WO2001088211A2 - Procede de traitement de pieces a usiner au moyen d'une solution colloidale de palladium - Google Patents
Procede de traitement de pieces a usiner au moyen d'une solution colloidale de palladium Download PDFInfo
- Publication number
- WO2001088211A2 WO2001088211A2 PCT/EP2001/005064 EP0105064W WO0188211A2 WO 2001088211 A2 WO2001088211 A2 WO 2001088211A2 EP 0105064 W EP0105064 W EP 0105064W WO 0188211 A2 WO0188211 A2 WO 0188211A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- palladium
- solution
- work pieces
- liquid
- colloid solution
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/02—Reverse osmosis; Hyperfiltration ; Nanofiltration
- B01D61/027—Nanofiltration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/14—Ultrafiltration; Microfiltration
- B01D61/145—Ultrafiltration
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/20—Regeneration of process solutions of rinse-solutions
Definitions
- the present invention relates to a method for the treatment of work pieces with a palladium colloid solution, preferably to a method for the treatment with a hydrochloric palladium colloid solution being stabilized with tin.
- the surfaces thereof For the electroplating of work pieces the surfaces thereof must first be treated to render them electrically conductive if the work pieces have electrically nonconducting surfaces.
- the work pieces are dipped into a solution containing colloidal palladium.
- the palladium particles thereupon adsorbed on the surfaces serve as activators for initiating electroless metal deposition, which results in the production of an electrically conductive layer on the surface of the work pieces.
- This conductive layer may afterwards be electroplated with any metal.
- This process may for example be applied to the production of printed circuit boards and of sanitary appliances, metallized parts for automotive industry and of furniture mountings, especially for chromium plating of plastics parts.
- Palladium containing activating solutions are also used for direct plating on electrically nonconducting surfaces without using electroless plating methods.
- the adsorbed layer containing palladium is converted into an electrically conducting layer, which may be used to directly electrodeposit metal on an activated nonconducting surface.
- a higher concentration of the palladium colloid particles of about 200 mg palladium per liter solution is required.
- the problem of the present invention therefore consists in avoiding the disadvantages of the known methods and especially in finding a method to treat work pieces with a palladium colloid solution which may be carried out easily. Only small amounts of additional chemicals shall be required for performing the method. Moreover the method shall be carried out with low expense of energy and time.
- the method according to the invention serves to treat work pieces with a palladium colloid solution by bringing the work pieces into contact with the colloid solution.
- the invention relates to the treatment of work pieces with a hydrochloric palladium colloid solution being stabilized with tin.
- the method according the present invention advantageously leads to complete separation of palladium between the concentrate part and the permeate part of the liquid.
- the known method suffers from the fact that a considerable part of palladium is oxidized to bivalent soluble palladium during the precipitation method. Therefore palladium cannot be separated entirely from the solution by filtration. For this reason palladium is lost partly due to the recovery method.
- the method according to the present invention advantageously does not require considerable expenditure of additional chemicals, such as for example of metallic tin, as well as of additional energy and time for heating the colloid solution as is the case if the known method would be carried out.
- the method according to the invention also has the additional advantage to be a single-stage recovery method. This is in contrast to the method as described in US-A-4,435,258. Therefore the method according to the invention is very easy to perform. Furthermore palladium can be removed essentially completely from palladium containing solutions, whereas, if the method as described in US-A-4,435,258 is used, only a very low current yield may be achieved when the palladium concentration is low which is normally the case after prolonged electrolysis time. Therefore complete removal of palladium is very complicated oder not at all possible if this known method is used.
- Colloidal palladium activating solutions contain palladium particles which are surrounded by a protective coating (protective colloid).
- HREM high-resolution electron microscopy
- AFM atomic force microscopy
- the palladium particles have a diameter of at least 2.5 nm.
- the size distribution is extremely narrow: It has proven that no considerable deviations from the mean particle size of 2.5 nm occurs in solutions containing colloidal palladium that are usually used to activate nonconductor surfaces.
- molecular filters are used that preferably have an exclusion pore size of from 200 Dalton to 10.000 Dalton.
- exclusion pore size of at least 500 Dalton is especially preferred. Most advantageous has proven an exclusion pore size of at least 2.000 Dalton. These further lower limits of the range represent preferred embodiments of the present invention, presenting an even better selectivity of separation between palladium particles and tin compounds under the circumstances mentioned.
- the rinsing liquid is pressed through the selective molecular filter membrane by means of a pressurized pump, the membrane holding back the palladium particles und letting pass the rinsing liquid, especially rinsing water, and all other components contained in the rinsing liquid.
- the permeate liquid can then be led to waste water treatment.
- the palladium being held back and present as a homogeneous metal dispersion concentrate can be used to produce an activating solution.
- tin(II) or tin(IV) salts and hydrochloric acid in higher or lower amounts are to be added to the concentrate liquid.
- the palladium held back may be dissolved und be used as a solution, for example a palladium chloride solution, in order to produce an activating solution or alternatively to use this solution for any other purpose.
- the rinsing liquid made acidic with hydrochloric acid is afterwards led to the molecular filter unit 10 via a pump 9.
