WO2002005603A1 - Multichip module connected to flexible, film-like substrate - Google Patents

Multichip module connected to flexible, film-like substrate Download PDF

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Publication number
WO2002005603A1
WO2002005603A1 PCT/FI2001/000657 FI0100657W WO0205603A1 WO 2002005603 A1 WO2002005603 A1 WO 2002005603A1 FI 0100657 W FI0100657 W FI 0100657W WO 0205603 A1 WO0205603 A1 WO 0205603A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
components
module
multichip module
film
Prior art date
Application number
PCT/FI2001/000657
Other languages
French (fr)
Inventor
Pekka Laukkala
Original Assignee
Nokia Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Oyj filed Critical Nokia Oyj
Priority to AU2001284066A priority Critical patent/AU2001284066A1/en
Publication of WO2002005603A1 publication Critical patent/WO2002005603A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Definitions

  • Multichip module connected to flexible, film-like substrate
  • the present invention relates to a multichip module comprising a substrate with components connected to it, said module being provided with connection pieces for its connection to a circuit board.
  • multichip modules are implemented using a rigid substrate (Common Circuit Base). Components are only connected to one side of the substrate. The other side of the substrate is a connection surface with pins for con- necting the module to a printed wiring board.
  • the components used in multichip modules may consist of conventional IC circuits, which are connected to the substrate using e.g. bond wires, as well as so-called flip-chip components, which are connected to the substrate using e.g. bonded joints.
  • Flip-chip components have the advantage of having a small size and a small space require- ment.
  • a drawback with present multichip modules is that the modules have a relatively large area and therefore take up much room on the circuit board as the components are only connected to one side of the substrate.
  • the object of the present invention is to eliminate the disadvantages of prior-art solutions and to achieve a new type of three-dimensional (3D) multichip module that will not take up much room on a circuit board and allow a compact package to be achieved.
  • a flexible, thin substrate film is used to which the components are connected on either side.
  • the multichip module of the invention is characterized in that the substrate is substantially film-like and flexible, that the components are connected to either side of the substrate, and that the module comprises filler layers fitted on either side of the substrate to stiffen the structure.
  • a preferred embodiment of the invention is characterized in that the substrate extends outside the filler layers and is bent against the outer surface of at least one filler layer to form the electric connection pieces of the module. Therefore, no separate connecting leads are needed, but the connecting surfaces can be formed directly in the area of the edge of the substrate.
  • Another embodiment of the invention is characterized in that the components in the upper layer are so disposed that their upper surfaces lie at the same plane, and that placed on top of them there is a cooling component comprising a plate- like part, so that a simple and effective cooling arrangement is achieved.
  • a further embodiment of the invention is characterized in that the substrate is bent so as to form a substantially closed structure, producing within the closed structure an electrically and magnetically protected space suitable for e.g. EMC components.
  • Fig. 1 presents a cross-sectional view of a multichip module according to the invention
  • Fig. 2 presents the module in Fig. 1 provided with soldering studs
  • Fig. 3 presents a perspective view of a multichip module according to the invention.
  • Fig. 4 presents the substrate of another multichip module according to the invention in perspective view.
  • the multichip module presented in Fig. 1 has in its middle a flexible, thin substrate film 1 (Common Circuit Base), which may be made of e.g. polyimide.
  • the film 1 may consist of e.g. four film layers provided with conductive metal films forming the conductor surfaces of the substrate.
  • IC components 2a - 2f Connected to the film 1 on ei- ther side of it are IC components 2a - 2f.
  • the components 2a - 2c in the upper layer are so-called flip-chip components, which are connected to the substrate 1 using e.g. a glue bonded joint 3a - 3c.
  • the components 2d - 2f in the lower layer may be conventional IC circuits, which can be connected to the substrate 1 e.g. by soldered joints 3d - 3f.
  • filler layers 4, 5 of e.g. cast resin, which is a dielectric material, are cast so as to surround the components 2a - 2f. In this way, a rectangular box-like package is formed.
  • the upper filler layer 4 fills the spaces between components 2a - 2c, and so the upper surface of the module consists of the upper surfaces of layer 4 and the upper-layer components 2a - 2c.
  • the upper surfaces of the flip-chip components 2a - 2c and of the upper filler layer 4 can be fitted to the same plane e.g. by grinding, so that a cooling plate 6 can be mounted upon them using e.g. thermopositive glue for cooling components 2a - 2c and the entire module.
  • the lower filler layer 5 covers the lower-layer components 2d - 2f completely, thus forming a continuous lower surface consisting of dielectric material.
  • edges 7a, 7b of the substrate film 1 extend outside the filler layers 4, 5 and are bent under the module so that they form connecting surfaces for connecting the module to a circuit board.
  • the connection may be implemented using e.g. soldering studs 8a, 8b as shown in Fig. 2.
  • Fig. 3 presents a perspective view of a multichip module according to the invention.
  • the surface of the substrate 1 may consist of conductive and non-conductive stripes, metallized areas 9 and non-conductive, e.g. polymer- based areas 10, the connecting surfaces of the module thus consisting of stripes 9.
  • Fig. 4 presents an embodiment in which the side edges 12a, 12b of the substrate 11 have been bent so that they cover the entire lower surface of the module, with only a small gap left between them.
  • the end edges 13a, 13b of the substrate 11 have been bent to the sides of the module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A multichip module comprising a substrate (1, 11) with components (2a - 2f) connected to it, said module comprising connection pieces for its connection to a circuit board. The substrate (1) is substantially film-like and flexible. The components (2a - 2f) are connected to either side of the substrate (1). Fitted on either side of the substrate (1) are filler layers (4, 5) to stiffen the structure. Using the multichip module of the invention, a very compact package is achieved and a small surface area is needed on the circuit board because the components can be packed in two or more layers on either side of the substrate.

