WO2001006826A2 - Treating device and treating method - Google Patents

Treating device and treating method Download PDF

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Publication number
WO2001006826A2
WO2001006826A2 PCT/JP2000/004669 JP0004669W WO0106826A2 WO 2001006826 A2 WO2001006826 A2 WO 2001006826A2 JP 0004669 W JP0004669 W JP 0004669W WO 0106826 A2 WO0106826 A2 WO 0106826A2
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
heating
heating chamber
purge
pressure
Prior art date
Application number
PCT/JP2000/004669
Other languages
French (fr)
Japanese (ja)
Other versions
WO2001006826A3 (en
Inventor
Yoshiaki Yokoyama
Original Assignee
Houei Syoukai Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Houei Syoukai Co., Ltd. filed Critical Houei Syoukai Co., Ltd.
Priority to AU60144/00A priority Critical patent/AU6014400A/en
Publication of WO2001006826A2 publication Critical patent/WO2001006826A2/en
Publication of WO2001006826A3 publication Critical patent/WO2001006826A3/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/02Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity of multiple-track type; of multiple-chamber type; Combinations of furnaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B09DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09BDISPOSAL OF SOLID WASTE
    • B09B3/00Destroying solid waste or transforming solid waste into something useful or harmless
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/74Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D3/00Diffusion processes for extraction of non-metals; Furnaces therefor
    • C21D3/10Furnaces therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/04Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity adapted for treating the charge in vacuum or special atmosphere
    • F27B9/042Vacuum furnaces
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E50/00Technologies for the production of fuel of non-fossil origin
    • Y02E50/30Fuel from waste, e.g. synthetic alcohol or diesel

Definitions

  • the present invention relates to a processing device and a processing method.
  • the present invention relates to a processing apparatus and a processing method for processing objects to be processed such as soil, incinerated ash, and sludge.
  • the present invention relates to a processing apparatus and a processing method for processing a processing target object containing an organic substance and a metal.
  • the present invention relates to a processing apparatus and a processing method for performing a heat treatment on a metal.
  • One such processing technique is heating under reduced pressure.
  • the object to be treated is heated under reduced pressure in a heating furnace equipped with an exhaust system.
  • the components of the object to be processed are thermally decomposed, and the components of the object to be processed are evaporated.
  • the organic substance when processing an object to be processed containing an organic substance and a metal, the organic substance may first be thermally decomposed and then the metal may be evaporated. At this time, if the hermetic chamber that thermally decomposes organic matter and the hermetic chamber that evaporates metal are directly connected, some inconveniences arise. Such reduced pressure heating technology Then, ensuring airtightness is an important issue.
  • the evaporated metal adheres to the hermetic door, and the sealing performance of the hermetic door decreases. When the sealing performance of the hermetic door decreases, the pressure inside the system increases, and the boiling point of the evaporated metal also increases. For this reason, the object to be treated must be heated to a higher temperature, and the productivity of the treatment decreases.
  • metal heat treatment includes quenching, tempering, annealing, and normalizing.
  • individual devices such as quenching and annealing have been used as heat treatment devices used for these heat treatments. Disclosure of the invention
  • an object of the present invention is to provide a processing apparatus having a simple configuration and high productivity.
  • Another object of the present invention is to provide a processing apparatus capable of ensuring a sealing property of an airtight door and performing a long-term continuous operation.
  • the present invention also provides a processing apparatus capable of efficiently processing an object to be processed including organic matter and metal, such as shredder dust, sludge, soil, incinerated ash, incinerated fly ash, and a circuit board. Aim.
  • the present invention provides a processing apparatus that can perform heat treatment such as quenching, annealing, and normalizing simultaneously or continuously by providing a cooling means capable of freely changing a cooling rate.
  • the purpose is to provide.
  • the present invention efficiently treats objects to be treated, such as shredder dust, sludge, soil, incinerated ash, incinerated fly ash, and circuit boards, which are composed of organic matter and metal, and also includes quenching, annealing, and annealing. It is an object of the present invention to provide a processing apparatus capable of performing a plurality of quasi heat treatments simultaneously or concurrently. In order to solve such a problem, the present invention employs the following configuration.
  • the processing apparatus of the present invention is a processing apparatus for processing an object to be processed, wherein the first airtight chamber is connected to a first exhaust unit and is accessible from outside, and is connected to the first airtight chamber; A second airtight chamber having a first heating means and a second exhaust means, and a second heating means and a third airtight chamber which are connected to the first airtight chamber in parallel with the second airtight chamber; And a third hermetic chamber having an exhaust means.
  • different heating processes such as a normal-pressure heating process, a purge heating process, and a reduced-pressure heating process can be performed concurrently or individually.
  • cooling processing in addition to the above-described heating processing can be performed simultaneously in parallel or individually.
  • the processing apparatus of the present invention is a processing apparatus for processing an object to be processed, wherein a first heating chamber including a first heating unit and a first exhaust unit, a second heating unit, and a second heating unit.
  • a second heating chamber provided with an exhaust means, and a first purge chamber interposed between the first heating chamber and the second heating chamber and provided with a third exhaust means. It is characterized by having.
  • the first purge chamber corresponds to the first hermetic chamber
  • the first heating chamber corresponds to the second hermetic chamber
  • the second heating chamber corresponds to the third hermetic chamber. That is, the first purge chamber is provided so as to be connected to the first heating chamber and the second heating chamber.
  • These rooms do not need to be arranged in a straight line, but may be arranged in an L-shape.
  • the first exhaust means, the second The exhaust means and the third exhaust means may be provided individually, or at least a part thereof may be provided in common.
  • openable and closable partitions that can keep each chamber airtight are provided. It is arranged. Examples of these partitions include a combination of an airtight door and an insulated door.
  • the first heating chamber and the second heating chamber are respectively provided with a first heating means and a second heating means for heating the room.
  • these heating means include various types of moss, induction heating, dielectric heating, microwave heating, indirect heating using gas, oil, and the like. Note that the first heating means and the second heating means need not be the same.
  • a first exhaust system and a second exhaust system for exhausting the interior of the room are connected to the first heating chamber and the second heating chamber.
  • exhaust systems for example, exhaust blowers and various vacuum pumps can be used.
  • vacuum pumps include liquid-sealed pumps (water-sealed pumps), such as mouth-to-mouth pumps, oil diffusion pumps, booths, evening pumps (roots pumps), evening-bottle molecular pumps, ion-jet pumps, and water-sealed pumps be able to. These vacuum pumps may be used in combination.
  • the object to be processed may be processed at normal pressure (including negative pressure by an exhaust blower) or may be processed at reduced pressure using a vacuum pump.
  • the first heating chamber, the second heating chamber, or the first purge chamber may include means for introducing a non-oxidizing gas.
  • the non-oxidizing gas include nitrogen and a rare gas.
  • the non-oxidizing gas introduction system include a configuration in which each chamber and a non-oxidizing gas reserve tank are connected via a valve.
  • a means for condensing the effluent and a means for reforming may be further provided.
  • the organic matter is thermally decomposed in the first heating chamber, and the gas (including mist and fine particles) generated by the thermal decomposition is condensed by an oiling device and collected. You may make it.
  • a predetermined metal may be heated under reduced pressure to be vaporized, and the evaporated metal may be condensed and recovered.
  • the first purge chamber includes an airtight door for accessing the outside without passing through the first heating chamber and the second heating chamber. With this airtight door, the object to be treated can be directly introduced into the first purge chamber from the outside of the apparatus, and can be taken out of the first purge chamber.
  • the first purge chamber also has a function of separating the first heating chamber and the second heating chamber.
  • an object to be treated is introduced into a purge chamber, and is heated in a first heating chamber. Thereafter, the object to be processed is sent to the second heating chamber via the first purge chamber.
  • the second partition is opened and closed so that at least one of the partitions is always closed.
  • the atmosphere of the heat chamber can be separated. Therefore, for example, a substance evaporated from the object to be treated in the second heating chamber can be prevented from adhering to the hermetic door separating the first heating chamber and the first purge chamber.
  • the number of airtight doors and heat-insulated doors can be reduced as compared with the conventional case.
  • each chamber is arranged in the order of a first purge chamber, a first heating chamber, a second heating chamber, and a second purge chamber as in a conventional processing apparatus.
  • Both insulated doors and airtight doors can be reduced by one. Therefore, the configuration of the device becomes simpler, the cost is reduced, and the maintainability is improved.
  • a discontinuous configuration in which multiple processing chambers are arranged in parallel with the purge chamber instead of a continuous configuration of multiple heating processing chambers, the use of the processing equipment is expanded, and the processing equipment becomes versatile. You can use it.
  • a means for adjusting the pressure so that the pressure in the first heating chamber is equal to or higher than the atmospheric pressure may be further provided.
  • pressure adjusting means include: means for detecting the pressure in the first heating chamber; means for introducing a non-oxidizing gas into the first heating chamber; and means for responding to the detected pressure. Means for adjusting the introduction amount of the non-oxidizing gas.
  • the first hermetic chamber can always be maintained at or above the atmospheric pressure, so that the safety of the device can be improved.
  • a non-oxidizing gas not only the pressure but also the oxygen concentration in the system may be adjusted. This makes it possible to stabilize the amount of pyrolysis gas generated and control the average molecular weight.
  • a second purge chamber connected to the second heating chamber may be further provided.
  • the second purge chamber may be provided with an exhaust system and an airtight door for accessing the outside similarly to the first purge chamber described above.
  • first purge chamber and the second purge chamber may be provided with cooling means for cooling the chamber.
  • the cooling means include a cooling fan and a water-cooled jacket structure.
  • a non-oxidizing gas may be circulated in the room, and the non-oxidizing gas may be cooled outside by a heat exchanger or the like. It is preferable that the object to be processed subjected to the predetermined processing in the second heating chamber is transported to the second purge chamber, cooled in the second purge chamber, and then taken out. This is because if the object to be treated is heated under reduced pressure in the second heating chamber, the surface free energy of the object to be treated is likely to be excessive, and if it is taken out as it is, it will be dangerous because it will burn violently. .
  • the object to be treated may be cooled in a non-oxidizing atmosphere in the second purge chamber and then taken out. Further, it is preferable that the cooling is performed in an atmosphere free from organic halides (a lack of organic halides). As a result, it is possible to prevent organic halides such as dioxins and other pollutants from remaining in the residue of the treatment.
  • the processing apparatus of the present invention can also perform a heat treatment of a metal.
  • the first heating chamber can be used as an annealing heating chamber, and the second heating chamber can be used as a quenching heating chamber.
  • the first heating chamber can be used as a heating chamber for tempering, and the second heating chamber can be used as a heating chamber for vacuum quenching.
  • the first purge chamber and the second purge chamber are used as cooling chambers. With such a configuration, different heat treatments can be performed in parallel or continuously. Between the two heating chambers, a first purge chamber with external access Such an advantage can be obtained by employing an interposed structure.
  • the processing apparatus of the present invention is provided with cooling means capable of freely changing the cooling rate.
  • cooling means capable of freely changing the cooling rate.
  • a processing apparatus includes a first chamber capable of forming a first sealed space for holding a processing target object, and a second chamber capable of forming a second sealed space for holding a processing target object.
  • a third chamber capable of delivering the object to be processed between the first chamber and the second chamber and forming a third closed space for holding the object to be processed; and the first chamber And means for heating the object to be treated in the second chamber, and means for reducing the pressure in the first to third enclosed spaces to below normal pressure.
  • means for forming each closed space and transferring the object to be treated between these closed spaces for example, the number of closed doors, for example, the first heating chamber and the second heating chamber
  • means for forming each closed space and transferring the object to be treated between these closed spaces for example, the number of closed doors, for example, the first heating chamber and the second heating chamber
  • independent processing can be performed simultaneously in parallel or continuously.
  • individual processing can be performed in the first heating chamber and the second heating chamber.
  • the treatment method of the present invention in the method for treating an object to be treated containing an organic substance and an inorganic substance, a step of thermally decomposing the organic substance, and a step of heating the pyrolysis residue under reduced pressure to evaporate and recover the inorganic substance. And a step of subjecting the thermal decomposition residue of the organic substance to a heating oxidation reaction in an oxidizing atmosphere.
  • a heating oxidation reaction in an oxidizing atmosphere.
  • FIG. 1 is a diagram schematically illustrating an example of a configuration of a processing apparatus of the present invention
  • FIG. 2 is a diagram schematically illustrating an example of a configuration of a pressure control system provided in the processing apparatus of the present invention
  • FIG. 3 is a view showing a modification of the processing apparatus of the present invention for comparison;
  • FIG. 4 is a view schematically showing an example of the configuration of the processing apparatus of the present invention; and
  • FIG. It is a figure which shows the example of a structure of a processing apparatus roughly.
  • FIG. 1 is a diagram schematically showing another example of the configuration of the processing apparatus of the present invention.
  • This processing apparatus includes four chambers: a first heating chamber 11, a first purge chamber 12, a second heating chamber 13, and a second purge chamber 14.
  • the first heating chamber 11 and the first purge chamber 12 are separated by a heat insulating door 21 and an airtight door 31.
  • the first purge chamber 12 and the second heating chamber are separated by an airtight door 32 and an insulating door 22.
  • the airtight door and the airtight door which are separated by the heat insulating door 23 and the airtight door 33 may be separated from each other, They may be formed integrally. In any case, it is preferable to provide a heat-insulating door on the heating chamber side of the airtight door to protect the seal of the airtight door from the heat of the heating chamber.
  • the first purge chamber 12 and the second purge chamber 14 are provided with airtight doors 34 and 35, respectively, through which the object to be treated can be taken in and out with the outside.
  • These hermetic doors and heat insulating doors are configured to be openable and closable, for example, with cylinders and wires. Note that these hermetic doors generally have only one side airtightly sealed.
  • Can be Each room is provided with a transport mechanism for transporting the object to be processed.
  • Reference numerals 18 and 19 denote transfer mechanisms for moving an object to be processed into and out of the first purge chamber 12 and the second purge chamber.
  • the first heating room 11 has a heater for heating the room.
  • the first heating chamber 11 is connected to an exhaust system via a reformer 41 and a condenser 42.
  • the exhaust system is provided with an exhaust pump 43.
