WO2001083620A1 - Composition de resine pour appareils electriques et electroniques - Google Patents

Composition de resine pour appareils electriques et electroniques Download PDF

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Publication number
WO2001083620A1
WO2001083620A1 PCT/JP2001/003771 JP0103771W WO0183620A1 WO 2001083620 A1 WO2001083620 A1 WO 2001083620A1 JP 0103771 W JP0103771 W JP 0103771W WO 0183620 A1 WO0183620 A1 WO 0183620A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
thermosetting resin
composition according
compound
magnesium hydroxide
Prior art date
Application number
PCT/JP2001/003771
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English (en)
Japanese (ja)
Inventor
Taro Ando
Hitoshi Manabe
Koji Shimizu
Original Assignee
Kyowa Chemical Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000133788A external-priority patent/JP4365986B2/ja
Priority claimed from JP2000141962A external-priority patent/JP4365987B2/ja
Application filed by Kyowa Chemical Industry Co., Ltd. filed Critical Kyowa Chemical Industry Co., Ltd.
Publication of WO2001083620A1 publication Critical patent/WO2001083620A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Definitions

  • the present invention particularly relates to a thermosetting resin composition for electric and electronic equipment having excellent flame retardancy, heat resistance and orchid water.
  • the present invention cures from such a resin composition
  • Molded products especially for electrical and electronic equipment parts, encapsulation, coating, insulation, laminates, metal cladding
  • the present invention also relates to a laminated board, for example, a sealing molded product, a pre-preda, a multilayer circuit board, and a laminated board for a circuit board.
  • Semiconductor devices and integrated circuit devices are sealed with various sealing materials so as not to be affected by external vibration, impact, dust, moisture, atmospheric gas, and the like.
  • Metal materials, ceramics, glass, etc. have been used as sealing materials, but most of them have recently been sealed with thermosetting resins in terms of cost and mass productivity.
  • thermosetting resins in terms of cost and mass productivity.
  • the degree of integration, miniaturization of element size, and miniaturization of wiring are progressing, and packages are also becoming smaller and thinner. Is needed.
  • the sealing material strength and thermal conductivity are required, and therefore, a resin in which an inorganic filler is blended is used.
  • thermosetting resins represented by epoxy gauze have excellent mechanical strength, electrical properties, thermal properties, adhesiveness, chemical resistance and water-based properties. It is also applied to various laminated boards combined with base materials such as synthetic fibers, for example, for structural use, heavy electrical equipment, printed wiring boards, metal-clad laminates for printed wiring boards, and the like. These electrical and electronic components have become smaller, thinner, and more sophisticated due to technological innovation, and the semiconductor devices that make up the electrical and electronic devices, as well as the multilayer printed wiring boards on which they are mounted, have become smaller and thinner. , High performance, and high reliability are needed.
  • the mounting method of multilayer printed circuit boards has shifted from pin insertion type packages to surface mount type packages, and also to bare chip mounting methods in which chips are directly mounted, and high resin adhesion is required.
  • This high adhesion can also be achieved by reducing the water absorption of the resin.
  • the circuit board laminate is subjected to a process such as solder bath immersion after being processed under the conditions of high temperature and high humidity at the time of manufacture of the laminate and mounting of electronic components, so that the laminate swells and peels off.
  • shelves are required, they must have a high degree of heat resistance, flame retardancy and long-term stability.
  • thermosetting resin used for encapsulation of semiconductor devices, printed wiring boards and laminates thereof (hereinafter, these may be referred to as “electronic components”) has a high degree of flame retardancy. Therefore, a method of adding a bromine-containing epoxy and adding antimony oxide to a resin has been used. However, in this case, harmfulness to humans and corrosiveness to equipment due to the generation of hydrogen bromide, bromine-based gas, antimony bromide, etc. during combustion, and industrial waste and epoxy resin produced during the manufacturing process of electronic components Environmental safety has become an issue, such as the problem of molding materials and the disposal of electronic components using such molding materials.
