JP3023479B1 - Processing apparatus, processing method, and soil processing method - Google Patents

Abstract

A processing apparatus according to the present invention includes a second hermetic chamber (10).
The airtight door 115b and the retort 115c serve as an interface for taking out a gaseous emission including an evaporant from the object to be processed, which is heated in a reduced pressure state, inside the second airtight chamber 3 while maintaining the conditions in the second airtight chamber. And The retort 115c is connected to the first opening 103b of the second hermetic chamber.
When the airtight door 115b is opened,
From the airtight chamber 103 to prevent the gaseous emission from condensing on the airtight door. Therefore, it is possible to take out the condensate to the outside without stopping the processing device and keeping the conditions such as the temperature and pressure in the airtight chamber. Such a continuous operation of the processing apparatus greatly improves the productivity of the processing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a treatment apparatus, a treatment method, and a method for treating soil. In particular, the present invention relates to a processing apparatus, a processing method, and a soil processing method for processing an object to be processed containing harmful organic halides such as heavy metals such as lead and dioxins. The present invention also relates to a processing apparatus and a processing method that enable continuous processing of a processing target object containing a metal or an organic substance.

[0002]

2. Description of the Related Art The enormous amount of wastes in modern society is increasing daily, and it is urgently necessary to establish effective treatment techniques.

Although various useful substances are contained in waste, they are not separated from waste due to difficulty in separation.
Most waste is disposed of by landfill or incineration. Useful substances in waste have energy problems and resource depletion problems, and it is required to separate and collect and reuse them as much as possible.

On the other hand, harmful substances are contained in waste, and such harmful substances not only cause environmental destruction but also one of the major causes that make it difficult to recycle waste. It is. Therefore, if the harmful substances in the waste can be effectively removed, the waste can be actively reused as a treasure trove of resources, and the impact on the environment and living things can be minimized. it can.

[0005] Thus, in order to solve the serious problems surrounding the modern society, such as environmental pollution by harmful substances, depletion of resources, and shortage of energy sources, a technology for effectively treating waste must be established. Must.

[0006] However, in recent years, the forms of wastes have become complicated and diverse, and there are many complex wastes in which a plurality of different materials are integrated, and some wastes further contain harmful substances. In order to reuse such complex waste as a resource, it is necessary to selectively separate and recover useful and harmful substances from the waste in which multiple different materials are integrated. Such processing technology has not been established yet.

[0007] From another point of view, waste can be a treasure trove of resources if harmful substances can be separated. So-called waste is so called by relative value judgment. If resource recycling technology can be established and the cost required for resource recycling can be reduced, it is a resource, not a waste.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. That is, the present invention is effective for an object having a metal or an organic material as a constituent material,
It is an object of the present invention to provide a processing apparatus and a processing method that can be economically processed.

The present invention also relates to a processing method and a processing apparatus capable of suppressing the generation of dioxin,
It is an object of the present invention to provide a processing apparatus and a processing method capable of suppressing the generation of organic halides including dioxin in thermal decomposition processing of end-of-life vehicles, garbage from factories, general households, and the like, in the processing of waste. And It is another object of the present invention to provide a processing method and a processing apparatus capable of reducing the residual dioxin concentration in pyrolysis residues, incineration residues, residual liquid, soil, sludge, etc. containing harmful organic halides such as dioxin. I do. Another object of the present invention is to produce a clean soil from a soil containing an organic halide such as dioxin. Furthermore, the present invention
It is an object of the present invention to provide a processing method and a processing apparatus capable of cleaning soil and incinerated fly ash contaminated with harmful substances such as organic halides such as dioxins, PCB and coplanar PCB and heavy metals.

[0010]

In order to solve such a problem, the processing apparatus of the present invention employs the following configuration. That is, the processing apparatus of the present invention includes a first hermetic chamber having a first opening, a pipe arranged so as to be insertable into the first opening, and having a second opening in an inserting direction; 1 is openably and closably disposed, and the pipe is connected to the first
And an airtight door that is shielded from the first airtight chamber by the pipe when inserted into the opening.

As the first hermetic chamber, for example, a heating furnace, a reduced pressure furnace, a reduced pressure heating furnace and the like can be mentioned. Further, such an airtight chamber is not limited to a single-chamber configuration, and a plurality of such airtight chambers may be arranged with a door therebetween. In addition, a purge chamber for purging the processing atmosphere of the processing target object, a preheating chamber for preheating the processing target object, a cooling chamber for cooling the processing target object, and the like may be further provided in a stage preceding or following the airtight chamber.
When the pressure in the first hermetic chamber is reduced, an exhaust system for exhausting the first hermetic chamber through the first opening may be provided. Examples of the exhaust system include various vacuum pumps (rotary pumps, oil diffusion pumps, mechanical booster pumps, turbo molecular pumps, ion getter pumps, liquid ring pumps, etc.), blowers, fans and the like.
With such an exhaust system, the pressure in the first hermetic chamber can be adjusted.

A first opening is provided in the first hermetic chamber. In the processing apparatus of the present invention, the first airtight chamber is heated,
The gaseous emission generated from the object to be treated due to decompression, etc.
When the airtight door is open, it is taken out and processed through a tube inserted into the first opening. Here, the gaseous emission includes gas, droplets, mist, solid fine particles, and the like generated by heating, depressurizing, and the like of the object to be treated.
Examples of the gaseous emission include a gas generated by the thermal decomposition or reaction of the constituents of the object to be treated, a gas in which the constituents are vaporized, and the like. These gaseous effluents taken out of the first hermetic chamber are introduced into a predetermined processing system. There are various aspects of gaseous emission treatment systems,
Examples include condensation, thermal decomposition, cracking, reforming (including hydroforming), decomposition by catalysts, decomposition by plasma or glow discharge, adsorption by various adsorbents, and traps by dry or wet filters (liquid filters). it can. A plurality of the first openings may be provided. Preferably, the first opening is provided separately from the opening for introducing the object to be processed into the first hermetic chamber and the opening for taking out the object to be processed from the first hermetic chamber.

An airtight door, which is a shutter that can be opened and closed, is provided in a first opening of the first airtight chamber. The airtight door may be opened and closed by a drive mechanism such as a cylinder. When the operation direction of the airtight door is substantially perpendicular to the normal direction of the opening surface of the first opening, a mechanism such as a joint that converts the pressing force of the cylinder to the normal direction of the opening surface of the first opening. May be provided at the connection between the cylinder and the airtight door. By doing so, the airtight door can be pressed more strongly in the direction of the normal to the first opening surface, and the airtightness can be improved. The airtight doors may be provided in multiple layers. In addition, it is preferable to cool a portion where the seal portion of the airtight door contacts when the airtight door is closed.

In the processing apparatus of the present invention, the hermetic door is opened, a pipe is inserted from the outside into the first opening of the first hermetic chamber, and gaseous exhaust is taken out of the hermetic chamber through the pipe.
A second hermetic chamber connected to the first hermetic chamber via the first opening is provided, and a pipe is connected to the first hermetic chamber from the second hermetic chamber.
May be inserted into the opening. The tube has an outer shape that matches the first opening. As a form of the tube, there is a tube having a third opening on a side opposed to the first hermetic chamber with the airtight door interposed therebetween when the tube is inserted into the first opening. The third opening is the second opening
May be disposed so as to face the opening of the tube, or may be disposed on the side surface of the pipe.

The pipe may have a double structure so that a refrigerant, for example, nitrogen gas, air, water, or the like flows between the inner layer and the outer layer. As a result, the ability of the tube to shield the airtight door is improved, and the tube can be cooled effectively. For example, even when the metal is vaporized from the object to be treated and the vaporized metal is condensed in the tube, the condensation efficiency can be improved. Further, the tubes may be arranged so as to be exchangeable. In this way, the tube also functions as a replaceable cartridge for collecting condensate.

When the tube is inserted into the first opening, the hermetic door is shielded from the first hermetic chamber by the area between the second and third openings on the side of the tube. You. For this reason, it is possible to prevent the gaseous emission from condensing or adhering to the airtight door. Also, for example, even when packing made of resin or the like is provided on the seal portion of the hermetic door, it is possible to prevent the seal portion of the hermetic door from being damaged by the heat of the gaseous emission. Therefore, the sealing performance of the airtight door can be maintained. As described above, in the processing apparatus of the present invention, the interface from the first hermetic chamber to the outside is realized by the hermetic door and the pipe.

[0017] A cylindrical sleeve may be provided at the first opening of the first hermetic chamber, and the tube may be inserted into the sleeve. The tube and the first opening or the sleeve are deformed by thermal expansion or the like in accordance with a temperature change in the first hermetic chamber. Due to this thermal expansion, the inserted tube may not be able to be pulled out of the first opening or the tube. Thus, for example, the coefficient of thermal expansion of the sleeve may be equal to or greater than the coefficient of thermal expansion of the tube. Alternatively, the tube may be selectively contracted by heating or keeping the sleeve warm and cooling the tube.

The sleeve is preferably made of a material having a high thermal conductivity such as carbon or metal. In this way, the evaporant from the object to be processed condenses after reaching farther from the second opening of the tube. Therefore, the collection efficiency can be improved.

In the processing apparatus of the present invention, in order to assist the moving operation of the tube, the processing device may be provided along a direction in which the tube is inserted, and may include means for guiding the operation of inserting and removing the tube. The guide means may be provided with, for example, guide rails and guide rollers as necessary.

Further, as an embodiment of the processing apparatus of the present invention, the treatment apparatus further includes a second hermetic chamber adjacent to the first hermetic chamber through the hermetic door, and the pipe is connected to the second hermetic chamber from the second hermetic chamber. There is one that is inserted into the first opening of the first hermetic chamber. That is, the first hermetic chamber and the second hermetic chamber are connected through the first opening provided with the hermetic door. The tube is then inserted from the second hermetic chamber into the first opening. When the pipe is inserted into the first opening of the first hermetic chamber, the first hermetic chamber and the second hermetic chamber are connected by the pipe. When the tube is inserted into the first opening, the second opening of the tube is located closer to the first hermetic chamber than the hermetic door, and the third opening is closer to the second hermetic chamber than the hermetic door. It is arranged as follows. At the same time, the hermetic door is shielded from the first hermetic chamber and the second hermetic chamber by a tube.

In the second hermetic chamber, various kinds of processing of gaseous emission from the object to be processed can be performed. For example, the gaseous effluent may be condensed by cooling the second hermetic chamber or tube. Further, reforming and cracking of the gaseous emission may be performed in the second hermetic chamber. The pipe or the second hermetic chamber may be provided between the first hermetic chamber and an exhaust system. In this case, the exhaust system is connected to the first hermetic chamber via the pipe or the second hermetic chamber. By adopting such a configuration, for example, metal vaporized under reduced pressure from the object to be treated in the first hermetic chamber can be condensed in the pipe or the second hermetic chamber while maintaining the reduced pressure. In addition, the processing of gaseous emission can be performed under reduced pressure. Under reduced pressure, the intermolecular distance becomes longer, so that the chance of a reaction between molecules is reduced as compared with the case of normal pressure or pressurization. For example, aromatic hydrocarbons in gaseous emissions,
Even when a component having an ability to produce an organic halide, such as halogen or oxygen, is contained, the production of an organic halide can be suppressed. Further, the reduced pressure state is also suitable for the case of performing a process by, for example, plasma discharge of a gaseous emission.

The temperature of the second hermetic chamber is adjusted (cooling, heating)
Is preferred. As the cooling structure of the second hermetic chamber, for example, a so-called water-cooled jacket structure in which the second hermetic chamber has a double structure and a coolant such as water is circulated in an outer layer can be given. This makes it possible to efficiently condense the evaporant and gaseous emission from the object to be treated in the pipe or the second hermetic chamber.

When the tube is provided as a replaceable cartridge, for example, an airtightly openable and closable door for replacing the tube is provided in the second hermetic chamber, and the door is opened to replace the tube. You may do so. In the pipe or second
If the metal condensed in the airtight chamber is taken out to the atmosphere as it is, it may burn violently. For this reason, when condensing and recovering a metal, it is preferable to cool it with a non-oxidizing gas before taking out the condensed metal to the outside. Therefore, it is preferable that the second hermetic chamber is provided with a means for supplying a non-oxidizing gas.

In the processing apparatus of the present invention, even when the second hermetic chamber is opened and the pipe is taken out, the airtightness of the hermetic door is maintained, so that the outside air is prevented from leaking into the first hermetic chamber. be able to. Therefore, the pipe can be taken out while maintaining the temperature and pressure conditions in the first hermetic chamber. Therefore, the processing apparatus can be continuously operated, and the productivity of the processing can be improved. In the processing apparatus of the present invention, this point is greatly different from the conventional processing apparatus in which the processing apparatus is stopped in order to take out gaseous emission and its condensate out of the system.

The exhaust system may be connected to the second hermetic chamber or to the third opening of the pipe. In the former case, the gaseous effluent is led from the pipe through the second hermetic chamber to the exhaust system.
In the latter case, the gaseous effluent is led directly from the third opening of the tube to the exhaust system. Further, it is preferable that the third opening of the pipe and the exhaust system are connected as tightly as possible. By directly connecting the third opening of the pipe and the exhaust system, it is possible to prevent the evaporation from the object to be treated from condensing in the second hermetic chamber.

In order for the gaseous effluent from the object to be treated to be drawn out to the outside by means of the tube while shielding the airtight door by means of the tube, it is preferred that the tube fits as much as possible into the first opening or sleeve. However, the tube may not easily come off the sleeve due to thermal expansion of the condensate into the sleeve, the tube, or the tube. When the third opening of the pipe is directly connected to the exhaust system, the space between the second hermetic chamber and the pipe is formed by the first hermetic chamber and the pipe even if there is some gap between the pipe and the sleeve. Exhausted through the pipe, gaseous emissions
Can be prevented from flowing into the space between the airtight chamber and the pipe. In order to connect the third opening of the pipe and the exhaust system, when the pipe is inserted into the first opening, a pipe or packing connecting the third opening and the exhaust system is used. You may.

Further, when the pipe is inserted into the first opening of the first hermetic chamber, the pressure in the space between the pipe and the second hermetic chamber increases the pressure of the first hermetic chamber. Means for adjusting the pressure to be higher than the internal pressure may be further provided. Further, when the pipe is inserted into the first opening of the first hermetic chamber, the pressure inside the first hermetic chamber increases the pressure of the space between the pipe and the second hermetic chamber. May be provided so as to be lower and higher than the pressure in the pipe. That is, the pressure in the first hermetic chamber is P1, the pressure in the space between the pipe and the second hermetic chamber is P2, and the pressure in the pipe is P3.
P2> P1, more preferably P2>P1>
By setting it to P3, it is possible to prevent the evaporant from entering the space between the pipe and the second hermetic chamber from the first hermetic chamber.

The adjustment of the pressure may be performed by supplying a carrier gas to a space between the pipe and the second hermetic chamber. The carrier gas supplied to the space between the pipe and the second hermetic chamber is guided into the pipe through the first hermetic chamber, and is exhausted through the third opening of the pipe. Therefore, the space between the pipe and the second hermetic chamber is sealed from the first hermetic chamber by pressure. Since the space between the pipe and the second hermetic chamber is connected to the space accommodated when the hermetic door is opened, the evaporant from the object to be processed is transferred to the hermetic door, especially its seal portion. Can be prevented from condensing. Further by adopting such a configuration. The fitting margin between the tube and the sleeve is increased. For this reason, it is possible to prevent the tube and the sleeve from engaging with each other and from falling off.

Further, the processing apparatus of the present invention may further include a filter means provided between the second hermetic chamber (or pipe) and the exhaust means. It is preferable to provide at least a wet filter as the filter means. When the first hermetic chamber is depressurized by the exhaust system, and when the evaporant from the object to be treated is to be condensed between the first hermetic chamber and the exhaust system, uncondensed evaporate and condensed solid particles are generated. Inevitably, it reaches the vacuum pump. For this reason, the vacuum pump is damaged and the maintenance frequency is increased. In the treatment apparatus of the present invention, a wet filter that traps fine particles and dust in gas in a liquid such as oil and water is provided at a stage preceding the exhaust system, thereby preventing the fine particles and dust from reaching the vacuum pump. can do. As the wet filter, for example, an oil film filter in which a cloth-like carrier is impregnated with oil can be used. The oil is sucked up into the cloth by capillary action or the like, forming an oil film. Dust and fine particles guided to the exhaust system are trapped in this oil film. Instead of oil, a liquid film of an aqueous solution such as an alkaline solution may be formed to trap acidic substances such as nitrogen oxides and sulfur oxides. A liquid ring pump such as a water ring pump or an oil ring pump may be used as the wet filter. In this case, dust and fine particles are trapped in the liquid sealed by the liquid ring pump.

Of course, a dry filter such as a net or a nonwoven fabric may be provided between the tube, the second hermetic chamber, or these and the vacuum pump. Such a dry filter may be disposed inside the tube or in the second hermetic chamber. However, such a type of filter that traps solids in a dry state, if the rear side is evacuated with a vacuum pump, it is inevitable that some of the trapped dust will pass through. Preferably, it is used.

According to the processing method of the present invention, the object to be processed is heated in an airtight area to thermally decompose the constituents of the object to be processed, and the heat object adjacent to the airtight area with an openable and closable door therebetween. From the treatment system side of the gaseous emission component generated by decomposition, open the hermetic door and insert a pipe so that the hermetic door is shielded from the hermetic region, and remove the gaseous emission from the treatment system side. Introducing to

Further, in the processing method of the present invention, an object to be processed is introduced into an airtight area, a component of the object to be processed is extracted by reducing the pressure in the airtight area, and an airtight door that can be opened and closed with the airtight area. Opening the hermetic door from the processing system side of the extraction component adjacent to the extraction component and inserting a pipe so that the hermetic door is shielded from the airtight region, and introducing the extraction component to the processing system side , Characterized in that.

Further, in the processing method of the present invention, the object to be processed containing the first metal is heated under reduced pressure in the first hermetic region to evaporate the first metal and can be opened and closed with the hermetic region. Inserting a pipe from the second hermetic chamber adjacent to the hermetic door so that the hermetic door is shielded from the first hermetic chamber, cooling the pipe, and condensing the first metal; It is characterized by.

Further, in the treatment apparatus of the present invention, the soil containing the first metal is heated under reduced pressure in the hermetic zone to evaporate the first metal, and sandwiches the hermetic zone with the hermetic door which can be opened and closed. A pipe is inserted from the adjacent second hermetic chamber so that the hermetic door is shielded from the hermetic area, and the pipe is cooled to condense the first metal evaporated from the object to be processed. It is characterized by the following.

Further, in the treatment apparatus of the present invention, the soil containing moisture, organic matter, and the first metal is heated in an airtight region to evaporate the moisture and evaporate or thermally decompose the organic matter. Moisture, the organic substance or the thermal decomposition product of the organic substance, from the treatment system side of the moisture, the organic substance, or the thermal decomposition product of the organic substance connected to the hermetic region via a first hermetic door that can be opened and closed. Opening the first hermetic door, inserting a pipe so that the first hermetic door is shielded from the hermetic region, introducing the pipe into the processing system, evaporating the moisture and the organic matter, and After the thermal decomposition of organic matter, the first metal is evaporated, and the evaporated first metal is evaporated.
The second hermetic door is opened from the side of the second hermetic chamber adjacent to the hermetic area with the second hermetic door openable and closable, and the second hermetic door is shielded from the hermetic area. Wherein the pipe is inserted into the second hermetic chamber and cooled to condense at least the first metal. After evaporating the first metal from the soil, it is preferable to cool the heating residue of the processing apparatus with a substantially organic halide-free cooling gas.

That is, in the treatment method of the present invention, when the object to be treated is heated, depressurized, or the like in the hermetically sealed area, the gaseous effluent including the evaporate from the object to be treated is subjected to temperature, pressure, This is a method of extracting gaseous emissions from the hermetic region while maintaining various conditions such as concentration. For this reason, the present invention employs a door that is disposed at the opening of the hermetic region and that can hermetically seal the hermetic region, and a pipe that is inserted into and removed from the opening of the hermetic region. As described above, in the present invention, when the door is opened to introduce the gaseous effluent from the hermetic zone into the processing system, a pipe is inserted into the opening, and the door at the retracted position in the opened state is opened by the pipe. Shield from gaseous emissions. By employing such a configuration, it is possible to prevent the gaseous emission from condensing or adhering to the airtight door. Further, it is possible to prevent the seal portion of the hermetic door from being damaged by the heat of the gaseous emission, and to maintain the hermeticity of the hermetic door.

Next, an example of a processing apparatus to which the present invention can be applied will be described. The present invention for extracting gaseous emissions from an object to be processed from a hermetic zone to a processing system by using a pipe and an airtight door can be applied to various processing apparatuses described below.

The present invention comprises a processing system for processing an organic substance such as a resin and a processing system for vaporizing and recovering a metal in order to process an object to be processed having a resin and a metal as constituents. Things.

The processing apparatus according to the present invention is a processing apparatus for processing an object to be processed having a resin and a metal as constituents, wherein the temperature and pressure are set so that the resin of the object to be processed is selectively thermally decomposed. And a first airtight region provided with a temperature adjusting unit and a pressure adjusting unit for adjusting the pressure, and are separated from the first airtight region by a partition which can be opened and closed to selectively vaporize metal in the object to be processed. A second hermetic region including a temperature adjusting device and a pressure adjusting device for adjusting the temperature and the pressure, and a second hermetic region connected to the first hermetic region for processing a gas generated by thermal decomposition of the resin. 1 processing system,
A second processing system connected to the second hermetic zone and configured to process metal vaporized from the processing target object.

The first hermetic zone selectively decomposes organic matter such as resin so that metals (excluding mercury) in the object to be treated do not vaporize. In general, when the object to be treated is complicated, the object to be treated may be partially oxidized or reduced or the phase equilibrium may change during the treatment. It is sufficient that (excluding mercury) remains without vaporizing in the object to be treated or in the first hermetic region. Further, a temperature adjusting means and a pressure adjusting means for decomposing organic substances while maintaining the constituent metal of the object to be treated substantially not oxidized may be provided.

As the temperature adjusting means, a heating means and a temperature measuring means may be used. As the heating means,
Various types of convection heating, radiation heating, and the like may be selected as needed, or may be used in combination. For example, resistance heating such as a sheathed heater or a radiant tube may be used, or gas, heavy oil, light oil, or the like may be burned. Further, an induction heating means may be used. Various temperature sensors may be used as the temperature measuring means.

In the first hermetic zone, organic substances such as resins are selectively decomposed under temperature and pressure conditions such that the metal in the object to be treated is not so oxidized or vaporized. ) Or carbonize.

The decomposition product gas of the vaporized resin is the first gas.
Is processed by the processing system. For example, it is recovered, but the decomposition product of the recovered resin may be burned and used as a heating means. As described above, in general, when the object to be treated is complicated and large in volume, the object to be treated may be partially oxidized, reduced, or change its phase equilibrium state during the treatment. possible. For example, when the constituent metal of the object to be processed is mixed into the first processing system for recovering the decomposition products of the resin, it may be separated and recovered in a subsequent step.

As the pressure adjusting means, an exhaust means or a pressurizing means and a pressure measuring means may be used. Various vacuum pumps such as a rotary pump, an oil diffusion pump, and a booster pump may be used as the exhaust means. As the pressurizing means, for example, a gas may be introduced into the system from a gas reservoir. The pressure measuring means may be used in accordance with the degree of vacuum for measuring a Bourdon tube, a Pirani gauge, or the like.

Further, a purge area may be provided adjacent to the first airtight area. The purge area may be provided with a pressure adjusting means such as an exhaust system or a pressurizing system, and a temperature adjusting means for preheating or cooling the object to be treated. Further, a carrier gas introduction system for gas replacement in the system may be provided, and the carrier gas introduction system may also serve as a pressurization system. The object to be processed is introduced into the first hermetic zone from outside the apparatus via the purge zone.

By providing the purge region, the first hermetic region is isolated from the outside of the apparatus when the object to be treated is introduced into the first hermetic region. Further, since the inside of the first hermetic zone is constantly evacuated to maintain the reduced pressure, the load on the vacuum pump is reduced.

Similarly, a purge region may be provided adjacent to the second hermetic region. The object to be processed is the second
From the airtight region through the purge region.

By providing the purge area after the second airtight area, the second airtight area is isolated from the outside of the apparatus when the object to be processed is taken out of the second airtight area.
Therefore, the load on the vacuum pump is reduced because the inside of the second hermetic region is constantly evacuated to maintain the reduced pressure state. Further, the object to be treated can be kept shut from the outside air until the temperature of the heated object to be treated is cooled to a temperature that is not oxidized even under atmospheric pressure.

That is, the purge area functions as a buffer area between the outside of the apparatus and the first and second hermetic areas from the viewpoint of the maintenance of the apparatus and the maintenance of the processing object.

The first hermetic zone and the second hermetic zone of the processing apparatus are separated by a partition which can be opened and closed. This partition keeps the airtightness of each region and the heat insulation of each region. For example, a vacuum door for maintaining airtightness and a heat insulating door for maintaining heat insulation may be used in combination. If the first and second hermetic regions are separated by a partition wall such as a heat insulating door-a vacuum door-a heat insulating door, the airtightness and the heat insulating property of each region are maintained. By arranging the heat insulating door between the vacuum door and the area separated by the vacuum door, the vacuum door can be protected from a thermal load even when a large thermal load is applied to the vacuum door. Can be. In this case, the vacuum door is protected from the heat of the first and second hermetic zones.

Such a partition is naturally formed between the outside of the apparatus and the purge region, between the purge region and the first hermetic region,
The partition is also provided between the second hermetic region and the purge region, but what kind of partition is provided may be designed as needed. For example, when the thermal load of the purge chamber is small, a vacuum door may be provided.

In the first hermetic region into which the object to be treated is introduced, the state of the metal in the object to be treated is maintained, and the temperature and pressure conditions are adjusted so that the resin is decomposed. The temperature and pressure conditions may be set in advance,
The measured values of the temperature and the pressure may be fed back to the heating means, the pressure adjusting means and the like for control. The same applies to the second hermetic zone.

When the pressure in the first hermetic zone is reduced, the oxygen concentration is also reduced and the object to be treated is not rapidly oxidized by heating. Further, a large amount of decomposition product gas is generated from the resin by heating, but generally, the resin hardly generates oxygen even when decomposed. Further, decomposition products of the resin are easily vaporized.

On the other hand, when the pressure is reduced, the thermal conductivity in the hermetic zone decreases. However, if the inside of the first hermetic region is a non-oxidizing atmosphere, the object to be treated is not substantially oxidized even under atmospheric pressure or under pressure. Therefore, if the inside of the first hermetic zone is a non-oxidizing atmosphere, pressurization is possible and the thermal conductivity in the system is improved.

The first processing system is for processing gaseous effluents containing decomposition products of organic substances constituting the object to be processed. Here, the resin may be a synthetic resin or a natural resin, or a mixture thereof.

As the first processing system tail, an oiling device that condenses gas to convert it into oil may be used. When a gas such as a halogen or an organic halide is contained in the decomposition product gas of the resin, the decomposition may be performed using, for example, a catalyst.

As described above, heavy oil or light oil collected in the first treatment system may be used for heating the first or second hermetic zone.

Further, the first processing system may be provided with a plurality of systems, or may be connected in multiple stages.

In the first hermetic zone, the resin component of the object to be treated is almost decomposed, and the decomposition product gas is recovered or made harmless. Therefore, the metal in the object to be processed exists in the object to be processed without being vaporized. On the other hand, most of the resin of the object to be treated exists as carbide. Then, in this state, the object to be processed is transferred from the first hermetic zone to the second hermetic zone.

In the processing apparatus of the present invention, the object to be processed heated in the first hermetic container is cooled by the second object without being cooled.
Is introduced into the hermetic zone. Therefore, the input energy in the second hermetic zone is largely saved, and the heating time is also reduced.

In the second hermetic region into which the object to be processed is introduced, the temperature and pressure conditions are adjusted so that the metal in the object to be processed is vaporized. When the pressure in the second hermetic zone is reduced, the metal in the object to be processed evaporates at a lower temperature than under normal pressure. Further, since the oxygen concentration also decreases and the second hermetic region becomes a non-oxidizing atmosphere, the metal state of the vaporized metal is maintained.

For example, the boiling point of Zn at 760 Torr is 1203 K, while the boiling point at 1 Torr is 743 K.
K, the boiling point at 10 @ -4 Torr is 533K.

For example, 760 Torr (1a) of Pb
tm) is 2017K, but 10 -1 To
The boiling point at rr is 1100K, and the boiling point at 10-3 Torr is 900K.

As described above, the metal is selectively vaporized in the second hermetic zone according to the temperature and pressure conditions.

When introduced into the second hermetic zone,
Since most of the resin of the object to be processed is carbide, even if metal is vaporized from the object to be processed, almost no decomposition product gas is generated. Therefore, the vaporized metal is recovered with high purity in the metal state, and the load on the vacuum pump is reduced.

The second recovery means recovers the metal vaporized in the second hermetic zone.

For example, a recovery chamber having an exhaust system may be connected to the second hermetic region, and the metal vaporized in this chamber may be cooled to a melting point or lower to condense and recover. The inside of the recovery chamber may have, for example, a countercurrent structure or a spiral structure. Alternatively, a valve or an openable / closable partition may be provided between the collection chamber and the second hermetic region and between the collection chamber and the exhaust system. Regardless of whether the vaporized metal is continuously condensed and collected, or whether the vaporized metal is condensed and collected in a batch process, the collection efficiency increases as the residence time of the vaporized metal in the collection chamber increases.

Further, N 2 or a rare gas may be introduced into the second hermetic zone as a carrier gas. The vaporized metal is efficiently introduced into the collection chamber by the carrier gas.

The second collecting means may be provided with a plurality of systems. The same metal may be recovered by a plurality of second recovery means, or the temperature and the pressure in the second hermetic zone are adjusted stepwise to selectively vaporize the plurality of metals, respectively, to thereby obtain a plurality of systems. The second collection means may be switched for collection.

The second collecting means may be connected in multiple stages. Thus, the processing apparatus of the present invention processes an object to be processed having resin and metal as constituent materials. The processing apparatus of the present invention is provided with a first hermetic region for decomposing the constituent resin of the object to be processed, in front of the second hermetic region for vaporizing the constituent metal of the object to be processed,
This enables processing of an object to be processed having a resin and a metal as constituents. The gas generated by decomposition of the resin of the object to be treated, which is generated in a large amount in the hermetic zone, is subjected to processes such as cracking, catalytic reaction, cooling, neutralization, and adsorption in a first processing system connected to the first hermetic zone. You. Therefore, sufficient heating and decompression can be performed so that the metal is vaporized in the second hermetic zone.

In the first hermetic zone, the resin is selectively thermally decomposed under the condition that the metal of the object to be treated is not so oxidized or vaporized. Therefore, the metal is separated and recovered from the object to be treated in a metal state. Is done.

Further, the processing apparatus of the present invention may further include an oxygen concentration adjusting means for adjusting the oxygen concentration in the first hermetic zone. For example, the oxygen concentration in the first hermetic region may be detected, and the temperature, the pressure, and the flow rate of the carrier gas in the first hermetic region may be adjusted according to the detected oxygen concentration.

By providing the oxygen concentration control means, the constituent resin of the object to be treated can be more selectively thermally decomposed. Further, the first hermetic zone may be provided with a temperature control means, a pressure control means, and an oxygen concentration control means for selectively thermally decomposing the resin while keeping the metal from being substantially oxidized. .

A feature of this processing apparatus is that an oxygen concentration adjusting means is provided in the first hermetic zone. With this oxygen concentration adjusting means, the oxygen concentration in the first hermetic zone can be adjusted independently of the total pressure in the first hermetic zone.

By adjusting the oxygen concentration in the first hermetic zone, the degree of freedom of processing in the first hermetic zone increases. For example, the state of the constituent metal of the object to be processed can be maintained without lowering the thermal conductivity in the first hermetic region. Further, the resin can be more actively decomposed under the pressurized condition.

As the oxygen concentration adjusting means, for example, an oxygen concentration sensor as an oxygen concentration measuring means and a carrier gas introduction system may be used.

As the oxygen concentration sensor, for example, a so-called zirconia sensor employing zirconia (zirconium oxide) may be used, or the absorption of CO and CO2 may be measured by infrared spectroscopy. Furthermore, G
C-MS may be used, and may be selected as needed or used in combination.