  • the reformer 41 reforms a gaseous emission discharged by heating the object to be treated at a high temperature of, for example, about 700 ° C. to 1200 ° C. This breaks down dioxin into chlorine and carbon, for example.
  • PCBs and the like are similarly decomposed and these pollutants are rendered harmless.
  • the condenser 42 is for condensing the condensable components in the gaseous effluent as a liquid component and a solid component. Thereby, the harmless substance can be recovered in a harmless state.
  • the first heating chamber 11, the first purge chamber 12, the second heating chamber 13, and the second purge chamber 14 have a gas introduction system 44 for introducing a non-oxidizing gas such as nitrogen into the chamber. It is connected.
  • the amount of the non-oxidizing gas introduced into the first heating chamber 11 is controlled so that the inside of the chamber is always at or above the atmospheric pressure.
  • FIG. 2 is a diagram illustrating an example of a configuration of a pressure control system. This control can be performed by, for example, a pressure sensor 54 that measures the pressure in the first heating chamber and a controller 55 that controls the open / close state of a valve that introduces a non-oxidizing gas according to the measured pressure. it can. If an oxygen concentration sensor is provided in the first heating chamber 11, not only the pressure but also the oxygen concentration in the room can be controlled.
  • the first purge chamber 12 is connected to the first heating chamber 11 and the second heating chamber 13 via an airtight door and a heat insulating door.
  • the first purge chamber 12 can be directly accessed from the outside via an airtight door 34.
  • the object to be processed can be introduced into the first purge chamber 12 through the hermetic door 34. Again processing The object can move between the first purge chamber, the first heating chamber 11 and the second heating chamber 13.
  • the first purge chamber 12 separates the first heating chamber 11 from the second heating chamber 13. This can prevent the atmospheric gas of the second heating chamber 13 from entering the first heating chamber 11. Further, it is possible to prevent the atmospheric gas of the first heating chamber 11 from entering the second heating chamber 13.
  • the first purge chamber 12 is connected to a common exhaust system with the second purge chamber 14.
  • This exhaust system is provided with a booster pump 51 and a mouth pump 52, and can evacuate the first purge chamber 12 and the second purge chamber.
  • An oil mist trap is provided behind the rotary pump 52 so as to catch oil and the like in exhaust gas.
  • FIG. 3 is a diagram showing, for comparison, a case where the processing apparatus of the present invention illustrated in FIG. 1 is configured by connecting two heat treatment chambers. In this case, the whole equipment requires 6 airtight doors and 4 insulated doors. In a continuous processing apparatus in which a plurality of heat treatment chambers are arranged adjacently as illustrated in FIG. 3, it is necessary to provide heat insulating doors 22a and 22b on both sides of an airtight door separating adjacent heat treatment chambers.
  • each of the plurality of heat treatment chambers arranged adjacently has a vacuum exhaust system
  • the apparatus can be configured with five airtight doors and three heat insulating doors . Therefore, the configuration of the device is simplified, and the price of the device can be reduced.
  • the sealing performance of the airtight door has been improved, Susceptibility also increases.
  • the sealing ability of the hermetic door is a major factor in achieving continuous operation of the equipment. According to the present invention, by arranging two heat treatment chambers in parallel with the purge chamber, it is possible to improve both the reliability and the productivity of the apparatus.
  • the second heating chamber 13 includes a heater for heating the room.
  • the second heating chamber 13 is connected to an exhaust system via a vacuum door 13a, a reformer 41a, and a condenser 45.
  • the exhaust system is equipped with a booth pump 48 and a rotary pump 49, and the object to be treated can be heated under reduced pressure in the second heating chamber.
  • the metal contained in the object to be treated can be evaporated under reduced pressure, condensed in the condenser 45, and recovered.
  • the condenser 45 not only solid components such as metal but also oil may be condensed.
  • a dry filter 46 and a wet filter 47 are interposed between the condenser 45 and the press pump 48 and the rotary pump 49.
  • the dry filter 46 is, for example, a filter such as a metal net, and is for trapping evaporating components, fine particles, dust and the like that have passed through the condenser 45.
  • the wet fill filter 47 is a fill filter such as an oil film fill filter, for capturing fine particles and dust that have passed through the condenser 45.
  • a second purge chamber 14 is connected to the second heating chamber 13.
  • the second purge chamber 14 can be directly accessed from outside via an airtight door 35.
  • the object to be treated can be taken out of the second purge chamber 12 through the airtight door 35 or introduced into the second purge chamber.
  • the second purge chamber 14 also has a function as a cooling chamber for cooling the object to be treated in a controlled atmosphere.
  • Water-cooled jacket structure is adopted for the second purge chamber
  • a mechanism for adjusting the temperature of the supplied non-oxidizing gas may be employed.
  • a bypass is provided between each chamber including the first purge chamber 12 and the second purge chamber 14. This bypass is used to balance the pressure in the chambers on both sides of the door when opening and closing the door.
  • the non-oxidizing gas used for cooling the object to be treated in the second purge chamber 14 can be used for preheating, slow cooling, etc. of the object to be treated in the first purge chamber 12.
  • the non-oxidizing gas used for cooling the object to be treated in the first purge chamber 12 is preheated and gradually cooled in the second purge chamber 14. It can be used for cooling or the like. Further, both of these configurations may be used so as to be selectively used depending on the situation.
  • each exhaust system is provided with an exhaust gas treatment system 60 via a valve 65 at the subsequent stage.
  • the exhaust gas treatment system 60 includes a gas combustion device 61 for complete combustion of the exhaust gas, a scrubber 62 for gas cleaning, and an activated carbon filter 6 for adsorbing and removing harmful components in the gas. 3. Equipped with exhaust blower 6 4.
  • the valve 65 also has a role as a check valve.
  • the configuration of the exhaust gas treatment system 60 may be determined as necessary, such as the components of the exhaust gas.
  • the exhaust gas contains, for example, dioxins, N ⁇ x, SOx, etc.
  • a configuration capable of coping with these, such as rapid cooling after gas combustion and a catalyst may be adopted.
  • each chamber may be provided with an independent exhaust system, or at least a part may be provided with a common exhaust system.
  • the configuration of the device is simplified, and the price of the device is low, so that the device can be used for multiple purposes.
  • the sealing performance of the airtight door is improved, and maintenance is also enhanced.
  • both the reliability and the productivity of the processing apparatus can be improved.
  • the circuit board was housed in a jig such as a car or a holder, and the airtight door 34 was opened and introduced into the first purge chamber. After the first purge chamber 12 was evacuated, it was purged with nitrogen gas. Alternatively, the bypass may be opened, or the first heating chamber 11 may be exhausted. Next, the airtight door 34 and the heat insulating door 21 were opened, and the circuit board was transported to the first heating chamber 11.
  • the door was closed, the circuit board was heated in the first heating chamber 11, and the constituent resin was thermally decomposed.
  • Organic components constituting the circuit board such as prepreg, solder resist, and mold resin for electronic components, were thermally decomposed by this heating.
  • Pyrolysis generated gases containing hydrocarbon gases with relatively short molecular chains. This pyrolysis gas (including mist and solid fine particles) is sucked into the exhaust system by the exhaust blower 43, and the high-molecular hydrocarbons reformed in the reformer 41 are converted to oil in the condenser 42. It has become.
  • the thermal decomposition of the object to be treated is controlled so that the pressure inside the system is higher than the atmospheric pressure (see Fig. 2). For this reason, it is possible to prevent the outside air from flowing back into the first heating chamber 11 and efficiently guide the pyrolysis generated gas to the exhaust system side.
  • the object to be processed was returned to the first purge chamber 12. At this time, since the airtight door 3 2 that separates the first purge chamber 12 and the second heating chamber 13 is closed, the atmosphere gas in the first heating chamber 11 never go to 3.
  • the airtight door 31 and the heat insulating door 21 are closed, and the chamber is evacuated. At this time, even if gas is still discharged from the object to be treated, it is condensed and recovered by the condenser 44. Then, with the pressures of the first purge chamber 12 and the second heating chamber 13 balanced, the airtight door 3 2 and the heat insulating door 22 were opened, and the object to be processed was transported to the second heating chamber 13. . At this time, a bypass valve between the first purge chamber 12 and the second heating chamber 13 may be opened as necessary to balance the pressures in both chambers. After transportation, the airtight door and the heat-insulated door were closed. After the first heating chamber 11 and the first purge chamber 12 are evacuated, the object to be processed may be transferred to the first purge chamber 12.
  • the object to be treated was heated under reduced pressure to selectively evaporate some oxides and other substances of the constituent metal (s).
  • the solder joint could be released by evaporating the lead.
  • the temperature and pressure in the second heating chamber may be adjusted to be higher than the boiling point of the metal to be evaporated.
  • the heating temperature is 1 0 0 0 ° C ⁇ 1 2 0 0 ° C
  • pressure was controlled at about 1 0 one 1 to about 1 0- 4 T 0 rr range of about.
  • the evaporated metal was condensed in a condenser 45. In the present invention, the evaporated metal does not enter the first heating 11 chamber and does not adhere to the airtight door 31.
  • the airtight door 33 and the heat insulating door 23 were opened, and the object to be processed was transported to the second purge chamber 14.
  • the pressure on both sides of the hermetic door was balanced so as to be almost equal as described above.
  • the second purge chamber 14 is evacuated by an exhaust system.
  • the object to be treated was introduced into the second purge chamber 14, the object to be treated was cooled by a non-oxidizing gas such as nitrogen. Due to the heat treatment under reduced pressure in the second heating chamber, the object to be treated is in an unstable state with excessive surface free energy, so it is exposed to outside air as it is. It ’s not good to eat.
  • the heating residue of the object to be treated such as the treated soil may be heated and oxidized in an oxidizing atmosphere.
  • metals and the like in the residue of the object to be processed change to a stable form as an oxide.
  • This oxidation treatment may be performed as needed, and is not an essential treatment item.
  • the object to be treated is cooled with an inert gas such as nitrogen gas in the second purge chamber 14 and then taken out.
  • an inert gas such as nitrogen gas in the second purge chamber 14
  • the carbon in the residue may be gasified as carbon monoxide and hydrogen by an aqueous reaction.
  • This gas can be used as a heating means of the processing apparatus of the present invention.
  • an example of processing using a circuit board as an object to be processed has been described.However, the present invention is not limited to this. it can.
  • the reducing action is strong at high temperatures, and it is also suitable for removal of objects to be treated containing organic halides such as dioxins.
  • the object to be treated is heated under reduced pressure, it is purged and cooled in a dioxin-free atmosphere. Residual concentrations of harmful organic halides such as coplanar PCBs can be suppressed to extremely low levels. The concentration of dioxins in the residue after this treatment was below the detection limit. In addition, since the oxygen gas concentration was extremely low (or negligible), the analysis results showed that the amount of pollutants such as NO x and SO x was very small.
  • FIG. 4 is a diagram schematically showing another example of the configuration of the processing apparatus of the present invention.
  • the illustration of the exhaust system and the like is omitted, but the configuration of the exhaust system and the non-oxidizing gas supply system is the same as in FIG.
  • This processing device is in addition to the configuration shown in Fig. 1.
  • a third heating chamber 15 is provided.
  • the third heating chamber 15 is connected to the second purge chamber 14 via an airtight door 36 and a heat insulating door 24. That is, the third heating chamber 15 is also connected to the second purge chamber 14 in parallel with the second heating chamber 13.
  • a steam introduction system 71 is connected to the third heating chamber, so that an aqueous reaction (a reaction of producing carbon monoxide and hydrogen by carbon and water) occurs in the third heating chamber.
  • the aqueous reaction is an endothermic reaction. Therefore, a heating means is provided in the room to supply the reaction energy and maintain the reaction temperature (about 500 ° C).
  • the generated hydrogen and carbon monoxide are used as fuel gas for heating and fuel gas for gas generators.
  • the third heating chamber 15 is an aqueous reaction chamber will be described.
  • other heating processing such as reduced pressure heating processing or changing the temperature to oxidize and remove fine heavy metals and the like by introducing an oxidizing agent is performed. You can also.
  • Shredder dust includes various resins, metals such as iron, copper, aluminum and lead, glass, earth and sand.
  • this shredder dust also takes place until the vacuum heating in the second heating chamber 13 Was performed in the same manner as the processing of the circuit board described in the second embodiment. That is, the organic matter contained in the shredder dust was thermally decomposed in the first heating chamber 11, and the heavy metals such as zinc and lead contained in the heating residue were evaporated in the second heating chamber 13. Note that the thermal decomposition of the organic substance in the first heating chamber may be performed under reduced pressure as necessary. In this case, the pressure in the first heating chamber 11 is not controlled to be higher than the atmospheric pressure. In addition, a vacuum pump will be provided in the exhaust system in place of the exhaust blower 43.
  • the object to be treated was transferred to the third heating chamber 15 via the second purge chamber 14 evacuated or purged to a non-oxidizing atmosphere.
  • the object to be treated was not actively cooled.
  • the object to be treated was reacted with water vapor while maintaining the heating residue at about 500 ° C.
  • the carbon contained in the heated residue of the shredder dust reacted with water to produce carbon monoxide and hydrogen.
  • This generated gas was taken out of the third heating chamber 15 through a pipe 72 and used as a fuel gas. After the treatment in the third heating chamber 15, it was returned to the second purge chamber 14, cooled in a non-oxidizing atmosphere, and taken out of the apparatus by the transfer mechanism 19.
  • oxidation and reduction can be freely performed, and safe and efficient processing can be performed on an object to be processed including organic matter and metal. It is possible to recycle shredder dust that had previously been landfilled at a managed landfill.
  • FIG. 5 is a diagram schematically showing another example of the configuration of the processing apparatus of the present invention.
  • a configuration in which the present invention can perform heat treatment of various metals will be described.
  • a plurality of heat treatments such as quenching, tempering, annealing, and normalizing a metal can be performed simultaneously. Further, in the processing apparatus of the present invention, these different processings are performed in parallel or continuously. Can be.
  • an object to be treated is introduced into the second heating chamber 13 via the first purge chamber 11, and the inside of the chamber is evacuated to perform vacuum heating at about 150 ° C.