  • Japanese Patent Application Laid-Open No. Hei 9-176 6368 discloses that the metal hydroxide is limited to magnesium hydroxide, and the magnesium hydroxide is subjected to a surface treatment to prevent moisture absorption. Compositions with improved dispersibility in water have been proposed. However, due to recent technological innovations in the field of electronic components, higher flame retardancy and higher moisture resistance and safety are required. In addition, if the magnesium hydroxide particles contain a large amount of impurities, especially Fe compounds and Mn compounds, they may cause thermal degradation of the resin.
  • the memory unit may generate a soft error due to the a-line due to the decay of U, Th, etc. Is becoming a problem.
  • the content of U and Th is 1 ppb (ng / g) or less for 1M to 4M bits of memory, and 0.1 lppb (ng / g) or less for 4 to 16M bits of memory.
  • the content of radioactive substances of magnesium hydroxide to be mixed with the synthetic resin used as the sealing material be very small, that is, low ⁇ rays.
  • it is a high-purity magnesium hydroxide particle containing a certain amount or less of Fe compound, Mn compound, U compound and Th compound as impurities, and having an average secondary particle diameter of Value of 5 m or less, and a certain amount of magnesium hydroxide particles with a specific surface area (BET) of 10 m 2 Zg or less, and if necessary, a certain amount of other inorganic fillers should be blended with the synthetic resin.
  • BET specific surface area
  • thermosetting resin composition comprising (a) a thermosetting resin and (b) magnesium hydroxide particles, wherein the magnesium hydroxide particles have the following requirements (i) to (iv):
  • the present invention provides a thermoplastic resin composition for electric and electronic devices, which satisfies the following.
  • the average secondary particle size measured by the laser single diffraction scattering method is 0.5 to 55
  • BET method specific surface area is 0.1 or more; L 0m 2 Zg (iii) the total content of the Fe compound and the Mn compound is 0.02% by weight or less as a metal, and
  • the total content of the U compound and the Th compound is 10 ppb or less in terms of metal.
  • Magnesium hydroxide particles not only have a high thermal conductivity, but also cause a significant decrease in the thermal stability of the compounded resin as the content of the iron compound and the manganese compound in the magnesium hydroxide is increased.
  • the fact that the total amount of these compounds satisfies the above range does not mean that the deterioration of the physical properties of the resin is not impaired, and that the average secondary particle diameter and the specific surface area each satisfy the above range. is necessary.
  • the range of the average secondary particle size of magnesium hydroxide is 0.5 to 5111, preferably 0.7 to 3 m.
  • the specific surface area of the magnesium hydroxide particles determined by the BET method is 0.1 to: L Om 2 Zg, and preferably 0.2 to 5 m 2 / g. Further, the total content of the U compound and the Th compound must satisfy 1 Op pb or less, preferably 5 ppb or less, more preferably 1 ppb or less in terms of metal.
  • the content of the water-soluble alkali metal salt is desirably 0.05% by weight or less, preferably 0.03% by weight or less, and more preferably 0.003% by weight or less.
  • the content of the Fe compound and the Mn compound exceeds the above range, it affects the thermal degradation of the resin. Further, when the content of the U compound and the Th compound is within the above range, the occurrence of the soft error in the memory can be reduced, but as the content increases, the soft error increases.
  • the magnesium hydroxide particles have an average secondary particle diameter, a specific surface area, a total content of an iron compound and a manganese compound, a content of a U compound and a Th compound, and more preferably a water-soluble alcohol.
  • the content of the metal salt is within the above range, compatibility with the resin, dispersibility, moldability and workability, appearance of the molded article, mechanical strength and flame retardancy, A resin composition that satisfies various characteristics such as reduction of Molly soft erosion can be obtained.
  • the method for preparing the magnesium hydroxide particles in the present invention is not particularly limited as long as the requirements (i), (ii), (iii) and (iv) are satisfied.
  • Magnesium hydroxide particles satisfying the average secondary particle diameter of U) and the specific surface area of (ii) can be obtained by, for example, basically employing the method and conditions described in JP-A-52-115799.
  • magnesium hydroxide particles satisfying the requirements (iii) and (iv) can be obtained.
  • a device such as a reactor, a refiner, a crystallization vessel, a dryer, and a pulverizer, a device made of a corrosion-resistant material that does not dissolve or contaminate the metal should be selected.