As the carrier gas, for example, N 2,
A rare gas such as Ar may be used. The carrier gas not only adjusts the oxygen concentration in the first hermetic zone, but also efficiently guides the resin decomposition product gas to the first recovery means. Further, the pressure adjusting means may also be used. Furthermore, not only oxygen but also the concentration of halogen such as chlorine may be detected, and the temperature, pressure, and flow rate of the carrier gas in the first hermetic zone may be adjusted according to the detected chlorine concentration. In this manner, generation and resynthesis of dioxin can be suppressed.

Further, a plurality of second hermetic regions may be provided. In other words, there is provided a processing apparatus for processing an object to be processed having a resin, a first metal, and a second metal as constituents, the temperature adjusting means for selectively thermally decomposing the resin, the pressure adjusting means, and the oxygen concentration. A first hermetic region provided with an adjusting device; a temperature adjusting device and a pressure adjusting device for selectively vaporizing the first metal in the object to be processed, which is separated from the first hermetic region by a partition which can be opened and closed; And a temperature adjusting means and a pressure adjusting means for selectively vaporizing the second metal in the object to be processed, which is separated from the second airtight area by a partition which can be opened and closed. A third gas-tight region, first recovery means for recovering a gas generated by decomposition of the resin connected to the first gas-tight region, and vaporized from the processing object connected to the second gas-tight region A second recovery means for recovering the first metal; Third to recover the second metal vaporized from the connected object to be treated in an airtight region
May be provided.

A feature of this processing apparatus is that a plurality of second hermetic regions are provided. By providing a plurality of second hermetic regions, a plurality of metals contained in the processing target object are selectively vaporized and recovered.

Further, the processing apparatus of the present invention is a processing apparatus for processing an object to be processed having a resin and a metal as constituents, wherein the temperature adjusting means, the pressure adjusting means, the oxygen concentration An airtight container provided with an adjusting means, and disposed to be connected to the airtight container, when the temperature and the oxygen concentration in the airtight container are adjusted so that the resin of the object to be treated is thermally decomposed, A first recovery unit configured to recover a gas generated by the thermal decomposition; and a first collection unit connected to the airtight container and disposed in the airtight container so that the first metal in the object to be processed is selectively vaporized. A second recovery unit configured to recover the vaporized metal from the object to be processed when the temperature and the pressure are adjusted. When the temperature and pressure in the airtight container are adjusted so that the second metal in the object to be processed is selectively vaporized, the second metal vaporized from the object to be processed is disposed so as to be connected to the airtight container. A third collecting means for collecting may be further provided.

The first collecting means is a means for collecting the first object in the object to be processed.
And when the temperature and oxygen concentration in the hermetic container are adjusted so that the resin is selectively thermally decomposed while the second metal is not substantially oxidized, the gas generated by the decomposition of the resin is recovered. You may do so.

This processing apparatus is different from the above-described processing apparatus of the present invention in that it has a plurality of hermetically sealed regions having different conditions such as temperature, pressure, and oxygen concentration conditions in the hermetically sealed container.
This is a processing apparatus provided with a means for changing conditions in one hermetic container and a plurality of recovery means according to conditions in the system.

As the temperature adjusting means in the airtight container, that is, the temperature adjusting means for the object to be processed, a heating means and a temperature sensor may be used in the same manner as in the above-described processing apparatus of the present invention. Regarding heating, various heating means such as convection and radiation may be selected or used in combination as necessary.

As for the pressure adjusting means, the exhaust means, the pressurizing means and the pressure measuring means may be used similarly to the processing apparatus of the present invention described above. Various vacuum pumps such as a rotary pump, an oil diffusion pump, and a booster pump may be used as the exhaust means. As the pressurizing means, for example, a gas may be introduced into the system from a gas reservoir. The pressure measuring means may be used in accordance with the degree of vacuum for measuring a Bourdon tube, a Pirani gauge, or the like.

The oxygen concentration adjusting means may also use an oxygen concentration sensor and a carrier gas introduction system.

The collecting means may be provided similarly to the above-described processing apparatus of the present invention. That is, the first recovery system may include, for example, an oiling device that condenses and recovers the decomposition product gas of the resin. And the oil obtained by this oiling device may be used as a heating means.

As the second and third recovery means, for example, a recovery chamber having an exhaust system is connected to an airtight area, and the vaporized metal is cooled to a melting point or lower and condensed and recovered in this chamber. Is also good. The inside of the recovery chamber may have, for example, a countercurrent structure or a spiral structure. Alternatively, a valve or an openable / closable partition may be provided between the collection chamber and the second hermetic region and between the collection chamber and the exhaust system. That is, when the metal vaporized from the object to be processed is introduced into the recovery chamber, the recovery chamber may be closed and cooled, and the metal may be condensed and recovered.

The processing system of the present invention is a processing system for processing an object to be processed having lead as a constituent material, wherein the airtight container holds the object to be processed and a temperature in the airtight container is adjusted. Temperature adjusting means, pressure adjusting means for adjusting the pressure in the hermetic container, and control means for controlling the temperature adjusting means and the pressure adjusting means such that lead in the object to be treated is selectively vaporized. And a recovery means connected to the airtight container and recovering vaporized lead from the object to be processed. As the collection means, a configuration in which the above-described tube and the airtight door are combined can be adopted.

Further, an airtight container for holding the object to be processed having lead and resin as constituents, a temperature adjusting means for adjusting the temperature in the airtight container, and a pressure adjusting means for adjusting the pressure in the airtight container And maintaining the temperature and pressure in the hermetic container so that the lead in the object to be treated is not substantially vaporized, and controlling the temperature control means and the pressure control means so that the resin is selectively thermally decomposed. A first control means, a second control means for controlling the temperature and pressure in the hermetic container so that lead in the object to be treated is selectively vaporized, and a second control means for controlling the temperature and pressure in the hermetic container. A first recovery means for recovering the gas generated by the decomposition of the resin is connected, and a second recovery means for recovering the vaporized lead from the object to be processed, which is connected to an airtight container,
May be provided.

The processing system of the present invention is a processing system for processing an object to be processed having lead and resin as constituents, wherein an airtight container for holding the object to be processed and a temperature inside the airtight container are provided. Temperature adjusting means for adjusting the
Pressure adjusting means for adjusting the pressure in the airtight container, oxygen concentration adjusting means for adjusting the oxygen concentration in the airtight container,
First control means for controlling the temperature control means and the oxygen concentration control means so that the resin is selectively thermally decomposed; and that the lead in the object to be treated selectively controls the temperature and pressure in the container. Second control means for controlling the temperature control means and the pressure control means so as to be vaporized, and a first recovery means connected to the airtight container and recovering gas generated by thermal decomposition of the resin. Means, and second recovery means connected to the airtight container and recovering vaporized lead from the object to be processed.

The first control means includes a temperature control means for maintaining the temperature and the oxygen concentration in the airtight container so that the lead in the object to be treated is not substantially oxidized and selectively decomposing the resin by thermal decomposition. The oxygen concentration adjusting means may be controlled.

The treatment method of the present invention comprises the steps of introducing an object to be treated having lead as a constituent material into an airtight container, sealing the airtight container, and selectively vaporizing the lead in the object to be treated. The method includes a step of adjusting a temperature and a pressure in the airtight container, and a step of collecting vaporized lead from the object to be processed.

In addition, a step of introducing an object to be treated having lead and resin as constituents and sealing the airtight container is performed, and the temperature and pressure in the airtight container are set so that the resin in the object to be treated is selectively thermally decomposed. A first control step of adjusting the temperature and pressure in the hermetic container so that lead in the object to be treated is selectively vaporized, and a resin generated by thermal decomposition. The method may include a first recovery step of recovering gas and a second recovery step of recovering vaporized lead from the object to be processed.

Further, the treatment method of the present invention comprises the steps of introducing an object to be treated having lead and resin as constituents and sealing the hermetic container, and the hermetic container so that the resin is selectively thermally decomposed. A first control step of adjusting the temperature and the oxygen concentration in the container, and a second control step of adjusting the temperature and the pressure in the hermetic container so that lead in the object to be processed is selectively vaporized.
, A first recovery step of recovering gas generated by thermal decomposition of the resin, and a second recovery step of recovering vaporized lead from the object to be processed.

In the first control step, the temperature and the oxygen concentration in the airtight container are adjusted so that the lead in the object to be treated is not substantially oxidized and the resin is selectively thermally decomposed. You may make it.

The processing system and the processing method of the present invention can separate and recover lead from the object containing lead.

In the first control step, for example, the oxygen concentration in the hermetic container may be adjusted to about 10 vol% or less. By adjusting the oxygen concentration, oxidation of lead is prevented.

In the first control step, for example, the temperature in the airtight container may be adjusted in the range of 323 to 1073K.

In the first control step, for example, the pressure in the airtight container may be adjusted to about 760 to 10 Torr. By adjusting the pressure, lead is vaporized at lower temperatures.

In the second control step, for example, the pressure in the airtight container may be adjusted to about 7.6 × 10 2 to 7.6 × 10 3 Torr. By thermally decomposing the resin selectively under pressure, the thermal decomposition of the resin is promoted.

In the second control step, for example, the temperature in the airtight container may be adjusted in the range of 713 to 2273K.

The basic features of this processing system and method are that the object to be treated is introduced into an airtight container, and the temperature, pressure and oxygen concentration in the airtight container are adjusted to selectively lead in the object to be processed. It is to separate and collect from an object to be processed by vaporization. Further, metals other than lead may be separated and recovered from the object to be processed by controlling the inside of the airtight container under a predetermined temperature and pressure condition such that the metal is selectively vaporized.

When the object to be treated contains lead and resin, first, the object to be treated is heated under conditions such that lead does not vaporize or oxidize, so that the resin portion is selectively formed. It pyrolyzes (gasifies, oils, carbides), selectively vaporizes lead, and recovers the vaporized lead in a metal state. Here, the resin may be a synthetic resin or a natural resin, or a mixture thereof. Generally, a thermoplastic resin can be vaporized and oilized to recover a large portion by heating, but a thermosetting resin has many carbonized and vaporized portions. In any case, the lead can be positively recovered by selectively thermally decomposing the constituent resin of the object to be treated.

For the apparatus part of the processing system, for example, the processing apparatus of the present invention as described above may be used. That is, for example, the conditions such as the temperature, pressure, and oxygen concentration in one hermetic container may be adjusted stepwise to perform selective thermal decomposition of the resin and vaporization of lead. In addition, a plurality of hermetically sealed areas having different conditions such as temperature, pressure, and oxygen concentration are provided, and a partition separating each of the hermetically sealed areas is opened and closed, and the object to be treated is sequentially transferred to selectively heat decomposition of the resin. Alternatively, vaporization of lead may be performed.

As the temperature adjusting means, a heating means and a temperature measuring means may be used. As the heating means, for example, resistance heating such as a sheathed heater may be used, or oil such as heavy oil or light oil may be burned. Further, induction heating may be used. Various thermometers may be used as the temperature measuring means.

By controlling the temperature, pressure and oxygen concentration in the hermetic container, the resin is selectively thermally decomposed under the temperature and pressure conditions under which the lead in the object to be treated is not oxidized or vaporized.
Evaporates (including those that have been vaporized after oiling) or carbonizes. Then, the gas generated by the thermal decomposition of the vaporized resin is recovered by the first recovery means, but the recovered decomposition product of the resin may be burned and used as the heating means.

As the pressure adjusting means, an exhaust means or a pressurizing means and a pressure measuring means may be used. The exhaust means may be provided with various vacuum pumps such as a rotary pump, an oil diffusion pump, and a booster pump as required, for example, the degree of vacuum and the exhaust capacity. As the pressurizing means, for example, a gas may be introduced into the system from a gas reservoir.

Further, a carrier gas may be introduced into the hermetic container, and this carrier gas may be used as a pressurizing means by adjusting, for example, a valve of an exhaust system or an introduction flow rate.

The pressure measuring means may be used according to the degree of vacuum for measuring a Bourdon tube, a Pirani gauge and the like.

The processing system of the present invention may be provided with an oxygen concentration adjusting means for adjusting the oxygen concentration in the hermetic container in addition to the temperature adjusting means and the pressure adjusting means.

By providing the oxygen concentration adjusting means, the oxygen concentration in the airtight container is adjusted independently of the total pressure. By adjusting the oxygen concentration in the hermetic container, the degree of freedom of processing in the hermetic container is increased. For example, the resin can be selectively thermally decomposed without lowering the thermal conductivity in the airtight container. Further, the oxidation and vaporization of the constituent metal of the object to be treated can be suppressed. In particular, when the object to be treated contains a resin as a constituent material, by adjusting the oxygen concentration in the airtight container, the resin can be more effectively and selectively thermally decomposed while substantially maintaining the state of lead. For example, by pressurizing the inside of the airtight container to about 1 to 10 atm in a non-oxidizing atmosphere, the resin can be more positively and selectively thermally decomposed.

As the oxygen concentration adjusting means, for example, an oxygen concentration sensor as an oxygen concentration measuring means and a carrier gas introduction system may be used.

As the oxygen concentration sensor, for example, a so-called zirconia sensor employing zirconia (zirconium oxide) may be used, or the absorption of CO and CO2 may be measured by infrared spectroscopy. Furthermore, G
C-MS may be used, and may be selected as needed or used in combination.

The processing system of the present invention is provided with control means for controlling such temperature control means, pressure control means or oxygen concentration control means. This control means controls the temperature, pressure or oxygen concentration in the airtight container so that the resin is selectively thermally decomposed and the lead in the object to be treated is selectively vaporized. This control means measures the state in the airtight container with the above-described temperature sensor, pressure sensor, oxygen concentration sensor, and the like, and feeds back the measured value to a heating means, an exhaust system, a pressurizing system, a carrier gas introducing system, and the like. The state in the airtight container may be optimized.

Such control is carried out by the operator according to the parameters of the state in the airtight container, by the heating means, the exhaust system,
The pressurizing system and the carrier gas introducing system may be operated.

Further, a signal for operating the heating means, the exhaust system, the pressurizing system, the carrier gas introducing system and the like so as to optimize the conditions in the hermetic container is input to the measured parameters of the state in the hermetic container as input. A control device for output may be provided. This control circuit is a program
The information may be stored in the storage unit of the control device.

The first step in the treatment method of the present invention comprises:
This is a step of heating the object to be treated and selectively thermally decomposing the resin.

Resin such as plastic is 323K (5
0 ° C), melting begins at about 453-873K
(180-600 ° C)
Discharge 16 hydrocarbon gases. The decomposition product gas generated by the selective thermal decomposition of these resins can be recovered as valuable oil by condensing it in, for example, an exhaust gas treatment system.

The selective thermal decomposition of the resin is preferably performed in a state where the oxygen concentration in the container is adjusted. The oxygen concentration may be adjusted by the total pressure in the airtight container,
The adjustment may be performed by introducing a carrier gas such as N2 or Ar.

The oxidation of lead can be prevented by adjusting the oxygen concentration in the airtight container. In addition, by adjusting the oxygen concentration separately from the total pressure, it is possible to prevent the oxidation of lead without lowering the thermal conductivity in the hermetic container, improving the decomposition efficiency of the resin and the recovery efficiency of the decomposition product gas. I do. In some cases, the resin may be selectively thermally decomposed by introducing a carrier gas such as N2 or Ar and pressurizing the inside of the airtight container.

The resin in the object to be treated need not be completely thermally decomposed, but may be decomposed to such an extent that it does not adversely affect the separation and recovery of lead.

It is 2017K that lead (metal) exhibits a vapor pressure of 760 mmHg, whereas lead oxide has a lower 174 mmHg.
It shows a vapor pressure of 760 mmHg at 5K. Therefore, by adjusting the oxygen concentration in the airtight container, it is possible to prevent the metal lead from being oxidized to the lead oxide and to prevent the lead from being scattered, and to more positively collect lead in a later step.

When the resin in the object to be treated is selectively pyrolyzed in this way, the temperature and pressure in the hermetic container are controlled so that lead is selectively vaporized, and the lead is separated from the object to be treated. to recover.

When the object to be treated contains a metal other than lead or the like, lead is selectively vaporized by a difference in vapor pressure.

The temperature at which lead vaporizes changes depending on the pressure in the airtight container. At atmospheric pressure, for example, the vapor pressure of lead when heated to 1673K is 84 mmHg, whereas iron is
The vapor pressure of copper and tin does not reach 1 mmHg.

Therefore, by heating the object to be processed to about 1673 K, almost only lead vapor can be selectively generated from the object to be processed.

At atmospheric pressure, for example, when heated to 2013K, the vapor pressure of lead is 760 mmHg, the vapor pressure of tin is 15 mmHg, and the vapor pressure of copper is 3 mmHg.
g. Therefore, the object to be processed is
By heating to about K, almost only lead vapor can be selectively generated from the object to be treated.

By reducing the pressure in the airtight container, lead in the object to be treated can be vaporized at a lower temperature.

If the pressure in the hermetic container is adjusted to 10 -1 Torr, almost only lead vapor can be selectively generated from the object to be treated by heating to about 1100K.

Further, the pressure in the airtight container is set to 10 -3 Torr.
By adjusting the temperature to about 900 K, almost only lead vapor can be selectively generated from the object to be treated.

Further, the pressure in the airtight container is set to 10 -4 Torr.
If it is adjusted to r, it is possible to selectively generate almost only lead vapor from the object to be treated by heating to about 700K.

The lead vapor thus selectively generated is recovered as metallic lead, for example, by a recovery device cooled to a temperature lower than the melting point of lead.

When the vapor lead is condensed and crystallized and recovered as described above, the lead recovery rate is increased by setting the residence time of the vapor lead in the apparatus to be long. For example, the structure of the recovery device may be a countercurrent structure or a spiral structure.

In addition, N2 or the like is transferred from the airtight container to the recovery device.
By flowing a rare gas such as Ar as a carrier gas, lead vapor can be more selectively recovered.

By continuously performing the step of selectively thermally decomposing the resin and the step of selectively vaporizing the lead, the energy input in the subsequent steps can be greatly suppressed.

That is, since the thermal conductivity of the gas decreases with a decrease in pressure, it is necessary to input more energy as the pressure in the hermetic container is reduced in the step of vaporizing lead. However, in the processing system and the processing method of the present invention, the thermal decomposition step of the resin is also a preheating step of the step of vaporizing lead, so that the energy input in the step of vaporizing lead can be largely saved.

Further, since water and oil in the object to be treated are removed from the object to be treated in the thermal decomposition step of the resin, there is no adverse effect on the step of vaporizing lead.

Further, the processing system of the present invention is a processing system for processing a processing object having a first object and a second object joined by metal, and holds the processing object inside. An airtight container, temperature adjusting means for adjusting the temperature in the airtight container, pressure adjusting means for adjusting the pressure in the airtight container, and the metal joining the first object and the second object is vaporized. And a control unit for controlling the temperature adjustment unit and the pressure adjustment unit.

Further, an airtight container for holding the first object and the second object joined by an alloy containing the first metal and the second metal therein, and a temperature control for adjusting the temperature in the airtight container Means, pressure adjusting means for adjusting the pressure in the airtight container,
Control means for controlling the temperature adjusting means and the pressure adjusting means such that the alloy vaporizes the temperature and the pressure in the airtight container may be provided.

Further, an airtight container holding a first object and a second object each having a resin as a constituent material and joined inside by an alloy comprising a first metal and a second metal, and an airtight container inside the airtight container. Temperature adjusting means for adjusting the temperature of the airtight container, pressure adjusting means for adjusting the pressure in the airtight container, first control means for controlling the temperature adjusting means so that the resin is selectively thermally decomposed, and Second control means for controlling the temperature control means and the pressure control means so that the first metal of the alloy selectively vaporizes the temperature and the pressure; and the second control means for controlling the temperature and the pressure in the hermetic container by the second control of the alloy. A third control means for controlling the temperature control means and the pressure control means so that the metal vaporizes, a first recovery means for recovering a gas generated by the selective thermal decomposition of the resin, and a vaporization from the alloy. And second recovery means for recovering the first metal. Good. Alternatively, the resin may be selectively thermally decomposed while substantially maintaining the oxidation state of the first and second metals.

An airtight container holding a first object and a second object having a resin as a constituent material and joined inside with an alloy made of a first metal and a second metal, and an airtight container inside the airtight container. Temperature adjusting means for adjusting the temperature of the airtight container, pressure adjusting means for adjusting the pressure in the airtight container, and first temperature control means for controlling the temperature adjusting means so that the resin selectively thermally decomposes the temperature and the pressure in the airtight container. Control means for controlling the temperature and pressure control means so that the first metal of the alloy selectively vaporizes the temperature and pressure in the airtight container; and Third control means for controlling the temperature control means and the pressure control means so that the second metal of the alloy vaporizes the temperature and pressure of the alloy, and recovers gas generated by the selective thermal decomposition of the resin. A first recovery means, and a second recovery means for recovering the first metal vaporized from the alloy. It may be and a yield means. Alternatively, the resin may be selectively thermally decomposed while substantially maintaining the oxidation state of the first and second metals.

Further, the processing system of the present invention is a processing object having a first object and a second object, each of which is made of a resin and is joined by an alloy having a first metal and a second metal. A processing system for processing, an airtight container that holds the object to be processed therein, a temperature adjustment unit that adjusts the temperature in the airtight container, and a pressure adjustment unit that adjusts the pressure in the airtight container, Oxygen concentration adjusting means for adjusting the oxygen concentration in the hermetic container, first control means for controlling the temperature adjusting means and the oxygen concentration adjusting means so that the resin is selectively thermally decomposed, and the alloy Second control means for controlling the temperature control means and the pressure control means so that the first metal of the alloy selectively vaporizes, and the temperature control means such that the second metal of the alloy is vaporized. Controlling the pressure adjusting means. A third control unit for recovering a gas generated by the thermal decomposition of the resin, and a second recovery unit for recovering a first metal vaporized from the alloy. It is characterized by.

Further, the first control means maintains the temperature and the oxygen concentration in the hermetic container so that the state of the first metal of the alloy is not substantially oxidized, and the resin is selectively thermally decomposed. Alternatively, the temperature control means and the oxygen concentration control means may be controlled.

For example, Zn, Cd, Hg, Ga, In, T
At least one element of l, Sn, Pb, Sb, Bi, Ag or In may be separated or recovered from the object to be treated as the first metal.

By adjusting the temperature, pressure and oxygen concentration in the hermetic container, other metals can be separated and recovered in the metal state (see FIG. 30).
This applies to all parts of the present invention unless otherwise specified.

The processing method of the present invention is a processing method for processing an object to be processed having a first object and a second object joined by a metal, wherein the object to be processed is introduced into an airtight container. The method further comprises a step of sealing the hermetic container and a step of adjusting the temperature and the pressure in the hermetic container so that the metal is vaporized.

A step of introducing a first object and a second object joined by an alloy having a first metal and a second metal into an airtight container and sealing the airtight container; Adjusting the temperature and the pressure in the airtight container so that the gas is vaporized.

Further, an object to be treated having a first object and a second object having a resin as a constituent material and joined by an alloy having a first metal and a second metal is placed in an airtight container. A step of introducing and sealing the hermetic container, a first step of adjusting the temperature and pressure in the hermetic container so that the resin is selectively thermally decomposed, and a first metal in the alloy is selectively vaporized. A second step of adjusting the temperature and the pressure in the hermetic container so as to perform the heat treatment, a third step of adjusting the temperature and the pressure in the hermetic container so that the second metal in the alloy is vaporized, May be provided with a first recovery step of recovering a gas generated by decomposition of the metal and a second recovery step of recovering a first metal vaporized from the alloy.

In the first step, the temperature and pressure in the hermetic container are controlled so that the resin is selectively thermally decomposed while substantially maintaining the state of the first metal in the alloy. You may.

Further, in the processing method of the present invention, an object to be processed having a first object and a second object having a resin as a constituent and joined by an alloy having a first metal and a second metal. A process of introducing the object to be treated into an airtight container and sealing the airtight container, and the temperature and oxygen concentration in the airtight container so that the resin is selectively thermally decomposed. A first control step of adjusting the temperature and pressure in the hermetic container such that the first metal in the alloy is selectively vaporized; and a second control step of adjusting the second metal of the alloy. A third control step of adjusting the temperature and pressure in the hermetic container so that the metal vaporizes, a first recovery step of recovering a gas generated by thermal decomposition of the resin, and vaporization of the alloy. And a second recovery step of recovering the first metal. And butterflies.

In the first control step, the temperature and oxygen concentration in the hermetic container are maintained so that the first and second metals of the alloy are not substantially oxidized and the resin is selectively thermally decomposed. May be adjusted.

In addition, a circuit board having a resin as a constituent material and an electronic component joined with an alloy having a first metal and a second metal are introduced into an airtight container. A step of sealing the airtight container, a first control step of adjusting the temperature and the oxygen concentration in the airtight container so that the resin is selectively thermally decomposed, and a step of selectively controlling the first metal in the alloy. A second control step of adjusting the temperature and pressure in the hermetic container so as to evaporate, and a third control step of adjusting the temperature and pressure in the hermetic container so that the second metal in the alloy evaporates And a first recovery step of recovering a gas generated by the selective thermal decomposition of the resin, and a second recovery step of recovering the first metal vaporized from the alloy.
The first control step is to substantially maintain the state of the first and second metals of the alloy and to adjust the temperature and the oxygen concentration in the hermetic container so that the resin is selectively thermally decomposed. Is also good.

The processing system of the present invention can release the bonding of the processing object bonded by the metal or the alloy. Further, the processing method of the present invention can release the bonding of the processing object bonded with the metal or the alloy.

The basic concept of the processing system and the processing method of the present invention is to introduce an object to be processed into an airtight container, adjust the temperature, pressure, oxygen concentration, etc. in the airtight container and join them. The bonding is released by evaporating the metal or alloy that is present. The vaporized metal may be recovered by condensation or the like.

In the case where the object to be treated has a resin as a constituent material, first, the resin portion is selectively thermally decomposed to vaporize,
Oil and carbonize. The selective thermal decomposition of the resin may be performed by adjusting the temperature, pressure, or oxygen concentration in the airtight container to a condition such that the metal does not oxidize or vaporize much. That is, the oxidation state of the constituent metal of the object to be treated,
The resin may be thermally decomposed while maintaining the phase equilibrium state as much as possible.

Next, the temperature and pressure in the hermetic container are adjusted to selectively vaporize the bonding metal in the object to be treated. When a plurality of metals (elements) are contained in the object to be treated,
The temperature and pressure in the hermetic container may be adjusted according to each metal so that each metal is selectively vaporized.

The processing unit of the processing system may use the above-described processing unit of the present invention. That is, for example, the temperature in one airtight container, pressure, selective thermal decomposition of the resin by adjusting the conditions such as oxygen concentration step by step,
The vaporization of lead may be performed. Also, temperature, pressure,
Arrange multiple airtight areas with different conditions such as oxygen concentration,
Selective thermal decomposition of the resin and vaporization of lead may be performed by sequentially opening and closing the partition that separates between the hermetic regions and sequentially transferring the object to be treated.

The temperature control means, pressure control means, oxygen concentration control means, control means, resin recovery means, metal recovery means and the like are the same as described above.

The object to be processed by the processing system and the processing method of the present invention is, for example, a mounting board in which a printed board and various electronic components are joined by a solder alloy such as Pb-Sn, and an electronic device having such a mounting board. A device or the like can be given as an example.

If the object to be processed is joined with a metal or an alloy other than the mounting substrate, the joining can be released.

For example, the mounting substrate is introduced into the processing apparatus of the present invention, the oxygen concentration is adjusted to heat the resin to a temperature at which the resin is not so oxidized (for example, about 473 K), and then the pressure in the airtight container is reduced to adjust the oxygen concentration. And further heated to a temperature at which lead does not oxidize or evaporate (for example,
(About 23 to 773K) to thermally decompose the constituent resin of the mounting board, and further heat it to a temperature higher than the boiling point of lead (for example, about 900K at 10-3 Torr) to vaporize lead, and vaporize tin in the same manner. The board may be separated into an electronic component and a circuit board (the board on which the electronic component is mounted is referred to as a circuit board in this case) and collected.

Even if a metal such as lead is vaporized during the selective thermal decomposition of the resin, a means for separating the metal may be provided in the recovery system. This is common for all of the present invention.

Further, for example, the mounting substrate is introduced into the processing apparatus of the present invention, and the oxygen concentration is adjusted to heat the resin to a temperature at which the resin is not so oxidized (for example, about 473 K). And then heated to a temperature at which lead does not substantially oxidize or vaporize (for example, 10-3
(Torr: about 523 to 773K) to thermally decompose the constituent resin of the mounting substrate, and further heat to, for example, about 973K to vaporize and collect Zn, Sb, and the like.

Further, for example, by heating to about 1773K, Au, Pt, Pd, Ta, Ni, Cr, Cu, A
l, Co, W, Mo, etc. may be vaporized and collected.

The solder alloy is not limited to Pb-Sn. For example, Ag-Sn, Zn-Sn, In-Sn, Bi
A so-called Pb-free solder such as -Sn, Sn-Ag-Bi, Sn-Ag-Bi-Cu or the like may be used. In addition, it may be joined by an alloy other than these or a simple metal.

The object to be processed may contain resin as a constituent material. The resin may be a thermoplastic resin or a thermosetting resin, or a mixture thereof.

When the object to be treated contains a resin as a constituent material, the resin portion may be selectively thermally decomposed (vaporized, oiled, carbonized, etc.) as described above. The gas or the like generated by the selective thermal decomposition may be condensed and recovered in, for example, an exhaust gas treatment system. Decomposition products of the recovered resin such as light oil and heavy oil may be used for heating the object to be treated. The selective thermal decomposition of the resin component does not need to be performed completely, but may be performed so long as it does not hinder the separation and recovery of the joining metal. Also,
As described above, even if a part of the joint metal is vaporized, the recovery system may be provided with means for separating and recovering the vaporized metal.

Resin such as plastic starts melting at about 323K, and thermally decomposes at about 453 to 873K to mainly emit hydrocarbon gases such as C1 to C8 and C8 to C16. The decomposition product gas generated by the selective thermal decomposition of these resins can be recovered as valuable oil by condensing it in, for example, an exhaust gas treatment system. Generally, the resin constituting the circuit board is often a thermosetting resin,
Many components are carbonized and vaporized.

The selective thermal decomposition of the resin is preferably performed in a state where the oxygen concentration in the container is adjusted. The oxygen concentration may be adjusted by the total pressure in the airtight container,
The adjustment may be performed by introducing a carrier gas such as N2 or Ar.

By adjusting the oxygen concentration in the hermetic container, it is possible to prevent, for example, oxidation of a joint metal such as lead or tin. In addition, by adjusting the oxygen concentration separately from the total pressure, it is possible to prevent oxidation of metal without lowering the thermal conductivity in the hermetic container, improving the decomposition efficiency of resin and the recovery efficiency of decomposition product gas. I do. In some cases, N2, A
The resin may be selectively thermally decomposed by introducing a carrier gas such as r and pressurizing the inside of the airtight container. The resin in the object to be treated does not need to be completely thermally decomposed, but may be decomposed to such an extent that it does not adversely affect the separation and recovery of the metal.

For example, the temperature at which metal lead exhibits a vapor pressure of 760 mmHg is 2017K, but that of lead oxide is lower than 17K.
Shows a vapor pressure of 760 mmHg at 45K. Therefore, by adjusting the oxygen concentration in the airtight container, the oxidation of the metal to the oxide can be suppressed, and the metal can be more positively recovered in the subsequent step. Further, by recovering as metal, the utility value is increased. If the resin is thermally decomposed while substantially maintaining the state of the lead in the object to be treated, the temperature and pressure in the hermetic container are controlled so that the lead is selectively vaporized, and the lead is removed from the object to be treated. Separate and collect from inside.

Even when a metal other than lead is contained in the object to be treated, lead is selectively vaporized by a difference in vapor pressure.

For example, the temperature at which lead vaporizes changes depending on the pressure in the airtight container. At atmospheric pressure, for example, 1673K
The vapor pressure of lead when heated to 84 mmHg is 84 mmHg, whereas the vapor pressure of iron, copper and tin does not reach 1 mmHg.
Therefore, by heating the object to be processed to about 1673K, almost only lead vapor can be selectively generated from the object to be processed.

At atmospheric pressure, for example, when heated to 2013K, the vapor pressure of lead is 760 mmHg, the vapor pressure of tin is 15 mmHg, and the vapor pressure of copper is 3 mmHg.
g. Therefore, the object to be processed is
By heating to about K, almost only lead vapor can be selectively generated from the object to be treated.

Further, by reducing the pressure in the airtight container, lead in the object to be treated can be vaporized at a lower temperature.

When the pressure in the airtight container is adjusted to 10 -1 Torr, almost only lead vapor can be selectively generated from the object to be treated by heating to about 1100K.