  • the object to be treated is transferred to the second purge chamber 14 and quenched by rapid cooling with an inert gas.
  • An oil tank for cooling may be provided in the second purge chamber 14 for cooling the object to be treated.
  • the quenched material is introduced into the second heating chamber 13 through the first purge chamber 11. After cooling, remove the object to be treated.
  • the object to be processed is once again transported to the first heating chamber 11 via the first purge chamber 11.
  • the object to be treated is tempered at about 180 ° C. to about 550 ° C.
  • the object to be processed is transported to the first purge chamber 11 again, where the slow cooling process is performed. Note that it is preferable that the temperature is lowered stepwise, such as returning twice or returning three times, such as three times.
  • the processing apparatus of the present invention can perform not only thermal decomposition of the object to be processed and evaporation processing by heating under reduced pressure but also various heat treatments.
  • quenching can be performed in the second heating chamber during tempering in the first heating chamber, and the first purge chamber and the second purge chamber are tempered and used for cooling the quenching. Therefore, as compared with the case where the quenching device and the tempering device are separately provided, there is an advantage that both the manufacturing cost and the installation space can be reduced.
  • the treatment apparatus of the present invention is used exclusively as a heat treatment furnace, the reformer, condenser, various filters, and exhaust gas treatment system are not essential elements, and may be provided as necessary.
  • Such a heat treatment can also be performed by the processing apparatus illustrated in FIG.
  • the resin is thermally decomposed in the first heating chamber 11 and the second heating chamber 13
  • Individual or multiple treatments such as vacuum quenching of metals in the first heating chamber, non-metal annealing and cleaning of the workpiece in the first heating chamber 11, and vacuum evaporation of the metals in the second heating chamber 12.
  • Such a multipurpose and highly productive processing apparatus is realized by adopting a configuration in which a plurality of heating chambers are connected in parallel to a purge chamber capable of accessing the outside. can do.
  • a processing apparatus with a simple configuration and high productivity is provided. be able to.
  • the reliability of the seal of the hermetic door can be improved, and long-term continuous operation can be performed.
  • a plurality of heat treatments can be performed in parallel or continuously.
  • the residue can be subjected to decomposition and detoxification of organic halides such as dioxins, coplanar PCB, and PCB, and other pollutant gases. Also, various elements including heavy metals can be separated by evaporation.

Abstract

A treating device, wherein a first heating chamber (11) having an exhaust system and a second heating chamber (13) are connected in parallel with a first purge chamber (12) capable of gaining access to the outside, whereby the number of air-tight doors and insulated doors can be reduced to below those of a conventional treating device, and the reliability of sealing of the air-tight doors can be increased and, in addition, general-purpose treatings such as a vacuum evaporation collecting and metal heat treatment can be performed simultaneously in parallel with each other.

Description

明 細  Detail
処理装置および処理方法 Processing device and processing method
技術分野 Technical field
本発明は、 処理装置および処理方法に関する。 特に土壌、 焼却灰、 汚 泥などの処理対象物体を処理する処理装置および処理方法に関する。 ま た本発明は有機物と金属とを含む処理対象物体を処理する処理装置およ び処理方法に関する。 さらに本発明は金属の熱処理を行う処理装置およ び処理方法に関する。 背景技術  The present invention relates to a processing device and a processing method. In particular, the present invention relates to a processing apparatus and a processing method for processing objects to be processed such as soil, incinerated ash, and sludge. Further, the present invention relates to a processing apparatus and a processing method for processing a processing target object containing an organic substance and a metal. Further, the present invention relates to a processing apparatus and a processing method for performing a heat treatment on a metal. Background art
産業の振興と、 公共の福祉とを両立させるためには、 産業活動に起因 する公共的社会資本への悪影響を最小限度に抑制する必要がある。 公共 的社会資本のもつとも重要なものの一つに環境がある。 このような観点 から、 近時、 リサイクル技術などの処理技術に関する関心が高まってい る。  In order to achieve both industrial promotion and public welfare, it is necessary to minimize the adverse effects on public social capital caused by industrial activities. One of the most important things of public social capital is the environment. From such a viewpoint, interest in processing technology such as recycling technology has recently been increasing.
このような処理技術の一つに減圧加熱がある。 この技術は処理対象物 体を排気系を備えた加熱炉内で、 減圧下で加熱するものである。 これに より、 処理対象物体の構成成分を熱分解したり、 処理対象物体の構成成 分を蒸発させたりする。  One such processing technique is heating under reduced pressure. In this technology, the object to be treated is heated under reduced pressure in a heating furnace equipped with an exhaust system. Thereby, the components of the object to be processed are thermally decomposed, and the components of the object to be processed are evaporated.
例えば有機物と金属とを含む処理対象物体を処理する場合には、 まず 有機物を熱分解し、 その後金属を蒸発させる場合がある。 このとき有機 物の熱分解を行う気密室と、 金属の蒸発を行う気密室とが直接接続して いると、 いくつかの不都合な問題が生じる。 このような減圧加熱の技術 では、 気密性の確保が重要な課題である。 しかしながら例えば蒸発した 金属が気密扉に付着して、 気密扉のシール性が低下する。 気密扉のシー ル性能が低下すると系内の圧力が高くなり、蒸発金属の沸点も高くなる。 このため処理対象物体をより高温に加熱しなければならず、 処理の生産 性が低下する。 また気密扉のシール部を交換するためには装置の運転を 停止する必要がある。 装置の運転を一度停止するためには、 一般的に数 曰の放冷が必要であり、 また再加熱にも時間を要する。 また気密扉、 断 熱扉等の隔壁の数が多くなるとそれだけ維持管理も大変になり、 装置の コス トも高くなる。 For example, when processing an object to be processed containing an organic substance and a metal, the organic substance may first be thermally decomposed and then the metal may be evaporated. At this time, if the hermetic chamber that thermally decomposes organic matter and the hermetic chamber that evaporates metal are directly connected, some inconveniences arise. Such reduced pressure heating technology Then, ensuring airtightness is an important issue. However, for example, the evaporated metal adheres to the hermetic door, and the sealing performance of the hermetic door decreases. When the sealing performance of the hermetic door decreases, the pressure inside the system increases, and the boiling point of the evaporated metal also increases. For this reason, the object to be treated must be heated to a higher temperature, and the productivity of the treatment decreases. In addition, it is necessary to stop the operation of the device to replace the seal part of the airtight door. In order to stop the operation of the equipment once, it is generally necessary to let it cool down, and it takes time to reheat. Also, as the number of bulkheads such as airtight doors and thermal insulation doors increases, maintenance becomes more difficult and the cost of equipment increases.
リサイクルに関連した技術においては、 生産性は重要な課題である。 このため生産性が高い処理技術を確立することが求められている。  Productivity is an important issue in technologies related to recycling. Therefore, it is required to establish a processing technology with high productivity.
一方、 金属の熱処理には、 焼き入れ、 焼き戻し、 焼鈍、 焼準などがあ る。 これらの熱処理に用いられる熱処理装置は従来から焼き入れ、 焼鈍 など個別の装置が用いられていた。 発明の開示  On the other hand, metal heat treatment includes quenching, tempering, annealing, and normalizing. Conventionally, individual devices such as quenching and annealing have been used as heat treatment devices used for these heat treatments. Disclosure of the invention
本発明はこのような課題を解決するためになされたものである。 すな わち本発明は構成が簡単で、 生産性の高い処理装置を提供することを目 的とする。 また本発明はまた本発明は気密扉のシール性を確保し、 長期 の連続運転を行うことができる処理装置を提供することを目的とする。 また本発明は例えばシュレッダーダス ト、 汚泥、 土壌、 焼却灰、 焼却 飛灰、 回路基板のように有機物と金属とからなる処理対象物体を効率的 に処理することができる処理装置を提供することを目的とする。  The present invention has been made to solve such a problem. That is, an object of the present invention is to provide a processing apparatus having a simple configuration and high productivity. Another object of the present invention is to provide a processing apparatus capable of ensuring a sealing property of an airtight door and performing a long-term continuous operation. The present invention also provides a processing apparatus capable of efficiently processing an object to be processed including organic matter and metal, such as shredder dust, sludge, soil, incinerated ash, incinerated fly ash, and a circuit board. Aim.
さらに本発明は、 自由に冷却速度を変えることができる冷却手段を備 えることで、 焼き入れ、 焼鈍、 焼準等の熱処理を同時に並行して、 また は連続して行うことができる処理装置を提供することを目的とする。 ま た本発明は、 シュレッダーダス ト、 汚泥、 土壌、 焼却灰、 焼却飛灰、 回 路基板のように有機物と金属とからなる処理対象物体を効率的に処理す るとともに、 焼き入れ、 焼鈍、 焼準等の熱処理を複数同時に並行して、 または連続して行うことができる処理装置を提供することを目的とする。 このような課題を解決するために、 本発明は以下のような構成を採用 している。 Furthermore, the present invention provides a processing apparatus that can perform heat treatment such as quenching, annealing, and normalizing simultaneously or continuously by providing a cooling means capable of freely changing a cooling rate. The purpose is to provide. Ma The present invention efficiently treats objects to be treated, such as shredder dust, sludge, soil, incinerated ash, incinerated fly ash, and circuit boards, which are composed of organic matter and metal, and also includes quenching, annealing, and annealing. It is an object of the present invention to provide a processing apparatus capable of performing a plurality of quasi heat treatments simultaneously or concurrently. In order to solve such a problem, the present invention employs the following configuration.
本発明の処理装置は、 処理対象物体を処理する処理装置において、 第 1の排気手段と接続され、外部からのアクセスが可能な第 1の気密室と、 前記第 1の気密室と接続され、 第 1の加熱手段および第 2の排気手段を 有する第 2の気密室と、 前記第 1の気密室に対し前記第 2の気密室と並 列に接続され、 第 2の加熱手段及び第 3の排気手段を有する第 3の気密 室と、 を具備したことを特徴とする。 このような構成を採用することに より本発明の処理装置では、 常圧加熱処理、 パージ加熱処理、 減圧加熱 処理などの異なった加熱処理を、 同時並行で、 あるいは個別に行うこと ができる。 また、第 1の気密室(パージ室)に冷却手段を設けることで、 上記の加熱処理に加えて冷却処理も同時並行で、 あるいは個別に行うこ とができる。  The processing apparatus of the present invention is a processing apparatus for processing an object to be processed, wherein the first airtight chamber is connected to a first exhaust unit and is accessible from outside, and is connected to the first airtight chamber; A second airtight chamber having a first heating means and a second exhaust means, and a second heating means and a third airtight chamber which are connected to the first airtight chamber in parallel with the second airtight chamber; And a third hermetic chamber having an exhaust means. By employing such a configuration, in the processing apparatus of the present invention, different heating processes such as a normal-pressure heating process, a purge heating process, and a reduced-pressure heating process can be performed concurrently or individually. In addition, by providing a cooling means in the first hermetic chamber (purge chamber), cooling processing in addition to the above-described heating processing can be performed simultaneously in parallel or individually.
また本発明の処理装置は、処理対象物体を処理する処理装置において、 第 1の加熱手段と第 1の排気手段とを備えた第 1の加熱室と、 第 2の加 熱手段と第 2の排気手段とを備えた第 2の加熱室と、 前記第 1の加熱室 と前記第 2の加熱室との間に介挿され、 第 3の排気手段を備えた第 1の パージ室と、 を具備したことを特徴とする。 第 1のパージ室は第 1の気 密室に、 第 1の加熱室は第 2の気密室に、 第 2の加熱室は第 3の気密室 に対応する。 すなわち第 1のパージ室は、 第 1の加熱室及び第 2の加熱 室と接続して配設されている。 これらの各室は直線上に配される必要は なく、 L字型に配置するようにしてもよい。 また第 1の排気手段、 第 2 の排気手段、 第 3の排気手段は個別に備えるようにしてもよいし、 少な くとも一部を共通に備えるようにしてもよい。 The processing apparatus of the present invention is a processing apparatus for processing an object to be processed, wherein a first heating chamber including a first heating unit and a first exhaust unit, a second heating unit, and a second heating unit. A second heating chamber provided with an exhaust means, and a first purge chamber interposed between the first heating chamber and the second heating chamber and provided with a third exhaust means. It is characterized by having. The first purge chamber corresponds to the first hermetic chamber, the first heating chamber corresponds to the second hermetic chamber, and the second heating chamber corresponds to the third hermetic chamber. That is, the first purge chamber is provided so as to be connected to the first heating chamber and the second heating chamber. These rooms do not need to be arranged in a straight line, but may be arranged in an L-shape. The first exhaust means, the second The exhaust means and the third exhaust means may be provided individually, or at least a part thereof may be provided in common.
第 1の加熱室と第 1のパージ室との間、 また第 2の加熱室と第 1のパ ージ室との間には、 各室を気密に保持することができる開閉可能な隔壁 が配設されている。 これら隔壁としては例えば気密扉と断熱扉とを組み 合わせたものを挙げることができる。  Between the first heating chamber and the first purge chamber, and between the second heating chamber and the first purge chamber, openable and closable partitions that can keep each chamber airtight are provided. It is arranged. Examples of these partitions include a combination of an airtight door and an insulated door.
第 1の加熱室と第 2の加熱室とには、 室内を加熱するための第 1の加 熱手段、 第 2の加熱手段がそれそれ配設されている。 これら加熱手段と しては例えば、 各種ヒ一夕類、 誘導加熱、 誘電加熱、 マイクロ波加熱、 ガス、 油などを用いた間接加熱などを挙げることができる。 なお第 1の 加熱手段と第 2の加熱手段とは同じでなく ともよい。  The first heating chamber and the second heating chamber are respectively provided with a first heating means and a second heating means for heating the room. Examples of these heating means include various types of moss, induction heating, dielectric heating, microwave heating, indirect heating using gas, oil, and the like. Note that the first heating means and the second heating means need not be the same.