  • magnesium chloride or magnesium nitrate as a raw material and the above-mentioned alkaline substance are subjected to a purification treatment in order to reduce the content of the impurities therein.
  • the water-soluble alkali metal salt can be removed.
  • M 3+ is at least one of A 1 3+ and Fe 3+ ,
  • x is a positive number of 0.2 ⁇ x and 0.5
  • a 2 — is at least one of C ⁇ 3 2 _ and S ⁇ 4 2 _,
  • This hydrotalcite may be a natural product or a synthetic product. More preferably, it is added to a magnesium hydroxide raw material to remove U compounds.
  • 3L beaker foremost bittern (MgC 1 2 1. 9mo 1 / L) 2L (U content 126 PPb) placed, 5 N (manufactured by Wako Pure Chemical KK) of hydrochloric acid was adjusted to a concentration under stirring conditions 2ml Was added, and the mixture was stirred at room temperature (25 ° C) for 30 minutes to obtain bitterness having a pH of 1.6.
  • the U content was less than 0.8 ng / mL.
  • This magnesium chloride was used as a Mg source and the alkali source was reacted as calcium hydroxide to obtain magnesium hydroxide.
  • the U content of this magnesium hydroxide was 2 ppb. Th can be removed at the same time by this U removal process.
  • the mechanism of removal of magnesium hydroxide lanthanum and trim is not clear, but crystal growth of magnesium hydroxide particles occurs, the BET specific surface area is reduced, and the dispersibility of the particles is improved, making it suitable as a resin additive. It is estimated that powder physical properties are imparted.
  • the magnesium hydroxide particles used in the present invention are at least one type of surface treatment agent selected from the group consisting of higher fatty acids, anionic surfactants, phosphate esters, coupling agents and fatty acid esters of polyhydric alcohols. Surface treatment may be applied.
  • Examples of the surface treatment agent preferably used are as follows. Higher fatty acids having 10 or more carbon atoms such as stearic acid, erlic acid, palmitic acid, lauric acid, and behenic acid and alkali metal salts of the higher fatty acids; sulfuric acid of higher alcohols such as stearyl alcohol and oleyl alcohol Ester salts: sulfates of polyethylene glycol ether, amide-bonded sulfates, ester-bonded sulfates, ester-bonded sulfonates, amide-bonded sulfonates, ether-bonded sulfonates, ether-bonded alkylaryl sulfonic acids Anionic surfactants such as salts, ester-bonded alkylaryl sulfonates and amide-bonded alkylaryl sulfonates; mono- or diesters such as orthophosphoric acid and oleyl alcohol, stearyl alcoholyl, or a mixture of both; acid Phosphoric esters
  • aminoethyl aminopropyltriethoxysilane (Aminoethyl) aminopropyltriethoxysilane, raminopropyltrimethoxysilane, aminopropyltriethoxysilane, N-phenylaminopropyltrimethoxysilane, glycidoxypropyltrimethoxy Silane coupling agents such as silane, acryloxypropyl trimethoxysilane, etc .; isopropyl triisostearoyl titanate, isopropyl tris
  • the surface treatment of the magnesium hydroxide particles with the surface treatment agent can be performed by a known wet or dry method.
  • the surface treating agent may be added to a slurry of magnesium hydroxide particles in a liquid or emulsion state and sufficiently mechanically mixed at a temperature up to about 100.
  • the magnesium hydroxide particles are added to the surface treatment agent in a liquid, emulsion, or solid state with sufficient stirring with a mixer such as a Benshell mixer, and then mixed well with or without heating. Good.
  • a mixer such as a Benshell mixer
  • the magnesium hydroxide particles having been subjected to the surface treatment can be subjected to a method such as washing with water, dehydration, granulation, drying, pulverization, classification and the like as appropriate and carried out, if necessary, to obtain a final product form. Further, the surface treating agent can be added at the time of kneading the synthetic resin and the magnesium hydroxide particles.
  • the ratio of (a) the thermosetting resin and (b) the magnesium oxide particles is (b) 100 parts by weight of the thermosetting resin, and (b) ) Hydroxyl 5 to 500 parts by weight, preferably 50 to 300 parts by weight, of magnesium oxide particles is suitable.