The pressure in the airtight container is set to 10 -3 Torr.
By heating to about 900 K, almost only lead vapor can be selectively generated from the object to be treated.

Further, the pressure in the airtight container was set to 10 -4 Torr.
If it is adjusted to r, almost only lead vapor can be selectively generated from the object to be treated by heating to about 700K.

The lead vapor thus selectively generated is recovered as metallic lead, for example, by a recovery device cooled to a temperature lower than the melting point of lead.

When the vapor lead is condensed and crystallized and recovered as described above, the lead recovery rate is increased by setting a longer residence time of the vapor lead in the apparatus. For example, the structure of the recovery device may be a countercurrent structure or a spiral structure.

Further, N2 or the like is transferred from the airtight container to the recovery device.
By flowing a rare gas such as Ar as a carrier gas, lead vapor can be more selectively recovered.

By continuously performing the step of thermally decomposing the resin and the step of selectively vaporizing lead, the energy input in the subsequent steps can be largely suppressed.

That is, since the thermal conductivity of the gas decreases as the pressure decreases, it is necessary to input more energy as the pressure in the hermetic container is reduced in the step of vaporizing lead. However, in the processing system and the processing method of the present invention, the thermal decomposition step of the resin is also a preheating step of the step of vaporizing lead, so that the energy input in the step of vaporizing lead can be largely saved.

Further, since the water and oil in the object to be treated are removed from the object to be treated in the selective pyrolysis step of the resin, it does not adversely affect the step of vaporizing lead.

The processing system of the present invention is a processing system for processing an object to be processed in which a resin and a metal are integrated, wherein an airtight container holding the object to be processed and a temperature in the airtight container are controlled. A temperature adjusting means for adjusting, a pressure adjusting means for adjusting a pressure in the airtight container, and controlling the temperature adjusting means and the pressure adjusting means in the airtight container so that the resin is selectively thermally decomposed. And control means.

Further, the control means for controlling the temperature adjusting means and the pressure adjusting means in the airtight container is provided for controlling the temperature in the airtight container so as to substantially maintain the state of the metal and selectively thermally decompose the resin. The means and the pressure adjusting means may be controlled.

Further, the processing system of the present invention comprises an airtight container for holding therein an object to be processed in which resin and metal are integrated, a temperature adjusting means for adjusting the temperature in the airtight container, and an oxygen concentration in the airtight container. Control means for controlling the temperature control means and the oxygen concentration control means in the hermetic container so that the resin is selectively thermally decomposed while substantially maintaining the state of the metal. You may make it. During the selective thermal decomposition of the resin, the temperature, pressure, or oxygen concentration may be adjusted to maintain the state of the constituent metals as much as possible.

The processing system of the present invention is a processing system for processing an object to be processed in which a resin and a metal are integrated, wherein an airtight container holding the object to be processed and a temperature in the airtight container are controlled. Temperature adjusting means for adjusting, pressure adjusting means for adjusting the pressure in the airtight container, oxygen concentration adjusting means for adjusting the oxygen concentration in the airtight container, and the airtightness so that the resin is selectively thermally decomposed. A control means for controlling the temperature adjusting means, the pressure adjusting means and the oxygen concentration adjusting means in the container is provided.

The control means controls the temperature control means, the pressure control means, and the oxygen concentration control means in the airtight container so as to substantially maintain the state of the metal and selectively thermally decompose the resin. It may be.

In addition, the processing system of the present invention includes an airtight container for holding a processing object in which resin, a first metal, and a second metal are integrated, and a temperature control for adjusting the temperature in the airtight container. Means, pressure adjusting means for adjusting the pressure in the airtight container, oxygen concentration adjusting means for adjusting the oxygen concentration in the airtight container, temperature adjusting means in the airtight container so that the resin is selectively thermally decomposed, and oxygen. Control means for controlling the concentration control means, second control means for controlling the temperature control means and the pressure control means so that the first metal is selectively vaporized, and the first metal vaporized from the object to be processed And a collecting means for collecting the data. The control means includes first and second
The temperature control means and the oxygen concentration control means in the hermetic container may be controlled such that the metal state is substantially maintained and the resin is selectively thermally decomposed.

Further, the treatment method of the present invention comprises the steps of introducing an object to be treated in which a resin and a metal are integrated into an airtight container, and controlling the temperature in the airtight container so that the resin is selectively thermally decomposed. Adjusting the oxygen concentration.

Further, the temperature and the oxygen concentration in the hermetic container may be adjusted so that the state of the metal is substantially maintained and the resin is selectively thermally decomposed. Further, the processing system of the present invention includes a step of introducing an object to be processed in which a resin and a metal are integrated into an airtight container, and adjusting a temperature and a pressure in the airtight container so that the resin is selectively thermally decomposed. May be performed.

Further, the treatment method of the present invention includes a step of introducing an object to be treated in which a resin and a metal are laminated in an airtight container, and a method of controlling the temperature in the airtight container so that the resin is selectively thermally decomposed. The method includes a step of adjusting the oxygen concentration and a step of adjusting the temperature and the pressure in the airtight container so that the metal of the object to be processed is melted and the surface area is reduced.

The temperature and oxygen concentration in the hermetic container may be adjusted so that the metal is not substantially oxidized and the resin is selectively thermally decomposed.

Further, the treatment method of the present invention includes a step of introducing an object to be treated in which a resin and copper are laminated in an airtight container, and a step of substantially maintaining the state of copper and selectively pyrolyzing the resin. And adjusting the temperature and the pressure in the airtight container so that the surface of the object to be treated is reduced while melting the copper. You may.

Further, in the treatment method of the present invention, the step of introducing the object to be treated in which the resin and the metal are integrated into the hermetic container, the step of substantially maintaining the state of the metal and selectively thermally decomposing the resin. Thus, a step of adjusting the temperature, the pressure, and the oxygen concentration in the hermetic container may be provided.

Further, in the processing method of the present invention, a step of introducing an object to be processed in which a resin, a first metal and a second metal are integrated into an airtight container, and a step of selectively thermally decomposing the resin. First, a temperature and an oxygen concentration in the hermetic container are adjusted.
Controlling the temperature and pressure in the hermetic container so that the first metal is selectively vaporized; and recovering the vaporized first metal from the object to be processed. And a step of performing

The first control step includes the first and second control steps.
The temperature and the oxygen concentration in the hermetic container may be adjusted so that the metal is not substantially oxidized and the resin is selectively thermally decomposed.

[0200] Such a processing system of the present invention is a system capable of processing an object to be processed having resin and metal as constituents. Further, such a processing method of the present invention is a method capable of processing an object to be processed having a resin and a metal as components.

That is, the basic idea of such a processing system or processing method of the present invention is as follows. An object to be processed having a resin and a metal as constituents is introduced into an airtight container, and a resin portion is first selectively selected. Decomposes thermally, vaporizes, oils and carbonizes. The selective thermal decomposition of the resin may be performed by adjusting the temperature, pressure, or oxygen concentration in the airtight container to a condition such that the metal is not oxidized or vaporized.

If it is still difficult to separate the metal from the object to be processed by this operation alone, the temperature and pressure in the airtight container are adjusted to selectively vaporize the metal in the object to be processed. When a plurality of metals (elements) are contained in the object to be treated, the temperature and pressure in the hermetic container may be adjusted in accordance with each metal to selectively vaporize each metal. As for the apparatus, for example, the processing apparatus of the present invention as described above may be used.

The object to be processed by the processing system or the processing method of the present invention can process not only an object having resin and metal but also an object having resin and metal integrated.

Examples of the object to be treated having such a resin and a metal include, for example, an aluminum foil laminated with a plastic film such as a packaging container for a retort food, a syringe, and a resin and a metal such as copper and nickel. Printed board, flexible board or T
AB film carriers, ICs, LSIs, resistors, and the like can be given as examples. Further, for example, the waste from which lead has been removed by the treatment system or treatment method of the present invention may be used as a treatment target object.

Further, in the processing system or the processing method of the present invention, the object to be processed which has been released from the joining by the metal or alloy may be used as the object to be processed. For example, the mounting substrate may be separated into the substrate and the electronic component by the processing system or the processing method of the present invention, and the substrate and the component may each be processed. Further, for example, each aspect of the processing apparatus, processing system, or processing method of the present invention may be combined.

In order to selectively thermally decompose the organic matter of the object to be treated, or to selectively thermally decompose the organic matter while minimizing oxidation and vaporization of the constituent metals as a whole, for example, The pressure in the airtight container may be controlled to heat the object to be processed,
The object to be treated may be heated by controlling the oxygen concentration in the airtight container.

To control the oxygen concentration, the partial pressure of oxygen may be adjusted by adjusting the total pressure in the hermetic container, or a gas such as nitrogen gas or a rare gas may be introduced into the hermetic container. Alternatively, the oxygen concentration in the system may be adjusted.
It should be noted that if the oxidation of the resin portion proceeds rapidly due to the heating of the object to be treated, that is, if the resin portion burns, the metal portion integrated with the resin portion is also oxidized and becomes an oxide, which lowers the utility value. Further, when heating the object to be treated, when the pressure in the airtight container is reduced, the thermal conductivity decreases and the temperature raising efficiency decreases, so that the resin is heated to a predetermined temperature, then reduced in pressure, and further heated. You may.

Further, the inside of the hermetic container is heated and pressurized in a non-oxidizing atmosphere to a temperature at which the oxidized state of the metal is maintained, whereby the thermal conductivity is increased, the temperature raising efficiency is improved and the oxidized state is maintained. After heating to such a temperature, the pressure may be reduced and heating may be further performed. By heating under pressure, the recovery rate of the decomposition component of the resin having a relatively small molecular weight is increased.

In the case where the metal portion is composed of a plurality of metals, it may be further heated and selectively evaporated for each element to recover.

The decomposition product gas of the resin of the object to be treated may be condensed and collected, or may be collected, for example, in an exhaust gas treatment system. Also, for example, 1000
You may make it condense after reforming and pyrolysis at high temperature of more than ° C. By cooling from a high temperature of 1000 ° C. or higher to a normal temperature, generation of dioxin can be suppressed.

[0211] Further, the hydrogen gas may be recovered by adsorbing or the like, and when a halogenated hydrocarbon or the like is generated, it may be decomposed using a catalyst or the like.

When the resin contains halogen such as a polyvinyl chloride resin, first, the resin is heated to normal temperature within a range where the oxidation state of the constituent metals of the waste is maintained to generate a halogen gas. You may. The generated halogen gas may be brought into contact with, for example, iron heated to a high temperature and recovered as iron halide, or may be reacted with ammonia and recovered as ammonium halide.

[0213] These gases generated by heating the waste may be treated by a multi-gas treatment system.

As an example of the treatment, for example, regarding the treatment of an aluminum foil laminated with a plastic film used for various packaging containers and the like (hereinafter referred to as “resin-coated aluminum foil”), if the temperature is less than 673K, the carbonization / oiling of the resin portion is performed. Thermal decomposition is insufficient. Also, 9
When heated to 23K or more, aluminum melts, so by heating at a temperature of 673 to 923K,
The resin portion is selectively thermally decomposed (vaporized, oiled, carbonized), and the aluminum foil is recovered in a metallic state.

It is more preferable to reduce the pressure in the airtight container to about 10 −2 Torr or less, or to adjust the oxygen concentration by introducing a gas such as N 2 Ar and heat. It is more preferable that the heating temperature be 823 to 873K.

Further, the waste treatment system of the present invention comprises: an airtight container for holding therein a waste in which resin and copper are integrated; a temperature adjusting means for adjusting the temperature in the airtight container; A control means for controlling the temperature in the airtight container so as not to oxidize and selectively thermally decompose the resin.

Further, the waste treatment system of the present invention comprises: an airtight container for holding therein a waste in which resin and copper are integrated; a temperature adjusting means for adjusting the temperature in the airtight container; Oxygen concentration adjusting means for adjusting the oxygen concentration, and control means for controlling the temperature and the oxygen concentration in the hermetic container so as to maintain copper substantially not oxidized and selectively thermally decompose the resin. It is characterized by having.

If the temperature is less than 673K, thermal decomposition such as carbonization and oilification of the resin portion is insufficient. By heating at a temperature of 673 to 923 K, the resin is vaporized and oilized and carbonized, and copper can be recovered in a metal state.

It is more preferable to reduce the pressure in the hermetic container to about 10 −2 Torr or less, or to control the oxygen concentration by introducing a gas such as N 2 Ar and heating. It is more preferable that the heating temperature be 823 to 873K.

[0220] A further object of the present invention is to provide a processing apparatus and a processing method for processing an object containing a metal and a resin such as shredder dust while suppressing generation of dioxin.

Further, according to the present invention, an object such as a circuit board on which electronic parts and the like are mounted is separated from the electronic parts and the circuit board while suppressing the generation of dioxin, and harmful metals such as lead and metals such as copper are separated. An object of the present invention is to provide a processing apparatus and a processing method for separating and collecting.

In order to solve such a problem, the processing apparatus of the present invention comprises a first pyrolyzing means for pyrolyzing an object containing a resin and a metal at a first temperature, A reforming means connected to the reforming means for reforming a gaseous effluent generated from the object at a second temperature at which dioxin is decomposed; Cooling means for cooling the gaseous effluent to a third temperature so that an increase in dioxin concentration in the gaseous effluent reformed at a temperature of It is characterized by comprising a reduced-pressure heating means for heating the residue under reduced pressure so that the metal contained in the residue is vaporized, and a condensing means for condensing the vaporized metal from the residue.

The processing apparatus of the present invention is provided with a first pyrolyzing means for pyrolyzing an object containing a resin and a metal at a first temperature, and is provided in connection with the pyrolyzing means. A second pyrolysis means for pyrolyzing the generated gaseous effluent at a second temperature higher than the first temperature; and a second pyrolysis means connected to the pyrolysis means and pyrolyzed at the second temperature. As the increase in dioxin concentration in the gaseous emission is suppressed,
Cooling means for cooling the gaseous emission to a third temperature; decompression heating means for heating a residue generated by thermal decomposition of the object under reduced pressure so that metals contained in the residue are vaporized; A condensing means for condensing the vaporized metal from the residue.

[0224] Further, the processing apparatus of the present invention comprises a first pyrolysis means for pyrolyzing an object containing a resin, a first metal and a second metal at a first temperature, and a first pyrolysis means. A reforming means disposed in connection with the gaseous effluent generated from the object at a second temperature at which dioxin is decomposed;
The gaseous effluent is connected to the reforming means, and the gaseous effluent is reformed at a second temperature so that an increase in dioxin concentration in the gaseous effluent is suppressed to a third temperature. A cooling means for cooling; and a first reduced pressure heating for heating the residue generated by the thermal decomposition of the object under reduced pressure so that the first metal contained in the residue is vaporized and the second metal is retained. Means connected to the first decompression and heating means for condensing the first metal vaporized from the residue; and second means contained in the residue vaporized from the first metal.
And a second reduced pressure heating means for heating under reduced pressure so that the metal is melted.

Further, the second reduced pressure heating means of the processing apparatus of the present invention is provided under reduced pressure so that the second metal contained in the residue obtained by vaporizing the first metal is melted and aggregated by its surface tension. May be used for heating.

Further, the processing apparatus of the present invention has a resin and a metal as a part of a constituent material, and holds an object having a first portion and a second portion joined by a joint metal while holding the joint metal. A pyrolyzing means for performing pyrolysis by means of a pyrolysis means, and a reforming means arranged to be connected to the pyrolyzing means and reforming a gaseous effluent generated from the object at a second temperature at which dioxin is decomposed, Cooling means disposed in connection with the reforming means, for cooling the gaseous effluent to a third temperature so that an increase in dioxin concentration in the reformed gaseous effluent is suppressed; And a decompression heating means for heating a residue generated by thermal decomposition of the object under reduced pressure so that the bonding metal is vaporized.

The thermal decomposition means of the processing apparatus of the present invention may be performed in a non-oxidizing atmosphere or a reducing atmosphere by controlling the oxygen concentration. The cooling means may cool the temperature up to the third temperature in as short a time as possible, preferably within about 10 seconds.

[0228] The processing apparatus of the present invention may further include a neutralizing means disposed to be connected to the cooling means and neutralizing the cooled gaseous effluent.

The treatment method of the present invention comprises a first pyrolysis step of pyrolyzing an object containing a resin and a metal at a first temperature, and a method of decomposing gaseous effluents generated from the object by dioxin. A reforming step of reforming at a suitable second temperature and a cooling step of cooling the gaseous effluent to a third temperature so as to suppress an increase in dioxin concentration in the reformed gaseous effluent And a decompression heating step of heating the residue generated by the thermal decomposition of the object under reduced pressure so that the metal contained in the residue is vaporized, and a condensing step of condensing the vaporized metal from the residue. It is characterized by.

[0230] The treatment method of the present invention comprises a first pyrolysis step of pyrolyzing an object containing a resin and a metal at a first temperature, and a gaseous effluent generated from the object at a first temperature. A second pyrolysis step of pyrolyzing at a high second temperature;
A cooling step of cooling the gaseous effluent to a third temperature such that an increase in dioxin concentration in the gaseous effluent pyrolyzed at a temperature of It is characterized by comprising a reduced-pressure heating means for heating the residue under reduced pressure so that the metal contained in the residue is vaporized, and a condensing means for condensing the vaporized metal from the residue.

The processing method of the present invention comprises a first pyrolysis step of pyrolyzing an object containing a resin, a first metal and a second metal at a first temperature, and a gaseous discharge generated from the object. A reforming step of reforming a substance at a second temperature at which dioxin is decomposed, and the gas so as to suppress an increase in dioxin concentration in the gaseous effluent reformed at the second temperature. Cooling means for cooling the state discharge to a third temperature, and decompression of a residue generated by thermal decomposition of the object so that the first metal contained in the residue is vaporized and the second metal is retained. A first heating step under reduced pressure, a condensing step of condensing the first metal vaporized from the residue,
And a second reduced pressure heating step of heating under reduced pressure so that the second metal contained in the residue obtained by vaporizing the metal is melted.

In the treatment method of the present invention, in the second reduced pressure heating step, the second metal contained in the residue obtained by vaporizing the first metal is melted and reduced under reduced pressure so as to aggregate by its surface tension. It is characterized by heating.

[0233] The treatment method of the present invention comprises an object having a resin and a metal as a part of a constituent material, and having a first portion and a second portion joined by a joining metal. A pyrolysis step of decomposing, a reforming step of reforming a gaseous effluent generated from the object at a second temperature such that dioxin decomposes, and a dioxin concentration in the reformed gaseous effluent. A cooling step of cooling the gaseous emission to a third temperature so that the increase is suppressed, and a reduced pressure of heating a residue generated by thermal decomposition of the object under reduced pressure so that the bonding metal is vaporized. And a heating step.

The treatment method of the present invention may further include a neutralization step of neutralizing the gaseous effluent cooled by the cooling means.

The thermal decomposition step may be performed in a non-oxidizing atmosphere or a reducing atmosphere by controlling the oxygen concentration. In addition, it is preferable that the cooling step is performed within about 10 seconds, if possible, to a third temperature as short as possible. Further, it is preferable that the first temperature is set at about 250 to about 500C. Also, the second temperature is at least above 800 ° C., more preferably at least above 1000 ° C., even more preferably 1200 ° C.
It is preferable to set the temperature to a higher temperature. In addition, the third temperature is preferably set to a temperature lower than at least 150 ° C., more preferably a temperature lower than at least 100 ° C., and further preferably a temperature lower than 35 ° C.

The gaseous effluent discharged from the object to be treated is reformed and thermally decomposed at such a high temperature that dioxin is decomposed, and the residence time in a temperature range in which dioxin is generated and resynthesized from this state. As short as possible,
By cooling to a third temperature at which dioxin is not generated and resynthesized, the concentration of dioxin in the gaseous effluent is greatly reduced. Further, by performing the first pyrolysis, the second pyrolysis or the reforming in two stages of the first temperature and the second temperature and simultaneously performing them in a reducing atmosphere,
The source concentration of dioxin is greatly reduced.

Here, the second temperature is a temperature at which dioxin is decomposed, and not only dioxin but also other compounds contained in gaseous emission are decomposed.
Therefore, in the present invention, not only dioxins but also halogenated hydrocarbons, PCBs, coplanar PCBs and the like can be decomposed and made harmless.

That is, according to the present invention, in order to treat an object having a resin and a metal as constituents, means for decomposing the resin, means for further thermally decomposing gaseous effluent generated from the object to be treated, It is provided with a cooling means for cooling the gas so that dioxin is not synthesized, and a means for vaporizing or liquefying the metal from the pyrolysis residue under reduced pressure to recover the gas. Here, the resin may be a synthetic resin or a natural resin, or a mixture thereof. The term “metal” as used herein is a generic term for metals contained in an object to be treated, unless otherwise specified, and is not limited to a specific metal element.

[0239] The first thermal decomposition means thermally decomposes the object to be treated at a first temperature under which the object is thermally decomposed under the control of the oxygen concentration. For example, gaseous discharge from shredder dust, waste circuit board, etc. Extract things. Here, the gaseous emission basically consists of an exhaust gas, but does not exclude the case where the exhaust gas contains solid fine particles, liquid fine particles, and the like mixed therein.

As the temperature adjusting means for adjusting the first temperature of the first thermal decomposition means, a heating means and a temperature measuring means may be used. As the heating means, various types of convection heating, radiant heating, and the like may be selected as necessary or used in combination. For example, resistance heating such as a sheathed heater may be used, or gas, heavy oil, light oil, or the like may be burned outside the chamber.
Furthermore, the gas discharged from the resin or the like of the object to be treated is reformed, made harmless, and neutralized, and then reused as a fuel gas as a heat source of the first thermal decomposition means and the processing apparatus of the present invention. It may be. Further, for example, the clean fuel gas obtained as described above is introduced into a gas turbine generator and converted into electric power, and this electric power is used to operate the first thermal decomposition means and other processing apparatuses of the present invention. It may be.

As the temperature measuring means, various temperature sensors may be used. The first temperature may be set so that the resin of the object to be treated is thermally decomposed and the metal of the object to be treated is not oxidized as much as possible. To cut off, it is preferred to keep the first pyrolysis means in reducing conditions. For example, by thermally decomposing an aromatic hydrocarbon compound containing chlorine under reducing conditions, chlorine in the aromatic hydrocarbon compound is decomposed into HCl or the like. Therefore, generation of dioxin is suppressed.

In the present invention, polychlorinated dibenzoparadioxin (Polychloro) is used unless otherwise specified.
ripped dibenzo-p-dioxin
s: PCCDs), polychlorinated dibenzofurans (Pol
ychlorinated dibenzofuran
s: PCDFs) and their homologs having different chlorine numbers and substitution positions are collectively referred to as dioxins. It also includes compounds in which chlorine is replaced by another halogen.

Accordingly, the first thermal decomposition means is preferably maintained in a reducing atmosphere so that the metal contained in the object to be treated is not substantially oxidized. It is preferable to provide

Generally, when the object to be processed is complicated,
During the treatment, the object to be treated may be partially oxidized, but the first thermal decomposition means may be kept in a reducing atmosphere as a whole. As the oxygen concentration adjusting means, for example, an oxygen concentration sensor as an oxygen concentration measuring means and a carrier gas introduction system may be used.

As the oxygen concentration sensor, for example, a so-called zirconia sensor employing zirconia (zirconium oxide) may be used, or the absorption of CO and CO2 may be measured by infrared spectroscopy. Furthermore, G
C-MS may be used, and may be selected as needed or used in combination.

A rare gas such as Ar may be used as the carrier gas. The carrier gas not only controls the oxygen concentration in the first pyrolysis means but also guides the gas to the reforming means or the second pyrolysis means efficiently. Further, the pressure adjusting means may also be used.

Further, a shredder may be provided in a stage preceding the first thermal decomposition means. The object to be treated brought in from the outside of the apparatus may be crushed and separated by a shredder and then introduced into the first pyrolysis means, or may be introduced into the first pyrolysis means without crushing. Good.
When the object to be processed is a waste circuit board, it is preferable that the object is introduced into the first pyrolysis means without being crushed.

In the first pyrolysis means into which the object to be treated is introduced, the state of the metal in the object to be treated is not oxidized as much as possible, and the amount of chlorine bonded to the organic compound during the thermal decomposition of the resin is as small as possible. Temperature and oxygen concentration conditions may be adjusted so that The temperature and the oxygen concentration conditions may be set in advance, or the measured values of the temperature and the oxygen concentration may be fed back to the heating means, the oxygen concentration adjusting means and the like for control. When it is necessary to measure the oxygen concentration, for example, a zirconia sensor may be used.

The pressure in the chamber of the first pyrolysis means may be controlled. For example, when the pressure in the first thermal decomposition means is reduced, the oxygen concentration also decreases and the object to be treated is not rapidly oxidized by heating. Further, a large amount of decomposition product gas is generated from the resin by heating, but generally, the resin hardly generates oxygen even when decomposed. Further, decomposition products of the resin are easily vaporized.

On the other hand, when the pressure is reduced, the thermal conductivity in the hermetic zone decreases. However, if the inside of the first pyrolysis means is a non-oxidizing atmosphere, the object to be treated is not oxidized even under atmospheric pressure or under pressure. Therefore, if the inside of the first thermal decomposition means is a non-oxidizing atmosphere, pressurization is possible and the thermal conductivity in the system is improved.

Here, a gaseous emission processing system for processing the gaseous emission discharged from the object to be processed will be described.

The gaseous emission treatment system is for treating the gaseous emission discharged from the object to be treated by the first thermal decomposition means, and is provided from the reforming means or the second thermal decomposition means and the cooling means. Its main part is configured. The gaseous effluent treated by the cooling means is used as a clean fuel gas by performing post-treatments such as neutralization, filtration and washing as required.

The reforming means is provided to be connected to the first heating means, and converts the gaseous effluent discharged from the object to be treated in the first pyrolysis means into a first gas having a temperature higher than the first temperature. At a temperature of 2. Here, reforming refers to changing a hydrocarbon compound contained in a gaseous effluent discharged from the object to be treated to lower molecular hydrogen, methane, carbon monoxide or the like. In addition, hydrorefining treatment (hyd
(reforming) may be performed. Reforming while maintaining the inside of the system under reducing conditions is also suitable from the viewpoint of cutting off the source of dioxin as described above. If the inside of the reforming unit is kept in a reducing atmosphere, a small amount of air may be introduced into the reforming unit. The reforming means may include not only the thermal reforming means but also a catalytic reforming means using, for example, a catalyst. As the catalyst, for example, various ceramics, a solid acid such as silica / alumina or zeolite (aluminosilicate) may be used by supporting a metal such as Pt, Re, Ni and V.

Further, in place of the reforming means, a second pyrolysis means connected to the first pyrolysis means for pyrolyzing the gaseous effluent in a reducing atmosphere may be provided.

By separating the reforming means and the second thermal decomposition means from the first thermal decomposition means, the second thermal decomposition means which is higher than the first temperature can be used.
At this temperature, the gaseous emission from the object to be treated can be treated, and the reformation of the gaseous emission and the mineralization of chlorine are effectively performed.

It is desirable that the reforming means or the second thermal decomposition means maintain conditions under which dioxin derived directly or indirectly from the object to be treated is decomposed as much as possible. For example, by setting the second temperature to about 800 ° C., considerable dioxin can be decomposed. Further, the second temperature is set to 1000 ° C. or more, more preferably 120 ° C.
By setting the temperature at 0 ° C. or higher, dioxin can be more effectively decomposed. Since this reforming means is performed at a second temperature at which dioxin is decomposed,
At this second temperature, thermal decomposition of the gaseous effluent will also occur simultaneously.

The hydrocarbon-based compound contained in the gaseous effluent discharged from the object to be treated is reduced by being reformed by the reforming means and thermally decomposed by the second pyrolysis means. It is molecularized and changes to hydrogen, methane, carbon monoxide, etc. When the gaseous emission contains dioxin, most of the dioxin is decomposed.
Further, the organic chlorine is mineralized, and the resynthesis of dioxin is suppressed.

[0258] The reforming means or the second pyrolysis means is provided with, for example, a gaseous effluent from the first pyrolysis means and a small amount of air into a chamber filled with coke, thereby reducing Atmosphere and a temperature condition under which dioxin is decomposed may be formed.

Further, as described above, the chamber is heated to a temperature at which dioxin is decomposed by burning the fuel gas and air, and gaseous emission from the first pyrolysis means is introduced into this chamber. You may do so.

Further, a catalytic cracking means such as a catalyst as described above may be provided in the chamber.

Further, if necessary, the reforming means or the second
May be provided with a temperature adjusting means for adjusting the temperature and oxygen concentration in the system and an oxygen concentration measuring means. As the oxygen concentration adjusting means, an oxygen concentration sensor and a carrier gas introduction system as described above may be used. Further, a hydrogen gas reservoir may be connected, or an inert gas reservoir such as Ar may be connected.

The gaseous effluent contained in the gaseous effluent discharged from the object to be treated is reduced in molecular weight by the reforming means or the second thermal decomposition means, and hydrogen, methane,
Changes to carbon monoxide and the like. The first thermal decomposition means, the reforming means or the second thermal decomposition means, and the cooling means require equipment because gaseous effluent contains chlorine and the like. In this case, the corrosion of containers and pipes by chlorine gas is severe. Depending on the situation, Hastelloy or a titanium alloy may be used instead of stainless steel.

In the treatment apparatus of the present invention, the gaseous effluent reformed or thermally decomposed at the second temperature is disposed in connection with the reforming means or the second pyrolysis means, Cooling means for cooling to a third temperature is provided so that an increase in dioxin concentration in the effluent is suppressed.

That is, in the reforming means or the second pyrolysis means, the dioxin concentration in the gaseous effluent reformed or pyrolyzed at the second temperature is such that the second temperature is such that the dioxin is decomposed. The temperature is extremely low because the halogen of the hydrocarbon compound which is decomposed or reformed at this temperature is made inorganic by the reducing atmosphere. Therefore, in order to prevent the generation and re-synthesis of dioxin from this state, the gas is cooled to the third temperature so that the increase in dioxin concentration in the gaseous emission is suppressed as much as possible. The third temperature may be set to a temperature that does not cause a dioxin generation reaction.

For example, from a gaseous effluent in which dioxin is decomposed (the temperature may not be the same as the temperature in the reforming means or the second thermal decomposition means, but may be any temperature at which dioxin is decomposed) to 150 ° C. Below, preferably 1
By cooling to not more than 00 ° C, more preferably not more than 50 ° C, generation and resynthesis of dioxin are suppressed. At this time, it is preferable to cool the gaseous emission to the third temperature in the shortest possible time. This is about 200 ° C to about 40
At 0 ° C., dioxin is easily generated and resynthesized, and the gaseous effluent is cooled to the third temperature to shorten the time for which dioxin stays in a temperature range where dioxin is easily generated and resynthesized, so that it is more effective. The dioxin concentration in the gaseous effluent can be reduced.

Therefore, the gaseous emission in the cooling means is preferably rapidly cooled within about 10 seconds.

As such a cooling means, contact cooling may be performed by directly injecting a coolant such as water or cooling oil into the gaseous emission. At this time, if an alkaline powder such as lime powder is injected into the gaseous emission, the gaseous emission is neutralized. Also, for example, HCl in gaseous emissions
Is diffused on the solid surface in contact with the lime powder, so that the production and resynthesis of dioxin can be suppressed.

As described above, the first thermal decomposition means, the reforming means or the second thermal decomposition means, and the cooling means convert gaseous emissions from the object to be treated into hydrogen, methane, carbon monoxide, and the like. Also, the dioxin concentration in the gaseous effluent is greatly reduced.

In the present invention, the decomposition of the object to be treated and the decomposition of the gaseous effluent from the object to be treated are performed in a plurality of stages of a first thermal decomposition means, a reforming means or a second thermal decomposition means. By maintaining such a decomposition means under reducing conditions, the generation of dioxin is suppressed.

When the gaseous effluent cooled by the cooling means contains a halide, SOx, NOx, etc., the gaseous effluent is washed and desulfurized by washing means, desulfurizing means and the like. You may. Further, a filter means using activated carbon may be provided.

[0271] The gaseous effluent cooled by the cooling means may be introduced into a neutralization reaction filtration means such as a bag filter. Between the cooling means and the neutralization reaction filtration means, slaked lime, a filter aid (eg, particles having a high porosity such as zeolite and activated carbon) and the like may be blown into the gas stream of the gaseous emission by a dry venturi or the like. .

The gaseous effluent discharged from the object to be treated thus treated may be used as a heat source for heating the first pyrolyzing means, or supplied to a gas turbine generator to generate electric power. It may be obtained. Further, this electric power may be used as a heat source or the like of the processing apparatus of the present invention.

