WO2002005603A1 - Multichip module connected to flexible, film-like substrate - Google Patents
Multichip module connected to flexible, film-like substrate Download PDFInfo
- Publication number
- WO2002005603A1 WO2002005603A1 PCT/FI2001/000657 FI0100657W WO0205603A1 WO 2002005603 A1 WO2002005603 A1 WO 2002005603A1 FI 0100657 W FI0100657 W FI 0100657W WO 0205603 A1 WO0205603 A1 WO 0205603A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- components
- module
- multichip module
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Definitions
- Multichip module connected to flexible, film-like substrate
- the present invention relates to a multichip module comprising a substrate with components connected to it, said module being provided with connection pieces for its connection to a circuit board.
- multichip modules are implemented using a rigid substrate (Common Circuit Base). Components are only connected to one side of the substrate. The other side of the substrate is a connection surface with pins for con- necting the module to a printed wiring board.
- the components used in multichip modules may consist of conventional IC circuits, which are connected to the substrate using e.g. bond wires, as well as so-called flip-chip components, which are connected to the substrate using e.g. bonded joints.
- Flip-chip components have the advantage of having a small size and a small space require- ment.
- a drawback with present multichip modules is that the modules have a relatively large area and therefore take up much room on the circuit board as the components are only connected to one side of the substrate.
- the object of the present invention is to eliminate the disadvantages of prior-art solutions and to achieve a new type of three-dimensional (3D) multichip module that will not take up much room on a circuit board and allow a compact package to be achieved.
- a flexible, thin substrate film is used to which the components are connected on either side.
- the multichip module of the invention is characterized in that the substrate is substantially film-like and flexible, that the components are connected to either side of the substrate, and that the module comprises filler layers fitted on either side of the substrate to stiffen the structure.
- a preferred embodiment of the invention is characterized in that the substrate extends outside the filler layers and is bent against the outer surface of at least one filler layer to form the electric connection pieces of the module. Therefore, no separate connecting leads are needed, but the connecting surfaces can be formed directly in the area of the edge of the substrate.
- Another embodiment of the invention is characterized in that the components in the upper layer are so disposed that their upper surfaces lie at the same plane, and that placed on top of them there is a cooling component comprising a plate- like part, so that a simple and effective cooling arrangement is achieved.
- a further embodiment of the invention is characterized in that the substrate is bent so as to form a substantially closed structure, producing within the closed structure an electrically and magnetically protected space suitable for e.g. EMC components.
- Fig. 1 presents a cross-sectional view of a multichip module according to the invention
- Fig. 2 presents the module in Fig. 1 provided with soldering studs
- Fig. 3 presents a perspective view of a multichip module according to the invention.
- Fig. 4 presents the substrate of another multichip module according to the invention in perspective view.
- the multichip module presented in Fig. 1 has in its middle a flexible, thin substrate film 1 (Common Circuit Base), which may be made of e.g. polyimide.
- the film 1 may consist of e.g. four film layers provided with conductive metal films forming the conductor surfaces of the substrate.
- IC components 2a - 2f Connected to the film 1 on ei- ther side of it are IC components 2a - 2f.
- the components 2a - 2c in the upper layer are so-called flip-chip components, which are connected to the substrate 1 using e.g. a glue bonded joint 3a - 3c.
- the components 2d - 2f in the lower layer may be conventional IC circuits, which can be connected to the substrate 1 e.g. by soldered joints 3d - 3f.
- filler layers 4, 5 of e.g. cast resin, which is a dielectric material, are cast so as to surround the components 2a - 2f. In this way, a rectangular box-like package is formed.
- the upper filler layer 4 fills the spaces between components 2a - 2c, and so the upper surface of the module consists of the upper surfaces of layer 4 and the upper-layer components 2a - 2c.
- the upper surfaces of the flip-chip components 2a - 2c and of the upper filler layer 4 can be fitted to the same plane e.g. by grinding, so that a cooling plate 6 can be mounted upon them using e.g. thermopositive glue for cooling components 2a - 2c and the entire module.
- the lower filler layer 5 covers the lower-layer components 2d - 2f completely, thus forming a continuous lower surface consisting of dielectric material.
- edges 7a, 7b of the substrate film 1 extend outside the filler layers 4, 5 and are bent under the module so that they form connecting surfaces for connecting the module to a circuit board.
