WO2001038036A1 - Procede et dispositif de traitement de substrats au moyen de rayons lasers - Google Patents

Procede et dispositif de traitement de substrats au moyen de rayons lasers Download PDF

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Publication number
WO2001038036A1
WO2001038036A1 PCT/DE2000/004240 DE0004240W WO0138036A1 WO 2001038036 A1 WO2001038036 A1 WO 2001038036A1 DE 0004240 W DE0004240 W DE 0004240W WO 0138036 A1 WO0138036 A1 WO 0138036A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
spot width
structures
laser beams
imaging device
Prior art date
Application number
PCT/DE2000/004240
Other languages
German (de)
English (en)
Inventor
Stefan Dietrich
Hans Jürgen MAYER
Eddy Roelants
Udo Wiggermann
Alex Schreiner
Leo Higgins
Original Assignee
Siemens Production And Logistics Systems Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Production And Logistics Systems Ag filed Critical Siemens Production And Logistics Systems Ag
Publication of WO2001038036A1 publication Critical patent/WO2001038036A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Definitions

  • V ent and device for processing substrates with ⁇ means laser beams
  • the invention relates to a method for processing of S ubstraten with laser beams, and an apparatus for processing substrates according to the preamble of the patent applica ⁇ entitlement. 5
  • standard lasers such as Nd: YAG, Nd: YV0 4 , C0 2 , argon ion or other lasers known per se are generally used.
  • the output beams of these lasers are imaged onto the substrate to be processed via a beam expander, a deflection unit and an optical imaging device, usually an f-theta lens with a focal length between 400 mm and 40 mm.
  • the laser beam is focused on the smallest possible spot width (hereinafter the beam diameter and thus the translation of the English term: * spot size w ) in order to be able to produce the finest possible structures on the substrate.
  • spot size w the translation of the English term
  • the T ASK is inventively achieved by a method having the features of claim 1 and a device of the initially mentioned type with the characterizing features of claim. 5
  • the structuring of larger areas with a larger spot width is used.
  • the larger spot width means that a larger area is removed per laser pulse, which means fewer lines are structured and processing time is reduced.
  • the distance between the laser and the processing surface is changed in order to realize the different spot width.
  • the processing surface comes out of the focal plane of the optical imaging device and the spot width increases.
  • the complex change in distance between the optical imaging device and the processing surface can be avoided in an advantageous manner by using a zoom telescope as the optical imaging device.
  • a further advantageous embodiment of the method according to claim 4 provides that the distance between the lenses of the beam expander is changed from one another. This shifts the focus point with respect to the processing area.
  • FIG. 1 shows a schematic side view of a device according to the invention
  • Figure 2a shows a schematic beam path of the laser beam with C hange of the relative position of processing surface an d optical imaging device
  • FIG. 2 b shows a schematic beam path of the laser beam using a zoom telescope
  • Figure 2c shows a schematic beam path of the laser beam with misaligned beam expander
  • Figure 3 is a schematic plan view of a substrate with fine structures and with flat structures.
  • FIG. 1 shows a schematic side view of a laser source 1 that generates a laser beam 2.
  • the laser beam 2 is expanded by a beam expander 3 and focused on a substrate 7 to be processed by a deflection unit 5 and an optical imaging device 6.
  • the laser beam is focused as much as possible to a minimum spot width 8, so that the processing surface of the substrate lies in the focal plane of the optical imaging device 6.
  • the optical conditions are shown in more detail in the associated beam path in FIG. 2a.
  • the beam 26 emanating from the laser source is widened to a wider beam 27 by a first lens 24 and a second lens 25 of the beam expander 3.
  • the first lens 24 has a focal length fl
  • the second lens 25 a focal length f2.
  • the two lenses 24, 25 are constructed like a Kepler telescope, that is, the focal points of both lenses coincide.
  • the optical imaging device 6 with a focal length f3 focuses the wide beam 27 on a minimum spot width 8 (represented schematically by the waist) in the focal plane of the optical imaging device.
  • the spot width is increased to a second spot width 11, in which the processing surface 9 is in a second position 10 in the beam direction z is moved. As a result, the processing surface 10 is no longer in the focal plane.
  • FIG. 2 b A further beam path for changing the spot width is shown in FIG. 2 b .
  • a zoom telescope 30 is used as trahlaufweiter S.
  • the expansion factor is varied by the zoom telescope 30.
  • This is shown schematically by the smaller focal length f4 of the second lens 31 of the zoom telescope 30, which causes the beam 27 after the zoom telescope 30 to have a smaller diameter than the beam after the beam expander 3 in FIG. 2a.
  • the narrower beam 27 results in an enlarged spot width 11 in the processing area 9 in the focal plane of the optical imaging device 6 according to the rules of Gaussian optics (which cannot be shown in this simple schematic, radiation-optical representation).
  • FIG. 2c Another possibility of changing the spot width is shown in FIG. 2c in the beam path.
  • the distance between the two lenses 24, 25 of the beam expander is changed so that the beam 28 emerging from the beam expander diverges. If the optical imaging device 6 remains the same, this change leads to a displacement of the image point out of the focal plane, which likewise leads to an enlarged spot width 11 in the processing surface 9.
  • the structuring of substrates can be designed more quickly if both fine structures 20 and structures 21 that have a flat structure are to be processed.
  • Fine structures 20 are processed with the smallest spot width 8, while the flat structures 21 with the larger spot width 11 are removed.
  • conductor tracks with connection pads are shown as fine structures 20, which must be separated from one another by structuring with the laser.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