第 1の加熱室と第 2の加熱室とには、 室内を排気するための第 1の排 気系、 第 2の排気系が接続されている。 これら排気系としては、 例えば 排気ブロワや各種真空ポンプを用いることができる。 真空ポンプとして は例えば口一夕リーポンプ、 油拡散ポンプ、 ブース夕一ポンプ (ルーツ ポンプ)、 夕一ボ分子ポンプ、 イオンゲッ夕一ポンプ、 水封ポンプなどの 液封ポンプ (水封ポンプ) などを挙げることができる。 これら真空ボン プは複数組み合わせて用いるようにしてもよい。 なお、 第 1の加熱室で は、 処理対象物体を常圧 (排気ブロワによる負圧も含む) で処理しても よいし、 真空ポンプを用いて減圧で処理するようにしてもよい。 例えば 第 1の加熱室に真空ポンプを有する排気系を接続すれば、 処理対象物体 の減圧加熱処理を行うことができるだけでなく、 真空パージを行うこと ができ、 非酸化性ガスを節約することができる。 また乾留や熱分解など 有機物の加熱処理 (常圧) を行う場合には処理対象物体が発火すること がある。 このような場合、 真空ポンプで室内を減圧することにより消火 することができ、 安全である。 また前記第 1の加熱室、 前記第 2の加熱室、 または前記第 1のパージ 室は、 非酸化性ガスを導入する手段を備えるようにしてもよい。 非酸化 性ガスとしては例えば窒素、 希ガスなどを挙げることができる。 非酸化 性ガスの導入系としては例えば各室と非酸化性ガスのリザーブタンクと をバルブを介して接続した構成を挙げることができる A first exhaust system and a second exhaust system for exhausting the interior of the room are connected to the first heating chamber and the second heating chamber. As these exhaust systems, for example, exhaust blowers and various vacuum pumps can be used. Examples of vacuum pumps include liquid-sealed pumps (water-sealed pumps), such as mouth-to-mouth pumps, oil diffusion pumps, booths, evening pumps (roots pumps), evening-bottle molecular pumps, ion-jet pumps, and water-sealed pumps be able to. These vacuum pumps may be used in combination. In the first heating chamber, the object to be processed may be processed at normal pressure (including negative pressure by an exhaust blower) or may be processed at reduced pressure using a vacuum pump. For example, if an exhaust system having a vacuum pump is connected to the first heating chamber, not only can the object to be treated be heated under reduced pressure, but also vacuum purging can be performed, saving non-oxidizing gas. it can. Also, when heat treatment (normal pressure) of organic substances such as carbonization or thermal decomposition, the object to be treated may ignite. In such a case, the fire can be extinguished by reducing the pressure in the room with a vacuum pump, which is safe. Further, the first heating chamber, the second heating chamber, or the first purge chamber may include means for introducing a non-oxidizing gas. Examples of the non-oxidizing gas include nitrogen and a rare gas. Examples of the non-oxidizing gas introduction system include a configuration in which each chamber and a non-oxidizing gas reserve tank are connected via a valve.
前記第 1の加熱室と前記第 1の排気手段との間、 または前記第 2の加 熱室と前記第 2の排気系との間に配設され、 前記処理対象物体から排出 されたガス状排出物を凝縮する手段ゃ改質する手段 (例えばガスクラッ キング装置) をさらに具備するようにしてもよい。 例えば有機物と金属 とを含む処理対象物体を処理する場合、 第 1の加熱室で有機物を熱分解 し、 熱分解により生じるガス (ミス トや微粒子を含む) を油化装置など で凝縮させて回収するようにしてもよい。 また第 2の加熱室では所定の 金属を減圧下で加熱して気化させ、 この蒸発金属を凝縮させて回収する ようにしてもよい。  A gaseous state disposed between the first heating chamber and the first exhaust means or between the second heating chamber and the second exhaust system, and discharged from the object to be treated; A means for condensing the effluent and a means for reforming (for example, a gas cracking device) may be further provided. For example, when treating an object to be treated containing organic matter and metal, the organic matter is thermally decomposed in the first heating chamber, and the gas (including mist and fine particles) generated by the thermal decomposition is condensed by an oiling device and collected. You may make it. In the second heating chamber, a predetermined metal may be heated under reduced pressure to be vaporized, and the evaporated metal may be condensed and recovered.
そして本発明の処理装置では、 第 1のパージ室は、 前記第 1の加熱室 および第 2の加熱室を経由することなく外部とアクセスするための気密 扉を備えている。 この気密扉により、 処理対象物体を装置外部から直接 第 1のパージ室に導入することができ、 また第 1のパージ室から外部へ 取り出すことができる。  Further, in the processing apparatus of the present invention, the first purge chamber includes an airtight door for accessing the outside without passing through the first heating chamber and the second heating chamber. With this airtight door, the object to be treated can be directly introduced into the first purge chamber from the outside of the apparatus, and can be taken out of the first purge chamber.
また第 1のパージ室は、 第 1の加熱室と第 2の加熱室を分離するため の機能も担っている。 例えば処理対象物体をパージ室に導入し、 第 1の 加熱室で加熱処理される。 その後、 処理対象物体は第 1のパージ室を経 由して第 2の加熱室へと送られる。 このとき前記第 1の加熱室と前記第 1のパージ室との間に配設された第 1の隔壁と、 前記第 2の加熱室と前 記第 2のパージ室との間に配設された第 2の隔壁とは、 少なく とも一方 が常に閉じているように開閉すれば、 第 1の加熱室の雰囲気と第 2の加 熱室の雰囲気とを分離することができる。 このため例えば第 2の加熱室 で処理対象物体から蒸発した物質が、 第 1の加熱室と第 1のパージ室と を隔てる気密扉に付着するのを防止することができる。 Further, the first purge chamber also has a function of separating the first heating chamber and the second heating chamber. For example, an object to be treated is introduced into a purge chamber, and is heated in a first heating chamber. Thereafter, the object to be processed is sent to the second heating chamber via the first purge chamber. At this time, a first partition provided between the first heating chamber and the first purge chamber, and a first partition provided between the second heating chamber and the second purge chamber. The second partition is opened and closed so that at least one of the partitions is always closed. The atmosphere of the heat chamber can be separated. Therefore, for example, a substance evaporated from the object to be treated in the second heating chamber can be prevented from adhering to the hermetic door separating the first heating chamber and the first purge chamber.
さらにこのような構成によれば、 気密扉や断熱扉を従来よりも少なく することができる。 例えば、 従来の処理装置のように第 1のパージ室、 第 1の加熱室、 第 2の加熱室、 第 2のパージ室の順で各室が配設された 場合と比較すると、 本発明では断熱扉、 気密扉ともに 1枚づっ少なくす ることができる。 したがって装置の構成がより簡単になり、 コス トも低 減し、 メ ンテナンス性も向上する。 また複数の加熱処理室の連続構成で はなく、 パージ室に対して複数の処理室を並列に配置する不連続な構成 を採用することにより、 処理装置の用途が拡大し、 処理装置を多目的に 使うことができるようになる。  Further, according to such a configuration, the number of airtight doors and heat-insulated doors can be reduced as compared with the conventional case. For example, in comparison with a case where each chamber is arranged in the order of a first purge chamber, a first heating chamber, a second heating chamber, and a second purge chamber as in a conventional processing apparatus, Both insulated doors and airtight doors can be reduced by one. Therefore, the configuration of the device becomes simpler, the cost is reduced, and the maintainability is improved. In addition, by adopting a discontinuous configuration in which multiple processing chambers are arranged in parallel with the purge chamber instead of a continuous configuration of multiple heating processing chambers, the use of the processing equipment is expanded, and the processing equipment becomes versatile. You can use it.
第 1の気密室での処理を常圧で行う場合、 前記第 1の加熱室内が大気 圧以上になるように圧力を調節する手段をさらに具備するようにしても よい。 このような圧力調整手段としては例えば、 前記前記第 1の加熱室 内の圧力を検出する手段と、 前記第 1の加熱室に非酸化性ガスを導入す る手段と、 前記検出した圧力に応じて前記非酸化性ガスの導入量を調節 する手段とを備えるようにしてもよい。 このような構成を採用すること により、 第 1の気密室内の圧力を常に大気圧以上に保持することができ る  In the case where the processing in the first airtight chamber is performed at normal pressure, a means for adjusting the pressure so that the pressure in the first heating chamber is equal to or higher than the atmospheric pressure may be further provided. Examples of such pressure adjusting means include: means for detecting the pressure in the first heating chamber; means for introducing a non-oxidizing gas into the first heating chamber; and means for responding to the detected pressure. Means for adjusting the introduction amount of the non-oxidizing gas. By employing such a configuration, the pressure in the first hermetic chamber can always be maintained at or above the atmospheric pressure.
例えば第 1の気密室内で有機物の熱分解を行う場合、 空気等が内部に 進入すると危険な場合がある。 本発明では第 1の気密室内を常に大気圧 以上に保持することができるので、 装置の安全性を向上することができ る。 また非酸化性ガスの導入により、 圧力の調節だけでなく系内の酸素 濃度の調整も行うようにしてもよい。 これにより熱分解生成ガスの発生 量を安定化したり、 平均分子量などを制御することができる。 前記第 2の加熱室と接続して配設された第 2のパージ室をさらに備え るようにしてもよい。 この第 2のパージ室も前述した第 1のパージ室と 同様に、 排気系、 外部とアクセスするための気密扉を備えるようにすれ ばよい。 また第 1のパージ室、 第 2パージ室は室内を冷却するための冷 却手段を備えるようにしてもよい。冷却手段としては例えば冷却ファン、 水冷ジャケッ ト構造などを挙げることができる。 また室内に非酸化性ガ スを循環させ、 この非酸化性ガスを室外で熱交換器等により冷却するよ うにしてもよい。第 2の加熱室で所定の処理を施された処理対象物体は、 第 2のパージ室へ搬送し、 この第 2のパージ室で冷却してから外部へ取 り出すことが好ましい。 これは第 2の加熱室において、 処理対象物体を 減圧下で加熱すると、 処理対象物体の表面自由エネルギーが過剰な状態 になりやすく、 そのまま外部に取り出すと激しく燃焼するなどして危険 なためである。 また処理対象物体が酸化するとその価値が減ずる場合も ある。 したがって、 処理対象物体は第 2のパージ室内で非酸化雰囲気で 冷却してから外部へ取り出すようにすればよい。 さらに冷却は有機ハロ ゲン化物フリ一 (有機ハロゲン化物が欠乏していること) な雰囲気で行 うことが好ましい。 これにより処理の残さにダイォキシン類などの有機 ハロゲン化物及びその他の公害物資が残留するのを防止することができ る。 For example, when thermal decomposition of organic matter is performed in the first hermetic chamber, it may be dangerous if air or the like enters inside. According to the present invention, the first hermetic chamber can always be maintained at or above the atmospheric pressure, so that the safety of the device can be improved. In addition, by introducing a non-oxidizing gas, not only the pressure but also the oxygen concentration in the system may be adjusted. This makes it possible to stabilize the amount of pyrolysis gas generated and control the average molecular weight. A second purge chamber connected to the second heating chamber may be further provided. The second purge chamber may be provided with an exhaust system and an airtight door for accessing the outside similarly to the first purge chamber described above. Further, the first purge chamber and the second purge chamber may be provided with cooling means for cooling the chamber. Examples of the cooling means include a cooling fan and a water-cooled jacket structure. Alternatively, a non-oxidizing gas may be circulated in the room, and the non-oxidizing gas may be cooled outside by a heat exchanger or the like. It is preferable that the object to be processed subjected to the predetermined processing in the second heating chamber is transported to the second purge chamber, cooled in the second purge chamber, and then taken out. This is because if the object to be treated is heated under reduced pressure in the second heating chamber, the surface free energy of the object to be treated is likely to be excessive, and if it is taken out as it is, it will be dangerous because it will burn violently. . Also, if the object to be treated is oxidized, its value may decrease. Therefore, the object to be treated may be cooled in a non-oxidizing atmosphere in the second purge chamber and then taken out. Further, it is preferable that the cooling is performed in an atmosphere free from organic halides (a lack of organic halides). As a result, it is possible to prevent organic halides such as dioxins and other pollutants from remaining in the residue of the treatment.
また本発明の処理装置は金属の熱処理も行うことができる。 例えば第 1の加熱室を焼鈍加熱室として、 第 2の加熱室を焼き入れ加熱室として 用いることができる。 また例えば第 1の加熱室を焼戻しのための加熱室 に、 第 2の加熱室を真空焼入れのための加熱室として用いることができ る。 第 1パージ室、 第 2パージ室は冷却室として用いられる。 このよう な構成により、 異なる熱処理を並行してまたは連続して行うことができ る。 2つの加熱室の間に、 外部とのアクセスが可能な第 1のパージ室を 介挿した構成を採用することにより、 このような利点を得ることができ る。 The processing apparatus of the present invention can also perform a heat treatment of a metal. For example, the first heating chamber can be used as an annealing heating chamber, and the second heating chamber can be used as a quenching heating chamber. Further, for example, the first heating chamber can be used as a heating chamber for tempering, and the second heating chamber can be used as a heating chamber for vacuum quenching. The first purge chamber and the second purge chamber are used as cooling chambers. With such a configuration, different heat treatments can be performed in parallel or continuously. Between the two heating chambers, a first purge chamber with external access Such an advantage can be obtained by employing an interposed structure.
さらに本発明の処理装置は、 自由に冷却速度を変えることができる冷 却手段を備えている。 このような構成を採用することで、 焼き入れ、 焼 鈍、 焼準等の熱処理を同時に並行して、 または連続して行うことができ る。  Further, the processing apparatus of the present invention is provided with cooling means capable of freely changing the cooling rate. By employing such a configuration, heat treatments such as quenching, annealing, and normalizing can be performed simultaneously or continuously.
本発明の別の観点の処理装置は、 処理対象物体を保持する第 1の密閉 空間を形成可能な第 1室と、 処理対象物体を保持する第 2の密閉空間を 形成可能な第 2室と、 前記第 1室及び第 2室との間で処理対象物体の受 け渡しが可能で、 かつ処理対象物体を保持する第 3の密閉空間を形成可 能な第 3室と、 前記第 1室及び第 2室内の処理対象物体を加熱するため の手段と、 前記第 1〜第 3の密閉空間の圧力を常圧よりも小さくするた めの手段とを具備することを特徴とする。  A processing apparatus according to another aspect of the present invention includes a first chamber capable of forming a first sealed space for holding a processing target object, and a second chamber capable of forming a second sealed space for holding a processing target object. A third chamber capable of delivering the object to be processed between the first chamber and the second chamber and forming a third closed space for holding the object to be processed; and the first chamber And means for heating the object to be treated in the second chamber, and means for reducing the pressure in the first to third enclosed spaces to below normal pressure.