- the connection may be implemented using e.g. soldering studs 8a, 8b as shown in Fig. 2.
- Fig. 3 presents a perspective view of a multichip module according to the invention.
- the surface of the substrate 1 may consist of conductive and non-conductive stripes, metallized areas 9 and non-conductive, e.g. polymer- based areas 10, the connecting surfaces of the module thus consisting of stripes 9.
- Fig. 4 presents an embodiment in which the side edges 12a, 12b of the substrate 11 have been bent so that they cover the entire lower surface of the module, with only a small gap left between them.
- the end edges 13a, 13b of the substrate 11 have been bent to the sides of the module.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001284066A AU2001284066A1 (en) | 2000-07-12 | 2001-07-10 | Multichip module connected to flexible, film-like substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20001654 | 2000-07-12 | ||
FI20001654A FI111197B (en) | 2000-07-12 | 2000-07-12 | Multichip module |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002005603A1 true WO2002005603A1 (en) | 2002-01-17 |
Family
ID=8558772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FI2001/000657 WO2002005603A1 (en) | 2000-07-12 | 2001-07-10 | Multichip module connected to flexible, film-like substrate |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2001284066A1 (en) |
FI (1) | FI111197B (en) |
WO (1) | WO2002005603A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102077341A (en) * | 2008-06-26 | 2011-05-25 | Nxp股份有限公司 | Packaged semiconductor product and method for manufacture thereof |
WO2011064272A2 (en) | 2009-11-24 | 2011-06-03 | Concepts For Success (C4S) | Articles with overfolded and attached side margins |
US8949323B2 (en) | 2006-06-30 | 2015-02-03 | Intel Corporation | Method and system for the protected storage of downloaded media content via a virtualized platform |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5031027A (en) * | 1990-07-13 | 1991-07-09 | Motorola, Inc. | Shielded electrical circuit |
FR2669179A1 (en) * | 1990-11-08 | 1992-05-15 | Bosch Gmbh Robert | ELECTRICAL APPARATUS, IN PARTICULAR A SWITCHING AND CONTROLLING APPARATUS FOR MOTOR VEHICLES, AND METHOD FOR MANUFACTURING SAME. |
DE19626126A1 (en) * | 1996-06-28 | 1998-01-02 | Fraunhofer Ges Forschung | Method for forming a spatial chip arrangement and spatial chip arrangement |
-
2000
- 2000-07-12 FI FI20001654A patent/FI111197B/en active
-
2001
- 2001-07-10 WO PCT/FI2001/000657 patent/WO2002005603A1/en active Application Filing
- 2001-07-10 AU AU2001284066A patent/AU2001284066A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5031027A (en) * | 1990-07-13 | 1991-07-09 | Motorola, Inc. | Shielded electrical circuit |
FR2669179A1 (en) * | 1990-11-08 | 1992-05-15 | Bosch Gmbh Robert | ELECTRICAL APPARATUS, IN PARTICULAR A SWITCHING AND CONTROLLING APPARATUS FOR MOTOR VEHICLES, AND METHOD FOR MANUFACTURING SAME. |
DE19626126A1 (en) * | 1996-06-28 | 1998-01-02 | Fraunhofer Ges Forschung | Method for forming a spatial chip arrangement and spatial chip arrangement |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8949323B2 (en) | 2006-06-30 | 2015-02-03 | Intel Corporation | Method and system for the protected storage of downloaded media content via a virtualized platform |
US9323558B2 (en) | 2006-06-30 | 2016-04-26 | Intel Corporation | Method and system for the protected storage of downloaded media content via a virtualized platform |
CN102077341A (en) * | 2008-06-26 | 2011-05-25 | Nxp股份有限公司 | Packaged semiconductor product and method for manufacture thereof |
WO2011064272A2 (en) | 2009-11-24 | 2011-06-03 | Concepts For Success (C4S) | Articles with overfolded and attached side margins |
US9161866B2 (en) | 2009-11-24 | 2015-10-20 | Concepts For Success (C4S) | Articles with overfolded and attached side margins |
Also Published As
Publication number | Publication date |
---|---|
AU2001284066A1 (en) | 2002-01-21 |
FI111197B (en) | 2003-06-13 |
FI20001654A0 (en) | 2000-07-12 |
FI20001654A (en) | 2002-01-13 |
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