  • the resin composition of the present invention may further contain (c) an inorganic filler other than (b) magnesium hydroxide particles, if necessary.
  • (C) The inorganic filler is blended for the purpose of improving strength or reducing hygroscopicity.
  • examples thereof include amorphous silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, magnesia, silicon nitride, magnesium aluminum oxide, and aluminum oxide.
  • examples include zirconia, zircon, clay, talc, wollastonite, calcium silicate, titanium oxide, antimony oxide, asbestos, glass edu, calcium sulfate, and aluminum nitride.
  • the (C) inorganic filler can be of any shape, such as spherical, broken frame, or fibrous.
  • Preferred specific examples of the (C) inorganic filler include amorphous silica, crystalline silica, and alumina.
  • the blending amount of the (C) inorganic filler is:
  • the total amount of (b) the magnesium hydroxide particles and (c) the inorganic filler is in the range of 60 to 95% by weight, preferably 70 to 90% by weight of the entire resin composition. is there.
  • the inorganic filler is required to have good moldability, that is, good fluidity and low viscosity.
  • thermosetting resin of the present invention may be any resin used for semiconductor encapsulants, laminated boards for electronic components, multilayer circuit boards, printed wiring boards, etc. Specifically, epoxy resins, silicone resins Phenolic resin, diaryl phthalate resin, urea resin, melamine iT fat or alkyd resin. Of these, the epoxy shelf is preferred.
  • the epoxy resin in the present invention is not particularly limited, and examples include the following.
  • Bisphenol A type epoxy resin Bisphenol F type epoxy resin, 2, 2,, 6, 6 ' ⁇ -Tetramethylbisphenol A type epoxy resin, Bisphenol S type epoxy resin, Bisphenol AD type epoxy resin And bisphenol type epoxy resins such as tetramethyl bisphenol A type epoxy resin;
  • Biphenol-type epoxy resin bisphenolhexafluoroacetone di Glycidyl ether, bis-] 3-Trifluoromethyldiglycidylbisphenol A, other bifunctional epoxy resins such as resorcinodiglycidyl ether, multifunctional epoxy shelf having naphthalene skeleton and dicyclopentene skeleton Purport,
  • Cyclic lipids ⁇ epoxy resins represented by epoxidized polyadducts of dicyclopentene and phenol
  • Glycidyl ester type epoxy such as diglycidyl phthalate, diglycidyl tetrahydrophthalate, diglycidyl hexahydrophthalate, diglycidyl p-oxybenzoic acid, glycidyl dimer monoester and triglycidyl ester Resin, diglycidyl ester type epoxy resin,
  • Heterocyclic compounds such as glycidylamine type epoxy resins such as tetraglycidyl ⁇ / aminodiphenylmethane, triglycidyl P-aminophenol, tetraglycidyl m-xylylenediamine, hydantoin type epoxy resins, and triglycidyl isocyanurate Epoxy resin, (9) phlorogrisinol triglycidyl ether, trihydroxybiphenyl tridaridyl ether, trihydroxyphenyl methane tridaridyl ether, glycerin triglycidyl ether, 2- [4- (2,3-epoxypropo Xy) phenyl] —2— [4-[1,1-bis [4- (2,3-epoxypropoxy) phenyl] ethyl] phenyl] propane, 1,3-bis [4— [1— [4-1] (2
  • alicyclic epoxy resins isocyanate-type epoxy resins, aliphatic chain epoxy resins, and N- compounds from their halides, hydrogenated products, aromatic amines and heterocyclic nitrogen bases
  • Glycidyl compounds such as N, N-diglycidylaniline, triglycidyl isocyanurate, N, N, N ', N, —tetraglycidyl-bis (p-aminophenyl) -methane Resins and aralkyl group-containing epoxy resins.
  • epoxy resins are reacted with a polymer obtained from a monomer such as a silicone oligomer having a functional group such as an epoxy group: a propyloxyl group or an amino group, a polymer such as acrylonitrile, butadiene, or isoprene, or a polyamide resin.