Next, the processing of the pyrolysis residue of the object to be processed pyrolyzed by the first pyrolysis means will be described.

The processing apparatus of the present invention comprises a means for decomposing and recovering the resin and a means for separating and recovering the metal in order to process an object having a resin and a metal as a part of the constituent material. The reduced-pressure heating means is means for separating and collecting metal from the residue of the object to be treated thermally decomposed by the first thermal decomposition means. Such processing may be performed by the processing apparatus of the present invention including a pipe and an airtight door.

The resin component of the object to be treated is almost decomposed by the first thermal decomposition means, and the gaseous emission is treated as described above. Further, the oxygen concentration in the first thermal decomposition means is controlled, and the metal in the object to be treated is held on the object to be treated without being substantially oxidized and almost not being vaporized. On the other hand, most of the resin of the object to be treated remains as carbide as a result of thermal decomposition. In the present invention, the first
The object to be processed, which has been processed by the thermal decomposition means, is transferred from the first thermal decomposition means to the reduced pressure heating means.

[0276] The reduced-pressure heating means provided in the processing apparatus of the present invention is provided with a temperature control means and a pressure control means for selectively vaporizing a metal in an object separated by the first pyrolyzing means and an openable / closable partition. A first hermetic zone, and first collecting means for collecting vaporized metal from an object connected to the first hermetic zone. As such a collecting means, a configuration in which an airtight door and a pipe are combined as described above may be adopted.

[0277]

(Embodiment 1) FIG. 1 is a perspective view schematically showing an example of a processing apparatus of the present invention. The inside is shown with a part cut away.

The processing apparatus 100 is capable of processing an object 150 to be processed having a resin and a metal as constituents, and includes a purge chamber 101 and a first hermetic chamber 10.
2, a second hermetic chamber 103 and a cooling chamber 104.

Each of these rooms is a door 10 which is a partition which can be opened and closed.
Separated by five. That is, the outside of the apparatus and the purge chamber 101 are separated by the door 105a, the purge chamber 101 and the first hermetic chamber 102 are separated by the door 105b, and the first hermetic chamber 102 and the second hermetic chamber 103 are separated by the door 105c. The second hermetic chamber 103 and the cooling chamber 104 are separated from each other by a door 105d, and the cooling chamber 104 and the outside of the apparatus are separated from each other by a door 105e.

The door 105 separating these chambers has airtightness and heat insulation, and separates the chambers thermally and pressure. Since the thermal load applied to the doors 105a and 105b is small, it is sufficient that airtightness can be maintained.

An exhaust system 106 is connected to the purge chamber 101. The exhaust system 106 includes an oil diffusion pump 106a,
Booster pump 106b, rotary pump 106c
It has. Between the purge chamber 101 and the exhaust system 106,
Valves (not shown) are provided between the respective vacuum pumps. This is the same even if not particularly described below.

The object 1 to be treated is placed between the purge chamber 101 and the exhaust system 106 due to the reduced pressure in the purge chamber 101 or the like.
A trap 107 for removing moisture, hydrogen gas, and the like discharged from 50 is provided. Therefore, even if moisture, hydrogen gas, and the like are discharged from the processing target object 150 in the purge chamber, the exhaust system 106 is not adversely affected. The trap 107 may be provided as needed. Further, when treating an object to be treated such as soil containing an organic halide such as dioxin, incineration fly ash, etc., an exhaust gas treatment system capable of decomposing or trapping dioxin as described later is provided instead of a trap. What should I do? As a trap, a wet filter such as an oil film filter, a liquid ring pump, or the like may be used.

[0283] The pressure in the purge chamber 101 is
6 and a vacuum gauge as a pressure sensor (not shown). As a vacuum gauge, a Bourdon tube, a Pirani gauge and the like may be used as necessary.

[0284] The purge chamber 101 is
A carrier gas introduction system for gas replacement inside is connected, and 108 is a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown). Here, N2 is used as the carrier gas, but a rare gas such as Ar may be used.

A heating means may be provided in the purge chamber 101 to preheat the object 150 to be processed.

The pressure in the purge chamber 101 and the pressure in the first hermetic chamber 102 are made substantially equal, and the door 105 b is opened to push the pusher 130.
Moves the processing target object 150 to the first hermetic chamber 102. Hereinafter, even if not particularly described, the door 105 may be opened and closed by balancing the pressure on both sides. When a plurality of airtight chambers are provided, the chambers may be arranged in an L-shape in order to transport an object to be processed.

[0287] The first hermetic chamber 102 is
This is a processing chamber for selectively thermally decomposing the constituent resin while maintaining the oxidation state of the constituent metal of No. 0.

The first hermetic chamber 102 has an electric heater 109 as a heating means. Here, a radiant tube is used as the heating means, but the heating means is not limited to such an electric heater 109, and may be selected or combined as needed. For example, gas, oil, or the like may be burned, or dielectric heating may be performed. Further, gas or oil, which is a thermal decomposition product of the constituent resin of the object 150 to be treated, may be burned.

The temperature in the first hermetic chamber 102 is adjusted by the electric heater 109, a temperature sensor (not shown), and a control means (not shown) for controlling the electric heater based on measured values from the temperature sensor. The control means may be, for example, a computer in which a program for inputting a measured value or a measured voltage from a temperature sensor and for outputting a signal or voltage for changing the power supplied to the electric heater is used. Good.

[0290] Such control may be performed by an analog circuit, or an operator may operate the heating means in accordance with the measured temperature.

In the processing apparatus illustrated in FIG.
The temperature inside the hermetic chamber 102 is equal to the temperature of the first hermetic chamber 10 described later.
2 along with the pressure and oxygen concentration in the purge chamber 10
The conditions in the first and second hermetic chambers 103 and the cooling chamber 104, the opening and closing of the partition 105, and the transfer of the processing object 150 are integrally controlled by control means (not shown).
This control means may be implemented by mounting a control program in an electronic computer, for example.

An exhaust system 110 is also connected to the first hermetic chamber 102. The configuration of this exhaust system is the same as that of the exhaust system 110 of the purge chamber 101.

The pressure in the first hermetic chamber 102 is adjusted by the exhaust system 110 and a vacuum gauge which is a pressure sensor (not shown). As the vacuum gauge, a Bourdon tube, a Pirani gauge, or the like may be used as necessary, as described above. A carrier gas introduction system for adjusting the oxygen concentration in this chamber is connected to the first hermetic chamber 102,
112 is a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown).

Although N2 is used as the carrier gas here, a rare gas such as Ar, for example, or air may be used.

Exhaust system 110 and carrier gas introduction valve 112
By appropriately operating the first airtight chamber,
Or it can be pressurized. The pressure adjusting means of this apparatus can adjust the pressure in the system from about 10 @ -3 Torr to about 4.times.10@3 Torr. The pressure may be further reduced by changing the capacity and capacity of the exhaust system. Further, the pressure may be further increased by pre-pressurizing the carrier gas.

The oxygen concentration in the first hermetic chamber 102 is adjusted by a carrier gas introduction valve 112 and an oxygen concentration sensor (not shown). For example, a zirconia sensor may be used as the oxygen concentration sensor. When the temperature in the first hermetic chamber 102 is low for the zirconia sensor,
For example, the gas extracted from the inside of the first hermetic chamber 102 is 773
You may make it measure by adjusting to about K.

In addition to the zirconia sensor, for example, the oxygen concentration may be measured by infrared spectroscopy of the gas in the system.

The oxygen concentration in the first hermetic chamber 102 may be adjusted by the total pressure in the system instead of introducing a carrier gas such as N2.

When the thermal decomposition of the constituent resin of the object 150 to be processed starts, the atmosphere of the gas generated by decomposition of the resin in the first hermetic chamber 102 becomes dominant. Therefore, if the inside of the first hermetic chamber 102 is decompressed and the oxygen concentration is sufficiently reduced before the thermal decomposition of the resin is started, combustion of the object 150 to be treated and oxidation of constituent metals of the object 150 are prevented. be able to.

As described above, the pressure and the oxygen concentration in the first hermetic chamber 102 may be controlled in the same manner as the temperature. For example, a computer is provided with a program that receives a measured value or a measured voltage from a pressure sensor or an oxygen concentration sensor as an input, and outputs a signal or voltage for controlling a valve of the exhaust system 110 and a carrier gas introduction valve 112 as an electronic computer. It may be used.

An exhaust gas treatment system 111 is disposed between the first hermetic chamber 102 and the exhaust system 110 for treating a gaseous effluent containing a gas produced by decomposition of the constituent resin of the object 150 to be treated. . First airtight chamber 102 and exhaust gas treatment system 1
11 is separated from the airtight door 111b which can be opened and closed. When the airtight door 111b is opened, the retort 111c is inserted from the exhaust gas treatment system 111 side. At this time, the hermetic door 111b is shielded from the first hermetic chamber 102, and the first hermetic chamber 102 and the exhaust gas treatment system 111 are air-tightly communicated by the retort 111c. By employing such a configuration, in the processing apparatus of the present invention, it is possible to prevent the gaseous emission from adhering to the hermetic door 111b. In addition, the airtight door 1 is heated by heat from the first airtight chamber 102.
The seal portion 11b is shielded. For this reason, the seal portion of the airtight door is protected, and the airtightness can be improved.

In the exhaust gas treatment system, the exhaust gas is detoxified and valuable substances are collected by condensing the exhaust gas, decomposing it by a catalyst or plasma glow discharge, or adsorbing it with an adsorbent. For example, the gas generated by the selective thermal decomposition of the object 150 to be treated by the exhaust gas treatment system may be condensed and recovered as oil such as light oil or heavy oil or tar. The oil recovered as described above may be used as the heating means.

When the decomposition product gas of the constituent resin of the object 150 contains a gas such as a halogen or an organic halide, it may be decomposed by using, for example, a catalyst or plasma.

In order to prevent harmful gas discharged from the object 150 to be processed from leaking out of the apparatus, a multi-exhaust gas chamber (not shown) is provided after the exhaust systems 106, 110, 114, and 115 connected to the respective chambers. Is also good.

The temperature, pressure and oxygen concentration in the first hermetic chamber 102 are controlled as described above. Accordingly, the constituent resin can be selectively thermally decomposed without substantially oxidizing or vaporizing the constituent metal of the processing target object 150. The gaseous emission generated by the thermal decomposition of the constituent resin is treated by an exhaust gas treatment system 111. It is not necessary to completely carbonize the constituent resin of the object to be treated in the first hermetic chamber 102, and if it can be selectively pyrolyzed to such an extent that it does not hinder the separation and recovery of the metal in the second hermetic chamber 103 at the subsequent stage. Good.

At the end of processing in the first hermetic chamber 102,
Most of the constituent resin remaining on the processing target object 150 exists as carbide.

In the processing apparatus 100 of the present invention, the object 150 heated in the first hermetic chamber 102 is transferred to the second hermetic chamber 103 without cooling, so that the heat efficiency is very high.

[0308] The second hermetic chamber 103 contains the object 15 to be treated.
This is a processing chamber for selectively vaporizing and collecting the constituent metal 0 from the processing target object 150.

The second hermetic chamber 103 is provided with the same electric heater 109 as the first hermetic chamber as a heating means. The heating means is not limited to the electric heater 109, and may be selected or combined as needed.

As described above, the temperature in the second hermetic chamber 103 is controlled by the electric heater 113 and a temperature sensor (not shown) in the same manner as in the first hermetic chamber 102. That is, the temperature in the second hermetic chamber 103 is determined by the pressure, the oxygen concentration, and the like in the second hermetic chamber 103, the various conditions of the purge chamber 101, the first hermetic chamber 102, the cooling chamber 104, and the partition 105. Is controlled by a control means (not shown) in an integrated manner.

[0311] An exhaust system 114 is also connected to the second hermetic chamber 103. The configuration of the exhaust system is similar to that of the exhaust system 114 of the purge chamber 101.

The pressure in the second hermetic chamber 103 is adjusted by the exhaust system 114 and a vacuum gauge (not shown) which is a pressure sensor. As the vacuum gauge, a Bourdon tube, a Pirani gauge, or the like may be used as necessary, as described above. A carrier gas introduction system for adjusting the oxygen concentration in this chamber is connected to the second hermetic chamber 103,
112 is a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown). Here, N2 is used as the carrier gas.
For example, a rare gas such as Ar may be used.

The exhaust system 114 and the carrier gas introduction valve 112
By appropriately operating the first airtight chamber,
Or it can be pressurized. In this device, 10-3T
The pressure in the system can be adjusted from orr to about 4.times.10@3 Torr. The pressure may be further reduced by changing the capacity and capacity of the exhaust system. Further, the pressure may be further increased by pre-pressurizing the carrier gas.

[0314] Since the vapor pressure (boiling point) of the constituent metal of the object 150 to be treated decreases with the decompression in the second hermetic chamber 103, the metal can be vaporized at a lower temperature.

Therefore, the capacity of the heating means and the exhaust means provided in the second hermetic chamber 103 may be changed according to the type of metal to be separated and recovered from the processing object 150.

For example, a dielectric heating means may be provided to heat the inside of the second hermetic chamber 103 to a higher temperature. Further, for example, a vacuum pump having a higher capacity and a larger displacement may be provided to reduce the pressure in the second hermetic chamber 103 to a higher vacuum. Second airtight room 103
Depending on the internal capacity, a higher vacuum may be obtained by using an ion getter pump, a turbo molecular pump, or the like.

[0317] The oxygen concentration in the second hermetic chamber 103 is sufficiently low without any special adjustment because the pressure in the system is sufficiently reduced. Therefore, there is no need to actively adjust,
When an oxygen concentration adjusting means is provided, the first airtight chamber 10
What is necessary is just to carry out similarly to 2.

The processing apparatus 100 shown in FIG.
Although the configuration in which one airtight chamber 103 is provided is exemplified, a plurality of second airtight chambers 103 may be provided. By providing the plurality of second hermetic chambers 103 having different internal temperature and pressure conditions, a plurality of metals having different vapor pressures can be vaporized and collected from the processing target object 150.

When it is not necessary to separate and collect metals from the object 150 to be processed, the metal may be vaporized and recovered from the object 150. For example, when removing the Pb-Sn alloy from the object to be treated, the Pb and Sn are heated to a temperature at which Pb and Sn are vaporized by the pressure in the second hermetic chamber 103, and Pb and Sn are removed.
May be collected. Of course, Pb and Sn may be selectively vaporized and collected as another fraction.

[0320] A collection chamber 115 is provided between the second hermetic chamber 103 and the exhaust system 114 for collecting vaporized metal from the object 150 to be processed.
The recovery chamber cools and condenses the metal vaporized in the chamber to a temperature lower than the melting point and recovers the metal. Second
The airtight chamber 103 and the collection chamber 115 are separated by an airtight door 115b that can be opened and closed. This airtight door 11
When 5b is opened, a retort (or pipe) 115c is inserted from the collection chamber 115 side. At this time,
The hermetic door 115b is shielded from the second hermetic chamber 103 and the collecting chamber 115, and the second hermetic chamber 103 and the collecting chamber 115 are air-tightly communicated by a retort 115c. By adopting such a configuration, in the processing apparatus of the present invention, it is possible to prevent the evaporation from the processing target object from condensing and adhering to the airtight door 115b. Further, the sealing portion of the airtight door 115b is shielded from heat from the second airtight chamber 103. Therefore, the sealing portion of the airtight door 115b is protected, and the airtightness can be improved.

Also, the retort 115c is removed from the collection chamber 11
By retreating to the fifth side and closing the airtight jumper 115b, the collection chamber 115 can be separated from the second airtight chamber 103. In this state, the retort 115c can be replaced by opening the collection chamber 115 from the outside. Therefore, in the processing apparatus of the present invention, the second hermetic chamber 1
The condensate once evaporated from the object to be treated can be taken out while keeping the conditions such as the temperature and pressure in 03. For this reason, the continuous operation of the processing apparatus becomes possible, and the productivity of the processing is greatly improved. The configuration of the collection chamber will be described in detail separately.

The inside of the retort 115c disposed in the collection chamber 115 may have a countercurrent structure or a spiral structure. Regardless of whether the vaporized metal is continuously condensed and collected, or whether the vaporized metal is condensed and collected in a batch process, the collection efficiency increases as the residence time of the vaporized metal in the collection chamber 115 increases. Recovery chamber 115 and exhaust system 11
4 and a valve that can be opened and closed, retort 115c
A filter may be provided to capture the evaporant and condensate that could not be collected in the above.

Further, N 2 or a rare gas may be introduced into the second hermetic chamber 103 as a carrier gas. The vaporized metal is efficiently introduced into the collection chamber by the carrier gas.

The collection chamber 115 is provided in the second hermetic chamber 10.
3 may be provided with a plurality of systems. The same metal may be collected in a plurality of collection chambers 115,
A plurality of metals may be selectively vaporized by adjusting the temperature and pressure in the second hermetic chamber 103 in a stepwise manner, and the plurality of collection chambers 115 may be switched to be collected.

The temperature, pressure and oxygen concentration in the second hermetic chamber 103 are controlled as described above. Therefore, the constituent metals of the processing target object 150 are vaporized according to the vapor pressure thereof,
The metal can be collected in the collection chamber 115.

The object 15 to be processed in the first hermetic chamber
Depending on the degree of thermal decomposition of the constituent resin of No. 0, the constituent resin may discharge decomposition product gas and the like. Such a decomposition product gas may be treated by connecting the latter stage of the recovery chamber 115 to the exhaust gas treatment system exhaust gas treatment system 111 or a multi-exhaust gas chamber (not shown).

As described above, in the second hermetic chamber 103, a predetermined metal can be vaporized and recovered from the object to be processed.

[0328] The object 15 to be processed is
If 0 is directly taken out of the apparatus 100, the object 150 to be processed may be rapidly oxidized. Further, the inside of the second hermetic chamber 103 must be returned to the atmospheric pressure.
It is also inconvenient from the viewpoint of maintaining the airtightness in the area 03. For this purpose, the processing apparatus 100 illustrated in FIG. 1 includes a cooling chamber 104 after the second hermetic chamber 103.

This cooling chamber has the same pressure adjusting means as the purge chamber 101, the first hermetic chamber 102, and the second hermetic chamber 103, and oxygen concentration adjusting means. That is, an exhaust system 116 similar to that described above and a carrier gas introduction valve 117 are provided.

The object to be treated 150 from which the predetermined metal has been separated in the second hermetic chamber 103 is transferred to the cooling chamber 104 and cooled in a state where the pressure and the oxygen concentration are adjusted. The carrier gas is used not only for adjusting the oxygen concentration but also for the object 15 to be treated.
It also functions as 0 cooling gas.

[0331] A trap 118 may be provided between the cooling chamber 104 and the exhaust system 116 for removing gas or the like discharged from the object to be processed by preheating.

When the object 150 is sufficiently cooled in the cooling chamber 104, it is taken out of the apparatus.

[0333] Such a processing apparatus of the present invention can be used to treat an object which may generate an organic halide such as dioxins, or an object containing an organic halide (eg, soil, incineration fly ash). It works effectively even when processing. This is because the heat treatment of the object to be treated is performed under reduced pressure, so that the partial pressure of an organic halide or a component having an ability to generate an organic halide in an atmosphere gas coexisting with the object to be treated is suppressed to an extremely small value. It is. By cooling the heated residue of the object to be treated in such a gas substantially free of organic halides and having no organic halide generating ability, the concentration of dioxins contained in the finally discharged residue is reduced. can do. The introduction and removal of the processing target object 150 into and from the processing apparatus 100 and the transfer of the processing target object 150 between the chambers are performed by the pusher 130 and the drawer 131.
What should be done is:

The pusher 130 and the drawer 131
This operation may be performed by the above-described control unit (not shown) together with the opening and closing of the partition wall 105.

FIG. 2 is a diagram schematically showing the processing apparatus of the present invention exemplified in FIG. The pressure sensor 202a in the purge chamber 101, the first airtight chamber 10 not shown in FIG.
Signals from the temperature sensor 201a, the pressure sensor 202b, the oxygen concentration sensor 203, the temperature sensor 201c, the pressure sensor 202c in the second hermetic chamber 103, and the pressure sensor 202d in the cooling chamber 104 constitute control means. It is transmitted to the board 200. The control means may be configured by mounting a program on an electronic computer. Then, the control means may control the heating means, the pressure adjusting means, and the oxygen concentration adjusting means in accordance with the state of each room in the apparatus. Opening and closing of the partition 105, the pusher 13
0, the transfer of the processing object 150 by the drawer 131 may be performed by this control means. 210 denotes the state of each room such as temperature, pressure, oxygen concentration, etc .;
This is a monitor that indicates to the operator the open / closed state of the device. Also 21
Reference numeral 1 denotes a multiple exhaust gas treatment device.

(Embodiment 2) FIG. 3 is a diagram schematically showing another example of the processing apparatus of the present invention. The inside is shown with a part cut away. The processing apparatus 300 can also process a processing target object 350 having resin and metal as constituent materials.

The processing apparatus 300 includes a purge chamber 301, an airtight chamber 302, and a cooling chamber 303. The hermetic chamber 302 has the functions of the first hermetic chamber 102 and the second hermetic chamber 103 of the processing apparatus 100 illustrated in FIG. That is, first, the constituent resin of the processing object 350 is selectively thermally decomposed in the hermetic chamber 302, and then the metal is separated and recovered in the same hermetic chamber 302. In particular, when the desired metal is isolated by the selective thermal decomposition of the resin, it is not necessary to vaporize the constituent metal of the processing object 350.

Although the hermetic chamber 302 is provided with a temperature adjusting means, a pressure adjusting means and an oxygen concentration adjusting means, the oxygen concentration may be adjusted by the total pressure in the hermetic chamber 302 as described above. .

The temperature inside the hermetic chamber 302 may be adjusted by the electric heater 309 and a temperature sensor (not shown).

The pressure in the airtight chamber 302 is adjusted by the exhaust system 31.
0, 314, a carrier gas introduction system, and a pressure sensor (not shown). 312 is a carrier gas introduction valve.

[0341] Between the airtight chamber 302 and the exhaust system 310,
An exhaust gas treatment system 311 for treating a gaseous effluent containing a decomposition product gas of the constituent resin of the treatment target object 350 is provided.

A collection chamber 315 for condensing the constituent metal gas vaporized from the object 350 to be processed is disposed between the airtight chamber 302 and the exhaust system 314. The configuration of the recovery chamber 315 is the same as described above. If it is not necessary to vaporize the constituent metal of the object to be treated, a plurality of exhaust gas treatment systems 311 may be provided.

The purge chamber 301, the cooling chamber 303, the partition 30
5, the carrier gas introduction system, the pusher 330, and the drawer 331 are the same as those of the processing apparatus 100 illustrated in FIG. The control means may be provided in the same manner.

As described above, the processing apparatus of the present invention basically comprises a portion that selectively thermally decomposes the constituent resin of the object to be treated so as not to oxidize the constituent metal as much as possible. By combining this part with a configuration in which constituent metals are vaporized from the object to be treated and separated and recovered, the category of the object that can be treated is greatly expanded.

For example, in the treatment of a resin-coated aluminum foil or the like, aluminum can be recovered in a metal state by selectively thermally decomposing a resin portion in a controlled atmosphere.

The processing of a mounting board or the like having an electronic component mounted on a substrate may be performed by vaporizing and collecting a solder alloy and separating the substrate and the electronic component.

(Embodiment 3) FIG. 4 is a view schematically showing another example of the processing apparatus of the present invention.

[0348] The processing apparatus 400 includes a first hermetic chamber 401.
And a second hermetic chamber 402. First airtight room 4
Reference numeral 01 denotes a temperature control unit (not shown),
03 and an exhaust gas treatment system 404. The second hermetic chamber is provided with a temperature control means (not shown),
05 and the collection chamber 406. Further, a carrier gas introduction system 407 is connected to the first hermetic chamber 401 and the second hermetic chamber 402 so that the oxygen concentration in the hermetic chamber can be adjusted and pressurized. 408 is a carrier gas reservoir. The first hermetic chamber 401 and the exhaust gas treatment system 404 are separated from each other by an airtight door 404b. When the airtight door 404b is open, the retort 4
04c is inserted into the opening of the first hermetic chamber 401, and the hermetic door 404b is connected to the first hermetic chamber 401 and the exhaust gas treatment system 4.
The first airtight chamber 401 and the exhaust gas treatment system 404 are substantially airtightly communicated with each other while being shielded from the first airtight chamber 401. Similarly,
The second hermetic chamber 402 and the collection chamber 406 are separated by an airtight door 406b. When the airtight door 406b is open, the retort 406c is in the second airtight chamber 4
02, the airtight door 406b is shielded from the second airtight chamber 402 and the recovery chamber 406, and the second airtight chamber 402 and the recovery chamber 406 are airtightly connected.

In this example, the constituent resin of the object to be treated having a resin and a metal is selectively thermally decomposed in the first hermetic chamber 401, and the decomposition product gas is detoxified in an exhaust gas treatment system 404. At this time, the resin is selectively thermally decomposed while controlling the temperature, pressure, and oxygen concentration in the first hermetic chamber 401 by the above-described control means or the like to maintain the state of the constituent metal of the object to be treated. do it. Further, the configuration of the exhaust gas treatment system 404 may be the same as that of the recovery chamber 406 to condense the evaporant from the object to be treated.

On the exhaust gas treatment system 404 side in the first hermetic chamber 401, a reforming unit 409 for reforming gaseous emission is provided. In this example, the reforming unit 40
9 is provided with a heating means such as a radiant tube, and heats the gaseous emission from about 700 ° C. to about 1200 ° C.
Cracking is performed under reduced pressure. For example, gas generated by the thermal decomposition of an organic substance such as a resin constituting the object to be treated is
It is reformed when passing through the reforming unit 409. Therefore, gas processing in the subsequent stage becomes easy. Further, by performing the reforming under reduced pressure, it is possible to suppress the regeneration of organic halides such as dioxins from the gaseous emission. The reforming unit 409 may perform not only cracking of gaseous emissions by heating but also reforming by glow discharge or plasma discharge, or reforming by a catalyst.

In the case of reforming the gaseous effluent from the reforming unit 409, first, the inside of the system is evacuated by the exhaust system, and the reforming unit 409 is allowed to reach the reforming temperature.
(In case of reforming by heating). After this, the first airtight chamber 40
It is preferable to heat the object to be treated by adjusting the temperature of Step 1. Even when the reforming unit 409 performs reforming by glow discharge or plasma discharge, or reforming by a catalyst, the object to be treated may be heated after reaching a state where reforming can be performed. With such a configuration, it is possible to reliably reform the gaseous emission in the process of raising the temperature of the object to be treated. For example, when treating soil or incinerated fly ash contaminated with organic halides such as dioxins, dioxins (solids, liquids, and gases) are extracted or synthesized in a process of raising the temperature from room temperature to about 500 ° C. Or According to the processing apparatus of the present invention, it is possible to reliably reform the gaseous effluent generated in such a heating process.

In the second hermetic chamber 402, the constituent metal of the object to be treated is vaporized by adjusting the internal temperature and pressure, and condensed in the recovery chamber 406. The temperature and the pressure in the second hermetic chamber 402 may be adjusted by the same control means as in the first hermetic chamber 401. As described above, a purge chamber may be provided before the first airtight chamber 401 or after the second airtight chamber 402. The second hermetic chamber may be provided with a reforming unit similar to the first hermetic chamber.

(Embodiment 4) FIG. 5 is a diagram schematically showing another example of the processing apparatus of the present invention.

The processing apparatus 500 is an apparatus capable of processing an object to be processed having a resin and a metal as constituents. The processing apparatus 500 includes a purge chamber 501, a first hermetic chamber 502, and a second airtight chamber 502.
, A third hermetic chamber 504, and a cooling chamber 505.

The purge chamber 501 is connected to a trap 506 and an exhaust system 507. The first hermetic chamber 502 is connected to an exhaust gas treatment system 508 and an exhaust system 509 via an airtight door 508b. The second hermetic chamber 503 has an airtight door 510b.
Are connected to the collection chamber 510 and the exhaust system 511 via the. The third hermetic chamber 504 is connected to the collection chamber 512 and the exhaust system 513 via the hermetic door 512b.
The cooling chamber 505 is connected to the trap 514 and the exhaust system 515. A first hermetic chamber 502, a second hermetic chamber 503,
The third hermetic chamber 504 includes a temperature control unit (not shown). 516 is a carrier gas introduction system, and 517 is a carrier gas reservoir.

The first hermetic chamber 502 has an oxygen concentration sensor (not shown) so that the oxygen concentration in the system can be adjusted independently of the total pressure.

That is, the processing apparatus 500 is provided with a plurality of processing chambers for vaporizing constituent metals of the object to be processed. Even when the object to be processed has a plurality of constituent metals, the object can be selectively vaporized and collected in the second hermetic chamber 503 and the third hermetic chamber 504, respectively.

(Embodiment 5) FIG. 6 is a diagram schematically showing another example of the processing apparatus of the present invention.

The processing apparatus 600 is an apparatus capable of processing an object to be processed having resin and metal as constituent materials. The processing apparatus 600 includes one airtight container 60.
A plurality of recovery systems are connected to one airtight container 60.
(1) The recovery system is switched according to the internal temperature, pressure and oxygen concentration for processing. Also in this example, the airtight container 601 and the exhaust gas treatment system 602 are separated by the airtight door 602b as described above. Further, the airtight container 601 and the collection chamber 605 are also separated by an airtight door 605b.

(Embodiment 6) FIG. 7 is a diagram schematically showing a configuration of a control system 610 for adjusting the temperature, pressure and oxygen concentration in the airtight container 601. As described above, all or a part of the control means 611 may be mounted on an electronic computer as a control program, for example, to control the apparatus.

The airtight container 601 is connected to a plurality of exhaust gas treatment systems 602 for collecting decomposition products of the constituent resin of the object to be treated, and each exhaust gas treatment system 602 is connected to an exhaust system 603. Generally, a large amount of resin decomposition product gas is discharged, and thus providing a plurality of exhaust gas treatment systems facilitates state control in an airtight container and reduces the load on the exhaust system.

[0362] The exhaust system 603 is provided with an exhaust gas treatment device 604 that renders harmful substances and the like contained in exhaust gas harmless, odorless, and smokeless. For example, dioxins, SOx, NOx, and the like that have passed through the exhaust system 603 are processed by the exhaust gas processing device 604 to a level equal to or lower than an emission reference value and then emitted. The exhaust gas treatment device 604 may include, for example, a wet filter such as an oil film filter or a bag filter, an activated carbon filter, or the like.

The airtight container 601 is connected to a plurality of systems of recovery chambers 605 for recovering constituent metals of the object to be processed vaporized in the airtight container 601, and each of the recovery chambers is connected to an exhaust system 606.

A plurality of collection chambers 605 connected to the airtight container 601 may collect the same metal. Alternatively, a plurality of metals having different vapor pressures (boiling points) may be recovered by switching according to the temperature and pressure conditions in the airtight container 601.

[0365] A carrier gas introduction system is connected to the airtight container 601. 607 is a carrier gas reservoir. By introducing a carrier gas such as N2 or Ar, the oxygen concentration in the hermetic container 601 can be adjusted independently of the total pressure. Further, the inside of the airtight container 601 may be pressurized by introducing a prepressurized carrier gas. By pressing the object to be treated in a non-oxidizing atmosphere, the decomposition efficiency of the constituent resin is improved.

[0366] The oxygen concentration in the airtight container 601 may be adjusted by the total pressure.

(Embodiment 7) FIGS. 8 and 9 are diagrams schematically showing an example of the configuration of the recovery chamber of the processing apparatus of the present invention illustrated in FIGS. 1 and 2. FIG. FIG. 8 shows a state in which the retort 115c is retracted into the collection chamber 115 and the hermetic door 115b is closed. FIG. 9 shows a state in which the retort 115c advances and is inserted into the opening 103b of the second hermetic chamber 103, and the hermetic door 115b is opened. Here, the recovery chamber will be mainly described, and illustration of other parts is omitted.