- a filter membrane is arranged inside the molecular filter 10.
- the liquid present in the region in front of the filter membrane in the molecular filter is pumped in a circuit (not shown). Therefore the colloid particles are permanently in motion in the region in front of the filter membrane, so that the pores of the membrane may not be clogged (cross- flow).
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Water Supply & Treatment (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01949313A EP1354073A2 (fr) | 2000-05-15 | 2001-05-04 | Procede de traitement de pieces a usiner au moyen d'une solution colloidale de palladium |
JP2001584593A JP2004500976A (ja) | 2000-05-15 | 2001-05-04 | パラジウムコロイド溶液を用いた被処理物の処理方法 |
CA002404620A CA2404620A1 (fr) | 2000-05-15 | 2001-05-04 | Procede de traitement de pieces a usiner au moyen d'une solution colloidale de palladium |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10024239.1 | 2000-05-15 | ||
DE10024239A DE10024239C1 (de) | 2000-05-15 | 2000-05-15 | Verfahren zum galvanotechnischen Behandeln von Werkstücken mit einer Palladiumkolloidlösung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001088211A2 true WO2001088211A2 (fr) | 2001-11-22 |
WO2001088211A3 WO2001088211A3 (fr) | 2003-08-28 |
Family
ID=7642432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2001/005064 WO2001088211A2 (fr) | 2000-05-15 | 2001-05-04 | Procede de traitement de pieces a usiner au moyen d'une solution colloidale de palladium |
Country Status (6)
Country | Link |
---|---|
US (1) | US20030155250A1 (fr) |
EP (1) | EP1354073A2 (fr) |
JP (1) | JP2004500976A (fr) |
CA (1) | CA2404620A1 (fr) |
DE (1) | DE10024239C1 (fr) |
WO (1) | WO2001088211A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115282789A (zh) * | 2022-01-24 | 2022-11-04 | 浙江师范大学 | 一种ABS-Ni复合分离膜及其制备方法与应用 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10148632C1 (de) * | 2001-09-26 | 2003-06-05 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum galvanotechnischen Behandeln von Werkstücken mit einer Edelmetalle enthaltenden Flüssigkeit |
JP2003247029A (ja) * | 2001-11-21 | 2003-09-05 | Shipley Co Llc | 多孔性金属を使用する触媒金属を回収する方法 |
US6908496B2 (en) * | 2002-01-02 | 2005-06-21 | William Marsh Rice University | Method for scalable production of nanoshells using salt assisted purification of intermediate colloid-seeded nanoparticles |
EP1884278A1 (fr) * | 2006-07-24 | 2008-02-06 | ATOTECH Deutschland GmbH | Appareil et méthode pour rincer des liquides de pièces à façonner |
JP6340302B2 (ja) * | 2014-10-24 | 2018-06-06 | 田中貴金属工業株式会社 | 廃液の処理方法、廃液の処理装置および廃液の再利用方法 |
EP3133175A1 (fr) * | 2015-08-19 | 2017-02-22 | Enthone, Inc. | Système et procédé de récupération de métal noble catalytique à partir de solution de traitement galvanique aqueuse |
CN106987877A (zh) * | 2017-04-01 | 2017-07-28 | 厦门建霖工业有限公司 | 一种塑料电镀用胶体钯回收及水回用的系统及方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5348657A (en) * | 1992-05-25 | 1994-09-20 | Degussa Aktiengesellschaft | Process for the separation of catalyst-free working solution from the hydrogenation circuit of the anthraquinone process for the production of hydrogen peroxide |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3532518A (en) * | 1967-06-28 | 1970-10-06 | Macdermid Inc | Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions |
DE2240317C3 (de) * | 1971-08-21 | 1975-07-10 | Asahi Kasei Kogyo K.K., Osaka (Japan) | Verfahren zur Wiedergewinnung erneut einsetzbarer palladiumhaltiger Katalysatoren aus flüssigen Reaktionsgemischen, die bei der Herstellung von Essigsäurearylestern anfallen |
CA1053994A (fr) * | 1974-07-03 | 1979-05-08 | Amp Incorporated | Sensibilisation de polymeres de type polyimide pour deposition non electrolytique de metal |
US4008343A (en) * | 1975-08-15 | 1977-02-15 | Bell Telephone Laboratories, Incorporated | Process for electroless plating using colloid sensitization and acid rinse |
US4078918A (en) * | 1976-11-26 | 1978-03-14 | Perman Craig A | Method for precious metal recovery |
DE3040631A1 (de) * | 1980-10-29 | 1982-05-27 | Merck Patent Gmbh, 6100 Darmstadt | Verfahren zur abtrennung von metallkatalysatoren und verwendung von membrantrennvorrichtungen |
US4435258A (en) * | 1982-09-28 | 1984-03-06 | Western Electric Co., Inc. | Method and apparatus for the recovery of palladium from spent electroless catalytic baths |
