WO2001012880A3 - Verfahren zur herstellung einer selbsttragenden kupferfolie - Google Patents

Verfahren zur herstellung einer selbsttragenden kupferfolie Download PDF

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Publication number
WO2001012880A3
WO2001012880A3 PCT/DE2000/002444 DE0002444W WO0112880A3 WO 2001012880 A3 WO2001012880 A3 WO 2001012880A3 DE 0002444 W DE0002444 W DE 0002444W WO 0112880 A3 WO0112880 A3 WO 0112880A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
copper
self
production
laminar
Prior art date
Application number
PCT/DE2000/002444
Other languages
English (en)
French (fr)
Other versions
WO2001012880A2 (de
Inventor
Juergen Hackert
Axel Schaefer
Original Assignee
Bolta Werke Gmbh
Juergen Hackert
Axel Schaefer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bolta Werke Gmbh, Juergen Hackert, Axel Schaefer filed Critical Bolta Werke Gmbh
Priority to AU72684/00A priority Critical patent/AU7268400A/en
Priority to EP00960325A priority patent/EP1203110A2/de
Publication of WO2001012880A2 publication Critical patent/WO2001012880A2/de
Publication of WO2001012880A3 publication Critical patent/WO2001012880A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

Es wird ein Verfahren zur Herstellung einer selbsttragenden Kupferfolie beschrieben, die aufgrund ihres Gefüges eine kleine Scherfestigkeit besitzt und scharfrandig prägbar ist, wobei auf einer in ein Kupferelektrolytbad eintauchenden und von einem Anodenkorb umgebenen rotierenden Kathodenwalze die Kupferfolie galvanisch abgeschieden und von der Kathodenwalze abgelöst wird. Dabei wird ein Standard-Kupferelektrolytbad mit solchen Zusätzen verwendet, daß sich ein dentritisches Wachstum der Kupferfolie mit einer lamellaren Gefüge-Struktur ergibt. Aus dieser lamellaren Gefüge-Struktur resultiert eine vergrößerte Härte der erfindungsgemäß hergestellten Kupferfolie. Diese vergrößerte Härte geht mit einer erhöhten Sprödigkeit einher, durch welche die Konturschärfe beim Prägen der Kupferfolie wesentlich verbessert wird.
PCT/DE2000/002444 1999-08-13 2000-07-25 Verfahren zur herstellung einer selbsttragenden kupferfolie WO2001012880A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU72684/00A AU7268400A (en) 1999-08-13 2000-07-25 Method for the production of a self-supporting copper foil
EP00960325A EP1203110A2 (de) 1999-08-13 2000-07-25 Verfahren zur herstellung einer selbsttragenden kupferfolie

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19937843.6 1999-08-13
DE1999137843 DE19937843C1 (de) 1999-08-13 1999-08-13 Verfahren zur Herstellung einer selbsttragenden Kupferfolie

Publications (2)

Publication Number Publication Date
WO2001012880A2 WO2001012880A2 (de) 2001-02-22
WO2001012880A3 true WO2001012880A3 (de) 2001-10-04

Family

ID=7917921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/002444 WO2001012880A2 (de) 1999-08-13 2000-07-25 Verfahren zur herstellung einer selbsttragenden kupferfolie

Country Status (4)

Country Link
EP (1) EP1203110A2 (de)
AU (1) AU7268400A (de)
DE (1) DE19937843C1 (de)
WO (1) WO2001012880A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10133250B4 (de) * 2001-07-09 2005-06-30 Vipem Hackert Gmbh Verfahren zur Herstellung eines elektrischen oder elektronischen Kabelbaumes in Form eines flexiblen Laminates
DE10255702B4 (de) * 2002-11-29 2011-08-11 Vipem Hackert GmbH, 08223 Verfahren zur Erzeugung mechanisch strukturierbarer Kupferfolien
DE10312693B3 (de) * 2003-03-21 2004-11-04 Rehau Ag + Co. Verfahren zum Aufbringen von mindestens einer Leiterbahn auf einem Kunststoffbauteil sowie Spritzgusswerkzeug zur Herstellung eines Kunststoffbauteils mit mindestens einer Leiterbahn
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
CN110055560B (zh) * 2019-04-24 2021-02-09 福建清景铜箔有限公司 电解铜箔的生箔装置及阴极辊的制备方法
CN110904472B (zh) * 2019-11-21 2021-06-08 湖北中一科技股份有限公司 一种防电解铜箔断裂阴极辊及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769179A (en) * 1972-01-19 1973-10-30 Kewanee Oil Co Copper plating process for printed circuits
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
US4692221A (en) * 1986-12-22 1987-09-08 Olin Corporation In-situ dendritic treatment of electrodeposited foil
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
EP0568733A2 (de) * 1992-05-06 1993-11-10 Circuit Foil U.S.A. Incorporated Kupferfolie mit niedrigem Profil sowie Verfahren und Vorrichtung zur Herstellung kaschierbarer Metallfolien
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
US5834140A (en) * 1995-09-22 1998-11-10 Circuit Foil Japan Co., Ltd. Electrodeposited copper foil for fine pattern and method for producing the same
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3116078A1 (de) * 1981-04-22 1983-01-20 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen "praegefolie"
US5019221A (en) * 1989-01-18 1991-05-28 Yates Industries Electroplating drum cathode with high current-carrying capability

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769179A (en) * 1972-01-19 1973-10-30 Kewanee Oil Co Copper plating process for printed circuits
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
US4692221A (en) * 1986-12-22 1987-09-08 Olin Corporation In-situ dendritic treatment of electrodeposited foil
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
EP0568733A2 (de) * 1992-05-06 1993-11-10 Circuit Foil U.S.A. Incorporated Kupferfolie mit niedrigem Profil sowie Verfahren und Vorrichtung zur Herstellung kaschierbarer Metallfolien
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
US5834140A (en) * 1995-09-22 1998-11-10 Circuit Foil Japan Co., Ltd. Electrodeposited copper foil for fine pattern and method for producing the same
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DETTNER H.W.; ELZE J.: "HANDBUCH DER GALVANOTECHNIK. BAND 2. Verfahren für die galvanische und stromlose Metallabscheidung.", 1966, HANSER VERLAG, MÜNCHEN, DE, XP002157256 *

Also Published As

Publication number Publication date
DE19937843C1 (de) 2001-02-08
AU7268400A (en) 2001-03-13
WO2001012880A2 (de) 2001-02-22
EP1203110A2 (de) 2002-05-08

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