A collection chamber 115 is provided adjacent to the second hermetic chamber 103 and separated by an airtight door 115b that can be opened and closed. The recovery chamber 115 has a temperature control unit (not shown). A carrier gas introduction system and a cooling gas introduction system may be connected to the recovery chamber 115. A collection chamber 115 is provided between the second hermetic chamber 103 and the exhaust system 114. An airtight door 115 is provided between the second airtight chamber 103 and the collection chamber 115.
b, the second hermetic chamber 103 and the collection chamber 11
5 can be separated. Collection chamber 11
5 houses a retort 115c. The retort 115c is a replaceable pipe-shaped cassette for collecting the evaporant from the object to be treated. In this example, it has a hollow cylindrical shape having a second opening 115f on the surface facing the second hermetic chamber 103 and a third opening 115d on the side surface on the exhaust system 114 side. Second hermetic chamber 103
The gas flowing from the retort to the exhaust system 114 enters the retort 115c through the second opening 115f of the retort, and is guided to the exhaust system 114 through the opening 115d on the side surface of the retort. A metal net or the like may be provided inside the retort 115c so that the evaporant from the object to be processed is easily condensed. Either way, retort 115
The shape of c may be designed as necessary so as to match the opening 103b of the second collection chamber 103.
Also, the internal structure of the collection retort may be designed as needed. Further, the recovery chamber 115c has a water-cooled jacket structure, and can be maintained at a temperature lower than a temperature at which the evaporant condenses in the chamber.

[0369] The retort 115c is provided in the second hermetic chamber 1
By opening the recovery chamber 115 in a state where the recovery chamber 03 and the exhaust system 114 are separated, the recovery chamber 115 can be taken out and loaded into the recovery chamber 115.

[0370] The retort 11 is provided in the collection chamber 115.
A mechanism for moving the 5c forward and backward is provided. In this example, the retort 115 is expanded and contracted by the cylinder 115d.
c moves forward and backward in the collection chamber 115. The collection retort 115c is inserted into the opening 103b of the second hermetic chamber 103 at the forward position. A plurality of cylinders may be provided for the forward operation and the reverse operation. In this example, the cylinder is covered with a bellows-like cover in order to prevent the evaporated substance from adhering to the cylinder 23.
A mechanism that guides the retort 115c to advance and retreat is provided in the collection chamber 115. As such a guide mechanism, a guide rail, a guide roller, or the like may be used as needed. This guide mechanism assists the heat conduction between the collection chamber 115 and the retort 115c. For this reason, the guide mechanism may be made of a metal having good heat conductivity.

The operation of the processing apparatus of the present invention having such a recovery system will now be described. First, the airtight door 115
b, the retort 115c is advanced and inserted into the opening 103b of the second hermetic chamber 103 (see FIG. 9). The hermetic door 115b is separated from the second hermetic chamber 103 and the collecting chamber 115 by the collecting retort 115c.
By employing such a configuration, it is possible to prevent the evaporation from the processing target object from adhering to the airtight door 115b. Further, the airtight door 115b is connected to the second airtight chamber 103.
Shielded from radiant heat. Therefore, the sealing portion of the airtight door 115b is protected, and the airtightness of the system can be improved.

When the retort 115c is inserted into the opening 103b of the second hermetic chamber 103,
The temperature and the pressure inside are adjusted to be higher than the boiling point of the desired metal in the object to be treated, and the metal is evaporated. Evaporate from the object to be processed passes through the retort 115c and passes through the exhaust system 11
4 and condenses in the retort 115c. A filter for trapping evaporants that could not be condensed in the retort 115c is provided in the collection chamber 11.
5 and the exhaust system 114 may be interposed.
Thereby, it is possible to prevent the evaporated matter from the object to be processed from reaching the vacuum pump. At this time, the airtight door 11
5b is shielded by the retort 115c from a hot gas flow containing the evaporant from the object to be treated. For this reason, it is possible to prevent the evaporated metal from the object to be treated from condensing on the seal portion of the airtight door 115b. Airtight door 11
Even when a resin is used for the seal portion 5b, the seal portion can be protected.

When the evaporation of the desired component from the object to be processed is completed, the retort 115c is removed from the collection chamber 11
5, and the hermetic door 115b is closed (see FIG. 8). Further, the valve between the collection chamber 115 and the exhaust system 114 is closed to separate the collection chamber 115 from the exhaust system 114. In this state, an airtight door (not shown) provided in the collection chamber 115 is opened, and the retort 115c is taken out. The condensate in the retort 115c is in a metallic state or has a large specific surface area and is in an unstable state.
It is preferable to cool the condensate by introducing a gas such as carbon oxide or an inert gas. Thereafter, another retort is loaded into the collection chamber 115, and the same operation is repeated. If such a collection chamber 115 is provided, the second hermetic chamber 103
And various conditions such as the temperature, pressure, and oxygen concentration of the recovery chamber 115 can be independently controlled. Therefore, the operation efficiency of the device is improved. Such a recovery chamber may be applied to each of the recovery chambers of the processing apparatus of the present invention as shown in, for example, FIGS. The same configuration can be adopted not only for the recovery chamber but also for the connection between the exhaust gas treatment system and the airtight chamber. By adopting such a configuration, in the processing apparatus of the present invention, even when the heating furnace is depressurized or pressurized, the evaporant from the object to be processed while continuously operating without stopping the furnace, Pyrolysis products such as gaseous emissions can be recovered. Therefore, the productivity of the processing can be greatly improved. Therefore, processing costs can be reduced.

(Embodiment 8) FIGS. 10, 11, and 12 are diagrams schematically showing an example of the configuration of a processing apparatus according to the present invention.
10 shows a state where the retort is loaded in the collection chamber, FIG. 11 shows a state where the retort is inserted into the airtight chamber, and FIG. 12 shows a state where the collection chamber is opened to replace the retort. In this example, the processing apparatus of the present invention shown in FIGS. 1 and 2 will be described as an example.
This configuration of the recovery system can be similarly applied to other processing apparatuses of the present invention.

As described above, the second hermetic chamber 103 is separated from the collection chamber 115 by the airtight door 115b that can be opened and closed. Further, the collection chamber 115 has the opening 17.
Through the exhaust system 114. Reference numeral 14 denotes an accommodation room that is accommodated when the airtight door 115b is opened,
Reference numeral 15 denotes a cylinder for opening and closing the airtight door 115b. A retort 115c is accommodated in the collection chamber 115. The retort 115c is a replaceable pipe-shaped cassette for collecting the evaporant from the object to be treated. In this example, it has a hollow cylindrical shape having an opening (115d) on the surface facing the second hermetic chamber 103 and on the side surface on the exhaust system 114 side. The collection chamber 115 has a mechanism for moving the retort 115c forward and backward.
In this example, the retort 115c moves forward and backward in the collection chamber 115 by the expansion and contraction operation of the cylinders 23 and 31. The collection retort 115c is inserted exactly into the opening 103b of the second hermetic chamber 103 at the advanced position. A plurality of cylinders may be provided for the forward operation and the reverse operation. In this example, the cylinder is covered with a bellows-shaped cover 30 in order to prevent the evaporated substance from adhering to the cylinder 23. A mechanism that guides the retort 115c to advance and retreat is provided in the collection chamber 115. As such a guide mechanism, a guide rail, a guide roller, or the like may be used as needed.

FIG. 11 shows a state in which the hermetic door 115b is opened, the retort 115c is advanced, and inserted into the opening 103b of the second hermetic chamber 103. Airtight door 11
5b is the second hermetic chamber 1 by the collection retort 115c.
03 and the collection chamber 115. By employing such a configuration, it is possible to prevent the evaporation from the processing target object from adhering to the airtight door 115b. Further, the hermetic door 115b is shielded from the radiant heat of the second hermetic chamber 103. Therefore, the sealing portion of the airtight door 115b is protected, and the airtightness of the system can be improved. In this state, the temperature and pressure in the second hermetic chamber 103 are adjusted to be higher than the boiling point of the desired metal in the object to be processed, and the metal is evaporated. Evaporate from the object to be processed is retort 115
c, while cooling toward the exhaust system 114,
It condenses in the retort 115c. At this time, the airtight door 115
b is shielded by the retort 115c from the hot gas flow containing the evaporant from the object to be treated. For this reason, it is possible to prevent the evaporated metal from the object to be treated from condensing on the seal portion of the airtight door 115b. Also the airtight door 115
Even when a resin is used for the seal portion b, the seal portion can be protected.

[0377] When the evaporation of the desired component from the object to be processed is completed, the retort 115c is removed from the collection chamber 11
5, and the hermetic door 115b is closed (see FIG. 10). Further, the valve between the collection chamber 115 and the exhaust system 114 is closed to separate the collection chamber 115 from the exhaust system 114. In this state, the airtight door 33 provided in the collection chamber 115 is opened to take out the retort 115c to the outside (FIG. 12). In the present invention, since the hermetic door 115b is shielded from the second hermetic chamber 103 during recovery of the evaporant from the object to be processed, adhesion of condensate to the hermetic door 115b is prevented. Further, damage to the seal portion of the airtight door 115b due to heat is also prevented. Therefore, the recovery chamber 115
Can be prevented from leaking outside air into the second hermetic chamber 103 even when the airtight chamber is opened. Thereafter, another retort is loaded into the collection chamber 115, and the same operation is repeated. By adopting such a configuration, according to the present invention, even when the heating furnace is depressurized or pressurized, evaporate and gaseous emissions from the object to be treated are continuously operated without stopping the furnace. Thermal decomposition products such as materials can be recovered. Therefore, the productivity of the processing can be greatly improved. Therefore, processing costs can be reduced.

FIG. 12 is a diagram schematically showing an example of the configuration of an exhaust gas processing apparatus for processing exhaust gas discharged from an object to be processed and not recovered by an exhaust gas processing system or a recovery chamber. A multi-exhaust gas treatment filter 1201,
The deodorizing filter 1202 and the deodorizing filter 1203 are connected. In addition, for example, an alkali trap for collecting a halogen gas or the like, a halogenated hydrocarbon decomposition device using a catalyst, or the like may be provided.

As described above, the processing apparatus of the present invention selectively pyrolyzes (vaporizes, oils, carbonizes) the constituent resin of the object to be processed having the resin and the metal as constituents, and vaporizes the constituent metals. It can be separated and collected from the object to be processed.

(Embodiment 9) Next, a processing system for removing lead from an object having lead as a constituent material will be described.

This processing system targets an object in which lead and resin are used for at least a part of the constituent materials.
For example, lead can be removed from electronic devices and automobile electronic components using an alloy containing lead such as a Pb-Sn-based solder alloy.

In this treatment system, first, a resin portion is selectively thermally decomposed by vaporization, oiling, carbonization, and the like, and then lead is vaporized and separated from the object to be treated. The vaporized lead may be recovered. The processing apparatus of the present invention as described above may be used as the apparatus.

First, the constituent resin is selectively thermally decomposed so that the lead of the object to be treated is not substantially oxidized.

The resin melts from about 323K,
When the temperature is maintained at about 453 to 873K, hydrocarbon gases mainly of C1 to C8 are discharged by thermal decomposition. Such a decomposition product gas of the resin may be collected in an exhaust gas treatment system or the like.

It is preferable that the step of selectively thermally decomposing this resin is performed in a state where the oxygen concentration is adjusted. By adjusting the oxygen concentration, the recovery efficiency of the decomposition product gas of the resin is improved. Further, oxidation of lead can be prevented. Since lead oxide evaporates at a temperature lower than that of lead, by controlling the oxygen concentration, scattering of lead can be prevented, and lead can be more actively recovered in a later step.

Then, lead is vaporized from the object to be treated by adjusting the temperature and the pressure. When the object to be treated includes metals such as iron, copper, aluminum, and tin in addition to lead, each metal may be selectively vaporized by a difference in vapor pressure.

The temperature at which lead vaporizes changes depending on the pressure in the airtight container. At atmospheric pressure, for example, the vapor pressure of lead when heated to 1673K is 84 mmHg, whereas iron is
The vapor pressure of copper and tin does not reach 1 mmHg. Therefore, by heating the object to about 1673K, almost only lead vapor can be selectively generated from the object.

At atmospheric pressure, for example, when heated to 2013K, the vapor pressure of lead is 760 mmHg, the vapor pressure of tin is 15 mmHg, and the vapor pressure of copper is 3 mmHg.
g. Therefore, by heating the object to about 1673K, almost only lead vapor can be selectively generated from the object.

By heating the object under reduced pressure, lead in the object can be vaporized at a lower temperature.

By adjusting the pressure to 10 -1 Torr, 11
By heating to about 00K, almost only lead vapor can be selectively generated from the object to be treated.

When the pressure is adjusted to 10 -3 Torr, almost only lead vapor can be selectively generated from the object to be treated by heating to about 900K.

Further, if the pressure is adjusted to 10 -4 Torr, almost only lead vapor can be selectively generated from the object to be treated by heating to about 700K.

The lead vapor thus selectively generated is
For example, the metal lead may be recovered by a recovery device cooled to a temperature lower than the melting point of lead.

FIG. 13 is a graph showing the relationship between the vapor pressure of lead and the temperature. It can be seen that if the pressure in the airtight container is reduced, the boiling point of lead decreases.

On the basis of this graph, the heating temperature may be adjusted in accordance with, for example, the pressure in the airtight container.
Further, for example, this relationship may be installed in an electronic computer as a program and used as the control means of the above-described processing device of the present invention.

(Embodiment 10) As an example of an object having lead and resin as constituents, a mounting substrate in which various electronic components are mounted on a circuit board with a solder alloy containing Pb was processed as an object to be processed. An example will be described.

FIG. 14 is a diagram schematically showing such a mounting board 1300. As shown in FIG.

An electronic component 1304 is mounted on a circuit board 1303 on which a copper foil 1301 and a resin 1302 are laminated. The electronic component 1304 is packaged with a resin 1305. Then, the connection terminal 1306 of the electronic component made of a Cu alloy and the copper foil are combined with the Pb—Sn based solder alloy
07. Although the surface of the connection terminal 1306 of the electronic component may be plated with a solder alloy, the same processing can be performed.

First, the mounting substrate 1300 is heated by adjusting the oxygen concentration in an airtight container, and the resins 1302 and 1303 are selectively thermally decomposed. The constituent resin of the printed circuit board is generally a thermosetting resin, and is mostly carbonized, but still generates a large amount of decomposition product gas. The same applies to the packaging resin 1303 for electronic components.

FIG. 15 is a view schematically showing a mounting board 1300 in which the constituent resin is selectively thermally decomposed.

In this state, most of the constituent resin of the mounting board is carbonized. In addition, lead is not scattered by adjusting the oxygen concentration.

Next, the temperature and pressure in the airtight container are adjusted to selectively vaporize lead in the object to be treated. The temperature and the pressure may be determined based on FIG. It is preferable to reduce the pressure inside the airtight container. This is because the lead is vaporized at a low temperature, so that the input energy is small, and the oxygen concentration is low, so that lead and other constituent metals of the object to be treated are not substantially oxidized. When the constituent metal of the object to be treated may be oxidized, N2, Ar
Such a carrier gas may be introduced to adjust the oxygen concentration in the airtight container.

As the pressure in the airtight container is reduced, lead vaporizes at a lower temperature. FIG. 16 is a view schematically showing a state in which lead 1308 is vaporized in a metal state. By adjusting the temperature and pressure in the airtight container, only lead can be selectively vaporized. When the object to be treated contains a metal having a lower boiling point than lead, such a metal may be vaporized first.

[0404] As described above, lead can be removed from the mounting substrate 1300 which is an object to be processed. In addition, by processing a large amount of mounted electronic devices such as waste electronic devices, it can be processed as general waste and does not pollute the environment due to elution of lead. Further, constituent metals other than lead can be easily separated and can be used as resources. The constituent resin can also be recovered as valuable oil or as carbide. This carbide may be used as fertilizer or activated carbon.

Although the description has been made up to the point where lead is removed from the mounting board 1300, the temperature and pressure in the hermetic container may be further adjusted to vaporize constituent metals other than lead of the object to be processed. Good.

For example, the circuit board 1303 and the electronic component 13 are formed by vaporizing tin which has made up a solder alloy.
04 can be separated.

FIG. 17 shows a case where the circuit board 130 is vaporized from tin.
FIG. 3 is a diagram schematically showing a state where electronic component 3 and electronic component 1304 are separated.

[0408] As described above, the lead is removed or the circuit board 1 is removed.
By separating the electronic component 303 from the electronic component 1304, the complexity of the object to be processed is reduced, and the subsequent processing is facilitated. In other words, the entropy of the object to be processed is reduced, and the value of the object can be increased.

Further, the temperature and pressure in the airtight container are adjusted so that the circuit board 1303 and the electronic components 1304 include
For example, Au, Ag, Pt, Bi, In, Ta, Ni, C
Metals such as r, Cu, Al, W, Mo, Co, and Pd may be vaporized and collected. It is more efficient to separate the circuit board 1303 and the electronic component 1304 and then collect them separately.

FIGS. 18, 29, and 30 are diagrams showing the boiling point (vapor pressure) pressure dependence of various metals. This drawing shows an example of a recoverable metal, and a metal not shown can also be recovered.

FIG. 19 is a diagram showing the temperature dependence of the free energy of formation of an oxide. The elements shown in FIG. 19 are shown as an example, and data on other elements can be easily calculated or obtained from a database. The relationship shown in FIGS. 18, 19, 29, and 30 is
13 may be used together with the relationship between the boiling point (vapor pressure) of lead and the pressure to control, for example, the temperature, pressure, and oxygen concentration in the hermetic container.

[0412] Further, for example, this relationship may be installed in an electronic computer as a program and used as control means of the above-described processing apparatus of the present invention.

(Embodiment 11) FIG. 20 is a diagram schematically showing an example of an apparatus used for removing lead of a processing object having lead and resin of the present invention as constituent materials. The apparatus is not limited to the apparatus illustrated in FIG. 20, and the processing apparatus of the present invention as described above may be used.

[0414] The processing apparatus 2000 includes the first airtight chamber 20.
01 and a second hermetic chamber 2002. The first hermetic chamber 2001 is provided with an oxygen concentration control device 2003 and a heating device such as a burner (not shown). The control unit (not shown) is configured to maintain the temperature at a predetermined temperature for a predetermined time.

[0415] The hydrocarbon-based gas discharged from the constituent resin due to the heating of the object to be treated 2004 is converted to the oil-based recovery device 200.
Cooled in 5 and collected as oil. Reference numeral 2006 denotes an exhaust gas cleaning device. In this example, an alkaline water shower cleaning device or the like is connected, and halogen gas in the exhaust gas is reduced to an environmental standard or less.

[0416] The second hermetic chamber 2002 is a vacuum heating furnace, and has a lead recovery chamber 2007 and an exhaust device 2008.

[0417] The object to be processed is transferred to the first hermetic chamber 2001 and the second hermetic chamber 2 by a transfer means 2009 such as a conveyor.
002.

The first airtight chamber 200 for these objects to be processed
The residence time, the heating temperature, the pressure, and the oxygen concentration in the first and second hermetic chambers 2002 are respectively controlled by a control unit (not shown).

[0419] After passing through the second hermetic chamber 2002, it is sent to the residue receiving section 2010. First airtight room 200
1, the object to be processed 2004 is, for example, 473K to
The temperature of the object 2 is raised to and maintained at a temperature of about 873K.
The resin component which is a part of the component 004 is decomposed by heating and discharged, for example, as C1 to C8 and C8 to C16 hydrocarbon gas.

The discharged resin decomposition product gas is condensed and recovered in an exhaust gas treatment system 2005. Unrecovered gas is removed by the exhaust gas cleaning device 2006, and is rendered harmless, smokeless, and odorless.

Next, the object to be processed 2004 is sent to the second hermetic chamber 2002, and the pressure is reduced to, for example, about 10 −5 Torr, the temperature is set to about 700 K, and this state is maintained. Lead in the object to be treated is released from the object to be treated as vapor lead. A gas discharge unit is provided in the upper part of the second hermetic chamber 2002, and vapor lead released from the object to be treated is condensed as metallic lead due to a decrease in vapor pressure. The crystallized metal lead is precipitated and recovered in the lead recovery chamber 2005. In addition, in order to efficiently send vapor lead from the second hermetic chamber 2002 to the lead recovery chamber 2005, an inert gas such as N2 or Ar is introduced from a carrier gas introduction section provided in the second hermetic chamber 2002. The vapor lead is sent into the lead recovery chamber 2005 together with the carrier gas.

[0422] A gas discharge section is provided above the first hermetic chamber, and the discharged decomposition product gas of the resin is sent to an exhaust gas treatment system 2005.

The exhaust gas treatment system 2005 has a cooling temperature of 523.
In the case of 〜 423 K to heavy oil, in the case of 423 to 323 K a mixture of heavy oil and light oil, and in the case of 323 K to room temperature, light oil is mainly used. The recovered oil is guided to a recovery tank (not shown) and can be reused as fuel or raw material.

[0424] The gas discharged from the exhaust gas treatment system 2005 is guided to the exhaust gas cleaning device 2006 via the gas delivery unit 15. In this example, alkaline water shower cleaning or the like is connected, and the halogen gas in the exhaust gas is reduced to an environmental standard or less.

(Embodiment 12) Next, an example in which electronic equipment including solder as a processing object is processed using the processing apparatus 2000 having the above configuration will be described.

[0426] The electronic device which is the processing object 2004 may be crushed in the preprocessing. Here, the electronic component was roughly crushed into about 10 cm square by a two-shaft crusher. The roughly crushed electronic device was put into the first hermetic chamber.

The first airtight chamber 2001 has a furnace temperature of about 773.
The electronic device was kept for about 30 minutes while the K and the oxygen concentration were maintained at about 5%. About 4% of electronic equipment
The constituent resin occupying 0% was selectively thermally decomposed in the first hermetic chamber 2001 and discharged as a hydrocarbon gas or carbonized.

Also, iron, copper,
No chemical change occurred in the first hermetic chamber 2001 between the metal such as aluminum and the mounting substrate occupying about 10% of the constituent ratio. That is, the oxidation state and the phase equilibrium state were substantially maintained.

The electronic device in which the constituent resin was selectively thermally decomposed was conveyed to the second hermetic chamber 2002 without being cooled. The pressure in the second hermetic chamber 2002 is about 10 -3 Torr,
The temperature was maintained at about 900K, and the electronic equipment was kept for about 30 minutes.

For a mounting substrate occupying about 10% of the electronic equipment, an alloy using solder of about 5 to 10% of the substrate weight is used. Also, about 40 wt% of this solder alloy is lead.

That is, in electronic equipment, 0.2 to 0.4
% Lead is used as part of the component. This lead was vaporized as evaporative lead in the second hermetic chamber 2002, sent to the lead recovery chamber 2005 together with the carrier gas, and recovered as metallic lead.

In order to improve the lead recovery rate, it is preferable to make the residence time of lead vapor inside the lead recovery chamber 2005 as long as possible. In this example, the lead recovery is 98
%Met. The recovered lead contained few impurities and could be reused as valuable metal.

The hydrocarbon gas that was pyrolyzed and discharged in the first hermetic chamber 2001 was sent to an exhaust gas treatment system 2005, and was cooled in a condensing section cooled with circulating water of about 300K. In this example, 40% of the electronic device is made of resin.
The oiling rate varies depending on the components of the constituent resin, but is about 9% by weight.
0% was recovered as oil and about 10% remained as a residue consisting primarily of carbides.

The recovered oil could be reused as fuel or raw material. The gas components that passed through the exhaust gas treatment system 2005 were released into the atmosphere as exhaust gas below the environmental standard by being cleaned by an exhaust gas cleaning device 2006. In addition, metals such as iron, copper, and aluminum, which account for about 50% of the electronic device, are contained in the first hermetic chamber 20.
It is hardly oxidized in the first and second hermetic chambers 2002, but rather is reduced and can be recovered as a metal, so that its reuse value is high.

In this example, the residue discharged to the residue receiving section 30 was mainly carbide residue of iron, copper, aluminum and resin.

FIG. 21 shows, for example, the first hermetic chamber 2001 and the second hermetic chamber 200 of the processing apparatus 2000 exemplified in FIG.
FIG. 4 is a diagram schematically illustrating an example of an openable and closable partition wall 2101 that maintains airtightness and heat insulation with the partition wall 2101. The partition 2101 is operated by a wire 2102 and a hoist 2103.

A vacuum door and a heat insulating door may be separately provided at the positions of the partition walls 2101. For example, partition 2
A vacuum door may be used as 101b, and a heat-insulating door that can be opened and closed may be disposed on the first airtight chamber 2001 side and the second airtight chamber 2002 side of the door.

Next, various electronic devices, automobiles, precision devices,
Wastes containing a large amount of resin and metal, such as stationery, pharmaceutical and food packages, etc., are taken up as objects to be treated, and their treatment systems are described.
As for the apparatus, the above-described processing apparatus of the present invention may be used.

(Embodiment 13) Such waste containing resin and metal is generally incinerated or landfilled because it is difficult to separate and collect it. In the treatment system of the present invention, the constituent resin of the waste is selectively thermally decomposed (vaporized, oiled, carbonized) and the constituent metals are vaporized and recovered in a metal state in the same apparatus. In particular, waste containing a resin has a practical problem in that heating during heating under reduced pressure is slow, but the present invention solves this problem by adjusting the oxygen concentration.

In the treatment system of the present invention, first, waste containing resin and metal is charged into an airtight container. Then, in order to recover the resin portion, the oxygen concentration is adjusted, and the pressure is increased to a pressure of several atmospheres to heat. Next, pressure reduction and heating for vaporization and recovery of the metal are performed.

FIG. 22 is a diagram schematically showing an example of the processing apparatus of the present invention which can be used in this processing system.

A waste containing resin and metal is accommodated in an airtight container 2201, and a charging shelf 2202 made of a metal having a high temperature rising efficiency and high heat resistance is provided in the airtight container. 2203 is a door for opening and closing the airtight container 2201. A heating device 220 such as a sheath heater is provided in the airtight container.
4 are operated by the control panel 2205 together with the pressure and oxygen concentration in the airtight container. Reference numeral 2206 denotes a sensor, which transmits the temperature, pressure, and oxygen concentration in the airtight container 2201 to the control panel 2205 as signals.

The airtight container 2201 is connected to an exhaust device 2208. Between the airtight container 2201 and the exhaust device 2208, a resin recovery system 2209 which is a device for recovering gas generated by decomposition of resin constituting waste and a metal recovery system 2210 which is a device for recovering constituent metal of waste are provided. Have been. The resin recovery system 2209 may include, for example, an exhaust gas treatment system. The metal recovery device may include, for example, a cyclone separator.

[0444] The waste is put into the input shelf 2202 provided in the airtight container 2201, and the door 2203 is closed and sealed.
First, heating (400 ° C.) and pressurization (3 atm) are started with the recovery system closed.

In this case, the heating efficiency is higher than the heating in the reduced pressure state, and contributes to the heating efficiency in the reduced pressure heating at the time of collecting the metal later.

The gas generated by the thermal decomposition of the constituent resin of the waste is recovered by a plurality of recovery devices according to the type of the gas. If the waste contains polyvinyl chloride resin, it may be heated at normal pressure first to generate chlorine gas,
This chlorine gas may be brought into contact with iron heated to a high temperature and recovered as iron chloride, or ammonia may be added to recover it as ammonium chloride. In this case, since the corrosion of containers and pipes due to chlorine gas is severe, Hastelloy or a titanium alloy may be used for the device instead of stainless steel as necessary. Exhaust gas such as unrecovered gas may be burned at a high temperature to make it harmless.

A part of the resin is carbonized and can be reused for fertilizer, fuel and the like. Carbide that has been subjected to the vacuum heat treatment is excellent in performance of fertilizer, fuel, deodorant and the like. Next, the resin recovery system 2209 is closed, and the circuit of another pipe of the metal recovery system 2210 is opened. The inside of the airtight container 2201 is reduced to a pressure of about 10 -3 Torr by an exhaust device, heated to a temperature equal to or higher than the boiling point of the alloy according to the type of the metal, and evaporated by the condensing means provided in the middle of the metal recovery system 2210. to recover. In this case, the evaporation temperature of the metal is lower than normal pressure, so that a relatively low heating temperature is sufficient, and the metal is hardly oxidized, so that the recovery efficiency is high.

As described above, according to the processing system of the present invention, the thermal efficiency is high and the processing cost is low. Further, by applying heat and pressure, the recovery efficiency of oil having a relatively small molecular weight is good, and the recovery rate of high purity metal is high by vacuum heating.

(Embodiment 14) [0449] Next, wastes of mounting boards, in which various electronic components are mounted on circuit boards used in large quantities, including various electronic devices, automobiles, precision instruments, and the like, are taken as objects to be treated. The processing system will be described. As for the apparatus, the above-described processing apparatus of the present invention may be used.

This processing system efficiently separates and collects electronic components from a mounting board on which various electronic components such as ICs, LSIs, resistors, and capacitors are mounted.
In addition, the system also separates and recovers the constituent resin and constituent metal of the mounting board composed of a circuit board, electronic components, and the like, and turns them into resources.

It is difficult to separate such electronic waste from the circuit board from the waste of the mounting board, and the mounting board is an object in which different materials are integrated in a complicated manner, and its processing is difficult. For this reason, landfill treatment, incineration treatment and the like have been common.

In this processing system, first, the waste of the mounting board is put into an airtight container. Then, in order to increase the temperature raising efficiency, the resin is heated to a temperature at which the resin is not oxidized at normal pressure or under pressure, and then the pressure is reduced. This is because the thermal conductivity in the hermetic container is reduced under reduced pressure.

As described above, the resin is selectively thermally decomposed (vaporized, oiled, carbonized), and the decomposition product gas is recovered.

In processing the constituent resin of the mounting board, in order to increase the temperature rising efficiency in the hermetic container, after heating to a temperature (200 ° C.) at which the resin does not oxidize much, the pressure and oxygen concentration are adjusted by an exhaust system. While mounting, the mounting substrate as the object to be processed is heated. In this case, the constituent resin is selectively thermally decomposed at a temperature corresponding to the degree of vacuum, and the higher the degree of vacuum, the lower the temperature at which the resin is thermally decomposed.

The package resin of the electronic component is also thermally decomposed,
It becomes very brittle and becomes easily separable from elements in the package.

The gas generated by the thermal decomposition of the resin is collected by a plurality of collecting devices according to the type of the generated gas. For example, hydrogen gas may be recovered by a substance that adsorbs this gas, and in the case of chlorine gas, it may be brought into contact with iron heated at a high temperature and recovered as iron chloride.

[0457] The exhaust gas and the like may be burned at a high temperature to render them harmless. Further, the temperature, pressure, and oxygen concentration in the hermetic container are adjusted according to the metal to be recovered (see FIG. 1).
3, see FIGS. 18, 19, 29, and 30), and an alloy (for example, a Pb—Sn alloy) joining the circuit board and the electronic component is vaporized. It is preferable from the viewpoint of recycling to selectively vaporize and separate the respective alloys by the vapor pressure.

When the alloy joining the circuit board and the electronic component is vaporized, the electronic component is separated from the circuit board.

[0459] Not only the joining alloy for joining the circuit board and the electronic component but also Zn, Sb, A contained in the mounting board.
Various metals such as u, Pt, Ni, Cr, Cu, Al, Mo, W, and Ta may be vaporized and separated and recovered. Since the metal can be recovered in a metal state without being converted into an oxide, the utility value is high.

When the solder alloy is vaporized, in order to increase the temperature raising efficiency, the solder alloy is heated to a temperature at which the solder alloy is not oxidized (for example, about 200 ° C.), and then the inside of the airtight container is further depressurized by the exhaust means (for example, for example). (About 400 ° C.), and may be condensed by condensing means provided in the middle of the recovery path.

According to this system, as shown in FIG. 17, the solder alloy of the mounting substrate is completely removed, and the IC, L
The solder at the lead terminals of the SI, resistor, capacitor, etc. has also been completely removed. For this reason, not only can the electronic component be separated from the substrate, but also the circuit board and the electronic component can be easily recycled to enhance the value.

The constituent resin of the mounting substrate is vaporized, carbonized, or becomes an intermediate product, and can be effectively used.

The constituent metals of the solder alloy evaporate in accordance with the degree of vacuum in the airtight container, and the higher the degree of vacuum, the lower the temperature of the evaporation. Therefore, the furnace wall of the processing apparatus is not damaged.

When the mounting substrate is landfilled, harmful metals such as Pb and Sb in the solder alloy are eluted by acid rain or the like, thereby contaminating soil and rivers. In addition, most of the resin remains semi-permanently without spontaneous decomposition.
There is also a problem in terms of environmental protection. According to the processing system of the present invention, these problems can be solved.

Further, various metals contained in circuit boards and electronic components can be separated and recovered for recycling. These metals include metals that may deplete resources, and rare metals that have a low elemental abundance in the crust. Therefore, recovering these metals will greatly help solve the resource and energy problems faced by the mass consumer society.

(Embodiment 15) Next, a circuit board on which a copper foil and a resin are laminated will be described as an object to be processed, and a processing system thereof will be described.