US4600699A (en) * | 1983-02-14 | 1986-07-15 | Enthone, Incorporated | Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters |
AU6017398A (en) * | 1997-01-10 | 1998-08-03 | Ellipsis Corporation | Micro and ultrafilters with controlled pore sizes and pore size distribution andmethod for making |
CA2307500C (fr) * | 1997-10-30 | 2010-01-12 | Hw Process Technologies, Inc. | Procede pour eliminer des contaminants de liquides a traiter dans des procedes de rendement metal |
DE60106498T2 (de) * | 2000-01-20 | 2006-07-13 | Westfalia Separator Ag | Verfahren und Vorrichtung für die Reinigung und/oder Behandlung von edelmetallhaltigen Suspensionen mittels Membranfiltration |
EP1224972A1 (fr) * | 2001-01-18 | 2002-07-24 | Shipley Co. L.L.C. | Procédé de récupération des métaux catalytiques à partir d'une solution colloidale |
-
2000
- 2000-05-15 DE DE10024239A patent/DE10024239C1/de not_active Expired - Fee Related
-
2001
- 2001-05-04 JP JP2001584593A patent/JP2004500976A/ja active Pending
- 2001-05-04 US US10/276,351 patent/US20030155250A1/en not_active Abandoned
- 2001-05-04 WO PCT/EP2001/005064 patent/WO2001088211A2/fr not_active Application Discontinuation
- 2001-05-04 EP EP01949313A patent/EP1354073A2/fr not_active Withdrawn
- 2001-05-04 CA CA002404620A patent/CA2404620A1/fr not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5348657A (en) * | 1992-05-25 | 1994-09-20 | Degussa Aktiengesellschaft | Process for the separation of catalyst-free working solution from the hydrogenation circuit of the anthraquinone process for the production of hydrogen peroxide |
Non-Patent Citations (2)
Title |
---|
DATABASE CA [Online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; REITER, ARPAD: "Recovery of the colloidal palladium content of exhausted activating solutions used for the current-free metal coating of resin surfaces" retrieved from STN Database accession no. 85:81575 CA XP002210024 cited in the application & HU 11 100 A (VIDEOTON RADIO ES TELEVIZIOGYAR, HUG.)) 28 January 1976 (1976-01-28) * |
See also references of EP1354073A2 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115282789A (zh) * | 2022-01-24 | 2022-11-04 | 浙江师范大学 | 一种ABS-Ni复合分离膜及其制备方法与应用 |
Also Published As
Publication number | Publication date |
---|---|
DE10024239C1 (de) | 2001-09-20 |
CA2404620A1 (fr) | 2001-11-22 |
WO2001088211A3 (fr) | 2003-08-28 |
US20030155250A1 (en) | 2003-08-21 |
JP2004500976A (ja) | 2004-01-15 |
EP1354073A2 (fr) | 2003-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1994012684A1 (fr) | Bains de depot de nickel chimique | |
JPS60106583A (ja) | 沈殿可能な材料と酸及び/又は塩基を含む水性流の処理方法 | |
KR20020086883A (ko) | 이온 교환에 의해 금속을 제거하는 방법 및 장치 | |
US20030155250A1 (en) | Method for the treatment of work pieces with a palladium colloid solution | |
US5328616A (en) | Methods and apparatus for treating electroless plating baths | |
JP2006000792A (ja) | 電解析出処理装置および方法 | |
CN100396627C (zh) | 一种纳滤法处理电镀废水的清洁生产方法 | |
CN115745295A (zh) | 一种pcb生产过程中产生的含铜废水的膜法处理工艺 | |
JP6518834B2 (ja) | 水性ガルバニック処理溶液から触媒貴金属を回収するためのシステム及び方法 | |
EP1884278A1 (fr) | Appareil et méthode pour rincer des liquides de pièces à façonner | |
KR100429763B1 (ko) | 인쇄회로기판의 세척폐액으로부터 유효성분의 회수방법 | |
EP1430163B1 (fr) | Recuperation de metal precieux | |
CN106865850A (zh) | 氰化镀镉废水零排放处理方法 | |
Ramachandraiah et al. | Separation and concentration of metals present in industrial effluent and sludge samples by using electrodialysis, coulometry, and photocatalysis | |
JP2016160493A (ja) | 電子基板から貴金属を分離、回収する方法およびそのための装置 | |
WO1994012683A1 (fr) | Procede et appareil de traitement de bain de metallisation sans courant electrique | |
JP3826497B2 (ja) | 純水製造方法 | |
KR20050076668A (ko) | 도금조를 유지하기 위한 방법 | |
CN218620523U (zh) | 一种电子行业含铜废水的回收处理系统 | |
McINTYRE | Wastewater Pollution Prevention, Precipitation and Separation Processes | |
CN102815828B (zh) | 表面处理湿制程清洗液中金及氰化物的循环利用系统 | |
JP2001131652A (ja) | パラジウムの分離、回収方法 | |
JPS5824515B2 (ja) | コケイリユウシオケンダクサセタタソウニツケルメツキコウテイノクロ−ズドシステムカホウホウ | |
DD284487A5 (de) | Verfahren zur rueckgewinnung von metallen aus spuelbaedern |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): CA JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2001949313 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2404620 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10276351 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 2001949313 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2001949313 Country of ref document: EP |