Description

Multichip module connected to flexible, film-like substrate
The present invention relates to a multichip module comprising a substrate with components connected to it, said module being provided with connection pieces for its connection to a circuit board.
At present, multichip modules are implemented using a rigid substrate (Common Circuit Base). Components are only connected to one side of the substrate. The other side of the substrate is a connection surface with pins for con- necting the module to a printed wiring board. The components used in multichip modules may consist of conventional IC circuits, which are connected to the substrate using e.g. bond wires, as well as so-called flip-chip components, which are connected to the substrate using e.g. bonded joints. Flip-chip components have the advantage of having a small size and a small space require- ment.
A drawback with present multichip modules is that the modules have a relatively large area and therefore take up much room on the circuit board as the components are only connected to one side of the substrate.
The object of the present invention is to eliminate the disadvantages of prior-art solutions and to achieve a new type of three-dimensional (3D) multichip module that will not take up much room on a circuit board and allow a compact package to be achieved. In the module of the invention, a flexible, thin substrate film is used to which the components are connected on either side. The multichip module of the invention is characterized in that the substrate is substantially film-like and flexible, that the components are connected to either side of the substrate, and that the module comprises filler layers fitted on either side of the substrate to stiffen the structure.
Using the multichip module of the invention, a very compact package is achieved and a small surface area1 is needed on the circuit board because components can be packed in two or more layers on either side of the substrate. In addition, very short electric connections are achieved, thus reducing electric interference. Moreover, thanks to the thin substrate and compact package, effective cooling of the module is achieved. A preferred embodiment of the invention is characterized in that the substrate extends outside the filler layers and is bent against the outer surface of at least one filler layer to form the electric connection pieces of the module. Therefore, no separate connecting leads are needed, but the connecting surfaces can be formed directly in the area of the edge of the substrate.
Another embodiment of the invention is characterized in that the components in the upper layer are so disposed that their upper surfaces lie at the same plane, and that placed on top of them there is a cooling component comprising a plate- like part, so that a simple and effective cooling arrangement is achieved.
A further embodiment of the invention is characterized in that the substrate is bent so as to form a substantially closed structure, producing within the closed structure an electrically and magnetically protected space suitable for e.g. EMC components.
In the following, the invention will be described in detail by the aid of an example with reference to the attached drawings, wherein
Fig. 1 presents a cross-sectional view of a multichip module according to the invention,
Fig. 2 presents the module in Fig. 1 provided with soldering studs,
Fig. 3 presents a perspective view of a multichip module according to the invention, and
Fig. 4 presents the substrate of another multichip module according to the invention in perspective view.
The multichip module presented in Fig. 1 has in its middle a flexible, thin substrate film 1 (Common Circuit Base), which may be made of e.g. polyimide. The film 1 may consist of e.g. four film layers provided with conductive metal films forming the conductor surfaces of the substrate. Connected to the film 1 on ei- ther side of it are IC components 2a - 2f. The components 2a - 2c in the upper layer are so-called flip-chip components, which are connected to the substrate 1 using e.g. a glue bonded joint 3a - 3c. The components 2d - 2f in the lower layer may be conventional IC circuits, which can be connected to the substrate 1 e.g. by soldered joints 3d - 3f.
To encapsulate the module and to stiffen the structure, filler layers 4, 5 of e.g. cast resin, which is a dielectric material, are cast so as to surround the components 2a - 2f. In this way, a rectangular box-like package is formed.
The upper filler layer 4 fills the spaces between components 2a - 2c, and so the upper surface of the module consists of the upper surfaces of layer 4 and the upper-layer components 2a - 2c. The upper surfaces of the flip-chip components 2a - 2c and of the upper filler layer 4 can be fitted to the same plane e.g. by grinding, so that a cooling plate 6 can be mounted upon them using e.g. thermopositive glue for cooling components 2a - 2c and the entire module. The lower filler layer 5 covers the lower-layer components 2d - 2f completely, thus forming a continuous lower surface consisting of dielectric material.
The edges 7a, 7b of the substrate film 1 extend outside the filler layers 4, 5 and are bent under the module so that they form connecting surfaces for connecting the module to a circuit board. The connection may be implemented using e.g. soldering studs 8a, 8b as shown in Fig. 2.
Fig. 3 presents a perspective view of a multichip module according to the invention. As shown, the surface of the substrate 1 may consist of conductive and non-conductive stripes, metallized areas 9 and non-conductive, e.g. polymer- based areas 10, the connecting surfaces of the module thus consisting of stripes 9.
Fig. 4 presents an embodiment in which the side edges 12a, 12b of the substrate 11 have been bent so that they cover the entire lower surface of the module, with only a small gap left between them. In addition, the end edges 13a, 13b of the substrate 11 have been bent to the sides of the module. Thus, inside the substrate 11 a closed structure is formed, the continuous conductive surface of the substrate 11 forming inside the structure a space protected from electric and magnetic fields, so the components placed in this protected space may be EMC components. It is obvious to the person skilled in the art that different embodiments of the invention are not limited to the examples described above, but that they may be varied within the scope of the claims presented below. For instance, in addition to the one-layer film described above, the substrate may be bent into folds, al- lowing components to be placed in several layers.