  • a polymer obtained from a monomer such as a silicone oligomer having a functional group such as an epoxy group: a propyloxyl group or an amino group, a polymer such as acrylonitrile, butadiene, or isoprene, or a polyamide resin.
  • a polymer obtained from a monomer such as a silicone oligomer having a functional group such as an epoxy group: a propyloxyl group or an amino group, a polymer such as acrylonitrile, butadiene, or isoprene, or a polyamide resin.
  • modified epoxy resins obtained by the above method Each of the above epoxy resins may be
  • the curing agent for the thermosetting resin is not particularly limited, but for example, an amine curing agent, an acid anhydride curing agent, a nopolak resin or an oligomer curing agent may be used according to each purpose. it can. Specific examples of the curing agent are shown below.
  • the following are exemplified as the amine-based curing agent.
  • Guanidine-based compounds such as dicyandiamide, dicyandiamide organic acid hydrazide, trimethyldanzidine and dimethyldanidine;
  • Imidazoles such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-indesylimidazole, 2-hepcidecylimidazole, 2-phenylimidazole and 1-benzyl-2-methylimidazole;
  • Polyether-based amines such as dioxyethylene diamine, trioxyethylene diamine, polyoxyethylene diamine, polyamine-ethylene oxide duct, polyamine-propylene oxide duct;
  • Alkanolamines such as trimethanolamine, triethanolamine and diethanolamine
  • diamines having a silicone skeleton in the main chain diamines having a silicone skeleton in the main chain, polyamine epoxy resin adducts, cyanoethylated polyamines, ketimine-based compounds, 1-cyanoethyl compounds, and trimellitates, quaternary salts, isocyanurates and 1-cyanoethyl compounds Hydroxymethyl form and the like; Boron trifluoride-amine complex as other latent amine curing agent
  • acid anhydride-based curing agents for example, phthalic anhydride, trimellitic anhydride, ethylene glycol bis (anhydrotrimellitate), glycerol monolith
  • phenol nopolak resin cresol novolak resin, BPA nopolak resin, biphenol nopolak resin, and nopolak type phenol resin such as halogen-substituted resin thereof, amino resin, and resin Phenolic resin, aniline-formalin resin, polyvinyl phenol resin and the like.
  • Other light sources include aromatic diazonium salts, diaryldonium salts, triallylsulfonium salts, triarylselenium salts, acridine orange, benzoflavin, and light such as ultraviolet light curing agents, polymercaptan, and polysulfide resins. And mercaptan-based curing agents.
  • the compounding amount of the curing agent is 100 to 200 parts by weight, preferably 50 to 150 parts by weight, based on 100 parts by weight of the thermosetting resin.
  • Known curing accelerators can be used, for example, Lewis acids, amine complexes, imidazole compounds, organic phosphorus compounds, tertiary amines, quaternary ammoniums Salts and the like are used. Specific examples include imidazole in which an imino group is masked with acrylonitrile, isocyanate, melamine, acrylate, epoxy, or the like.
  • the imidazole compounds include, for example, imidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-pendecylimidazole, 1-benzyl-2-methylimidazole , 2- to decyl imidazole, 4,5-diphenylimidazoline, 2-methylimidazoline, 2-ethyl-4-methylimidazoline, 2-phenylimidazoline, 2-phenylimidazoline, 2 —Heptane decyl imidazoline, 2-isopropyl imidazole, 2,4-dimethylimidazole, 2-phenylimidazole, 2-methylimidazole, 2-ethylimidazoline, 2-isopropylimidazoline, 2,4-dimethylimidazoline, 2 —Phenyl-4-methylimidazoline and the like.
  • the masking agent examples include acrylonitrile, phenylene diisocyanate, toluene diisocyanate, naphthalenedi isocyanate, hexamethylene diisocyanate, methylene bisphenyl isocyanate, melamine acrylate and various epoxy resins. is there.
