WO2001044875A3 - Micromolds fabricated using mems technology and methods of use therefor - Google Patents
Micromolds fabricated using mems technology and methods of use therefor Download PDFInfo
- Publication number
- WO2001044875A3 WO2001044875A3 PCT/US2000/041781 US0041781W WO0144875A3 WO 2001044875 A3 WO2001044875 A3 WO 2001044875A3 US 0041781 W US0041781 W US 0041781W WO 0144875 A3 WO0144875 A3 WO 0144875A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- molds
- mems technology
- micromolds
- fabricated
- methods
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A method of making microreaction molds for grafting and molding very thin films onto surfaces of materials such as microchips is provided. The methods utilize MEMS technology to achieve the manufacture of molds that have a high degree of consistency and uniformity in the thicknesses of the films applied to the surfaces. Use of MEMS technology allows such molds to be made with an accuracy of less than 1 νm in mold depth. The method provides for the manufacture of molds from a single transparent material that is able to be etched in a consistent manner. The method of this invention is particularly applicable to mass generation of microchip surfaces having uniform thin polymeric films bound thereto.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU30781/01A AU3078101A (en) | 1999-12-15 | 2000-10-31 | Micromolds fabricated using mems technology and methods of use therefor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46438099A | 1999-12-15 | 1999-12-15 | |
US09/464,380 | 1999-12-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001044875A2 WO2001044875A2 (en) | 2001-06-21 |
WO2001044875A3 true WO2001044875A3 (en) | 2002-06-27 |
Family
ID=23843714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/041781 WO2001044875A2 (en) | 1999-12-15 | 2000-10-31 | Micromolds fabricated using mems technology and methods of use therefor |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU3078101A (en) |
WO (1) | WO2001044875A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7091034B2 (en) | 2000-12-15 | 2006-08-15 | Burstein Technologies, Inc. | Detection system for disk-based laboratory and improved optical bio-disc including same |
WO2004023210A1 (en) * | 2002-08-30 | 2004-03-18 | Toyo Gosei Co., Ltd. | Method for producing a pattern formation mold |
US7524672B2 (en) | 2004-09-22 | 2009-04-28 | Sandia Corporation | Microfluidic microarray systems and methods thereof |
KR20110088512A (en) * | 2008-10-28 | 2011-08-03 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | Composite stamp for embossing |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4543225A (en) * | 1984-07-05 | 1985-09-24 | Docdata N.V. | Method and system for reproducing relief structures onto a substrate |
EP0156372A2 (en) * | 1984-03-28 | 1985-10-02 | Hitachi, Ltd. | Process for producing plastic information-recording medium and resin composition used therefor |
JPH0354569A (en) * | 1989-07-24 | 1991-03-08 | Dainippon Printing Co Ltd | Formation of resist pattern |
US5171392A (en) * | 1988-11-08 | 1992-12-15 | Pioneer Electronic Corporation | Method of producing an optical information record carrier |
US5259926A (en) * | 1991-09-24 | 1993-11-09 | Hitachi, Ltd. | Method of manufacturing a thin-film pattern on a substrate |
EP0623440A1 (en) * | 1993-03-16 | 1994-11-09 | Koninklijke Philips Electronics N.V. | Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method |
-
2000
- 2000-10-31 WO PCT/US2000/041781 patent/WO2001044875A2/en active Application Filing
- 2000-10-31 AU AU30781/01A patent/AU3078101A/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0156372A2 (en) * | 1984-03-28 | 1985-10-02 | Hitachi, Ltd. | Process for producing plastic information-recording medium and resin composition used therefor |
US4543225A (en) * | 1984-07-05 | 1985-09-24 | Docdata N.V. | Method and system for reproducing relief structures onto a substrate |
US5171392A (en) * | 1988-11-08 | 1992-12-15 | Pioneer Electronic Corporation | Method of producing an optical information record carrier |
JPH0354569A (en) * | 1989-07-24 | 1991-03-08 | Dainippon Printing Co Ltd | Formation of resist pattern |
US5259926A (en) * | 1991-09-24 | 1993-11-09 | Hitachi, Ltd. | Method of manufacturing a thin-film pattern on a substrate |
EP0623440A1 (en) * | 1993-03-16 | 1994-11-09 | Koninklijke Philips Electronics N.V. | Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method |
Non-Patent Citations (2)
Title |
---|
HAISMA J ET AL: "MOLD-ASSISTED NANOLITHOGRAPHY: A PROCESS FOR RELIABLE PATTERN REPLICATION", JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY: PART B, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 14, no. 6, 1 November 1996 (1996-11-01), pages 4124 - 4128, XP000721137, ISSN: 0734-211X * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 207 (P - 1207) 28 May 1991 (1991-05-28) * |
Also Published As
Publication number | Publication date |
---|---|
AU3078101A (en) | 2001-06-25 |
WO2001044875A2 (en) | 2001-06-21 |
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