WO2001024259A3 - Encapsulation de semi-conducteurs - Google Patents
Encapsulation de semi-conducteurs Download PDFInfo
- Publication number
- WO2001024259A3 WO2001024259A3 PCT/US2000/027206 US0027206W WO0124259A3 WO 2001024259 A3 WO2001024259 A3 WO 2001024259A3 US 0027206 W US0027206 W US 0027206W WO 0124259 A3 WO0124259 A3 WO 0124259A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- recess
- electronic component
- electronic device
- conductive material
- coupled
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/147—Semiconductor insulating substrates
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU77488/00A AU7748800A (en) | 1999-09-30 | 2000-10-02 | Semiconductor packaging |
EP00967264A EP1243025A2 (fr) | 1999-09-30 | 2000-10-02 | Encapsulation de semi-conducteurs |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15673999P | 1999-09-30 | 1999-09-30 | |
US60/156,739 | 1999-09-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001024259A2 WO2001024259A2 (fr) | 2001-04-05 |
WO2001024259A3 true WO2001024259A3 (fr) | 2001-11-29 |
Family
ID=22560878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/027206 WO2001024259A2 (fr) | 1999-09-30 | 2000-10-02 | Encapsulation de semi-conducteurs |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1243025A2 (fr) |
AU (1) | AU7748800A (fr) |
WO (1) | WO2001024259A2 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10047213A1 (de) * | 2000-09-23 | 2002-04-11 | Philips Corp Intellectual Pty | Elektrisches oder elektronisches Bauteil und Verfahren zum Herstellen desselben |
US6686642B2 (en) | 2001-06-11 | 2004-02-03 | Hewlett-Packard Development Company, L.P. | Multi-level integrated circuit for wide-gap substrate bonding |
SI3659437T1 (sl) | 2004-01-23 | 2022-10-28 | Eden Research Plc | Postopki za uničevanje nematod, ki obsega uporabo inkapsulirane terpenske komponente |
DE102005007423B3 (de) | 2005-02-18 | 2006-06-14 | Atmel Germany Gmbh | Verfahren zur Integration eines elektronischen Bauteils oder dergleichen in ein Substrat |
DE102010042567B3 (de) | 2010-10-18 | 2012-03-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen eines Chip-Package und Chip-Package |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3436604A (en) * | 1966-04-25 | 1969-04-01 | Texas Instruments Inc | Complex integrated circuit array and method for fabricating same |
US4936808A (en) * | 1988-12-12 | 1990-06-26 | Samsung Electronics Co., Ltd. | Method of making an LED array head |
US5198963A (en) * | 1991-11-21 | 1993-03-30 | Motorola, Inc. | Multiple integrated circuit module which simplifies handling and testing |
WO1996012298A1 (fr) * | 1993-08-05 | 1996-04-25 | Vlsi Technology, Inc. | Technologie du microcablage appliquee a un boitier a cavite mince a reseau de billes en forme de grille sur sa face inferieure |
WO1999028971A1 (fr) * | 1997-05-15 | 1999-06-10 | Cis Institut Für Mikrosensorik | Composant electronique hybride et procede permettant de le produire |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5944849A (ja) * | 1982-09-08 | 1984-03-13 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPS61214444A (ja) * | 1985-03-18 | 1986-09-24 | Fujitsu Ltd | 半導体装置 |
JPH0834264B2 (ja) * | 1987-04-21 | 1996-03-29 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
-
2000
- 2000-10-02 WO PCT/US2000/027206 patent/WO2001024259A2/fr active Application Filing
- 2000-10-02 EP EP00967264A patent/EP1243025A2/fr not_active Ceased
- 2000-10-02 AU AU77488/00A patent/AU7748800A/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3436604A (en) * | 1966-04-25 | 1969-04-01 | Texas Instruments Inc | Complex integrated circuit array and method for fabricating same |
US4936808A (en) * | 1988-12-12 | 1990-06-26 | Samsung Electronics Co., Ltd. | Method of making an LED array head |
US5198963A (en) * | 1991-11-21 | 1993-03-30 | Motorola, Inc. | Multiple integrated circuit module which simplifies handling and testing |
WO1996012298A1 (fr) * | 1993-08-05 | 1996-04-25 | Vlsi Technology, Inc. | Technologie du microcablage appliquee a un boitier a cavite mince a reseau de billes en forme de grille sur sa face inferieure |
WO1999028971A1 (fr) * | 1997-05-15 | 1999-06-10 | Cis Institut Für Mikrosensorik | Composant electronique hybride et procede permettant de le produire |
Non-Patent Citations (1)
Title |
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See also references of EP1243025A2 * |
Also Published As
Publication number | Publication date |
---|---|
WO2001024259A2 (fr) | 2001-04-05 |
AU7748800A (en) | 2001-04-30 |
EP1243025A2 (fr) | 2002-09-25 |
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