The circuit board may be a so-called copper-clad laminate, a flexible board, or a TAB (Tape Auto).
(Material Bonding) film carrier. Further, a cut-off portion of the copper-clad laminate, which is generated in a circuit board manufacturing process, may be processed. Further, as described above, a circuit board in which an electronic component and a bonding alloy are separated from a mounting board may be processed.

[0468] Although a circuit board is described here, an object having copper and resin as constituents can be processed in the same manner.

The separation of the solder alloy and electronic components from the mounting board is as described above. The thermal decomposition of the constituent resin of the mounting board is as described above. Here, paper may be included in a part of the resin. This applies to other parts of the present invention.

In this treatment system, the circuit board is heated under reduced pressure or non-oxidizing conditions in order to efficiently separate the copper foil and the resin, and the resin constituting the circuit board is thermally decomposed into gas, oil, carbide and the like. I do. Copper foil is recovered as almost pure metal. Impurities such as carbides adhering to copper may be cleaned, vibrated, mixed with fine sand, and rotated as necessary. The apparatus may use the processing apparatus of the present invention.

FIG. 23 shows a circuit board 23 which is an object to be processed.
It is a figure which shows 00 schematically. The circuit board 2300 is a two-layer board in which a copper foil 2301 and a resin 2302 are integrally laminated.

[0472] The circuit board 2300 is introduced into the airtight container,
The resin 2302 is selectively thermally decomposed (vaporized, oiled, carbonized) by adjusting the temperature, pressure, and oxygen concentration in the airtight container so that the copper 2301 is not substantially oxidized. The decomposition product gas of the resin 2302 may be collected in an exhaust gas treatment system or the like.

At this time, the resin 2302 is heated to a temperature at which the resin 2302 is not so oxidized (for example, 200 ° C.), and then the pressure is reduced or the oxygen concentration partial pressure is reduced.
(650 ° C.). This is to increase the heating efficiency.

FIG. 24 is a diagram schematically showing the circuit board 2300 after the constituent resin is thermally decomposed. Many of the resins exist as carbides.

In this state, the carbonized resin 2302 may be mechanically separated. When the temperature is increased to several tens of degrees higher than the melting point of copper while adjusting the pressure or the oxygen concentration in the airtight container, the copper 2301 in a liquid state is heated.
Is granular copper 23 due to surface free energy (surface tension).
01b (FIG. 25). If cooled in this state, the separation and recovery of copper is easier. For example, the melting point of copper at 760 Torr is 1080 ° C., but by heating the temperature in the airtight container to, for example, about 1150 ° C. (in the case of 760 Torr), copper can be collected in a granular form.

By heating the circuit board under reduced pressure or in a non-oxidizing atmosphere, the copper foil can be recovered almost without being oxidized. Incidentally, if necessary, impurities such as carbides attached to the surface may be removed by washing or the like.

As described above, according to the processing system of the present invention, copper can be separated and recovered in a metal state from an object in which resin and copper are integrated. Resins can also be recovered as oils and carbides.

(Embodiment 16) Next, a resin-coated aluminum foil in which an aluminum foil and a resin are laminated will be described as an object to be processed, and a processing system thereof will be described.

[0479] Such resin-coated aluminum foil is widely used for packaging containers for retort foods such as bags of potato chips and curry, as well as packaging containers for foods and pharmaceuticals, and heat insulating materials.

[0480] Such a resin-coated aluminum foil is difficult to treat because the resin and the aluminum foil are integrated, and is treated by landfill or incineration. When incinerated, aluminum becomes an oxide, and its value as a resource is significantly reduced.

A great deal of energy is put into the refining of aluminum, and it is a waste of energy not to recycle.

The present invention relates to a method for heating a resin-coated aluminum foil in an airtight container while controlling the oxygen concentration.
The constituent resin is selectively thermally decomposed (vaporized, oiled, carbonized) while substantially maintaining the oxidation state of aluminum. That is, in order to efficiently separate the aluminum foil and the resin, the resin-coated aluminum foil is heated under reduced pressure or non-oxidizing conditions, and the resin is decomposed and recovered into gas, oil, carbide, and the like. Aluminum foil is recovered as almost pure metal. Impurities such as carbide attached to aluminum
If necessary, a method such as washing, vibration, mixing with fine sand, and rotating may be performed.

[0483] In this treatment system, the resin-coated aluminum foil is heated to a temperature at which the resin is not so oxidized in order to increase the temperature-raising efficiency. , Oil, carbide and the like. Aluminum foil is separated from resin as almost pure metal.

FIG. 26 shows a resin-coated aluminum foil 2600.
It is a figure which shows typically. Resin 2601 and aluminum foil 2602 are integrated.

First, a resin-coated aluminum foil 2600 to be processed is introduced into the processing apparatus of the present invention.

Next, in order to increase the temperature raising efficiency of the airtight container,
The temperature at which the resin 2601 is not so oxidized (for example, 200
C.), and heat the resin-coated aluminum foil 2600 to 400 to 650 ° C. while controlling the temperature and pressure conditions (see FIGS. 18, 19, 29, and 30).

When the temperature is lower than 400 ° C., the thermal decomposition of the constituent resin is insufficient, and when the temperature is higher than 650 ° C., the aluminum foil is melted.

It is more preferable to selectively thermally decompose the resin at a heating temperature of 550 to 650 ° C. under a pressure of 10 −2 Torr or less (or a non-oxidizing atmosphere).

[0489] Fig. 27 is a diagram schematically showing the appearance of the resin-coated aluminum foil after the constituent resin 2601 is selectively thermally decomposed. The aluminum foil 2601 in a metallic state is provided with a carbide as a thermal decomposition product of the resin. 2602b is attached. In this state, carbide 2602b is easily peeled off from the aluminum foil only by light contact. Therefore, the aluminum foil can be easily recovered in a metal state (see FIG. 28).

[0490] Decomposition gas generated by thermal decomposition of the resin is recovered by a plurality of recovery devices according to the type of gas. A catalyst may be used. For example, hydrogen gas may be adsorbed and collected by, for example, a hydrogen gas adsorbing substance. The chlorine gas may be trapped and neutralized with an alkaline solution such as NaOH, or may be brought into contact with iron heated to a high temperature and recovered as iron chloride.

[0491] Exhaust gas such as unrecovered gas may be burned at a high temperature to render it harmless. Part of the resin is recovered as carbide or oil. In general, the constituent resin of the resin-coated aluminum foil is a thermoplastic resin, and a large portion can be vaporized or oiled and recovered. The carbide of the constituent resin could be easily separated from the aluminum foil. Aluminum retained its metallic properties.

By heating the resin-coated aluminum foil under reduced pressure or in a non-oxidizing atmosphere, aluminum can be recovered without being substantially oxidized. Incidentally, if necessary, impurities such as carbides attached to the surface may be removed by washing or the like.

(Embodiment 17) FIG. 31 is a view schematically showing an example of a processing apparatus of the present invention.

FIG. 32 is a diagram schematically showing the configuration of the processing apparatus of the present invention exemplified in FIG.

The processing apparatus 10 is connected to a pyrolysis furnace 20 which is a first pyrolysis means for pyrolyzing an object to be processed containing a resin and a metal at a first temperature, and the pyrolysis furnace 2. A gas decomposer 30 that reforms or thermally decomposes a gaseous effluent generated from the object to be treated at a second temperature at which dioxin is decomposed; and a gas decomposer 30 connected to the gas decomposer 30. A cooling tower 40 serving as cooling means for cooling the gaseous effluent to a third temperature so as to suppress an increase in dioxin concentration in the gaseous effluent reformed at the second temperature.
And a vacuum heating furnace 50 for heating a residue generated by the thermal decomposition of the object to be treated, a solid separated from the gaseous effluent, and the like under a reduced pressure so that the metal contained in the residue is vaporized.
And a recovery chamber 60 for condensing vaporized metal from the residue.
Is provided.

That is, the processing apparatus of the present invention introduces a processing object containing a resin and a metal into a pyrolysis furnace and thermally decomposes the gas. The main part of the tower is treated by a gaseous emission treatment system consisting of a tower to render it harmless and clean gas fuel. It is separated and collected.

The pyrolysis furnace 20 is for pyrolyzing the object to be treated at a first temperature at which the object to be processed is pyrolyzed under the control of oxygen concentration. For example, the pyrolysis furnace 20 removes gaseous emissions from shredder dust, waste circuit boards and the like. Extract. Here, the gaseous emission basically consists of an exhaust gas, but does not exclude the case where the exhaust gas contains solid fine particles, liquid fine particles, and the like mixed therein.

FIG. 33 is a diagram schematically showing an example of the structure of the thermal decomposition furnace 20. As shown in FIG. The pyrolysis furnace 20 includes a pyrolysis chamber 21 for pyrolyzing an object to be treated and a combustion chamber 22 for heating the pyrolysis chamber 21, and burns a fuel gas introduced from a fuel gas pipe 23 in a combustion chamber 24. ,
The combustion heat heats the inside of the pyrolysis chamber 21.

[0499] The pyrolysis furnace 20 is provided with temperature control means and oxygen concentration control means (not shown) so that the inside of the pyrolysis chamber 21 is maintained at the first temperature and the pyrolysis is performed in a reducing atmosphere. The oxygen concentration is adjusted.

As the temperature adjusting means for adjusting the first temperature of the pyrolysis furnace 20, a heating means and a temperature measuring means may be used. As the heating means, various types of convection heating, radiant heating, and the like may be selected as necessary or used in combination. For example, resistance heating such as a sheathed heater may be used, or gas, heavy oil, light oil, or the like may be burned outside the chamber. Further, the gas discharged from the resin or the like of the object to be treated is reformed, made harmless, neutralized, and then reused as a fuel gas as a heat source of the processing apparatus of the present invention such as the pyrolysis furnace 20. Is also good. Further, for example, the clean fuel gas obtained as described above is introduced into a gas turbine generator and converted into electric power, and the electric power is used for operation of the processing apparatus of the present invention including the pyrolysis furnace 20. Is also good.

[0501] Various temperature sensors may be used as the temperature measuring means. The first temperature may be set so that the resin of the object to be treated is thermally decomposed and the metal of the object to be treated is not oxidized as much as possible. In order to cut off, it is preferable to keep the pyrolysis furnace 20 under reducing conditions. For example, by thermally decomposing an aromatic hydrocarbon compound containing chlorine under reducing conditions, chlorine in the aromatic hydrocarbon compound is decomposed into HCl or the like. Therefore, generation of dioxin is suppressed.

In this pyrolysis furnace 20, the object to be treated is
About 50 ° C. to about 600 ° C., more preferably 400 to 55 ° C.
It is designed to thermally decompose in a temperature range of about 0 ° C. The first temperature may be adjusted as necessary depending on the properties and configuration of the object to be processed. Pyrolysis furnace 20
By setting the first temperature to a relatively low temperature, it is possible to prevent evaporation of heavy metals and the like of the object to be processed. Separation and recovery can be performed more efficiently in the vacuum heating furnace 50 in the subsequent stage. Further, the load on the pyrolysis furnace 20 is reduced, the service life can be extended, and the processing cost can be reduced. The gaseous emission processing system may process gaseous emissions from a reduced pressure heating furnace. Further, a reduced pressure heating furnace may be used as the thermal decomposition furnace.

The oxygen concentration adjusting means may use, for example, an oxygen concentration sensor as an oxygen concentration measuring means and a carrier gas introduction system. In addition, in the example of FIG.
Is constructed separately from the decompression heating furnace. For example, the first hermetic chamber 102 of the processing apparatus of the present invention shown in FIGS. 1 and 2 can be used as a thermal decomposition furnace.

As the oxygen concentration sensor, a so-called zirconia sensor employing, for example, zirconia (zirconium oxide) may be used, or the absorption of, for example, CO and CO2 may be measured by infrared spectroscopy. Furthermore, G
C-MS may be used, and may be selected as needed or used in combination.

As the carrier gas, a rare gas such as Ar may be used. The carrier gas not only regulates the oxygen concentration in the pyrolysis furnace 20 but also guides the gas to the gas decomposer 30 efficiently. Further, the pressure adjusting means may also be used.

The pyrolysis furnace 20 only needs to be capable of pyrolyzing the object to be treated under oxygen concentration control. For example, a rotary kiln may be used.

[0507] Further, a shredder 25 may be provided in a stage preceding the pyrolysis furnace 20 (see Fig. 40). The object to be treated brought from outside the apparatus may be crushed and separated by a shredder and then introduced into the pyrolysis furnace 20, or may be introduced into the pyrolysis furnace 20 without crushing. When the object to be processed is a waste circuit board, it is preferable to introduce the object into the pyrolysis furnace 20 without crushing.

In the pyrolysis furnace 20 into which the object to be treated has been introduced, the state of the metal in the object to be treated is minimized, and the chlorine combined with the organic compound during the thermal decomposition of the resin is mineralized as much as possible. Thus, the temperature and oxygen concentration conditions may be adjusted. The temperature and the oxygen concentration conditions may be set in advance, or the measured values of the temperature and the oxygen concentration may be fed back to the heating means, the oxygen concentration adjusting means and the like for control. When it is necessary to measure the oxygen concentration, for example, a zirconia sensor may be used.

Also, the thermal decomposition chamber 21 of the thermal decomposition furnace 20
The internal pressure may be controlled. For example, when the pressure in the thermal decomposition chamber 21 is reduced, the oxygen concentration also decreases, and the object to be treated is not rapidly oxidized by heating. Further, a large amount of decomposition product gas is generated from the resin by heating, but generally, the resin hardly generates oxygen even when decomposed. Further, decomposition products of the resin are easily vaporized.

On the other hand, when the pressure is reduced, the thermal conductivity in the pyrolysis chamber 21 decreases. However, if the inside of the pyrolysis furnace 20 is in a non-oxidizing atmosphere, the object to be treated is not oxidized even under atmospheric pressure or under pressure. Therefore, if the inside of the thermal decomposition chamber 21 is a non-oxidizing atmosphere, pressurization is possible, and the thermal conductivity in the system is improved.

[0511] The gaseous emission discharged from the object to be treated is introduced into the gas decomposer 30 through a pipe. FIG.
In the processing apparatus 10 illustrated in FIG. 1, a cyclone separator 29 for separating solid emission such as dust in a gaseous emission is disposed between the pyrolysis furnace 20 and the gas decomposer 30. The separator 29 may be provided as needed.

[0512] The gas decomposer 30 thermally decomposes or reforms the gaseous effluent discharged from the object to be treated at a second temperature higher than the first temperature. Here, pyrolysis or reforming refers to converting a hydrocarbon compound contained in a gaseous effluent discharged from an object to be treated into lower-molecular hydrogen,
It means to change to methane, carbon monoxide, etc. In addition, hydrorefining treatment (kidroforming)
May be performed. Reforming while maintaining the inside of the system under reducing conditions is also suitable from the viewpoint of cutting off the source of dioxin as described above. Gas decomposer 3
0 is maintained in a reducing atmosphere, the gas decomposer 30
A small amount of air may be introduced therein. The gas decomposer 30 may perform not only thermal decomposition but also catalytic decomposition using a catalyst, for example. As the catalyst, for example, a solid acid such as silica-alumina or zeolite (aluminosilicate) may be used by supporting a metal such as Pt or Re.

[0513] By providing the gas decomposer 30 separately from the pyrolysis furnace 20, gaseous emissions from the object to be treated can be processed at a second temperature higher than the first temperature,
Modification of gaseous emission and mineralization of chlorine can be effectively performed.

[0514] It is desirable that the gas decomposer 30 maintain a condition under which dioxin derived directly or indirectly from the object to be treated is decomposed as much as possible. For example, by setting the second temperature to about 800 ° C., considerable dioxin can be decomposed. The second temperature is set to 10
By setting the temperature at 00 ° C. or higher, more preferably at 1200 ° C. or higher, dioxin can be decomposed more effectively. Since the gas decomposer 30 is set at the second temperature at which dioxin is decomposed, thermal decomposition of hydrocarbons in the gaseous effluent occurs at this second temperature.

The hydrocarbon compounds contained in the gaseous effluent discharged from the object to be treated are reformed and thermally decomposed by the gas decomposer 30 to be reduced to low molecular weight hydrogen, methane, carbon monoxide. And so on.

When dioxin is contained in the gaseous effluent, most of the dioxin is decomposed. Further, the organic chlorine is mineralized, and the resynthesis of dioxin is suppressed.

FIG. 34 is a diagram schematically showing an example of the structure of the gas decomposer 30. As shown in FIG.

[0518] The gas decomposer illustrated in Fig. 34A introduces a gaseous effluent from the pyrolysis furnace 20 and a small amount of air into a chamber filled with coke, thereby producing a gaseous effluent. Is thermally decomposed and reformed, and a reducing atmosphere and a temperature condition such that dioxin is decomposed are formed.

[0519] The gas decomposer illustrated in Fig. 34 (b) burns the fuel gas and air to heat the chamber to a temperature at which dioxin is decomposed, and gaseous discharge from the pyrolysis furnace 20 into this chamber. The substance is introduced to thermally decompose and reform.

[0520] The chamber of the gas decomposer 30 may be provided with catalytic decomposition means such as a catalyst as described above.

[0521] If necessary, the gas decomposer 30 may be provided with a temperature adjusting means for adjusting the temperature and oxygen concentration in the chamber and an oxygen concentration measuring means. As the oxygen concentration adjusting means, an oxygen concentration sensor and a carrier gas introduction system as described above may be used. further,
A hydrogen gas reservoir may be connected, or an inert gas reservoir such as Ar may be connected.

The gaseous emission contained in the gaseous emission discharged from the object to be treated is the gas
Alternatively, it is degraded by the second thermal decomposition means and changes to hydrogen, methane, carbon monoxide and the like.

[0523] The gaseous emission thermally decomposed and reformed by the gas decomposition means 30 is introduced into the cooling tower 40.

[0524] The cooling tower 40 is provided so as to be connected to the gas decomposer 30, and suppresses an increase in dioxin concentration in the gaseous effluent reformed or pyrolyzed at the second temperature. To cool to a third temperature.

That is, in the gas decomposer 30 or the second pyrolysis means, the concentration of dioxin in the gaseous effluent reformed or pyrolyzed at the second temperature is determined so that the dioxin is decomposed at the second temperature. Is low, and the chlorine of the hydrocarbon compound decomposed or reformed at this temperature is extremely low because it is made mineral by the reducing atmosphere. Therefore, in order to prevent the generation and re-synthesis of dioxin from this state, the gas is cooled down to the third temperature so that the increase in dioxin concentration in the gaseous emission is suppressed as much as possible. The third temperature may be set to a temperature that does not cause a dioxin generation reaction.

For example, a gaseous effluent in which dioxin is decomposed (not necessarily the second temperature in the gas decomposer 30, but may be any higher than the temperature at which dioxin is decomposed) to 150 ° C. By cooling to 100 ° C. or lower, more preferably 50 ° C. or lower, and most preferably 35 ° C. or lower, generation and resynthesis of dioxin can be suppressed.

At this time, it is preferable to cool the gaseous emission to the third temperature in as short a time as possible. This is about 2
At a temperature of 00 ° C. to about 400 ° C., dioxin is easily generated and re-synthesized. Therefore, the gaseous effluent is cooled to a third temperature to minimize the time for which dioxin is generated and stays in a temperature range where re-synthesis is easily performed. This makes it possible to more effectively suppress the dioxin concentration in the gaseous emission.

Therefore, it is preferable that the gaseous emission in the cooling tower 40 be cooled rapidly, preferably within about 10 seconds.

In such a cooling tower 40, a coolant such as water or cooling oil may be directly injected into the gaseous effluent for contact cooling. At this time, if an alkaline powder such as lime powder is injected into the gaseous emission, the gaseous emission is neutralized. Also, for example, HC in gaseous emissions
Since l is diffused to the solid surface in contact with the lime powder, the production and resynthesis of dioxin can be suppressed.

FIG. 35 is a diagram schematically showing an example of the structure of the cooling tower 40.

[0531] Fig. 35 (a) shows a structure in which the gaseous effluent introduced from the decomposer 30 is rectified and the refrigerant such as cooling water or cooling oil is directly injected to cool the gaseous effluent to a third temperature. Has become. In FIG. 35 (b), a neutralizing agent such as lime powder is injected together with the refrigerant to neutralize the gaseous emission, and at the same time, the chlorine in the gaseous emission is fixed and the source of dioxin is changed to the gaseous emission. It is a structure to remove from.

[0532] The cooling tower 40 is provided with a temperature sensor (not shown) at the gaseous emission introduction portion and the cooling gas exhaust portion. The cooling speed management means for the introduced gaseous emission, for example, the flow rate of the refrigerant. -Temperature control means is provided, and the cooling rate of the gaseous emission is controlled so as to suppress generation and resynthesis of dioxin.

The gaseous effluent discharged from the object to be treated in the pyrolysis furnace 20 is pyrolyzed or reformed in the gas decomposer 30 at a temperature at which dioxin is decomposed.
By being cooled by the cooling tower 40 so that generation and resynthesis of dioxin do not occur, it is changed to hydrogen, methane, carbon monoxide, and the like, and the dioxin concentration in the gaseous emission is greatly reduced.

As described above, in the processing apparatus of the present invention, the decomposition of the object to be treated and the decomposition of the gaseous effluent from the object to be treated are performed in the pyrolysis furnace 20 and the gas decomposer 30 in a plurality of stages. By maintaining such a decomposition means in a reducing atmosphere, the generation of dioxin can be suppressed.

By setting the second temperature at 800 ° C. and the third temperature at 150 ° C., the dioxin concentration in the gaseous effluent can be reduced to 0.1 to 0.5 TEQng / Nm 3. Was.

By setting the second temperature to 1150 ° C. and the third temperature to 50 ° C., the dioxin concentration in the gaseous effluent could be reduced to 0.1 TEQng / Nm 3 or less.

The gaseous effluent cooled by the cooling tower 40 is
Cleaning and desulfurization may be performed as necessary.

[0538] The gaseous effluent cooled by the cooling tower 40 may be introduced into a neutralization reaction filtration means such as a bag filter. Between the cooling tower 40 and the neutralization reaction filtration means, slaked lime, a filter aid (eg, particles having a high porosity such as zeolite and activated carbon, tesisorb, shirasu balloon) and the like are introduced into the gas stream of the gaseous emission by a dry venturi or the like. You may make it blow in.

FIG. 36 is a diagram showing a part of the configuration of a gaseous emission processing system in which a bag filter 70 is connected to the subsequent stage of the cooling tower 40.

[0540] Solid discharges such as heavy metal fine particles condensed in the cooling tower 40 and solids discharged from the bag filter 70 are introduced into the decompression heating furnace 50 for treatment, so that lead discharges in the gaseous discharge. Even when metals such as tin, arsenic, cadmium, etc. are contained, they can be separated and recovered.

[0541] The gaseous emission discharged from the object to be processed thus treated may be used as a heat source for heating the pyrolysis furnace 20, or supplied to a gas turbine generator to obtain electric power. It may be. Further, this electric power may be used as a heat source or the like of the processing apparatus of the present invention.

On the other hand, the pyrolysis residue of the object to be treated, which has been discharged from the pyrolysis furnace 20 as a gaseous emission, is introduced into the reduced pressure heating furnace 50. Since organic components of the object to be treated are mostly decomposed in the pyrolysis furnace 20 as the first pyrolysis means, the pyrolysis residue is mainly composed of metal and carbide, or glass.

The vacuum heating furnace 50 for separating and recovering the metal from the pyrolysis residue, which is the object to be treated, comprises a purge chamber 51,
It comprises a first airtight chamber 52 and a cooling chamber 53,
Each chamber is separated by a partition 54 that can be opened and closed. Further, the first hermetic chamber of the pyrolysis furnace 20 and the decompression heating furnace 50 is
The connection may be made via the purge chamber 51.

The reduced pressure heating furnace 5 of the processing apparatus illustrated in FIG.
0, the object to be processed opens the partition wall 54a and the purge chamber 5
Introduced in 1. After the partition 54a is closed and the inside of the purge chamber 51 is roughly evacuated by an exhaust system (not shown), the partition 54b is opened and the object to be processed is moved to the first hermetic chamber 52.

[0545] The partition wall 54b is closed, and the pressure in the first hermetic chamber 52 is increased so that the metal in the object to be treated is vaporized under reduced pressure.
Control the temperature. The metal vaporized from the object to be processed is condensed and collected in the collection chamber 60. The configuration of the recovery chamber is, for example, shown in FIGS. 8, 9, 10, 11, and 1.
What is necessary is just to carry out similarly to what was illustrated to 2. 55 is an exhaust system. The exhaust gas from the exhaust gas treatment system of the thermal decomposition furnace 50 may be introduced into the decomposer 30.

After the desired metal is vaporized, a partition 54 between the cooling chamber 53 and the cooling chamber 53 which is depressurized by an exhaust system (not shown).
c is opened, and the object to be processed is moved to the cooling chamber 53.

When the object to be processed is cooled by closing the partition wall 54c and the object to be processed is stable in the atmosphere,
The cooling chamber 53 leaks and the partition 54d is opened to take out the object to be processed.

The object to be treated is composed of carbide and non-vaporized metal, and the metal can be easily separated from carbide.

As described above, according to the present invention, an object to be treated having a resin and a metal can be highly recycled, and the generation of dioxin can be prevented.

(Embodiment 18) FIG. 37 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 38 is a diagram schematically showing the configuration of the processing apparatus of the present invention exemplified in FIG. In this processing apparatus, the acidic components in the gaseous effluent cooled by the cooling tower 40 are neutralized by the neutralization washing tower 61 and desulfurized by the desulfurization tower 62 so as to be used as a clean fuel gas. This fuel gas is sent to the combustion chamber 23 of the pyrolysis furnace 20 to be used as heating fuel for the pyrolysis furnace, and is filtered by the activated carbon filter 63 and then sent to the gas turbine generator 64 to be converted into electric power. . The exhaust gas heated the pyrolysis furnace 20 and the exhaust gas of the gas turbine generator 64 are components by GC-MS or the like,
After the concentration is monitored and safety is confirmed, it is released from the chimney 66 to the atmosphere.

By adopting such a configuration, the processing apparatus of the present invention can process a processing target object more efficiently.

For example, the detoxified gaseous effluent is neutralized and washed to be used as a clean fuel gas for heating the pyrolysis furnace, and the decompression heating furnace is operated by the electric power obtained by the gas generator, or By selling the power, the running cost of the device can be extremely low.

[0555] The first temperature in the first thermal decomposition means is 6
Since the temperature is as low as 00 ° C. or less, the service life of the pyrolysis furnace is long, and the maintenance can be facilitated.

FIG. 39 is a diagram schematically showing an example in which the treatment method of the present invention is applied to waste treatment. That is, waste is thermally decomposed, and gaseous emissions emitted from waste are converted into clean fuel gas in a gaseous emission treatment system, and the pyrolysis residue is introduced into a reduced-pressure heating furnace to be used as heavy metals, useful metals, activated carbon, etc. Can be recovered.

FIG. 40 is a diagram schematically showing an example of the configuration of a shredder device which can be provided in a stage preceding the processing device of the present invention. Here, a shredder device for treating a waste vehicle is exemplified.

[0556] The scrap car is shredded by a shredder.
Iron, non-ferrous metals, non-metals, etc. are separated by magnetism, wind, etc. Such a separation residue is shredder dust. Shredder dust contains various metals including resin (including fiber and paper), glass, and heavy metals.
By adopting the above-described configuration, the present invention can safely and efficiently treat such shredder dust for which a conventional treatment technique has not been established.

The shredder dust is charged into the pyrolysis furnace 20 and thermally decomposed at 400 to 500 ° C., and the gaseous emission discharged from the resin component or organic component of the shredder dust is led to the gas decomposer 30. The second temperature is set to 1100 to decompose and make harmful substances such as dioxin harmless.
Decomposition by heating at a temperature of at least 1 ° C (more preferably at least 1150 ° C). Immediately thereafter, the cooling tower 40 sets the third temperature to 100 ° C. or lower (preferably 50 ° C. or lower) for 10 seconds.
By rapid cooling within c, the generation of dioxin could be suppressed to 0.1 TEQng / Nm3 or less. The gaseous effluent from the object to be treated thus treated was removed by a gas washing (neutralization) device and a desulfurization device to remove cyanide, sulfide, nitride, and the like, thereby obtaining a clean fuel gas. .

This fuel gas is used as a heat source for heating the pyrolysis furnace 20, and is generated by a gas turbine generator to be converted into electric power.

[0560] The thermal decomposition residue of the object to be treated is introduced into a reduced pressure heating furnace 50 and heated under reduced pressure of 10 -1 to 10 -3 Torr so that metals such as Pb, Sb, As, Cd, Sn and Zn are removed. Separation and recovery were achieved at a yield of 99% or more. The objects to be processed in the reduced pressure heating furnace 50 are Pb, Sb, A
s, Cd, Sn, and Zn could be reduced to the 0.1 ppm level.

The iron remaining on the object to be treated which was treated in the reduced pressure heating furnace 50 was separated and recovered by a specific gravity selection method, an electric magnet or the like, and finally a harmless and high-purity carbide was obtained. This carbide may be used in the activated carbon filter 63 or may be used as an effective soil conditioner.

As described above, according to the present invention, household electrical appliances, automobiles, precision equipment, and the like, or shredder dust of these wastes are pyrolyzed by controlling the oxygen concentration, and the gaseous effluent treatment system is thermally decomposed. By treating with a decomposition residue treatment system, gaseous effluents can decompose and detoxify harmful substances such as dioxin to produce clean gas fuel. This gaseous fuel can be introduced into a combustion chamber such as a pyrolysis furnace and used as a heating heat source. Further, power can also be generated using this gas fuel. Shredder dust is abundant and inexpensive resource compared to hydropower methods, which have a shortage of water during the drought period and have difficulty supplying power constantly, and are extremely efficient using the treatment equipment of the present invention. Power can be generated. In addition, since the processing apparatus of the present invention has a module configuration, it can be used in a wide range from a small scale to a large scale, and can be used in accordance with a use.

On the other hand, the pyrolysis residue can be used to separate and recover various metals in a high-purity metal state by vacuum heating.
The heavy metals have also been removed from the carbides, and can be used effectively. Further, the decompression heating furnace is smaller in size than the melting furnace, requires less installation cost and installation place, and can efficiently cope with municipal waste treatment.

[0564] As described above, a large amount of waste containing harmful substances or raw materials thereof and producing toxic substances such as dioxins when burned is converted into harmful substances,
A reusable substance can be recovered in a high-purity state without releasing heavy metals or the like.

According to the processing apparatus and the processing method of the present invention,
The circuit board and various electronic components such as ICs, resistors and capacitors can be easily separated from the mounting board waste without generating harmful gas, and at the same time, the solder alloy and the like can be separated and recovered.

First, without cracking the mounting substrate,
And pyrolyze at a first temperature of 250 to 500 ° C. At this time, the pressure in the pyrolysis furnace may be reduced. The gaseous effluent generated by the thermal decomposition of the mounting substrate is guided to a gas decomposer 30 where it is thermally decomposed at 800 ° C. or higher, and then cooled to 100 ° C. or lower in a cooling tower 40 in order to suppress generation of harmful substances such as dioxin. . The pyrolysis residue is introduced into a reduced pressure heating furnace 50, and the pressure is reduced to about 10 -3.
The temperature was sequentially increased to about 700 ° C. to evaporate constituent metals of the solder alloy. Therefore, the circuit board and various ICs, resistors,
An electronic component such as a capacitor is separated, and at the same time, metal such as evaporated lead is recovered by a coagulation means provided in the middle of a recovery path.

By such a method, the electronic component and the circuit board could be almost completely separated. Also, harmful P
Almost completely low melting point metals such as b (0.1 ppm level)
Removed. The concentration of harmful substances in the gaseous effluent generated from the resin part is also extremely low.
It could be reduced to 0.5 TEQng / Nm3.
The circuit board from which the electronic components were unmounted and from which the bonding metal was removed was carbonized and contained copper for wiring. Harmful metals such as Pb and Sb are removed from various electronic components such as ΔC, resistors and capacitors, and resin parts such as mold resin are carbonized and partially Si, Δu, Δi, W,
A state including a metal such as Mo was obtained.

Next, the carbonized circuit board containing copper is further heated (1055-1200 ° C.) in a reduced pressure heating furnace 50.
Then, the copper foil was semi-melted and aggregated into a spherical shape of several mm.

By performing such a treatment, separation and recovery of copper from carbides became easy. The circuit board composed of the carbide and metallic copper was washed with an aqueous solution of calcium carbonate or the like, and high-purity copper could be recovered.

