AU2001292058A1 - Moulding apparatus and method - Google Patents

Moulding apparatus and method

Info

Publication number
AU2001292058A1
AU2001292058A1 AU2001292058A AU9205801A AU2001292058A1 AU 2001292058 A1 AU2001292058 A1 AU 2001292058A1 AU 2001292058 A AU2001292058 A AU 2001292058A AU 9205801 A AU9205801 A AU 9205801A AU 2001292058 A1 AU2001292058 A1 AU 2001292058A1
Authority
AU
Australia
Prior art keywords
films
mould
article
moulding apparatus
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001292058A
Inventor
Paul Bagnall
Rod Duddin
Laurie Sims
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innavisions Ltd
Original Assignee
Innavisions Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innavisions Ltd filed Critical Innavisions Ltd
Publication of AU2001292058A1 publication Critical patent/AU2001292058A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B29C2045/14532—Joining articles or parts of a single article injecting between two sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14901—Coating a sheet-like insert smaller than the dimensions of the adjacent mould wall
    • B29C2045/14918—Coating a sheet-like insert smaller than the dimensions of the adjacent mould wall in-mould-labelling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14967—Injecting through an opening of the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2715/00—Condition, form or state of preformed parts, e.g. inserts
    • B29K2715/006—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/002—Coloured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456—Antennas, e.g. radomes

Abstract

The present invention provides a method of moulding an article, the method comprising the steps of providing a mould (20) having a mould cavity (41); providing first and second films (26, 28), at least one of which has a length greater than the mould cavity (41); aligning said films (26, 28) relative to one another; injecting a thermoplastics material between the films (26, 28) to produce a moulded article (44) having the films (26, 28) attached thereto; and removing said article (44) from the mould (20).
AU2001292058A 2000-10-02 2001-10-02 Moulding apparatus and method Abandoned AU2001292058A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0024070.5A GB0024070D0 (en) 2000-10-02 2000-10-02 Mpulding apparatus and method
GB0024070 2000-10-02
PCT/GB2001/004389 WO2002028613A1 (en) 2000-10-02 2001-10-02 Moulding apparatus and method

Publications (1)

Publication Number Publication Date
AU2001292058A1 true AU2001292058A1 (en) 2002-04-15

Family

ID=9900499

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001292058A Abandoned AU2001292058A1 (en) 2000-10-02 2001-10-02 Moulding apparatus and method

Country Status (7)

Country Link
US (1) US20050035491A1 (en)
EP (1) EP1322457B1 (en)
AT (1) ATE334793T1 (en)
AU (1) AU2001292058A1 (en)
DE (1) DE60121974T2 (en)
GB (1) GB0024070D0 (en)
WO (1) WO2002028613A1 (en)

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FI112121B (en) * 2000-12-11 2003-10-31 Rafsec Oy Smart sticker web, process for making it, process for making a carrier web, and component of a smart sticker on a smart sticker web
KR100484834B1 (en) * 2002-11-28 2005-04-22 엘지전자 주식회사 The display panel manufacturing mold of a washer
US6997777B2 (en) 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7030316B2 (en) * 2004-01-30 2006-04-18 Piranha Plastics Insert molding electronic devices
US7607249B2 (en) 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
DE602005015718D1 (en) * 2005-09-22 2009-09-10 Gemalto Oy Smartcard with transparent edge and manufacturing process for this
FI20065356A0 (en) * 2006-05-26 2006-05-26 Perlos Oyj Shall be provided with integrated user interface means and shell production process
DE102008019571A1 (en) 2008-04-18 2009-10-22 Giesecke & Devrient Gmbh Chip card and method for its production
DE102009023405A1 (en) * 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Method for producing portable data carriers
DE102011114119B3 (en) 2011-09-24 2013-01-03 Oechsler Ag Housing shell equipped with an antenna for, in particular, a mobile telecommunication device and method for its production
US10406845B2 (en) 2013-03-15 2019-09-10 Gemalto Sa Flexible hinge material comprising cross-linked polyurethane material
TWI504498B (en) * 2013-07-26 2015-10-21 Button Int Co Ltd Object decoration processing method
US10513081B1 (en) 2013-12-10 2019-12-24 Wells Fargo Bank, N.A. Method of making a transaction instrument
US10354175B1 (en) 2013-12-10 2019-07-16 Wells Fargo Bank, N.A. Method of making a transaction instrument
US10380476B1 (en) 2013-12-10 2019-08-13 Wells Fargo Bank, N.A. Transaction instrument
US10479126B1 (en) 2013-12-10 2019-11-19 Wells Fargo Bank, N.A. Transaction instrument
DE102014217061B4 (en) * 2014-08-27 2021-09-16 Koenig & Bauer Ag Device for producing plastic molded parts
US10482365B1 (en) 2017-11-21 2019-11-19 Wells Fargo Bank, N.A. Transaction instrument containing metal inclusions
JP2021054009A (en) 2019-10-01 2021-04-08 豊田合成株式会社 Manufacturing method for near-infrared sensor cover
CN113276359B (en) * 2020-02-19 2022-11-08 长鑫存储技术有限公司 Injection mold and injection molding method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01163038A (en) * 1987-11-27 1989-06-27 Nec Corp Apparatus for positioning printing film for multicolor molding
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
US5417905A (en) * 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
DE4038126C2 (en) * 1990-11-27 1993-12-16 Mannesmann Ag Method and device for producing a decorated chip card
DE59404205D1 (en) * 1993-10-26 1997-11-06 Siemens Ag Process for the production of chip cards by means of injection molding
FR2716555B1 (en) * 1994-02-24 1996-05-15 Gemplus Card Int Method of manufacturing a contactless card.
FR2760998B1 (en) * 1997-03-21 1999-05-21 Equisecurite Sa METHOD OF INCLUDING AN ELECTRONIC LABEL IN AN OBJECT MADE OF PLASTIC, AT THE TIME OF THE MANUFACTURE OF THE OBJECT
JPH1111064A (en) * 1997-06-26 1999-01-19 Konica Corp Card for identifying certification and its manufacture
DE19733800A1 (en) * 1997-08-05 1999-02-11 Sachsenring Automobiltechnik Method for producing a storage part with an anti-slip covering

Also Published As

Publication number Publication date
WO2002028613A1 (en) 2002-04-11
DE60121974T2 (en) 2007-03-15
ATE334793T1 (en) 2006-08-15
EP1322457A1 (en) 2003-07-02
DE60121974D1 (en) 2006-09-14
US20050035491A1 (en) 2005-02-17
EP1322457B1 (en) 2006-08-02
GB0024070D0 (en) 2000-11-15

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