このような構成によれば、 各密閉空間を形成し、 かつこれら密閉空間 の間で処理対象物体の受け渡しを行うための手段、例えば密閉扉の数を、 例えば第 1加熱室と第 2加熱室とを連続的に繋げた場合と比し、 より少 なくすることができる。 また第 1加熱室と第 2加熱室において、 独立な 処理を同時並行して、 または連続して処理することができる。 もちろん 第 1加熱室と第 2加熱室とで個別の処理を行うこともできる。  According to such a configuration, means for forming each closed space and transferring the object to be treated between these closed spaces, for example, the number of closed doors, for example, the first heating chamber and the second heating chamber Can be reduced as compared with the case where the and are continuously connected. In the first heating chamber and the second heating chamber, independent processing can be performed simultaneously in parallel or continuously. Of course, individual processing can be performed in the first heating chamber and the second heating chamber.
また本発明の処理方法は、 有機物と無機物とを含む処理対象物体の処 理方法において、 前記有機物を熱分解する工程と、 前記熱分解残渣を減 圧下で加熱し前記無機物を蒸発回収させる工程と、 前記有機物の熱分解 残渣を酸化雰囲気内で加熱酸化反応させる工程とを有することを特徴と する。 これにより処理対象物体の熱分解残渣の少なく とも一部は酸化さ れる。 例えば金属は単体からより安定な酸化物へと存在形態を変える。 この処理は必要に応じて行うようにすればよく、 必ずしも必須の工程で はない。 図面の簡単な説明 Further, in the treatment method of the present invention, in the method for treating an object to be treated containing an organic substance and an inorganic substance, a step of thermally decomposing the organic substance, and a step of heating the pyrolysis residue under reduced pressure to evaporate and recover the inorganic substance. And a step of subjecting the thermal decomposition residue of the organic substance to a heating oxidation reaction in an oxidizing atmosphere. As a result, at least a part of the thermal decomposition residue of the object to be treated is oxidized. For example, metal changes its form from a simple substance to a more stable oxide. This process can be performed as needed, and is an indispensable step There is no. BRIEF DESCRIPTION OF THE FIGURES
図 1は本発明の処理装置の構成の例を概略的に示す図であり ; 図 2は本発明の処理装置が備える圧力制御系の構成例を模式的に示す図 であり ;  FIG. 1 is a diagram schematically illustrating an example of a configuration of a processing apparatus of the present invention; FIG. 2 is a diagram schematically illustrating an example of a configuration of a pressure control system provided in the processing apparatus of the present invention;
図 3は本発明の処理装置の変形例を比較のために示す図であり ; 図 4は本発明の処理装置の構成の例を概略的に示す図であり ; そして、 図 5は本発明の処理装置の構成の例を概略的に示す図である。 発明を実施するための最良の形態 FIG. 3 is a view showing a modification of the processing apparatus of the present invention for comparison; FIG. 4 is a view schematically showing an example of the configuration of the processing apparatus of the present invention; and FIG. It is a figure which shows the example of a structure of a processing apparatus roughly. BEST MODE FOR CARRYING OUT THE INVENTION
(実施形態 1 )  (Embodiment 1)
図 1は本発明の処理装置の構成の別の例を概略的に示す図である。 こ の処理装置は第 1加熱室 1 1、 第 1パージ室 1 2、 第 2加熱室 1 3、 第 2パージ室 1 4の 4室を備えている。  FIG. 1 is a diagram schematically showing another example of the configuration of the processing apparatus of the present invention. This processing apparatus includes four chambers: a first heating chamber 11, a first purge chamber 12, a second heating chamber 13, and a second purge chamber 14.
第 1加熱室 1 1 と第 1パージ室 1 2との間は断熱扉 2 1 と気密扉 3 1 とにより隔てられている。 同様に第 1パージ室 1 2と第 2加熱室との間 は気密扉 3 2 と断熱扉 2 2とにより隔てられている。 また第 2加熱室 1 3と第 2パージ室 1 4との間は断熱扉 2 3 と気密扉 3 3とにより隔てら れているこれら気密扉と断熱扉とは別体にしてもよいし、 一体に形成し てもよい。 いずれにしても気密扉の加熱室側には断熱扉を配設し、 気密 扉のシール部を加熱室の熱から保護することが好ましい。 第 1パージ室 1 2、 第 2パージ室 1 4には、 外部との間で処理対象物体を出し入れす ることができる気密扉 3 4、 3 5がそれぞれ設けられている。 これら気 密扉、 断熱扉は例えばシリンダーやワイヤなどにより開閉可能に構成さ れている。 なお、 これら気密扉は一般に一方の側だけを気密にシールす ることができる。 また各室には、 処理対象物体を搬送するための搬送機 構が配設されている。 符号 1 8、 1 9は第 1パージ室 1 2、 第 2パージ 室へ処理対象物体を出し入れするための搬送機構である。 The first heating chamber 11 and the first purge chamber 12 are separated by a heat insulating door 21 and an airtight door 31. Similarly, the first purge chamber 12 and the second heating chamber are separated by an airtight door 32 and an insulating door 22. Further, between the second heating chamber 13 and the second purge chamber 14, the airtight door and the airtight door which are separated by the heat insulating door 23 and the airtight door 33 may be separated from each other, They may be formed integrally. In any case, it is preferable to provide a heat-insulating door on the heating chamber side of the airtight door to protect the seal of the airtight door from the heat of the heating chamber. The first purge chamber 12 and the second purge chamber 14 are provided with airtight doors 34 and 35, respectively, through which the object to be treated can be taken in and out with the outside. These hermetic doors and heat insulating doors are configured to be openable and closable, for example, with cylinders and wires. Note that these hermetic doors generally have only one side airtightly sealed. Can be Each room is provided with a transport mechanism for transporting the object to be processed. Reference numerals 18 and 19 denote transfer mechanisms for moving an object to be processed into and out of the first purge chamber 12 and the second purge chamber.
第 1加熱室 1 1は、 室内を加熱するためのヒー夕を備えている。 また 第 1加熱室 1 1は、 改質器 4 1及び凝縮器 4 2を介して排気系と接続さ れている。 ここでは排気系は排気プロヮ 4 3を備えている。 改質器 4 1 は、 処理対象物体の加熱により排出されるガス状排出物を例えば 7 0 0 °C〜 1 2 0 0 °C程度の高温で改質するためのものである。これにより、 例えばダイォキシンは塩素と炭素に分解される。 その他、 P C B等につ いても同様に分解され、 これらの公害物質が無害化される。 凝縮器 4 2 はガス状排出物中の凝縮可能成分を液体成分、 固体成分として凝縮させ るためのものである。 これにより、 無害化された物質を無害化された状 態で回収することができる。  The first heating room 11 has a heater for heating the room. The first heating chamber 11 is connected to an exhaust system via a reformer 41 and a condenser 42. Here, the exhaust system is provided with an exhaust pump 43. The reformer 41 reforms a gaseous emission discharged by heating the object to be treated at a high temperature of, for example, about 700 ° C. to 1200 ° C. This breaks down dioxin into chlorine and carbon, for example. In addition, PCBs and the like are similarly decomposed and these pollutants are rendered harmless. The condenser 42 is for condensing the condensable components in the gaseous effluent as a liquid component and a solid component. Thereby, the harmless substance can be recovered in a harmless state.
第 1加熱室 1 1、 第 1パージ室 1 2、 第 2加熱室 1 3、 第 2パージ室 1 4には、 室内に窒素などの非酸化性ガスを導入するためのガス導入系 4 4が接続されている。 この例では、 第 1加熱室 1 1内に導入される非 酸化性ガスの量は、室内が常に大気圧以上になるように制御されている。 図 2は圧力制御系の構成の例を示す図である。 この制御は、 例えば、 第 1加熱室内の圧力を測定する圧力センサ 5 4と、 測定した圧力に応じて 非酸化性ガスを導入するバルブの開閉状態を制御するコン トローラ 5 5 とにより行うことができる。 第 1加熱室 1 1に酸素濃度センサを配設す れば、 圧力だけでなく室内の酸素濃度も制御することができる。  The first heating chamber 11, the first purge chamber 12, the second heating chamber 13, and the second purge chamber 14 have a gas introduction system 44 for introducing a non-oxidizing gas such as nitrogen into the chamber. It is connected. In this example, the amount of the non-oxidizing gas introduced into the first heating chamber 11 is controlled so that the inside of the chamber is always at or above the atmospheric pressure. FIG. 2 is a diagram illustrating an example of a configuration of a pressure control system. This control can be performed by, for example, a pressure sensor 54 that measures the pressure in the first heating chamber and a controller 55 that controls the open / close state of a valve that introduces a non-oxidizing gas according to the measured pressure. it can. If an oxygen concentration sensor is provided in the first heating chamber 11, not only the pressure but also the oxygen concentration in the room can be controlled.
第 1パージ室 1 2は、第 1加熱室 1 1および第 2加熱室 1 3と気密扉、 断熱扉を介して接続されている。 第 1パージ室 1 2は気密扉 3 4を介し 外部から直接アクセスできるようになつている。 処理対象物体は、 気密 扉 3 4を介して第 1パージ室 1 2へ導入することができる。 また処理対 象物体は第 1パージ室と、 第 1加熱室 1 1、 第 2加熱室 1 3との間を移 動することができる。 The first purge chamber 12 is connected to the first heating chamber 11 and the second heating chamber 13 via an airtight door and a heat insulating door. The first purge chamber 12 can be directly accessed from the outside via an airtight door 34. The object to be processed can be introduced into the first purge chamber 12 through the hermetic door 34. Again processing The object can move between the first purge chamber, the first heating chamber 11 and the second heating chamber 13.
この第 1パージ室 1 2は、 第 1加熱室 1 1 と第 2加熱室 1 3とを分離 している。 これにより、 第 1加熱室 1 1に第 2加熱室 1 3の雰囲気ガス が入るのを防止することができる。 また第 2加熱室 1 3に第 1加熱室 1 1の雰囲気ガスが入るのを防止することができる。  The first purge chamber 12 separates the first heating chamber 11 from the second heating chamber 13. This can prevent the atmospheric gas of the second heating chamber 13 from entering the first heating chamber 11. Further, it is possible to prevent the atmospheric gas of the first heating chamber 11 from entering the second heating chamber 13.
なお、 第 1パージ室 1 2は、 第 2パージ室 1 4と共通の排気系に接続 されている。 この排気系はブースタ一ポンプ 5 1、 口一タリ一ポンプ 5 2を備えており、 第 1パージ室 1 2および第 2パージ室を真空引きする ことができる。 またロータリ一ポンプ 5 2の後ろ側にはオイルミス ト ト ラップが設けられており、 排ガス中の油などを捕捉するようになってい る。  The first purge chamber 12 is connected to a common exhaust system with the second purge chamber 14. This exhaust system is provided with a booster pump 51 and a mouth pump 52, and can evacuate the first purge chamber 12 and the second purge chamber. An oil mist trap is provided behind the rotary pump 52 so as to catch oil and the like in exhaust gas.
また例えば第 1加熱室 1 1 と第 2加熱室 1 3とを接続すると、 これら 2室の間には気密扉と断熱扉がそれそれ 2枚ずつ必要になる。 図 3は、 図 1に例示した本発明の処理装置を、 2つの加熱処理室を接続して構成 した場合を比較のために示した図である。 この場合装置全体では気密扉 6枚、 断熱扉 4枚が必要となる。 図 3に例示したような複数の加熱処理 室を隣接配置する連続型の処理装置では、 隣接する加熱処理室を隔てる 気密扉の両側に断熱扉 2 2 a、 2 2 bを設ける必要がある。 また隣接配 置される複数の加熱処理室がどちらも真空排気系を備えている場合、 隣 接する加熱処理室の間には 2枚の気密扉 3 2 a、 3 2 bを設ける必要が ある。 これは気密扉が隔てる 2つの空間の一方の側しかシールできない からである。 本発明では、 第 1加熱室 1 1 と第 2加熱室 1 3との間に第 1パージ室を配設することにより、 気密扉 5枚、 断熱扉 3枚で装置を構 成することができる。 したがって装置の構成が簡単になり、 装置の価格 も低くすることができる。 また気密扉のシール性も向上し、 メンテナン ス性も高まる。 特に気密扉のシール能力は、 装置の連続稼働を実現する ための大きな要素である。 本発明によれば 2つの加熱処理室をパージ室 に対して並列に配設することによって、 装置の信頼性、 生産性をともに 向上することができる。 For example, when the first heating chamber 11 and the second heating chamber 13 are connected, two airtight doors and two heat insulating doors are required between these two chambers. FIG. 3 is a diagram showing, for comparison, a case where the processing apparatus of the present invention illustrated in FIG. 1 is configured by connecting two heat treatment chambers. In this case, the whole equipment requires 6 airtight doors and 4 insulated doors. In a continuous processing apparatus in which a plurality of heat treatment chambers are arranged adjacently as illustrated in FIG. 3, it is necessary to provide heat insulating doors 22a and 22b on both sides of an airtight door separating adjacent heat treatment chambers. In the case where each of the plurality of heat treatment chambers arranged adjacently has a vacuum exhaust system, it is necessary to provide two airtight doors 32a and 32b between adjacent heat treatment chambers. This is because only one side of the two spaces separating the airtight doors can be sealed. In the present invention, by arranging the first purge chamber between the first heating chamber 11 and the second heating chamber 13, the apparatus can be configured with five airtight doors and three heat insulating doors . Therefore, the configuration of the device is simplified, and the price of the device can be reduced. In addition, the sealing performance of the airtight door has been improved, Susceptibility also increases. In particular, the sealing ability of the hermetic door is a major factor in achieving continuous operation of the equipment. According to the present invention, by arranging two heat treatment chambers in parallel with the purge chamber, it is possible to improve both the reliability and the productivity of the apparatus.