As described above, according to the present invention, it is possible to eliminate the harmful substance from the waste of the mounting board, remove the harmful substance, and easily separate the circuit board and various electronic components without manual operation. it can. At the same time, various metals including the constituent metals of the solder alloy can be evaporated and separated and recovered. In addition, metals such as copper that have not evaporated can be recovered with high purity. According to the present invention, it is possible to recover a reusable substance in a high-purity state without releasing harmful substances, heavy metals, etc. into the environment from wastes such as a mounting substrate, for which a conventionally effective processing technique has not been established. Can be.

(Embodiment 19) FIG. 41 is a diagram showing another example of the configuration of the processing apparatus of the present invention. In this example, the retort 115c is directly connected to the exhaust system through the third opening 115d. The space between the third opening 115d and the exhaust system is hermetically sealed by a packing 115p. The packing may be made of, for example, asbestos. Further, instead of the packing, when the retort is inserted into the first opening, a pipe for connecting the third opening 115d and the exhaust system may be provided. By employing such a configuration, it is possible to prevent gaseous emissions from the object to be treated from entering the space between the retort 115c and the collection chamber 115. This is the second
Is lower than the pressure in the space between the retort 115c and the collection chamber 115.

Further, an inert carrier gas such as a nitrogen gas may be supplied to the space between the retort 115c and the recovery chamber 115 by providing a carrier gas introduction system 115n. This carrier gas is introduced into the retort 115c through the second hermetic chamber 103,
Is led to the exhaust system through the opening 115d. Therefore, the space between the retort 115c and the collection chamber 115 is sealed from the second hermetic chamber 103 by pressure. Since the space between the retort 115c and the collection chamber 115 is also connected to the space accommodated when the airtight door 115b is open, the airtight door, particularly the seal 1
15q, it is possible to prevent the evaporation from the object to be treated from being condensed. Further by adopting such a configuration. The fitting margin between the retort 115c and the sleeve 103s increases. For this reason retort 1
15c and the sleeve 103s can be prevented from engaging with each other and from coming off. Further, the driving means of the retort 115c such as the cylinder 23 can be made small or unnecessary.

FIG. 42 is a diagram showing another example of the configuration of the processing apparatus of the present invention. In this example, the third opening 115d of the retort 115c is connected to an exhaust system via a pipe 116. The pipe 116 moves up and down to open and close the connection between the exhaust system and the retort. In addition, packing 116
Due to the elastic deformation of q, both the pipe 116 and the sealing surface 115m of the collection chamber, and the pipe 116 and the third opening 115d of the retort 115c are airtightly connected. When the retort 115c is inserted into the first opening 103b, the third opening 1 of the retort 1
15d and the exhaust system are airtightly connected. When the retort is pulled out and the airtight door 115b is closed, the cylinder 23 is closed.
The pipe 116 is moved to the retreat position by b.

In this example, the carrier gas introduction system 115
n includes a pressure gauge g for detecting a pressure in a space between the retort 115c and the collection chamber 115, and controls a flow rate of the carrier gas by opening and closing a valve according to the detected pressure. For example, the pressure in the second hermetic chamber 103 may be detected, and the pressure in the space between the retort 115c and the collection chamber 115 may be adjusted to be slightly higher than this pressure. By doing so, even if the retort 11
Even if there is a gap between 5c and the sleeve 103s, gaseous emissions from the object to be treated can be guided into the inside of the retort.

In this example, the airtight door 115b employs a double structure. This airtight door 115b is opened and closed by a cylinder. The joint 115 converts the force of the cylinder when closed to a direction substantially perpendicular to the direction in which the cylinder is pushed. By adopting such a structure, the packing 115q of the airtight door is more strongly pressed against the collection chamber. It is preferable that the region of the collection chamber 115 where the packing 115q of the airtight door abuts is cooled by water cooling or the like.

FIG. 43 is a diagram showing another example of the configuration of the processing apparatus of the present invention. In this example, the opening surface of the third opening 115d of the retort 115b is aligned with the second opening surface 115f. This allows the cylinder 23 to simultaneously perform the operation of inserting the retort 115c and the operation of connecting the retort 115c to the exhaust system. A wire mesh, a dry filter, or the like may be provided inside the retort 115c in order to facilitate the condensation of the evaporant from the object to be treated. Further, such a dry filter may be made of the same material as the condensate. For example, in the case of evaporating zinc from a zinc steel sheet, if the dry filter or the retort itself is made of zinc, post-processing after recovery becomes easy. FIGS. 44 and 45 are diagrams for explaining an example of a guide mechanism that guides the forward / backward movement of the retort 115c. FIG. 44 is a cross-sectional view in a direction parallel to the second opening of the retort 115c, and FIG. 45 is a cross-sectional view in a direction parallel to the retreating direction of the retort. In this example, a guide roll 115g is provided on the inner surface of the collection chamber 115 along the direction in which the retort moves. With such a guide mechanism, the retreating movement of the retort can be made more reliable. The guide roll is made of metal and plays a part in heat conduction between the retort 115c and the recovery chamber 115. Thereby, the temperature of the retort can be adjusted more effectively.

FIG. 46 is a diagram showing a sectional structure of a wet filter provided in the processing apparatus of the present invention. In this oil film filter 711, oil 711o for a vacuum pump having a small vapor pressure is accumulated in a housing 711a.
The lower portion of the cloth 711c airtightly fixed to the oil 7a
It is immersed in 11o. Oil is cloth 711c by capillary action
The film is made along the surface of. Collection chamber 115
Dust not captured by the filter means or other filter means is trapped by the oil film of the cloth 711c.

In the processing apparatus of the present invention, it is preferable that such an oil film filter 711 is provided between the above-described collection chamber 115 and the exhaust system. This is to prevent evaporated substances that could not be completely condensed by the retort 115 and the like and fine particles once condensed from reaching the exhaust system. Thereby, the exhaust performance of the vacuum pump can be maintained. In addition, the life of the vacuum pump and the period until the next maintenance can be extended.

(Embodiment 20) Shredder dust was treated by applying the present invention.

An automobile shredder dust was prepared as a sample. This sample consists of the following six fractions. The car used was Minica (Mitsubishi Motors).

(1) Vinyl chloride (10% by weight) (2) Polypropylene (10% by weight) (3) Polyurethane (10% by weight) (4) Rubber (10% by weight) (5) Polyurethane (10% by weight) (6) Others (50% by weight) %) The fraction (6) was pressed. Pyrolysis of such shredder dust under normal pressure (600 ° C, 80
(0 ° C.) and pyrolysis under reduced pressure (600 ° C., 800 ° C.), and the concentration of dioxin contained in the pyrolysis residue was measured.

FIG. 47 is a view for explaining the processing conditions of the thermal decomposition. In the case of 600 ° C., the temperature was raised from room temperature to 600 ° C. in 2 hours, kept at 600 ° C. for 2.5 hours, and then cooled. In the case of 800 ° C., the temperature was raised from room temperature to 800 ° C. in 2.5 hours, kept at that temperature for 2.15 hours, and then cooled.

In the case of cooling under reduced pressure pyrolysis, the reduced pressure substitution of the present invention is applied. In the case of cooling under normal pressure pyrolysis, air cooling is performed without applying the present invention. Further, the pyrolysis residue at 800 ° C. normal pressure where dioxin remains was further pyrolyzed under reduced pressure at 800 ° C., and the concentration of dioxin contained in the pyrolysis residue was measured (800 ° C. pyrolysis in the figure). B fraction).

FIG. 48 shows the measurement results. Measurement is PCDD
s and PCDFs were performed separately, and the sum of these was defined as the dioxin concentration (ng / g). Further, n. d. (Not d
detected) indicates that dioxin was not detected.

As described above, according to the present invention, dioxin in the heated residue can be significantly reduced. In particular, in pyrolysis under normal pressure, dioxin remains even after treatment at 800 ° C., but when this residue is reprocessed under reduced pressure, dioxin can be removed. Here, an example of processing using shredder dust as a processing target object has been described, but similar results can be obtained in the case of soil, incinerated ash, sludge, and the like. The present invention may be a manual type suitable for small-scale processing for general factories as a waste processing apparatus, or a continuous processing furnace suitable for large-scale processing in local governments or the like, and may be combined according to processing costs.

In the present invention, heavy metals such as lead, cadmium, mercury, and zinc contained in the soil could be separated from the soil by evaporating them under reduced pressure. The separation and recovery of these heavy metals from the object to be processed could be performed by the above-described processing apparatus of the present invention. Concentrations of phosphorus and cyanide in soil could be reduced to below the environmental standard value.

(Embodiment 21) FIGS. 49, 50 and 51
FIG. 3 is a view schematically showing another example of the configuration of the processing apparatus of the present invention.

In FIG. 49, FIG. 50 and FIG. 51, two heat treatment chambers are provided: a dry distillation chamber 701 for normal-pressure pyrolysis and a vacuum evaporation chamber 702 for low-pressure pyrolysis. Further, a cooling chamber 703 for cooling the heating residue is provided at a subsequent stage. These processing chambers are openably and closably separated by a vacuum door.

In the configuration illustrated in FIGS. 49, 50 and 51, for example, an object to be treated such as soil is introduced into a dry distillation heating chamber 701 and thermally decomposed, and then introduced into a vacuum evaporation chamber 702 and introduced into, for example, arsenic, cadmium, Heavy metals such as lead are removed by evaporation. Then, the heating residue of the object to be processed is introduced into the cooling chamber 703 and cooled in an atmosphere free of organic halide and having no organic halide generating ability as described above. The system is evacuated by booster pumps 705 and 712 and rotary pumps 706 and 713. The processing of the gaseous emission of the object to be processed is performed by the gas processing apparatus in the same manner as described above. The gaseous effluent from the carbonization heating chamber 701 is introduced into the gas treatment device 714 via a gas cracking device 707 and a condenser 708 for condensing and recovering the evaporant in the gaseous effluent. The gaseous effluent from the vacuum heating chamber 702 is introduced into the gas processing device 714 via the recovery chamber 709 provided with the retort 115c and the oil film filter 711. The gas processing device 714 includes a gas cracking device 71.
5. A jet scrubber 716, an activated carbon filter, and an exhaust blower 718 are provided. In the example of FIG. 51, the gas cracking device 715 is omitted from the gas processing device 714. Further, a gas combustion device for burning gaseous emission instead of the jet scrubber 716 is provided with an activated carbon filter 7.
Instead of 17, an alkali shower for washing the gaseous emission with alkali may be provided.

[0590] In Figs. 49 and 51, the dry distillation heating chamber 70 is used.
Although the loading chamber 704 for introducing the object to be treated and the dry distillation heating chamber are commonly used, they may be separately provided. In FIG. 51, an oil jet scrubber 708b is provided as a gas processing device, and the oil content in the gaseous emission is recovered here. However, a condenser 708 may be provided.

(Embodiment 22) The present invention relates to a vacuum evaporation and recovery apparatus, more specifically, a method for recovering metal from an evaporant generated by a vacuum heating process in a vacuum furnace without having to lower the temperature of the vacuum furnace. The present invention relates to an efficient vacuum evaporation recovery device.

In a conventional vacuum evaporation and recovery apparatus, when recovering metal from evaporated material generated by vacuum heating in a vacuum furnace, the furnace temperature of the vacuum furnace is lowered, the recovered metal is taken out, and then the furnace temperature is raised again. A procedure of performing a vacuum heat treatment had to be taken. This is because the evaporated metal adheres to the seal portion of the vacuum door existing between the vacuum furnace and the metal recovery device, so that the vacuum sealing is not completely performed, and as a result, air flows into the vacuum heating furnace during metal recovery. Therefore, the collection operation cannot be performed.

[0593] As described above, in the conventional vacuum evaporation and recovery apparatus, it is necessary to cool the vacuum furnace at the time of recovering the evaporant and raise the furnace temperature again after the recovery.
There is a problem that the operation of the vacuum furnace must be stopped for a long time (for example, 4 days) for heating.

Therefore, the present invention does not have such a problem, that is, since it is not necessary to change the furnace temperature when recovering the evaporant, continuous operation is possible, work efficiency is greatly improved, and cost is reduced. It is an object to provide an advantageous vacuum evaporation recovery device.

[0595] The present invention also provides a vacuum evaporation and recovery apparatus that does not have a risk that the powder evaporate will reach the vacuum valve and the vacuum pump, thereby impairing the vacuum sealing performance of the vacuum valve and causing the vacuum pump to fail. The task is to provide.

According to the present invention, a cooling and vacuum purging chamber having a cooling function is installed in a vacuum furnace via a vacuum door, and the cooling and vacuum purging chamber is moved forward and backward in the cooling and vacuum purging chamber. A vacuum evaporative recovery device, which is provided with an evaporant recovery retort that faces the inside of the vacuum furnace and escapes from the vacuum purge chamber at the time of retreat, and is detachable with respect to a shaft of a cylinder for moving the recovery retort forward and backward.
Has solved the above-mentioned problem.

[0597] The present invention is also characterized in that a cooling and vacuum purging chamber is installed in a vacuum furnace through a vacuum door, and a vacuum valve and a vacuum pump are installed in the cooling and vacuum purging chamber through a filter. The above problem was solved by a vacuum evaporation recovery device. The filter in this case is preferably a combination of a solid filter (dry filter) and a liquid filter (wet filter).

An embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 52 is an overall configuration diagram of an apparatus according to the present invention.
The apparatus includes a vacuum furnace 1, a vacuum double door 2 installed at an evaporant outlet of the vacuum furnace 1, a cooling and vacuum purging chamber 3 connected to the vacuum furnace 1 via the vacuum double door 2, a cooling and vacuum A solid powder recovery filter 4 and a liquid powder recovery filter 5 connected to a gas passage from the purge chamber 3;
And a vacuum pump 7.

In the cooling / vacuum purge chamber 3, a recovery retort 21 which moves forward and backward by the action of the insertion cylinder 23 is inserted. The insertion cylinder 23 is provided with a vacuum door 32 for vacuum-sealing an end opening of the cooling and vacuum purge chamber 3, and is connected to a cylinder shaft of the moving cylinder 31. The collection retort 21 is drawn out of the cooling and vacuum purge chamber 3 with the extension operation of the moving cylinder 31.

FIG. 53 shows the details of the vacuum double door 2 and the cooling and vacuum purging chamber 3.
The vacuum furnace 1 is installed between a vacuum furnace 1 surrounded by a reference numeral 0 and a cooling / vacuum purge chamber 3 connected to the vacuum furnace 1. The vacuum double door 2 is a double door in which an insulated vacuum door 12 arranged on the vacuum furnace 1 side and a vacuum door 13 arranged on the opposite side are combined.
4 is moved up and down by the action of the opening / closing cylinder 15 installed on
When descending, the passage to the cooling and vacuum purging chamber 3 is closed in an airtight state. An uncollected evaporative flow outlet 17 is provided in the cooling and vacuum purge chamber 3, and a solid powder recovery filter 4 is installed in a gas passage extending from the uncollected evaporative flow outlet 17.

[0601] A cylindrical recovery retort 21 for recovering the metal evaporation is inserted from the cooling / vacuum purge chamber 3 to the vacuum furnace 1 through the open double vacuum door 2 to the vacuum furnace 1. The recovery retort 21 has an open front end facing the heating section of the vacuum furnace 1, and allows the evaporative gas generated in the vacuum furnace 1 to enter the recovery retort 21 therefrom. An opening is provided on the side of the rear end of the collection retort 21, and a metal net 22 is stretched there to allow ventilation inside and outside the retort. In addition, it is preferable to provide a heat exchange function by making the peripheral wall of the cooling and vacuum purge chamber 3 double and allowing the cooling water to flow therethrough.

[0602] A cylinder shaft 24 of an insertion cylinder 23 for allowing the recovery retort 21 to advance from the cooling and vacuum purge chamber 3 into the vacuum furnace 1 is detachably attached to the rear end surface of the recovery retort 21. As an attachment means, as shown in FIG. 55, an elongated hole 2 in which the cylinder shaft 24 can move is provided on the rear end face of the collection retort 21.
6 is provided with a gap 28 between the mounting plate 27 and the rear end face.
In the meantime, it is conceivable that a locking portion 29 larger than the width of the elongated hole 26 is provided at the tip of the cylinder shaft 24.

In this case, the recovery retort 21 is operated while being lifted using a hoist or the like, and
When the cylinder shaft 24 is displaced into the long hole 26 by inserting the cylinder shaft 24 into the long hole 26, the locking portion 29 is hooked on the edge of the long hole 26, so that the cylinder shaft 24 is engaged with the rear end face of the collection retort 21 via the mounting plate 27. The collection retort 21 can move in the horizontal direction following the movement of the cylinder shaft 24. The bellows cover 30 is mounted on the cylinder shaft 24.

The insertion cylinder 23 is fixed to a cylinder support block 33 that reciprocates on the gantry 18 by the action of the moving cylinder 31 via a vacuum door 32 attached to the insertion cylinder 23. It moves on the gantry 18. That is, the cylinder support block 33 is installed on a movable base 36 having rollers 34 and configured to be movable on a table 35 of the base 18, and the movable cylinder 31 is mounted on the table 3 of the base 18.
5, the cylinder shaft of which is fixed to the moving table 36.

As shown in FIG. 54, the vacuum door 32 is fixed to a flange portion of the insertion cylinder 23, and a vacuum seal 32a is provided at the insertion portion of the cylinder shaft 24.
A packing 32b is provided in close contact with the end flange 3a of the cooling and vacuum purging chamber 3, and the cooling and vacuum purging chamber 3 is vacuum-sealed.

[0606] After the closing operation of the vacuum double door 2, the insertion cylinder 23 moves the gantry 1 at the extending end of the moving cylinder 31.
8 reaches the rear end (the right end in FIG. 53), at which position the replacement work of the collection retort 21 is performed (hereinafter, this position is referred to as a "first stop point"). The new collection retort 21 is attached to the cylinder shaft 24 of the insertion cylinder 23 by, for example, the engaging means as described above. When the mounting work of the new collection retort 21 is completed, the moving table 3 is moved by the contraction operation of the moving cylinder 31.
6 moves forward (moves to the left in FIG. 53).

[0607] Accordingly, the collection retort 21 enters the cooling and vacuum purging chamber 3 and stops at the contraction operation end of the moving cylinder 31 and waits. In this standby position,
The front surface of the collection retort 21 is located immediately before the double vacuum door 2 that closes the cooling and vacuum purge chamber 3 (hereinafter, this position is referred to as a “second stop point”), and the vacuum door 32 cools and cools. The vacuum purging chamber 3 is in close contact with the end flange 3a and vacuum-sealed there.

Next, the operation of the apparatus having the above configuration will be described in more detail. As described above, when the moving table 36 reaches the end of the gantry 18 by the extension operation of the moving cylinder 31 (first stop point), a new collection retort 21 is attached to the cylinder shaft 24 of the insertion cylinder 23. Then, as the moving cylinder 31 contracts, the collecting retort 21 advances in the cooling and vacuum purging chamber 3, and the forward end of the moving table 36, in other words, the opening end of the collecting retort 21 becomes the vacuum double door 2. Stops just before (second stop point). At that time, the vacuum double door 2 is closed.

When the recovery retort 21 reaches the second stop point, the inside of the cooling and vacuum purging chamber 3 is kept airtight by the action of the vacuum door 32, and then the vacuum valve 6 is opened and the vacuum pump 7 operates. The inside of the cooling and vacuum purging chamber 3 is set to the same degree of vacuum as the inside of the vacuum furnace 1. Thereafter, the opening / closing cylinder 15 operates to open the vacuum double door 2, and the insertion cylinder 23 operates to expose the opening of the collection retort 21 into the vacuum furnace 1. In the vacuum furnace 1, the processed material is appropriately heat-treated under a degree of vacuum to generate metal evaporates.
The evaporant flows into the collection retort 21 without going to the vacuum double door 2. Therefore, it is possible to avoid a situation in which the evaporant adheres to the vacuum double door 2 and impairs and degrades the vacuum sealing performance.

[0610] After the collection of the evaporated material is completed, the collection retort 21 is pulled out to the second stop point by the action of the insertion cylinder 23, and then the vacuum double door 2 is closed by the action of the opening and closing cylinder 15. Therefore, an inert cooling gas such as nitrogen gas is supplied into the cooling and vacuum purging chamber 3 to cool the recovered metal to a temperature at which there is no risk of oxidizing and burning the recovered metal. As described above, in the apparatus according to the present invention, after the vacuum furnace 1 and the cooling and vacuum purging chamber 3 are shut off by the vacuum double door 2, the cooling and vacuum purging chamber 3 is maintained while the inside of the vacuum furnace 1 is maintained at a high temperature. Since only the inside is cooled, useless time for cooling the vacuum furnace 1 as in the conventional case can be omitted.

[0611] After the recovered metal is sufficiently cooled, nitrogen gas or the like is further supplied into the cooling and vacuum purging chamber 3 so that the pressure in the chamber is adjusted to the same as the external pressure.
After the completion of the pressure adjustment, the vacuum door 32 opens with the operation of the moving cylinder 31, and the collection retort 21 is pulled out to the first stop point. Then, the recovery retort 21 is removed from the insertion cylinder 23, and the recovery of the evaporated metal is performed separately. Thereafter, the above procedure is repeated.

Next, the configuration of the path from the cooling and vacuum purging chamber 3 to the vacuum pump 7 will be described. In the apparatus according to the present invention, the powder that has been vacuum-evaporated in the vacuum furnace 1 passes through the collection retort 21 and flows into the evaporative flow outlet 17 and enters the sealing portion of the vacuum valve 6 and the vacuum pump 7 to form a vacuum seal. In order to prevent the sealability of the vacuum pump 7 from being hindered or causing the vacuum pump 7 to malfunction, measures have been taken. That is, a metal net 22 is attached to the evaporant outlet of the recovery retort 21, and a solid type filter and a liquid type filter are double-installed between the evaporative flow outlet 17 and the vacuum valve 6.

[0613] The solid filter 4 is composed of a wire mesh filter, ceramic balls, or the like. When the absorption power of the vacuum pump 7 is not so strong, the solid filter 4 alone is sufficient, but when the suction power becomes stronger to some extent,
The powder passes through the solid filter 4 and passes through the vacuum valve 6
Or the vacuum pump 7. Therefore, in the present invention, the liquid filter 5 is disposed after the solid filter 4. The liquid type filter 5 recovers the powder by introducing the powder into a liquid or a liquid film.

When the amount of powder is small, only the liquid filter 5 may be used without using the solid filter 4, but when the amount of powder is large or the particles are large,
It is necessary to use the solid filter 4 and the liquid filter 5 together.

[0615] The present invention is as described above. After the recovery retort in which the vacuum evaporate is recovered is drawn out of the vacuum furnace into the cooling and vacuum purging chamber, the vacuum furnace and the cooling and vacuum purging chamber are shut off by the vacuum door. Then, since only the cooling and vacuum purging chamber is cooled, it is possible to omit a long-term operation of cooling and reheating the vacuum furnace. for that reason,
The work can be performed efficiently and at low cost, which has the effect of contributing to energy saving.

Also, since the recovered retort is in contact with the furnace surface of the vacuum furnace via the vacuum door, most of the evaporant generated in the vacuum furnace enters the recovery retort, and the evaporate adheres to the vacuum door and becomes This has the effect of eliminating the risk of impairing the vacuum sealing performance.

In the present invention, it is possible to prevent the powder evaporant from reaching the vacuum valve and the vacuum pump, thereby inhibiting the vacuum sealing performance of the vacuum valve and causing a failure of the vacuum pump. There is an effect that can be avoided.

Also, in the present invention, since the vacuum door is doubled, even if one of the vacuum doors has an abnormality, the other vacuum door alone can fulfill its function, and the operation is continued as it is. There is an effect to get.

(Embodiment 23) Dioxin, PCB,
The diffusion of organic halides, such as coplanar PCBs, into the environment and their effects have become a major social problem. For example, harmful organic halides such as dioxins remain in heating residues (ash, char, carbon) obtained by burning and pyrolyzing waste. In addition, for example, high concentrations of dioxins have been detected in soil around a refuse incineration plant, an industrial waste disposal site, or the like, and there is a serious concern about the adverse effects on the health of residents. Organic halides are also contained in soil and sludge.

As described above, in many cases, organic residues such as dioxins, heavy metals, and the like remain in heated residues of wastes, solids such as soil and sludge under special conditions, and liquids.

As a method for removing these harmful substances containing organic halides or heavy metals, the object to be treated containing organic halides is heated to a high temperature,
There has been proposed a method of reducing the concentration of the organic halide by performing a melting treatment at a high temperature of about ° C. However, such a method has problems in that expensive and large-scale equipment is required, running cost is high, and the like. Furthermore, there is a problem in that dioxin generated during a period from a room temperature to a temperature at which dioxin is decomposed cannot be dealt with. Organic halides such as dioxin, As, Hg, Cd, Pb,
An effective treatment technique for soil such as Cr ^{+ 6} has not been established.

In the case of treating city garbage and the like by combustion (incineration) or the like, the generation of organic halides can be reduced if complete combustion is possible. However, it is very difficult to completely burn large and heterogeneous objects to be treated. Further, even if complete combustion is possible, harmful organic halides such as dioxins are produced until the temperature reaches a predetermined temperature.

An organic halide such as dioxins remains in a heating residue which is a residue of heat treatment of an object to be treated such as incineration or thermal decomposition, and the concentration of the organic halide remaining in the heating residue is reduced and removed. It is required to establish a heat treatment technique.

Incidentally, in order to generate dioxin, a reactive chlorine atom bonded to the carbon of the benzene nucleus,
It is necessary that oxygen to bind the benzene nucleus be present. In order to suppress the generation of dioxin during pyrolysis, it is considered effective to control the amounts of these reactive chlorine atoms and oxygen in the pyrolysis furnace. However, a pyrolysis furnace suitable for preventing the generation of dioxin from such a viewpoint has not been proposed. In particular, the formation of dioxins and organic halides such as coplanar PCB at a relatively low temperature (normal temperature to 500 ° C.) during the heating process to a predetermined heating temperature, and the organic halogen remaining in the heating residue such as residual ash The technology to realize the decomposition of the compound at low temperature has not yet been established.

[0625] It is an object of the present invention to provide a soil production method and a soil treatment apparatus for producing clean soil from soil contaminated with an organic halide such as dioxin.

Further, the present invention can safely and surely prevent dioxins contained in heated residues such as ash from municipal incineration facilities and factories, residual liquids, dust and the like, soil and sludge contaminated by these, and the like. It is an object to provide a processing method and a processing apparatus capable of removing dioxin.

[0627] In order to solve such a problem, the present invention employs the following configuration. The method for producing a soil according to the present invention produces the second soil containing the organic halide at a second concentration lower than the first concentration from the first soil containing the organic halide at the first concentration. A method for producing soil, wherein the first soil is introduced into an airtight region, and at least a part of the organic halide is thermally decomposed by heating the first soil under reduced pressure. . The object to be treated is heated above the decomposition temperature of the organic halide or above the boiling point. Examples of the organic halide include dioxins, PCB, coplanar PCB, and the like.

[0628] The method may further include the step of reducing the halogen concentration in the gaseous effluent generated by the thermal decomposition of the soil. This can reduce the possibility that the organic halide is generated and regenerated in the gaseous emission.

The pyrolysis residue of the first soil may be cooled after replacing the inside of the hermetic zone with the replacement gas substantially free of the organic halide and having no ability to generate an organic halide. This can prevent organic halides such as dioxin from being fixed in the residue with cooling.

Examples of the form of the replacement gas substantially free of an organic halide and having no ability to generate an organic halide include, for example, a group consisting of helium, neon, argon, krypton, xenon, nitrogen, and hydrogen. At least one selected gas, a mixed gas thereof, or a gas mainly composed of these gases or a mixed gas can be used.

[0631] The thermal decomposition step may be performed while controlling the oxygen concentration in the hermetic zone. This suppresses fluctuations in the amount of gaseous emission generated regardless of non-uniformity of the object to be processed and partial combustion, and enables more reliable and efficient processing of gaseous emission. Dioxin formation can also be prevented by suppressing the oxygen concentration and the halogen concentration.

[0632] The method for producing a soil according to the present invention is characterized in that the second soil containing the organic halide at a second concentration lower than the first concentration is obtained from the first soil containing the organic halide at the first concentration. In the method for producing soil for producing soil, the first soil is heated so that at least a part of the organic halide evaporates or decomposes, and a heated residue of the soil is introduced into an airtight area. Is replaced with a replacement gas that is substantially free of an organic halide and has no ability to generate an organic halide, and then the heated residue of the soil is cooled.

The method for producing soil according to the present invention is characterized in that soil containing an organic halide is thermally decomposed under reduced pressure. Under reduced pressure, the mean free path of molecules is long, and the system is kept in a non-oxidizing atmosphere, so that generation and regeneration of organic halides such as dioxin can be prevented. Also, under reduced pressure, the partial pressure of the organic halide itself is small, so that the concentration of dioxin remaining in the heated residue can be reduced.

For example, by heat-treating soil, heated residue, steamed product, residual ash, residual liquid, dust and the like containing residual dioxin from a refuse treatment facility or factory while reducing the pressure from normal pressure and raising the temperature. Dioxin can be effectively treated. Further, the halogen concentration of the gaseous emission generated by the thermal decomposition of the soil may be reduced.

The soil treatment apparatus of the present invention is a soil treatment apparatus for treating a soil containing an organic halide or capable of producing an organic halide by heating, wherein the means for heating the soil, the airtight region, Means for introducing a heating residue of the soil into an airtight area, means for replacing the inside of the airtight area with a replacement gas substantially free of an organic halide (a lack of an organic halide), and Means for cooling the residue. In the present invention, regardless of combustion, pyrolysis, pyrolysis under reduced pressure,
After the soil to be treated is heated, it is purged and cooled in the hermetic zone. The replacement means may introduce the replacement gas after reducing the pressure in the hermetic zone.

Also, a metal which forms a compound with halogen contained in the gaseous emission generated by heating the soil,
Alternatively, the apparatus may further include a halogen removing unit provided with an adsorbent for adsorbing halogen in the gaseous emission.

[0637] A reforming means for reforming the gaseous effluent generated by heating the soil at a first temperature at which dioxin is decomposed, and an increase in the concentration of dioxin in the reformed gaseous effluent. Cooling means for cooling the gaseous emission to a second temperature so as to be suppressed. As the cooling means, oil may be injected into the gaseous effluent for rapid cooling.

That is, the treatment method of the present invention is characterized in that an object to be treated containing an organic halide is thermally decomposed under reduced pressure. If the object to be treated, such as soil and incinerated fly ash, contains not only organic halides but also heavy metals, the temperature and pressure in the system are adjusted after treating the organic halides to evaporate these heavy metals. Let it.
The evaporated metal may be condensed and recovered by the recovery chamber as described above. In addition, gaseous emissions generated by decompression or heating of an object to be treated such as soil and incinerated fly ash may be introduced into the treatment system in the same manner.

The processing apparatus of the present invention is a processing apparatus for processing an object containing an organic halide or capable of generating an organic halide by heating, wherein the means for heating the object to be processed is airtight. A region, means for introducing the heating residue into the hermetic region, and means for substituting the inside of the hermetic region with the organic halide-free (substantially deficient in organic halide) replacement gas.
Means for cooling the heating residue.

As the heating means, a combustion furnace for burning the object to be treated, a pyrolysis furnace for thermally decomposing the object to be treated, a reduced pressure pyrolysis furnace for thermally decomposing the object to be treated under reduced pressure, and the like are mentioned. Can be.

In the processing apparatus of the present invention, a pyrolysis (steaming) process is performed while reducing the pressure of an object to be processed from normal pressure, or a furnace capable of controlling the pyrolysis temperature or a plurality of decompression furnaces having different pyrolysis temperatures. Is passed. For example, the pressure of the furnace may be substantially constant, and the object to be processed may be thermally decomposed while changing the temperature.

Also, a furnace capable of controlling the thermal decomposition temperature for performing thermal decomposition processing of the object to be treated was provided, and the inside of the furnace was changed from normal pressure to a predetermined degree of vacuum so that the degree of vacuum could be maintained. It is characterized by the following. For example, the temperature inside the furnace may be kept substantially constant, and the object to be treated may be thermally decomposed while changing the pressure.

Also, a normal-pressure furnace for thermally decomposing the object to be treated and a plurality of decompression furnaces may be provided in series, and the pyrolysis temperature in each of the furnaces may be set so as to become higher in the later stages.

The metal which forms a compound with the halogen contained in the gaseous effluent generated by the thermal decomposition of the object to be treated and which is disposed in connection with the decompression furnace, or the halogen in the gaseous effluent is adsorbed. And a halogen removing means holding an adsorbent therein.
The portion of the halogen removing means loaded with, for example, a metal for trapping halogen, a catalyst for decomposing, and the like, is at room temperature to about 1
000 ° C, more preferably about 400 ° C to about 1 ° C.
The temperature may be kept substantially constant within the range of 000 ° C. It is preferable to keep the halogen-adsorbing portion at a low temperature.

