核裂变反应堆系统 |
US20110075787A1 (en) | 2009-09-25 | 2011-03-31 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Heat exchanger, methods therefor and a nuclear fission reactor system |
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DE112013006883B4 (de) * | 2013-03-26 | 2022-01-20 | Mitsubishi Electric Corporation | Fahrzeug-Leistungswandlervorrichtung |
CN103426841A (zh) * | 2013-07-02 | 2013-12-04 | 北京睿德昂林新能源技术有限公司 | 一种功率半导体器件冷却装置 |
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-
2002
- 2002-10-08 US US10/266,300 patent/US7278474B2/en not_active Expired - Lifetime
- 2002-10-09 JP JP2003534833A patent/JP4101174B2/ja not_active Expired - Lifetime
- 2002-10-09 KR KR10-2004-7005282A patent/KR20040050910A/ko not_active Application Discontinuation
- 2002-10-09 WO PCT/US2002/032102 patent/WO2003031898A1/en active Application Filing
- 2002-10-09 CN CNA028241525A patent/CN1599858A/zh active Pending
- 2002-10-09 EP EP02769004A patent/EP1442266A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN1599858A (zh) | 2005-03-23 |
WO2003031898A1 (en) | 2003-04-17 |
EP1442266A4 (en) | 2007-05-23 |
EP1442266A1 (en) | 2004-08-04 |
US7278474B2 (en) | 2007-10-09 |
US20030066634A1 (en) | 2003-04-10 |
KR20040050910A (ko) | 2004-06-17 |
JP2005505739A (ja) | 2005-02-24 |
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