Claims

1. Multichip module comprising a substrate (1, 11) with components (2a - 2f) connected to it, said module comprising connection pieces for its connection to a circuit board, characterized in that
the substrate (1 , 11) is substantially film-like and flexible,
the components (2a - 2f) are connected to either side of the substrate (1, 11), and
the module comprises filler layers (4, 5) fitted on either side of the substrate (1 , 11) to stiffen the structure.
2. Multichip module as defined in claim ^characterized in that the substrate (1, 11) extends outside the filler layers and is bent against the outer surface of at least one filler layer to form the electric connection pieces (7a, 7b, 12a, 12b) of the module.
3. Multichip module as defined in claim 1, characterized in that the components (2a - 2c) in the upper layer are so disposed that their upper surfaces lie at the same plane, and that a cooling component comprising a plate-like part (6) is placed on top of them.
4. Multichip module as defined in claim ^characterized in that the substrate (11) is bent so as to form a substantially closed structure, producing within the closed structure an electrically and magnetically protected space.
5. Multichip module as defined in claim 1, characterized in that the filler layers (4, 5) consist of cast resin.
6. Multichip module as defined in claim ^characterized in that the filler layers (4, 5) together with the components (2a - 2f) form a box-like structure.
PCT/FI2001/000657 2000-07-12 2001-07-10 Multichip module connected to flexible, film-like substrate WO2002005603A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001284066A AU2001284066A1 (en) 2000-07-12 2001-07-10 Multichip module connected to flexible, film-like substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20001654 2000-07-12
FI20001654A FI111197B (en) 2000-07-12 2000-07-12 Multichip module

Publications (1)

Publication Number Publication Date
WO2002005603A1 true WO2002005603A1 (en) 2002-01-17

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AU (1) AU2001284066A1 (en)
FI (1) FI111197B (en)
WO (1) WO2002005603A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102077341A (en) * 2008-06-26 2011-05-25 Nxp股份有限公司 Packaged semiconductor product and method for manufacture thereof
WO2011064272A2 (en) 2009-11-24 2011-06-03 Concepts For Success (C4S) Articles with overfolded and attached side margins
US8949323B2 (en) 2006-06-30 2015-02-03 Intel Corporation Method and system for the protected storage of downloaded media content via a virtualized platform

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031027A (en) * 1990-07-13 1991-07-09 Motorola, Inc. Shielded electrical circuit
FR2669179A1 (en) * 1990-11-08 1992-05-15 Bosch Gmbh Robert ELECTRICAL APPARATUS, IN PARTICULAR A SWITCHING AND CONTROLLING APPARATUS FOR MOTOR VEHICLES, AND METHOD FOR MANUFACTURING SAME.
DE19626126A1 (en) * 1996-06-28 1998-01-02 Fraunhofer Ges Forschung Method for forming a spatial chip arrangement and spatial chip arrangement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031027A (en) * 1990-07-13 1991-07-09 Motorola, Inc. Shielded electrical circuit
FR2669179A1 (en) * 1990-11-08 1992-05-15 Bosch Gmbh Robert ELECTRICAL APPARATUS, IN PARTICULAR A SWITCHING AND CONTROLLING APPARATUS FOR MOTOR VEHICLES, AND METHOD FOR MANUFACTURING SAME.
DE19626126A1 (en) * 1996-06-28 1998-01-02 Fraunhofer Ges Forschung Method for forming a spatial chip arrangement and spatial chip arrangement

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8949323B2 (en) 2006-06-30 2015-02-03 Intel Corporation Method and system for the protected storage of downloaded media content via a virtualized platform
US9323558B2 (en) 2006-06-30 2016-04-26 Intel Corporation Method and system for the protected storage of downloaded media content via a virtualized platform
CN102077341A (en) * 2008-06-26 2011-05-25 Nxp股份有限公司 Packaged semiconductor product and method for manufacture thereof
WO2011064272A2 (en) 2009-11-24 2011-06-03 Concepts For Success (C4S) Articles with overfolded and attached side margins
US9161866B2 (en) 2009-11-24 2015-10-20 Concepts For Success (C4S) Articles with overfolded and attached side margins

Also Published As

Publication number Publication date
AU2001284066A1 (en) 2002-01-21
FI20001654A (en) 2002-01-13
FI111197B (en) 2003-06-13
FI20001654A0 (en) 2000-07-12

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