第 2加熱室 1 3も、 第 1加熱室 1 1 と同様に、 室内を加熱するための ヒー夕を備えている。 また第 2加熱室 1 3は、 真空扉 1 3 a、 改質器 4 1 a、 凝縮器 4 5を介して排気系と接続されている。 排気系はブース夕 一ポンプ 4 8、 ロータリーポンプ 4 9を備えており、 第 2加熱室では処 理対象物体を減圧下で加熱することができる。 例えば処理対象物体の含 む金属を減圧下で蒸発させ凝縮器 4 5で凝縮させて回収することができ る。 この凝縮器 4 5では金属のような固体成分に限らず油なども凝縮さ せるようにしてもよい。 この装置では、 凝縮器 4 5 とプ一ス夕一ポンプ 4 8およびロータリーポンプ 4 9との間には、 乾式フィル夕 4 6および 湿式フィル夕 4 7が介挿されている。 乾式フィル夕 4 6は例えば金属ネ ッ トのようなフィル夕であり、凝縮器 4 5を通過した蒸発成分、微粒子、 粉麈などを捕捉するためのものである。 湿式フィル夕 4 7は例えば油膜 フィル夕のようなフィル夕であり、 凝縮器 4 5を通過した微粒子、 粉塵 などを捕捉するためのものである。 このようなフィル夕を真空ポンプの 前段に配置することにより、 個体微粒子や粉塵による真空ポンプへの悪 影響を防止することができる。  Similarly to the first heating chamber 11, the second heating chamber 13 includes a heater for heating the room. The second heating chamber 13 is connected to an exhaust system via a vacuum door 13a, a reformer 41a, and a condenser 45. The exhaust system is equipped with a booth pump 48 and a rotary pump 49, and the object to be treated can be heated under reduced pressure in the second heating chamber. For example, the metal contained in the object to be treated can be evaporated under reduced pressure, condensed in the condenser 45, and recovered. In the condenser 45, not only solid components such as metal but also oil may be condensed. In this device, a dry filter 46 and a wet filter 47 are interposed between the condenser 45 and the press pump 48 and the rotary pump 49. The dry filter 46 is, for example, a filter such as a metal net, and is for trapping evaporating components, fine particles, dust and the like that have passed through the condenser 45. The wet fill filter 47 is a fill filter such as an oil film fill filter, for capturing fine particles and dust that have passed through the condenser 45. By arranging such a filter in front of the vacuum pump, it is possible to prevent solid particles and dust from adversely affecting the vacuum pump.
第 2加熱室 1 3には、 第 2パージ室 1 4が接続されている。 この第 2 パージ室 1 4は気密扉 3 5を介して外部から直接アクセスできるように なっている。 処理対象物体は、 気密扉 3 5を介して第 2パージ室 1 2か ら取り出したり、 第 2パージ室へ導入することができる。 また第 2パー ジ室 1 4は処理対象物体を制御された雰囲気で冷却するための冷却室と しての機能も有している。 第 2パージ室には水冷ジャケッ ト構造を採用 したり、 供給する非酸化性ガスの温度を調節する機構を採用するように してもよい。 この例では第 1パージ室 1 2 と第 2パージ室 1 4との間を はじめ、 各室間にバイパスを設けている。 このバイパスは、 気密扉を開 閉する時に、 気密扉の両側の室の圧力のバランスをとるために用いられ る。 また各室内に導入された非酸化性ガスやその熱量を有効に利用する ためにも用いられる。 例えば第 1パージ室 1 2と第 2パージ室との間の バイパスには乾式フィル夕 5 4、 熱交換器 5 5、 ブロワ 5 6が介挿され ている。 これにより例えば第 2パージ室 1 4で処理対象物体の冷却に用 いた非酸化性ガスを、 第 1パージ室 1 2での処理対象物体の予熱、 徐冷 等に用いることができる。 また、 当然その逆の構成を採用すれば、 第 1 パージ室 1 2で処理対象物体の冷却に用いた非酸化性ガスを、 第 2パ一 ジ室 1 4での処理対象物体の予熱、徐冷等に用いることができる。更に、 これらの構成を両方用い、 状況に応じて選択的に使用するように構成し ても構わない。 A second purge chamber 14 is connected to the second heating chamber 13. The second purge chamber 14 can be directly accessed from outside via an airtight door 35. The object to be treated can be taken out of the second purge chamber 12 through the airtight door 35 or introduced into the second purge chamber. The second purge chamber 14 also has a function as a cooling chamber for cooling the object to be treated in a controlled atmosphere. Water-cooled jacket structure is adopted for the second purge chamber Alternatively, a mechanism for adjusting the temperature of the supplied non-oxidizing gas may be employed. In this example, a bypass is provided between each chamber including the first purge chamber 12 and the second purge chamber 14. This bypass is used to balance the pressure in the chambers on both sides of the door when opening and closing the door. It is also used to effectively utilize the non-oxidizing gas introduced into each room and its calorific value. For example, a dry filter 54, a heat exchanger 55, and a blower 56 are interposed in the bypass between the first purge chamber 12 and the second purge chamber. Thus, for example, the non-oxidizing gas used for cooling the object to be treated in the second purge chamber 14 can be used for preheating, slow cooling, etc. of the object to be treated in the first purge chamber 12. Naturally, if the reverse configuration is adopted, the non-oxidizing gas used for cooling the object to be treated in the first purge chamber 12 is preheated and gradually cooled in the second purge chamber 14. It can be used for cooling or the like. Further, both of these configurations may be used so as to be selectively used depending on the situation.
なお各排気系はその後段にバルブ 6 5を介して排ガス処理系 6 0を備 えている。 この例では排ガス処理系 6 0は、 排ガスを完全燃焼させるた めのガス燃焼装置 6 1、 ガス洗浄のためのスクラバー 6 2、 ガス中の有 害成分等を吸着除去するための活性炭フィル夕 6 3、 排気ブロワ 6 4を 有している。またバルブ 6 5は、逆火防止弁としての役割も有している。 排ガス処理系 6 0は、 排ガスの成分など、 必要に応じてその構成を定め るようにしてもよい。 排ガス中に、 例えばダイォキシン類や、 N〇x、 S O x等が含まれる場合には、 ガス燃焼後の急冷や触媒等これらに対応 できる構成を採用すればよい。 またこの例では第 1パージ室 1 2 と第 2 パージ室 1 4とで共通に接続している力'、 独立に配設するようにしても よい。 本発明の処理装置では各室に独立な排気系を備えてもよいし、 少 なくとも一部が共通な排気系を備えるようにしてもよい。 上述のように本発明によれば装置の構成が簡単になり、 装置の価格も 低く多目的に使用することができる。 また気密扉のシール性も向上し、 メンテナンス性も高まる。 また本発明によれば処理装置の信頼性、 生産 性をともに向上することができる。 Each exhaust system is provided with an exhaust gas treatment system 60 via a valve 65 at the subsequent stage. In this example, the exhaust gas treatment system 60 includes a gas combustion device 61 for complete combustion of the exhaust gas, a scrubber 62 for gas cleaning, and an activated carbon filter 6 for adsorbing and removing harmful components in the gas. 3. Equipped with exhaust blower 6 4. The valve 65 also has a role as a check valve. The configuration of the exhaust gas treatment system 60 may be determined as necessary, such as the components of the exhaust gas. When the exhaust gas contains, for example, dioxins, N〇x, SOx, etc., a configuration capable of coping with these, such as rapid cooling after gas combustion and a catalyst, may be adopted. Further, in this example, the forces commonly connected to the first purge chamber 12 and the second purge chamber 14 may be independently provided. In the processing apparatus of the present invention, each chamber may be provided with an independent exhaust system, or at least a part may be provided with a common exhaust system. As described above, according to the present invention, the configuration of the device is simplified, and the price of the device is low, so that the device can be used for multiple purposes. In addition, the sealing performance of the airtight door is improved, and maintenance is also enhanced. Further, according to the present invention, both the reliability and the productivity of the processing apparatus can be improved.
(実施形態 2 )  (Embodiment 2)
本発明の処理装置を用いて行うことができる処理の例について説明す る。 この例では電子部品がはんだ等により実装された回路基板を処理対 象物体として処理した例について説明する。  An example of processing that can be performed using the processing apparatus of the present invention will be described. In this example, an example will be described in which a circuit board on which electronic components are mounted by solder or the like is processed as an object to be processed.
回路基板をかごやホルダ一などの治具に収容し、 気密扉 3 4を開いて 第 1パージ室に導入した。 第 1パージ室 1 2を排気した後に窒素ガスで パージした。 またはバイパスを開にし、 または第 1加熱室 1 1を排気し てもよい。 ついで気密扉 3 4および断熱扉 2 1を開いて回路基板を第 1 加熱室 1 1へ搬送した。  The circuit board was housed in a jig such as a car or a holder, and the airtight door 34 was opened and introduced into the first purge chamber. After the first purge chamber 12 was evacuated, it was purged with nitrogen gas. Alternatively, the bypass may be opened, or the first heating chamber 11 may be exhausted. Next, the airtight door 34 and the heat insulating door 21 were opened, and the circuit board was transported to the first heating chamber 11.
扉を閉じ、 第 1加熱室 1 1で回路基板を加熱し、 その構成樹脂を熱分解 した。 プリプレグ、 ソルダーレジス ト、 電子部品のモールド樹脂等の、 回路基板を構成する有機物成分は、 この加熱により熱分解した。 熱分解 によって比較的分子鎖が短い炭化水素系ガスを含むガスが発生した。 こ の熱分解生成ガス (ミス トや固体微粒子を含む) は排気ブロワ 4 3によ り排気系側に吸引され、 改質器 4 1で改質した高分子炭化水素は凝縮器 4 2で油化した。 なおこの例では、 処理対象物体の熱分解を系内の圧力 が大気圧よりも高くなるように制御して行っている (図 2参照)。 このた めは第 1加熱室 1 1に外気が逆流するのを防止するとともに、 熱分解生 成ガスを効率的に排気系側へ導くことができる。 The door was closed, the circuit board was heated in the first heating chamber 11, and the constituent resin was thermally decomposed. Organic components constituting the circuit board, such as prepreg, solder resist, and mold resin for electronic components, were thermally decomposed by this heating. Pyrolysis generated gases containing hydrocarbon gases with relatively short molecular chains. This pyrolysis gas (including mist and solid fine particles) is sucked into the exhaust system by the exhaust blower 43, and the high-molecular hydrocarbons reformed in the reformer 41 are converted to oil in the condenser 42. It has become. In this example, the thermal decomposition of the object to be treated is controlled so that the pressure inside the system is higher than the atmospheric pressure (see Fig. 2). For this reason, it is possible to prevent the outside air from flowing back into the first heating chamber 11 and efficiently guide the pyrolysis generated gas to the exhaust system side.
第 1加熱室 1 1での加熱処理の後、 処理対象物体を第 1パージ室 1 2 へ戻した。 このとき第 1パージ室 1 2と第 2加熱室 1 3とを隔てる気密 扉 3 2は閉じているので、 第 1加熱室 1 1の雰囲気ガスが第 2加熱室 1 3へ入ることはない。 After the heat treatment in the first heating chamber 11, the object to be processed was returned to the first purge chamber 12. At this time, since the airtight door 3 2 that separates the first purge chamber 12 and the second heating chamber 13 is closed, the atmosphere gas in the first heating chamber 11 Never go to 3.
処理対象物体が第 1パージ室へ戻ったら、 気密扉 3 1および断熱扉 2 1を閉じて、 室内を真空排気する。 このとき処理対象物体からなおガス が排出される場合でも、 凝縮器 4 4で凝縮回収される。 そして第 1パ一 ジ室 1 2 と第 2加熱室 1 3の圧力がバランスした状態で、 気密扉 3 2お よび断熱扉 2 2を開き、 処理対象物体を第 2加熱室 1 3へ搬送した。 こ のとき必要に応じて第 1パージ室 1 2 と第 2加熱室 1 3との間のバイパ スバルブを開いて、 両室の圧力をバランスさせるようにしてもよい。 搬 送後、 気密扉及び断熱扉を閉じた。 なお、 第 1加熱室 1 1及び第 1パー ジ室 1 2を排気した後、 処理対象物体を第 1パージ室 1 2に搬送しても よい。  When the object to be treated returns to the first purge chamber, the airtight door 31 and the heat insulating door 21 are closed, and the chamber is evacuated. At this time, even if gas is still discharged from the object to be treated, it is condensed and recovered by the condenser 44. Then, with the pressures of the first purge chamber 12 and the second heating chamber 13 balanced, the airtight door 3 2 and the heat insulating door 22 were opened, and the object to be processed was transported to the second heating chamber 13. . At this time, a bypass valve between the first purge chamber 12 and the second heating chamber 13 may be opened as necessary to balance the pressures in both chambers. After transportation, the airtight door and the heat-insulated door were closed. After the first heating chamber 11 and the first purge chamber 12 are evacuated, the object to be processed may be transferred to the first purge chamber 12.
第 2加熱室 1 3では、 処理対象物体を減圧下で加熱することにより、 その構成金属 (単数または複数) の一部の酸化物その他の物質を選択的 に蒸発させた。 ここでは鉛を蒸発させることではんだ接合を解除するこ とができた。 第 2加熱室内の温度、 圧力は、 蒸発させたい金属の沸点以 上に調節すればよい。 ここでは加熱温度は 1 0 0 0 °C〜 1 2 0 0 °C、 圧 力は約 1 0一 1〜約 1 0— 4 T 0 r r程度の範囲で調節した。蒸発した金属 は凝縮器 4 5で凝縮させた。 本発明では蒸発金属が第 1加熱 1 1室へ入 り込むことがなく、 また気密扉 3 1に付着することもない。 In the second heating chamber 13, the object to be treated was heated under reduced pressure to selectively evaporate some oxides and other substances of the constituent metal (s). Here, the solder joint could be released by evaporating the lead. The temperature and pressure in the second heating chamber may be adjusted to be higher than the boiling point of the metal to be evaporated. Here the heating temperature is 1 0 0 0 ° C~ 1 2 0 0 ° C, pressure was controlled at about 1 0 one 1 to about 1 0- 4 T 0 rr range of about. The evaporated metal was condensed in a condenser 45. In the present invention, the evaporated metal does not enter the first heating 11 chamber and does not adhere to the airtight door 31.