In the present invention, the heating residue containing the residual dioxin from the refuse treatment facility or factory may be treated while reducing the pressure and heating. In addition, steamed products containing residual dioxin, residual ash, residual liquid, dust, and the like from a refuse treatment facility or factory may be treated while reducing the pressure from normal pressure and raising the temperature.

In the present invention, the gaseous effluent is decomposed and reduced by introducing the gaseous effluent to a heating-state reducing means provided at a gas outlet of a hermetic pyrolysis furnace. Oxygen, oxide gas, chlorine,
At least one gas concentration of the chloride gas may be measured, and the temperature, pressure, oxygen concentration, and the like in the pyrolysis furnace may be controlled according to the measured value.

In the present invention, the organic halide includes dioxins, PCB, coplanar PCB, DDT, trichloroethylene, trihalomethane and the like (see FIG. 6).

In the present invention, unless otherwise specified, polychlorinated dibenzoparadioxin (Polychloro) is used.
ripped dibenzo-p-dioxin
s: PCDDs), polychlorinated dibenzofuran (Pol
ychlorinateddibenzofuran
s: PCDFs) and their homologs having different chlorine numbers and substitution positions are collectively referred to as dioxins. Further, compounds obtained by substituting chlorine in dioxin with other halogen such as fluorine and bromine are also included in the organic halide in the present invention.

In order to reduce the concentration of organic halides such as dioxins, PCB and coplanar PCB in the heating residue of the object to be treated, the treatment should be performed at a temperature at which at least a part of such organic halides is decomposed. It is important to heat the target object and to cool the target object in an atmosphere having a low concentration of the organic halide and the substance capable of generating an organic halide as much as possible.

[0650] On the other hand, it is preferable that the concentration of dioxins, for example, the concentration of a substance capable of producing dioxin such as halogen is also reduced as much as possible with respect to the gaseous emission generated by heating the object to be treated.

If an organic halide coexists in the cooling atmosphere when the object to be processed is cooled, the organic halide is fixed in the object to be processed. Also, when a material that can generate an organic halide is present when the object to be treated is cooled, the organic halide is synthesized or re-synthesized during the cooling process, and the organic halide remains in the residue. Will be lost.

Accordingly, in the present invention, when treating an object to be treated which contains an organic halide or generates an organic halide by heating, the object is treated by combustion,
After heating such as thermal decomposition, the heated residue is cooled in a state where the concentration of the organic halide and the substance having an ability to generate an organic halide is reduced. For this reason, the cooling of the heating residue may be performed, for example, in an atmosphere purged with a cooling gas containing no organic halide material. Therefore, it is preferable to use a gas containing no halogen, oxygen, or an organic compound as the cooling gas. For example, a rare gas such as argon, nitrogen, or the like can be used.

Examples of the object to be treated include municipal garbage, incinerated ash of municipal garbage, soil contaminated with organic halides such as dioxin and PCB, sludge, agricultural products, marine products, shredder dust, waste home appliances, various wastes and the like. Can be given.

The processing method of the present invention is a processing method for processing an object to be processed which can generate an organic halide by heating, wherein the object to be processed is heated, and the heated residue is introduced into an airtight area. The inside is replaced with a replacement gas that is substantially free of an organic halide and has no ability to generate an organic halide, and the heated residue is cooled.

[0655] The processing method of the present invention is a processing method for processing an object to be processed which can generate an organic halide by heating, wherein the object to be processed is heated, the heated residue is introduced into an airtight region, Substituting the inside of the region with the organic halide-free (organic halide-deficient) replacement gas, and cooling the heated residue. Here, “organic halide free” means that the organic halide is deficient. As a form of the replacement gas, a rare gas, nitrogen, hydrogen,
Alternatively, a mixed gas thereof may be used. In addition, air can be used as the replacement gas as long as the oxygen concentration does not matter.

[0656] The mode of heating the object to be treated is as follows.
For example, combustion, thermal decomposition and the like can be mentioned. Such heating may be performed while adjusting the oxygen concentration. Further, the thermal decomposition may be performed while adjusting the pressure in the hermetic region such as decompression and pressurization. The introduction of the replacement gas into the hermetic zone may be performed after the pressure in the hermetic zone is reduced.

[0657] The gaseous emission generated by heating the object to be treated is also subjected to a treatment for reducing the concentration of an organic halide such as dioxin.

[0658] As such a treatment, for example, the gaseous effluent is reformed at a first temperature at which dioxin is decomposed, and an increase in the dioxin concentration in the reformed gaseous effluent is suppressed. The gaseous effluent to a second
The temperature may be cooled to the temperature.

The gaseous emission produced by heating the object to be treated may be cooled by injecting oil into the gaseous emission to rapidly cool it. Thereby, resynthesis of the organic halide can be suppressed, and hydrocarbons and the like in the reformed gaseous emission can be trapped.

Further, the gaseous effluent cooled by spraying oil is reheated again to a high temperature at which organic halides such as dioxin are decomposed, and then cooled by spraying cooling water. Good. This cooling water may be made alkaline.

Further, the concentration of halogen such as chlorine contained in the gaseous emission generated by heating the object to be treated may be reduced. For example, a halogen removing device or the like for removing halogen in the gaseous effluent may be provided at a stage subsequent to the pyrolysis furnace. As the form of the halogen removing device, for example, a metal such as iron which forms a chloride by reacting with chlorine in a gaseous effluent in a chamber, Dalai powder and / or
Alternatively, some are loaded with a compound such as calcium hydroxide. The chamber may be loaded with a catalyst that promotes the reaction for fixing halogens in the gaseous emission or the decomposition of organic halides in the gaseous emission. Further, an adsorbent for adsorbing the halogen contained in the gaseous emission may be loaded. A plurality of these halogen removing devices may be combined.

When using an adsorbent such as zeolite for removing halogen, it is preferable to maintain the adsorbent at a temperature as low as possible in order to improve the adsorption efficiency.
In this case, the gaseous effluent is cooled in the chamber loaded with the adsorbent, and the cooling is performed by setting the temperature of the gaseous effluent to a residence time in the regeneration temperature range of organic halides such as dioxins. Is preferably performed rapidly so as to be as short as possible.

The above-described various treatments for reducing the concentration of organic halides such as dioxin in the gaseous emission may be used in combination.

The processing apparatus of the present invention for realizing such processing includes, for example, an air-tight area capable of holding an object to be processed air-tight, means for adjusting the temperature of the air-tight area, And a cooling unit for cooling the heating residue of the object to be processed. Further, the pressure in the airtight region may be reduced.

The replacement means may not only replace the gas in the hermetic region, but may also introduce a replacement gas after depressurizing and exhausting the gas in the hermetic region. This exhaust system can also be used for depressurization in an airtight region other than gas replacement.

[0666] Further, a moving means for moving the object to be processed in the airtight area may be provided. The moving means may include a rotary kiln, a screw conveyor, a tray pusher, a drawer, a roller house, and the like.

A gas circulating device for circulating the gas inside the hermetic zone while controlling the temperature may be provided.
As the gas circulation device, for example, a bypass connected to an airtight region (chamber) is provided, and a circulation pump,
Temperature controllers or heat exchangers, dust in gas streams,
What is necessary is just to provide the filter means etc. which remove a mist etc. These may be arranged in the order of the filter, the temperature controller, and the circulation pump. In particular, it is preferable that the filter be provided in a stage preceding the circulation pump and the temperature controller. For example, an oil film may be used as the filter. The processing method and the processing apparatus of the present invention as described above can be applied to the processing in a heating furnace such as an incinerator and a normal-pressure pyrolysis furnace without being limited to the reduced-pressure pyrolysis furnace.

For example, the treatment apparatus of the present invention can be attached to the subsequent stage of a conventional incinerator or atmospheric pressure pyrolysis furnace. Therefore, organic halides such as dioxin can be safely and effectively removed from incineration residues generated in large quantities in an incinerator.

[0669] The diffusion of toxic organic halides into the environment is a serious problem, and rebuilding incineration facilities with new treatment facilities requires enormous costs and time, as well as waste generated daily. Processing must also be performed. The present invention can be applied to existing incineration facilities as incidental facilities. Therefore, it is possible to treat the object to be treated having the ability to generate an organic halide while utilizing the existing facilities.

[0670] The method for producing a soil according to the present invention is characterized in that the second soil containing the organic halide at a second concentration lower than the first concentration is obtained from the first soil containing the organic halide at the first concentration. In the method for producing soil for producing soil, a step of introducing the first soil into an airtight region, and a step of thermally decomposing at least a part of the organic halide by heating the first soil under reduced pressure. And the following.

[0671] It is preferable that the thermal decomposition residue of the first soil is cooled after replacing the inside of the hermetic zone with the replacement gas that is substantially free of the organic halide and has no ability to generate an organic halide.

[0672] As described above, if an organic halide coexists in the cooling atmosphere when the object to be treated is cooled, the organic halide is fixed in the heating residue in the object to be treated. It is. In order to remove the organic halide from the heating residue of the object to be treated, in which the organic halide evaporates or the organic halide is generated by heating, the heating atmosphere gas containing the organic halide is replaced or the pressure is reduced. It is important to cool the heating residue in a state where the concentration of the organic halide and the substance having the ability to generate an organic halide is reduced. Therefore, by cooling the pyrolysis residue of the first soil in a state where the concentration of the organic halide or the substance capable of generating an organic halide is reduced, the second residue that is the heating residue of the first soil is reduced. The concentration of the organic halide remaining in the soil can be reduced and removed.

It is preferable that the first soil is thermally decomposed while controlling the oxygen concentration in the hermetic zone. For example, the oxygen concentration in the hermetic region may be measured, and the oxygen concentration in the hermetic region may be adjusted according to the measured oxygen concentration. The control of the oxygen concentration may be performed by introducing a reducing carrier gas or a reducing agent into the hermetic zone.

As described above, by actively controlling the oxygen concentration in the hermetic zone, even if the object to be treated is heterogeneous, it can be thermally decomposed in a stable state. Further, by performing the thermal decomposition while maintaining the inside of the hermetic zone in a reducing atmosphere, the generation of organic halides such as dioxin can be suppressed. Further, by reducing the pressure in the hermetic region, the mean free path between molecules becomes longer, and the generation probability of an organic halide such as dioxin can be reduced.

If the first soil contains a metal such as a heavy metal, the soil may be heated and reduced in pressure to vaporize and collect the metal. By doing so, even when the soil is contaminated with mercury, cadmium, zinc, lead, arsenic, or the like, such a metal can be separated and recovered from the soil. Also
Hexavalent chromium can be reduced to trivalent chromium, for example. Such metal recovery can be performed using the recovery chamber described above. The present invention is not limited to contaminated soil, and can be similarly applied to the treatment of incinerated ash, sludge, waste liquid, agricultural products, marine products, and the like. Since the soil treated according to the present invention contains a large amount of inorganic components such as porous carbon, it can be used not only as soil but also as an effective soil conditioner. Also, for example, mulch,
You may mix and use it with organic substances, such as compost.

(Embodiment 24) FIGS. 56 and 57 are views showing an example of the configuration of a processing apparatus according to the present invention. This processing apparatus can process soil or incinerated ash containing organic halides such as dioxins.

In this processing apparatus, a reforming unit 72 and a recovery unit 73 are provided between a reduced pressure heating furnace 71 and an exhaust system.
It has. The exhaust system includes a booster pump 74, a water seal pump 75 having a liquid sealing circulation system capable of adjusting pH, and a rotary pump 76. An exhaust gas treatment system for treating exhaust gas from the exhaust system is provided downstream of the exhaust system (FIG. 57).

[0678] The reduced-pressure heating furnace 71 can heat the object to be processed while reducing the pressure in the system by the exhaust system. The decompression heating furnace 71 controls a chamber 71a for accommodating an object to be processed, a heater 71b for heating the chamber 71a, a vacuum gauge 71c for measuring a pressure in the chamber, a thermocouple 71d for measuring a temperature in the chamber, and a flow rate of a carrier gas. The flow meter 71e is provided. As the carrier gas, for example, nitrogen, a rare gas, hydrogen, or the like may be used as needed. The oxygen concentration in the system may be adjusted by the flow rate of the carrier gas. These carrier gases are also used as an organic halide-free cooling gas of the heating residue of the object to be treated. The chamber 72a of the reforming unit 72 is heated by the heater 72b,
The gaseous effluent of the object to be processed flowing through the inside can be cracked. This high temperature reforming also decomposes harmful substances such as dioxins, PCBs, coplanar PCBs and the like contained in the gaseous effluent. In the processing apparatus of the present invention, by providing such a gaseous emission reforming section between the reduced pressure heating furnace and the exhaust system, the gaseous emission can be reformed under reduced pressure. In this example, a catalyst 72c that decomposes organic halides, accelerates decomposition, or suppresses synthesis is loaded in the chamber 72a. Here, a catalyst in which a carrier made of alumina or ceramics is impregnated with nickel is used, but the type of the catalyst may be used as needed. The pressure reducing heating furnace 71 and the reforming unit 72 are connected by a pipe 71f that is kept warm so that the gaseous emission does not condense. In the present invention, it is preferable that the object to be treated is heated after the reforming unit 72 reaches a predetermined operating condition. For example, when reforming is performed by heating,
After the temperature in the reforming unit reaches the set temperature at which the gaseous effluent is reformed, the object to be treated may be heated in the reduced pressure heating furnace 71. For this reason, a means for detecting the temperature of the reforming unit and a means for heating the inside of the reduced-pressure heating furnace in accordance with the detected temperature may be provided. A means (for example, a memory) for holding a set value such as a reforming temperature in the reforming unit; a means for detecting a temperature of the reforming unit; and a comparison between the detected temperature and the set value. Means for heating the inside of the reduced pressure heating furnace in accordance with the requirement. The gaseous effluent reformed by the reforming unit 72 is introduced into the recovery unit 73.

[0679] The recovery unit 73 is provided with a recovery chamber 73a in which a tubular retort is loaded, and an airtight door 73b for opening and closing the chamber 72a of the reforming unit 73 and the recovery chamber 73a. Airtight door 73b
Performs opening and closing operations by the cylinder 73c. The structure of this collection unit is described in, for example, FIGS. 8, 9, 42, and 43.
Is the same as That is, when the airtight door 73b is open, the retort moves from the collection chamber 73c to the chamber 72a.
Inserted to the side. The airtight door 73b is shielded and protected by the inserted retort. When the retort is replaced, the retort is pulled out toward the collection chamber 73a, the hermetic door 73b is closed, and the valve between the collection chamber and the exhaust system is closed. Thereby, the reduced pressure heating furnace 71,
While maintaining the state of the reforming unit 72, the retort can be taken out and the condensate can be collected. In the present invention, the metal contained in the object to be treated can also be separated from the object to be treated and recovered by this recovery unit. For example, even if contaminated soil or incinerated fly ash contains heavy metals such as lead, zinc, and cadmium, they are heated to a boiling point or higher under reduced pressure in a reduced-pressure heating furnace 71 and vaporized, and recovered in a metal state by a recovery unit 73. can do. It is preferable that the metal condensed in the retort be taken out after the non-oxidizing gas such as nitrogen is introduced into the recovery chamber and cooled.

[0680] The recovery chamber 73a is cooled by a coolant such as cooling water. This cooling not only condenses the metal, but also functions as a means for quenching the gaseous effluent reformed in the reforming unit. Thereby, re-synthesis of organic halides such as dioxins in the gaseous emission can be suppressed.

[0680] Recovery unit 73 and booster pump 74
An oil film filter 711 is provided between the two. The oil film filter 711 prevents gaseous emissions, dust, condensed metal fine particles, and the like that could not be condensed in the recovery unit from reaching the exhaust system.

A water ring pump 75 and a rotary pump 76 are connected in parallel at the subsequent stage of the booster pump 74. These exhaust systems can be switched and used according to the processing sequence. For example, when treating soil,
At the beginning of heating, water, oil and the like are contained in the gaseous effluent. In such a case, it is preferable that the booster pump 74 be bypassed and exhausted by the liquid ring pump 75. Water or oil in the gaseous effluent is captured by the liquid sealed by the liquid ring pump. In this apparatus, an alkaline aqueous solution is used for sealing the liquid ring pump. By this sealing liquid, nitrogen oxides and sulfur oxides in the gaseous emission can be neutralized. When the processing proceeds and the amount of water and oil in the gaseous emission decreases, the exhaust system is switched to the rotary pump 76 and the booster pump 74. Thereby, the pressure in the processing system can be further reduced. In this state, for example, zinc,
Metal such as lead is evaporated from the object to be treated and condensed on the retort in the collection chamber. The switching of the exhaust system is not limited to the above example, and may be performed as needed.

In the latter part of the exhaust system, an exhaust gas neutralizing unit 7 for neutralizing the exhaust gas to treat the exhaust gas from the exhaust system
7. An activated carbon filter 78 and an exhaust blower 79 are provided. Exhaust gas from the exhaust system is showered by a spray tower 77 with an alkaline aqueous solution. The aqueous solution for cleaning the exhaust gas is supplied to the neutralization tank 77a and the circulation pump 77c.
Is sent to the spray tower 77 again. The pH of the aqueous solution is monitored by a pH meter, and an alkaline aqueous solution is supplied from the alkaline reservoir 77e to adjust the pH of the circulating water.
Is kept alkaline. This aqueous solution is also supplied to the liquid sealing circulation system of the liquid ring pump 75. The exhaust gas washed with the alkaline aqueous solution is filtered by an activated carbon filter 78 and then exhausted out of the system by an exhaust blower 79. In this example, a sample recovery unit 80 for analysis is provided in order to monitor the concentration of substances in gaseous emission and exhaust gas. Quantitative analysis of components in gaseous emissions can also be performed online. By doing so, it becomes possible to adjust the processing temperature, pressure, oxygen concentration, reforming temperature of the gaseous emission, and the like according to the detection result.

[0684]

As described above, according to the present invention, when the tube is inserted into the first opening, the area between the second opening and the third opening on the side surface of the tube. Thereby, the hermetic door is shielded from the first hermetic chamber. For this reason, it is possible to prevent the gaseous emission from condensing or adhering to the airtight door. Also, for example, even when packing made of resin or the like is provided on the seal portion of the hermetic door, it is possible to prevent the seal portion of the hermetic door from being damaged by the heat of the gaseous emission.
Therefore, the sealing performance of the airtight door can be maintained. As described above, in the processing apparatus of the present invention, the interface from the first hermetic chamber to the outside is realized by the hermetic door and the pipe.

In the processing apparatus of the present invention, even when the second airtight chamber is opened and the pipe is taken out, the airtight door is kept airtight so that the outside air is prevented from leaking into the first airtight chamber. be able to. Therefore, the pipe can be taken out while maintaining the temperature and pressure conditions in the first hermetic chamber. Conventionally, the processing apparatus has to be stopped in order to take out the condensate to the outside, which hinders the productivity of the processing. According to the present invention, the processing apparatus can be continuously operated, and the productivity of the processing can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an example of a processing apparatus of the present invention.

FIG. 2 is a diagram schematically showing the processing apparatus of the present invention exemplified in FIG.

FIG. 3 is a diagram schematically showing another example of the processing apparatus of the present invention.

FIG. 4 is a diagram schematically showing another example of the processing apparatus of the present invention.

FIG. 5 is a diagram schematically showing another example of the processing apparatus of the present invention.

FIG. 6 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 7 is a diagram schematically showing a configuration of a control system for adjusting the temperature, pressure, and oxygen concentration of the processing apparatus of the present invention.

FIG. 8 is a diagram schematically showing a recovery system including a recovery chamber connected to the processing apparatus of the present invention.

FIG. 9 is a diagram schematically showing a recovery system including a recovery chamber connected to the processing apparatus of the present invention.

FIG. 10 is a diagram schematically showing an example of the structure of a collection chamber.

FIG. 11 is a diagram schematically showing an example of the structure of a collection chamber.

FIG. 12 is a diagram schematically showing an example of the structure of a collection chamber.

FIG. 13 is a graph showing the temperature dependence of the boiling point (vapor pressure) of lead.

FIG. 14 is a diagram schematically showing a state before processing of a mounting substrate as a processing target object.

FIG. 15 is a view schematically showing a state of a mounting substrate in which a constituent resin is thermally decomposed.

FIG. 16 is a view schematically showing a state in which lead is vaporized.

FIG. 17 is a view schematically showing a state where a circuit board and an electronic component are separated.

FIG. 18 is a graph showing pressure dependence of boiling points (vapor pressures) of various metals.

FIG. 19 is a graph showing the free energy of formation of various oxides and their temperature dependence.

FIG. 20 is a diagram schematically showing an example of a processing apparatus of the present invention.

FIG. 21 is a diagram schematically showing a partition wall of the processing apparatus of the present invention.

FIG. 22 is a diagram schematically showing an example of a processing apparatus of the present invention.

FIG. 23 is a diagram schematically showing a state before processing of a circuit board as an example of a processing target object.

FIG. 24 is a diagram schematically showing a state of a circuit board in which a constituent resin is thermally decomposed.

FIG. 25 is a diagram schematically showing a state in which copper gathers in a granular form due to surface tension.

FIG. 26 is a diagram schematically showing a state before processing of a resin-coated aluminum foil as a processing target object.

FIG. 27 is a view schematically showing a state of a resin-coated aluminum foil in which a constituent resin is thermally decomposed.

FIG. 28 is a view schematically showing an aluminum foil separated from a resin-coated aluminum foil.

FIG. 29 is a graph showing the relationship between the vapor pressure of various metals and the temperature.

FIG. 30 is a graph showing the relationship between the vapor pressure of various metals and the temperature.

FIG. 31 is a view schematically showing an example of a processing apparatus of the present invention.

FIG. 32 is a diagram schematically showing a configuration of the processing apparatus of the present invention illustrated in FIG. 31;

FIG. 33 is a diagram schematically showing an example of the structure of a thermal decomposition furnace.

FIG. 34 is a view schematically showing an example of the structure of a gas decomposer.

FIG. 35 is a diagram schematically showing an example of the structure of a cooling tower.

FIG. 36 is a diagram showing a part of the configuration of a gaseous emission processing system in which a bag filter is connected to a stage subsequent to the cooling tower.

FIG. 37 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 38 is a view schematically showing the configuration of the processing apparatus of the present invention illustrated in FIG. 37;

FIG. 39 is a view schematically showing an example in which the treatment method of the present invention is applied to waste treatment.

FIG. 40 is a view schematically showing an example of the configuration of a shredder device.

FIG. 41 is a view schematically showing a configuration of a processing apparatus of the present invention.

FIG. 42 is a view schematically showing a configuration of a processing apparatus of the present invention.

FIG. 43 is a view schematically showing a configuration of a processing apparatus of the present invention.

FIG. 44 is a view schematically showing a configuration of a processing apparatus of the present invention.

FIG. 45 is a view schematically showing a configuration of a processing apparatus of the present invention.

FIG. 46 is a view schematically showing an example of the configuration of a wet filter.

FIG. 47 is a view for explaining processing conditions of a processing target object;

FIG. 48 is a view showing a measurement result of a residual dioxin concentration of a heating residue.

FIG. 49 is a view schematically showing an example of the configuration of a processing apparatus of the present invention.

FIG. 50 is a view schematically showing an example of the configuration of a processing apparatus of the present invention.

FIG. 51 is a view schematically showing an example of the configuration of a processing apparatus of the present invention.

FIG. 52 is a schematic configuration diagram of a vacuum evaporation and recovery apparatus according to the present invention.

FIG. 53 is a detailed sectional view of a cooling / vacuum purge chamber portion of the vacuum evaporation recovery apparatus according to the present invention.

FIG. 54 is a view showing a method of connecting a recovery retort and a cylinder for driving the retreat thereof in the vacuum evaporation recovery apparatus according to the present invention.

FIG. 55 is a view showing a method of connecting a recovery retort and a cylinder for driving the retreat thereof in the vacuum evaporation recovery apparatus according to the present invention.

FIG. 56 is a view schematically showing a configuration of a processing apparatus of the present invention.

FIG. 57 is a view schematically showing a configuration of a processing apparatus of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Processing apparatus 20 ... Pyrolysis furnace 30 ... Gas decomposer 40 ... Cooling tower 50 ... Decompression heating furnace 51 ... Purge chamber 52 ... 1st airtight chamber 53 ... Cooling chamber 54a, 54b, 54c, 54d ... Partition wall 55 ... Exhaust System 71: Decompression heating furnace 72: Reforming unit 73: Recovery unit 100: Processing device 101: Purge chamber 102: First hermetic chamber 103: Second hermetic chamber 103b: First opening 104: Cooling chamber 106 ... Exhaust system 115 ... Recovery chamber 115b ... Airtight door 115c ... Retort (tube) 115d ... Third opening 115f ... Second opening 711 ... Oil film filter

────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI // C09K 17/00 ZAB B09B 3/00 302F C22B 9/02 303P (72) Inventor Katsuo Takamiya 66, Tateike, Tsutsumachi, Tsutsumachi, Toyota City, Aichi Prefecture Address Toyoei Shokai Co., Ltd. (72) Inventor Yoshiaki Yokoyama 2-1-4-402, Akamidai, Konosu City, Saitama Prefecture (72) Inventor Takeshi Abe 66, Tsutsumachi Teraike, Toyota City, Aichi Prefecture Toyoei Shokai Co., Ltd. (72) Inventor, etc. 66, Teraike, Tsutsumi-cho, Toyota-shi, Aichi Pref. Hoei Shokai Co., Ltd. (56) References JP-A-7-3343 (JP, A) JP-A-9-126427 (JP, A) 248549 (JP, A) JP-A-11-19625 (JP, A) JP-A-8-501601 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) B01J 3/02 B09B 3 / 00-5/00 B02C 1/06 C22B 7/00-9/04 F27D 17/00 104

Claims (31)

(57) [Claims] A first airtight chamber having a first opening; a tube arranged to be insertable into the first opening, and having a second opening in an insertion direction; and the first opening. An airtight door, wherein the airtight door is arranged to be openable and closable, and the airtight door is shielded from the first airtight chamber by the pipe when the pipe is inserted into the first opening. 2. The processing apparatus according to claim 1, further comprising an exhaust system connected to the first hermetic chamber through the first opening. 3. The processing apparatus according to claim 2, wherein the exhaust system is connected to the first hermetic chamber via the pipe. 4. The tube has a third opening on a side facing the first hermetic chamber with the airtight door interposed therebetween when the tube is inserted into the first opening. The processing apparatus according to claim 1, wherein: 5. The processing apparatus according to claim 1, further comprising means for adjusting a temperature of the first hermetic chamber. 6. The processing apparatus according to claim 1, further comprising: a unit disposed along a direction in which the tube is inserted, and configured to guide an operation of inserting the tube. . 7. The first hermetic chamber has a plurality of the first openings, and the tube and the hermetic door are arranged for each of the first openings. The processing device according to claim 6. 8. A processing device according to any one of claims 1 to 7 wherein the first hermetic chamber is characterized in that a plurality of arrayed at a closing septum. 9. The apparatus further comprising a second hermetic chamber adjacent to the first hermetic chamber through the hermetic door, wherein the pipe is connected to the first hermetic chamber from the second hermetic chamber. The processing apparatus according to claim 1, wherein the processing apparatus is inserted into an opening of the processing apparatus. 10. The processing apparatus according to claim 9, wherein said exhaust system is connected to said first hermetic chamber via said second hermetic chamber. 11. The first airtight chamber of the first airtight chamber, wherein:
The processing apparatus according to claim 10, wherein the third opening of the pipe and the exhaust system are connected in an airtight manner when inserted into the opening. 12. The first hermetic chamber of the first hermetic chamber,
Means for adjusting the pressure in the space between the pipe and the second hermetic chamber to be higher than the pressure in the first hermetic chamber when inserted into the opening of the first hermetic chamber. The processing apparatus according to any one of claims 9 to 11, wherein 13. The first airtight chamber of the first airtight chamber,
When inserted into the opening of the first hermetic chamber, the pressure inside the first hermetic chamber is higher than the pressure in the space between the pipe and the second hermetic chamber .
And means for adjusting the pressure to be lower than the pressure in the tube.
The processing apparatus according to claim 11. 14. The method according to claim 12, wherein the means for adjusting the pressure includes means for supplying a carrier gas to a space between the pipe and the second hermetic chamber. A processing device according to any one of the above. 15. The processing apparatus according to claim 9, further comprising a filter disposed between the second hermetic chamber and the exhaust unit. 16. The processing apparatus according to claim 15, wherein said filter means comprises at least a wet filter. 17. The method according to claim 17, wherein the tube is exchangeably disposed, and
The processing apparatus according to any one of claims 9 to 16, wherein the hermetic chamber has an airtightly openable / closable door for replacing the pipe. 18. The processing apparatus according to claim 9, further comprising a means for adjusting a temperature of the second hermetic chamber. 19. The apparatus according to claim 9, further comprising means for supplying a non-oxidizing gas to said second hermetic chamber.
The processing device according to claim 18. 20. An object to be processed is heated under reduced pressure in an airtight region to evaporate constituent components of the object to be processed, and a processing system for the evaporation component adjacent to the airtight region with an openable and closable airtight door interposed therebetween. From the side, open the hermetic door and insert a tube so that the hermetic door is shielded from the hermetic area,
A processing method, comprising introducing a component evaporated from the processing target object to the processing system side. 21. The apparatus according to claim 20, wherein the pipe is cooled to condense the evaporation component from the object to be processed.
The processing method described in 1. 22. The apparatus according to claim 20, wherein said component introduced into said processing system is decomposed.
The processing method described in 1. 23. The processing method according to claim 20, wherein the component introduced into the processing system is adsorbed by an adsorbent. 24. A gas generated by the thermal decomposition, wherein the object to be processed is heated in an airtight region to thermally decompose the constituent components of the object to be processed, and the airtight region is adjacent to the airtight door with an openable and closable door interposed therebetween. From the processing system side of the gaseous emission component, opening the hermetic door and inserting a pipe so that the hermetic door is shielded from the hermetic region, and introducing the gaseous emission to the processing system side. A processing method characterized by the following. 25. An object to be processed is introduced into an airtight area, a component of the object to be processed is extracted by reducing a pressure in the airtight area, and the component adjacent to the airtight area with an openable and closable airtight door is interposed therebetween. From the processing system side of the extracted component, open the hermetic door and insert a tube so that the hermetic door is shielded from the hermetic region,
A processing method comprising introducing the extracted component into the processing system. 26. An object to be treated containing a first metal is heated under reduced pressure in a first hermetic region to evaporate the first metal, and is sandwiched between the hermetic region and an openable and closable door. Adjacent second
A processing method, comprising: inserting a pipe from the hermetic chamber so that the hermetic door is shielded from the first hermetic chamber; and cooling the pipe to condense the first metal. 27. A method of heating a soil containing a first metal under reduced pressure in an airtight area to evaporate the first metal, and a second metal adjacent to the airtight area with an openable and closable airtight door interposed therebetween.
Processing from the airtight chamber, said insert tube as hermetic door is shielded from the air-tight area, and cooling the tube soil, characterized in that for condensing the first metal evaporated from the soil Method. 28. The treatment method according to claim 27, wherein the heating residue of the soil is cooled by a substantially organic halide-free cooling gas. 29. A soil containing water, an organic matter, and a first metal is heated in an airtight region to evaporate the water and evaporate or thermally decompose the organic matter, thereby evaporating the water, the organic matter or the organic matter. The first hermetic product from the moisture, the organic substance, or the treatment system of the thermal decomposition product of the organic substance is connected to the thermal decomposition product of the organic substance via the first hermetic door that can be opened and closed with the hermetic region. After opening the door, inserting a tube so that the first hermetic door is shielded from the hermetic region and introducing it into the processing system side, after evaporating the water and the organic substance, and after thermal decomposition of the organic substance The first metal is evaporated, and the evaporated first metal is removed from the second hermetic chamber side adjacent to the hermetic region with a second hermetic door openable and closable. Open and the second hermetic door is in the hermetic zone A method for treating soil, comprising inserting a pipe so as to be shielded from the air, introducing the pipe into the second hermetic chamber, and cooling the pipe to condense at least the first metal. 30. The treatment method according to claim 29, wherein the thermal decomposition of the soil and the evaporation of the first metal are performed under reduced pressure. 31. The method according to claim 29, wherein the soil is cooled by a substantially organic halide-free cooling gas after evaporating the first metal. Processing method.