Lors du traitement de structures de surface importante (21) et de structures fines (20) sur un substrat (7), les structures de surface importante (21) sont généralement enlevées par lignes fines, ce qui est très coûteux en temps. Selon l'invention, les structures fines (20) sont traitées avec une largeur de spot (8) plus petite que les structures (21) de constitution surfacique.
PCT/DE2000/004240 1999-11-29 2000-11-28 Procede et dispositif de traitement de substrats au moyen de rayons lasers WO2001038036A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16792199P 1999-11-29 1999-11-29
US60/167,921 1999-11-29
DE19957733 1999-12-01
DE19957733.1 1999-12-01

Publications (1)

Publication Number Publication Date
WO2001038036A1 true WO2001038036A1 (fr) 2001-05-31

Family

ID=26055685

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/004240 WO2001038036A1 (fr) 1999-11-29 2000-11-28 Procede et dispositif de traitement de substrats au moyen de rayons lasers

Country Status (1)

Country Link
WO (1) WO2001038036A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002100137A1 (fr) * 2001-06-06 2002-12-12 Siemens Aktiengesellschaft Procede et dispositif pour structurer des cartes de circuit
WO2011131541A1 (fr) * 2010-04-22 2011-10-27 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Unité de formation de faisceau destinée à focaliser un faisceau laser et son procédé de commande

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4088864A (en) * 1974-11-18 1978-05-09 Alza Corporation Process for forming outlet passageways in pills using a laser
US4667080A (en) * 1984-03-26 1987-05-19 Bias Forschungs- Und Entwicklungslabor Fur Angewandte Strahltechnik Device for processing workpieces using an energy beam of high power density, in particular a laser beam from a CO2 laser
US5092350A (en) * 1983-11-11 1992-03-03 Molins, Plc Cigarette manufacture
FR2689254A1 (fr) * 1992-03-31 1993-10-01 Commissariat Energie Atomique Dispositif de focalisation d'un faisceau lumineux.
US5494781A (en) * 1993-08-26 1996-02-27 Matsushita Electric Works, Ltd. Method for manufacturing printed circuit board
US5811754A (en) * 1994-06-02 1998-09-22 Mitsubishi Denki Kabushiki Kaisha Optical processing method and apparatus for carrying out the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4088864A (en) * 1974-11-18 1978-05-09 Alza Corporation Process for forming outlet passageways in pills using a laser
US5092350A (en) * 1983-11-11 1992-03-03 Molins, Plc Cigarette manufacture
US4667080A (en) * 1984-03-26 1987-05-19 Bias Forschungs- Und Entwicklungslabor Fur Angewandte Strahltechnik Device for processing workpieces using an energy beam of high power density, in particular a laser beam from a CO2 laser
FR2689254A1 (fr) * 1992-03-31 1993-10-01 Commissariat Energie Atomique Dispositif de focalisation d'un faisceau lumineux.
US5494781A (en) * 1993-08-26 1996-02-27 Matsushita Electric Works, Ltd. Method for manufacturing printed circuit board
US5811754A (en) * 1994-06-02 1998-09-22 Mitsubishi Denki Kabushiki Kaisha Optical processing method and apparatus for carrying out the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"METHOD FOR PRODUCING HOLES OF DIFFERENT SIZES BY A LASER", RESEARCH DISCLOSURE,KENNETH MASON PUBLICATIONS, HAMPSHIRE,GB, no. 395, 1 March 1997 (1997-03-01), pages 195 - 196, XP000698585, ISSN: 0374-4353 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002100137A1 (fr) * 2001-06-06 2002-12-12 Siemens Aktiengesellschaft Procede et dispositif pour structurer des cartes de circuit
US6783688B2 (en) 2001-06-06 2004-08-31 Siemens Aktiengesellschaft Method and apparatus for structuring printed circuit boards
WO2011131541A1 (fr) * 2010-04-22 2011-10-27 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Unité de formation de faisceau destinée à focaliser un faisceau laser et son procédé de commande
CN102985214A (zh) * 2010-04-22 2013-03-20 通快机床两合公司 用于使激光射束聚焦的射束成型单元及其控制方法
US8804238B2 (en) 2010-04-22 2014-08-12 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Beam shaping unit for focusing a laser beam
US9329368B2 (en) 2010-04-22 2016-05-03 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Beam shaping unit for focusing a laser beam

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