所望の金属を蒸発させた後、 気密扉 3 3および断熱扉 2 3を開いて処 理対象物体を第 2パージ室 1 4へ搬送した。 このときも前述のように気 密扉の両側の圧力をほぼ等しくなるようにバランスさせた。 これには排 気系により第 2パージ室 1 4を真空排気する。 処理対象物体を第 2パ一 ジ室 1 4へ導入したら、 窒素等の非酸化性ガスにより処理対象物体を冷 却した。 第 2加熱室での減圧下での加熱処理により、 処理対象物体は表 面自由エネルギーが過剰な不安定な状態にあるから、 そのまま外気にさ らすのは好ましくない。 After evaporating the desired metal, the airtight door 33 and the heat insulating door 23 were opened, and the object to be processed was transported to the second purge chamber 14. At this time, the pressure on both sides of the hermetic door was balanced so as to be almost equal as described above. For this purpose, the second purge chamber 14 is evacuated by an exhaust system. After the object to be treated was introduced into the second purge chamber 14, the object to be treated was cooled by a non-oxidizing gas such as nitrogen. Due to the heat treatment under reduced pressure in the second heating chamber, the object to be treated is in an unstable state with excessive surface free energy, so it is exposed to outside air as it is. It ’s not good to eat.
また処理した土壌などの処理対象物体の加熱残渣を酸化雰囲気内で加 熱し酸化するようにしてもよい。 これにより処理対象物体の残渣中の金 属などは酸化物として安定な形態に変化する。 この酸化処理は必要に応 じて施せばよく、 必須の処理事項ではない。  Further, the heating residue of the object to be treated such as the treated soil may be heated and oxidized in an oxidizing atmosphere. As a result, metals and the like in the residue of the object to be processed change to a stable form as an oxide. This oxidation treatment may be performed as needed, and is not an essential treatment item.
処理対象物体は第 2パージ室 1 4で窒素ガスなどの不活性ガスで冷却 した後外部へ取り出す。 以上の処理により回路基板の構成樹脂はほぼ熱 分解し、はんだ合金等に含まれる鉛も除去された。残さ中のカーボンは、 水性反応により一酸化炭素と水素としてガス化するようにしてもよい。 このガスは本発明の処理装置の加熱手段として用いることもできる。 なおこの例では回路基板を処理対象物体とした処理の例について説明 したが、 本発明はこれに限ることなく、 土壌、 汚泥、 シュレッダーダス ト、 焼却灰、 焼却飛灰などの処理を行うことができる。 また真空処理の ための高温では還元作用が強く、 ダイォキシン類などの有機ハロゲン化 物を含む処理対象物体の除去処理にも適している。 本発明では処理対象 物体を減圧下で加熱処理した後、 ダイォキシンフリ一な雰囲気でパージ して冷却するので、 処理の残さにダイォキシン類 (P C D F sぉょびP C D D s、 すべての異性体を含む) ゃコプラナ P C Bなどの有害な有機 ハロゲン化物の残留濃度を極低レベルに抑制することができる。 この処 理後の残渣のダイォキシン類の濃度は検出限界以下であった。 また、 酸 素ガス濃度が極めて低いため (または無視できるため) 公害物質である N O x、 S O x等の酸化物も非常に少ない分析結果が得られた。  The object to be treated is cooled with an inert gas such as nitrogen gas in the second purge chamber 14 and then taken out. Through the above processing, the constituent resin of the circuit board was substantially thermally decomposed, and lead contained in the solder alloy and the like was also removed. The carbon in the residue may be gasified as carbon monoxide and hydrogen by an aqueous reaction. This gas can be used as a heating means of the processing apparatus of the present invention. In this example, an example of processing using a circuit board as an object to be processed has been described.However, the present invention is not limited to this. it can. In addition, at high temperatures for vacuum processing, the reducing action is strong at high temperatures, and it is also suitable for removal of objects to be treated containing organic halides such as dioxins. In the present invention, after the object to be treated is heated under reduced pressure, it is purged and cooled in a dioxin-free atmosphere. Residual concentrations of harmful organic halides such as coplanar PCBs can be suppressed to extremely low levels. The concentration of dioxins in the residue after this treatment was below the detection limit. In addition, since the oxygen gas concentration was extremely low (or negligible), the analysis results showed that the amount of pollutants such as NO x and SO x was very small.
(実施形態 3 )  (Embodiment 3)
図 4は本発明の処理装置の構成の別の例を概略的に示す図である。 こ こでは排気系等の図示は省略しているが、 排気系、 非酸化性ガス供給系 等の構成は図 1 と同様である。 この処理装置は図 1に例示した構成に加 え、 第 3加熱室 1 5を備えている。 この第 3の加熱室 1 5は第 2パージ 室 1 4と気密扉 3 6および断熱扉 2 4を介して接続されている。 つまり 第 3加熱室 1 5も第 2パージ室 1 4に対して第 2加熱室 1 3と並列に接 続されている。 FIG. 4 is a diagram schematically showing another example of the configuration of the processing apparatus of the present invention. Here, the illustration of the exhaust system and the like is omitted, but the configuration of the exhaust system and the non-oxidizing gas supply system is the same as in FIG. This processing device is in addition to the configuration shown in Fig. 1. In addition, a third heating chamber 15 is provided. The third heating chamber 15 is connected to the second purge chamber 14 via an airtight door 36 and a heat insulating door 24. That is, the third heating chamber 15 is also connected to the second purge chamber 14 in parallel with the second heating chamber 13.
さらにこの例では第 3加熱室には水蒸気導入系 7 1が接続されており、 室内で水性反応 (炭素と水とにより一酸化炭素と水素を生じる反応) を 生じさせるようになつている。 水性反応は吸熱反応である。 したがって 反応エネルギーを供給して反応温度 (約 5 0 0 °C ) を維持するために、 室内には加熱手段が配設されている。 また生成した水素と一酸化炭素は 加熱の燃料ガス、 ガス発電機の燃料ガス等として用いる。 この例では第 3加熱室 1 5を水性反応室とした例について説明するが、 減圧加熱処理 や温度を変化させ酸化剤投入により微細な重金属などを酸化除去するな ど、 他の加熱処理を行うこともできる。  Further, in this example, a steam introduction system 71 is connected to the third heating chamber, so that an aqueous reaction (a reaction of producing carbon monoxide and hydrogen by carbon and water) occurs in the third heating chamber. The aqueous reaction is an endothermic reaction. Therefore, a heating means is provided in the room to supply the reaction energy and maintain the reaction temperature (about 500 ° C). The generated hydrogen and carbon monoxide are used as fuel gas for heating and fuel gas for gas generators. In this example, an example in which the third heating chamber 15 is an aqueous reaction chamber will be described. However, other heating processing such as reduced pressure heating processing or changing the temperature to oxidize and remove fine heavy metals and the like by introducing an oxidizing agent is performed. You can also.
図 4に例示した本発明の処理装置を用いて自動車のシユレッダーダス トを処理した例について説明する。 自動車のシユレッダーダス トの処理 が課題となっている。 自動車のリサイクルは一般的に以下のように行わ れる。  An example of processing a car shredder dust using the processing apparatus of the present invention illustrated in FIG. 4 will be described. The challenge is to deal with car shredder dust. Car recycling is generally performed as follows.
1 ) 自動車からエンジン、 ミッション、 燃料タンク等の主要部品を取 り外す  1) Remove main parts such as engine, mission, fuel tank, etc. from the car
( 2 ) プレスする  (2) Press
( 3 ) シュレツダ一にかける  (3) Apply to Shretzda
( 4 ) シュレッダーを磁力、 風力、 比重等により素材を分別する  (4) Sort materials by magnetic force, wind force, specific gravity, etc.
このシュレツダ一の分別後の残りがシュレツダーダス トである。 シュ レッダ一ダス トには、 各種樹脂、 鉄、 銅、 アルミニウム、 鉛等の金属、 ガラス、 土砂などが含まれている。  The rest of this Shretzda after the separation is the Shrezdaust. Shredder dust includes various resins, metals such as iron, copper, aluminum and lead, glass, earth and sand.
このシュレツダーダス トの処理も、 第 2加熱室 1 3での減圧加熱まで は、 実施形態 2で説明した回路基板の処理と同様に行った。 すなわち、 第 1加熱室 1 1でシュレッダーダス 卜に含まれる有機物を熱分解し、 第 2加熱室 1 3では、 加熱残さに含まれる亜鉛、 鉛などの重金属を蒸発さ せた。 なお第 1加熱室での有機物の熱分解は必要に応じて減圧下で行う ようにしてもよい。 この場合第 1加熱室 1 1内の圧力を大気圧以上に制 御することはしない。 また排気ブロワ 4 3に代えて排気系に真空ポンプ を配設する。 The processing of this shredder dust also takes place until the vacuum heating in the second heating chamber 13 Was performed in the same manner as the processing of the circuit board described in the second embodiment. That is, the organic matter contained in the shredder dust was thermally decomposed in the first heating chamber 11, and the heavy metals such as zinc and lead contained in the heating residue were evaporated in the second heating chamber 13. Note that the thermal decomposition of the organic substance in the first heating chamber may be performed under reduced pressure as necessary. In this case, the pressure in the first heating chamber 11 is not controlled to be higher than the atmospheric pressure. In addition, a vacuum pump will be provided in the exhaust system in place of the exhaust blower 43.
第 2加熱室 1 3での減圧加熱の後、 処理対象物体は真空排気または非 酸化雰囲気にパージされた第 2パージ室 1 4を経由して第 3加熱室 1 5 へと搬送した。 第 2パージ室 1 4では処理対象物体の積極的な冷却は行 わなかった。 第 3加熱室 1 5では処理対象物体の加熱残さを約 5 0 0 °C 程度に保持しながら水蒸気と反応させた。 シユレッダーダス 卜の加熱残 さに含まれるカーボンは水と反応して一酸化炭素と水素を生じた。 この 生成ガスは第 3加熱室 1 5から配管 7 2により取り出して燃料ガスとし て利用した。 第 3加熱室 1 5での処理の後、 第 2パージ室 1 4へ戻して 非酸化雰囲気で冷却し、 搬送機構 1 9により装置外部へ取り出した。  After heating under reduced pressure in the second heating chamber 13, the object to be treated was transferred to the third heating chamber 15 via the second purge chamber 14 evacuated or purged to a non-oxidizing atmosphere. In the second purge chamber 14, the object to be treated was not actively cooled. In the third heating chamber 15, the object to be treated was reacted with water vapor while maintaining the heating residue at about 500 ° C. The carbon contained in the heated residue of the shredder dust reacted with water to produce carbon monoxide and hydrogen. This generated gas was taken out of the third heating chamber 15 through a pipe 72 and used as a fuel gas. After the treatment in the third heating chamber 15, it was returned to the second purge chamber 14, cooled in a non-oxidizing atmosphere, and taken out of the apparatus by the transfer mechanism 19.
このように本発明の処理装置によれば、 酸化、 還元が自由にでき、 有 機物と金属とを含む処理対象物体についても安全で効率的な処理を行う ことができる。 従来管理型処分場で埋め立て処理されていたシユレッダ 一ダストをリサイクルすることができる。  As described above, according to the processing apparatus of the present invention, oxidation and reduction can be freely performed, and safe and efficient processing can be performed on an object to be processed including organic matter and metal. It is possible to recycle shredder dust that had previously been landfilled at a managed landfill.
(実施形態 4 )  (Embodiment 4)
図 5は本発明の処理装置の構成の別の例を概略的に示す図である。 こ の例では本発明を各種金属の熱処理を行うことができる構成について説 明する。 本発明の処理装置では金属の焼き入れ、 焼戻し、 焼鈍、 焼準な どの熱処理も複数処理を同時に行うこともできる。 さらに本発明の処理 装置ではこれらの異なった処理を並行して、 あるいは連続して行うこと ができる。 FIG. 5 is a diagram schematically showing another example of the configuration of the processing apparatus of the present invention. In this example, a configuration in which the present invention can perform heat treatment of various metals will be described. In the processing apparatus of the present invention, a plurality of heat treatments such as quenching, tempering, annealing, and normalizing a metal can be performed simultaneously. Further, in the processing apparatus of the present invention, these different processings are performed in parallel or continuously. Can be.
S K Dを処理対象物体とした焼き入れ処理および焼戻し処理を行う場 合を例にとって説明する。 まず第 1パージ室 1 1を介して処理対象物体 を第 2加熱室 1 3へ導入し、 室内を真空排気して約 1 0 5 0 °C程度で真 空加熱を行う。 ついで処理対象物体を第 2パージ室 1 4へ搬送して不活 性ガスで急冷することで焼き入れをする。処理対象物体の冷却のために、 第 2パージ室 1 4に冷却用の油槽を設けてもよい。 この第 2パージ室 1 4で冷却中に第 2加熱室 1 3へ焼き入れ物を第 1パージ室 1 1を通じて 投入する。 冷却後、 処理対象物体を外部へ取り出す。  A case where quenching processing and tempering processing using SKD as a processing target object will be described as an example. First, an object to be treated is introduced into the second heating chamber 13 via the first purge chamber 11, and the inside of the chamber is evacuated to perform vacuum heating at about 150 ° C. Next, the object to be treated is transferred to the second purge chamber 14 and quenched by rapid cooling with an inert gas. An oil tank for cooling may be provided in the second purge chamber 14 for cooling the object to be treated. During cooling in the second purge chamber 14, the quenched material is introduced into the second heating chamber 13 through the first purge chamber 11. After cooling, remove the object to be treated.
焼き入れ処理を終えた処理対象物体は、 もう一度第 1パージ室 1 1を 経由して今度は第 1加熱室 1 1へと搬送される。 第 1加熱室では、 約 1 8 0 °C〜 5 5 0度程度に処理対象物体を焼き戻しをする。 ついで処理対 象物体をもう一度第 1パージ室 1 1へと搬送し、 ここで徐冷処理が行わ れる。 なお 2回戻しや、 3回戻しなど複数回戻しを段階的に温度を下げ て行うことが好ましい。  After the quenching process, the object to be processed is once again transported to the first heating chamber 11 via the first purge chamber 11. In the first heating chamber, the object to be treated is tempered at about 180 ° C. to about 550 ° C. Next, the object to be processed is transported to the first purge chamber 11 again, where the slow cooling process is performed. Note that it is preferable that the temperature is lowered stepwise, such as returning twice or returning three times, such as three times.