  • Diazabicycloargens such as 1,8-diazabicyclo (5,4,0) indene-17 and derivatives thereof; triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoenol, tris ( Tertiary amines such as phenol; organic phosphines such as tributylphosphine, methyldiphenylphosphine, and triphenylphosphine; tetra-substituted phosphonium and tetra-substituted porates such as tetraphenylphosphonium and tetraphenylporate , 2-Ethyl-14-methylimidazole, tetraphenylporate, and N-methylmorpholine / tetraphenylporate; Some of these curing accelerators may be used in combination.
  • a photo-printing method has been used as a method of forming a solder resist in a manufacturing process of a printed wiring board, and double-sided simultaneous exposure has been implemented. For this reason, it has become necessary for composite laminates not to transmit ultraviolet rays in order to cope with double-sided simultaneous exposure.
  • an ultraviolet-impermeable laminate a laminate in which a matrix resin is blended with an ultraviolet absorber, and a laminate in which a glass fiber base material is attached with an ultraviolet shielding agent are known.
  • organic ultraviolet shielding agent to be mixed with the matrix resin examples include organic ultraviolet absorbers, for example, hydroxybenzophenones, hydroxybenzotriazoles, diaminostyrylbenzylsulfonate derivatives, imidazole derivatives, coumarin derivatives and the like.
  • the ultraviolet absorber or the ultraviolet shielding be contained in an amount of 0.001 to 2% by weight based on the resin composition. If the content is less than 0.001% by weight, the effect is small, and if it exceeds 2% by weight, discoloration due to heating occurs.
  • a curing agent such as a natural wax, a synthetic wax, a higher fatty acid and its metal: a releasing agent such as ⁇ or paraffin; a coloring agent such as Ripbon black, a pigment, and foaming Agents, plasticizers, fillers, acid acceptors, reinforcing agents, antioxidants, antistatic agents, lubricants, stabilizers, curing accelerators, and the like may be added.
  • melt-kneading is performed by using a known kneading method such as a kneader, a single-screw or twin-screw extruder, or a kneader. Made by Built.
  • the resin composition of the present invention is usually used in the form of powder or tablet for molding electronic components.
  • a low-pressure transfer molding method is generally used, and an injection molding method or a compression molding method is also possible.
  • the molding conditions include, for example, the molding temperature of the resin composition.
  • Molding time is 30-300 seconds, and the molded resin is cured to produce a sealed semiconductor molded product. Further, if necessary, the above molded product may be subjected to additional heat treatment at 100 to 200 ° C. for 2 to 15 hours.
  • % and “part” mean “% by weight” and “part by weight” unless otherwise specified.
  • properties of the magnesium hydroxide particles and the physical properties of the molded product were measured by the following methods. The molding was performed by transfer molding.
  • the measurement was determined using a MI CROTRAC 13 ⁇ 4 analyzer SPA type [LEEDS & NORTHR UP INSTRUMENTS].
  • a set of two test pieces is sandwiched between papers, clamped with metal clips, suspended on a rotating ring, and withdrawn over time.
  • Test piece 1Z12 inch
  • the synthetic resin is a square, 2 mm thick rectangular parallelepiped, each side of which is cut with scissors and each side is ⁇ 0 cm.
  • a test piece consisting of a rectangular parallelepiped is immersed in 95 ion-exchanged water for 48 hours, taken out, and surfaced with a paper towel The test piece was wiped off and adjusted to a condition of 23 "C ⁇ 2.C, 50% RH for 15 minutes. Under the same condition, the test piece was volume-specific using TR8401 by Takeda Riken Co., Ltd. The resistance was measured and the data of water resistance and insulation was obtained, except that the EVA test piece was immersed in 70 ion-exchanged water for 168 hours.
  • the properties of the magnesium hydroxide particles (A-1 to A-5) used in the examples are shown in Table 2 below. However, A-2 and A-3 are surface-treated A-1.
  • the presence or absence of surface treatment of magnesium hydroxide particles and the type of surface treatment agent used are as follows. When the surface treating agent was used, the amount was 2% by weight based on the magnesium hydroxide particles.
  • Each component shown in Table 3 was dry-blended by a mixer at the composition ratio shown in Table 3. This was heated and kneaded for 5 minutes using a mixing roll at a roll surface temperature of 90, and then cooled and pulverized to produce a test piece of an epoxy resin composition.