このように本発明の処理装置では処理対象物体の熱分解や、 減圧加熱 による蒸発処理だけでなく、 各種熱処理も行うことができる。 この例で は第 1加熱室で焼き戻し中に第 2加熱室では焼き入れができ、 第 1パー ジ室と第 2のパージ室が焼き戻し、 焼き入れの冷却に用いられる。 この ため焼入れ処理装置と、 焼戻し処理装置を個別にした場合と比べると、 製造コス ト、 設置スペースともに低減することができるという利点を有 する。なお本発明の処理装置をもっぱら熱処理炉として用いる場合には、 改質装置、 凝縮器、 各種フィル夕、 および排ガス処理系は必須要素では なく必要に応じて備えるようにすればよい。  As described above, the processing apparatus of the present invention can perform not only thermal decomposition of the object to be processed and evaporation processing by heating under reduced pressure but also various heat treatments. In this example, quenching can be performed in the second heating chamber during tempering in the first heating chamber, and the first purge chamber and the second purge chamber are tempered and used for cooling the quenching. Therefore, as compared with the case where the quenching device and the tempering device are separately provided, there is an advantage that both the manufacturing cost and the installation space can be reduced. When the treatment apparatus of the present invention is used exclusively as a heat treatment furnace, the reformer, condenser, various filters, and exhaust gas treatment system are not essential elements, and may be provided as necessary.
なおこのような熱処理は図 1に例示した処理装置によっても行うこと ができる。 また第 1加熱室 1 1で樹脂の熱分解を行い、 第 2加熱室 1 3 で金属の真空焼入れを行ったり、 第 1加熱室 1 1で非金属の焼鈍や処理 物の洗浄を行い、 第 2加熱室 1 2で金属の真空蒸発を行うなど、 個別の あるいは複合的な処理を行うこともできる。本発明の処理装置によれば、 複数の加熱室を外部とのアクセスが可能なパージ室に対して並列に接続 した構成を採用することにより、 このような多目的で生産性の高い処理 装置を実現することができる。 産業上の利用可能性 Note that such a heat treatment can also be performed by the processing apparatus illustrated in FIG. The resin is thermally decomposed in the first heating chamber 11 and the second heating chamber 13 Individual or multiple treatments, such as vacuum quenching of metals in the first heating chamber, non-metal annealing and cleaning of the workpiece in the first heating chamber 11, and vacuum evaporation of the metals in the second heating chamber 12. Can also be performed. According to the processing apparatus of the present invention, such a multipurpose and highly productive processing apparatus is realized by adopting a configuration in which a plurality of heating chambers are connected in parallel to a purge chamber capable of accessing the outside. can do. Industrial applicability
以上説明したように本発明によれば、 複数の加熱室を外部とのァクセ スが可能なパージ室に対して並列に接続することにより、構成が簡単で、 生産性の高い処理装置を提供することができる。 また本発明によれば気 密扉のシールの信頼性を向上し、 長期の連続運転を行うことができる。 また本発明によればシュレッダ一ダス ト、 土壌、 焼却灰、 焼却飛灰、 回 路基板のように有機物と金属とからなる処理対象物体を効率的に処理す ることができる。 さらに本発明によれば、 複数の熱処理を並行して、 ま たは連続して行うことができる。 さらに、 真空処理や窒素パージ冷却す ることにより、 残渣中にダイォキシン類ゃコプラナ P C B、 P C Bなど の有機ハロゲン化物、 またその他公害ガスの分解、 無害化処理を行うこ とができる。 また重金属類を含む各種元素の蒸発分離を行うことができ る。  As described above, according to the present invention, by connecting a plurality of heating chambers in parallel to a purge chamber capable of accessing the outside, a processing apparatus with a simple configuration and high productivity is provided. be able to. According to the present invention, the reliability of the seal of the hermetic door can be improved, and long-term continuous operation can be performed. Further, according to the present invention, it is possible to efficiently treat an object to be treated composed of organic matter and metal, such as shredder dust, soil, incinerated ash, incinerated fly ash, and a circuit board. Further, according to the present invention, a plurality of heat treatments can be performed in parallel or continuously. Furthermore, by subjecting the residue to vacuum treatment or nitrogen purge cooling, the residue can be subjected to decomposition and detoxification of organic halides such as dioxins, coplanar PCB, and PCB, and other pollutant gases. Also, various elements including heavy metals can be separated by evaporation.

Claims

請求の範囲 The scope of the claims
1 . 処理対象物体を処理する処理装置において、 1. In a processing apparatus for processing an object to be processed,
第 1の加熱手段と第 1の排気手段とを備えた第 1の加熱室と、 第 2の加熱手段と第 2の排気手段とを備えた第 2の加熱室と、 前記第 1の加熱室と前記第 2の加熱室との間に介挿され、 第 3の排気 手段を備えた第 1のパージ室と、  A first heating chamber including a first heating unit and a first exhaust unit, a second heating room including a second heating unit and a second exhaust unit, and the first heating chamber. A first purge chamber interposed between the second heating chamber and the second heating chamber, the first purge chamber including third exhaust means;
を具備したことを特徴とする処理装置。  A processing device comprising:
2, 前記第 1のパージ室は前記第 1の加熱室および第 2の加熱室を経由 することなく外部とアクセスするための気密扉を備えていることを特徴 とする請求の範囲第 1項に記載の処理装置。  2. The method according to claim 1, wherein the first purge chamber is provided with an airtight door for accessing the outside without passing through the first heating chamber and the second heating chamber. The processing device according to the above.
3 . 前記第 1の加熱室と前記第 1のパージ室との間に配設された第 1の 隔壁と、 前記第 2の加熱室と前記第 2のパージ室との間に配設された第 2の隔壁と、 前記第 1の隔壁と前記第 2の隔壁とを少なく とも一方が常 に閉じているように開閉する手段とをさらに具備したことを特徴とする 請求の範囲第 1項に記載の処理装置。  3. A first partition provided between the first heating chamber and the first purge chamber, and a first partition provided between the second heating chamber and the second purge chamber. The method according to claim 1, further comprising a second partition, and means for opening and closing the first partition and the second partition so that at least one of them is always closed. The processing device according to the above.
4 . 前記第 1の加熱室内、 前記第 2の加熱室内または前記第 1のパージ 室内が大気圧以上になるように圧力を調節する圧力調節手段をさらに具 備したことを特徴とする請求の範囲第 1項に記載の処理装置。  4. The apparatus according to claim 1, further comprising pressure adjusting means for adjusting the pressure so that the pressure in the first heating chamber, the second heating chamber, or the first purge chamber is equal to or higher than the atmospheric pressure. A processing device according to claim 1.
5 . 前記第 1の加熱室、 前記第 2の加熱室または前記第 1のパージ室の 圧力調節手段は、 当該室内の圧力を検出する手段と、 当該室に非酸化性 ガスを導入する手段と、 前記検出した圧力に応じて前記非酸化性ガスの 導入量を調節する手段とを備えたことを特徴とする請求の範囲第 4項に 記載の処理装置。  5. The pressure adjusting means of the first heating chamber, the second heating chamber, or the first purge chamber includes: means for detecting a pressure in the chamber; and means for introducing a non-oxidizing gas into the chamber. 5. The processing apparatus according to claim 4, further comprising: means for adjusting an introduction amount of the non-oxidizing gas according to the detected pressure.
6 . 前記第 1の加熱室、 前記第 2の加熱室、 または前記第 1のパージ室 へ非酸化性ガスを導入する手段をさらに具備したことを特徴とする請求 の範囲第 1項に記載の処理装置。 6. The apparatus further comprising means for introducing a non-oxidizing gas into the first heating chamber, the second heating chamber, or the first purge chamber. 2. The processing device according to item 1, wherein
7 . 前記第 1の排気手段または前記第 2の排気手段は真空ポンプを備え たことを特徴とする請求の範囲第 1項に記載の処理装置。  7. The processing apparatus according to claim 1, wherein the first exhaust unit or the second exhaust unit includes a vacuum pump.
8 . 前記第 2の加熱室と接続して配設された第 2のパージ室をさらに具 備したことを特徴とする請求の範囲第 1項に記載の処理装置。  8. The processing apparatus according to claim 1, further comprising a second purge chamber connected to the second heating chamber.
9 . 前記第 1のパージ室または前記第 2のパージ室は処理対象物体を冷 却する手段を具備したことを特徴とする請求の範囲第 8項に記載の処理 装置。  9. The processing apparatus according to claim 8, wherein the first purge chamber or the second purge chamber includes means for cooling an object to be processed.
1 0 . 前記第 1の加熱室と前記第 1の排気手段との間、 または前記第 2 の加熱室と前記第 2の排気手段との間に配設され、 前記処理対象物体か ら排出されたガス状排出物を凝縮する手段をさらに具備したことを特徴 とする請求の範囲第 1項に記載の処理装置。  10. Disposed between the first heating chamber and the first exhaust means or between the second heating chamber and the second exhaust means and discharged from the object to be treated. 2. The processing apparatus according to claim 1, further comprising means for condensing the discharged gaseous emission.
1 1 . 前記第 1の加熱室と前記凝縮手段との間、 または前記第 2の加熱 室と前記凝縮手段との間に配設され、 前記処理対象物体から排出された ガス状排出物を改質する手段をさらに具備したことを特徴とする請求の 範囲第 1 0項に記載の処理装置。  11. The gaseous effluent that is disposed between the first heating chamber and the condensing means or between the second heating chamber and the condensing means and is discharged from the object to be treated is improved. The processing apparatus according to claim 10, further comprising a quality control unit.
1 2 . 前記改質手段は、 前記処理対象物体から排出されたガス状排出物 を 7 0 0 °C ~ 1 2 0 0 °C程度の高温で改質することを特徴とする請求の 範囲第 1 1項に記載の処理装置。  12. The reforming means, wherein the gaseous effluent discharged from the object to be treated is reformed at a high temperature of about 700 ° C. to about 1200 ° C. 11. The processing device according to item 1.
1 3 . 処理対象物体を処理する処理装置において、  1 3. In the processing device that processes the object to be processed,
第 1の排気手段と接続され、 外部からのアクセスが可能な第 1の気密 室と、  A first hermetic chamber connected to the first exhaust means and accessible from outside;
前記第 1の気密室と接続され、 第 1の加熱手段および第 2の排気手段 を有する第 2の気密室と、  A second hermetic chamber connected to the first hermetic chamber and having first heating means and second exhaust means;
前記第 1の気密室に対し前記第 2の気密室と並列に接続され、 第 2の 加熱手段及び第 3の排気手段を有する第 3の気密室と を具備したことを特徴とする処理装置。 A third hermetic chamber connected to the first hermetic chamber in parallel with the second hermetic chamber, and having a second heating means and a third exhaust means; A processing device comprising:
1 4 . 前記第 1の気密室内の処理対象物体を冷却するための手段を更に 具備することを特徴とする請求の範囲第 1 3項に記載の処理装置。  14. The processing apparatus according to claim 13, further comprising means for cooling an object to be processed in the first hermetic chamber.
1 5 . 処理対象物体を保持する第 1の密閉空間を形成可能な第 1室と、 処理対象物体を保持する第 2の密閉空間を形成可能な第 2室と、 前記第 1室及び第 2室との間で処理対象物体の受け渡しが可能で、 か つ処理対象物体を保持する第 3の密閉空間を形成可能な第 3室と、  1 5. A first chamber capable of forming a first sealed space holding the object to be processed, a second chamber capable of forming a second sealed space holding the object to be processed, the first chamber and the second A third chamber capable of transferring the object to be processed to and from the chamber and forming a third enclosed space holding the object to be processed;
前記第 1室及び第 2室内の処理対象物体を加熱するための手段と、 前記第 1〜第 3の密閉空間の圧力を常圧よりも小さくするための手段 と  Means for heating the object to be treated in the first chamber and the second chamber; and means for reducing the pressure of the first to third enclosed spaces below normal pressure.
を具備することを特徴とする処理装置。  A processing device comprising:
1 6 . 有機物と金属とを含む処理対象物体の処理方法において、  1 6. In a method for treating an object to be treated containing an organic matter and a metal,
前記有機物を熱分解する工程と、  Thermally decomposing the organic matter;
前記熱分解残渣を減圧下で加熱し前記金属を蒸発回収させる工程と、 前記有機物の熱分解残渣に水を添加して水性反応によりガス化するェ 程と  Heating the pyrolysis residue under reduced pressure to evaporate and recover the metal; and adding water to the organic pyrolysis residue and gasifying it by an aqueous reaction.
を有することを特徴とする処理方法。  A processing method comprising:
1 7 . 有機物と無機物とを含む処理対象物体の処理方法において、  1 7. In a method for treating an object to be treated containing an organic substance and an inorganic substance,
前記有機物を熱分解する工程と、  Thermally decomposing the organic matter;
前記熱分解残渣を減圧下で加熱し前記無機物を蒸発回収させる工程と、 前記有機物の熱分解残渣を酸化雰囲気内で加熱酸化反応させる工程と を有することを特徴とする処理方法。  A processing method comprising: heating the pyrolysis residue under reduced pressure to evaporate and recover the inorganic substance; and heating and oxidizing the pyrolysis residue of the organic substance in an oxidizing atmosphere.
PCT/JP2000/004669 1999-07-22 2000-07-12 Treating device and treating method WO2001006826A2 (en)

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JP4093451B2 (en) * 2001-04-27 2008-06-04 アートセラミック株式会社 Hazardous substance removal device
WO2019180772A1 (en) * 2018-03-19 2019-09-26 カンケンテクノ株式会社 Exhaust gas decompression and detoxification method, and device therefor
KR102657899B1 (en) * 2021-06-01 2024-04-17 주식회사 로오딘 Organic matter uum purification equipment and organic matter purification method using the same

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WO1997033703A1 (en) * 1996-03-15 1997-09-18 Ogihara Ecology Co., Ltd. Treatment apparatus, treatment system and treatment method

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