  • Phenolite TD-2131 manufactured by Dainippon Ink and Chemicals, Inc.
  • Each component shown in Table 4 was dry-blended by a mixer at the composition ratio shown in Table 4. This was heated and kneaded for 5 minutes using a mixing roll having a roll surface temperature of 90 ° C., and then cooled to form a test piece of an epoxy resin composition.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

L'invention concerne une composition de résine conçue pour des appareils électriques et électroniques, qui consiste en (a) une résine thermoplastique et (b) des particules d'hydroxyde de magnésium, qui se caractérisent en ce qu'elles satisfont aux exigences (i) à (iv), à savoir: (i) un diamètre moyen de particule secondaire de 0,5 à 5 νm, mesuré suivant le procédé de diffusion par diffraction laser; (ii) une surface spécifique de 0,1 à 10 m2/g; (iii) une somme de la teneur en métal des composés de Fe et de Mn correspondant à 0,02 % en poids au maximum; et (iv) une somme de la teneur en métal des composés de U et de Mn correspondant à 10 ppb au maximum. La composition pour appareils électriques et électroniques est excellente en matière d'ignifugation, de résistance à l'eau, de conductivité thermique et de résistance thermique.
PCT/JP2001/003771 2000-05-02 2001-05-01 Composition de resine pour appareils electriques et electroniques WO2001083620A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000-133788 2000-05-02
JP2000133788A JP4365986B2 (ja) 2000-05-02 2000-05-02 電子部品封止用樹脂組成物およびその成形品
JP2000-141962 2000-05-15
JP2000141962A JP4365987B2 (ja) 2000-05-15 2000-05-15 積層板用材料および電機および電子機器用樹脂組成物およびその成型品

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7193006B2 (en) 2002-12-06 2007-03-20 Nippon Shokubai Co., Ltd. Process for continuous production of water-absorbent resin product

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5856084B2 (ja) * 2011-01-20 2016-02-09 東レ・ダウコーニング株式会社 硬化シリコーンゴムの耐水性を改善するためのマグネシウム化合物の使用
EP2832695A4 (fr) * 2012-03-26 2015-08-26 Kyowa Chem Ind Co Ltd Fines particules d'hydrotalcite
CN115668411A (zh) * 2020-06-17 2023-01-31 日本制铁株式会社 电磁钢板用涂布组合物、接合用表面被覆电磁钢板及层叠铁芯

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03505863A (ja) * 1989-05-05 1991-12-19 ファイトシェル・マグネジット　ヴェルケ―アクチエン―ゲゼルシャフト 微粉末状水酸化マグネシウム及びその調製方法
EP0780425A1 (fr) * 1995-12-19 1997-06-25 Kyowa Chemical Industry Co., Ltd. Ignifugeant avec bonne résistance à la détérioration par la chaleur, composition de résine et articles moulés
JPH1111930A (ja) * 1997-06-25 1999-01-19 Matsushita Electric Works Ltd 無機フィラーの精製方法
EP0906933A1 (fr) * 1997-10-01 1999-04-07 Kyowa Chemical Industry Co., Ltd. Composition de résine ignifugée

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03505863A (ja) * 1989-05-05 1991-12-19 ファイトシェル・マグネジット　ヴェルケ―アクチエン―ゲゼルシャフト 微粉末状水酸化マグネシウム及びその調製方法
EP0780425A1 (fr) * 1995-12-19 1997-06-25 Kyowa Chemical Industry Co., Ltd. Ignifugeant avec bonne résistance à la détérioration par la chaleur, composition de résine et articles moulés
JPH1111930A (ja) * 1997-06-25 1999-01-19 Matsushita Electric Works Ltd 無機フィラーの精製方法
EP0906933A1 (fr) * 1997-10-01 1999-04-07 Kyowa Chemical Industry Co., Ltd. Composition de résine ignifugée

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7193006B2 (en) 2002-12-06 2007-03-20 Nippon Shokubai Co., Ltd. Process for continuous production of water-absorbent resin product
US9382390B2 (en) 2002-12-06 2016-07-05 Nippon Shokubai Co., Ltd. Process for continuous production of water-absorbent resin product

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